JP2003224231A - Circuit module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit module which is inexpensive and reduced in thickness, wherein a fixed frame is quickly filled with a filler material of resin, and the condition of the hardened filler material can be surely and easily ascertained. <P>SOLUTION: A prescribed wiring conductor is formed on a circuit board 1, and electronic component elements 11 and 12 connected to the wiring conductor and electronic component elements 13 covered with the resin 3 filling the fixed frame 2 disposed on the circuit board 1 are arranged on the circuit board 1 for the formation of a circuit module 10. The surface of the resin 3 is partitioned into a plurality of regions with the crosspieces 4 provided to the fixed frame 2. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention requires a plurality of electronic component elements mounted on a circuit board, and the electronic component elements are potted with a resin material. Regarding circuit modules.

[0002]

2. Description of the Related Art Conventionally, as a structure in which an electronic component element arranged on a circuit board is potted with a resin material, a fixing frame body surrounding the outer periphery of a predetermined electronic component element is attached to the surface of the circuit board, A resin filling material such as silicone resin is filled and cured from the opening to the entire fixed frame body.

Here, an electronic component element covered with a resin material is an electronic component element such as an IC chip in which its electrode pad and an electrode pad on a circuit board are connected by a bonding wire, and airtightness -It is an electronic component element for which reliability is especially required. As the resin material, a gel resin material having flexibility is desirable. For example, in the case of a hard resin material such as an epoxy resin, when a temperature change is applied, the expansion and contraction of the electronic component element and the resin are directly applied to the bonding wire, which causes disconnection of the bonding wire and peeling of the bonding portion. Therefore, as the material of the resin material, a flexible gel-like resin, for example,
A silicone resin or the like is preferable.

However, in a circuit module in which the fixing frame is covered with a resin material such as a silicone resin, the resin material itself sways when repeatedly impacted or vibrated from the outside, and as a result, The breaking of the bonding wire of the electronic component element and the peeling of the bonding portion may occur.

That is, when vibration is applied from the outside, the flexible gel-like resin material filled in the fixed frame body oscillates as a whole, and as a result, electronic component elements such as bonding wires are connected. The durability of the bonding wire of the IC chip will be exceeded, and breakage of the bonding wire or peeling of the bonding portion will occur.

In order to solve such a situation, Japanese Patent Laid-Open No.
In 1-345916, the tubular body is attached to the upper portion of the electronic component element, and the resin filling member is supplied from the upper portion of the tubular body. The tubular body 54 is divided into a plurality of spaces S by a plurality of partition walls 56, 56 whose interior extends in the thickness direction,
A resin filling member is supplied to each space S. That is, since the volume of the resin-made filling member filled in this space S is reduced, the vibration amount of the resin-made filling member 53 in each space S is suppressed to be small and attenuated.

FIG. 4 is a sectional view of the structure. Board 51
A structure is shown in which after mounting the IC 52 thereon, the tubular body 54 is attached to the substrate 51 to which wire bonding has been applied, and the resin filling member 53 is filled. Here, 55 in the figure indicates the surface of the resin filling member 53.

[0008]

However, the tubular body 54 shown in FIG. 4 has a complicated shape having a plurality of partition walls 56, and is difficult and expensive to mold.

Further, since the resin-made filling member 53 is filled through the communicating portions of the lower portions of the plurality of spaces S forming the tubular body 54, it takes a long time to fill each space with the resin-made filling member 53. It was difficult to confirm whether or not it was filled.

The tubular member 54 is made of an insulating hard resin (eg epoxy, liquid crystal polymer resin, polycarbonate,
It is made of PBT, polyamide, polyimide, etc.), rubber, plastic, ceramics, etc., and is a molding die for injection molding because of its manufacturing method. Therefore, the more complicated the shape of the tubular body 54, the higher the cost of the die. In addition, even in the case of a slight design change such as shifting the position of the IC, the fixed frame body is remade from the beginning.

The present invention has been devised in view of the above-mentioned problems, and an object thereof is to make it possible to reduce the height of a circuit module, at a low cost, and to make a resin material filled in a fixed frame body, Provided is a circuit module capable of stably protecting the connection of electronic component elements even when external vibration is applied.

[0012]

According to the present invention, the fixed frame body is arranged on a circuit board on which a wiring conductor is formed, and an electronic component element is mounted on the circuit board in the fixed frame body. In the circuit module, wherein the electronic component element is covered with a resin material filled in a fixed frame,
The circuit module is characterized in that a cross section that partitions the surface of the resin material into a plurality of regions is provided in the fixed frame body. The crosspiece is a lattice plate or a mesh plate.

In the circuit module according to the present invention, a plurality of electronic component elements, which are mounted on the circuit board and need to be covered with a resin protective film, are surrounded by a fixed frame, and a flexible gel-like resin material is used. It is a structure that protects component elements.

Since the fixed frame body is not divided into a plurality of spaces in the fixed frame body as in the conventional case, the filling member, which is a resin material, is substantially divided into one space, and therefore the resin material can be quickly filled. In addition, it is possible to surely fill the whole. It is easy to check the inside after the curing process.

A crosspiece is provided to partition the surface of the resin material in the fixed frame into a plurality of areas. Since the cross-section can be provided at a position from the opening in the fixed frame to the point where the connecting means such as the IC or the bonding wire is covered, the height of the fixed frame can be reduced, and the fixed frame can be made smaller. Since the body height can be minimized, the height of the entire circuit module can be reduced. Further, since the fixed frame body has a rectangular tube shape, it can be manufactured at low cost.

A crosspiece for partitioning the surface of the resin material in the fixed frame into a plurality of regions is provided. Therefore, even if vibration is applied to the resin material due to external vibration, the surface tension of the resin material suppresses the vibration of the resin material, so that the amount of vibration can be suppressed and damped. Therefore, it is possible to prevent deterioration of the connection state of the electronic component element due to this vibration and peeling of the resin material. Therefore, the circuit module can stably protect the electronic component element.

[0016]

DETAILED DESCRIPTION OF THE INVENTION A circuit module of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a circuit module of the present invention, and FIG. 2 is a sectional view thereof.

The circuit module 100 of the present invention is mainly composed of a circuit board 1, electronic component elements 11, 12, and 13, a fixed frame body 2, and a resin material 3 in a cured state of a gel-like or rubber-like resin filling member. It is configured. The fixed frame body 2 shown in FIGS. 1 and 2 has an opening on the lower surface, and a crosspiece 4 near the upper surface.
Is a rectangular tubular body provided with.

The circuit board 1 is made of ceramic or glass.
It is composed of a substrate body made of an epoxy material and a predetermined wiring conductor formed on the substrate body. The wiring conductor of the substrate body is omitted in the figure.

Various electronic component elements 11, 12, and 13 are mounted on the predetermined wiring conductors of the circuit board 1. Among the electronic component elements 11, 12, and 13, the electronic component elements that do not require potting of the resin material 3 are hereinafter referred to as electronic component elements 11 and 12. The electronic component elements 11 and 12 are mounted on the circuit board 1 in the area outside the fixed frame body 2. On the other hand, an electronic component element requiring potting of the resin material 3 is simply replaced with the electronic component element 13
Say. The electronic component element 13 is mounted on the circuit board 1 inside the fixed frame body 2 and is potting-coated with the resin material 3.

For example, the electronic component element 11 is an electronic component already covered with a container or an exterior resin for improving moisture resistance, and the electronic component 12 is a trimmer component (variable resistor, variable inductor component) for adjusting characteristics. , Trimmer capacitors, stub conductors). Examples of the electronic component element 13 include an IC chip connected to a predetermined wiring conductor of the circuit board 1 by a bonding wire and various bumps. The electronic component element 11 covered with a container or an exterior resin can be used as an IC chip. It may be arranged in the fixed frame body 2 together with the above.

Further, even in the case of an electronic component element 11 covered with a container or an exterior resin, an electronic component element 12 such as a trimmer capacitor, etc., if the thickness of the resin material 3 is controlled, the area within the fixed frame body 2 is controlled. It may be placed in.

In FIG. 2, the electronic component elements 13 are arranged in one fixed frame body 2 and are connected to predetermined wiring conductors by bonding wires.

The fixed frame 2 is made of an insulating hard resin (eg epoxy, liquid crystal polymer resin, polycarbonate, PB).
T, polyamide, polyimide, etc.), rubber, plastic, ceramics, etc., and the external shape is a rectangular tube shape with open upper and lower surfaces. A band-shaped or lattice-shaped cross-section 4 is provided near the upper surface inside the fixed frame body 2 so as to pass through the opening diameter. Further, the height of the fixed frame body 2, substantially up to the crosspiece 4, may be a little higher than the height of the IC chip which is the electronic component element 13 or the highest part of the connecting means such as the bonding wire. Therefore, the fixed frame body 2 has a short height, and the height of the circuit module can be reduced.

The resin material 3 is constructed by supplying a predetermined amount of a filling member to be the resin material 3 to the inner region of the fixed frame body 2 and curing it. Examples of the resin material 3 include low elastic materials such as gel-like or rubber-like silicone resins and modified silicone resins.

The resin material 3 has a thickness sufficient for burying at least the wire bonded from the circuit board 1 to the electronic component element 13 in the inner region of the fixed frame body 2.
Moreover, the amount of contact with the crosspiece 4 is set to the minimum amount, and the amount reaching the upper surface of the crosspiece 4 is set to the maximum amount. That is, the crosspiece 4 is embedded near the surface of the resin material 3.

Specifically, various electronic component elements 11, 12, and 13 are arranged at predetermined positions on the circuit board 1, and, for example, the electronic component elements 13 are connected by bonding wires, and then the predetermined positions on the circuit board 1 are set. Then, the fixed frame body 2 is adhered and temporarily held. The predetermined position for temporary holding is
This is a position where the electronic component element 13 substantially exists in the area surrounded by the fixed frame body 2.

After that, the upper surface of the fixed frame body 2, that is, the crosspiece 4
A filling member to be the resin material 3 is supplied from the gap to fill the fixed frame body 2 in a predetermined amount.

In this way, a sufficient filling member for burying the electronic component element 13 is supplied and then cured.

According to the circuit module thus formed, substantially only the electronic component element 13 can be covered with the resin material 3. At the same time, the filling amount of the resin material 3 in the fixed frame body 2 can be easily controlled, and furthermore, the curing process and the inside can be confirmed easily and quickly. This is because the inside of the fixed frame body 2 can be treated as a substantially single space.

Then, even if vibration or shock is applied to the resin material 3 from the outside of the fixed frame body 2 to cause the resin material 3 to swing,
Since the surface of the resin material 3 is substantially finely divided by the crosspiece 4, this swing is dispersed. The surface tension disperses the swing on the surface formed on the resin material 3, and immediately propagates to the crosspiece 4 and the inner wall of the fixed frame body 2, and the vibration is significantly attenuated. As a result, the flow and vibration of the resin material 3 due to external vibration and impact can be effectively suppressed, and breakage and peeling of the bonding wire of the electronic component element 13 can be effectively suppressed. Moreover, the bonding state of the resin material 3 and the circuit board 1 can be kept stable.

Therefore, the circuit module 10 can be formed in which the stable resin material 3 can be formed only in the predetermined region for covering the electronic component element 13.

FIG. 3 is a perspective view showing another embodiment.
The circuit module 100 shown in FIG. 3A uses a circuit board 1, an electronic component element (not shown), a fixed frame body 21, a cross piece body 41 a, and a resin material 3. Here, the fixed frame body 21
Is made of an insulating hard resin (for example, epoxy, liquid crystal polymer resin, polycarbonate, PBT, polyamide, polyimide, etc.), rubber, plastic, ceramic, etc. The difference between the fixed frame body 2 and the fixed frame body 21 is It is the presence or absence, and the crosspiece portion 4 is not integrally formed inside the fixed frame body 21, but has a simple tubular shape. The crosspiece is a crosspiece (hereinafter, crosspiece 41a) which is a member separate from the fixed frame body 21.

Various electronic component elements are arranged on the predetermined wiring of the circuit board 1, and after the elements requiring wire bonding are connected by bonding wires, the fixing frame 21 is aligned with the predetermined position on the circuit board 1. Adhere and temporarily hold. The predetermined position for temporary holding is a position where the electronic component element that needs to be potted with the resin material 3 exists in the area surrounded by the fixed frame body 21.

After that, a filling member serving as the resin material 3 is supplied from the upper opening of the fixed frame body 21 to fill the fixed frame body 21 by a predetermined amount. After supplying the filling member sufficient to bury the electronic component element in this way, the crosspiece body 41a is inserted into the fixed frame body 21 and is pushed down and held until it comes into contact with the surface of the filling member which becomes the resin material 3. After that, the filling member is cured.

Here, the crosspiece body 41a is made of an insulating hard resin similar to that of the fixed frame body 21 (for example, epoxy, liquid crystal polymer resin, polycarbonate, PBT, polyamide, polyimide, etc.), rubber, plastic, ceramic and the like. The inside of the fixed frame body 21 is formed so that it can be smoothly fit into the fixed frame body 21.

The circuit module 10 manufactured in this way
Even when vibration or shock is applied to the fixing member 21 from the outside, the surface of the resin member 3 is substantially divided by the crosspiece member 41a. The oscillation of the vibration is restricted by the surface tension of the resin material 3 between the crosspieces 41a, and soon the crosspieces 41a and the fixed frame 21
Propagate to the inner wall of the, and the attenuation of this vibration becomes remarkable. As a result, it is possible to effectively suppress the vibration of the resin material 3 due to external vibration or impact, and it is possible to effectively prevent the bonding wire of the electronic component element 13 from breaking or peeling. Moreover, the bonding state of the resin material 3 and the circuit board 1 can be kept stable.

Further, at the time of filling the filling member to be the resin material 3, there is no crosspiece that obstructs the filling, so that the filling work can be performed very quickly and reliably.

In this case, the cross-piece body 41a is a grid plate body, but as shown in FIG. 3 (b), the cross-piece body 41b may be a mesh plate body. And the opening
As shown in FIG. 3 (c), a cross piece 41c having an opening punched out in a circle, an ellipse, or the like has the same effect, and as shown in the cross piece 41d of FIG. 3 (d). If a crosspiece body shaped like a sword with a large number of downward projections is used, the effect of further suppressing swing can be expected, and a more stable circuit module can be obtained.

[0039]

As described above, according to the present invention, the filling of the resin material becomes quick and reliable. In addition, the subsequent effect processing and internal confirmation will be simple and reliable. Further, the shape of the fixed frame body is a simple tubular body, and the cost is low. Since the height of the fixed frame body is enough to bury the electronic component or the connecting means for the electronic component, the height of the circuit module can be minimized and the height of the circuit module can be reduced.

Further, even if the resin protective film swings due to external shock or vibration applied to the fixed frame, the substantial vibration distance of the resin protective film due to this swing can be reduced, and moreover,
Vibrations can be quickly damped by surface tension.
Therefore, it is possible to protect the bonding wire from disconnection and peeling, and to prevent the influence of expansion with respect to temperature. Therefore, the circuit module can stably protect the electronic component element.

[Brief description of drawings]

FIG. 1 is a perspective view of a circuit module of the present invention.

FIG. 2 is a cross-sectional view of a circuit module of the present invention.

FIG. 3A is a perspective view showing another embodiment of the circuit module of the present invention, and FIGS. 3B to 3D are perspective views showing other structures of the crosspieces, respectively.

FIG. 4 is a cross-sectional view of a conventional circuit module.

[Explanation of symbols]

10, 100 ... Circuit module 1 ... Circuit board 2, 21 ... Fixed frame 3 ... Resin material 4 ... Cross section 41a, 41b, 41c ... Cross member 11, 12 ... Electronic component element ..Electronic component elements

Claims (2)

[Claims] 1. A fixed frame body is arranged on a circuit board on which a wiring conductor is formed, and an electronic component element is mounted on the circuit board in the fixed frame body, and the electronic component element is fixed. A circuit module which is covered with a resin material filled in a frame body, wherein a crosspiece partitioning the surface of the resin material into a plurality of regions is provided in the fixed frame body. 2. The circuit module according to claim 1, wherein the crosspiece portion is a lattice plate body or a mesh plate body.