JP2003209007A - Method for manufacturing multiple chip resistor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a fine multiple chip resistor which eliminates the need for the size classification of individual substrates as in the case of a conventional method and by which a manufacturing process can be simplified. <P>SOLUTION: Before forming edge electrodes 20, tapes 19 are put on parts positioned between a plurality of resistors on edges of strip substrates 11b in order to prevent the plurality of resistors of individual substrates from being conductive with each other. The edge electrodes 20 are formed on the edges of the strip substrates 11b with the tapes 19 put on them, and unwanted parts of the edge electrodes 20 are removed by peeling the tapes 19. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multiple chip resistor, and more particularly to a method for manufacturing a fine multiple chip resistor.

[0002]

2. Description of the Related Art As a conventional method of manufacturing a multiple chip resistor of this type, Japanese Patent Application No. 1-90570 (Japanese Utility Model Publication No. 3-3).
No. 0409) disclosed in the microfilm is known.

In the above-described method for manufacturing a multiple chip resistor, a vertical slit line for breaking a strip into which chips are connected side by side and a horizontal slit line for breaking from a strip to a chip are formed on both front and back surfaces. An insulating sheet-like substrate made of ceramic or the like having a substantially oval hole provided at the intersection of the vertical and horizontal slit lines and / or in the middle of the vertical slit line is used. First, break into strips along the vertical slit lines, and then form electrode terminals on the end faces of the strip along the vertical slit lines and on the upper and lower sides of the sides of the strip, and then on both ends of the pair of electrode terminals. A resistance film is printed and baked on the upper surface of the chip portion so that the portions overlap, then each resistance film is laser-trimmed, and then a glass coat covering the resistance film is applied.

[0004]

However, in the above-mentioned conventional method of manufacturing a multiple chip resistor, as a sheet-like substrate having an insulating property such as ceramics, a vertical slit wire is preliminarily set in the green sheet state. And a horizontal slit line are formed, and a substantially oval hole is formed at the intersection of the vertical and horizontal slit lines and / or the middle portion of the vertical slit line, and then a sheet-shaped substrate obtained by firing is used. The vertical slit lines, horizontal slit lines, and holes formed on this sheet-shaped substrate are caused by subtle compositional variations in the sheet-shaped substrate made of ceramic or the like, and subtle temperature variations during firing of the sheet-shaped substrate. Since dimensional variation will occur, when manufacturing fine multiple chip resistors, a sheet shape made of ceramic etc. It is necessary to classify the dimensions of the individual substrates in the substrate into very fine dimensional ranks in the vertical and horizontal directions, and to prepare the electrode terminals, resistive film, and glass-coated screen printing masks corresponding to each dimensional rank. In addition, it is necessary to replace the mask according to the dimensional rank of the individual substrate, and as a result, there is a problem that the manufacturing process becomes very complicated.

The present invention solves the above-mentioned conventional problems and eliminates the need for the conventional dimensional classification of individual substrates.
It is an object of the present invention to provide a method for manufacturing a fine multi-chip resistor chip that can simplify the manufacturing process.

[0006]

In order to achieve the above object, the present invention has the following constitution.

The invention according to claim 1 of the present invention comprises the step of forming a plurality of pairs of upper surface electrode layers on the upper surface of a sheet-like substrate, and a plurality of plurality of upper surface electrode layers electrically connected to the plurality of pairs of upper surface electrode layers. Forming a resistor on the upper surface of a sheet-like substrate; forming a plurality of protective layers so as to cover at least the plurality of resistors; dividing the sheet-like substrate into a plurality of strip-shaped substrates And a step of forming an end face electrode on an end face of the strip substrate, and a step of dividing the strip substrate into individual substrates having a plurality of resistors, and before forming the end face electrode, a plurality of A tape is attached to a portion of the end face of the strip-shaped substrate located between the resistors so that the resistors are not electrically connected to each other in the individual substrate having the resistors. Form the end face electrode on the end face of the substrate After that, the tape is peeled off to remove unnecessary portions of the end face electrodes. According to this manufacturing method, a step of dividing a sheet-shaped substrate into a plurality of strip-shaped substrates, and the strip-shaped substrate Since the individual substrate is obtained by the step of dividing the individual substrate having a plurality of resistors, the conventional dimensional classification of the individual substrate is not required, and thus Since the step of exchanging the mask according to the dimensional rank of the individual substrate can be eliminated, the manufacturing process can be simplified. Further, before forming the end face electrode, a tape is attached to a portion located between the plurality of resistors on the end face of the strip-shaped substrate so that the plurality of resistors in the individual substrate having the plurality of resistors are not electrically connected, Since the end face electrode is formed on the end face of the strip substrate with this tape attached, and then the unnecessary portion of the end face electrode is removed by peeling off the tape, the end face electrode of the multiple chip resistor is removed. When forming, the end face electrode can be formed with a very simple structure of sticking and peeling the tape, which makes it possible to provide the electrode at low cost and also by using the tape. This has an effect that it is possible to surely prevent conduction between the plurality of resistors on the substrate.

The invention according to claim 2 of the present invention is
In the step of dividing the sheet-shaped substrate into a plurality of strip-shaped substrates, the division is performed by the dicing method. According to this manufacturing method, the sheet-shaped substrate is divided into the strip-shaped substrates by the dicing method. Therefore, it is not necessary to perform dimensional classification of individual substrates as in the related art, which makes it possible to eliminate the complexity of the manufacturing process due to mask replacement as in the related art, and dicing is generally used for semiconductors and the like. It has an effect that it can be easily performed by using dicing equipment.

The invention according to claim 3 of the present invention is
As the tape, a tape that loses its tackiness when exposed to ultraviolet rays or heat is used. According to this manufacturing method, a tape that loses its tackiness when exposed to ultraviolet rays or heat is used. When the end face electrode is formed on the end face of the strip substrate and then the tape is peeled off, the tape can be easily peeled off.

The invention according to claim 4 of the present invention is
A plurality of strip-shaped substrates arranged in this state, and in this state, a portion located between the plurality of resistors on the end face of the plurality of strip-shaped substrates so that the plurality of resistors in the individual substrate having the plurality of resistors are not electrically connected to each other. A tape is attached to, and with the tape attached, end face electrodes are formed on the end faces of a plurality of strip-shaped substrates,
After that, by removing the tape, unnecessary portions of the end face electrodes of the plurality of strip-shaped substrates are removed.
According to this manufacturing method, when the end face electrodes of the multiple chip resistors are formed, since a plurality of strip-shaped substrates are arranged and the end face electrodes are formed in this state, the end faces of many multiple chip resistors are formed. The electrode has a function and effect that it can be simultaneously formed with a very simple structure of attaching and peeling a tape.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION A method of manufacturing a multiple chip resistor according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of a multiple chip resistor obtained by a method of manufacturing a multiple chip resistor according to an embodiment of the present invention, and FIG. 2 is a sectional view of the multiple chip resistor.

In FIG. 1 and FIG. 2, 1 is a baked 96
The substrate is singulated by dividing a sheet-shaped substrate made of alumina of% purity into a first divided portion and a second divided portion having an orthogonal relationship with the first divided portion. Reference numeral 2 denotes a plurality of pairs of upper surface electrode layers formed on the upper surface of the substrate 1 and having silver as a main component. Reference numeral 3 denotes a plurality of ruthenium oxide-based resistors formed on the upper surface of the substrate 1 so as to partially overlap the plurality of pairs of upper surface electrode layers 2, that is, to be electrically connected. Reference numeral 4 is a first protective layer composed mainly of glass and formed so as to completely cover the resistor 3. Reference numeral 5 denotes a trimming groove provided to correct the resistance value of the resistor 3 between the plurality of pairs of upper surface electrode layers 2. The trimming groove 5 is provided in the first protective layer 4 and the resistor 3. Reference numeral 6 denotes a plurality of pairs of adhesive layers made of a silver-based conductive resin provided so as to overlap a part of the plurality of pairs of upper electrode layers 2. The plurality of pairs of adhesive layers 6 and the plurality of pairs of upper electrode layers 2 are provided. Are configured to be flush with the edge of the substrate 1. Reference numeral 7 is a second protective layer containing resin as a main component, which is formed so as to cover the first protective layer 4 containing glass as a main component and to overlap a part of the adhesion layer 6. Reference numeral 8 denotes a plurality of pairs of end surface electrodes which are provided on the end edges of the substrate 1 and are electrically connected to the plurality of pairs of upper surface electrode layers 2. The end surface electrodes 8 are located on the end edge side of the substrate 1, The end face of the substrate 1, the end face of the upper surface electrode layer 2 and the end face of the adhesion layer 6 overlap with the end face of the upper surface of the adhesion layer 6 and the substrate 1
Is formed so as to cover the end of the back surface of the. Reference numeral 9 denotes a first plating film made of nickel plating formed so as to cover the end surface electrode 8 and the exposed upper surface of the adhesion layer 6. Reference numeral 10 is a second plating film formed of tin plating so as to cover the first plating film 9.

A manufacturing method of the multiple chip resistor having the above-described structure according to the embodiment of the present invention will be described with reference to the drawings.

FIG. 3 is a top perspective view showing a state in which an unnecessary region portion is formed at an end portion of the entire periphery of a sheet-like substrate used for manufacturing a multiple chip resistor according to one embodiment of the present invention, 4 (a) (b), 6 (a) (b), 8
(A), (b), FIG. 10 (a), (b) and FIG. 17 are top views showing a manufacturing process of a multiple chip resistor according to an embodiment of the present invention, FIGS. 7 (a) (b),
9 (a) (b), FIG. 11 (a) (b), FIG. 15 and FIG.
8, FIG. 19 and FIG. 20 are cross-sectional views showing a manufacturing process of a multiple chip resistor according to one embodiment of the present invention, and FIG. 12 shows a case of manufacturing the multiple chip resistor according to one embodiment of the present invention. FIG. 13, FIG. 14, and FIG. 16 are top perspective views of the sheet-shaped substrate showing a state when the sheet-shaped substrate used is separated into a plurality of strip-shaped substrates. FIG. 6 is a top perspective view showing a state when forming an end face electrode of the container.

First, as shown in FIGS. 3, 4 (a) and 5 (a), an insulating sheet-like substrate 11 having a thickness of 0.2 mm and made of fired 96% pure alumina is prepared. To do. In this case, as shown in FIG. 3, the sheet-shaped substrate 11 has an unnecessary area 11a which does not become a final product at the end of the entire circumference. The unnecessary area portion 11a is formed in a substantially square shape.

Next, as shown in FIGS. 3, 4 (b) and 5 (b), a plurality of pairs of upper surface electrode layers 12 containing silver as a main component are formed on the upper surface of the sheet-like substrate 11 by the screen printing method. Is formed, and the upper surface electrode layer 12 is formed into a stable film by baking with a baking profile having a peak temperature of 850 ° C.

Next, as shown in FIGS. 3, 6A, and 7A, a plurality of ruthenium oxide-based resistors 13 are formed by a screen printing method so as to extend over a plurality of pairs of upper electrode layers 12. Is formed and is fired with a firing profile having a peak temperature of 850 ° C., thereby forming the resistor 13 as a stable film.

Next, as shown in FIGS. 6 (b) and 7 (b), a first protective layer 14 mainly composed of a plurality of glasses is formed by screen printing so as to cover the plurality of resistors 13.
Are formed and baked in a baking profile having a peak temperature of 600 ° C., so that the first protective layer 14 containing glass as a main component is a stable film.

Next, as shown in FIGS. 8A and 9A, the laser trimming method is used to correct the resistance value of the resistor 13 between the plurality of pairs of upper electrode layers 12 to a constant value. Trimming is performed to form a plurality of trimming grooves 15.

Next, as shown in FIGS. 8 (b) and 9 (b), a plurality of silver-based conductive resins are formed by screen printing so as to overlap a part of the plurality of pairs of upper surface electrode layers 12. The pair of adhesive layers 16 are formed and cured with a curing profile having a peak temperature of 200 ° C. to form the adhesive layer 16 as a stable film.

Next, as shown in FIGS. 10 (a) and 11 (a), the first protective layer 14 mainly composed of a plurality of glasses arranged in the vertical direction on the drawing is covered and the adhesion layer 16 is formed. By forming a plurality of second protective layers 17 containing a resin as a main component by a screen printing method so as to overlap a part of the above, and curing with a curing profile of a peak temperature of 200 ° C.,
The second protective layer 17 is a stable film.

Next, FIG. 3, FIG. 10B, and FIG. 11B.
, A plurality of pairs of upper surface electrode layers 12 and adhesion layers 1 are formed.
A first dividing portion 18 for separating 6 into a plurality of strip-shaped substrates 11b is formed on the sheet-shaped substrate 11 by a dicing method.

Next, as shown in FIG. 12, a sheet-like substrate 1 having a first divided portion 18 formed by a dicing method.
1 on an unnecessary area partial pallet (not shown),
A part of the unnecessary area 11a is removed by cutting along the line 18a connecting both ends of the plurality of first divided portions 18 in 2 and separated into a plurality of strip-shaped substrates 11b. Is.

Next, as shown in FIG. 13, the strip-shaped substrate 1
A plurality of resistors 1b are arranged in the vertical direction or a plurality of resistors 1b are arranged in the horizontal direction (not shown), and in this state, a plurality of resistors (not shown) in the individual substrate having a plurality of resistors (not shown). A plurality of tapes 19 are respectively attached to the portions located between the plurality of resistors (not shown) on both end surfaces of the strip-shaped substrate 11b so that they are not electrically connected to each other. In this case, as the tape 19, a tape that loses its adhesiveness by irradiation with ultraviolet rays or heating is used.

Next, with the tape 19 adhered, as shown in FIGS. 14 and 15, at least the upper surface electrode layer 12 and the electrical conductivity are provided on the entire one end surface of the plurality of strip-shaped substrates 11b and the other end surface thereof. The epoxy resin paste material containing Ni and C as conductive components so as to be electrically connected by roller transfer and drying, and further, the peak temperature 165
The end face electrodes 20 are formed by curing with a curing profile of ° C.

Next, as shown in FIG. 16, the tape 1
The tape 19 is peeled off by irradiating 9 with ultraviolet rays or by heating the tape 19. As a result, a gap 21 is formed in the portion where the tape 19 was attached,
The end face electrodes 20 formed on the entire both end faces of the plurality of strip-shaped substrates 11b are separated into a plurality of pairs by forming the gap 21. By this separation into a plurality of pairs, an individual substrate (not shown) having a plurality of resistors (not shown)
The plurality of resistors (not shown) in the above are no longer electrically connected to each other.

Next, the strip-shaped substrate 11b is divided into four pieces as shown in FIGS. 17 and 18 by the second dividing portion 22 shown in FIG.
It is divided into individual substrate 11c having one resistor 13.
In this case, the plurality of second dividing portions 22 are formed by laser scribing. First, the dividing grooves are formed by laser, and then the dividing groove portions are divided by general dividing equipment. It is configured to be divided into strip-shaped substrates 11c. That is, this dividing method has an effect that it is not divided into pieces every time the second dividing portion 22 is formed, but is divided into two pieces. Note that the plurality of second divided portions 22 may be formed by a dicing method, and in this case, each of the second divided portions 22 is formed into individual pieces.

Finally, as shown in FIG. 19, the end face electrodes 20 on the individual substrate 11c are formed by electroplating.
A first plating film 23 made of nickel plating having a thickness of about 2 to 6 μm and having excellent solder diffusion prevention and heat resistance is formed so as to cover the exposed upper surface of the adhesion layer 16. After that, as shown in FIG. 20, a tin plating having a thickness of about 3 to 8 μm and having good solderability is further formed by using an electroplating method so as to cover the first plating film 23 made of nickel plating. Second plating film 24
To form.

The multiple chip resistor according to the embodiment of the present invention is manufactured by the above manufacturing steps.

Although the second plating film 24 is made of tin plating in the above manufacturing process, the present invention is not limited to this, and plating made of a tin alloy type material may be used. In the case of (1), stable soldering can be performed during reflow soldering.

In the above manufacturing process, the resistor 13
A first protective layer 14 mainly made of glass covering the resistor 13 and a second resin mainly made of resin covering the first protective layer 14 and covering the trimming groove 15. Since the protective layer 17 is composed of two layers,
The protective layer 14 can prevent the occurrence of cracks during laser trimming to reduce the current noise, and since the entire resistor 13 is covered with the second protective layer 17 containing the resin as a main component, it has excellent moisture resistance. It is possible to secure excellent resistance characteristics.

Further, in the multiple chip resistor manufactured by the above manufacturing process, the interval between the first divided portion 18 formed by the dicing method and the second divided portion 22 formed by the laser scribing is accurate (± 0. 0.005 mm
Since the thickness of the end face electrode 20, the first plating film 23, and the second plating film 24 is also accurate, the total length and width of the 4-unit multiple chip resistor as a product are
The length is exactly 0.6 mm and the width is 1.2 mm. Further, the pattern accuracy of the upper surface electrode layer 12 and the resistor 13 does not need to be classified into the dimensional rank of the individual substrate, and it is not necessary to consider the dimensional variation within the dimensional rank of the same individual substrate. The effective area of the resistor 13 can be made larger than that of the conventional product. That is, the resistor in the conventional product had a length of about 0.20 mm and a width of 0.19 mm, whereas the resistor 13 of the multiple chip resistor according to the embodiment of the present invention had a length of about 0.2.
The area is 5 mm × width 0.24 mm, which is about 1.6 times or more in area.

Further, in the above manufacturing process, the first dividing portion 18 is formed by using the dicing method, and
Since the sheet-shaped substrate 11 that does not require the dimensional classification of the individual substrate is used, the conventional dimensional classification of the individual substrate is not necessary, and thus the complexity of the process can be eliminated. Also, dicing can be easily performed using general dicing equipment for semiconductors and the like.

Further, in the above manufacturing process, a step of forming the first dividing portion 18 on the sheet-shaped substrate 11 to divide the sheet-shaped substrate 11 into a plurality of strip-shaped substrates 11b, and the strip-shaped substrate 11b. Since the second divided portion 22 is formed in the step of dividing the strip-shaped substrate 11b into the individual substrate 11c having the plurality of resistors 13, the individual substrate 11c is obtained. Since it is not necessary to classify the size of the individual substrate, it is possible to eliminate the conventional step of exchanging the mask according to the dimensional rank of the individual substrate, thereby simplifying the manufacturing process. Is something that can be done.

In the above manufacturing process, the end face electrode 2
Before forming 0, the plurality of resistor bodies 13 on the end face of the strip-shaped substrate 11b are arranged so that the plurality of resistor bodies 13 in the individual substrate 11c having the plurality of resistor bodies 13 are not electrically connected to each other.
Attach the tape 19 to the part located between the
The end surface electrode 20 is attached to the end surface of the strip-shaped substrate 11b with
Is formed, and then the tape 19 is peeled off to remove an unnecessary portion of the end face electrode 20, so that when the end face electrode 20 of the multiple chip resistor is formed,
The end face electrode 20 can be formed with a very simple structure of sticking and peeling the tape 19, which makes it possible to provide the electrode 20 at low cost, and by using the tape 19, the individual substrate It is possible to reliably prevent conduction between the plurality of resistors 13 in 11c.

In addition, in the above-described manufacturing process, the individual substrates 11c having the plurality of resistors 13 are positioned between the plurality of resistors 13 on the end face of the strip substrate 11b so that the plurality of resistors 13 are not electrically connected to each other. Since the tape 19 that loses its adhesiveness by being irradiated with ultraviolet rays or being heated is used as the tape 19 to be attached to the portion to be attached,
When the end face electrodes 20 are formed on the end faces of the plurality of strip-shaped substrates 11b in the state where the tapes are attached, and then the tape 19 is peeled off, the tape 19 can be easily peeled off.

Further, in the above manufacturing process, when the end face electrode 20 of the multiple chip resistor is formed, as shown in FIG. 13, a plurality of strip-shaped substrates 11b are arranged vertically or
Alternatively, a plurality of them are arranged side by side (not shown) in this state,
In order to prevent the plurality of resistors 13 in the individual substrate 11c having the plurality of resistors 13 from being electrically connected to each other, a tape 19 is attached to a portion located between the plurality of resistors 13 on the end surface of the plurality of strip substrates 11b, The end face electrodes 20 are formed on the end faces of the plurality of strip-shaped substrates 11b with the tape 19 attached, and then the tape 19 is peeled off to remove unnecessary portions of the end face electrodes 20 of the plurality of strip-shaped substrates 11b. Therefore, the end face electrodes 20 of a large number of multiple chip resistors can be formed at the same time with a very simple structure in which the tape 19 is attached and removed.

In the embodiment of the present invention described above, when the end face electrodes 20 are formed on the end faces of the plurality of strip-shaped substrates 11b, one of the strip-shaped substrates 11b is attached with the tape 19 attached. At least the upper surface electrode layer 12 is electrically connected to the entire end surface and the other end surface by N.
The end face electrodes 20 are formed by printing an epoxy resin paste material having i and C as conductive components by roller transfer, drying, and curing with a curing profile with a peak temperature of 165 ° C. However, the end face electrode 20 is not limited to this, and for example, an end face electrode made of a nickel chromium thin film by a sputtering method or an end face electrode made of a thin film such as a chromium-based, copper-based or nickel-based thin film by a sputtering method is used. , Multiple strip substrates 1
It may be formed on the entire one end face of 1b and the entire other end face.

Further, in the above-mentioned one embodiment of the present invention, the description has been given of the four-series multi-series chip resistor.
It is possible to easily manufacture a multi-chip resistor having two or more series by changing the setting location of the dividing section 22.

[0041]

As described above, according to the method of manufacturing a multiple chip resistor of the present invention, a step of dividing a sheet-shaped substrate into a plurality of strip-shaped substrates, and a step of dividing the strip-shaped substrate into a plurality of resistors. Since the individual substrate is obtained by the step of dividing into the individual substrate, the dimensional classification of the conventional individual substrate becomes unnecessary, and thus the conventional individual substrate can be divided into Since the step of exchanging the mask according to the dimension rank can be eliminated, the manufacturing process can be simplified. Further, before forming the end face electrode, a tape is attached to a portion located between the plurality of resistors on the end face of the strip-shaped substrate so that the plurality of resistors in the individual substrate having the plurality of resistors are not electrically connected, With this tape attached, form an end face electrode on the end face of the strip substrate, and then
Since the unnecessary portion of the end face electrode is removed by peeling off the tape, when forming the end face electrode of the multiple chip resistor, the end face electrode is formed with a very simple structure of sticking and peeling the tape. You can
With this, it is possible to provide the device at low cost, and it is possible to reliably prevent conduction between the plurality of resistors in the individual substrate by using the tape.

[Brief description of drawings]

FIG. 1 is a perspective view of a multiple chip resistor obtained by a method of manufacturing a multiple chip resistor according to an embodiment of the present invention.

FIG. 2 is a sectional view of the same multiple chip resistor.

FIG. 3 is a top perspective view showing a state in which an unnecessary region portion is formed at an end portion of the entire circumference of a sheet-shaped substrate used for manufacturing the same multiple chip resistor.

4A and 4B are top views showing manufacturing steps of the same multiple chip resistor.

5A and 5B are cross-sectional views showing a manufacturing process of the same multiple chip resistor.

6A and 6B are top views showing manufacturing steps of the same multiple chip resistor.

7A and 7B are cross-sectional views showing a manufacturing process of the same multiple chip resistor.

8A and 8B are top views showing a manufacturing process of the same multiple chip resistor.

9A and 9B are cross-sectional views showing a manufacturing process of the same multiple chip resistor.

10A and 10B are top views showing a manufacturing process of the same multiple chip resistor.

11A and 11B are cross-sectional views showing a manufacturing process of the same multiple chip resistor.

FIG. 12 is a top perspective view of the sheet-like substrate showing a state when the sheet-like substrate used for manufacturing the same multiple chip resistor is separated into a plurality of strip-shaped substrates.

FIG. 13 is a top perspective view showing a state when forming an end surface electrode of the multiple chip resistor.

FIG. 14 is a top perspective view showing a state when forming an end surface electrode of the multiple chip resistor.

FIG. 15 is a cross-sectional view showing the manufacturing process of the multiple chip resistor.

FIG. 16 is a top perspective view showing a state when forming an end surface electrode of the multiple chip resistor.

FIG. 17 is a top view showing a manufacturing process of the same multiple chip resistor.

FIG. 18 is a sectional view showing a manufacturing process of the multiple chip resistor.

FIG. 19 is a cross-sectional view showing a manufacturing process of the multiple chip resistor.

FIG. 20 is a cross-sectional view showing the manufacturing process of the multiple chip resistor.

[Explanation of symbols]

11 Sheet-shaped substrate 11b Strip substrate 11c piece-shaped substrate 12 Top electrode layer 13 resistor 14 First protective layer 17 Second protective layer 18 First division 19 tapes 20 Edge electrode 21 Gap 22 Second division

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Seiji Seiji             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Mitsunari Nakatani             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F-term (reference) 5E032 BA07 BB13 CA02 CC03 CC08                       CC14 CC16

Claims (4)

[Claims] 1. A step of forming a plurality of pairs of upper surface electrode layers on an upper surface of a sheet-shaped substrate, and a plurality of resistors electrically connected to the plurality of pairs of upper surface electrode layers on the upper surface of the sheet-shaped substrate. A step of forming, a step of forming a plurality of protective layers so as to cover at least the plurality of resistors, a step of dividing the sheet-like substrate into a plurality of strip-shaped substrates, and an end face at an end face of the strip-shaped substrate A step of forming electrodes, a step of dividing the strip substrate into individual substrates having a plurality of resistors, and before forming the end face electrodes, in a individual substrate having a plurality of resistors A tape is attached to a portion of the end face of the strip-shaped substrate located between the resistors so that the plurality of resistors are not electrically connected to each other, and an end face electrode is formed on the end face of the strip-shaped substrate in a state where the tape is attached, Then peel off the tape A method for manufacturing a multiple chip resistor in which an unnecessary portion of an end face electrode is removed by. 2. The method of manufacturing a multiple chip resistor according to claim 1, wherein in the step of dividing the sheet-shaped substrate into a plurality of strip-shaped substrates, the division is performed by a dicing method. 3. The method for producing a multiple chip resistor according to claim 1, wherein a tape that loses its adhesiveness upon irradiation with ultraviolet rays or heating is used as the tape. 4. A plurality of strip-shaped substrates are arranged, and in this state, a plurality of resistors on the end faces of the plurality of strip-shaped substrates are arranged so that the plurality of resistors in the individual substrate having the plurality of resistors are not electrically connected to each other. A tape is attached to a portion located between them, end face electrodes are formed on end faces of a plurality of strip-shaped substrates in a state where the tape is attached, and then the tape is peeled off to remove unnecessary portions of end face electrodes of the strip-shaped substrates. The method for manufacturing a multiple chip resistor according to claim 1, wherein the is removed.