JP2003198114A - Spherical body pasting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a spherical body pasting apparatus capable of pasting a spherical body such as a solder ball to a spherical body pasting place of a target work one by one without fail. <P>SOLUTION: A spherical body pasting apparatus 10 comprises a stage 16 for supporting a target work, a tray 22 for storing spherical bodies, a nozzle 26 for suctioning the spherical bodies stored in the tray 22 and pasting the suctioned spherical bodies to a target work, and a control section for matching the position of the nozzle 26 with that of the spherical body pasting place of the target work to paste them. A recess 26c is provided to the tip of the nozzle 26, which has a diameter slightly larger than that of the spherical body and a depth slightly shallower than the diameter of the spherical body. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for attaching a spherical body such as a solder ball to a work piece such as a substrate for mounting a BGA, a CSP device and the like.
The present invention relates to a spherical body sticking apparatus capable of always sticking spherical bodies such as solder balls one by one and sticking them to a workpiece.

[0002]

2. Description of the Related Art When mounting a BGA or CSP element or the like, a method of attaching a spherical body such as a solder ball to a work piece such as a substrate is to provide a through hole in accordance with the position where the solder ball of the substrate is attached. In many cases, a jig is used to guide the solder balls to the substrate and to attach the solder balls to the substrate. Also, since it is difficult to specify the solder ball attachment position on the prototype board, the mainstream method is to confirm the solder ball attachment position through a microscope and attach the solder balls manually. It was However, in the case of a prototype board or the like, if a jig is manufactured every time a board is prototyped, it takes too much time and cost, which leads to an increase in product cost. Therefore, in order to automate the solder ball sticking operation, a memory that stores a program that can recognize the nozzle that sucks the solder ball by sucking air and the board pattern and select the solder ball sticking position from the recognition result is stored. A solder ball application device provided with the device is provided.

[0003]

As a result, although the solder ball sticking operation is automated, when the solder ball becomes smaller, it becomes very light weight, and therefore a plurality of nozzles are attached to the tip of the nozzle by sucking air. However, there is a problem in that it is very difficult to accurately attach the solder balls one by one to the substrate. Further, the tray in which the solder balls are stored is provided with a nozzle entry portion, and air is sent into the tray to agitate the solder balls in order to facilitate the suction of the solder balls to the nozzles. ,
There was also a problem that the solder balls would be blown outside from the entry portion of the nozzle. As described above, there is a problem in that it is difficult to ensure an accurate sticking operation and an orderly work environment when the sticking device spherical body represented by the solder ball sticking device is small.

Therefore, the present invention has been made to solve these problems, and an object of the present invention is to allow only one spherical body to be adsorbed and supported by a nozzle in a spherical body sticking apparatus. An object of the present invention is to provide a spherical body sticking device capable of surely performing the sticking operation of the spherical body and preventing the spherical body from being blown off from the tray for storing the spherical body.

[0005]

In order to achieve the above object, the present invention has the following constitution. That is, a stage for supporting the workpiece, a tray for storing the spherical body, a nozzle for adsorbing the spherical body accommodated in the tray and adhering the adsorbed spherical body to the workpiece, the nozzle and the nozzle. In a spherical body sticking apparatus configured by a control unit for sticking together a pasting position of a spherical body of a processed product, a spherical body having a diameter slightly larger than the spherical body at the tip of the nozzle. The spherical body sticking device is characterized in that a concave portion having a depth slightly shallower than the diameter is provided. In addition, the control unit, a camera for photographing the attachment position of the spherical body of the workpiece, an arithmetic unit for processing the image photographed by the camera, based on the calculation result of the arithmetic unit, the nozzle and the nozzle A spherical body sticking device comprising a positioning mechanism for aligning a position where a spherical body of a processed product is stuck. As a result, when the spherical body is attached to the substrate or the like, the suction nozzle can be brought close to the substrate or the like, so that the spherical body can be accurately attached to the substrate.

Further, in the spherical body sticking device, the tray is provided with a shutter at a portion where the nozzle enters. Further, in the spherical body sticking device, the shutter is formed by radially providing cuts from a central portion of the nozzle toward an outer portion of the nozzle. Furthermore, in the spherical body sticking device, the shutter is formed in a taper shape in which the member thickness gradually decreases from the outside of the cut to the center side of the cut around the center of the cut. Further, in the spherical body sticking device, the shutter is made of rubber. As a result, there is no possibility of the spherical body being blown off from the spherical body storage tray. Further, when a plurality of spherical bodies are likely to be adsorbed by the suction nozzle, the shutter acts as a scraper, so that one spherical body is always adsorbed by the suction nozzle.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of a device for attaching a spherical body according to the present invention will be described in detail below with reference to the drawings. In the present embodiment, a description will be given of a solder ball sticking device for sticking solder balls to a substrate to which the present invention is applied. FIG. 1 is an explanatory view showing the overall configuration of a solder ball sticking apparatus. Solder ball sticking apparatus 1 of the present embodiment
Reference numeral 0 denotes a belt conveyor 14 for supplying a substrate 12 as a workpiece, a stage 16 for adsorbing and fixing the substrate 12 with air, and a first table 18 supporting the stage 16 and movable in the XY directions. A tray 22 for housing the solder balls 20, a second table 24 for moving the tray 22 in the Y direction, and a solder ball 20 housed in the housing tray 22 for adsorbing and adhering to the substrate 12. Of the nozzle 26, a camera 28 for photographing the wiring pattern of the substrate 12, and image data of the wiring pattern of the substrate 12 photographed by the camera 28,
A control unit that controls the attachment of the solder balls 20 to the substrate 12 is provided.

The belt conveyor 14 is a conveying means for conveying the substrate 12 to which the solder balls 20 are attached to the vicinity of the stage 16. The stage 16 is provided on a first table 18 which is movable in the XY directions, and the substrate 12 is movable in the XY directions along with the movement of the first table 18. Further, a suction hole 16a for sucking and fixing the substrate 12 by suction of air is provided. The solder ball 20 used in the solder ball sticking apparatus 10 of the present embodiment has a diameter of about 0.3 mm, and the tray 2
It is stored in 2. The tray 22 is the second table 24
It is mounted on the and is movable in the Y direction. The positions of the first table 18 and the second table 24 are adjusted by a control unit including an arithmetic device and the like. 28 is a camera. A small camera represented by a CCD or the like is mainly used as the camera 28. The video image captured by the camera 28 is processed by the arithmetic device provided in the control unit and displayed on the monitor 30 as image data. The monitor 30 cooperates with a program that allows the position where the solder balls 20 are attached to the substrate 12 to be selected.
The configuration is such that the attachment position of the solder ball 20 can be determined while watching 0.

FIG. 2 is an explanatory view showing a mechanism for attracting solder balls by a nozzle. FIG. 3 is an explanatory view showing the structure of the tip of the nozzle. FIG. 4 is a plan view of the tray shutter. FIG. 5 is an explanatory diagram showing the mutual relationship between the nozzle and the shutter. 26 is air suction,
It is a nozzle for adsorbing and fixing the solder ball 20 and adhering it to the substrate 12. The nozzle 26, as shown in FIG.
The outer cylindrical portion 26a and the inner cylindrical portion 26b are integrally formed by adhesion to have a double structure. Outer cylindrical portion 26a
The inner diameter of is formed to be slightly larger than the diameter of the solder ball 20, and the inner diameter of the inner cylindrical portion is formed to be smaller than the diameter of the solder ball.

The nozzle 26 assembled in this way
A concave portion 26c having an inner diameter slightly larger than the diameter of the solder ball 20 and a depth slightly shallower than the diameter of the solder ball 20 is formed at the tip of the. As a result, the solder balls 20 are housed in the recessed portion 26c surrounded by the outer cylindrical portion 26a and the inner cylindrical portion 26b in a state where the solder balls 20 are attracted to the inner cylindrical portion 26b.
The recess 26c in the present embodiment is formed such that a part of the outer surface of the solder ball 20 projects from the nozzle tip in a state where the solder ball 20 is adsorbed by the recess 26c at the nozzle tip.

As described above, the nozzle 26 is connected to the outer cylindrical portion 26a.
By adopting a double structure in which the inner cylindrical portion 26b is drawn inside, the tip end surface of the nozzle 26 is attached to the solder paste of the substrate 12 when the attracted solder balls 20 are attached to the substrate 12. It is possible to attach the solder ball 20 at a position brought close to immediately before.
When the tip end surface of the nozzle 26 is brought close to the solder paste of the substrate 12 and the air adsorption of the solder ball 20 is released, the solder ball 20 is guided by the inner side wall of the outer cylindrical portion 26a of the nozzle 26, and the solder ball 20 falls. Can be precisely positioned and attached to the substrate 12.

In FIG. 2, reference numeral 22 is a tray for storing the solder balls 20. The tray 22 is provided with a shutter 22a into which the nozzle 26 can enter. The shutter 22a is provided in a portion corresponding to the upper lid of the tray 22,
It is made of a material having good sliding property such as silicone rubber, and is shown in FIG.
As shown in FIG. 3, a notch 22b formed in a cross shape in plan view extending radially outward from the intersection with the central axis of the nozzle 26 is provided as the entrance of the nozzle 26. When taking out the solder balls 20 from the tray 22,
The nozzle 26 is inserted into the tray 22 from the center of the cut 22b. When the nozzle 26 is inserted into the tray 22 from the central portion of the cut 22b, the shutter 22a elastically deforms to the state of the broken line in FIG.

Air is constantly sent from the lower portion of the tray 22 into the tray 22 by the air supply means, and the solder balls 20 are agitated by this. When air is sucked from the nozzle 26, the solder ball 20 is sucked into the recess 26 c at the tip of the nozzle 26. Since the solder balls 20 are extremely lightweight, the solder balls 20, 20, ...
As shown in, it is sucked into a tuft of grapes. According to the present invention, when the nozzle 26 is pulled out from the tray 22,
Since the shutter 22a is in a state of scraping off the solder balls 20, 20, 20, ... Suctioned by the nozzle 26, the solder balls 20, 20, .. Will be paid off. Therefore, when the nozzle 26 is pulled out from the tray 22, one solder ball 20 can be adsorbed in the recess 26c at the tip of the nozzle.

FIG. 6 is an explanatory view showing another embodiment of the shutter. In the present embodiment, the shape around the tip of the notch of the shutter 22a provided in the upper lid portion of the tray 22 is changed from the root (outer) portion to the tip (center).
It is characterized in that the part is formed in a taper shape so that the thickness of the member is gradually reduced. When the nozzle 26 enters the tray 22 through the shutter 22a, the tip portion of the cut of the shutter 22a ( The central portion) is deformed, the tip portion (central portion) of the cut of the shutter 22a is deformed so as to be bent along the outer peripheral surface of the nozzle 26, and the deformation amount of the root (outer) portion is reduced.

The shutter 22a is formed in a taper shape in which the thickness of the member is gradually reduced from the root (outside) to the tip (center side) in the vicinity of the portion in contact with the nozzle. The shutter 22a comes into contact with the nozzle 26 at an acute angle to improve the sliding property with the nozzle 26, and when the nozzle 26 is pulled out from the tray 22, the solder ball 20 attracted to the nozzle 26
This is because the effect of cutting off the solder is improved and the extra solder balls 20 can be removed more reliably.

If the amount of deformation of the root (outer) portion of the shutter 22a is large, a gap is created in the cut portion of the shutter 22a when the nozzle 26 is inserted, and the tray 2
When air is blown into 2 to agitate the solder balls 20, it is possible that the solder balls 20 jump out from the tray 22. If the root (outer) portion of the shutter 22a is formed thick and the amount of deformation of that portion is reduced as in the present embodiment, a gap is less likely to be created in the cut portion of the shutter 22a, and the solder ball 20 is removed from the inside of the tray 22. Can be effectively prevented from popping out.

Further, as shown in FIG.
By increasing the number of cuts in a, the shutter 2
By increasing the amount of deformation of the tip (center) portion of 2a and decreasing the amount of deformation of the root (outer side) portion, the sealing performance of the tray 22 is improved, and the extra solder balls 20 adsorbed by the nozzle 26 are removed. It is possible to enhance the effect of cutting.

Furthermore, as shown in FIG. 8, the shutter 22a may have a double structure. In the shutter 22a in FIG. 8, the upper half 22b is formed by NBR, the lower half 22c is formed by urethane, and the upper half 22b is formed.
The lower half 22c and the lower half 22c are integrally formed by an adhesive or melting. Further, like the other embodiments, the shutter 22a is formed in a taper shape such that the thickness of the member gradually decreases from the root (outer side) to the tip (inner side) portion. In such a shutter 22a, it is possible to suppress deterioration due to contact with the nozzle 26 by using a material having excellent wear resistance for the material of the upper half 22b, and the lower half 22c.
It is possible to secure the strength and the wear resistance of the shutter 22a by using a high-strength member material. Accordingly, the shutter 22a with less deterioration and high abrasion resistance can be obtained, which is preferable.

Next, the procedure for attaching the solder balls 20 to the substrate 12 by the solder ball attaching apparatus 10 of the present invention will be described. FIG. 9 is an explanatory diagram showing an operating state of the solder ball sticking apparatus. First, the substrate 12 is conveyed by the belt conveyor 14 (S1). After the substrate 12 is transported to a predetermined position, the first table 18
It is mounted on the stage 16 provided in the stage 16 and sucked and fixed by sucking air from the suction hole 16a of the stage 16 (S2). The pattern of the substrate 12 on the stage 16 is photographed by the camera 28, and the photographed image is transmitted to a computing device (not shown) (S3). The arithmetic device analyzes the photographed image and outputs the pattern of the substrate 12 to the monitor 30 (S4). The pattern output to the monitor 30 is linked with a program in the arithmetic unit that selects the position where the solder ball 20 is attached to the substrate 12, and the attachment position can be determined on the screen of the monitor 30.

When the sticking position is determined by the operator, the tray 22 containing the solder balls 20 approaches the nozzle 26 (S5). Nozzle 26 is tray 22
From the shutter 22a portion into the tray 22, and the air is blown from below the tray 22 by the air supply means (not shown) to agitate the solder balls 20 in the tray 22. Then, when the nozzle 26 sucks air, the agitated solder ball 20 is adsorbed near the tip of the nozzle 26 (S6). While pulling out the nozzle 26 from the tray 22, the excess solder balls 20 adsorbed at the tip of the nozzle 26 are scraped off by a shutter 22a.
One solder ball 20 is provided in the recess 26c at the tip of the nozzle 26.
Is adsorbed (S7).

When the nozzle 26 is completely pulled out from the tray 22, the tray 22 is pulled down to the inner side of the apparatus (S).
8). After the tray 22 is pulled down, the nozzle 26 is
Substrate 12 adsorbed on stage 16 on table 18 of
And the solder ball 20 is attached to the attachment position of the solder ball 20 previously determined by the operator (S9). A heater (not shown) is provided on the stage 16 and heats the solder paste on the substrate 12 before the solder balls 20 are attached. When the solder paste is sufficiently heated, the solder ball 20 of the nozzle is attached to the substrate 12. The solder ball 20 is directly attached to the substrate 12 by releasing the air suction of the nozzle 26, and the solder ball 20 is blown with compressed air or the like from the inside of the nozzle 26.
From the recess 26c at the tip of the nozzle 26,
The solder balls 20 are attached to the solder paste at the attachment position of.

The solder ball 20 is separated from the nozzle 26,
Freely drops to the solder paste at the attachment position. Since the solder ball 20 is extremely lightweight, it may be affected by even a slight air flow and may be displaced from a predetermined position and stick to the solder paste. Since the solder ball 20 is guided in the falling direction by the inner side wall of the outer cylindrical portion 26a that constitutes 26c, it is less affected by the flow of air, and the solder ball 20 is pinned to the position of the solder paste on the substrate 12. It becomes possible to paste in points. By repeating the above operations (S1 to S9),
The solder balls 20 are attached to all the predetermined positions of the substrate 12. The operation of each movable part described above is controlled by a controller (not shown).

After the solder balls 20 are attached to all the predetermined positions of the board 12, the board 28 is photographed again by the camera 28 (S10). The captured image is transmitted to a computing device (not shown), the computing device analyzes the captured image, and the substrate 1
The state 2 is output to the monitor 30 (S11). As a result, it is possible to confirm whether or not the solder balls 20 are attached to the predetermined positions of the substrate 12 and the attached state of the solder balls 20, so that a high-quality substrate 12 can be manufactured. is there.

As described above, according to the solder ball sticking apparatus to which the present invention is applied, the number of the solder balls 20 to be attracted to the tip of the nozzle can be always one. The solder balls 20 can be attached to the solder paste. Further, since the shutter 22a is provided, the solder balls 20 excessively adsorbed by the nozzles 26 are scraped off and the tray 2 is removed.
2 can be dropped into the tray 22,
When the solder balls 20 are pulled out from the nozzles 26, the solder balls 20 excessively adsorbed by the nozzles 26 are not scattered.

Solder ball sticking apparatus 10 according to the present invention
Is not limited to the embodiment described above. For example, omitting the conveyor such as the belt conveyor 13,
A semi-automatic device for manually placing the workpiece on the stage 16 can reduce the manufacturing cost of the main body.
Further, the nozzle 26 does not bond a plurality of members,
It may be formed alone. Further, the shutter 22a may be provided not on the upper lid portion of the tray 22 but on the side wall portion. Not only is the shutter 22a formed by cutting one rubber plate as described in the embodiment, but also a small rubber plate. The shutter 22a may be formed by wrapping a plurality of sheets. Furthermore, the present invention can be sufficiently configured even if the shutter is made of plastic or metal. As a matter of course, the embodiment may be modified without departing from the spirit of the invention.

The solder ball sticking device has been described in detail as a specific example to which the present invention is applied, but the present invention is not limited to this. For example,
As the sphere state, copper spheres, iron spheres, aluminum spheres, plastic spheres, etc. are conceivable, and it goes without saying that even a device for sticking these spheres at a predetermined position of a workpiece is not the subject of the present invention. Is.

[0027]

EFFECTS OF THE INVENTION By providing a concave portion having a slightly wider inner width than a spherical body and a depth slightly shallower than the spherical body at the tip of the nozzle, the nozzle is allowed to enter a tray containing a large number of spherical bodies, By sucking air, it is possible to easily attract only one spherical body at the time of adsorbing the spherical body to the nozzle tip portion. Further, by providing the shutter on the upper lid portion of the tray, it is possible to scrape off the extra spherical body adsorbed to other than the nozzle tip concave portion and drop it from the nozzle tip portion,
It is possible to almost surely make one spherical body adsorbed to the tip portion of the nozzle. Further, when the nozzle is pulled out from the tray, there is no possibility that the spherical bodies in the tray will pop out, so that the periphery of the tray will not be scattered and the spherical bodies can be saved.

Further, since the shutter is formed in a taper shape in the vicinity of the tip end portion such that the thickness of the shutter gradually decreases from the outer side to the tip end side, the shutter comes into contact with the nozzle at an acute angle. Therefore, the scraping efficiency of the spherical body adsorbed by the nozzle is improved. Further, since the portion having a small member thickness is mainly deformed, the amount of deformation of the shutter as a whole is reduced, so that the gap generated in the cut portion is reduced and the spherical body in the tray is less likely to pop out. Furthermore, since the shutter is made of rubber, the sliding property is improved, and the abrasion effect is further improved.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an overall configuration of a solder ball sticking device.

FIG. 2 is an explanatory diagram showing a mechanism for attracting solder balls by a nozzle.

FIG. 3 is an explanatory diagram showing a structure of a nozzle tip portion.

FIG. 4 is a plan view of a tray shutter.

FIG. 5 is an explanatory diagram showing a mutual relationship between a nozzle and a shutter.

FIG. 6 is an explanatory diagram showing another embodiment of the shutter.

FIG. 7 is a plan view showing another embodiment of the shutter.

FIG. 8 is a plan view showing another embodiment of the shutter.

FIG. 9 is an explanatory view showing an operating state of the solder ball sticking device.

[Explanation of symbols]

10 Solder ball sticking device 12 substrates 20 solder balls 22 trays 22a shutter 26 nozzles 26a Outer cylindrical portion 26b Inner cylindrical part 26c recess 28 cameras

Claims (6)

[Claims] 1. A stage for supporting a workpiece, a tray for storing spherical bodies, a nozzle for adsorbing the spherical bodies stored in the tray, and affixing the adsorbed spherical bodies to the workpiece, and a nozzle. In a spherical body sticking device configured by a control unit for sticking the sticking position of the spherical body of the work piece in alignment with each other, the tip of the nozzle has a diameter slightly larger than that of the spherical body. A spherical body sticking device, wherein a concave portion having a depth slightly shallower than the diameter of the spherical body is provided. 2. The control unit, based on a calculation result of the arithmetic unit, a camera for photographing the attachment position of the spherical body of the workpiece, an arithmetic unit for processing an image photographed by the camera, The spherical body sticking apparatus according to claim 1, further comprising a positioning mechanism for positioning the nozzle and a position for sticking the spherical body of the workpiece. 3. The spherical body sticking apparatus according to claim 1, wherein the tray is provided with a shutter at a portion where the nozzle enters. 4. The spherical body sticking device according to claim 3, wherein the shutter is formed by radially providing notches from a central portion of the nozzle toward an outer portion of the nozzle. 5. The shutter according to claim 3, wherein the shutter is formed in a tapered shape in which a member thickness is gradually reduced from the outside of the cut to the center side of the cut around the center of the cut. Spherical body sticking device. 6. The spherical body sticking device according to claim 3, wherein the shutter is made of rubber.