JP2003224228A5 - - Google Patents
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- Publication number
- JP2003224228A5 JP2003224228A5 JP2002023106A JP2002023106A JP2003224228A5 JP 2003224228 A5 JP2003224228 A5 JP 2003224228A5 JP 2002023106 A JP2002023106 A JP 2002023106A JP 2002023106 A JP2002023106 A JP 2002023106A JP 2003224228 A5 JP2003224228 A5 JP 2003224228A5
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- circuit board
- forming layer
- bonding
- pattern formed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 6
- 230000001070 adhesive Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002023106A JP2003224228A (ja) | 2002-01-31 | 2002-01-31 | 半導体装置用パッケージ並びに半導体装置及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002023106A JP2003224228A (ja) | 2002-01-31 | 2002-01-31 | 半導体装置用パッケージ並びに半導体装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2003224228A JP2003224228A (ja) | 2003-08-08 |
JP2003224228A5 true JP2003224228A5 (ru) | 2005-06-16 |
Family
ID=27745908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002023106A Pending JP2003224228A (ja) | 2002-01-31 | 2002-01-31 | 半導体装置用パッケージ並びに半導体装置及びその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2003224228A (ru) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3566957B2 (ja) | 2002-12-24 | 2004-09-15 | 沖電気工業株式会社 | 半導体装置及びその製造方法 |
JP4511245B2 (ja) * | 2004-05-28 | 2010-07-28 | 三洋電機株式会社 | 回路装置 |
JP5100081B2 (ja) * | 2006-10-20 | 2012-12-19 | 新光電気工業株式会社 | 電子部品搭載多層配線基板及びその製造方法 |
US7608921B2 (en) * | 2006-12-07 | 2009-10-27 | Stats Chippac, Inc. | Multi-layer semiconductor package |
KR100907639B1 (ko) * | 2007-12-20 | 2009-07-14 | 삼성전기주식회사 | 다층 인쇄회로기판의 제조방법 및 그것을 이용한 반도체플라스틱 패키지 |
KR101084252B1 (ko) * | 2010-03-05 | 2011-11-17 | 삼성전기주식회사 | 전자소자 내장형 인쇄회로기판 및 그 제조방법 |
JP6136710B2 (ja) * | 2013-07-29 | 2017-05-31 | 富士通株式会社 | 電子部品 |
-
2002
- 2002-01-31 JP JP2002023106A patent/JP2003224228A/ja active Pending
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