JP2003218312A - Semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the separation of a periphery of a tab which is disposed on the under surface of a sealing resin member from occurring. <P>SOLUTION: The semiconductor device QFT.IC38 is provided with the tab 18 which has a bonded pellet 32 via an adhesive layer 31, a plurality of inner leads 19 which are connected electrically to electrodes of the pellet 32 with wires 33, a plurality of outer leads 20 each of which is connected to each inner lead 19 respectively, and the sealing resin member 35 which seals the pellet 32, the tab 18 and the inner leads 19. At the periphery of the tab 18, rising portions 21 which are anchored in the resin of the sealing resin member 35 and non-rising portions 22 are alternately formed, and a back surface of the tab 18 is exposed outside the under surface of the sealing resin member 35. The separation of the periphery of the tab, which is exposed outside the sealing resin member from the resin around the periphery of the tab, can be prevented, since a plurality of the rising portions formed around the periphery of the tab have anchoring effects to the sealing resin member. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a technique for improving the heat dissipation of a resin-sealed package. Type IC package).

[0002]

2. Description of the Related Art A surface mount type package IC is a semiconductor pellet (hereinafter referred to as a pellet) in which an integrated circuit including a semiconductor element is formed, a tab to which the pellet is adhered with silver paste, and each electrode of the pellet. A plurality of inner leads electrically connected to the pad via a wire, a plurality of outer leads connected to each inner lead, and a resin encapsulant in which a pellet, a tab, and an inner lead group are resin-encapsulated. Is equipped with. As a means for improving the heat dissipation performance of the surface mount type package of this IC, the main surface of the tab opposite to the pellet (hereinafter referred to as the lower surface).
It is generally considered that the resin is exposed from the lower surface of the resin sealing body.

As an example of describing a surface mount type package in which a tab is exposed on the lower surface of a resin sealing body, there is Japanese Patent Laid-Open No. 5-291459.

[0004]

However, in the surface mount type package in which the tab is exposed on the lower surface of the resin encapsulation body, if peeling or a gap occurs on the outer periphery of the tab on the lower surface of the resin encapsulation body, the pellet and the It has been clarified by the present inventor that peeling or cracking may occur in the adhesive layer with the tab, and thus the heat dissipation performance may be deteriorated.

An object of the present invention is to provide a semiconductor device capable of preventing the outer periphery of the tab on the lower surface of the resin encapsulant from being peeled off or from forming a gap.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0007]

The typical ones of the inventions disclosed in the present application will be outlined below.

That is, a semiconductor pellet, a tab to which the semiconductor pellet is bonded by an adhesive layer, a plurality of inner leads electrically connected to each electrode of the semiconductor pellet, and a plurality of inner leads are connected in series. In a semiconductor device including a plurality of outer leads and a resin encapsulation body in which a semiconductor pellet, a tab, and an inner lead group are resin-encapsulated, a main surface of the tab opposite to the semiconductor pellet is encapsulating the resin. It is exposed on the main surface of the body opposite to the semiconductor pellet, and a plurality of cut-and-raised parts anchored to the resin-sealed body are formed on the outer periphery of the tab alternately with non-cut-and-raised parts in the circumferential direction. It is characterized by

According to the above means, since the tab to which the semiconductor pellet is bonded by the adhesive layer is exposed on the main surface of the resin encapsulant, the heat dissipation performance of the semiconductor device can be improved. Moreover, since a plurality of cut-and-raised portions formed on the outer circumference of the tab are buried inside the resin sealing body to exert the anchoring effect, even if the tab is exposed from the resin sealing body, It can prevent peeling.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a semiconductor device according to an embodiment of the present invention, in which (a) is a front sectional view,
(B) is a partially cut bottom view. FIG. 2 and subsequent drawings are explanatory views showing the manufacturing method thereof.

In the present embodiment, as shown in FIG. 1, the semiconductor device according to the present invention includes a quat flat package (hereinafter referred to as QFP) 37 which is an example of a surface mount type package. It is configured as a semiconductor integrated circuit device 38. Q of a semiconductor integrated circuit device (hereinafter, referred to as QFP / IC) 38 provided with this QFP
The FP 37 is made of a resin having an insulating property and is formed into a substantially square flat plate shape. A plurality of outer leads 20 bent into a wing shape are provided. Inside the resin encapsulant 35, a semiconductor pellet (hereinafter referred to as a pellet) 32 in which an integrated circuit including a semiconductor element is formed, a tab 18 to which the pellet 32 is adhered by an adhesive layer 31, and a pellet 32 are provided.
A plurality of inner leads 19 electrically connected to the respective electrode pads 32 a of the above with the wires 33 are resin-sealed, and each inner lead 19 is integrally connected to each outer lead 20. . Also, the outer lead 20
The groups project from the four sides of the resin encapsulation body 35 at right angles in a horizontal plane and are bent in a gull wing shape, and are substantially aligned with the height position of the lower main surface of the resin encapsulation body 35. .

In this embodiment, the main surface of the tab 18 on the side opposite to the pellet 32 is the pellet 32 of the resin sealing body 35.
A plurality of cut-and-raised parts 21 which are exposed on the main surface on the opposite side and are buried in the resin encapsulant 35 are arranged on the outer periphery of the tab 18 in parallel with each other at intervals in the circumferential direction. It is cut and raised so as to face the radial direction of 18 and incline upward toward the outer end.

A QFP according to an embodiment of the present invention will be described below.
-Explain the method of manufacturing an IC. This description will clarify the details of the configuration of the QFP IC.

In this embodiment, the multiple lead frame 11 shown in FIG. 2 is used in the manufacturing method of the QFP / IC, and this multiple lead frame 11 is manufactured by the multiple lead frame molding process. Be prepared to be.
The multiple lead frame 11 is integrally formed by punching and pressing using a thin plate made of a spring material having a relatively large mechanical strength such as iron-nickel alloy or phosphor bronze. A plating process using silver (Ag) or the like is partially or entirely applied to the surface of the multiple lead frame 11 so as to appropriately perform the wire bonding described later (not shown). A plurality of unit lead frames 12 are arranged side by side in a row in the multiple lead frame 11. However, the description and illustration will be made for one unit.

The unit lead frame 12 has a positioning hole 13
a is provided with a pair of outer frames 13 that are opened, and both outer frames 1
The reference numerals 3 and 13 are arranged in parallel at a predetermined interval and extend in series. A pair of section frames 14 is provided between the unit lead frames 12 and 12 adjacent to each other.
The outer frames 13 and 13 and the section frames 14 and 14 are arranged integrally with each other in parallel with each other.
The unit lead frame 12 is formed in a substantially square frame body (frame) formed by.

In each unit lead frame 12, a dam suspension member 15 is provided at the connecting portion of the outer frame 13 and the section frame 14 so as to be disposed in a substantially right angle direction and integrally projected. The four dam members 16 are arranged so as to have a substantially square frame shape and are integrally suspended.

A tab suspension lead 17 is arranged at one end of each dam member 16 on the side of the section frame 14, and the tab suspension leads 17 are arranged at approximately 4
The tabs 18, which are integrally provided so as to face each other in the direction of 5 degrees and are formed in a substantially square flat plate shape at the tips of the tab suspension leads 17, are substantially concentric with the frame shape of the dam member 16 group. The tab suspension leads 17 are integrally arranged so as to be suspended by the tab suspension leads 17. Each tab suspension lead 17 is bent in the vicinity of the tab 18, and due to the bending of the tab suspension lead 17, the tab 18 is lowered from the surface of the lead group described later by the thickness of the pellet described later. There is so-called tab lowering.

On the inner side of each dam member 16, a plurality of inner leads 19 are arranged at equal intervals in the longitudinal direction and are integrally projected so as to be parallel to each other and orthogonal to the dam member 16. The front end portions of the inner leads 19 of the member 16 are laid so as to be aligned in a substantially straight line in the state of being close to the outer circumference of the tab 18. On the other hand, a plurality of outer leads 20 are integrally projectingly provided on the outer side of each dam member 16 so as to be continuous with each inner lead 19 in series, and the tips of the outer leads 20 of each dam member 16 are external. Frame 13
And section frame 14 respectively. Adjacent outer leads 20, 20 in each dam member 16
The intervening portions respectively form dams 16a that block the flow of the resin at the time of molding a resin encapsulating body, which will be described later.

In this embodiment, as shown in FIG. 1 and as shown in FIG. 4B, a plurality of cut-and-raised portions 21 and a plurality of cut-and-raised portions 21 are provided on the four sides of the tab 18. The non-cut-and-raised parts 22 are alternately arranged in the circumferential direction and formed, and the cut-and-raised parts 21 are formed in a substantially square shape and are inclined in the radial direction so that the outer end side rises. Each of the cut-and-raised parts 21 is formed by a cut-and-raised press work for leaving the non-cut-and-raised parts 22, 22 flat on both sides in the circumferential direction. Incidentally, in the cut-and-raised press working, a shearing work and a die bending work carried out by attaching a bending die to a press (press) are simultaneously carried out. The cut-and-raised press work of the cut-and-raised part 21 may be carried out simultaneously with the punching press work of the inner lead 19, or with the tab lowering press work of the tab 18, or in a separate process from them. You may.

The multiple lead frame 11 having the above-mentioned structure prepared in the multiple lead frame molding step is
In the pellet bonding process and the wire bonding process, the pellet bonding work and then the wire bonding work are performed. These bonding operations are sequentially performed for each unit lead frame by laterally pitching multiple lead frames. Tab 1 for these bonding operations
Since the cut-and-raised portion 21 formed in 8 is cut and raised on the upper surface side, it does not interfere with the feeding of the multiple lead frame 11.

First, a pellet 32 as a semiconductor integrated circuit structure in which an integrated circuit including a semiconductor element is formed by a pellet bonding operation in a so-called pre-process in the IC manufacturing process is shown in FIGS. 3 and 4. As shown in FIG.
8 is disposed at a substantially central portion and is bonded mechanically by an adhesive layer 31 formed between the tab 18 and the pellet 32. As a method for forming the adhesive layer 31, a bonding method using a silver paste adhesive layer is used.

Then, by wire bonding work,
As shown in FIGS. 3 and 4, the electrode pad 32a of the pellet 32 bonded onto the tab 18 is bonded.
And the inner lead 1 in each unit lead frame 12
The wire 33 is connected to the wire bonding device 9 such as an ultrasonic thermocompression bonding wire bonding device (not shown).
Is used, the both ends thereof are respectively bonded and bridged. As a result, the integrated circuit built in the pellet 32 is connected to the electrode pad 32a and the wire 3
3, the inner lead 19 and the outer lead 20 are electrically pulled out to the outside.

As described above, pellets and wires
In the bonded assembly 34, a resin sealing body for each unit lead frame is molded at the same time for each unit lead frame by using the transfer molding device 40 shown in FIG.

The transfer molding apparatus 40 shown in FIG.
Is provided with a pair of upper and lower molds 41 and 42 which are clamped to each other by a cylinder device (not shown). The upper mold cavity recess 43a is formed on the mating surface of the upper mold 41 and the lower mold 42. And a plurality of lower mold cavity recesses 43b cooperate with each other to form a plurality of cavities 43.

A pot 44 is opened on the mating surface of the upper die 41, and a cylinder device (not shown) is provided in the pot 44.
A plunger 45 that is advanced and retracted by is inserted so that a resin (hereinafter, referred to as a resin) as a molding material can be fed. Cull 46 is in pot 4 on the mating surface of lower mold 42.
4, the runners 47 are radially arranged so as to be connected to the culls 46, respectively. The other end of each runner 47 is connected to the lower cavity recess 43b, and a gate 48 is formed at that connection so that the resin can be injected into the cavity 43. Further, on the mating surface of the lower mold 42, a rectangular shape slightly larger than the outer shape of the multiple lead frame 11 is provided so that an escape recess 49 can escape the thickness of the lead frame, and a constant depth having a dimension substantially equal to the thickness thereof. It is buried in.

During transfer molding, the assembly 34 shown in FIGS. 3 and 4 has the multiple leadframes 11 housed in the recesses 49 recessed in the lower die 42, and the pellets in each unit leadframe 12 are pelletized. 32 are arranged and set so as to be housed in the respective cavities 43. Subsequently, the upper mold 41 and the lower mold 42 are clamped. In this state, the lower surface of the tab 18 is pressed against the upper surface of the lower mold cavity recess 43b.

Next, the resin 50 is fed from the pot 44 to the respective cavities 43 through the runner 47 and the gate 48 by the plunger 45 and press-fitted. The resin 50 press-fitted into the cavity 43 is
Since the resin 50 is filled without any gaps, the resin 50 does not have any gaps in the cut-and-raised portions 21 formed on the tab 18 and the lower space and the void 23 formed between the non-cut-and-raised portions 22 on both sides. Is filled.

After the resin is filled, the resin is thermoset and the resin encapsulant 35 is molded, so that the upper mold 41 and the lower mold 4 are formed.
The mold 2 is opened, and the group of resin sealing bodies 35 is released from the mold by ejector pins (not shown). In this way, as shown in FIG. 6, the assembly 36 in which the group of resin sealing bodies 35 is molded is detached from the transfer molding device 40.

As shown in FIG. 6, the resin sealing body 3
In the state where the lower surface of the tab 18 is exposed at the lower surface of the resin sealing body 35 inside the tab 5, the tab 18 and the pellet 3
2, the inner lead 19 and the wire 33 are resin-sealed. A plurality of cut-and-raised portions 21 cut and raised around the tab 18 are in a state of being embedded inside the resin sealing body 35, and the cut-and-raised portions 21 are anchored in the resin of the resin sealing body 35. It is in a state. The cut-and-raised portions 21 formed between the adjacent non-cut-and-raised portions 22, 22 are filled with the resin of the resin sealing body 35 in the cut-and-raised spaces 23, respectively. The cut-and-raised parts 22, 22 are sandwiched by the void-filling resin parts 24 on both sides.

The assembly 36, which is a semi-finished product in which the resin sealing body 35 is molded, is used to form the outer frame 13, the section frame 14 and the dam 16a in a lead cutting process (not shown).
Is cut off for each unit lead frame 12, and the outer lead 20 group is bent into a gull wing shape. As a result, the plurality of outer leads 20 are aligned in a row from each of the four side surfaces of the substantially square flat plate-shaped resin encapsulation body 35 and protruded to be bent into a gull wing shape, and the lower surface of the tab 18 is formed. Becomes a state in which the exposed QFP 37 is formed on the lower surface of the resin sealing body 35,
This means that the QFP / IC 38 having the configuration shown in FIG. 1 is manufactured.

QFP / IC manufactured as described above
38 is mounted on the printed wiring board 51 as shown by the imaginary line in FIG. That is, a plurality of lands 52 are arranged on the printed wiring board 51 so as to correspond to the respective outer leads 20 of the QFP / IC 38 to be mounted, and are formed in a rectangular thin plate shape. Similarly, a tab land 53 corresponding to the tab 18 exposed from the lower surface of the tab 35 is formed. When the outer leads 20 of the QFP / IC 38 are respectively brought into contact with the respective lands 52 and the tabs 18 are brought into contact with the tab lands 53, the QFP / IC 38 is subjected to the reflow soldering process.
Is mechanically and electrically connected by the soldering portion 54.

In the mounted state of the QFP / IC 38 on the printed wiring board 51, the heat generated by the pellet 32 is conducted to the tab 18 via the adhesive layer 31, and further the soldered portion from the tab 18 to the tab land 53 is formed. The heat is dissipated by being thermally conducted via 54. In this way, the heat generated by the pellet 32 is directly radiated to the printed wiring board 51 by heat conduction, so that the heat radiation efficiency becomes extremely good.

Next, the cut-and-raised portion 2 of the QFP / IC 38
The action of 1 will be described.

QFP manufactured in a semiconductor device manufacturing factory
-The IC38 is inspected before shipment. Environmental tests including temperature cycle tests and thermal shock tests are carried out as sampling inspections. In such environmental tests,
When thermal stress is applied to the QFP / IC according to the above configuration, stress is generated inside the resin encapsulant due to the difference in thermal expansion coefficient between the constituent materials of the pellet, the resin encapsulant, and the tab. Due to repeated stress due to such repeated thermal stress, peeling or a gap may occur on the lower surface of the resin sealing body 35 at the interface with the resin on the outer periphery of the tab 18.

In the unlikely event that peeling or a gap occurs on the lower surface of the resin encapsulation body 35 at the interface with the resin on the outer periphery of the tab 18, the moisture outside the resin encapsulation body 35 will pass through the gap and the pellet 32 and the tab. The adhesive layer 31 adhering 18 is reached and absorbed by the adhesive layer 31. Moisture absorbed by the adhesive layer 31 expands when the QFP / IC 38 is heated to cause a so-called steam explosion, so that peeling or cracking of the adhesive layer 31 may occur. Then, as described above, the heat generated by the pellet 32 is generated by the pellet 32 and the tab 1.
Since heat is radiated by heat conduction via the adhesive layer 31 with the adhesive layer 8, the peeling or cracking of the adhesive layer 31 hinders heat conduction of the heat generated by the pellet 32 to the tab 18, and the tab 18 is sealed with resin. QF exposed on the underside of body 35
The heat dissipation of the P / IC 38 is reduced.

However, the QFP / IC according to the present embodiment
In 38, since a plurality of cut-and-raised portions 21 are formed on the outer periphery of the tab 18, peeling or cracking of the adhesive layer 31 can be prevented,
The QFP in which the tab 18 is exposed on the lower surface of the resin sealing body 35.
It is possible to prevent the heat radiation performance of the IC 38 from deteriorating.

That is, even if repeated stress due to thermal stress such as an environmental test including a temperature cycle test and a thermal shock test is generated, a plurality of cut-and-raised parts 21 formed on the outer periphery of the tab 18 have the resin-sealed body 35. Since the resin is anchored in the resin of No. 1, no peeling or gap is formed at the interface between the tab 18 and the resin of the resin sealing body 35.

Therefore, so-called water vapor caused by moisture outside the resin encapsulant 35 entering the adhesive layer 31 through the peeling or gap formed between the interface between the tab 18 and the resin of the resin encapsulant 35. Since the peeling or cracking of the adhesive layer 31 due to the explosion is prevented in advance, it is possible to avoid the phenomenon of the deterioration of the heat radiation performance due to the increase of the thermal resistance in the adhesive layer 31.

According to the above embodiment, the following effects can be obtained.

1) Q where the tab is exposed on the lower surface of the resin encapsulant
By forming a plurality of cut-and-raised parts on the outer periphery of the tab of the FP / IC, it is possible to prevent peeling or a gap from being generated at the interface between the tab and the resin sealing body due to the anchoring effect of the cut-and-raised parts. Therefore, it is possible to prevent moisture outside the resin encapsulant from entering the adhesive layer.

2) By preventing peeling or a gap from being generated at the interface between the tab and the resin encapsulant due to the anchoring effect of the cut-and-raised part, moisture outside the resin encapsulant can prevent moisture from outside the tab and the resin encapsulant. Since it is possible to prevent peeling formed between the interface with the resin and entering into the adhesive layer through a gap, it is possible to prevent peeling or cracking of the adhesive layer due to so-called steam explosion caused by the entry. can do.

3) By preventing the peeling or cracking of the adhesive layer due to so-called steam explosion, it is possible to avoid the occurrence of the phenomenon of deterioration of the heat radiation performance due to the increase of the thermal resistance in the adhesive layer. The QFP / IC exposed on the lower surface of the resin encapsulant and having excellent heat dissipation performance can be provided to the market.

4) Since the cut-and-raised portion can be formed simultaneously with the tab when forming the multiple lead frame, it is possible to suppress a decrease in productivity.

FIG. 7 shows a second embodiment Q of the present invention.
The main part of FP * IC is shown, (a) is front sectional drawing, (b) is the perspective view which abbreviate | omitted the resin part which shows the outer peripheral part of a tab.

The present embodiment differs from the previous embodiments in that the cut-and-raised portions 21A are cut and raised in the circumferential direction of the tab 18 so as to be arranged in series with each other.

In this embodiment, since the cut-and-raised portion 21A is formed on the outer peripheral portion of the tab 18, the same operational effect as that of the above-described embodiment can be obtained.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above-mentioned embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the shape of the cut-and-raised portion is not limited to the rectangular wave shape, but may be a triangular shape, a U-shape, a polygonal shape, a semicircular shape, a combined shape of straight lines and curved lines, and the like. The shape does not matter.

In the above description, the invention made mainly by the present inventor is a field of application which is the background of the invention.
The case of application to an IC has been mainly described, but the present invention is not limited to this and can be applied to all semiconductor devices including a resin-sealed package. In particular, the present invention can be applied to a manufacturing technique of a semiconductor device having a thin surface-mounted resin-sealed package that requires a low thermal resistance, and an excellent effect can be obtained.

[0050]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

By forming a plurality of cut-and-raised parts on the outer periphery of the tab on the lower surface of the resin sealing body of the surface mount type resin sealing package in which the tab is exposed on the lower surface of the resin sealing body,
The effect of anchoring the cut-and-raised portion onto the resin of the resin encapsulant can prevent the interface between the tab and the resin of the resin encapsulant from peeling or a gap from occurring.

[Brief description of drawings]

FIG. 1 shows a QFP / IC which is an embodiment of the present invention, in which (a) is a front sectional view and (b) is a partially cut bottom view.

FIG. 2 shows a multiple lead frame used in the method for manufacturing the QFP / IC, in which (a) is a partially omitted plan view and (b) is a front sectional view.

FIG. 3 is a partially omitted plan view showing a state after a pellet and wire bonding step.

4A is a front sectional view taken along line IV-IV in FIG.
(B) is a perspective view showing an outer peripheral portion of the tab.

5A and 5B show a molding step of the resin encapsulation body, where FIG. 5A is a partially omitted vertical sectional view, and FIG. 5B is a sectional view taken along line bb of FIG.

FIG. 6 shows the assembly after molding the resin encapsulant,
(A) is a partially cutaway plan view and (b) is a front sectional view.

FIG. 7 is a QFP / IC according to a second embodiment of the present invention.
4A is a front cross-sectional view, and FIG. 6B is a perspective view in which a resin portion showing an outer peripheral portion of the tab is omitted.

[Explanation of symbols]

11 ... Multiple lead frame, 12 ... Unit lead frame, 13 ... Outer frame, 13a ... Positioning hole, 14 ... Section frame, 15 ... Dam suspension member, 16 ... Dam member, 16a ...
Dam, 17 ... Tab suspension lead, 18 ... Tab, 19 ... Inner lead, 20 ... Outer lead, 21, 21A ... Cut and raised part, 22 ... Non-cut and raised part, 23 ... Vacancy, 24 ... Vacancy filling resin part, 31 ... Adhesive layer, 32 ... Pellet, 32a
... Electrode pad, 33 ... Wire, 34 ... Assembly, 35 ... Resin encapsulant, 36 ... Assembly after resin encapsulation, 37 ... Q
FP (Surface mount type resin sealed package), 38 ... QFP
IC (semiconductor device provided with surface mount type resin sealing package), 40 ... Transfer molding device, 41 ... Upper mold, 42 ... Lower mold, 43 ... Cavity, 43a ... Upper mold cavity recess, 43b ... Bottom Mold cavity recess, 44
… Pot, 45… Plunger, 46… Cull, 47… Lanna, 48… Gate, 49… Escape recess, 50… Resin, 5
1 ... Printed wiring board, 52 ... Land, 53 ... Tab land, 54 ... Soldering part.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Shinya Koike             5-20-1 Kamimizuhonmachi, Kodaira-shi, Tokyo Stock             Ceremony Company within Hitachi Semiconductor Group (72) Inventor Kazuo Shimizu             5-20-1 Kamimizuhonmachi, Kodaira-shi, Tokyo Stock             Ceremony Company within Hitachi Semiconductor Group F-term (reference) 5F067 AA03 AA06 AA07 AB03 BD05                       BD08 BD10 BE05 BE07 CA03                       CA04 DA11

Claims (5)

[Claims] 1. A semiconductor pellet, a tab to which the semiconductor pellet is bonded by an adhesive layer, a plurality of inner leads electrically connected to each electrode of the semiconductor pellet, and a plurality of inner leads connected in series to each inner lead. In a semiconductor device including a plurality of outer leads and a resin encapsulation body in which a semiconductor pellet, a tab, and an inner lead group are resin-encapsulated, a main surface of the tab opposite to the semiconductor pellet is encapsulating the resin. It is exposed on the main surface of the body opposite to the semiconductor pellet, and a plurality of cut-and-raised parts anchored to the resin-sealed body are formed on the outer periphery of the tab alternately with non-cut-and-raised parts in the circumferential direction. A semiconductor device characterized in that. 2. The semiconductor device according to claim 1, wherein the cut-and-raised portions are cut and raised in a radial direction of the tab so that the cut-and-raised portions are arranged in parallel with each other. 3. The semiconductor device according to claim 1, wherein the cut-and-raised parts are cut-and-raised in the circumferential direction of the tab so as to be arranged in series with each other. 4. The cut-and-raised portion is formed by cut-and-raised press working.
The semiconductor device according to 2 or 3. 5. The semiconductor device according to claim 4, wherein the cut-and-raised part is formed by cut-and-raised press working simultaneously with punching press working of the tab.