JPH06252304A - Heat sink for cooling down semiconductor element - Google Patents

Abstract

PURPOSE:To evenly cool down semiconductor elements regardless of the fitting positions of the semiconductor elements by a method wherein heat pipes are arranged on the surface of a heat detecting block for cooling down semiconductor elements whereinto the intermediate parts of multiple cooling down fins are inserted. CONSTITUTION:A heat pipe 5A is endlessly arranged on the outer peripheral side of respective module type elements 3A-3F of a heat detecting block 2A furthermore heat pipes 1A-1D are fitted to the outer peripheral side. Besides, the heat pipes 1A-1D and 5A are sealed with pure water as a refrigerant. When the temperature in the module type element 3C is heated higher than the other element 3c, the refrigerant inside the heat pipes adjacently arranged to the element 3C is vaporized to start running to the heat pipes arranged in the lower parts in the heat detecting block 2A so that the refrigerant may dissipate heat to be condensated. Through these procedures, the heat in the semiconductor reaching a high temperature can be transferred to the low temperature parts thereby enabling the temperatures in the semiconductor elements to be evenly cooled down.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor element cooling heat sink having a plurality of heat pipes incorporated therein.

[0002]

2. Description of the Related Art As is well known, in semiconductor devices,
Due to the high performance of power converters, the high frequency PWM control method using high-speed switching elements has been increasingly adopted, and with the increase in capacity of semiconductor devices, large capacity elements are connected in parallel and used. Further, in the high frequency PWM control type semiconductor device, it is necessary to reduce the reactance of the conductor connecting the high speed switching elements to suppress the surge voltage generated at the time of switching.
Mounted close to each other.

Therefore, since the heat generated in the high speed switching element is locally concentrated, an air-cooled heat sink has been conventionally used to cool the heat concentrated in the local area.

FIG. 4 is a diagram showing an example of a conventional heat sink for cooling a semiconductor element (hereinafter referred to as heat sink). In FIG. 4, the heat sink is hermetically sealed in a substantially square thick plate heat receiving block 2D shown on the front side of FIG. 4 and a parallel cylindrical hole machined from the rear side in FIG. 4 with respect to this heat receiving block 2D. Heat pipes 1A, 1B, 1C, 1D inserted and having pure water injected therein as a refrigerant,
The heat pipes 1A, 1B, 1C and 1D have an intermediate portion inserted therein, and each of the heat pipes 1A, 1B, 1C and 1D is composed of a plurality of radiating fins 4 of a rectangular aluminum plate material in a rear view (not shown). Among these, on both surfaces of the heat receiving block 2D, module-type elements (hereinafter referred to as elements) 3A, 3 of the same rating to be cooled are provided.
B, 3C, 3D, 3E and 3F are attached.

When the heat sink is incorporated in a vehicle (not shown), the heat pipes 1A, 1B, 1C and 1D are mounted with the tip ends thereof slightly above the heat receiving block 2D side.

In the heat sink configured as described above, when the power converter is operated from the lower side of the heat sink, it is sent to the semiconductor heat sink from the lower side of the heat sink as shown by an arrow A shown in FIG. 4 (b). The cooling air is heated by the radiating fins 4 of the heat sink and then discharged above the box body as indicated by an arrow B to be cooled.

That is, each heat pipe 1A, 1B, 1
Pure water enclosed in C and 1D is used for each module type element 3
Heat receiving block 2 from A, 3B, 3C, 3D, 3E, 3F
The heat transferred through the heat transfer block 2D vaporizes inside the heat receiving block 2D. This steam is applied to each heat pipe 1A, 1
Each of the heat pipes 1A, 1C, 1D, which rises from the base end to the tip and is cooled by the cooling fins 4 in the process,
The inner peripheral surfaces of 1B, 1C and 1D are touched and condensed and liquefied.
This liquefied pure water is used for each heat pipe 1A, 1B, 1
It flows down the inside of C, 1D and is stored in each heat pipe 1A, 1B, 1C, 1D inside the heat receiving block 2.
The above heating, vaporization, liquefaction, and flow-down are repeated.

Further, in terms of the cooling of the module type element and the mounting density of the vehicle, by mounting six module type elements on each side of the heat receiving block 2D, the mounting section and the heat receiving section of this module type element are made small. In addition, the heat receiving block 2D is installed vertically inside the box body of the vehicle, so that the cooling condition is made uniform among the respective modular elements by the cooling air flowing on both sides of the heat receiving block 2D.

[0009]

However, in the heat sink configured as described above and cooled by each heat pipe, among the heat pipes shown in FIG.
The heat pipe 1D, which is the lower end in FIG. 4A, cools well, but the heat pipes 1A and 1B located above are
It is cooled by the cooling air warmed by the heat pipes 1C and 1D and the radiation fins 4 therebelow.

Then, the cooling temperature rises in order, and the temperature becomes highest in the uppermost heat pipe 1A. Therefore, since the heat receiving block 2D is cooled at the lower part but not so much as it is located at the upper part, when the elements 3A, 3B and 3C are connected in parallel and the elements 3D, 3E and 3F are also connected in parallel, the heat receiving block 2D is There is a possibility that the rating of the power converter is determined by the elements 3A, 3B, 3C attached to the upper part, and the rated capacity of the power converter is reduced.

Further, the heat receiving block 2D is provided with a plurality of module-type elements on both sides thereof, and the heat generation amounts of the modules may be different from each other. Since the phase heat siphon type heat pipes are all independent cooling systems, and there are two-phase flow of vapor and liquid inside the heat pipe with a small diameter, the heat receiving part inside the heat pipe is complicated due to various factors. It becomes a flow.

For example, when the amount of the working fluid inside the closed two-phase thermosyphon type heat pipe is small, the working fluid stored in the lower part of the heat pipe is mounted on the heat receiving block 2D near the radiation fins. The module element does not reach the shaped element, and the module element is cooled only by the working fluid cooled by the radiating fins 4, and a temperature difference occurs with the lower portion of the heat receiving block 2D. On the other hand, if the amount of the working fluid is too large, the evaporation section of the closed two-phase thermosyphon type heat pipe has a boiling heat transfer mode, sometimes shows an unsteady state, and a temperature difference occurs in the heat receiving block 2D.

If a temperature imbalance occurs in the heat receiving block 2D, the module element mounted at a high temperature may generate more heat due to the characteristics of the module element. The temperature difference between the two becomes even larger, and the module type element that has become high temperature may be destroyed.

Therefore, an object of the present invention is to obtain a semiconductor element cooling heat sink capable of cooling uniformly regardless of the mounting position of the semiconductor element mounted on the heat receiving block.

[0015]

According to a first aspect of the present invention, a plurality of heat pipes are provided on a plurality of heat pipes arranged in a row from an end surface of a heat receiving block having a plurality of semiconductor elements attached to the surface thereof. In the semiconductor element cooling heat sink having the intermediate portion of the cooling fin inserted therein, a heat pipe is arranged on the surface of the heat receiving block.

Further, in the invention according to claim 2, a plurality of heat pipes protruding from the end surface of the heat receiving block having a plurality of semiconductor elements mounted on the surface in a row are provided in the middle of the plurality of cooling fins. In the heat sink for cooling the semiconductor element having the inserted portion, a heat pipe is bored inside the heat receiving block.

Further, in the third aspect of the invention, a plurality of heat pipes protruding from the end face of the heat receiving block having a plurality of semiconductor elements mounted on both sides in a row are provided in the middle of the plurality of cooling fins. In the heat sink for cooling the semiconductor element with the inserted parts, heat pipes are arranged on both sides of the heat receiving block, and the heat pipes on both sides are communicated with each other.

[0018]

According to the first aspect of the present invention, the heat transferred to the heat receiving block from the semiconductor element having a high temperature due to the non-uniform cooling is transferred to the heat receiving block by the heat pipe arranged on the surface of the heat receiving block. Transported to low temperature part.

According to the second aspect of the invention,
The heat transferred to the heat receiving block from the semiconductor element having a high temperature due to uneven cooling is transferred to the low temperature portion of the heat receiving block by the heat pipe provided inside the heat receiving block.

Further, in the third aspect of the present invention, the heat transferred from the semiconductor element having a high temperature due to non-uniform cooling to the heat receiving block is provided on both sides of the heat receiving block by the heat pipes connected to each other. , Transported to the low temperature part of the heat receiving block.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a heat sink for cooling a semiconductor device according to the present invention will be described below with reference to the drawings. However, the same parts as those of the conventional FIG. FIG. 1 is a diagram showing a heat sink of the invention described in claim 1, and is a diagram corresponding to FIG. 4 (a) shown in the prior art.

In FIG. 1, the mounting relationship between the heat receiving block 2A and the heat pipes 1A, 1B, 1C and 1D and the heat receiving block 2A and the modular elements 3A, 3B, 3C and 3D,
The mounting relationship of 3E and 3F is the same as that of the conventional FIG. However, the heat pipe 5A is provided on the upper surface and the lower surface of the heat receiving block 2A.
Is different.

That is, in FIG. 1, the heat receiving block 2
Each modular element 3A, 3B, 3C, 3D, 3 of A
On the mounting surfaces of E and 3F, each of the module type elements 3A and 3F
Endless heat pipes 5A are arranged between B, 3C, 3D, 3E and 3F and on the outer peripheral side, and are brazed to both sides of the heat receiving block 2A.

The heat pipe 5A is provided with heat pipes 1A, 1B, 1 which extend through the heat receiving block 2A.
Pure water is enclosed as a refrigerant like C and 1D.

In the heat sink configured as described above, for example, when the temperature of the modular element 3C is higher than that of the modular element 3A, the refrigerant inside the heat pipe disposed adjacent to the modular element 3C. Is first vaporized and flows into a heat pipe arranged in a low temperature portion of the heat receiving block 2A to release heat and be condensed, so that the module element 3C on the high temperature side is cooled more than the module element 3A. it can.

Next, FIG. 2 is a view showing a heat sink of the invention described in claim 2, which is shown in FIG.
3 is a view corresponding to FIG. 1;

In FIG. 2, the mounting relationship between the heat receiving block 2B and the heat pipes 1A, 1B, 1C and 1D and the heat receiving block 2A and the modular elements 3A, 3B, 3C and 3D,
The mounting relationship of 3E and 3F is the same as that of the conventional FIG. 4 and FIG. However, the heat pipe 5 is provided inside the heat receiving block 2A.
The difference is that B is formed endlessly.

That is, in FIG. 2, the heat receiving block 2
Inside B, each modular element 3A, 3B, 3C,
An endless heat pipe 5B is provided between 3D, 3E, and 3F and on the outer peripheral side.

The heat pipe 5B is provided with heat pipes 1A, 1B, 1 which extend through the heat receiving block 2B.
Pure water is enclosed as a refrigerant like C and 1D.

In the heat sink thus constructed, for example, when the temperature of the modular element 3C is higher than that of the modular element 3A, the refrigerant inside the heat pipe adjacent to the modular element 3C is provided. Is first vaporized and flows into a heat pipe penetrating the low temperature portion of the heat receiving block 2A to release heat and be condensed, so that the module element 3C on the high temperature side is cooled more than the module element 3A. it can.

FIG. 3 is a diagram showing a heat sink of the invention described in claim 3, and is a diagram corresponding to FIG. 4 (a) shown in the prior art.

In FIG. 3, the mounting relationship between the heat receiving block 2C and the heat pipes 1A, 1B, 1C and 1D and the heat receiving block 2A and the modular elements 3A, 3B, 3C and 3D,
The mounting relationship of 3E and 3F is the same as that of the conventional FIG. 4 and FIGS. 1 and 2. However, the upper surface and the lower surface of the heat receiving block 2C,
The difference is that a heat pipe 5C is provided between the upper surface and the lower surface and is endlessly formed.

That is, in FIG. 3, the heat receiving block 2
C modular elements 3A, 3B, 3C, 3D, 3
Each module type element 3 is attached on both sides of the mounting surface of E, 3F.
An endless heat pipe 5C is disposed between A, 3B, 3C, 3D, 3E, and 3F and on the outer peripheral side, and also penetrates the heat receiving block 2C. Of these, heat receiving block 2C
The heat pipes on both sides of the heat receiving block 2C
Is brazed on both sides.

In this heat pipe 5C, the heat pipes 1A, 1B, 1 penetrating the heat receiving block 2C are provided.
Pure water is enclosed as a refrigerant like C and 1D.

In the heat sink thus constructed, for example, when the temperature of the module element 3C or the temperature of the module element 3A is higher than the temperature of the module element 3C, the refrigerant inside the heat pipe disposed adjacent to the module element 3C. Is first vaporized and flows into a heat pipe arranged in a low temperature portion of the heat receiving block 2C to release heat to be condensed, so that the module element 3C on the high temperature side is cooled more than the module element 3A. it can.

In the above embodiment, the heat pipes 5A, 5B and 5C are formed with a thin groove in the longitudinal direction of the pipes to form, for example, modular elements 3A, 3B and 3C.
Modules 3D, 3E, 3F whose temperature is below
When it is higher than, the modular elements 3D, 3E,
The refrigerant condensed and liquefied by the heat pipe on the 3F side may be circulated by the capillary phenomenon that moves up the narrow groove. Further, instead of the groove, a cylindrical wire net may be inserted and attached.

[0037]

As described above, according to the invention of claim 1,
A heat sink for cooling semiconductor elements, in which the intermediate portions of a plurality of cooling fins are inserted into a plurality of heat pipes protruding in a row from the end surface of a heat receiving block with a plurality of semiconductor elements attached to the surface By disposing the heat pipe on the surface of the block, the heat transferred from the semiconductor element that has become high temperature due to the non-uniform cooling to the heat receiving block is transferred to the heat receiving block by the heat pipe arranged on the surface of the heat receiving block. Since it is transported to the low temperature part, a semiconductor element cooling heat sink capable of cooling uniformly can be obtained regardless of the mounting position of the semiconductor element mounted on the heat receiving block.

According to the second aspect of the present invention, a plurality of heat pipes, which are provided in a row from the end surface of the heat receiving block on which a plurality of semiconductor elements are attached, are provided.
In a heat sink for cooling a semiconductor element in which the intermediate portions of a plurality of cooling fins are inserted, a heat pipe is bored inside the heat receiving block so that the semiconductor element that has become high in temperature due to uneven cooling is transferred to the heat receiving block. Since the transferred heat was transferred to the low temperature part of the heat receiving block by the heat pipe bored inside the heat receiving block, it should be cooled uniformly regardless of the mounting position of the semiconductor element mounted on the heat receiving block. It is possible to obtain a heat sink for cooling a semiconductor device.

Further, according to the invention of claim 3,
In a semiconductor cooling heat sink in which the intermediate portions of a plurality of cooling fins are inserted into a plurality of heat pipes protruding in a row from the end surface of a heat receiving block having a plurality of semiconductor elements attached to both sides, the heat receiving block By arranging heat pipes on both sides of the heat pipe and connecting the heat pipes on both sides, the heat transferred from the semiconductor element that has become high temperature due to uneven cooling to the heat receiving block is arranged on both sides of the heat receiving block. Since the transferred heat is transferred to the low temperature part of the heat receiving block by the heat pipe, it is possible to obtain a heat sink for cooling the semiconductor device capable of cooling uniformly regardless of the mounting position of the semiconductor device mounted on the heat receiving block. it can.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of a heat sink for cooling a semiconductor element of the invention according to claim 1;

FIG. 2 is a diagram showing an embodiment of a heat sink for cooling a semiconductor device of the invention according to claim 2;

FIG. 3 is a diagram showing an embodiment of a heat sink for cooling a semiconductor device of the invention according to claim 3;

FIG. 4 is a diagram showing an example of a conventional semiconductor element cooling heat sink.

[Explanation of symbols]

1A, 1B, 1C, 1D; 5A, 5B, 5C ... Heat pipe, 2A, 2B, 2C ... Heat receiving block, 3A, 3B,
3C, 3D, 3E, 3F ... Modular element, 4 ... Radiating fin.

Claims (3)

[Claims] 1. A semiconductor element cooling in which an intermediate portion of a plurality of cooling fins is inserted into a plurality of heat pipes protruding in a row from an end surface of a heat receiving block having a plurality of semiconductor elements attached to the surface thereof. A heat sink for semiconductor device cooling, characterized in that a heat pipe is disposed on the surface of the heat receiving block. 2. A semiconductor element cooling in which an intermediate portion of a plurality of cooling fins is inserted into a plurality of heat pipes protruding in a row from an end surface of a heat receiving block having a plurality of semiconductor elements attached to the surface thereof. A heat sink for semiconductor device cooling, wherein a heat pipe is bored inside the heat receiving block. 3. A semiconductor element cooling in which an intermediate portion of a plurality of cooling fins is inserted into a plurality of heat pipes protruding from the end surface of a heat receiving block having a plurality of semiconductor elements mounted on both sides in a row. A heat sink for cooling a semiconductor element, wherein heat pipes are arranged on both sides of the heat receiving block, and the heat pipes on both sides are communicated with each other.