JP2003218441A - Light emitting unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting unit that can introduce light irradiated from a semiconductor laser device to an optical waveguide type SHG device by a simple adjustment. <P>SOLUTION: The light emitting unit includes the semiconductor laser device 51 and the optical waveguide type SHG device 56 that generates a second higher harmonic of the light irradiated from the semiconductor laser device 51, wherein an optical fiber 42 is provided that guides the light irradiated from the semiconductor laser device 51 to an optical waveguide 56a formed on the optical waveguide type SHG device 56, by which a relative positional relation between the semiconductor laser device 51 and the optical fiber 42 and a relative positional relation between the optical fiber 42 and the optical waveguide type SHG device 56 can be independent each other and can be adjusted separately each other to reduce complexity in collimation. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device including a semiconductor laser element and an optical waveguide type SHG element that generates a second harmonic of the emitted light of the semiconductor laser element.

[0002]

2. Description of the Related Art Such a light emitting device is a device for making emitted light of a semiconductor laser element incident on an optical waveguide of an optical waveguide type SHG element and taking out a second harmonic having a wavelength of 1/2 of the incident light as an optical output. Therefore, a high-power and long-wavelength semiconductor laser device is used to generate short-wavelength laser light for use in various applications. In this type of light emitting device, conventionally, a semiconductor laser element and an optical waveguide type SHG element are arranged on the same support substrate, and emitted light of the semiconductor laser element is collected at an incident end of an optical waveguide of the optical waveguide type SHG element. It was equipped with a lens optical system that emits light.

[0003]

However, in the above-mentioned conventional configuration, although the emitted light of the semiconductor laser element can be converted into the second harmonic with high conversion efficiency by using the optical waveguide type SHG element, the emission of the semiconductor laser element is high. Since the spot width and the optical waveguide width of the optical waveguide type SHG element are as narrow as micron order, it is very difficult to adjust the optical axis of the lens optical system, which causes an increase in the device cost. The present invention has been made in view of the above circumstances, and an object thereof is to provide a light emitting device capable of causing the emitted light of a semiconductor laser element to enter an optical waveguide type SHG element with simple adjustment. is there.

[0004]

According to the present invention, the semiconductor laser device and the optical waveguide type SHG device for generating the second harmonic of the emitted light of the semiconductor laser device are provided. In the light emitting device, an optical fiber is provided for guiding the emitted light of the semiconductor laser element to an optical waveguide formed in the optical waveguide type SHG element. That is, the basic difficulty in optically coupling the semiconductor laser device and the optical waveguide type SHG device by the lens optical system is the relative positional relationship between the semiconductor laser device and the lens optical system, the lens optical system. The relative positional relationship of the system itself and the relative positional relationship between the lens optical system and the optical waveguide type SHG element are linked to each other, and it is necessary to integrally perform these adjustments. Therefore, by configuring the optical path between the semiconductor laser element and the optical waveguide type SHG element with an optical fiber, the relative positional relationship between the semiconductor laser element and the optical fiber, and the relative optical fiber and the optical waveguide type SHG element. Such positional relationships can be made independent of each other, and adjustments can be made individually, thereby reducing the complexity of optical axis adjustment. Moreover,
Since the adjustment technology of the positional relationship between the optical fiber and the semiconductor laser element and the like has been established, the relative positional relationship between the semiconductor laser element and the optical fiber and the relative positional relationship between the optical fiber and the optical waveguide type SHG element. Adjusting the positional relationship is not so difficult. Therefore, it has become possible to provide a light emitting device capable of causing the light emitted from the semiconductor laser element to enter the optical waveguide type SHG element with a simple adjustment.

Further, by providing the structure according to claim 2, the emitted light of the semiconductor laser element is directly incident on the optical fiber, and the emitted light of the optical fiber is the optical waveguide type SHG element. It is configured to directly enter the optical waveguide. That is, in order to increase the light emission intensity of the second harmonic from the optical waveguide type SHG element, the conversion efficiency of the optical waveguide type SHG element itself is improved and the optical efficiency of the semiconductor laser element and the optical waveguide type SHG element is increased. The coupling efficiency has been improved, and research has been advanced on the premise that the utilization efficiency of the emitted light of the semiconductor laser device is improved as much as possible by precisely adjusting the high-precision lens optical system. However, an optical system that may reduce the utilization efficiency of the emitted light of the semiconductor laser device has not been of interest as a research target. On the other hand, in the configuration in which the optical fiber, the semiconductor laser element, and the optical waveguide type SHG element are directly coupled without passing through a lens, although the coupling efficiency of light is lowered, the position adjustment itself can be easily performed, and these are supported. It is also possible to position the member only by the mechanical accuracy of the member and eliminate the need for position adjustment. Therefore, in view of the recent progress in higher output of semiconductor laser devices and higher efficiency of optical waveguide type SHG devices and the cost of assembling and adjusting light emitting devices, the idea is changed, and an optical fiber, a semiconductor laser device and an optical waveguide type SHG are made. As a configuration in which each of the elements is directly coupled without passing through a lens, the manufacturing cost of the light emitting device as a whole is reduced by intentionally sacrificing the utilization efficiency of the emitted light of the semiconductor laser element and simplifying the position adjustment. It was possible to reduce.

Further, by providing the structure according to claim 3, the laser supporting member for supporting the semiconductor laser device and the SHG supporting member for supporting the optical waveguide type SHG device are separately formed. . That is, in the configuration in which the optical waveguide type SHG element generates the second harmonic of the emitted light of the semiconductor laser element, generally, the optimum operating temperature of each element for efficiently extracting the second harmonic is different, and the high temperature is high. It is necessary to control the temperature with accuracy. Therefore, if both elements are arranged on a single supporting member, it is necessary to arrange them at a considerable distance in order to weaken the thermal interaction between both elements. Therefore, considering the avoidance of thermal interaction between both elements, there is a disadvantage that the light emitting device becomes large. Therefore, the supporting member of the semiconductor laser element and the supporting member of the optical waveguide type SHG element are used as separate supporting members, so that the thermal interaction can be sufficiently weakened. In addition, as described above, the semiconductor laser device and the optical waveguide type SHG device are optically coupled to each other by the optical fiber, and the semiconductor laser device and the optical waveguide type SHG device are coupled with each other.
Since the degree of freedom of the relative positional relationship with the element can be dramatically increased, it is possible to arrange the semiconductor laser element and the optical waveguide type SHG element in a positional relationship that further weakens the thermal interaction. At the same time, in a device in which a light emitting device is installed, it is possible to use a suitable empty space of the device to arrange a semiconductor laser element or the like to save space and to have a high degree of freedom in the arrangement of the semiconductor laser element or the like. By utilizing this, it becomes possible to simplify the layout design of other device parts in the device in which the light emitting device is installed. Furthermore, even if the support member of the semiconductor laser device and the support member of the optical waveguide type SHG device become separate support members and the degree of freedom in adjustment increases,
It is possible to prevent the position adjustment of these components from becoming complicated.

Further, by providing the structure according to claim 4, a laser temperature adjusting means for adjusting the temperature of the semiconductor laser element and an SHG temperature adjusting means for adjusting the temperature of the optical waveguide type SHG element. And are provided separately. That is, as described above, the optical waveguide type SHG
In the configuration in which the elements generate the second harmonic of the light emitted from the semiconductor laser element, the optimum operating temperatures of the respective elements are generally different. Therefore, by configuring the light emitting device so that the temperature of these elements can be adjusted separately, The second harmonic of the light emitted from the semiconductor laser device can be efficiently extracted. Moreover,
Along with optically coupling the semiconductor laser device and the optical waveguide type SHG device with the optical fiber as described above, the semiconductor laser device and the laser temperature adjusting means, and the optical waveguide type SHG element and the SHG temperature adjusting means are provided. Since the degree of freedom of the relative positional relationship between the two can be dramatically increased, thermal interference between the semiconductor laser element and the SHG temperature adjusting means, and the optical waveguide type SHG element and the laser temperature adjusting means. It is possible to arrange them in a positional relationship that minimizes thermal interference between them.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments in which the light emitting device of the present invention is provided as a light source for exposure in a photographic printing system will be described below with reference to the drawings. The photographic print system DP illustrated in the present embodiment is known as a so-called digital minilab machine, and as shown in the block diagram of FIG. 5, a photographic film, a memory card, an MO or a CD that has been developed. An image input device IR for inputting image data for producing a photographic print from R or the like, and an exposure / developing device EP for exposing the image data input by the image input device IR to the photographic paper 2. There is. [Schematic Configuration of Image Input Device IR] The image input device IR includes a film scanner 3 for reading frame images of photographic film, a memory reader, and M as shown in FIG.
An external input / output device 4 including an O drive and a CD-R drive, and a general-purpose small computer system are used to control the film scanner 3 and the external input / output device 4 as well as manage the entire photo print system DP. A main controller 5 is further provided, and the main controller 5 further includes a monitor 5a for displaying a simulated image of a finished print image and various control information, and manual setting of exposure conditions and control. An operation console 5b for inputting information is connected.

[Overall Structure of Exposure / Development Device EP]
The developing device EP is drawn out from an image exposure device EX, a developing device PP for developing the photographic paper 2 exposed by the image exposure device EX, and a photographic paper magazine 6 arranged in the housing inside the housing. A printing paper transport system PT that transports the printed printing paper 2 to the development processing device PP by a number of transport rollers 9 and the like is provided. Although not shown, the exposure / developing device E
Outside the casing of P, a sorter for sorting the photographic paper 2 developed and dried by the developing device PP for each order is provided, and the conveyor 10 that conveys the photographic paper 2 to this sorter is a casing. It is provided on the upper surface of the body. Further, in the middle of the conveyance path of the photographic paper conveyance system PT, a cutter 11 for cutting the long photographic paper 2 pulled out from the photographic paper magazine 6 into a set print size, and a plurality of photographic papers 2 conveyed in a line. The sorting device 12 is provided for sorting to the transport rows.

[Structure of Image Exposure Device EX] The image exposure device EX forms an exposure image on the photographic paper 2 by scanning the photographic paper 2 with a light beam.
3 and an exposure control device 1 for controlling the image exposure unit 13
4 and the main part. [Structure of Image Exposure Unit 13] Image Exposure Unit 13
Adopts a so-called laser exposure method in which an image is exposed on the photographic printing paper 2 using a laser as a light source, and a schematic configuration thereof is shown in a block configuration diagram of FIG. The image exposure unit 13 includes a red laser light source 20r and a green laser light source 2 which respectively emit red, green and blue monochromatic light as collimated light.
0g and blue laser light source 20b and each laser light source 20
An acousto-optic modulator 21 (hereinafter abbreviated as "AOM element 21") for intensity-modulating emitted light of r, 20g, and 20b, and a beam of a light beam LB emitted from each of the laser light sources 20r, 20g, and 20b. The beam expander 22 for adjusting the diameter, the cylindrical lens 23, the prism 24 that combines the optical axes of the three red, green, and blue light beams LB into one optical axis, and the light beam LB are scanned. In addition to a polygon mirror 25 for the purpose and an imaging lens group 26 having an f-θ characteristic and a surface tilt correction function,
A mirror 27 that bends the optical path of the light beam LB and an aperture 28 that restricts light incident on the prism 24 are arranged.

[Structure of each laser light source 20r, 20g, 20b] Each of the laser light sources 20r, 20g, 20b uses a semiconductor laser element as a light source. The red laser light source 20r emits light emitted from the semiconductor laser element. While the light beam LB is used as it is, the green laser light source 20
The g and blue laser light source 20b makes the light emitted from the semiconductor laser element incident on the optical waveguide type SHG element to generate a second harmonic, and the second harmonic is used as the light beam LB. Hereinafter, the configurations of the green laser light source 20g and the blue laser light source 20b will be further described.
Since g and 20b have basically the same configuration, both will be described together.

The green laser light source 20g and the blue laser light source 20b, which are the light emitting device LS to which the present invention is applied, are composed of an LD unit 40 and an SHG unit 41, both of which are optical fibers, as schematically illustrated in FIG. Optically connected at 42. This optical fiber 42
It may be glass fiber or plastic fiber. The LD unit 40 has a housing 50.
A semiconductor laser element 51, a laser support member 52 for supporting the semiconductor laser element 51, and a semiconductor laser element 51.
And a Peltier element 53 as a laser temperature adjusting means LT for adjusting the temperature.
The semiconductor laser element 51 used here is I for both the green laser light source 20g and the blue laser light source 20b.
An nGaAs-based material is used, and the composition ratio of the material differs depending on the difference in wavelength between the two.

The arrangement of each component in the LD unit 40 will be described in more detail. The laser support member 52 is fixed on the Peltier element 53 as shown in FIG. Further, one end (light incident end) of the semiconductor laser element 51 and the optical fiber 42 is fixed on the laser support member 52. A V-shaped groove 52a for positioning the light incident end of the optical fiber 42 is formed in the laser support member 52, and the light incident end of the optical fiber 42 is connected to the V-shaped groove 52a.
The light emitted from the semiconductor laser element 51 is fixed to the optical fiber 42 by positioning the light using the groove 52a in proximity to the light emitting end surface of the semiconductor laser element 51.
Directly and efficiently. Laser support member 52
To form the above-mentioned shape, for example, a substrate of Si single crystal is used as the laser supporting member 52, and the V-shaped groove 52a may be formed by etching.

The SHG unit 41 includes an optical waveguide type SHG element 56 in a housing 55, an SHG support member 57 for supporting the optical waveguide type SHG element 56, and an SHG for adjusting the temperature of the optical waveguide type SHG element 56. Temperature adjustment means ST
And a Peltier element 58 as a component. The arrangement of each component in the SHG unit 41 will be described in more detail. As shown in FIG. 3, which shows the component arrangement in the housing 55 in a perspective view, the SHG support member 57 is provided on the Peltier element 58.
Is fixed, and the optical waveguide type S is further mounted on the SHG support member 57.
One end of the HG element 56 and the optical fiber 42 (light emitting end)
Is fixed.

Optical Waveguide 56 of Optical Waveguide Type SHG Element 56
a is formed on the upper side, the SHG
The upper surface of the support member 57 is formed in a two-step shape, and a V-shaped groove 57a for positioning the light emitting end of the optical fiber 42 is formed on the upper side. The optical waveguide 5 of the optical waveguide type SHG element 56 with the light emitting end of the optical fiber 42 positioned using the V-shaped groove 57a.
The light emitted from the optical fiber 42 directly and efficiently enters the optical waveguide 56a by being fixed close to the optical fiber 6a. By mounting the optical fiber 42 in this way, the optical fiber 42 guides the emitted light of the semiconductor laser element 51 to the optical waveguide 56 a formed in the optical waveguide type SHG element 56. When the SHG support member 57 is formed in the above-described shape, like the laser support member 52, for example, a Si single crystal substrate is used as the SHG support member 57, and the V-shaped groove 57a and the step are formed by etching. It should be formed.

The green laser light source 2 configured as described above
0g and the blue laser light source 20b are the laser support member 52
Since the SHG support member 57 and the SHG support member 57 are separately formed and the Peltier devices 53 and 58 are separately provided, the temperature of the semiconductor laser device 51 and the optical waveguide type SHG device 56 can be controlled individually and are not shown. The semiconductor laser device 51 and the optical waveguide type SHG device 5 are operated by the operation of the Peltier devices 53 and 58 controlled by the temperature controller.
6 are individually controlled to the optimum temperature. In this state, the laser light emitted from the semiconductor laser device 51 passes through the optical fiber 42 and the optical waveguide 56a of the optical waveguide type SHG device 56.
When incident on, part of the laser light propagating through the optical waveguide 56a is converted into laser light having a wavelength of ½ and emitted.
The light beam LB is used to expose the printing paper 2.

[Structure of Exposure Control Device 14] The exposure control device 14 includes an image input device IR for controlling the image exposure unit 13 having the above structure, as schematically shown in FIG.
An image processing circuit 30 that corrects and calculates the image data input from the image data into image data in consideration of the exposure characteristics of the image exposure unit 13, and the image data obtained by the image processing circuit 30 for each color of red, green, and blue. An image data memory 31 for storing and a D provided for each color of red, green and blue for D / A converting output data of the image data memory 31.
A / A converter 32 and a control signal having an amplitude corresponding to an input signal from each D / A converter 32, to the AOM element 2
An AOM control circuit 33 for outputting to 1 and a timing control circuit 34 for controlling the sending timing of the image signal sent from each D / A converter 32 are provided.

[Exposure Operation of Image Exposure Device EX] Next, operations of the image exposure unit 13 and the exposure control device 14 having the above-described configurations will be described. The exposure image data input from the image input device IR is corrected and calculated by the image processing circuit 30, and is converted into image data that gives a good print image when exposed by the image exposure unit 13.
The data is sequentially written in the image data memory 31. The data once stored in the image data memory 31 is sent to the D / A converter 32 pixel by pixel in synchronization with the clock signal input from the timing control circuit 34 for each pixel data, and converted into an analog signal. After AOM control circuit 33
Sent to. When the timing control circuit 34 detects that the front end of the photographic paper 2 has been conveyed to a predetermined exposure start position based on the conveyance information of the photographic paper 2 obtained from the photographic paper conveyance system PT, the timing of the light beam LB The image exposure unit 1 outputs the image signal at a speed corresponding to the exposure processing speed of the image exposure unit 13 while synchronizing with the detection signal of the scanning position.
The clock signal is generated so as to be sequentially transmitted to the signal generator 3.

The AOM control circuit 33 outputs a control signal having an amplitude corresponding to the input signal to the AOM element 21, and the AOM element 21 outputs from the laser light sources 20b, 20g, 20r with a diffraction index according to the amplitude of the input control signal. Modulates the incident laser light. Each light beam LB modulated as described above is
After passing through the beam expander 22 etc., the prism 24
Is incident on the polygon mirror 25 and the three light beams LB of red, green and blue are combined into one light beam LB.
It is irradiated on the reflective surface of.

The light beam LB reflected by the reflecting surface of the polygon mirror 25 which is rotationally driven by the drive motor 25a.
Is formed on the photographic printing paper 2 which is scanned and conveyed in a plane orthogonal to the rotation axis of the polygon mirror 25.
Is collected by. The scanning direction of the light beam LB intersects (more specifically, orthogonally) the conveyance direction of the photographic paper 2, the scanning direction of the light beam LB is the main scanning direction, and the conveyance direction of the photographic paper 2 is the sub-scanning direction. Become. An image to be printed on the printing paper 2 is formed as a latent image by scanning the light beam LB and moving the printing paper 2.

[Manufacturing Operation of Photographic Print] Next, the manufacturing operation of the photographic print by the photographic print system DP having the above-described configuration will be schematically described. When the operator inputs an instruction to make a photographic print for a frame image of a photographic film, the main control unit 5 commands the film scanner 3 to read the photographic film, and the film scanner 3 sends the image data of the photographic film. Are sequentially received and recorded in the built-in memory. On the other hand, when the operator inputs an instruction to make a photographic print for image data recorded on a recording medium such as a memory card, MO or CD-R, the main control unit 5 causes the external I / O unit 4 to drive the corresponding drive. To read the image data, sequentially receive the image data from the drive and record it in the memory.

Based on the image data input as described above, the main control unit 5 sends a simulated image, which will be obtained when a print is made from the image data, to an image processing circuit (not shown). And calculate it,
It is displayed on the monitor 5a. The operator uses this monitor 5
Observing the simulated image on a, and if an appropriate image is not obtained, a correction input operation of the exposure condition is performed from the console 5b. The image processing circuit of the main controller 5 generates exposure image data for each of red, green, and blue under preset calculation conditions according to the input image data and the correction input.

The image data for exposure is sent to the exposure control device 14 of the exposure / developing device EP, and a latent image of a print image is formed on the photographic printing paper 2 as described above. The photographic printing paper 2 exposed by the image exposure unit 13 is transported to the development processing device PP by the photographic printing paper transport system PT, and is developed by sequentially passing through the respective development processing tanks, and the development processing is performed. 2 is a conveyor 10 after being further dried.
It is discharged to the top and collected by the sorter for each order.

[Other Embodiments] Other embodiments of the present invention will be listed below. (1) In the above embodiment, the light emitting device LS of the present invention is
The case where the image exposure device EX of the photographic print system DP is applied to a light source for forming an exposure image on the photographic printing paper 2 is illustrated, but it is used for various applications such as a light source for reading and recording of an optical disk device. Can be used. (2) In the above embodiment, L constituting the light emitting device LS
Although the case where the D unit 40 and the SHG unit 41 are arranged close to each other is illustrated, by adopting the optical fiber 42, the degree of freedom in arranging the laser temperature adjusting means LT and the SHG temperature adjusting means ST is higher than that in the conventional case. The optical fiber 42 may be stretched and arranged further apart from each other by more effectively utilizing the point of dramatic improvement. For example, the LD unit 40 may be arranged in the exposure control device 14, and the SHG unit 4 may be arranged.
1 may be arranged in the image exposure unit 13. Alternatively, the laser temperature adjusting means LT and the SHG temperature adjusting means ST may be stored in separate sealed chambers, and the sealed chambers may be connected by an optical fiber 42. With such a configuration, individual temperature settings required for the semiconductor laser device 51 and the optical waveguide type SHG device 56 can be accurately performed by eliminating mutual thermal interference, and at the same time, for laser use. By arranging each of the sealed chambers that store the temperature adjusting means LT and the temperature adjusting means ST for SHG using an appropriate empty space, it is possible to avoid limiting the arrangement of other device parts. it can. (3) In the above embodiment, the LD unit 40 and the SHG
Although the unit 41 and the unit 41 are housed in separate housings, they may be housed in the same housing.

[0025]

According to the structure of the above-mentioned claim 1, the optical path between the semiconductor laser element and the optical waveguide type SHG element is constituted by an optical fiber, so that the relative position between the semiconductor laser element and the optical fiber. It is possible to make the relationship and the relative positional relationship between the optical fiber and the optical waveguide type SHG element independent from each other, and it is possible to individually adjust each, and the complexity of the optical axis adjustment is reduced. In addition, the relative positional relationship between the semiconductor laser device and the optical fiber and the relative relationship between the optical fiber and the optical waveguide type SHG device have been established because the technology for adjusting the positional relationship between the optical fiber and the semiconductor laser device has been established. It is not so difficult to adjust the physical relationship. With simple adjustment,
It has become possible to provide a light emitting device capable of allowing the light emitted from the semiconductor laser element to enter the optical waveguide type SHG element.

Further, according to the structure of the above-mentioned claim 2, the recent high output of the semiconductor laser device and the optical waveguide type SHG.
A structure in which the idea is changed in view of the progress of high efficiency of the element and the assembly and adjustment cost of the light emitting device, and the optical fiber and each of the semiconductor laser element and the optical waveguide type SHG element are directly coupled without a lens. As a result, the manufacturing cost of the light emitting device as a whole can be reduced by intentionally sacrificing the utilization efficiency of the emitted light of the semiconductor laser element and simplifying the position adjustment. Further, according to the structure described in claim 3, the supporting member of the semiconductor laser device and the supporting member of the optical waveguide type SHG device are used as separate supporting members, and it is possible to sufficiently weaken the thermal interaction. In addition to the optical coupling of the semiconductor laser device and the optical waveguide type SHG device by the optical fiber as described above, the degree of freedom of the relative positional relationship between the semiconductor laser device and the optical waveguide type SHG device is increased. The size can be dramatically increased, and even if the support member for the semiconductor laser device and the support member for the optical waveguide type SHG device become separate support members and the degree of freedom in adjustment increases, the position adjustment of these components becomes complicated. Can be avoided as much as possible. Further, according to the structure described in claim 4, in the structure in which the optical waveguide type SHG element generates the second harmonic of the emitted light of the semiconductor laser element, the optimum operating temperature of each element is generally different. By configuring the light emitting device so that the temperature of each element can be adjusted separately,
The second harmonic of the light emitted from the semiconductor laser device can be efficiently extracted.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of a light emitting device according to an embodiment of the invention.

FIG. 2 is a perspective view of an LD unit according to an embodiment of the present invention.

FIG. 3 is a perspective view of an SHG unit according to an embodiment of the present invention.

FIG. 4 is a schematic configuration diagram of an image exposure apparatus according to an embodiment of the present invention.

FIG. 5 is a block configuration diagram of a photographic print system according to an embodiment of the present invention.

[Explanation of symbols]

42 optical fiber 51 Semiconductor laser device 52 Laser support member 56 Optical Waveguide SHG Device 56a optical waveguide 57 SHG support member LT Laser temperature adjustment means ST SHG temperature adjustment means

Claims (4)

[Claims] 1. A semiconductor laser device and an optical waveguide type SHG for generating a second harmonic of emitted light of the semiconductor laser device.
A light emitting device including an element, wherein the light emitted from the semiconductor laser element is the optical waveguide type SHG.
A light emitting device provided with an optical fiber that guides an optical waveguide formed in an element. 2. The light emitted from the semiconductor laser element is directly incident on the optical fiber, and the light emitted from the optical fiber is directly incident on the optical waveguide of the optical waveguide type SHG element. The light emitting device according to claim 1. 3. A laser supporting member for supporting the semiconductor laser device, and an SH for supporting the optical waveguide type SHG device.
The light emitting device according to claim 1, wherein the G support member is formed separately. 4. A laser temperature adjusting means for adjusting the temperature of the semiconductor laser element and an SHG temperature adjusting means for adjusting the temperature of the optical waveguide type SHG element are separately provided. Light emitting device.