JP2003222427A - Temperature adjusting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a temperature adjusting system capable of efficiently performing cooling operation and heating operation in a wide scope of temperature adjustment using an inexpensive and safe refrigerant without causing noise. <P>SOLUTION: This temperature adjusting system is provided with a refrigerant vessel 4 for sealing the refrigerant, a thermoelectric conversion unit 3 whose one end is thermally connected with an object whose temperature is adjusted and whose other end is thermally connected with the refrigerant vessel to cause phase change of the refrigerant in order to cool or heat the object whose temperature is adjusted, and a pressure adjusting means 8 for adjusting pressure in the refrigerant vessel. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature control system, and more particularly to a temperature control system capable of alternately repeating a heating operation and a cooling operation using a thermoelectric conversion unit.

[0002]

2. Description of the Related Art Generally, a semiconductor manufacturing apparatus for performing CVD (vapor deposition method), coating, exposure, etching, sputtering, etc., is equipped with a wafer mount called a susceptor. For example, in the step of forming a polycrystalline silicon film on the silicon oxide film formed on the wafer by using the CVD method, the wafer is heated and the temperature of the wafer changes. Such a temperature change of the wafer also changes the reaction speed of the gas used for forming the polycrystalline silicon film. Therefore, by adjusting the temperature of the susceptor using a temperature control system, the temperature of the wafer can be kept constant. Need to

FIG. 5 shows the configuration of a conventional mechanical temperature control system. As shown in FIG. 5, this temperature control system includes a 0th-order refrigerant circulating means 53 for circulating a 0th-order refrigerant 52 such as cooling water in a 0th-order refrigerant pipe 51, and a 1st refrigerant such as CFC in a primary refrigerant pipe 54. Primary refrigerant circulating means (compressor) 56 for circulating the secondary refrigerant 55 and pressurizing the primary refrigerant 55, and the primary refrigerant 5
A condenser 57 for liquefying 5 and an evaporator 59 for evaporating the primary refrigerant 55 with the heat supplied by the heat exchanger 58,
Expansion valve 60 for decompressing the primary refrigerant 55 and the secondary refrigerant pipe 6
A secondary refrigerant circulating means 63 for circulating an inert secondary refrigerant 62 having a high boiling point such as Galden and Fluorinert in 1 and a heat exchange section 64 for exchanging heat between a temperature control object 65 such as a susceptor. Is equipped with.

The secondary refrigerant 62 is circulated in the secondary refrigerant pipe 61 by the function of the secondary refrigerant circulating means 63, and the temperature controlled object 6
In the heat exchange section 64 that is thermally coupled to the heat exchanger 5, heat is taken from the temperature control target object 65. The secondary refrigerant 62 is further circulated,
Heat is released to the primary refrigerant 55 in the heat exchanger 58 that is thermally coupled to the primary refrigerant 55.

The primary refrigerant 55 circulates in the primary refrigerant pipe 54 by the action of the primary refrigerant circulating means 56, and the secondary refrigerant 62.
In the evaporator 59 that is thermally coupled to the secondary refrigerant 6
It takes the heat of vaporization from 2 and evaporates. Evaporated primary refrigerant 55
Is further circulated and pressurized in the compressor 57 to raise the boiling point. Furthermore, the primary refrigerant 55 is the 0th-order refrigerant 5 such as cooling water.
In the condenser 57, which is thermally coupled to the No. 2, heat is taken by the zero-order refrigerant 52 and condensed.

In this temperature control system, pressure is applied to the vapor of the primary refrigerant to raise the evaporation temperature, thereby increasing the amount of heat released to the zero-order refrigerant and improving the cooling capacity. However, the noise and size of the compressor 56 such as a compressor, the point that an expensive secondary refrigerant 62 that does not cause a phase change in a wide temperature range is necessary (the CFC is abolished), and heating is performed only by the cooling operation. There is a problem in that it cannot operate.

On the other hand, in Japanese Patent Laid-Open No. 5-315293, an operation for carrying the temperature of the object to be processed to the other end by placing the object on which the object is to be processed and one end of which is brought into contact with the table. Placement device (temperature control system) for an object to be processed, including a heat pipe filled with a fluid, and a cooling means having a refrigerant that is in contact with the other end of the heat pipe and discharges the carried heat
Is disclosed.

In this temperature control system, the refrigerant is supplied to the evaporation section through the wick formed on the wall surface of the pipe by the capillary phenomenon, and deprives the heat of the temperature control object as the heat of vaporization. The refrigerant becomes a vapor flow, and heat is taken away by the liquefied nitrogen in the condensing part, and condensed and liquefied again. By this cycle, the heat of the temperature controlled object is transferred to the liquefied nitrogen to perform cooling. In this temperature control system, the problem of the compressor and the problem of the refrigerant are solved, but the heating operation cannot be performed but only the cooling operation. Further, there is a problem in that the temperature cannot be set.

Further, Japanese Patent Laid-Open No. 6-268053 discloses a susceptor for semiconductor wafers (temperature control system) in which a thermoelectric conversion element is embedded in a base material made of dense ceramics.

In this temperature control system, the thermoelectric conversion unit is directly embedded in the temperature control target, and heating / cooling can be performed depending on the direction of the electric current for converting electric energy into heat energy. However, when the temperature difference between the temperature controlled object and the refrigerant is large, the temperature difference applied to the thermoelectric conversion element also becomes large, and the thermoelectric conversion element is destroyed by thermal stress. Therefore, there is a problem in that the temperature control range is limited.

Further, in these conventional temperature control systems, when the temperature of the temperature controlled object is higher than the set temperature, heat is discharged to the refrigerant, and when the temperature of the temperature controlled object is lower than the set temperature, new heating is performed. To do. Therefore, all the energy of the waste heat is wasted.

[0012]

Therefore, in view of the above points, the present invention uses a cheap and safe refrigerant which is free from noise and the like, and efficiently performs a cooling operation and a heating operation in a wide temperature control range. An object is to provide a temperature control system that can be performed.

[0013]

In order to solve the above-mentioned problems, a temperature control system according to a first aspect of the present invention is a refrigerant container for enclosing a refrigerant and an object whose temperature is controlled at one end. And a thermoelectric conversion unit that causes the phase change of the refrigerant to cool or heat the object to be temperature-controlled, and the pressure inside the refrigerant container. And a pressure adjusting means.

According to the temperature control system of the first aspect of the present invention, the refrigerant circulation system can be simplified and the temperature control range can be expanded by utilizing the phase change of the refrigerant, so that the cooling operation and the heating operation can be performed. It can be done efficiently. Further, the thermal stress applied to the electric conversion unit is relieved. As a refrigerant,
It is not necessary to use a fluorine-based cooling liquid, and it is possible to use water.

Here, the temperature control system is arranged in the refrigerant container so that a predetermined gap is formed between the temperature control system and the inner wall of the refrigerant container, the liquefied refrigerant is moved by the capillary phenomenon in the gap, and the vaporized refrigerant is generated. You may make it further equipped with the refrigerant supply / recirculation means in which the several hole which allows passage was formed. Alternatively, the temperature control system separates the inside of the refrigerant container into a first space and a second space, and a partition wall having a plurality of holes through which the vaporized refrigerant passes, and a first space inside the refrigerant container. You may make it further provide with the refrigerant supply / reflux means which moves a liquefied refrigerant between the 2nd space. In those cases, the refrigerant can be efficiently evaporated and condensed.

Further, the temperature control system may be arranged in the refrigerant container and may further include heating means for heating the refrigerant in the refrigerant container. In that case, an appropriate amount of refrigerant can be vaporized in advance, and the temperature can be quickly adjusted at the start of the temperature adjustment operation.

A temperature control system according to a second aspect of the present invention is a refrigerant container for enclosing a refrigerant, and a thermoelectric conversion unit for causing a phase change of the refrigerant for cooling or heating an object to be temperature controlled. And a case that stores the thermoelectric conversion unit and is movable in the refrigerant container, and a distance adjusting unit used to adjust the distance between the thermoelectric conversion unit and the temperature control target.

According to the second aspect of the present invention, in addition to the effect of the first aspect of the present invention, the temperature on the high temperature side of the thermoelectric conversion unit in the cooling operation can be lowered.

Here, the temperature control system may further include a refrigerant supply / reflux means for moving the liquefied refrigerant between the two spaces in the refrigerant container separated by the case. The temperature control system may further include a pressure adjusting mechanism that adjusts the pressure of the refrigerant in the refrigerant container. Thereby, the boiling point of the refrigerant can be controlled.

In the above, the refrigerant container may include heat insulating means for holding the heat accumulated in the refrigerant for reuse. Thereby, energy saving can be realized when the cooling operation and the heating operation are repeated.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a partial cross-sectional view showing the configuration of the temperature control system according to the first embodiment of the present invention. The temperature adjustment system 1 adjusts the temperature of the temperature adjustment object 2 placed on the upper surface (first end) of the thermoelectric conversion unit 3. Bottom surface of thermoelectric conversion unit 3 (second end)
Is in contact with the upper surface of the refrigerant container 4 in which the refrigerant 5 is enclosed, and the side surface and the bottom surface of the refrigerant container 4 include a heat insulating material 7 as heat insulating means. Alternatively, the refrigerant container 4 may have a structure like a thermos. Thus, the thermal contact between the refrigerant 5 and the outside is performed only through the thermoelectric conversion unit 3,
It blocks other thermal contacts. Since the heat quantity of the refrigerant 5 is retained and reused, the heat insulating capacity of the heat insulating means is important. The pressure in the refrigerant container 4 is adjusted by the pressure adjusting mechanism 8.

A refrigerant supply / reflux means 6 is provided in the refrigerant container 4.
Are arranged. A slight gap is formed between the side surface of the coolant supply / reflux means 6 and the inner wall of the coolant container 4, and the liquefied coolant 5 is evaporated / condensed by utilizing the capillary action in this gap. Supply to 9. Also,
A large number of pores penetrating from the upper surface to the bottom surface of the refrigerant supply / reflux unit 6 are formed, and the refrigerant vaporized in the evaporation / condensation unit 9 passes through the refrigerant supply / reflux unit 6 to supply the refrigerant. It moves to the refrigerant pool below the reflux means 6.

By adjusting the pressure of the refrigerant in the refrigerant container 4, the pressure adjusting mechanism 8 suppresses the pressure change when the refrigerant 5 evaporates or condenses, and controls the boiling point of the refrigerant 5. When the set temperature is changed, the pressure adjusting mechanism 8
Changes the boiling point of the refrigerant 5 by pressurizing or depressurizing the inside of the refrigerant container 4.

In the present embodiment, in order to efficiently evaporate and condense the refrigerant, the refrigerant supply / reflux means 6 having pores is provided, but the refrigerant supply / reflux means 6 is omitted. The refrigerant container may have a simple tank shape.
Also, a vapor reservoir may be provided outside the refrigerant container.

When the temperature control system 1 performs the cooling operation, the thermoelectric conversion unit 3 discharges the heat absorbed from the temperature control object 2 to the evaporation / condensation section 9. Therefore, the temperature of the second end of the thermoelectric conversion unit 3 rises. In the evaporation / condensing unit 9, the liquefied refrigerant supplied by the refrigerant supply / reflux means 6 takes heat of the liquefied refrigerant to be vaporized, and the pressure is increased. After passing through the large number of pores formed in the above, it moves to the refrigerant pool below the refrigerant supply / reflux means 6.

As described above, in the cooling operation, the latent heat generated by the evaporation and vaporization of the liquefied refrigerant is used to absorb and store the heat output from the second end of the thermoelectric conversion unit 3 to thereby control the temperature control object. Is cooling. The heat absorbed from the temperature control target is accumulated in the refrigerant as sensible heat or latent heat, and can be reused when the temperature control target is heated.

When the temperature control system 1 performs a heating operation, the thermoelectric conversion unit 3 supplies the heat removed from the evaporation / condensation section 9 to the temperature control target 2. Therefore, the temperature of the 2nd end of the thermoelectric conversion unit 3 falls. In the evaporating / condensing unit 9, the vaporized refrigerant is liquefied to release heat of condensation. The released heat of condensation is used to heat the temperature controlled object 2. In the evaporation / condensation section 9,
The pressure drops due to the liquefaction of the vaporized refrigerant. As a result, the vaporized refrigerant moves from the refrigerant reservoir below the refrigerant supply / reflux means 6 through the large number of pores formed in the refrigerant supply / reflux means 6 and moves to the evaporation / condensation section 9.

As described above, in the heating operation, the object to be temperature-controlled is heated by using the heat of condensation when the vaporized refrigerant is liquefied as a heat source. The liquefied refrigerant can be reused by being vaporized again when the temperature control target object is cooled.

According to this embodiment, the refrigerant circulation system can be simplified, the temperature control range can be expanded by utilizing the phase change of the refrigerant, and the cooling operation and the heating operation can be efficiently and alternately repeated. . Further, it becomes possible to reduce the temperature difference between both ends of the thermoelectric conversion element and prevent damage to the thermoelectric conversion element due to thermal stress. For example, in the cooling operation,
By reducing the pressure of the refrigerant and lowering the boiling point of the refrigerant, the temperature difference between both ends of the thermoelectric conversion element is reduced. On the other hand, in the heating operation, by pressurizing the refrigerant and raising the boiling point of the refrigerant, the temperature difference between both ends of the thermoelectric conversion element is reduced. The coolant need not be a fluorine-based cooling liquid, but water can also be used.

Next, a temperature control system according to the second embodiment of the present invention will be described. The thermoelectric conversion element may be used as in the first embodiment in order to store the necessary amount of heat at the start of the temperature control operation, but in the present embodiment, an appropriate amount of refrigerant is vaporized in advance. Therefore, an auxiliary heating means is provided in the refrigerant container.

FIG. 2 is a partial cross-sectional view showing the structure of the temperature control system according to the second embodiment of the present invention. As shown in FIG. 2, a heater 21 as an auxiliary heating means is provided in the refrigerant container 4. By using the heater 21, an appropriate amount of the refrigerant 5 is previously prepared before starting the temperature control operation.
Can be vaporized and an appropriate amount of heat can be accumulated in the refrigerant 5. By doing this, at the start of the temperature control operation,
Good temperature control can be performed.

Next, a temperature control system according to the third embodiment of the present invention will be described. FIG. 3 is a partial cross-sectional view showing the configuration of the temperature control system according to the third embodiment of the present invention. In this temperature control system, a partition wall 31 in which a large number of pores through which vaporized refrigerant passes is formed is provided in the refrigerant container 4, and the inside of the refrigerant container 4 is provided on the thermoelectric conversion unit 3 side.
Is separated from the second space on the pressure adjusting mechanism 8 side. Further, the coolant supply / reflux means 32 is used to supply the coolant 5 from the second space in the coolant container 4 to the first space. Instead of forming pores in the partition wall 31, a vapor pool may be provided outside the refrigerant container 4.

When the temperature control system performs the cooling operation,
The liquefied refrigerant 5 supplied from the second space to the first space by the refrigerant supply / reflux means 32 is vaporized by the heat released by the thermoelectric conversion unit 3. In the first space, the pressure increases due to the vaporization of the liquefied refrigerant, and the vaporized refrigerant passes through the pores of the partition wall 31 from the first space and moves to the second space.

When the temperature control system performs the heating operation,
The thermoelectric conversion unit 3 cools the refrigerant 5 vaporized in the first space, and the vaporized refrigerant is liquefied to release the heat of condensation. The refrigerant condensed in the first space is
It is returned to the second space by the refrigerant supply / reflux means 32. Further, in the first space, the vaporized refrigerant is liquefied to reduce the pressure. As a result, the vaporized refrigerant passes through the pores of the partition wall 31 from the second space and moves to the first space.

Next, a temperature control system according to the fourth embodiment of the present invention will be described. FIG. 4 is a partial cross-sectional view showing the configuration of the temperature control system according to the fourth embodiment of the present invention. In this temperature control system, the temperature control object 2 is in direct contact with the upper surface of the refrigerant container 4 in which the refrigerant is sealed, and the side surface and bottom surface of the refrigerant container 4 with which the temperature control object 2 is not in contact Includes a heat insulating material 7 as heat insulating means. A case 41 that stores the thermoelectric conversion unit 3 is movably arranged in the refrigerant container 4, and the inside of the refrigerant container 4 includes a first space above the case 41 and a case 4
It is divided into a second space below 1.

Further, in this temperature control system, in the cooling operation, the refrigerant supply / reflux means 42 for supplying the refrigerant 5 from the second space in the refrigerant container 4 to the first space, and the first
A vapor passage for sending the vaporized refrigerant to the second space is formed. Further, a distance adjusting mechanism 43 that mechanically adjusts the distance between the case 41 and the temperature control target 2.
Is provided. Instead of the refrigerant supply / reflux means 42, a minute gap may be provided between the case 41 and the inner surface of the refrigerant container 4 to the extent that a capillary phenomenon occurs. The distance between the case 41 and the temperature control target 2 may be adjusted electrically or magnetically.

When the temperature control system performs the cooling operation,
The distance between the case 41 and the temperature control target 2 is adjusted so that a thin layer of the refrigerant is formed in the first space inside the refrigerant container 4. When the coolant is supplied to the first space in the coolant container 4 by the coolant supply / reflux means 42, the coolant evaporates by the heat from the temperature control target 2 and absorbs the latent heat. This allows
The temperature controlled object 2 is rapidly cooled. The vaporized refrigerant moves to the second space through the vapor passage. On the other hand, the liquefied refrigerant moves from the second space to the first space due to the capillary phenomenon in the minute gap between the case 41 and the inner surface of the refrigerant container 4. In this way, the cooling operation is continuously performed.

When the temperature is precisely adjusted, the thermoelectric conversion unit 3 controls the evaporation amount / condensation amount of the refrigerant.
Further, the heat load may be changed by adjusting the distance between the case 41 and the temperature control target 2 to control the evaporation amount / condensation amount of the refrigerant. At that time, the heat absorbed from the temperature control target is accumulated in the refrigerant as sensible heat or latent heat and can be reused when the temperature control target is heated.

When the temperature control system performs the heating operation,
The case 41 is raised to the maximum in the refrigerant container 4 and brought into close contact with the inner wall of the refrigerant container 4. After that, the temperature control target 2 is heated by the thermoelectric conversion unit 3 while using the liquefied refrigerant on the lower side of the case 41 or the steam remaining after cooling as a heat source.

According to this embodiment, since the refrigerant is interposed between the thermoelectric conversion unit 3 and the temperature control object 2 when the temperature control system performs the cooling operation, the temperature on the high temperature side of the thermoelectric conversion element is lowered. At the same time, the temperature difference in the thermoelectric conversion element can be reduced, and damage to the thermoelectric conversion element due to thermal stress can be better prevented.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional view showing a configuration of a temperature control system according to a first embodiment of the present invention.

FIG. 2 is a partial cross-sectional view showing the configuration of a temperature control system according to a second embodiment of the present invention.

FIG. 3 is a partial cross-sectional view showing the configuration of a temperature control system according to a third embodiment of the present invention.

FIG. 4 is a partial cross-sectional view showing the configuration of a temperature control system according to a fourth embodiment of the present invention.

FIG. 5 is a diagram showing a configuration of a conventional mechanical temperature control system.

[Explanation of symbols]

1 Temperature control system 2 Temperature control target 3 Thermoelectric conversion unit 4 Refrigerant container 5 Refrigerant 6, 32, 42 Refrigerant supply / reflux means 7 insulation 8 Pressure adjustment mechanism 9 Evaporation / condensation section 21 heater 31 partitions 41 cases 43 Distance adjustment mechanism 51 0th refrigerant pipe 52 0th order refrigerant 53 0th-order refrigerant circulation means 54 Primary Refrigerant Piping 55 Primary Refrigerant 56 Primary refrigerant piping means (compressor) 57 condenser 58 heat exchanger 59 Evaporator 60 expansion valve 61 Secondary refrigerant piping 62 Secondary refrigerant 63 Secondary Refrigerant Circulation Means 64 heat exchange section 65 Temperature control target

Claims (8)

[Claims] 1. A cooling medium container for enclosing a cooling medium, one end of which is thermally coupled to the temperature control target and the other end of which is thermally coupled to the cooling medium container to cool or heat the temperature control target. In order to achieve this, a temperature control system including a thermoelectric conversion unit that causes a phase change of the refrigerant, and a pressure adjusting unit that adjusts the pressure inside the refrigerant container. 2. A plurality of units arranged in the refrigerant container such that a predetermined gap is formed between the refrigerant container and an inner wall of the refrigerant container, and moving the liquefied refrigerant by capillarity in the gap and allowing the vaporized refrigerant to pass therethrough. The temperature control system according to claim 1, further comprising a refrigerant supply / reflux means having holes formed therein. 3. A first space and a second space are provided inside the refrigerant container.
And a partition for forming a plurality of holes through which the vaporized refrigerant passes, and a refrigerant supply / reflux means for moving the liquefied refrigerant between the first space and the second space in the refrigerant container. The temperature control system according to claim 1, further comprising: 4. The temperature control system according to claim 1, further comprising a heating unit that is arranged in the refrigerant container and that heats the refrigerant in the refrigerant container. 5. A refrigerant container for enclosing a refrigerant, a thermoelectric conversion unit for causing a phase change of the refrigerant in order to cool or heat the temperature control target, a thermoelectric conversion unit, and the refrigerant container. A temperature control system, comprising: a case movable inside; and a distance adjusting unit used to adjust a distance between the thermoelectric conversion unit and an object to be temperature controlled. 6. The temperature control system according to claim 5, further comprising a refrigerant supply / reflux means for moving the liquefied refrigerant between two spaces in the refrigerant container separated by the case. 7. The temperature control system according to claim 5, further comprising pressure adjusting means for adjusting the pressure of the refrigerant in the refrigerant container. 8. The refrigerant container includes heat insulating means for retaining heat accumulated in the refrigerant for reuse.
The temperature control system according to any one of 1.