JP2003223111A - Method for producing display device, sealed side original substrate for display device, aggregate of display device, display device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for producing a display device, a sealed side original substrate for the display device, an aggregate of the display device, the display device and an electronic equipment in which a process can be simplified and productivity can be improved. <P>SOLUTION: A first original substrate 20 integrated with a plurality of matrix-shaped functional substrate areas 23 each having an optical function part 6 and a terminal part 7 communicated thereto and a second original substrate 21 integrated with a plurality of matrix-shaped sealed substrate areas 24 each having a seal part 12 for sealing the optical function part 6 and a notched part 25 exposing the terminal part 7 are prepared, the second original substrate 21 is stuck on the first original substrate 20 in the state of mutually aligning them, and this is divided into matrix. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a display device such as a liquid crystal display device or an organic EL element in which an optical functional part such as a liquid crystal or a light emitting element part is sealed between two substrates, and a display device. The present invention relates to a sealing-side prototype substrate, an assembly of display devices, a display device, and electronic equipment.

[0002]

2. Description of the Related Art In the conventional method for manufacturing an organic EL device shown in FIG. 5, a first prototype substrate 54 in which a plurality of element substrate regions 53 having an element portion 51 and a terminal portion 52 connected thereto are formed in a matrix. , A plurality of sealing substrates 55 for sealing the element portion 51 are prepared, and each sealing substrate 55 is attached to each element substrate region 53 of the first prototype substrate 54 so as to seal only the element portion 51. The bonding (adhesion) is performed, and the device substrate area is cut. Further, in the conventional method of manufacturing an organic EL device shown in FIG. 6, a first prototype substrate 64 in which a plurality of element substrate regions 63 each having an element portion 61 and a terminal portion 62 connected to the element portion 61 are formed in a matrix, A second prototype substrate 65 having substantially the same size as the prototype substrate 64 is prepared, the second prototype substrate 65 is attached (bonded) to the first prototype substrate 64, and this is cut in element substrate region units, and In the organic EL device after the division, the corresponding portion of the sealing substrate (second prototype substrate 65) is cut off to expose the terminal portion 62.

[0003]

In the former manufacturing method, there is a problem that the bonding work including the positioning of each sealing substrate with respect to each element substrate region of the first prototype substrate is complicated and the productivity is deteriorated. is there. In the latter manufacturing method,
In the cut organic EL device, only the sealing substrate needs to be cut to expose the terminal portion, which complicates the manufacturing process and may damage the terminal portion during the cutting.

The present invention provides a method for manufacturing a display device, a master substrate on the sealing side of the display device, an assembly of the display devices, a display device and an electronic device which can simplify the process and improve the productivity. Is the task.

[0005]

A method of manufacturing a display device according to the present invention comprises a first prototype substrate in which a plurality of functional substrate regions each having an optical functional portion and terminal portions connected to the optical functional portion are formed in a matrix, and an optical functional portion. A second prototype substrate in which a plurality of sealing substrate regions having a sealing portion that seals a portion and a cutout portion that exposes a terminal portion are formed in a matrix, and the first prototype substrate is aligned with each other; The second prototype substrate is bonded to the prototype substrate of, and the plurality of display devices are manufactured by dividing the second prototype substrate into a matrix for each substrate region unit.

According to this structure, since the notch portion exposing the terminal portion is formed in advance in the portion corresponding to the terminal portion of the second prototype substrate, the bonded first and second prototype substrates are divided into both substrate area units. In each of the display devices divided in the matrix shape, the terminal portion is exposed from the cutout portion. Therefore, the cutting step for exposing the terminal portion after the division can be omitted. In this case, by forming each notch as a rectangular opening formed corresponding to each terminal, the rigidity of the second prototype substrate is not impaired, and the second prototype substrate is damaged during manufacturing work or the like. Can be prevented. Further, the display device is a liquid crystal display device or an organic EL device.
It is preferably any of the devices. In addition, it is preferable to divide the bonded first and second prototype substrates by scribing, dicing laser cutting, etching, or the like.

The encapsulation-side prototype substrate of the display device of the present invention has a plurality of functional substrate regions each having an optical function portion and a terminal portion connected to the optical function portion, which are formed in a matrix shape. A sealing-side prototype substrate of a display device to be bonded so as to seal, and a plurality of sealing substrate regions having a sealing portion for sealing an optical function portion and a notch portion for exposing a terminal portion are arranged in a matrix. It is characterized by being built into.

According to this structure, each display device constituted by adhering the function-side prototype substrate and the sealing-side prototype substrate and dividing them into a matrix shape in units of both substrate regions has the notch portion to the terminal portion. Will be exposed. Therefore, the cutting work for exposing the terminal portion is not required. In this case, by forming each notch as a square opening formed corresponding to each terminal, the rigidity of the sealing-side prototype substrate itself is not impaired, and the sealing-side prototype substrate in the manufacturing operation etc. Can be prevented from being damaged.

A display device assembly according to the present invention is bonded to a first prototype substrate and a first prototype substrate in which a plurality of functional substrate regions each having an optical functional portion and a terminal portion connected to the optical functional portion are formed in a matrix. A second prototype substrate in which a plurality of sealing substrate regions each having a sealing portion for sealing the optical function portion and a notch portion for exposing the terminal portion are formed in a matrix, and each functional substrate region bonded together A display device is constituted by each sealing substrate region.

According to this structure, the bonded first and second prototype substrates are divided into matrix regions in units of both substrate regions, so that in each display device after the division, the terminal portion is exposed from the notch portion. Will be things. Therefore, the cutting step for exposing the terminal portion after the division can be omitted.
In this case, each notch is formed as a rectangular opening formed corresponding to each terminal, so that the rigidity of the second prototype substrate is not impaired, and the second prototype substrate is protected from damage during manufacturing work or the like. Can be prevented. Further, the display device is either a liquid crystal display device or an organic EL device,
preferable.

A display device according to the present invention is characterized in that the above-mentioned display device assembly is divided into matrix regions in units of both substrate regions.

With this structure, a plurality of display devices can be easily manufactured in a short time.

The electronic equipment of the present invention is characterized by including the above-mentioned display device.

According to this structure, the cost of the display device can be reduced, so that it is possible to provide a low-cost electronic device as a whole. The electronic devices include mobile phones, personal computers, and televisions,
Various electronic devices equipped with so-called flat displays are included.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION A case where the present invention is applied to an organic EL device and a manufacturing method thereof will be described below with reference to the accompanying drawings. FIG. 1 is a cross-sectional view schematically showing an organic EL device. As shown in FIG.
The element substrate 2 in which a light emitting portion 6 containing an organic light emitting material and a plurality of external connection terminals 7 continuous with the organic light emitting material are formed on a glass substrate 5, and the light emitting portion 6 is covered with an absorbent 9 and an inert gas via an adhesive 8. A sealing substrate 3 that seals together with 10.

The light emitting portion 6 is basically an anode layer on the inner side (on the side of the glass substrate 5) made of a transparent and conductive material such as indium tin oxide (ITO) and an organic light emitting material such as polydioctylfluorene. And an outer cathode layer made of a metal material having a low work function such as aluminum, and, if necessary, a hole injecting and transporting layer on the anode layer side of the light emitting layer, and a light emitting layer. It is a publicly known one in which an electron injecting and transporting layer is provided on the side of the cathode layer. The ends of the plurality of electrodes 6a composed of the anode layer and the cathode layer are exposed to the outside as a plurality of external connection terminals (ITO) 7.
Further, as will be described later in detail, the upper side of the external connection terminal (ITO) 7 is a cutout portion (opening 25) formed by cutting out a part of the sealing substrate 3.

The glass substrate 5 which mainly constitutes the element substrate 2 is
It is formed of a transparent material such as an inorganic glass having a high light-transmitting property and a gas-shielding property. The encapsulation substrate 3 is formed of a reverse dish-shaped glass molded product, and a rectangular encapsulation protrusion 11 that surrounds the light emitting portion 6 and serves as a portion to which the adhesive 8 is applied is formed on the lower surface. ing. That is, the inside of the rectangular sealing convex portion 11 is the sealing portion 12 that seals the light emitting portion 6. in this case,
Argon gas having a large atomic weight is suitable as the inert gas 10 to be sealed inside, but it is also possible to achieve cost reduction by using nitrogen gas.

The sealing substrate 3 may be formed of a material such as metal or ceramic having a high gas barrier property, and in connection with this, the adhesive 8 has a high gas barrier property. Alternatively, instead of the adhesive 8, low melting glass, metal solder, or the like is used to weld the sealing substrate 3 to the element substrate (glass substrate 5) 2 by a method such as laser irradiation or ultrasonic welding. Is also possible. Furthermore, instead of the inert gas 10,
It is also possible to adopt a structure in which this portion is filled with the adhesive 8. That is, in this organic EL device 1, the adsorbent 9 for water and oxygen is stored, and the light emitting section 6 is completely shielded from external water, oxygen and the like.

A method of manufacturing the organic EL device 1 will be described with reference to FIGS. 2 and 3. In this manufacturing method, a plurality of light emitting portions (optical function portions) 6 and a plurality of external connection terminals (terminal portions) 7 are arranged in a matrix (in FIG. 9
Original device-side prototype substrate (first prototype substrate) 20
And a sealing-side prototype substrate (second prototype substrate) 21 having a plurality of sealing projections 11 (nine in FIG. 2) formed in a matrix shape and having substantially the same size, This is cut (separated) into a matrix form, and a plurality of (9 in FIG. 2)
The individual organic EL devices 1 are obtained.

As shown in FIGS. 2 and 3A, first, the light emitting section 6 and the external connection terminals 7 are formed in a matrix form by the ink jet method or the photolithography method, and the element side original substrate 20 and the sealing projections. Sealing side prototype substrate 2 in which the parts (the absorbent 9 is also adhered) 11 are formed in a matrix
Prepare 1 and. That is, an element-side prototype substrate (aggregate of element substrates 2) 20 having a plurality of element substrate regions 23 in a matrix which will be the element substrate 2 of the organic EL device 1 after cutting.
And a sealing-side prototype substrate (assembly of sealing substrates 3) 21 having a plurality of sealing substrate regions 24 in a matrix shape, which will be the sealing substrate 3 of the organic EL device 1 after cutting.

In this case, in the sealing-side prototype substrate 21, a rectangular opening (notch portion) is formed so as to expose it to the outside of each sealing portion 12, that is, the portion corresponding to the plurality of external connection terminals 7. ) 25 is formed. For example, the opening 25 is formed by cutting a part of the sealing-side prototype substrate 21 by scribing, dicing, laser cutting, or the like. The opening 25a at the outermost end is a notch with one side open.

Next, the adhesive 8 is applied to the sealing portion of the element-side prototype substrate 20 (see FIGS. 2 and 3 (b)). The adhesive 8 is applied by a syringe or the like so as to surround each light emitting unit 6 in a rectangular shape. Then, the sealing-side prototype substrate 21 is aligned with the element-side prototype substrate 20 and bonded (see FIGS. 2 and 3C). Then, finally, the element-side original substrate 20 and the sealing-side original substrate 21 that are bonded together are cut vertically and horizontally in units of the element substrate region 23 and the sealing substrate region 24 to cut out a plurality of organic EL devices 1. At least the above-mentioned bonding work (process)
Is performed in an atmosphere of an inert gas.

As described above, the sealing-side prototype substrate 21 having the opening 25 at the portion corresponding to the external connection terminal 7 is attached to the element-side prototype substrate 22, and this is cut (divided) vertically and horizontally to form a plurality of pieces. Since the organic EL device 1 is formed, the cutting step for exposing the external connection terminals 7 can be omitted after cutting, as in the conventional case (see FIG. 6). Therefore, the external connection terminal 7 does not have a problem such as damage and the productivity can be improved.

Next, with reference to FIG. 4, a method for manufacturing the organic EL device 1 according to the second embodiment will be described. The manufacturing method (process) in this case is exactly the same as the above, but the opening side 27 of the sealing-side prototype substrate 21 used in this embodiment extends over a plurality of sealing substrate regions 24, and both ends are formed. It is formed in an elongated shape except for the connecting portion 28. With such a configuration, the number of openings 27 formed can be reduced. However, when the number of the organic EL devices 1 to be manufactured is large and the rigidity of the sealing-side prototype substrate 21 is impaired, the connecting portions 28 are appropriately increased.

In addition to the organic EL device, liquid crystal display devices can be manufactured in the same manner as above. In this case, the inert gas is not sealed, but a step of filling the cut liquid crystal display device with liquid crystal is added.

[0026]

As described above, the manufacturing method of the display device of the present invention, the master substrate on the sealing side of the display device, the assembly of the display devices,
According to the display device and the electronic device, since the notch portion that exposes the terminal portion corresponding to the terminal portion of the second prototype substrate (sealing-side prototype substrate) is formed, the bonded first and second prototypes After cutting the substrates (the functional side master substrate and the sealing side master substrate), the cutting step for exposing the terminal portion can be omitted. Further, a plurality of display devices can be obtained (a plurality of display devices) from two substrates. The process can be simplified and the productivity can be improved.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of an organic EL device according to a first embodiment of the invention.

FIG. 2 is a plan view showing the method of manufacturing the organic EL device according to the first embodiment of the invention.

FIG. 3 is an explanatory view showing the method of manufacturing the organic EL device according to the first embodiment of the invention in the order of steps.

FIG. 4 is a plan view showing a method for manufacturing an organic EL device according to a second embodiment of the invention.

FIG. 5 is a plan view showing a method for manufacturing an organic EL device according to a first conventional technique.

FIG. 6 is a plan view showing a method for manufacturing an organic EL device according to a second conventional technique.

[Explanation of symbols]

1 Organic EL Device 2 Element Substrate 3 Sealing Substrate 5 Glass Substrate 6 Light Emitting Section 7 External Connection Terminal 8 Adhesive 10 Inert Gas 11 Sealing Convex 12 Sealing 20 Element Side Prototype Substrate 21 Sealing Side Prototype Substrate 23 Element Substrate region 24 Sealed substrate region 25 Opening

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05B 33/10 H05B 33/10 33/12 33/12 Z 33/14 33/14 AF term (reference) 2H088 FA04 FA06 FA07 FA10 FA16 FA17 FA19 FA24 FA26 FA30 MA16 MA17 2H089 HA40 KA11 KA16 KA17 NA12 NA24 NA25 NA35 NA38 NA48 NA53 NA55 NA56 NA60 QA10 QA12 QA13 3K007 AB18 BB01 DB03 FA02 5C094 AA43 AA46 AA49 BA27 BA43 GB10 5G435 AA17 BB05 BB12 KK05 KK10

Claims (10)

[Claims] 1. A first prototype substrate in which a plurality of functional substrate regions having an optical functional portion and terminal portions connected to the optical functional portion are formed in a matrix, a sealing portion for sealing the optical functional portion and the terminal portion. A second prototype substrate in which a plurality of sealing substrate regions having notches to be exposed are formed in a matrix is prepared, and the second prototype substrate is placed on the first prototype substrate in a state of being aligned with each other. A method of manufacturing a display device, comprising: laminating the substrates, dividing the substrates into a matrix in units of both the substrate regions, and manufacturing a plurality of display devices. 2. The method for manufacturing a display device according to claim 1, wherein each of the notches is a rectangular opening formed corresponding to each of the terminals. 3. The display device is one of a liquid crystal display device and an organic EL device, wherein the display device is a liquid crystal display device or an organic EL device.
Alternatively, the display device manufacturing method according to the item 2. 4. A display device, which is attached to a functional side original substrate in which a plurality of functional substrate regions having an optical functional portion and terminal portions connected to the optical functional portion are formed in a matrix so as to seal the element portion. A sealing-side prototype substrate, characterized in that a plurality of sealing substrate regions having a sealing portion that seals the optical function portion and a cutout portion that exposes the terminal portion are formed in a matrix. Prototype substrate on the sealing side of the display device. 5. The sealing-side prototype substrate of the display device according to claim 4, wherein each of the notches is a rectangular opening formed corresponding to each of the terminals. 6. A first prototype substrate in which a plurality of functional substrate regions each having an optical function portion and a terminal portion connected to the optical function portion are formed in a matrix, and the first prototype substrate is attached to seal the optical function portion. A second prototype substrate in which a plurality of sealing substrate regions having a sealing portion for exposing the terminal portion and a notch portion for exposing the terminal portion are formed in a matrix, and the functional substrate regions and the sealing substrates are bonded together. A display device assembly comprising a display region and a substrate region. 7. The assembly of display devices according to claim 6, wherein each of the notches is a rectangular opening formed corresponding to each of the terminals. 8. The display device is one of a liquid crystal display device and an organic EL device, wherein the display device is a liquid crystal display device or an organic EL device.
Or an assembly of the display devices according to 7. 9. A display device, characterized in that the aggregate of the display devices according to claim 6, 7 or 8 is divided and formed in a matrix shape in units of both substrate regions. 10. An electronic device comprising the display device according to claim 9.