JP2003198990A - Liquid crystal display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make electronic equipment with a camera at a low cost. <P>SOLUTION: A liquid crystal display comprises a liquid crystal display panel and the camera fitted to the liquid crystal display panel. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly to a technique effective when applied to a liquid crystal display device incorporated in an electronic device having a camera function.

[0002]

2. Description of the Related Art As a liquid crystal display device, for example, COG (C
A liquid crystal display device of a hip on glass type is known.
This COG liquid crystal display device is used for a display unit of an electronic device such as a mobile phone, a portable information processing terminal device, and a portable PC (Personal Computer).

A COG type liquid crystal display device is a semiconductor chip (driving chip) having a liquid crystal display panel in which liquid crystal is injected and sealed between a pair of transparent glass substrates and a drive circuit for driving and controlling the liquid crystal display panel. ) And is configured to have. The driving chip is mounted on one of the pair of glass substrates forming the liquid crystal display panel by a wire bonding method or a flip chip method. The wire bonding method refers to a mounting technique for electrically connecting an electrode arranged on the main surface of a semiconductor chip and a wiring arranged on the main surface of a substrate with a conductive wire. The flip-chip method is a state in which the main surface of the semiconductor chip and the main surface of the substrate face each other, and the protruding electrodes arranged on the main surface of the semiconductor chip and the wiring arranged on the main surface of the substrate are electrically connected. It refers to the mounting technology that connects them physically. In the flip-chip method, various methods have been proposed and put into practical use, but in the COG method liquid crystal display device, the ACF (Anisotropic Conductive) is mainly used.
Film) method is adopted. The ACF method is an anisotropic conductive resin film (AC
This is a method of mounting the semiconductor chip on the substrate by pressure bonding the semiconductor chip while heating with F) interposed. The anisotropic conductive resin film is a sheet-shaped processing of an insulating resin in which a large number of conductive particles are dispersed and mixed, and as the insulating resin, for example, an epoxy thermosetting resin is used. ing.

A COG type liquid crystal display device is described in, for example, Japanese Patent Application Laid-Open No. 6-118433 and Japanese Patent Application Laid-Open No. 63-191130. Also,
Regarding the ACF method, for example, JP-A-4-34504
No. 1 and Japanese Patent Application Laid-Open No. 5-175280.

[0005]

By the way, mobile phones and portable mobile PCs having a camera function have been commercialized. However, in the conventional camera-equipped mobile phone and portable mobile PC, a single camera is mechanically incorporated in the assembly process, so that the cost of incorporating the camera is increased. In addition, since a space for incorporating the camera is required, an electronic device with a camera such as a mobile phone or a portable mobile PC becomes large.

An object of the present invention is to provide a technique capable of reducing the cost of electronic equipment with a camera.

Another object of the present invention is to provide a technique capable of reducing the size of an electronic device with a camera.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0009]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows. (1) The liquid crystal display device of the present invention has a configuration including a liquid crystal display panel and a camera attached to the liquid crystal display panel. (2) The liquid crystal display device of the present invention includes a liquid crystal display panel in which liquid crystal is injected and sealed between a pair of transparent substrates, and a camera attached to the liquid crystal display panel.
The solid-state imaging device is mounted on one transparent substrate of the pair of transparent substrates, and the lens is disposed on the light-receiving surface of the solid-state imaging device. The solid-state imaging device is mounted with its light-receiving surface facing a first surface of the first and second surfaces of the one transparent substrate opposite to each other, and the lens is mounted on the one of the first and second transparent substrates. It is arranged so as to face the second surface of the transparent substrate.
The light-receiving surface of the solid-state image sensor is sealed with transparent resin. (3) The liquid crystal display device of the present invention has a liquid crystal display panel in which liquid crystal is injected and sealed between a pair of transparent substrates, and a camera attached to the liquid crystal display panel, and the solid-state imaging device has The back surface located on the opposite side of the light receiving surface is mounted in a state of facing the first surface of the first and second surfaces located on opposite sides of the one transparent substrate, and the lens is mounted on the one side. On the first surface side of the transparent substrate, it is arranged on the light receiving surface of the solid-state imaging device. (4) The electronic device with a camera of the present invention comprises the above-mentioned means (1).
The liquid crystal display device according to any one of to (3) is incorporated.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In all the drawings for explaining the embodiments of the invention, components having the same function are designated by the same reference numeral, and the repeated description thereof will be omitted.

(Embodiment 1) In this embodiment, an example in which the present invention is applied to an active matrix type liquid crystal display device using a thin film transistor (TFT) will be described.

FIG. 1 is a schematic perspective view showing a schematic structure of a liquid crystal display device according to a first embodiment of the present invention, FIG. 2 is a schematic side view of the liquid crystal display device of FIG. 1, and FIG. FIG. 4 is a bottom view of the liquid crystal display device of FIG. 4, and FIG. 4 is a schematic cross-sectional view of the liquid crystal display device of FIG.

As shown in FIGS. 1 to 3, the liquid crystal display device 1 of this embodiment has a structure including a liquid crystal display panel 2, a camera 5, a flexible printed wiring board 11, semiconductor chips 12 and 13, and the like. There is.

In the liquid crystal display panel 2, the transparent substrate 3 and the transparent substrate 4 are adhered and fixed to each other via a sealing material, and liquid crystal is provided in the regions defined by the transparent substrate 3, the transparent substrate 4 and the sealing material. It has an injection-sealed configuration. The transparent substrates 3 and 4 have a first surface and a second surface opposite to each other, and are bonded and fixed in a state where the respective first surfaces face each other. The transparent substrates 3 and 4 are formed in a rectangular plane, and in this embodiment, the transparent substrate 3 has a larger plane size than the transparent substrate 4. Transparent substrates 3 and 4
Is formed of, for example, a glass material.

The liquid crystal display panel 2 has a display area in which a plurality of pixels are arranged, and each pixel has two adjacent scanning signal lines (gate signal lines or horizontal signal lines) and two adjacent video signals. It is arranged in a crossing region with a line (drain signal line or vertical signal line) (in a region surrounded by four signal lines). Each pixel includes a thin film transistor, a transparent pixel electrode and a storage capacitor element. For example, the scanning signal lines extend in the X direction and are arranged in the Y direction orthogonal to the X direction.
The video signal lines extend, for example, in the Y direction, and a plurality of video signal lines are arranged in the X direction.

Within the region defined by the sealing material, a thin film transistor, a transparent pixel electrode, etc. are formed on the first main surface of the transparent substrate 4, and a color filter and a light shield are formed on the first main surface of the transparent substrate 3. A black matrix pattern for use is formed. That is, the liquid crystal display panel 2 is configured to use the second surface of the transparent substrate 3 as a display surface.

The camera 5 is attached to the liquid crystal display panel 2. In the present embodiment, the camera 5 is attached to one transparent substrate 3 of the pair of transparent substrates forming the liquid crystal display panel 2. As shown in FIG. 4, the camera 5 has a configuration including a lens housing 6, an image forming lens 7, a filter 8, a solid-state image sensor 9, and the like.

The lens housing 6 has a ceiling portion on one end side,
It is configured in a tubular shape in which the other end side opposite to the one end side is opened. A window is provided in the ceiling portion on one end side of the lens housing 6, and the lens 7 is fixed to the ceiling portion of the lens housing 6 so as to close the window. A filter 8 fixed to the lens housing 6 is arranged between one end side and the other end side of the lens housing 6.

The solid-state image pickup element 9 has a light receiving surface 9X and a back surface 9Y which are located on opposite sides of each other.
A photoelectric conversion unit is arranged in the central region of the light receiving surface 9X, and a plurality of photodiodes for photoelectric conversion are arranged in this photoelectric conversion unit. A plurality of electrode pads are arranged in the peripheral area surrounding the central area of the light receiving surface 9X, and the projecting electrodes 10 are provided on the respective electrode pads. Here, the solid-state imaging device is a solid-state imaging device in which photoelectric conversion-accumulation-scanning (signal reading) is made into a semiconductor, and a photodiode for photoelectric conversion is mainly a MOSFET (a type of insulated gate field effect transistor). Metal Oxide Sem
It can be roughly classified into a MOS type integrated with an insulator Field Effect Transistor) and a CCD type integrated with a CCD (Charge Coupled Device). In this embodiment, CC
A D-type solid-state image sensor is used.

The solid-state image sensor 9 is mounted on the liquid crystal panel 2 outside the region defined by the sealing material of the liquid crystal display panel 2. In the present embodiment, the solid-state image sensor 9 is
The light receiving surface 9X is mounted on the first surface of the one transparent substrate 3 in a state of facing the first surface of the one transparent substrate 3. That is, the solid-state image sensor 9 of this embodiment is mounted by the flip chip method.

The protruding electrodes 10 are made of, for example, gold (A
The stud bump whose main component is u) is used. This stud bump is formed by melting the tip of an Au wire to form a ball portion, then thermocompression-bonding the ball portion to an electrode pad while applying ultrasonic vibration, and then cutting and separating the ball portion from the Au wire. It is formed.

The plurality of protruding electrodes 10 are electrically and mechanically connected to the plurality of wirings arranged on the first surface of the transparent substrate 3 corresponding to the plurality of protruding electrodes 10. . In this embodiment, since the stud bump made of Au is used as the protruding electrode 10, the protruding electrode 10 and the wiring of the transparent substrate 3 are connected to each other, for example, by using an adhesive at the connecting portion of the wiring of the transparent substrate 3 as an adhesive. A method in which a solder paste material is applied and the solder paste material is melted and connected is used.

A transparent resin 14 is provided between the first surface of the transparent substrate 3 and the light receiving surface 9X of the solid-state image pickup device 9,
The transparent resin 14 allows the light-receiving surface 5X of the solid-state image sensor 9
Are sealed. As the transparent resin 14, for example, an epoxy thermosetting resin is used. The transparent resin 14 is
After mounting the solid-state imaging device 9 on the transparent substrate 3 by the flip chip method, a liquid thermosetting transparent resin is filled, and then,
It is formed by applying heat treatment to cure the liquid thermosetting transparent resin.

The lens housing 6 has a transparent substrate 3 on the other end side.
Is bonded and fixed to the second surface by an adhesive 15.
In the lens housing 6, the lens 7 has a light receiving surface 9 of the solid-state imaging device 9.
It is adhered and fixed to the second surface of the transparent substrate 3 in a state of facing X. That is, the lens 7 is arranged on the light-receiving surface 9X of the solid-state image sensor 9, and the transparent resin 14 is provided between the light-receiving surface 9X of the solid-state image sensor 9 and the lens 7 from the light-receiving surface 9X side of the solid-state image sensor 9. The transparent substrate 3 and the filter 8 are sequentially arranged.

As shown in FIG. 3, the semiconductor chips 12 and 13 are located outside the region defined by the encapsulating material of the liquid crystal display panel 2 and are one of the pair of transparent substrates (3, 4). Mounted on the first side of the. Semiconductor chip 1
2 and 13 are configured to have a circuit formation surface (main surface) and a back surface located on opposite sides of each other. A driving circuit for driving and controlling the liquid crystal display panel and a plurality of electrode pads are arranged on the circuit forming surface of the semiconductor chip 12, and a driving circuit and a plurality of electrodes for driving and controlling the solid-state imaging device 9 are arranged on the circuit forming surface of the semiconductor chip 13. Pads are placed. A protruding electrode is provided on each electrode pad of the semiconductor chips 12 and 13. As the protruding electrodes of the semiconductor chips 12 and 13, the same stud bumps as the protruding electrodes 10 of the solid-state imaging device 9 are used.

The semiconductor chips 12 and 13 are mounted on the first surface of the transparent substrate 3 with their circuit forming surfaces facing the first surface of the transparent substrate 3. Semiconductor chip 12
An anisotropic conductive resin, for example, is interposed as an adhesive resin between the circuit forming surface of each of the wirings 13 and 13 and the first surface of the transparent substrate 3, and the semiconductor chips 12 and 13 are transparent by the anisotropic conductive resin. It is adhesively fixed to the substrate 3. As the anisotropic conductive resin, for example, an epoxy thermosetting resin in which a large number of conductive particles are mixed is used.

In the semiconductor chips 12 and 13, the plurality of protruding electrodes are electrically and mechanically connected to the plurality of wirings arranged on the first surface of the transparent substrate 3 corresponding to the plurality of protruding electrodes. It is connected to the. In this embodiment,
The semiconductor chips 12 and 13 are mounted by the ACF method using an anisotropic conductive resin film.

The flexible printed wiring board 11 has one end side and the other end side opposite to each other, and further has a plurality of wires extending from one end side to the other end side. . As shown in FIGS. 2 and 3, one end of the flexible printed wiring board 11 is bonded and fixed to the first surface of the transparent substrate 3 outside the area defined by the sealing material of the liquid crystal display panel 2.

One end side of each of the plurality of wirings of the flexible printed wiring board 11 is electrically and mechanically connected to the plurality of wirings arranged on the first surface of the transparent substrate 3 corresponding to the plurality of wirings. The other end side of each of the plurality of wirings of the flexible printed wiring board 11 is connected to a wiring of a mounting board on which a central processing unit (CPU) or the like is mounted.

As shown in FIG. 4, the solid-state image sensor 9 is mounted on the first surface of the transparent substrate 3 with its light-receiving surface 9X facing the first surface of the transparent substrate 3, and the solid-state image sensor 9 receives light. The surface 9X is sealed by the transparent resin 14 filled between the light receiving surface 9X and the first surface of the transparent substrate 3, and the lens 7 and the filter 8 are transparent in a state of facing the light receiving surface 9X of the solid-state image sensor 9. It is arranged on the second surface of the substrate 3 opposite to the first surface. The light condensed by the lens 7 passes through the filter 8, the transparent substrate 3 and the transparent resin 14, and reaches the light receiving surface 9X of the solid-state image sensor 9. The light that has reached the light receiving surface 9X of the solid-state imaging device 9 is converted into an electric signal by the plurality of photoelectric conversion photodiodes arranged in the photoelectric conversion section of the light receiving surface 9X. Therefore, with such a configuration, the liquid crystal display device 1 with a camera can be provided.

FIG. 5 is a schematic perspective view of a camera-equipped mobile phone incorporating the liquid crystal display device of this embodiment, and FIG. 6 is a schematic development view of the camera-equipped mobile phone of FIG.

As shown in FIGS. 5 and 6, the camera-equipped mobile phone 20 has a housing 21 composed of a front housing 22a and a rear housing 22b. Inside the housing 21, a liquid crystal display device is provided. 1 and the mounting substrate 25 are incorporated. A plurality of discrete components (individual components) including a central processing unit are mounted on the mounting board 25.

The front case 22a is provided with a window 23 for exposing the display surface of the liquid crystal display device 1 to the outside, and a window 24 for exposing the lens 7 of the camera 5 to the outside. . An antenna 26 is provided on the rear housing 22b. The other end sides of the plurality of wirings of the flexible printed wiring board 11 are electrically connected to the plurality of wirings arranged on the mounting substrate 25 corresponding to the other end sides of the plurality of wirings, respectively. .

The camera 5 is incorporated in the liquid crystal display device 1. Therefore, in the process of assembling the camera-equipped mobile phone 20, the camera 5 is also incorporated by incorporating the liquid crystal display device 1 inside the housing 21, so that the camera is incorporated as compared with the case where a single camera is incorporated as in the conventional case. The cost for can be omitted. As a result, the cost of the mobile phone with a camera can be reduced.

Further, the space for incorporating the camera can be reduced as compared with the case where a single camera is incorporated as in the conventional case. As a result, the camera-equipped mobile phone can be downsized.

(Embodiment 2) FIG. 7 is a schematic sectional view of a liquid crystal display device according to Embodiment 2 of the present invention.

As shown in FIG. 7, the liquid crystal display device 30 of the present embodiment has basically the same configuration as the liquid crystal display device of the first embodiment described above, except for the following configuration.

That is, in the liquid crystal panel 2, the transparent substrate 4 has a larger plane size than the transparent substrate 3. Further, the solid-state imaging device 9 is located outside the region defined by the sealing material of the liquid crystal display panel 2 with the back surface 9Y facing the first surface of the other transparent substrate 4 and the first surface of the other transparent substrate 4. Has been implemented on the surface. The electrical connection between the electrode pad of the solid-state image sensor 9 and the wiring of the transparent substrate 4 is made via the bonding wire 31. The bonding wire 31 is sealed with resin 32. Resin 32
Is provided so as not to seal the photoelectric conversion portion of the light receiving surface 9X of the solid-state image sensor 9. The solid-state image sensor 9 is arranged in the lens housing 6.

The solid-state image sensor 9 is mounted on the first surface of the transparent substrate 4 with the back surface 9Y facing the first surface of the transparent substrate 4, and the lens 7 and the filter 8 are mounted on the solid-state image sensor 9.
It is arranged on the second surface of the transparent substrate 3 opposite to the first surface in a state of facing the light receiving surface 9X. The light condensed by the lens 7 passes through the filter 8 and reaches the light receiving surface 9X of the solid-state image sensor 9. The light that has reached the light receiving surface 9X of the solid-state imaging device 9 is converted into an electric signal by the plurality of photoelectric conversion photodiodes arranged in the photoelectric conversion section of the light receiving surface 9X. Therefore, with this configuration,
It is possible to provide the liquid crystal display device 30 with a camera.

Further, since the light transmitted through the filter 8 reaches the light receiving surface 9X of the solid-state image pickup element 9 directly, the sensitivity of the camera 5 is improved as compared with the first embodiment.

The lens housing 6 is composed of the liquid crystal display panel 2
Outside the region defined by the encapsulant, the other end side is adhesively fixed to the first surface of the other transparent substrate 4,
The thickness of the transparent substrate 3 can partially offset the height of the lens housing 6. As a result, the height of the camera 5 protruding from the display surface of the liquid crystal display panel 2 can be reduced, so that the liquid crystal display device with a camera can be thinned.

In the above-described embodiment, an example in which a transparent substrate made of a glass material is used as the transparent substrate forming the liquid crystal display panel has been described, but the transparent substrate may be made of resin.

As described above, the invention made by the present inventor is
Although the specific description has been given based on the above-described embodiment, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications can be made without departing from the scope of the invention.

For example, the present invention can be applied to a liquid crystal display device incorporated in an electronic device with a camera such as a mobile PC or a videophone.

[0045]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

According to the present invention, it is possible to reduce the cost of electronic equipment with a camera.

According to the present invention, it is possible to reduce the size of the electronic device with a camera.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing a schematic configuration of a liquid crystal display device that is Embodiment 1 of the present invention.

FIG. 2 is a schematic side view of the liquid crystal display device of FIG.

FIG. 3 is a bottom view of the liquid crystal display device of FIG.

FIG. 4 is a schematic cross-sectional view of the liquid crystal display device of FIG.

FIG. 5 is a schematic perspective view of a mobile phone incorporating the liquid crystal display device of FIG.

FIG. 6 is a schematic development view of the mobile phone of FIG.

FIG. 7 is a schematic cross-sectional view showing a schematic configuration of a liquid crystal display device which is Embodiment 2 of the present invention.

[Explanation of symbols]

1, 30 ... Liquid crystal display device 2 ... Liquid crystal display panel 3, 4 ... Transparent substrate 5 ... Camera 6 ... Lens housing 7 ... Lens 8 ... Filter 9 ... Solid-state image sensor 10 ... Protruding electrode 11 ... Flexible printed wiring board 12, 13 ... Semiconductor chip 14 ... Transparent resin 20 ... Mobile phone

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H04N 5/64 511 H04N 5/64 511F F term (reference) 2H088 EA02 EA25 HA01 HA05 HA06 MA16 MA18 5C022 AA13 AC01 AC54 AC70 AC78 CA00 5C058 AA06 AB06 BA35 5C094 AA15 BA43 HA10 5G435 AA18 BB12 LL14

Claims (6)

[Claims] 1. A liquid crystal display device comprising a liquid crystal display panel and a camera attached to the liquid crystal display panel. 2. The liquid crystal display device according to claim 1, wherein the liquid crystal display panel has a configuration in which liquid crystal is injected and sealed between a pair of transparent substrates, and the camera has the pair of transparent substrates. A liquid crystal display device having a solid-state image sensor mounted on one of the transparent substrates, and a lens disposed on a light-receiving surface of the solid-state image sensor. 3. The liquid crystal display device according to claim 2, wherein the light receiving surface of the solid-state imaging device is the first of the first and second surfaces of the one transparent substrate located on opposite sides of each other. Is mounted so as to face the surface of the liquid crystal display device, and the lens is arranged so as to face the second surface of the one transparent substrate. 4. The liquid crystal display device according to claim 3, wherein the light-receiving surface of the solid-state image pickup element is sealed with a transparent resin. 5. The liquid crystal display device according to claim 2, wherein in the solid-state imaging device, a back surface located opposite to a light receiving surface of the solid-state imaging element is located opposite to each other of the one transparent substrate.
And the second surface is mounted so as to face the first surface, and the lens is disposed on the light receiving surface of the solid-state image sensor on the first surface side of the one transparent substrate. Liquid crystal display device characterized by. 6. An electronic device with a camera, in which the liquid crystal display device according to claim 1 is incorporated.