JP2003224228A5 - - Google Patents

Download PDF

Info

Publication number
JP2003224228A5
JP2003224228A5 JP2002023106A JP2002023106A JP2003224228A5 JP 2003224228 A5 JP2003224228 A5 JP 2003224228A5 JP 2002023106 A JP2002023106 A JP 2002023106A JP 2002023106 A JP2002023106 A JP 2002023106A JP 2003224228 A5 JP2003224228 A5 JP 2003224228A5
Authority
JP
Japan
Prior art keywords
conductor pattern
circuit board
forming layer
bonding
pattern formed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002023106A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003224228A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002023106A priority Critical patent/JP2003224228A/ja
Priority claimed from JP2002023106A external-priority patent/JP2003224228A/ja
Publication of JP2003224228A publication Critical patent/JP2003224228A/ja
Publication of JP2003224228A5 publication Critical patent/JP2003224228A5/ja
Pending legal-status Critical Current

Links

JP2002023106A 2002-01-31 2002-01-31 半導体装置用パッケージ並びに半導体装置及びその製造方法 Pending JP2003224228A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002023106A JP2003224228A (ja) 2002-01-31 2002-01-31 半導体装置用パッケージ並びに半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002023106A JP2003224228A (ja) 2002-01-31 2002-01-31 半導体装置用パッケージ並びに半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2003224228A JP2003224228A (ja) 2003-08-08
JP2003224228A5 true JP2003224228A5 (ru) 2005-06-16

Family

ID=27745908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002023106A Pending JP2003224228A (ja) 2002-01-31 2002-01-31 半導体装置用パッケージ並びに半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP2003224228A (ru)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3566957B2 (ja) 2002-12-24 2004-09-15 沖電気工業株式会社 半導体装置及びその製造方法
JP4511245B2 (ja) * 2004-05-28 2010-07-28 三洋電機株式会社 回路装置
JP5100081B2 (ja) * 2006-10-20 2012-12-19 新光電気工業株式会社 電子部品搭載多層配線基板及びその製造方法
US7608921B2 (en) * 2006-12-07 2009-10-27 Stats Chippac, Inc. Multi-layer semiconductor package
KR100907639B1 (ko) * 2007-12-20 2009-07-14 삼성전기주식회사 다층 인쇄회로기판의 제조방법 및 그것을 이용한 반도체플라스틱 패키지
KR101084252B1 (ko) * 2010-03-05 2011-11-17 삼성전기주식회사 전자소자 내장형 인쇄회로기판 및 그 제조방법
JP6136710B2 (ja) * 2013-07-29 2017-05-31 富士通株式会社 電子部品

Similar Documents

Publication Publication Date Title
JP2004063767A5 (ru)
WO2005064641A3 (en) Semiconductor device and method of fabricating the same
JP2006253289A5 (ru)
WO2004109771A3 (en) Stackable semiconductor device and method of manufacturing the same
JP2004063787A5 (ru)
JP2002524857A5 (ru)
JP2006060128A (ja) 半導体装置
JP2010028601A5 (ru)
WO2003069695A3 (en) Multilayer package for a semiconductor device
EP1701380A3 (en) Semiconductor power module
TW200612440A (en) Polymer-matrix conductive film and method for fabricating the same
EP1610381A3 (en) Electronic package employing segmented connector and solder joint
JP2010537397A (ja) 電気的回路装置及び電気的回路装置の製造方法
WO2007070533A3 (en) Electrical microfilament to circuit interface
JP2003224228A5 (ru)
WO2009004870A1 (ja) 半導体パッケージ
JP2006134912A5 (ru)
JP2002093949A5 (ru)
WO2006048846A3 (en) Semiconductor chip connection based on carbon nanotubes
EP1041618A4 (en) SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, PRINTED CIRCUIT BOARD AND ELECTRONIC EQUIPMENT
JP2003142797A5 (ru)
JP2009158741A5 (ru)
TW200743166A (en) Stack bump structure and manufacturing method thereof
WO2003085775A3 (en) Spiral couplers
EP1367645A3 (en) Semiconductor device and manufacturing method thereof