JP2003225785A5 - - Google Patents
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- Publication number
- JP2003225785A5 JP2003225785A5 JP2003021589A JP2003021589A JP2003225785A5 JP 2003225785 A5 JP2003225785 A5 JP 2003225785A5 JP 2003021589 A JP2003021589 A JP 2003021589A JP 2003021589 A JP2003021589 A JP 2003021589A JP 2003225785 A5 JP2003225785 A5 JP 2003225785A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0201128A FR2835390B1 (fr) | 2002-01-31 | 2002-01-31 | Procede et equipement de soudage de conducteurs sur des substrats |
| FR02.01128 | 2002-01-31 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003225785A JP2003225785A (ja) | 2003-08-12 |
| JP2003225785A5 true JP2003225785A5 (enExample) | 2006-02-16 |
| JP4527355B2 JP4527355B2 (ja) | 2010-08-18 |
Family
ID=8871438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003021589A Expired - Fee Related JP4527355B2 (ja) | 2002-01-31 | 2003-01-30 | 電導体を基板に溶接する方法及びその装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6903303B2 (enExample) |
| EP (1) | EP1333481B1 (enExample) |
| JP (1) | JP4527355B2 (enExample) |
| FR (1) | FR2835390B1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007102462A1 (ja) * | 2006-03-07 | 2007-09-13 | Daikin Industries, Ltd. | 圧縮機の製造方法及び圧縮機 |
| JP4722757B2 (ja) | 2006-04-19 | 2011-07-13 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP5040269B2 (ja) * | 2006-11-14 | 2012-10-03 | 富士電機株式会社 | レーザ溶接方法 |
| EP1974849A1 (de) * | 2007-03-28 | 2008-10-01 | Trumpf Laser- und Systemtechnik GmbH | Verfahren zur Fixierung strukturgeklebter Werkstücke, insbesondere zum Laserschweißen von geklebten Werkstücken |
| US10195688B2 (en) * | 2015-01-05 | 2019-02-05 | Johnson Controls Technology Company | Laser welding system for a battery module |
| CN116194244A (zh) * | 2020-08-09 | 2023-05-30 | 库利克和索夫工业公司 | 包括与电池系统相关的激光焊接系统及相关方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4538860A (en) * | 1981-03-05 | 1985-09-03 | Gkn Technology Limited | Wear resistant wheel for track laying vehicle |
| EP0218069A1 (de) * | 1985-09-19 | 1987-04-15 | Siemens Aktiengesellschaft | Verfahren zum Verschweissen mittels Laserlicht |
| FR2595491B1 (fr) * | 1986-03-05 | 1988-06-17 | Boutroy Marc | Dispositif de securite pour le transport de documents de valeur |
| US4814922A (en) * | 1986-05-16 | 1989-03-21 | Canon Kabushiki Kaisha | Recording and reproducing apparatus using flexible disc |
| EP0308749A3 (de) * | 1987-09-25 | 1990-07-11 | Siemens Aktiengesellschaft | Elektrooptische Baugruppe |
| US5194710A (en) * | 1991-05-22 | 1993-03-16 | Cray Research, Inc. | Method and apparatus for laser masking of lead bonding |
| US5175410A (en) * | 1991-06-28 | 1992-12-29 | Digital Equipment Corporation | IC package hold-down fixture |
| US5604831A (en) * | 1992-11-16 | 1997-02-18 | International Business Machines Corporation | Optical module with fluxless laser reflow soldered joints |
| US5295214A (en) * | 1992-11-16 | 1994-03-15 | International Business Machines Corporation | Optical module with tolerant wave soldered joints |
| JP3119052B2 (ja) * | 1993-09-30 | 2000-12-18 | 松下電器産業株式会社 | 平板状画像表示装置 |
| JPH07272981A (ja) * | 1994-03-30 | 1995-10-20 | Marcon Electron Co Ltd | チップ形電子部品の製造方法 |
| US5809793A (en) * | 1996-12-12 | 1998-09-22 | Ssac Inc. | Timer circuit for heating or air conditioner unit |
| US6138898A (en) * | 1998-12-22 | 2000-10-31 | The Boeing Company | Corner gap weld pattern for SPF core packs |
| EP1093880A1 (de) * | 1999-10-21 | 2001-04-25 | Leister Process Technologies | Verfahren und Vorrichtung zum selektiven Erwärmen von Bauelementen |
| FR2802765B1 (fr) * | 1999-12-17 | 2002-06-14 | Framatome Connectors Int | Methode et dispositif de brasage de composants sur support fin |
| US6704163B1 (en) * | 2000-09-11 | 2004-03-09 | Hutchinson Technology Incorporated | Deformable towers useful for assembly of suspensions used in a data storage drive |
| US6547895B2 (en) * | 2001-01-25 | 2003-04-15 | General Motors Corporation | Superplastic multi-layer forming |
-
2002
- 2002-01-31 FR FR0201128A patent/FR2835390B1/fr not_active Expired - Fee Related
-
2003
- 2003-01-28 EP EP03290213.2A patent/EP1333481B1/fr not_active Expired - Lifetime
- 2003-01-30 JP JP2003021589A patent/JP4527355B2/ja not_active Expired - Fee Related
- 2003-01-30 US US10/354,016 patent/US6903303B2/en not_active Expired - Lifetime