JP2003224106A5 - - Google Patents
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- JP2003224106A5 JP2003224106A5 JP2002020577A JP2002020577A JP2003224106A5 JP 2003224106 A5 JP2003224106 A5 JP 2003224106A5 JP 2002020577 A JP2002020577 A JP 2002020577A JP 2002020577 A JP2002020577 A JP 2002020577A JP 2003224106 A5 JP2003224106 A5 JP 2003224106A5
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- JP
- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002020577A JP3842657B2 (ja) | 2002-01-29 | 2002-01-29 | ウエットエッチングシステム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002020577A JP3842657B2 (ja) | 2002-01-29 | 2002-01-29 | ウエットエッチングシステム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003224106A JP2003224106A (ja) | 2003-08-08 |
| JP2003224106A5 true JP2003224106A5 (de) | 2005-08-11 |
| JP3842657B2 JP3842657B2 (ja) | 2006-11-08 |
Family
ID=27744038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002020577A Expired - Fee Related JP3842657B2 (ja) | 2002-01-29 | 2002-01-29 | ウエットエッチングシステム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3842657B2 (de) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100655429B1 (ko) | 2005-11-10 | 2006-12-08 | 삼성전자주식회사 | 인산 용액을 재생하는 방법 및 장치, 그리고 인산 용액을사용하여 기판을 처리하는 장치 |
| JP2008103678A (ja) | 2006-09-20 | 2008-05-01 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP4879126B2 (ja) * | 2007-09-12 | 2012-02-22 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| TWI452620B (zh) | 2007-08-20 | 2014-09-11 | Chemical Art Technology Inc | Etching apparatus and etching apparatus |
| US8211810B2 (en) | 2007-09-21 | 2012-07-03 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus and substrate processing method for performing etching process with phosphoric acid solution |
| JP4966223B2 (ja) * | 2008-02-29 | 2012-07-04 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
| TWI458006B (zh) * | 2012-05-02 | 2014-10-21 | Winbond Electronics Corp | 磷酸製程控制氧化物蝕刻率的方法 |
| JP6302708B2 (ja) * | 2013-03-29 | 2018-03-28 | 芝浦メカトロニクス株式会社 | ウェットエッチング装置 |
| US10147619B2 (en) | 2015-08-27 | 2018-12-04 | Toshiba Memory Corporation | Substrate treatment apparatus, substrate treatment method, and etchant |
| JP6292694B2 (ja) * | 2017-01-23 | 2018-03-14 | 芝浦メカトロニクス株式会社 | 基板処理方法及び基板処理システム |
| KR102417059B1 (ko) * | 2021-12-22 | 2022-07-06 | 램테크놀러지 주식회사 | 식각액 검증을 위한 배치형 식각 장치 |
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2002
- 2002-01-29 JP JP2002020577A patent/JP3842657B2/ja not_active Expired - Fee Related