JP2003218529A - Wiring board - Google Patents
Wiring boardInfo
- Publication number
- JP2003218529A JP2003218529A JP2002011421A JP2002011421A JP2003218529A JP 2003218529 A JP2003218529 A JP 2003218529A JP 2002011421 A JP2002011421 A JP 2002011421A JP 2002011421 A JP2002011421 A JP 2002011421A JP 2003218529 A JP2003218529 A JP 2003218529A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- conductor
- wiring board
- layer
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、配線基板に関し、
特に筒状のスルーホール導体とこれに接続する充填ビア
導体とを有する配線基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board,
In particular, the present invention relates to a wiring board having a tubular through-hole conductor and a filled via conductor connected thereto.
【０００２】[0002]
【従来の技術】従来より、内側絶縁層の厚さ方向に貫通
するスルーホール内に筒状のスルーホール導体が形成さ
れ、さらに内側絶縁層の外側に積層された外側絶縁層の
厚さ方向に貫通するビアホール内に充填ビア導体が形成
された配線基板が知られている。なお、スルーホール導
体の貫通孔内には樹脂充填体が形成されており、さら
に、スルーホール導体と充填ビア導体とを接続するため
に、樹脂充填体及びスルーホール導体を覆うように蓋メ
ッキ層が形成されている。2. Description of the Related Art Conventionally, a cylindrical through-hole conductor is formed in a through-hole penetrating in the thickness direction of an inner insulating layer, and further in the thickness direction of an outer insulating layer laminated outside the inner insulating layer. A wiring substrate is known in which a filled via conductor is formed in a penetrating via hole. A resin filling body is formed in the through hole of the through-hole conductor, and further, in order to connect the through-hole conductor and the filling via conductor, a lid plating layer covers the resin filling body and the through-hole conductor. Are formed.
【０００３】[0003]
【発明が解決しようとする課題】一般に、樹脂の熱膨張
率は、金属の熱膨張率よりも大きい。従って、配線基板
では、スルーホール導体内の貫通孔内に充填された樹脂
充填体の熱膨張率が、スルーホール導体の熱膨張率より
も大きいために、配線基板の温度が高くなると樹脂充填
体の方がスルーホール導体よりも伸びる。一方、配線基
板の温度が下がると逆に樹脂充填体の方がスルーホール
導体よりも大きく縮む。このため、樹脂充填体及びスル
ーホール導体を覆うように形成されている蓋メッキ層に
応力がかかり、スルーホール導体と樹脂充填体との境界
付近で蓋メッキ層が破断してしまうことがあった。本発
明は、かかる現状に鑑みてなされたものであって、蓋メ
ッキ層のうち、特に応力が集中し易いスルーホール導体
と樹脂充填体との境界付近を補強し、蓋メッキ層の破断
を防止できる配線基板を提供する。Generally, the coefficient of thermal expansion of resin is larger than that of metal. Therefore, in the wiring board, since the thermal expansion coefficient of the resin filling body filled in the through hole in the through hole conductor is larger than the thermal expansion coefficient of the through hole conductor, when the temperature of the wiring board becomes high, the resin filling body Is longer than the through-hole conductor. On the other hand, when the temperature of the wiring board decreases, the resin-filled body shrinks more than the through-hole conductor. For this reason, stress may be applied to the lid plating layer formed so as to cover the resin filling body and the through-hole conductor, and the lid plating layer may be broken near the boundary between the through-hole conductor and the resin filling body. . The present invention has been made in view of the above situation, and in the lid plating layer, the vicinity of the boundary between the through-hole conductor and the resin filling body where the stress is particularly likely to concentrate is reinforced to prevent breakage of the lid plating layer. Provided is a wiring board.
【０００４】[0004]
【課題を解決するための手段、作用及び効果】その解決
手段は、１または複数の内側絶縁層を、その厚さ方向に
貫通するスルーホールと、上記スルーホールの内壁面に
形成され、内部に貫通孔を有する筒状のスルーホール導
体と、上記スルーホール導体内の上記貫通孔内に充填さ
れた樹脂充填体と、上記樹脂充填体を覆うと共に、上記
スルーホール導体と接続する蓋メッキ層と、上記内側絶
縁層の外側に積層された外側絶縁層と、上記スルーホー
ルと同軸であり、上記外側絶縁層の厚さ方向に貫通する
ビアホールと、上記ビアホール内に充填され、上記蓋メ
ッキ層と接続する充填ビア導体と、を備える配線基板で
あって、上記ビアホールのうち上記蓋メッキ層側の内径
が、上記スルーホールの内径以上である配線基板を要旨
とする。Means for Solving the Problem, Action and Effect The means for solving the problem is to form a through hole that penetrates one or a plurality of inner insulating layers in the thickness direction and an inner wall surface of the through hole, and A cylindrical through-hole conductor having a through hole, a resin filler filled in the through hole in the through-hole conductor, and a lid plating layer for covering the resin filler and connecting with the through-hole conductor. An outer insulating layer laminated on the outer side of the inner insulating layer, a via hole coaxial with the through hole and penetrating in the thickness direction of the outer insulating layer, and filling the via hole with the lid plating layer. A wiring board comprising a filling via conductor to be connected, wherein the inner diameter of the via hole on the side of the lid plating layer is equal to or larger than the inner diameter of the through hole.
【０００５】本発明の配線基板は、ビアホールをスルー
ホールと同軸に形成し、このビアホールのうち蓋メッキ
層側の内径をスルーホールの内径以上にしている。これ
により、蓋メッキ層のうち、特に応力が集中し易いスル
ーホール導体と樹脂充填体との境界付近が、充填ビア導
体に覆われて補強されるので、本発明の配線基板は、蓋
メッキ層の破断を防止できる。なお、内側絶縁層として
は、例えば、ガラスエポキシ複合材料など、ガラス織布
に樹脂を含浸させたガラス−樹脂複合材料を１層または
複数層積層したものや、このガラス−樹脂複合材料の層
に樹脂絶縁層を積層したものなどが挙げられる。In the wiring board of the present invention, the via hole is formed coaxially with the through hole, and the inner diameter of the via hole on the lid plating layer side is made equal to or larger than the inner diameter of the through hole. As a result, in the lid plating layer, the vicinity of the boundary between the through-hole conductor where the stress is particularly likely to concentrate and the resin filling body is covered and reinforced by the filled via conductor, so that the wiring board of the present invention has the lid plating layer. Can be prevented from breaking. The inner insulating layer may be, for example, one or more laminated glass-resin composite materials obtained by impregnating glass woven cloth with resin, such as glass epoxy composite material, or layers of this glass-resin composite material. For example, a laminate of resin insulating layers may be used.
【０００６】他の解決手段は、１または複数の内側絶縁
層を、その厚さ方向に貫通するスルーホールと、上記ス
ルーホールの内壁面に形成され、内部に貫通孔を有する
筒状のスルーホール導体と、上記スルーホール導体内の
上記貫通孔内に充填された樹脂充填体と、上記樹脂充填
体を覆うと共に、上記スルーホール導体と接続する蓋メ
ッキ層と、上記内側絶縁層の外側に積層された外側絶縁
層と、上記外側絶縁層の厚さ方向に貫通するビアホール
と、上記ビアホール内に充填され、上記蓋メッキ層と接
続する充填ビア導体と、を備える配線基板であって、上
記ビアホールは、上記スルーホールを上記外側絶縁層側
に延ばした仮想スルーホール領域を内部に含む配線基板
を要旨とする。Another solution is a cylindrical through hole having a through hole penetrating one or a plurality of inner insulating layers in the thickness direction and an inner wall surface of the through hole and having a through hole therein. A conductor, a resin filler filled in the through hole in the through-hole conductor, a lid plating layer that covers the resin filler and is connected to the through-hole conductor, and is laminated outside the inner insulating layer. And a filled via conductor that is filled in the via hole and is connected to the lid plating layer, the via hole being formed in the via hole. The gist of the present invention is a wiring board which internally includes a virtual through hole region in which the through hole is extended to the outer insulating layer side.
【０００７】本発明の配線基板は、ビアホールが、スル
ーホールを外側絶縁層側に延ばした仮想スルーホール領
域を内部に含んでいる。これにより、蓋メッキ層のう
ち、特に応力が集中し易いスルーホール導体と樹脂充填
体との境界付近が、充填ビア導体に覆われて補強される
ので、本発明の配線基板は、蓋メッキ層の破断を防止で
きる。In the wiring board of the present invention, the via hole internally includes a virtual through hole region in which the through hole is extended to the outer insulating layer side. As a result, in the lid plating layer, the vicinity of the boundary between the through-hole conductor where the stress is particularly likely to concentrate and the resin filling body is covered and reinforced by the filled via conductor, so that the wiring board of the present invention has the lid plating layer. Can be prevented from breaking.
【０００８】[0008]
【発明の実施の形態】本発明の実施形態を、図面を参照
しつつ説明する。図１に示す配線基板１００は、コア基
板１１０（内側絶縁層）、コア主面１１０ｂ側に積層さ
れた樹脂絶縁層１２０（外側絶縁層）、及びソルダーレ
ジスト層１３０を有する。さらに、図示しないが、コア
裏面側にも同様に、樹脂絶縁層、及びソルダーレジスト
層が積層されている。コア基板１１０は、厚さ８００μ
ｍのガラス−エポキシ樹脂複合材料からなり、この厚さ
方向を貫通する内径Ｄ１＝１００μｍのスルーホール１
１１が多数形成されている。さらに、スルーホール１１
１内とコア主面１１０ｂ及び図示しないコア裏面のうち
スルーホール１１１の周縁部とには、厚さ１８μｍの円
筒状のスルーホール導体１１２が形成されている。さら
に、スルーホール導体１１２の貫通孔１１２ｂ内には樹
脂充填体１１３が充填されている。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to the drawings. The wiring substrate 100 shown in FIG. 1 has a core substrate 110 (inner insulating layer), a resin insulating layer 120 (outer insulating layer) laminated on the core main surface 110b side, and a solder resist layer 130. Further, although not shown, a resin insulating layer and a solder resist layer are similarly laminated on the back surface side of the core. The core substrate 110 has a thickness of 800 μ
m glass-epoxy resin composite material, and a through hole 1 having an inner diameter D1 of 100 μm that penetrates in the thickness direction.
A large number of 11 are formed. Furthermore, through hole 11
A cylindrical through-hole conductor 112 having a thickness of 18 μm is formed inside 1 and on the peripheral surface of the through-hole 111 on the core main surface 110b and the core back surface (not shown). Further, a resin filling body 113 is filled in the through hole 112b of the through hole conductor 112.
【０００９】コア基板１１０と樹脂絶縁層１２０との層
間には、樹脂充填体１１３を覆いつつスルーホール導体
１１２と接続する、厚さ１５μｍの蓋メッキ層１１５が
形成されている。樹脂絶縁層１２０は、厚さ３０μｍの
エポキシ樹脂からなり、多数のビアホール１２１が形成
されている。さらに、ビアホール１２１内には、蓋メッ
キ層１１５と接続する充填ビアホール導体１２２が形成
されている。さらに、樹脂絶縁層１２０とソルダーレジ
スト層１３０との層間には、充填ビアホール導体１２２
と接続する配線層１３２が形成されている。さらに、ソ
ルダーレジスト層１３０には、貫通孔１３１が形成され
ており、配線層１３２の一部を露出させてパッド１３２
ｂを形成している。配線基板１００には、このパッド１
３２ｂを利用して、図示しないＩＣチップ等が搭載され
る。Between the core substrate 110 and the resin insulation layer 120, a lid plating layer 115 having a thickness of 15 μm is formed so as to cover the resin filler 113 and connect to the through-hole conductor 112. The resin insulating layer 120 is made of an epoxy resin having a thickness of 30 μm and has a large number of via holes 121 formed therein. Further, in the via hole 121, a filled via hole conductor 122 connected to the lid plating layer 115 is formed. Further, a filled via-hole conductor 122 is provided between the resin insulating layer 120 and the solder resist layer 130.
A wiring layer 132 that is connected to the wiring layer is formed. Further, through holes 131 are formed in the solder resist layer 130, and a part of the wiring layer 132 is exposed to expose the pads 132.
b is formed. This pad 1 is provided on the wiring board 100.
An IC chip (not shown) or the like is mounted by using 32b.
【００１０】さらに、本実施形態の配線基板１００で
は、図１に示すように、ビアホール１２１は、その中心
軸がスルーホール１１１の中心軸Ｃに一致するように形
成されている。さらに、ビアホール１２１の底面１２１
ｂの直径Ｄ２を、スルーホール１１１の内径Ｄ１（＝１
００μｍ）以上の大きさである１２０μｍとしている。
従って、ビアホール１２１は、スルーホール１１１を樹
脂絶縁層１２０側（図１中上方）に延長した仮想スルー
ホール領域Ｅ１を内部に含む。これにより、本実施形態
の配線基板１００では、蓋メッキ層１１５のうちスルー
ホール導体１１２と樹脂充填体１１３との境界付近であ
る境界部１１５ｂが、充填ビア導体１２２の底部１２２
ｂによって覆われる。なお、コア裏面側にも蓋メッキ
層、ビアホール導体等が、コア主面１１０ｂ側と同様に
形成されている。Further, in the wiring board 100 of the present embodiment, as shown in FIG. 1, the via hole 121 is formed so that its central axis coincides with the central axis C of the through hole 111. Further, the bottom surface 121 of the via hole 121
The diameter D2 of b is set to the inner diameter D1 of the through hole 111 (= 1
The size is set to 120 μm, which is larger than 00 μm).
Therefore, the via hole 121 internally includes a virtual through hole region E1 in which the through hole 111 is extended to the resin insulating layer 120 side (upper side in FIG. 1). As a result, in the wiring board 100 of the present embodiment, the boundary portion 115b of the lid plating layer 115 that is near the boundary between the through-hole conductor 112 and the resin filling body 113 is the bottom portion 122 of the filled via conductor 122.
covered by b. A lid plating layer, a via-hole conductor, etc. are formed on the back surface of the core in the same manner as on the core main surface 110b side.
【００１１】ところで、配線基板１００では、エポキシ
樹脂からなる樹脂充填体１１３の熱膨張率が約４０ｐｐ
ｍ、銅からなるのスルーホール導体１１２の熱膨張率が
約１８ｐｐｍとなっている。従って、樹脂充填体１１３
の熱膨張率がスルーホール導体１１２の熱膨張率よりも
２倍以上大きいために、配線基板１００の温度が上下す
ると、樹脂充填体１１３がスルーホール導体１１２に比
べて大きく伸縮する。このため、蓋メッキ層１１５に応
力がかかり、特にスルーホール導体１１２と樹脂充填体
１１３との境界付近に応力が集中する。しかしながら、
本実施形態の配線基板１００では、蓋メッキ層１１５の
うちスルーホール導体１１２と樹脂充填体１１３との境
界付近である境界部１１５ｂが、充填ビア導体１２２に
覆われて補強されているので、蓋メッキ層１１５の破断
を防止することができる。さらに、本実施形態の配線基
板１００は、蓋メッキ層１１５と非充填ビア導体１２２
との接触面積が大きいので、電気特性が良好となる。さ
らに、たとえ蓋メッキ層１１５が破断したとしても、ス
ルーホール導体１１２、蓋メッキ層１１５、及び充填ビ
ア導体１２２の導通を確保することができる。In the wiring board 100, the coefficient of thermal expansion of the resin filler 113 made of epoxy resin is about 40 pp.
The coefficient of thermal expansion of the through-hole conductor 112 made of m and copper is about 18 ppm. Therefore, the resin filling body 113
Since the coefficient of thermal expansion of is greater than the coefficient of thermal expansion of the through-hole conductor 112 by a factor of two or more, the resin filler 113 expands and contracts more greatly than the through-hole conductor 112 when the temperature of the wiring board 100 rises and falls. For this reason, stress is applied to the lid plating layer 115, and particularly stress is concentrated near the boundary between the through-hole conductor 112 and the resin filling body 113. However,
In the wiring board 100 of the present embodiment, the boundary portion 115b of the lid plating layer 115, which is near the boundary between the through-hole conductor 112 and the resin filling body 113, is covered and reinforced by the filled via conductor 122, and thus the lid is formed. It is possible to prevent breakage of the plated layer 115. Further, the wiring board 100 of the present embodiment has the lid plating layer 115 and the unfilled via conductor 122.
Since the contact area with is large, the electrical characteristics are good. Further, even if the lid plating layer 115 is broken, the conduction of the through-hole conductor 112, the lid plating layer 115, and the filled via conductor 122 can be ensured.
【００１２】このような配線基板１００は、次のように
して製造する。なお、ここではコア裏面側についての説
明を省略するが、コア裏面側についてもコア主面１１０
ｂ側と同時に形成するものとする。ガラス−エポキシ樹
脂複合材料からなり、両面に銅箔を張り付けた、厚さ約
１．０ｍｍのコア基板１１０を用意する。そして、コア
基板１００の所定の位置に、ドリルまたはレーザによっ
て、これを貫通する多数のスルーホール１１１を穿孔す
る。その後、公知の無電解Ｃｕメッキ、及び電解Ｃｕメ
ッキによって、スルーホール１１１内にスルーホール導
体１１２を形成する。次いで、スルーホール導体１１２
の貫通孔１１２ｂ内に樹脂ペーストを印刷充填して熱硬
化させ、コア主面１１０ｂを研磨して樹脂充填体１１３
を形成する。次に、例えば、サブトラクティブ法など公
知の無電解Ｃｕメッキ、電解Ｃｕメッキ、及びエッチン
グ手法によって、コア主面１１０ｂ上に、樹脂充填体１
１３を覆いつつスルーホール導体１１２と接続するよう
な、直径２００μｍ、厚さ１５μｍの蓋メッキ層１１５
を形成する。Such a wiring board 100 is manufactured as follows. Although the description of the core back surface side is omitted here, the core main surface 110 is also described for the core back surface side.
It is formed at the same time as the b side. A core substrate 110 made of a glass-epoxy resin composite material and having a copper foil adhered on both sides and having a thickness of about 1.0 mm is prepared. Then, a large number of through holes 111 are formed at predetermined positions of the core substrate 100 by a drill or a laser. After that, the through-hole conductor 112 is formed in the through-hole 111 by known electroless Cu plating and electrolytic Cu plating. Then, through-hole conductor 112
A resin paste is printed and filled in the through holes 112b of the resin and thermally cured, and the core main surface 110b is polished to make the resin filler 113
To form. Next, for example, by a known electroless Cu plating method such as a subtractive method, an electrolytic Cu plating method, and an etching method, the resin filling body 1 is formed on the core main surface 110b.
The lid plating layer 115 having a diameter of 200 μm and a thickness of 15 μm so as to be connected to the through-hole conductor 112 while covering 13
To form.
【００１３】次いで、コア主面１１０ｂ及び蓋メッキ層
１１５上に、ビアホール１２１を有する樹脂絶縁層１２
０を形成する。具体的には、未硬化感光性樹脂を貼り付
け、フォトリソグラフィ技術により、露光・現像・硬化
させて、ビアホール１２１を有する樹脂絶縁層１２０を
形成する。ここで、ビアホール１２１はスルーホール１
１１と同軸に且つ、蓋メッキ層１１５に近づくにつれて
内径が小さくなるテーパ状に形成する。なお、ビアホー
ル１２１の底面１２１ｂの直径Ｄ２を１２０μｍとし
た。その後、例えば、セミアディティブ法など公知の無
電解Ｃｕメッキ、電解Ｃｕメッキ及びエッチング手法に
よって、ビアホール１２１内に充填ビアホール導体１２
２を形成し、樹脂絶縁層１２０の主面１２０ｂに配線層
１３２を形成する。次いで、ソルダーレジスト層１３０
を積層し、露光・現像して所定の位置に貫通孔１３１を
形成する。これにより、配線層１３２の一部が貫通孔１
３１から露出して、パッド１３２ｂが形成される。この
ようにして、配線基板１００が完成する。Next, the resin insulation layer 12 having the via holes 121 on the core main surface 110b and the lid plating layer 115.
Form 0. Specifically, an uncured photosensitive resin is attached and exposed, developed and cured by a photolithography technique to form a resin insulating layer 120 having a via hole 121. Here, the via hole 121 is the through hole 1.
It is formed so as to be coaxial with 11 and have a tapered inner diameter as it approaches the lid plating layer 115. The diameter D2 of the bottom surface 121b of the via hole 121 was 120 μm. After that, the filled via-hole conductor 12 is filled in the via-hole 121 by a known electroless Cu plating, electrolytic Cu plating, or etching method such as a semi-additive method.
2 is formed, and the wiring layer 132 is formed on the main surface 120b of the resin insulating layer 120. Then, the solder resist layer 130
Are laminated, exposed and developed to form a through hole 131 at a predetermined position. As a result, a part of the wiring layer 132 is partially exposed to the through hole 1.
The pad 132b is formed by being exposed from 31. In this way, the wiring board 100 is completed.
【００１４】（変形形態）次に、実施形態の変形形態で
ある配線基板２００について、図面を参照しつつ説明す
る。上述した実施形態の配線基板１００では、ビアホー
ル１２１とスルーホール１１１とを同軸に形成した。こ
れに対し、本変形形態の配線基板２００は、ビアホール
をスルーホールと同軸に形成しない点で異なるが、その
他の部分についてはほぼ同様である。従って、実施形態
と異なる部分を中心に説明し、同様な部分については、
説明を省略または簡略化する。図２に示す配線基板２０
０は、実施形態の配線基板１００と同様に、コア基板２
１０（内側絶縁層）、コア主面２１０ｂ側に積層された
樹脂絶縁層２２０（外側絶縁層）、及びソルダーレジス
ト層２３０を有する。さらに、図示しないが、コア裏面
側にも同様に、樹脂絶縁層、及びソルダーレジスト層が
積層されている。(Modification) Next, a wiring board 200 which is a modification of the embodiment will be described with reference to the drawings. In the wiring board 100 of the above-described embodiment, the via hole 121 and the through hole 111 are formed coaxially. On the other hand, the wiring board 200 of the present modification is different in that the via hole is not formed coaxially with the through hole, but is substantially the same in other parts. Therefore, the description will be focused on the parts different from the embodiment, and the similar parts will be described.
Omit or simplify the description. Wiring board 20 shown in FIG.
0 indicates the core substrate 2 as in the wiring substrate 100 of the embodiment.
10 (inner insulating layer), a resin insulating layer 220 (outer insulating layer) laminated on the core main surface 210b side, and a solder resist layer 230. Further, although not shown, a resin insulating layer and a solder resist layer are similarly laminated on the back surface side of the core.
【００１５】コア基板２１０には、実施形態の配線基板
１００と同様に、厚さ方向を貫通する内径１００μｍの
スルーホール２１１、スルーホール導体２１２、及び樹
脂充填体２１３が形成されている。コア基板２１０と樹
脂絶縁層２２０との層間には、実施形態の配線基板１０
０と同様に、蓋メッキ層２１５が形成されている。樹脂
絶縁層２２０には、実施形態の配線基板１００と異なる
ビアホール２２１及び充填ビアホール導体２２２が形成
されている。さらに、実施形態の配線基板１００と同様
に、配線層２３２、パッド２３２ｂが形成されている。Like the wiring board 100 of the embodiment, the core substrate 210 is provided with through holes 211 having an inner diameter of 100 μm, through holes conductors 212, and resin filling bodies 213 that penetrate through the thickness direction. Between the core substrate 210 and the resin insulating layer 220, the wiring substrate 10 of the embodiment is provided.
Like 0, the lid plating layer 215 is formed. A via hole 221 and a filled via hole conductor 222 different from those of the wiring board 100 of the embodiment are formed in the resin insulating layer 220. Further, a wiring layer 232 and a pad 232b are formed as in the wiring board 100 of the embodiment.
【００１６】但し、本変形形態の配線基板２００は、実
施形態の配線基板１００と異なり、図２に示すように、
ビアホール２２１とスルーホール２１１とは同軸に形成
されていない。しかしながら、本変形形態の配線基板２
００は、ビアホール２２１が、スルーホール２１１を樹
脂絶縁層２２０側（図２中上方）に延ばした仮想スルー
ホール領域Ｅ２を内部に含んでいる。これにより、蓋メ
ッキ層２１５のうちスルーホール導体２１２と樹脂充填
体２１３との境界付近である境界部２１５ｂが、充填ビ
ア導体２２２に覆われて補強されるので、本変形形態の
配線基板２００においても、蓋メッキ層２１５の破断を
防止することができる。さらに、本変形形態の配線基板
２００は、蓋メッキ層２１５と充填ビア導体２２２との
接続部分が実施形態の配線基板１００よりも大きいの
で、さらに電気特性が良好となる。However, unlike the wiring board 100 according to the embodiment, the wiring board 200 according to the present modification is different from the wiring board 200 according to the embodiment as shown in FIG.
The via hole 221 and the through hole 211 are not formed coaxially. However, the wiring board 2 of the present modified embodiment
In 00, the via hole 221 includes a virtual through hole region E2 in which the through hole 211 is extended to the resin insulating layer 220 side (upper side in FIG. 2). As a result, the boundary portion 215b of the lid plating layer 215, which is in the vicinity of the boundary between the through-hole conductor 212 and the resin filling body 213, is covered and reinforced by the filled via conductor 222. Also, the lid plating layer 215 can be prevented from breaking. Furthermore, in the wiring board 200 of the present modification, the connection portion between the lid plating layer 215 and the filled via conductor 222 is larger than that of the wiring board 100 of the embodiment, so the electrical characteristics are further improved.
【００１７】以上において、本発明を実施形態及び変形
形態に即して説明したが、本発明は上記実施形態等に限
定されるものではなく、その要旨を逸脱しない範囲で、
適宜変更して適用できることはいうまでもない。例え
ば、実施形態及び変形形態では、内側絶縁層を１層のコ
ア基板１１０，２１０として、これらを貫通するスルー
ホール１１１，２１１を形成したが、内側絶縁層を複数
の絶縁層として、この複数の絶縁層を貫通するスルーホ
ールを形成しても良い。また、実施形態及び変形形態で
は、コア基板１１０，２１０の両面に樹脂絶縁層１２
０，２２０、充填ビア導体１２２，２２２等を形成した
が、コア基板１１０，２１０の主面１１０ｂ，２１０ｂ
側のみに形成しても良い。Although the present invention has been described with reference to the embodiments and the modifications, the present invention is not limited to the above-mentioned embodiments and the like, and does not depart from the gist of the invention.
It goes without saying that it can be applied with appropriate changes. For example, in the embodiment and the modified embodiment, the inner insulating layer is the single-layer core substrate 110, 210 and the through holes 111, 211 are formed to penetrate through the inner substrate, but the inner insulating layer is formed as the plurality of insulating layers. You may form a through hole which penetrates an insulating layer. Further, in the embodiment and the modified embodiment, the resin insulating layer 12 is formed on both surfaces of the core substrates 110 and 210.
0, 220, filled via conductors 122, 222, etc. are formed, but the main surfaces 110b, 210b of the core substrates 110, 210 are not formed.
It may be formed only on the side.
【００１８】[0018]
【図１】実施形態にかかる配線基板１００の要部を示す
部分断面図である。FIG. 1 is a partial cross-sectional view showing a main part of a wiring board 100 according to an embodiment.
【図２】変形形態にかかる配線基板２００の要部を示す
部分断面図である。FIG. 2 is a partial cross-sectional view showing a main part of a wiring board 200 according to a modification.
１００，２００ 配線基板
１１０，２１０ コア基板（内側絶縁層）
１１１，２１１ スルーホール
１１２，２１２ スルーホール導体
１１２ｂ，２１２ｂ 貫通孔
１１３，２１３ 樹脂充填体
１１５，２１５ 蓋メッキ層
１２０，２２０ 樹脂絶縁層（外側絶縁層）
１２１，２２１ ビアホール
１２２，２２２ 充填ビア導体
Ｄ１ スルーホール１１１の内径
Ｄ２ ビアホール１２１の底面１２１ｂの直径（ビアホ
ールのうち蓋メッキ層側の内径）
Ｅ１，Ｅ２ 仮想スルーホール領域100, 200 Wiring boards 110, 210 Core boards (inner insulating layer) 111, 211 Through holes 112, 212 Through hole conductors 112b, 212b Through holes 113, 213 Resin filling bodies 115, 215 Lid plating layers 120, 220 Resin insulating layers ( Outer insulating layer) 121,221 Via holes 122,222 Filled via conductor D1 Inner diameter D2 of through hole 111 Diameter of bottom surface 121b of via hole 121 (inner diameter of via hole on lid plating layer side) E1, E2 Virtual through hole regions
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 5E314 AA24 CC01 FF01 FF08 FF17 GG11 5E317 AA24 AA26 BB12 CC15 CC25 CC32 CC33 CD27 CD32 GG05 GG09 GG14 5E346 AA06 AA12 AA15 AA22 AA32 AA35 AA43 AA51 BB16 CC08 CC32 DD23 DD24 EE18 FF07 FF15 GG15 GG17 GG28 HH11 ─────────────────────────────────────────────────── ─── Continued front page F-term (reference) 5E314 AA24 CC01 FF01 FF08 FF17 GG11 5E317 AA24 AA26 BB12 CC15 CC25 CC32 CC33 CD27 CD32 GG05 GG09 GG14 5E346 AA06 AA12 AA15 AA22 AA32 AA35 AA43 AA51 BB16 CC08 CC32 DD23 DD24 EE18 FF07 FF15 GG15 GG17 GG28 HH11
Claims (2)
向に貫通するスルーホールと、 上記スルーホールの内壁面に形成され、内部に貫通孔を
有する筒状のスルーホール導体と、 上記スルーホール導体内の上記貫通孔内に充填された樹
脂充填体と、 上記樹脂充填体を覆うと共に、上記スルーホール導体と
接続する蓋メッキ層と、 上記内側絶縁層の外側に積層された外側絶縁層と、 上記スルーホールと同軸であり、上記外側絶縁層の厚さ
方向に貫通するビアホールと、 上記ビアホール内に充填され、上記蓋メッキ層と接続す
る充填ビア導体と、を備える配線基板であって、 上記ビアホールのうち上記蓋メッキ層側の内径が、上記
スルーホールの内径以上である配線基板。1. A through hole penetrating one or a plurality of inner insulating layers in a thickness direction thereof, a cylindrical through hole conductor formed on an inner wall surface of the through hole, and having a through hole therein, A resin filling body filled in the through hole in the through-hole conductor, a lid plating layer that covers the resin filling body and is connected to the through-hole conductor, and an outer insulation layer laminated outside the inner insulation layer. A wiring board having a layer, a via hole coaxial with the through hole and penetrating in the thickness direction of the outer insulating layer, and a filled via conductor filled in the via hole and connected to the lid plating layer. The inner diameter of the via hole on the side of the lid plating layer is equal to or larger than the inner diameter of the through hole.
向に貫通するスルーホールと、 上記スルーホールの内壁面に形成され、内部に貫通孔を
有する筒状のスルーホール導体と、 上記スルーホール導体内の上記貫通孔内に充填された樹
脂充填体と、 上記樹脂充填体を覆うと共に、上記スルーホール導体と
接続する蓋メッキ層と、 上記内側絶縁層の外側に積層された外側絶縁層と、 上記外側絶縁層の厚さ方向に貫通するビアホールと、 上記ビアホール内に充填され、上記蓋メッキ層と接続す
る充填ビア導体と、を備える配線基板であって、 上記ビアホールは、上記スルーホールを上記外側絶縁層
側に延ばした仮想スルーホール領域を内部に含む配線基
板。2. A through hole penetrating one or a plurality of inner insulating layers in a thickness direction thereof, a cylindrical through hole conductor formed on an inner wall surface of the through hole and having a through hole therein, A resin filling body filled in the through hole in the through-hole conductor, a lid plating layer that covers the resin filling body and is connected to the through-hole conductor, and an outer insulation layer laminated outside the inner insulation layer. A wiring board comprising a layer, a via hole penetrating in a thickness direction of the outer insulating layer, and a filled via conductor filled in the via hole and connected to the lid plating layer, wherein the via hole is the through hole. A wiring board which internally includes a virtual through hole region in which a hole is extended to the outer insulating layer side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002011421A JP3854510B2 (en) | 2002-01-21 | 2002-01-21 | Wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002011421A JP3854510B2 (en) | 2002-01-21 | 2002-01-21 | Wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003218529A true JP2003218529A (en) | 2003-07-31 |
| JP3854510B2 JP3854510B2 (en) | 2006-12-06 |
Family
ID=27648908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002011421A Expired - Fee Related JP3854510B2 (en) | 2002-01-21 | 2002-01-21 | Wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3854510B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005203764A (en) * | 2003-12-16 | 2005-07-28 | Ngk Spark Plug Co Ltd | Multi-layer wiring board |
| JP2018114328A (en) * | 2018-03-30 | 2018-07-26 | 株式会社ユニバーサルエンターテインメント | Game machine |
| JP2019067812A (en) * | 2017-09-28 | 2019-04-25 | 大日本印刷株式会社 | Through-electrode substrate and manufacturing method thereof |
| JP2019067798A (en) * | 2017-09-28 | 2019-04-25 | 大日本印刷株式会社 | Through-electrode substrate and manufacturing method thereof |
-
2002
- 2002-01-21 JP JP2002011421A patent/JP3854510B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005203764A (en) * | 2003-12-16 | 2005-07-28 | Ngk Spark Plug Co Ltd | Multi-layer wiring board |
| JP4647990B2 (en) * | 2003-12-16 | 2011-03-09 | 日本特殊陶業株式会社 | Multilayer wiring board |
| JP2019067812A (en) * | 2017-09-28 | 2019-04-25 | 大日本印刷株式会社 | Through-electrode substrate and manufacturing method thereof |
| JP2019067798A (en) * | 2017-09-28 | 2019-04-25 | 大日本印刷株式会社 | Through-electrode substrate and manufacturing method thereof |
| JP7043768B2 (en) | 2017-09-28 | 2022-03-30 | 大日本印刷株式会社 | Through Electrode Substrate and Its Manufacturing Method |
| JP7087319B2 (en) | 2017-09-28 | 2022-06-21 | 大日本印刷株式会社 | Through Silicon Via Board and Its Manufacturing Method |
| JP2018114328A (en) * | 2018-03-30 | 2018-07-26 | 株式会社ユニバーサルエンターテインメント | Game machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3854510B2 (en) | 2006-12-06 |
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