JP2003217832A - Manufacturing method for organic electroluminescence element and organic electroluminescence display - Google Patents
Manufacturing method for organic electroluminescence element and organic electroluminescence displayInfo
- Publication number
- JP2003217832A JP2003217832A JP2002018266A JP2002018266A JP2003217832A JP 2003217832 A JP2003217832 A JP 2003217832A JP 2002018266 A JP2002018266 A JP 2002018266A JP 2002018266 A JP2002018266 A JP 2002018266A JP 2003217832 A JP2003217832 A JP 2003217832A
- Authority
- JP
- Japan
- Prior art keywords
- organic
- protective film
- organic electroluminescence
- resin
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005401 electroluminescence Methods 0.000 title claims abstract description 69
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 230000001681 protective effect Effects 0.000 claims abstract description 52
- 239000011347 resin Substances 0.000 claims abstract description 34
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 238000004544 sputter deposition Methods 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 10
- 239000010408 film Substances 0.000 claims description 61
- 239000000758 substrate Substances 0.000 claims description 32
- 239000012044 organic layer Substances 0.000 claims description 22
- 239000010409 thin film Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 19
- 229910010272 inorganic material Inorganic materials 0.000 claims description 9
- 239000011147 inorganic material Substances 0.000 claims description 9
- 238000000926 separation method Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 239000010410 layer Substances 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 10
- 239000001301 oxygen Substances 0.000 description 10
- 229910052760 oxygen Inorganic materials 0.000 description 10
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 238000005336 cracking Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229920001038 ethylene copolymer Polymers 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 2
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 238000005477 sputtering target Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229920001780 ECTFE Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical group FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 239000003230 hygroscopic agent Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 229910001512 metal fluoride Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- -1 polychlorotrifluoroethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、有機エレクトロル
ミネッセンス素子の製造方法、特に、該有機エレクトロ
ルミネッセンス素子を画素として配列した有機エレクト
ロルミネッセンスディスプレイに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an organic electroluminescence element, and more particularly to an organic electroluminescence display in which the organic electroluminescence elements are arranged as pixels.
【０００２】[0002]
【従来の技術】有機エレクトロルミネッセンス（ＥＬ：
Electro Luminescence）素子（有機電界発光素子）は、
低電圧で高輝度の発光が得られる為、様々なディスプレ
イ装置の表示素子やバックライトのような照明光源など
への利用が期待されている。2. Description of the Related Art Organic electroluminescence (EL:
Electro Luminescence element (organic electroluminescence element)
Since high-luminance light emission can be obtained at a low voltage, it is expected to be used as a display element of various display devices and an illumination light source such as a backlight.
【０００３】有機ＥＬ素子の基本的な構造は、図１に示
すように、ガラス又は樹脂の基板１上に、透明な陽極
２、有機物を材料とする複数の層（典型的には３乃至５
層）からなる有機層３、金属の陰極４を順次積層した構
造をしている。ここで、有機層３は、陽極２及び陰極４
の間に電圧を印加することにより発光する発光層を少な
くとも含んでいる。また有機エレクトロルミネッセンス
（ＥＬ）ディスプレイは、基板１上に陽極２、有機層
３、陰極４を積層した一又は複数のＥＬ素子を配列し、
各々の素子を画素として発光させることによって、画像
を形成する画像表示パネルである。As shown in FIG. 1, the basic structure of an organic EL element is such that a transparent anode 2 and a plurality of layers (typically 3 to 5) made of an organic material are provided on a glass or resin substrate 1.
Layer) and a metal cathode 4 are sequentially laminated. Here, the organic layer 3 includes an anode 2 and a cathode 4.
At least a light emitting layer that emits light by applying a voltage between the two is included. Further, an organic electroluminescence (EL) display has one or a plurality of EL elements in which an anode 2, an organic layer 3 and a cathode 4 are laminated on a substrate 1 and arranged.
The image display panel forms an image by emitting light from each element as a pixel.
【０００４】有機ＥＬディスプレイを初めとする各種表
示装置、又は照明光源として有機ＥＬ素子を使用する際
には、様々な環境下においてある一定期間以上の間、発
光特性を維持し得る事が要求される。図１に示した有機
ＥＬ層の構成要素において、有機層３及び陰極４は、通
常の環境下では時間の経過と共に性質が変化し、有機Ｅ
Ｌ素子の発光部面積の減少による輝度の低下や駆動電圧
の上昇が起こる。これらの有機ＥＬ素子における発光性
能の劣化は、大気中に含まれる酸素や水蒸気が有機層３
及び陰極４と反応することが原因であることは周知であ
る。When using an organic EL element as a display device such as an organic EL display or as an illuminating light source, it is required that the light emitting characteristics can be maintained for a certain period or longer under various environments. It In the constituent elements of the organic EL layer shown in FIG. 1, the organic layer 3 and the cathode 4 change their properties with the passage of time under a normal environment.
The decrease in the area of the light emitting portion of the L element causes a decrease in brightness and an increase in drive voltage. The deterioration of the light emission performance of these organic EL elements is caused by the oxygen and water vapor contained in the atmosphere being separated by the organic layer 3.
It is well known that it is caused by the reaction with the cathode 4.
【０００５】[0005]
【発明が解決しようとする課題】このような有機ＥＬ素
子の酸素や水蒸気による性能の劣化を抑制する方法とし
ては、まず基板１上に陽極２、有機層３、陰極４を順次
積層した後、これらの積層物を大気に晒すことなく、酸
素及び水蒸気量を極めて低くした環境下で、ガラスや金
属の封止カバーによる封止を行う方法がある。製造した
有機ＥＬ素子における有機層３及び陰極４と水蒸気との
反応を更に抑制する為に、封止カバーで気密封止した内
部に、シリカゲルやＢａＯ等の吸湿剤を設置することが
好ましい。しかしながら、この封止カバーで気密封止す
る方法は、封止カバーの剛性により有機ＥＬディスプレ
イなどの装置全体の剛性が高くなり、基板１に樹脂基板
などの可撓性基板を用いた可撓性の有機ＥＬ素子の製造
には適用することができない。As a method of suppressing the deterioration of the performance of such an organic EL element due to oxygen or water vapor, first, an anode 2, an organic layer 3, and a cathode 4 are sequentially laminated on a substrate 1, and then, There is a method of sealing with a glass or metal sealing cover in an environment in which the amounts of oxygen and water vapor are extremely low without exposing these laminates to the atmosphere. In order to further suppress the reaction between the organic layer 3 and the cathode 4 in the manufactured organic EL element and water vapor, it is preferable to install a hygroscopic agent such as silica gel or BaO inside the airtightly sealed interior with a sealing cover. However, in the method of hermetically sealing with this sealing cover, the rigidity of the entire device such as an organic EL display is increased due to the rigidity of the sealing cover, and a flexible substrate such as a resin substrate is used as the substrate 1. It cannot be applied to the production of the organic EL device.
【０００６】また、有機ＥＬ素子における上述のような
発光性能の劣化を抑制する別の方法として、酸化シリコ
ン（ＳｉＯｘ）などの金属酸化物や窒化シリコン（Ｓｉ
Ｎｘ）などの金属窒化物などの無機材料からなる膜を図
１に示すような保護膜５として成膜する方法がある。こ
こで、基板１に可撓性基板を使用した場合には、保護膜
５は有機ＥＬ素子の可撓性を保つ為に薄膜であることが
望ましい。しかしながら、可撓性の有機ＥＬ素子に保護
膜５として上述のような無機材料からなる無機薄膜を用
いた場合には、有機ＥＬ素子を折り曲げると、保護膜５
又は有機ＥＬ素子自体に亀裂や剥離を生じるという問題
がある。Further, as another method for suppressing the above-described deterioration of the light emitting performance in the organic EL element, a metal oxide such as silicon oxide (SiO x ) or silicon nitride (Si) is used.
There is a method of forming a film made of an inorganic material such as a metal nitride such as N x ) as the protective film 5 as shown in FIG. Here, when a flexible substrate is used as the substrate 1, the protective film 5 is preferably a thin film in order to keep the flexibility of the organic EL element. However, when an inorganic thin film made of the above-mentioned inorganic material is used as the protective film 5 in the flexible organic EL element, when the organic EL element is bent, the protective film 5 is formed.
Alternatively, there is a problem that the organic EL element itself is cracked or peeled.
【０００７】本発明は、上記問題に鑑みなされたもので
あり、可撓性基板を用いた場合にも変形によって亀裂や
剥離が生じにくい保護膜を有する有機エレクトロルミネ
ッセンス素子の製造方法、及び有機エレクトロルミネッ
センスディスプレイを提供することを目的とする。The present invention has been made in view of the above problems, and a method for manufacturing an organic electroluminescence device having a protective film that is unlikely to cause cracks or peeling due to deformation even when a flexible substrate is used, and an organic electroluminescence device. It is intended to provide a luminescence display.
【０００８】[0008]
【課題を解決するための手段】請求項１記載の発明は、
基板上に少なくとも陽極、陰極、前記陽極及び前記陰極
に電圧を印加することにより発光する有機層、並びに前
記陽極、前記陰極、及び前記有機層を保護する保護膜を
有する有機エレクトロルミネッセンス素子の製造方法に
おいて、前記保護膜は、樹脂を材料としたスパッタリン
グ法で成膜されることを特徴とする。The invention according to claim 1 is
At least an anode, a cathode, an organic layer that emits light by applying a voltage to the anode and the cathode, and a method for producing an organic electroluminescence device having a protective film that protects the anode, the cathode, and the organic layer on a substrate. In the above, the protective film is formed by a sputtering method using a resin material.
【０００９】請求項１記載の発明によれば、前記保護膜
は、樹脂を材料としたスパッタリング法で成膜されるの
で、可撓性基板を用いた場合にも変形によって亀裂や剥
離が生じにくい保護膜を有する有機エレクトロルミネッ
センス素子の製造方法を提供することができる。According to the first aspect of the present invention, since the protective film is formed by a sputtering method using a resin material, cracks or peeling are less likely to occur due to deformation even when a flexible substrate is used. It is possible to provide a method for manufacturing an organic electroluminescence device having a protective film.
【００１０】請求項２記載の発明は、請求項１記載の有
機エレクトロルミネッセンス素子の製造方法において、
前記樹脂は、フッ素樹脂であることを特徴とする。According to a second aspect of the present invention, there is provided a method for manufacturing an organic electroluminescence device according to the first aspect,
The resin is a fluororesin.
【００１１】請求項２記載の発明によれば、前記樹脂
は、フッ素樹脂であるので、可撓性基板を用いた場合に
も変形によって亀裂や剥離が、更に生じにくい保護膜を
有する有機エレクトロルミネッセンス素子の製造方法を
提供することができる。According to the second aspect of the present invention, since the resin is a fluororesin, organic electroluminescence having a protective film that is more resistant to cracking and peeling due to deformation even when a flexible substrate is used. A method for manufacturing an element can be provided.
【００１２】請求項３記載の発明は、請求項１又は２記
載の有機エレクトロルミネッセンス素子の製造方法にお
いて、前記保護膜を成膜する前及び／又は後に、無機物
を材料とする一又は複数の薄膜をスパッタリング法で成
膜することをさらに含むことを特徴とする。According to a third aspect of the present invention, in the method for manufacturing an organic electroluminescence element according to the first or second aspect, one or a plurality of thin films made of an inorganic material are used before and / or after forming the protective film. Is further formed by a sputtering method.
【００１３】請求項３記載の発明によれば、前記保護膜
を成膜する前及び／又は後に、無機物を材料とする一又
は複数の薄膜をスパッタリング法で成膜することをさら
に含むので、有機層及び陰極などに対する酸素や水蒸気
の遮断性がさらに向上した有機エレクトロルミネッセン
ス素子の製造方法を提供することができる。According to the third aspect of the present invention, the method further comprises forming one or a plurality of thin films made of an inorganic material by a sputtering method before and / or after forming the protective film. It is possible to provide a method for manufacturing an organic electroluminescence device in which the barrier properties against oxygen and water vapor with respect to layers and cathodes are further improved.
【００１４】請求項４記載の発明は、有機エレクトロル
ミネッセンスディスプレイにおいて、請求項１乃至３い
ずれか１項記載の有機エレクトロルミネッセンス素子の
製造方法で製造した一又は複数の有機エレクトロルミネ
ッセンス素子を、画素として配列したことを特徴とす
る。According to a fourth aspect of the invention, in an organic electroluminescence display, one or a plurality of organic electroluminescence elements produced by the method for producing an organic electroluminescence element according to any one of the first to third aspects are used as pixels. It is characterized by being arranged.
【００１５】請求項４記載の発明によれば、請求項１乃
至３いずれか１項記載の有機エレクトロルミネッセンス
素子の製造方法で製造した一又は複数の有機エレクトロ
ルミネッセンス素子を、画素として配列したもので、可
撓性基板を用いた場合にも変形によって亀裂や剥離が生
じにくい保護膜を有する有機エレクトロルミネッセンス
ディスプレイを提供することができる。According to a fourth aspect of the present invention, one or a plurality of organic electroluminescent elements produced by the method for producing an organic electroluminescent element according to any one of the first to third aspects are arranged as pixels. It is possible to provide an organic electroluminescence display having a protective film that is resistant to cracking or peeling due to deformation even when a flexible substrate is used.
【００１６】[0016]
【発明の実施の形態】次に、本発明の第一の実施形態に
ついて図１と共に説明する。本発明の有機エレクトロル
ミネッセンス素子は、図１に示すような構成を有する。
即ち、ガラス又は樹脂の基板１上に陽極２と、陽極２と
陰極４との間に電圧を印加した際に発光する発光層を少
なくとも含む有機層３と、陰極４とを順次積層し、基板
１上の陽極２、有機層３、陰極４の全体を覆い封止する
保護膜５とを有する。BEST MODE FOR CARRYING OUT THE INVENTION Next, a first embodiment of the present invention will be described with reference to FIG. The organic electroluminescence device of the present invention has a structure as shown in FIG.
That is, an anode 2, an organic layer 3 including at least a light emitting layer that emits light when a voltage is applied between the anode 2 and a cathode 4, and a cathode 4 are sequentially laminated on a glass or resin substrate 1 to form a substrate. 1 has an anode 2, an organic layer 3 and a cathode 4 which cover the entire surface and a protective film 5.
【００１７】本発明では、保護膜５の材料として樹脂を
用い、またこの樹脂からなる保護膜５の成膜方法として
スパッタリング法を用いることを特徴とする。The present invention is characterized in that a resin is used as a material for the protective film 5 and a sputtering method is used as a method for forming the protective film 5 made of this resin.
【００１８】保護膜５の材料である樹脂は、従来の無機
材料からなる保護膜とは異なり、有機ＥＬ素子の弾性的
な変形を可能とする。よって基板１に樹脂基板などの可
撓性基板を使用し、有機ＥＬ素子を折り曲げた場合で
も、折り曲げ時に加わる応力によって保護膜５及び有機
ＥＬ素子自体に亀裂や剥離等が生じにくい。加えて樹脂
の保護膜５を成膜することで、有機層３及び陰極４に対
する外界からの酸素や水蒸気の侵入を防止できるので、
有機ＥＬ素子の長寿命化が可能となる。The resin, which is the material of the protective film 5, enables elastic deformation of the organic EL element, unlike the conventional protective film made of an inorganic material. Therefore, even when a flexible substrate such as a resin substrate is used as the substrate 1 and the organic EL element is bent, the protective film 5 and the organic EL element itself are unlikely to be cracked or peeled due to the stress applied at the time of bending. In addition, by forming a protective film 5 of resin, it is possible to prevent oxygen and water vapor from entering the organic layer 3 and the cathode 4 from the outside.
The life of the organic EL element can be extended.
【００１９】また、保護膜５の成膜方法であるスパッタ
リング法は、フィルムの張り付けやスピンコーティング
法など他の方法よりも、容易に薄膜を成膜することがで
きる。また、スパッタリング法により成膜される膜は、
密着性が高く、付着強度が強い。これに対して、例えば
フィルムの張り付けは、フィルムの張り付け工程が余分
に必要となり、またフィルムは、貼り付ける面との間に
空気が入ることで密着性が悪く、フィルムが剥がれ易
い。さらにスパッタリング法は、一貫した真空工程で有
機ＥＬ素子を製造することができ、デバイスの信頼性、
及び生産性が向上する。In addition, the sputtering method, which is a method of forming the protective film 5, can form a thin film more easily than other methods such as film sticking and spin coating. The film formed by the sputtering method is
High adhesion and strong adhesive strength. On the other hand, for example, when attaching a film, an extra film attaching step is required, and the film has poor adhesion due to air entering between the surface to be attached and the film is easily peeled off. In addition, the sputtering method can produce organic EL devices in a consistent vacuum process, which improves device reliability,
And productivity is improved.
【００２０】以上のように、樹脂の保護膜５をスパッタ
リングで成膜することにより、亀裂や剥離などが生じに
くく、付着強度が高い薄膜の保護膜５を成膜することが
でき、特に可撓性を有する有機ＥＬ素子の製造に有効で
ある。As described above, by forming the resin protective film 5 by sputtering, it is possible to form a thin protective film 5 which is unlikely to be cracked or peeled off and which has high adhesive strength, and is particularly flexible. It is effective for manufacturing an organic EL device having properties.
【００２１】次に、本発明の第二の実施形態について図
１と共に説明する。本発明における第二の実施形態の有
機ＥＬ素子は、本発明の第一の実施形態において、保護
膜５の材料の樹脂が、フッ素樹脂であることを特徴とす
る。即ち、保護膜５としてフッ素樹脂の薄膜をスパッタ
リング法で成膜する。フッ素樹脂は、高耐熱性、耐薬品
性、低摩擦性、電気絶縁性、及び低吸水性等の優れた特
性を示す。有機ＥＬ素子の保護膜５の材料としてこのよ
うなフッ素樹脂を用いると、基板１に樹脂基板などの可
撓性基板を使用し、有機ＥＬ素子を折り曲げた場合で
も、保護膜５又は有機ＥＬ素子自体に亀裂及び剥離がさ
らに生じにくくなる。また本発明における第一の実施形
態で説明したように、スパッタリング法を用いているの
で、保護膜５を付着強度の強い薄膜として成膜できる。
加えてフッ素樹脂の保護膜５でも、有機層及び陰極に対
する外界からの酸素や水蒸気の侵入を防止でき、有機Ｅ
Ｌ素子の長寿命化が可能となる。Next, a second embodiment of the present invention will be described with reference to FIG. The organic EL element of the second embodiment of the present invention is characterized in that, in the first embodiment of the present invention, the resin of the material of the protective film 5 is a fluororesin. That is, a thin film of fluororesin is formed as the protective film 5 by the sputtering method. The fluororesin exhibits excellent properties such as high heat resistance, chemical resistance, low frictional property, electric insulation and low water absorption. When such a fluororesin is used as the material of the protective film 5 of the organic EL element, even when a flexible substrate such as a resin substrate is used as the substrate 1 and the organic EL element is bent, the protective film 5 or the organic EL element is bent. It becomes more difficult for cracks and peeling to occur on itself. Further, as described in the first embodiment of the present invention, since the sputtering method is used, the protective film 5 can be formed as a thin film having a high adhesion strength.
In addition, the protective film 5 made of fluororesin can also prevent oxygen and water vapor from entering the organic layer and the cathode from the outside.
It is possible to extend the life of the L element.
【００２２】スパッタリングのターゲットとして使用で
きるフッ素樹脂の材料は、四フッ化エチレン樹脂（ＰＴ
ＦＥ）、四フッ化エチレンペルフルオロアルキルビニル
エーテル共重合体（ＰＦＡ）、四フッ化エチレン・六フ
ッ化プロピレン共重合体（ＦＥＰ）、ポリクロロトリフ
ルオロエチレン（ＰＣＴＦＥ）、四フッ化エチレン・エ
チレン共重合体（ＥＴＦＥ）、クロロトリフルオロエチ
レン・エチレン共重合体（ＥＣＴＦＥ）、ポリフッ化ビ
ニリデン（ＰＶＤＦ）、ポリフッ化ビニル（ＰＶＦ）等
がある。A fluororesin material that can be used as a sputtering target is tetrafluoroethylene resin (PT).
FE), tetrafluoroethylene perfluoroalkyl vinyl ether copolymer (PFA), tetrafluoroethylene / hexafluoropropylene copolymer (FEP), polychlorotrifluoroethylene (PCTFE), tetrafluoroethylene / ethylene copolymer Examples include polymer (ETFE), chlorotrifluoroethylene / ethylene copolymer (ECTFE), polyvinylidene fluoride (PVDF), polyvinyl fluoride (PVF), and the like.
【００２３】次に、本発明の第三の実施形態について説
明する。本発明における第三の実施形態の有機ＥＬ素子
は、本発明の第一又は第二の実施形態において、樹脂、
特にフッ素樹脂の保護膜５に一又は複数の無機薄膜を積
層させたことを特徴とする。Next, a third embodiment of the present invention will be described. The organic EL element of the third embodiment of the present invention is a resin in the first or second embodiment of the present invention,
In particular, one or more inorganic thin films are laminated on the protective film 5 of fluororesin.
【００２４】本発明の第一、第二の実施形態において、
樹脂（特にフッ素樹脂）の保護膜５を成膜することによ
り、基板１に樹脂基板などの可撓性基板を使用し、有機
ＥＬ素子を折り曲げた場合でも、保護膜５又は有機ＥＬ
素子自体に亀裂や剥離が生じにくい有機ＥＬ素子を形成
することができる。またスパッタリング法の使用によ
り、保護膜５を付着強度の強い薄膜として成膜できる。In the first and second embodiments of the present invention,
Even if a flexible substrate such as a resin substrate is used as the substrate 1 and the organic EL element is bent by forming the protective film 5 of resin (particularly fluororesin), the protective film 5 or the organic EL can be formed.
It is possible to form an organic EL element in which cracking or peeling hardly occurs in the element itself. Further, by using the sputtering method, the protective film 5 can be formed as a thin film having high adhesion strength.
【００２５】ここで樹脂（特にフッ素樹脂）の保護膜５
をスパッタリング法で成膜することで、有機層３及び陰
極４に対する外界からの酸素や水蒸気の侵入を防止でき
るが、本実施形態においては有機層３や陰極４に対する
酸素や水蒸気の遮断性をさらに向上させる為に、樹脂
（特にフッ素樹脂）の保護膜５を成膜する前及び／又は
後に、スパッタリング法により一又は複数の無機薄膜を
積層させる。Here, a protective film 5 of resin (particularly fluororesin)
By forming a film by the sputtering method, it is possible to prevent oxygen and water vapor from entering the organic layer 3 and the cathode 4 from the outside, but in the present embodiment, the oxygen and water vapor blocking property for the organic layer 3 and the cathode 4 is further improved. In order to improve, one or a plurality of inorganic thin films are laminated by a sputtering method before and / or after forming the protective film 5 of resin (particularly fluororesin).
【００２６】従来の有機ＥＬ素子に見られるように、有
機層３や陰極４に対する酸素や水蒸気を遮断する為に、
一又は複数の無機薄膜のみを陽極２、有機層３、陰極４
からなる素子に積層させた場合には、基板１に樹脂基板
などの可撓性基板を使用し、有機ＥＬ素子を折り曲げた
場合、保護膜５又は有機ＥＬ素子自体に亀裂や剥離が生
じる。特に無機材料の膜は、その厚さが厚くなると割れ
やすい。As seen in the conventional organic EL device, in order to block oxygen and water vapor from the organic layer 3 and the cathode 4,
Only one or a plurality of inorganic thin films are used as the anode 2, the organic layer 3, and the cathode 4.
When a flexible substrate such as a resin substrate is used as the substrate 1 when the organic EL element is bent and the organic EL element is bent, cracks or peeling occur in the protective film 5 or the organic EL element itself. In particular, a film made of an inorganic material is likely to be broken when the thickness thereof is increased.
【００２７】従って、本発明では、比較的厚い樹脂（特
にフッ素樹脂）の保護膜５に対して、一又は複数の無機
薄膜を積層させ、比較的厚い樹脂の保護膜５で外的な変
形に対よる亀裂や剥離を防止すると共に、厚さの薄い無
機材料の膜を成膜して、亀裂や剥離の生じにくい有機Ｅ
Ｌ素子とし、有機層３や陰極４に対する酸素や水蒸気の
遮断性をさらに向上させる。Therefore, according to the present invention, one or a plurality of inorganic thin films are laminated on the protective film 5 made of a relatively thick resin (especially fluororesin), and the protective film 5 made of a relatively thick resin prevents external deformation. Along with the prevention of cracking and peeling, a thin film of an inorganic material is formed to prevent the occurrence of cracking and peeling.
As an L element, the ability to block oxygen and water vapor from the organic layer 3 and the cathode 4 is further improved.
【００２８】樹脂の保護膜５に一又は複数の無機薄膜を
積層させた構成において、層の数や積層の順序などは、
任意に決定することができる。例えば、陽極２、有機層
３、陰極４を樹脂の保護膜５で覆うことが困難である場
合には、まず無機薄膜で覆い、この無機薄膜に樹脂の保
護膜５を成膜してもよい。また、例えば、第一の無機薄
膜、樹脂の保護膜５、第二の無機薄膜のように、同種又
は異種の無機薄膜で樹脂の保護膜を挟んだ構成とするこ
ともできる。In the structure in which one or a plurality of inorganic thin films are laminated on the resin protective film 5, the number of layers and the order of lamination are as follows.
It can be arbitrarily determined. For example, when it is difficult to cover the anode 2, the organic layer 3 and the cathode 4 with the resin protective film 5, the resin protective film 5 may be formed by first covering with the inorganic thin film. . Further, the resin protective film may be sandwiched between the same or different inorganic thin films such as the first inorganic thin film, the resin protective film 5, and the second inorganic thin film.
【００２９】無機薄膜の材料としては、酸化シリコン
（ＳｉＯｘ）などの金属酸化物、窒化シリコン（ＳｉＮ
ｘ）などの金属窒化物、及びフッ化マグネシウム（Ｍｇ
Ｆ２）などの金属フッ化物を使用することができる。ま
た、陰極との電気的短絡を生じさせない構成（高い比抵
抗や膜厚等の条件）とすれば、チタン（Ｔｉ）、タンタ
ル（Ｔａ）、アルミニウム（Ａｌ）、クロム（Ｃｒ）等
の金属材料、又は合金、金属間化合物を使用しても良
い。Materials for the inorganic thin film include metal oxides such as silicon oxide (SiO x ), and silicon nitride (SiN).
x ) and other metal nitrides, and magnesium fluoride (Mg
Metal fluorides such as F 2 ) can be used. Further, as long as the structure does not cause an electrical short circuit with the cathode (conditions such as high specific resistance and film thickness), metallic materials such as titanium (Ti), tantalum (Ta), aluminum (Al), chromium (Cr), etc. Alternatively, an alloy or an intermetallic compound may be used.
【００３０】尚、これらの無機材料も樹脂の薄膜と同様
に、スパッタリング法で成膜することで、付着強度の強
い薄膜として成膜することができる。Similar to the resin thin film, these inorganic materials can be formed as a thin film having a high adhesion strength by forming them by the sputtering method.
【００３１】[0031]
【実施例】所定の形状にパターニングを行ったＩＴＯ
（酸化スズインジウム）の陽極を設けたガラス基板を、
中性洗剤、有機アルカリ洗浄液、ＩＰＡ（イソプロピル
アルコール）を用いて洗浄した。この陽極を設けたガラ
ス基板上に真空蒸着を用いて、有機層（正孔輸送層及び
発光層）を成膜し、さらにＬｉＦ層を設けたＡｌ層の陰
極を成膜した。次いでＲＦ（高周波）マグネトロンスパ
ッタ装置を用いて、フッ素樹脂からなる保護膜を成膜し
た。ここで、スパッタリングのターゲット材料として直
径８インチのＰＴＦＥ（四フッ化エチレン樹脂）を用
い、スパッタガスは、Ａｒガス（ガス流量５ｓｃｃｍ、
圧力０．２Ｐａ）を使用した。スパッタ装置の投入電力
を１．５４Ｗ／ｃｍ２として、成膜するフッ素樹脂の膜
厚が０．５μｍとなるように制御した。フッ素樹脂の保
護膜を成膜した後の有機ＥＬ素子の発光状態は良好であ
り、通常の環境（温度２２℃、湿度５０％Ｒ．Ｈ．）下
では、６０時間放置しても発光特性に変化は認められな
かった。[Example] ITO patterned into a predetermined shape
A glass substrate provided with an anode of (indium tin oxide),
It was washed with a neutral detergent, an organic alkali washing solution, and IPA (isopropyl alcohol). An organic layer (hole transport layer and light emitting layer) was formed on the glass substrate provided with this anode by vacuum vapor deposition, and an Al layer cathode provided with a LiF layer was further formed. Then, a protective film made of fluororesin was formed by using an RF (radio frequency) magnetron sputtering device. Here, PTFE (tetrafluoroethylene resin) having a diameter of 8 inches was used as a sputtering target material, and the sputtering gas was Ar gas (gas flow rate 5 sccm,
A pressure of 0.2 Pa) was used. The power supplied to the sputtering apparatus was set to 1.54 W / cm 2 and the film thickness of the fluororesin to be formed was controlled to 0.5 μm. The light emitting state of the organic EL element after forming the protective film of the fluororesin is good, and under normal environment (temperature 22 ° C., humidity 50% RH), the organic EL element has a light emitting property even if left for 60 hours. No change was observed.
【００３２】[0032]
【発明の効果】本発明によれば、可撓性基板を用いた場
合にも変形によって亀裂や剥離が生じにくい保護膜を有
する有機エレクトロルミネッセンス素子の製造方法、及
び有機エレクトロルミネッセンスディスプレイを提供す
ることができる。According to the present invention, it is possible to provide a method for producing an organic electroluminescence device having a protective film which is unlikely to be cracked or peeled by deformation even when a flexible substrate is used, and an organic electroluminescence display. You can
【００３３】[0033]
【図１】有機エレクトロルミネッセンス素子の基本的構
成を説明する図である。FIG. 1 is a diagram illustrating a basic configuration of an organic electroluminescence element.
１ 基板 ２ 陽極 ３ 有機層 ４ 陰極 ５ 保護膜 1 substrate 2 anode 3 organic layers 4 cathode 5 protective film
Claims (4)
極及び前記陰極に電圧を印加することにより発光する有
機層、並びに前記陽極、前記陰極、及び前記有機層を保
護する保護膜を有する有機エレクトロルミネッセンス素
子の製造方法において、 前記保護膜は、樹脂を材料としたスパッタリング法で成
膜されることを特徴とする有機エレクトロルミネッセン
ス素子の製造方法。1. An organic electro device having at least an anode, a cathode, an organic layer that emits light when a voltage is applied to the anode and the cathode, and a protective film that protects the anode, the cathode, and the organic layer on a substrate. In the method of manufacturing a luminescent element, the protective film is formed by a sputtering method using a resin as a material, and the method of manufacturing an organic electroluminescent element.
徴とする請求項１記載の有機エレクトロルミネッセンス
素子の製造方法。2. The method for manufacturing an organic electroluminescence device according to claim 1, wherein the resin is a fluororesin.
無機物を材料とする一又は複数の薄膜をスパッタリング
法で成膜することをさらに含むことを特徴とする請求項
１又は２記載の有機エレクトロルミネッセンス素子の製
造方法。3. Before and / or after forming the protective film,
The method for manufacturing an organic electroluminescence device according to claim 1, further comprising forming one or a plurality of thin films made of an inorganic material by a sputtering method.
レクトロルミネッセンス素子の製造方法で製造した一又
は複数の有機エレクトロルミネッセンス素子を、画素と
して配列したことを特徴とする有機エレクトロルミネッ
センスディスプレイ。4. An organic electroluminescence display characterized in that one or a plurality of organic electroluminescence elements produced by the method for producing an organic electroluminescence element according to any one of claims 1 to 3 are arranged as pixels.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002018266A JP2003217832A (en) | 2002-01-28 | 2002-01-28 | Manufacturing method for organic electroluminescence element and organic electroluminescence display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002018266A JP2003217832A (en) | 2002-01-28 | 2002-01-28 | Manufacturing method for organic electroluminescence element and organic electroluminescence display |
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| Publication Number | Publication Date |
|---|---|
| JP2003217832A true JP2003217832A (en) | 2003-07-31 |
Family
ID=27653681
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|---|---|---|---|
| JP2002018266A Pending JP2003217832A (en) | 2002-01-28 | 2002-01-28 | Manufacturing method for organic electroluminescence element and organic electroluminescence display |
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| Country | Link |
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| JP (1) | JP2003217832A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006222070A (en) * | 2005-01-17 | 2006-08-24 | Seiko Epson Corp | Light emitting device, manufacturing method thereof, and electronic equipment |
| US9105870B2 (en) | 2010-07-12 | 2015-08-11 | Samsung Display Co., Ltd. | Organic light-emitting apparatus and method of manufacturing the same |
| CN110741427A (en) * | 2017-11-10 | 2020-01-31 | 深圳市柔宇科技有限公司 | Manufacturing method of flexible panel, flexible panel and display device |
| JP2020109751A (en) * | 2018-12-31 | 2020-07-16 | エルジー ディスプレイ カンパニー リミテッド | Organic light emitting display device |
-
2002
- 2002-01-28 JP JP2002018266A patent/JP2003217832A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006222070A (en) * | 2005-01-17 | 2006-08-24 | Seiko Epson Corp | Light emitting device, manufacturing method thereof, and electronic equipment |
| JP4631683B2 (en) * | 2005-01-17 | 2011-02-16 | セイコーエプソン株式会社 | Light emitting device and electronic device |
| US9105870B2 (en) | 2010-07-12 | 2015-08-11 | Samsung Display Co., Ltd. | Organic light-emitting apparatus and method of manufacturing the same |
| CN110741427A (en) * | 2017-11-10 | 2020-01-31 | 深圳市柔宇科技有限公司 | Manufacturing method of flexible panel, flexible panel and display device |
| CN110741427B (en) * | 2017-11-10 | 2021-10-22 | 深圳市柔宇科技股份有限公司 | Manufacturing method of flexible panel, flexible panel and display device |
| JP2020109751A (en) * | 2018-12-31 | 2020-07-16 | エルジー ディスプレイ カンパニー リミテッド | Organic light emitting display device |
| US11594695B2 (en) | 2018-12-31 | 2023-02-28 | Lg Display Co., Ltd. | Organic light emitting display device |
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