JP2003197812A - Wiring base board and manufacturing method thereof, semiconductor device and manufacturing method thereof, circuit base board and electronic instrument - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring base board and the manufacturing method of the same, capable of preventing contact between the end part of a semiconductor chip and the wiring of the wiring base board, a semiconductor device and the manufacturing method thereof, a circuit base board and an electronic instrument. <P>SOLUTION: The wiring base board comprises a base board 12 having the mounting area of the semiconductor chip 20, a plurality of wirings 14 formed on the base board 12 so as to arrive at the mounting area and a protective film 30 provided in the area between neighbored wirings 14 so as to arrive at the end part of the mounting area on the wiring 14 while avoiding the end part of the mounting area. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board and a manufacturing method thereof, a semiconductor device and a manufacturing method thereof, a circuit board, and electronic equipment.

[0002]

BACKGROUND OF THE INVENTION A semiconductor device in which a semiconductor chip is mounted face down on a substrate is known. In face-down mounting, the surface of the semiconductor chip on which the wiring (for example, aluminum wiring) is formed faces the surface of the wiring substrate on which the wiring (for example, copper wiring) is formed.

Conventionally, a wiring or the like turned up at the end of a semiconductor chip may come into contact with the wiring of a wiring board to cause a short circuit. This problem could not be solved simply by increasing the distance between the end of the semiconductor chip and the wiring of the wiring board.

The present invention is intended to solve the above-mentioned problems, and an object thereof is a wiring board capable of preventing contact between an end portion of a semiconductor chip and a wiring of the wiring board, a manufacturing method thereof, and a semiconductor. An object of the present invention is to provide a device, a manufacturing method thereof, a circuit board, and an electronic device.

[0005]

(1) A wiring board according to the present invention comprises a base substrate having a semiconductor chip mounting region, and a plurality of wirings formed on the base substrate to reach the mounting region. A protective film which is provided so as to reach the end of the mounting region on the wiring, and which is provided in a region between the adjacent wirings while avoiding the end of the mounting region,
including.

According to the present invention, when the semiconductor chip is mounted on the wiring board, the protective film is interposed between the end portion of the semiconductor chip and the wiring of the wiring board. As a result, it is possible to prevent contact between the end portion of the semiconductor chip and the wiring of the wiring board. Therefore, it is possible to provide a wiring board with high electrical connection reliability.

(2) In this wiring board, the protective film may be provided on the wiring so as to have a pattern substantially the same as the pattern of the wiring outside the mounting region of the base substrate.

(3) In this wiring board, the protective film may be provided outside the mounting area of the base substrate so as to cover the wiring and the area between the adjacent wirings.

(4) In the semiconductor device according to the present invention, a semiconductor chip having electrodes and a plurality of wirings arranged on the side of the surface of the semiconductor chip having the electrodes and electrically connected to the electrodes are formed. And a base substrate provided between the semiconductor chip and an end of the semiconductor chip and the wiring, and is provided so as to avoid an area between the end of the semiconductor chip and the adjacent wiring. And a protective film formed thereon.

According to the present invention, the protective film is interposed between the end of the semiconductor chip and the wiring of the wiring board. As a result, it is possible to prevent contact between the end portion of the semiconductor chip and the wiring of the wiring board. Therefore, a semiconductor device with high electrical connection reliability can be provided.

(5) In this semiconductor device, the protective film may be provided on the wiring outside the semiconductor chip of the wiring substrate so as to have a pattern substantially the same as the pattern of the wiring.

(6) In this semiconductor device, the protective film may be provided outside the semiconductor chip of the wiring board so as to cover the wiring and a region between adjacent wirings.

(7) In this semiconductor device, the entering portion of the protective film may be in close contact with the end portion of the semiconductor chip.

(8) In this semiconductor device, the part of the protective film that comes in may be provided so as not to contact the end of the semiconductor chip.

According to this, a material having relatively low heat resistance can be used as the protective film.

(9) This semiconductor device may further include a resin provided between the semiconductor chip and the wiring board.

According to this, since the protective film is provided so as to avoid the end portion of the semiconductor chip and the region between the adjacent wirings, the flow of the resin is not obstructed. There is. Therefore, the resin is provided in a suitable state.

(10) In this semiconductor device, the resin is an anisotropic conductive material containing conductive particles, and the electrodes and the wiring may be electrically connected by the conductive particles. .

According to this, even when the conductive particles are present between the end portion of the semiconductor chip and the wiring, it is possible to prevent the conductive particles from electrically connecting to each other.

(11) In this semiconductor device, the electrode and the wiring may be electrically connected by metal bonding.

(12) A circuit board according to the present invention has the above wiring board or the above semiconductor device mounted thereon.

(13) An electronic device according to the present invention has the wiring board or the semiconductor device.

(14) A method of manufacturing a wiring board according to the present invention includes forming a plurality of wirings on a base substrate having a mounting area of a semiconductor chip so as to reach the mounting area and providing a protective film, The protective film is provided on the wiring so as to reach an end of the mounting area, and is provided so as to avoid an end of the mounting area in a region between adjacent wirings.

According to the present invention, when the semiconductor chip is mounted on the wiring board, the protective film is interposed between the end portion of the semiconductor chip and the wiring of the wiring board. As a result, it is possible to prevent contact between the end portion of the semiconductor chip and the wiring of the wiring board. Therefore, it is possible to manufacture a wiring board having high electrical connection reliability.

(15) In this wiring board manufacturing method, the protective film may be provided on the wiring outside the mounting region of the base substrate so as to have a pattern substantially the same as the wiring pattern. .

According to this, the area for providing the protective film can be small, so that the material cost can be reduced.

(16) In this method for manufacturing a wiring board, the protective film may be provided outside the mounting area of the base substrate so as to cover the wiring and the area between the adjacent wirings. .

According to this, the protective film can be provided by a simple process.

(17) In this method of manufacturing a wiring board, the protective film may be provided by a printing method.

(18) In this method of manufacturing a wiring board, the protective film may be made of a photosensitive material, and the protective film may be provided by exposing the material to remove a part thereof.

(19) In this method for manufacturing a wiring board, a conductive member is provided on the base substrate, the material is exposed on the conductive member to partially remove the material, and a portion of the conductive member exposed from the material. May be formed by etching, and the protective film may be provided by removing a portion of the material that covers an electrical connection portion of the wiring with the electrode.

According to this, since the protective film is provided by using the material for forming the wiring, the process is simplified and the cost can be significantly reduced.

(20) In this method of manufacturing a wiring board, the protective film may be provided by an electrodeposition method.

(21) In this method of manufacturing a wiring board, the protective film may be provided by an inkjet method.

(22) A method of manufacturing a semiconductor device according to the present invention includes the method of manufacturing a wiring board described above.

[0036]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. However, the present invention is not limited to the following embodiments.

(Wiring Substrate) FIGS. 1 to 2B are plan views of the wiring substrate according to the present embodiment. 2A is a partially enlarged view of FIG. 1, and FIG. 2B is a view showing a modified example.

The wiring board 10 includes a base substrate 12 and wirings 14. The base substrate 12 may be made of an organic material (for example, an epoxy substrate), an inorganic material (for example, a ceramic substrate, a glass substrate), or a composite structure thereof (for example, a glass epoxy substrate), and the material is not limited. The base substrate 12 may be a flexible substrate (flexible substrate). Examples of the flexible substrate include a polyester substrate and a polyimide substrate. The base substrate 12 is a COF (Chip On Film).
It may also be called a substrate for TAB (Tape Automated Bonding). Alternatively, the base substrate 12 may be a rigid substrate.

The base substrate 12 has a mounting area for the semiconductor chip 20. In the example shown in FIGS. 1 to 2B, the semiconductor chip 2 is formed in the region surrounded by the two-dot chain line of the base substrate 12.
0 is installed.

A plurality of wirings 14 are formed on the base substrate 12. Although the wiring 14 is formed on one surface of the base substrate 12 in the present embodiment, it may be formed on both surfaces. The wiring 14 refers to a portion for achieving electrical connection of at least two points, and the plurality of wirings 14 formed independently may be referred to as a wiring pattern. The wiring 14 is
Often formed of a metal such as copper, nickel or gold.

The plurality of wirings 14 are formed so as to reach the mounting area of the semiconductor chip 20. Specifically, each wiring 14 is formed so as to reach a portion (in many cases, an end portion of the semiconductor chip) of the semiconductor chip 20 where any of the electrodes 22 is arranged. Each wiring 14 has a connection portion 16 with the electrode 22 in a portion where the electrode 22 is arranged. The connecting portion 16 may be a land having an area larger than that of a line portion, or may be a tip portion extended with the same width as the line.

Here, the plane shape of the semiconductor chip 20 is
It is often a rectangle, but it may have another shape (for example, a circle). The electrodes 22 are often formed on the ends of the semiconductor chip 20. For example, the semiconductor chip 20
Is rectangular, the plurality of electrodes 22 may be formed along two or four opposite sides (two sides in FIG. 1).

A protective film 30 is provided on the wiring board 10. The protective film 30 is formed of an insulating material (for example, resin). Since the protective film 30 remains on the wiring substrate 10 as a final product (semiconductor device), it is preferable to select a material having desired heat resistance and the like.

The protective film 30 is provided outside the mounting region of the semiconductor chip 20 so as to cover at least the wiring 14. In the example shown in FIGS. 1 and 2A, the protective film 3
0 is provided outside the mounting region of the semiconductor chip 20 so as to cover the wiring substrate 10 (the region of the wiring 14 and the region between the adjacent wirings 14). In that case, the protective film 3
0 is provided in a region between adjacent wirings 14 (exposed region of the base substrate 12) so as to avoid the end of the mounting region of the semiconductor chip 20. According to this, since the patterning region of the protective film 30 is small, the protective film 30 can be easily provided. For example, as illustrated, the protective film 3
0 may be provided near the mounting region of the semiconductor chip 20 so as to expose a region between adjacent wirings 14. By doing so, the semiconductor chip 20 and the wiring board 1
Since the ventilation between 0 and 0 can be improved, for example, the resin can be easily flowed, as described later.

The protective film 30 reaches the end of the mounting area of the semiconductor chip 20 on any one or a plurality (all in FIG. 2A) of the wirings 14 inside the mounting area of the semiconductor chip 20. Is provided. In other words, the protective film 30 is provided so as to enter between the end portion of the semiconductor chip 20 and the wiring 14 when the semiconductor chip 20 is mounted on the wiring board 10. In other words, the protective film 30 has a function of a spacer between the end of the semiconductor chip 20 and the wiring 14.

The spacer portion 32 of the protective film 30 is formed by the wiring 14
It is provided so as to avoid at least the connecting portion 16 so as not to interfere with the electrical connection between the electrode 22 and the electrode 22. Protective film 30
The spacer portion 32 may be formed on the wiring 14 with a width substantially the same as the width of the wiring 14 (including an error range). In that case, the spacer portion 32 of the protective film 30 may be provided on the upper end portion of the wiring 14 (see FIG. 4A), or may be provided so as to cover the upper end portion and the side end portion.

Alternatively, as shown in FIG. 2B, the protective film 40 may be provided on the wiring 14 outside the mounting region of the semiconductor chip 20 so as to have a pattern substantially the same as the pattern of the wiring 14. Good. In other words, the base substrate 12 is exposed from the protective film 40 between the wirings 14 outside the mounting region of the semiconductor chip 20. According to this, the area in which the protective film 40 is provided can be reduced, so that the material cost can be reduced. Protective film 4
The 0 may be formed on the wiring 14 with a width (including an error range) substantially the same as the width of the wiring 14. In addition, the protective film 40
May be provided on the upper end of the wiring 14, or may be provided so as to cover the upper end and the side end. Then, the protective film 40 extends from the outer side to the inner side of the mounting area of the semiconductor chip 20, and on the wiring 14, the semiconductor film 2 is formed.
It is provided so as to reach the end of the mounting area of 0. In other words, the protective film 40 is provided so as to enter between the end portion of the semiconductor chip 20 and the wiring 14 when the semiconductor chip 20 is mounted on the wiring board 10. Protective film 40
The spacer portion 42 is provided so as to avoid at least the connection portion 16 so as not to hinder the electrical connection between the wiring 14 and the electrode 22.

FIG. 3 is a sectional view taken along the line III-III of FIG. 2A, and FIG. 4A is a sectional view taken along the line IVA-IVA of FIG. 2A. FIG. 4B is a diagram showing a modified example. In addition,
In FIGS. 3 to 4B, a semiconductor chip is mounted on the wiring board.

As shown in FIGS. 3 and 4A, the spacer 32 between the end of the semiconductor chip 20 of the protective film 30 and the wiring 14 may be closely attached to the end of the semiconductor chip 20. . That is, the protective film 30 may be provided high on the wiring board 10 so as to fill the gap between the end portion of the semiconductor chip 20 and the wiring 14.

According to this, the semiconductor chip 20 and the wiring 1
4, a protective film 30 is provided in close contact with both. Therefore, the end portion of the semiconductor chip 20 and the wiring board 1
It is possible to reliably prevent the contact with the wiring 14 of 0.

Alternatively, as shown in FIG. 4B, the spacer portion 52 is provided between the end of the semiconductor chip 20 of the protective film and the wiring 14 so as not to contact the end of the semiconductor chip 20. You may be asked. That is, the protective film 30 may be provided on the wiring board 10 so as not to reach the end of the semiconductor chip 20.

According to this, since the protective film 30 is less likely to come into contact with the semiconductor chip 20, the protective film 30 is heated by the heat of the semiconductor chip 20 (for example, heat during mounting or operation).
Can be prevented from melting. That is, as the protective film 30, a material having relatively low heat resistance can be used, and the degree of freedom in design is widened.

According to the wiring board of this embodiment, when the semiconductor chip 20 is mounted on the wiring board 10, the protective film 30 is provided between the end of the semiconductor chip 20 and the wiring 14 of the wiring board 10. Intervene. As a result, contact between the end portion of the semiconductor chip 20 and the wiring 14 of the wiring board 10 can be prevented. Therefore, the wiring board 10 having high electrical connection reliability can be provided.

(Semiconductor Device) FIG. 5A is a diagram showing a semiconductor device according to the present embodiment, and FIG. 5B is a diagram showing a modified example. The semiconductor device is the wiring board 10 described above.
And a semiconductor chip 20 having electrodes 22.

The semiconductor chip 20 has the plurality of electrodes 22 as described above. The electrode 22 is often formed on the surface on which the circuit element is formed. The electrode 22 includes a pad (for example, an aluminum pad or a copper pad). Alternatively, if bumps (eg gold bumps) are formed on the pad,
The electrodes 22 include pads and bumps.

The semiconductor chip 20 is mounted so that the wiring board 10 is arranged on the side having the electrodes 22. That is, the semiconductor chip 20 is mounted face down on the wiring board 10. Then, the electrode 22 and the connecting portion 16 of the wiring 14 are electrically connected.

The electrical connection between the two may be achieved by metal bonding. In that case, only heat, only ultrasonic vibration, or ultrasonic vibration and heat may be applied to bond the both. When bonded, the material forming the electrode 22 and the connecting portion 16 of the wiring 14 diffuses to form a metal bond. For example, they may be thermocompression bonded to achieve Au-Au bonding. Further, it is preferable that the connection portion 16 of the wiring 14 is plated with a metal so as to form a eutectic, because metal bonding can be easily achieved. For example, the connection portion 16 may be plated with tin to form a Sn-Au eutectic alloy. In addition, you may perform solder joining as metal joining.

A resin 60 may be provided between the semiconductor chip 20 and the wiring board 10. The resin 60 may be made of, for example, an epoxy material. When the semiconductor chip 20 is mounted face down on the wiring board 10, the resin 60 is called an underfill material. Resin 60
May be the same material as the protective film 30 or may be a different material. As shown in FIG. 5A, the resin 60
May cover the surface of the semiconductor chip 20 on which the electrodes 22 are formed, or may be provided so as to reach the side portion of the semiconductor chip 20.

The resin 60 may be injected between the semiconductor chip 20 and the wiring board 10 after the semiconductor chip 20 is mounted. For example, when the electrodes 22 are formed on two opposite sides of the rectangular semiconductor chip 20, the resin 60 may be injected from the other two sides where the electrodes 22 are not formed.
In that case, since the protective film 30 is not provided between the end portion of the semiconductor chip 20 and the region between the adjacent wirings 14 on the side where the electrodes 22 are formed, the semiconductor chip 20 and the wirings are not provided. Ventilation with the substrate 10 can be improved. Therefore, the flow of the resin 60 is not obstructed, and the occurrence of voids can be prevented.

As shown in FIG. 5B, the semiconductor chip 2
An anisotropic conductive material 62 may be provided between 0 and the wiring board 10. The anisotropic conductive material 62 is one in which conductive particles 62 are contained in an adhesive (binder), and a dispersant may be added in some cases. A thermosetting adhesive is often used as the adhesive for the anisotropic conductive material 62. In the anisotropic conductive material 62, the conductive particles 64 are crushed between the electrode 22 and the connection portion 16 of the wiring 14 to achieve electrical connection between the two.

According to this, even when the conductive particles 64 are interposed between the end portion of the semiconductor chip 20 and the wiring 14, the protective film 50 (the spacer portion 52) prevents the conductive particles 64 from electrically connecting to each other. be able to.

Although the example in which the semiconductor chip 20 is mounted on one surface of the wiring board 10 has been described above, the present invention also includes a mode in which the semiconductor chip 20 is mounted on both surfaces of the wiring board 10. In that case, the above-mentioned protective films may be formed on both surfaces of the wiring board 10.

The effects of the semiconductor device according to the present embodiment are as described above.

(Method of Manufacturing Wiring Board) FIGS. 6 to 9 are views showing a method of manufacturing the wiring board according to the present embodiment.
In the present embodiment, the wiring 14 is formed on the base substrate 12 and the protective film 30 is provided.

The wiring board may be manufactured by applying the reel-to-reel transfer method. In that case, the base substrate 12 is a flexible substrate (tape). The base substrate 12 has an elongated shape and has a mounting region for mounting the plurality of semiconductor chips 20. Further, a plurality of sprocket holes (not shown) are formed at the end of the base substrate 12, and a sprocket (not shown) is fitted in the sprocket holes to enable reel-to-reel transfer.
According to this, since the manufacturing process can be performed by a flow work, the production efficiency can be improved and the manufacturing cost can be reduced.

The wiring 14 may be formed on one surface or both surfaces of the base substrate 12. The wiring 14 is
3 is attached to the base substrate 12 via an adhesive material.
You may comprise a layered substrate. In that case, the wiring 14 may be formed by etching after applying photolithography (see the third example). Alternatively, the wiring 14 may be formed on the base substrate 12 without an adhesive to form a two-layer substrate. For example, the wiring 14 may be formed by sputtering or the additive method of forming the wiring 14 by electroless plating may be applied.

The protective film 30 is patterned into a predetermined shape. Below, the example of the formation method of the protective film 30 is shown.

(First Example) As shown in FIG. 6, a protective film 30 is formed.
May be patterned by a printing method. Thereby, for example, the protective film 30 can be easily formed by using the existing manufacturing apparatus.

Base substrate 12 on which the wiring forming process is completed
Then, the mask 100 is aligned. Specifically, the mask 100 covers the portion of the final product to be exposed from the protective film 30 of the base substrate 12. That is, the portion where the protective film 30 is to be provided is opened. Next, the protective film 30
The material 102 is formed into a paste and provided on the entire surface of the base substrate 12 (including the region of the wiring 14). Then, the squeegee 104 is used to fill the material 102 into the opening of the mask 100. In that case, the material 102 is the mask 100.
Filled flat at a height of. After that, by removing the mask 100, the protective film 30 can be patterned.

(Second Example) As shown in FIGS. 7A and 7B, the protective film 30 may be patterned by photolithography.

Base substrate 12 on which the wiring forming process is completed
Then, the material 102 of the protective film 30 is provided. Where material 1
02 has photosensitivity. In that case, the material 102 may be either a positive type in which the photosensitive portion is soluble in the solvent or a negative type in which the photosensitive portion is insoluble in the solvent. The material 102 is provided on the entire surface of the base substrate 12 on which the wiring 14 is formed. The material 102 may be provided by a spin coating method, a dipping method, an electrodeposition method, or the like.

Next, the mask 106 is arranged and the light energy 108 is irradiated. That is, the material 102 is exposed. The shape of the mask 106 is determined by the patterning shape and has an inverted shape depending on whether the material 102 is a positive type or a negative type. In the illustrated example, the material 102 is a positive type, and the mask 106 is provided so as to cover the portion where the protective film 30 is to be provided. After the exposure, by developing the material 102, the protective film 30 can be patterned as shown in FIG. Note that the material 102 is preferably baked in any of the manufacturing steps.

(Third Example) As shown in FIGS. 8 (A) to 8 (D), the material 102 is used as a resist material for etching in the step of forming the wiring, and the material 102 remaining after the wiring 14 is formed. The protective film 30 may be patterned by using. For patterning the material 102, photolithography can be applied, and the contents described in the second example may be applied.

As shown in FIG. 8A, the base substrate 12
A conductive member 110 which is a material of the wiring 14 is provided on the substrate. The conductive member 110 is bonded to the base substrate 12 via an adhesive material (not shown) so as to include the area where the wiring 14 is formed. The material 102 is provided on the entire surface of the conductive member 110.

As shown in FIG. 8B, the material 102 is exposed and developed. The material 102 is used as a resist material by covering a portion which is not etched in a later etching step.

As shown in FIG. 8C, the conductive member 110
The portion exposed from the material 102 in is etched away. In that case, either dry etching or wet etching may be applied. In this way, the wiring 14 is formed in a predetermined pattern. At this time, material 1
02 is provided to cover the connecting portion 16 of the wiring 14.

As shown in FIG. 8D, the portion of the material 102 that covers the connection portion 16 of the wiring 14 is removed. For example, by irradiating with a laser beam, the material 102
May be partially removed. In this way, the protective film 30 can be patterned. Note that the material 102 is preferably baked in any of the manufacturing steps.

According to this, since the protective film 30 is provided by using the material 102 for forming the wiring 14, the process is simplified and the cost can be significantly reduced.

(Fourth Example) As shown in FIG. 9, the protective film may be patterned by an electrodeposition method.

Base substrate 12 on which the wiring forming process is completed
Is immersed in the bath 114 of the bath 112. In the bath 114, the material of the protective film is dispersed in the solvent. An anode electrode 116 is arranged in the bath 114. The anode electrode 116 is arranged on the side of the surface of the base substrate 12 on which the wiring is formed. Then, the base substrate 12 is sent into the bath 114, and the wiring is connected to a voltage lower than that of the anode electrode 116, for example, a cathode of GND. As a result, a current flows between the anode electrode 116 and the wiring of the base substrate 12. Thus, the material of the protective film can be provided on the wiring through which the current flows.
At this time, since the wiring connecting portion is also covered with the material of the protective film, a portion of the material covering the wiring connecting portion is removed in a subsequent step. For example, part of the material may be removed by irradiation with a laser beam.

As shown in FIG. 9, if the base substrate 12 is a long tape, reel-to-reel transfer can be applied. In that case, a lead electrically connected to each wiring pattern (a plurality of independent wirings) is formed on the base substrate 12, and the lead is connected to the cathode.

According to this, since the portion of the material of the protective film provided on the base substrate 12 to be removed is small,
Manufacturing costs can be reduced.

(Fifth Example) As shown in FIG. 10, the protective film may be patterned by an ink jet method.

Base substrate 12 on which the wiring forming process is completed
Then, the material 102 is discharged from the nozzle 120 of the inkjet head 118. More specifically, the inkjet head 118 uses the electrostatic force to eject the paste-like material 102 from the nozzle 120. According to the inkjet method, it is possible to fill the ink at high speed and economically without waste by applying the technology put to practical use for the inkjet printer. The inkjet head 118 shown in FIG. 10 has been put into practical use for an inkjet printer, for example, and is a piezo jet type using a piezoelectric element, or a bubble jet (registered trademark) type using an electrothermal converter as an energy generating element. Can be used. This makes it possible to freely set the ejection area and ejection pattern of the material 102 to be the protective film.

According to this, the protective film can be provided on a necessary portion of the base substrate 12, so that the material of the protective film is not wasted. Therefore, the manufacturing cost can be reduced.

As shown in FIG. 10, the base substrate 1
If 2 is a long tape, reel-to-reel transport can be applied.

(Method for Manufacturing Semiconductor Device) The method for manufacturing a semiconductor device according to the present embodiment includes the method for manufacturing a wiring board described above, and a semiconductor chip is mounted on the wiring board. One or more semiconductor chips are mounted on the wiring board. The details are as described above.

(Circuit Board and Electronic Equipment) FIG. 11 is a diagram showing a circuit board according to the present embodiment. Circuit board 10
The wiring board or the semiconductor device (semiconductor device in FIG. 11) described above is electrically connected to 00. Circuit board 1
000 may be an electro-optical device. The electro-optical device is, for example, a liquid crystal device, a plasma display device, an electroluminescence display device,
It has an electro-optical material (liquid crystal, discharge gas, luminescent material, etc.). As illustrated, the wiring board 10 of the semiconductor device
Is the wiring board 1 around the edge of the circuit board 1000, for example.
You may bend 0.

FIG. 1 shows an electronic apparatus according to this embodiment.
2 is a notebook personal computer 1100, FIG.
A mobile phone 1200 is shown at 3. These electronic devices include the wiring board or the semiconductor device described above.

The present invention is not limited to the above-described embodiment, but various modifications can be made. For example, the present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations having the same function, method and result, or configurations having the same purpose and result). Further, the invention includes configurations in which non-essential parts of the configurations described in the embodiments are replaced. Further, the present invention includes a configuration having the same effects as the configurations described in the embodiments or a configuration capable of achieving the same object. Further, the invention includes configurations in which known techniques are added to the configurations described in the embodiments.

[Brief description of drawings]

FIG. 1 is a diagram showing a wiring board according to the present embodiment.

FIG. 2 is a diagram showing a wiring board according to the present embodiment.

FIG. 3 is a diagram showing a semiconductor device according to the present embodiment.

FIG. 4A and FIG. 4B are views showing a semiconductor device according to this embodiment.

5A and 5B are diagrams illustrating a semiconductor device according to this embodiment.

FIG. 6 is a diagram showing a method of manufacturing a wiring board according to a first example of the present embodiment.

7A and 7B are diagrams showing a method for manufacturing a wiring board according to a second example of the present embodiment.

8A to 8D are diagrams showing a method for manufacturing a wiring board according to a third example of the present embodiment.

FIG. 9 is a diagram showing a method of manufacturing a wiring board according to a fourth example of the present embodiment.

FIG. 10 is a diagram showing a method of manufacturing a wiring board according to a fifth example of the present embodiment.

FIG. 11 is a diagram showing a circuit board according to the present embodiment.

FIG. 12 is a diagram showing an electronic device according to the present embodiment.

FIG. 13 is a diagram showing an electronic device according to the present embodiment.

[Explanation of symbols]

10 wiring board 12 Base substrate 14 wiring 16 Connection 20 semiconductor chips 22 electrodes 30 protective film 40 Protective film 50 Protective film 60 resin 62 Anisotropic conductive material 64 conductive particles

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 3/32 H01L 23/12 FF term (reference) 5E314 AA27 BB06 CC06 FF02 FF03 FF05 FF06 GG03 GG26 5E319 AA03 AB05 AC02 AC03 AC04 BB16 BB20 CC22 CC70 GG20 5E336 AA04 BB12 BB15 BB18 CC34 CC55 DD22 EE01 EE05 EE08 GG12 5F044 MM48

Claims (22)

[Claims] 1. A base substrate having a semiconductor chip mounting region, a plurality of wirings formed on the base substrate to reach the mounting region, and provided on the wiring so as to reach an end of the mounting region. And a protective film provided in a region between the wirings adjacent to each other so as to avoid an end portion of the mounting region. 2. The wiring board according to claim 1, wherein the protective film is provided on the wiring so as to have a pattern substantially the same as the pattern of the wiring outside the mounting region of the base substrate. Wiring board. 3. The wiring board according to claim 1, wherein the protective film is provided outside the mounting region of the base substrate so as to cover the wiring and a region between adjacent wirings. Wiring board. 4. A semiconductor chip having an electrode, a base substrate formed on a side of the surface of the semiconductor chip having the electrode and having a plurality of wirings electrically connected to the electrode, the semiconductor chip A protective film that is provided between the end of the semiconductor chip and the wiring, and that is provided so as to avoid the space between the end of the semiconductor chip and a region between the adjacent wirings. apparatus. 5. The semiconductor device according to claim 4, wherein the protective film is provided on the wiring so as to have a pattern substantially the same as the pattern of the wiring outside the semiconductor chip of the wiring substrate. Semiconductor device. 6. The semiconductor device according to claim 4, wherein the protective film is provided outside the semiconductor chip of the wiring board so as to cover the wiring and a region between adjacent wirings. Semiconductor device. 7. The semiconductor device according to claim 4, wherein the part of the protective film that comes in is in close contact with an end portion of the semiconductor chip. 8. The semiconductor device according to claim 4, wherein the part of the protective film that enters the semiconductor film is provided so as not to contact an end of the semiconductor chip. . 9. The semiconductor device according to claim 4, further comprising a resin provided between the semiconductor chip and the wiring board. 10. The semiconductor device according to claim 9, wherein the resin is an anisotropic conductive material containing conductive particles, and the electrodes and the wiring are electrically connected by the conductive particles. Semiconductor device. 11. The semiconductor device according to claim 4, wherein the electrode and the wiring are electrically connected by metal bonding. 12. A circuit board on which the wiring board or the semiconductor device according to claim 1 is mounted. 13. An electronic device having the wiring board or the semiconductor device according to claim 1. Description: 14. A base substrate having a mounting area for a semiconductor chip, wherein a plurality of wirings are formed so as to reach the mounting area, and a protective film is provided. The protective film is formed on the wiring to the mounting area. A manufacturing method of a wiring board, which is provided so as to reach an end portion of the wiring board and which is provided in a region between adjacent wirings while avoiding the end portion of the mounting area. 15. The method of manufacturing a wiring board according to claim 14, wherein the protective film is provided on the wiring outside the mounting region of the base substrate so as to have a pattern substantially the same as the pattern of the wiring. Wiring board manufacturing method. 16. The method of manufacturing a wiring board according to claim 14, wherein the protective film is provided outside the mounting area of the base substrate so as to cover the wiring and an area between adjacent wirings. Wiring board manufacturing method. 17. The method of manufacturing a wiring board according to claim 14, wherein the protective film is provided by a printing method. 18. The method of manufacturing a wiring board according to claim 14, wherein the protective film is made of a photosensitive material, and the protective film is partially exposed by exposing the material. A method of manufacturing a wiring board, which is provided by removing. 19. The method for manufacturing a wiring board according to claim 18, wherein a conductive member is provided on the base substrate, the material is exposed on the conductive member to partially remove the material, and the conductive material is removed from the material. A method of manufacturing a wiring substrate, wherein the wiring is formed by etching an exposed portion, and the protective film is provided by removing a portion of the material that covers an electrical connection portion of the wiring with the electrode. 20. The method of manufacturing a wiring board according to claim 14, wherein the protective film is provided by an electrodeposition method. 21. The method of manufacturing a wiring board according to claim 14, wherein the protective film is provided by an inkjet method. 22. A method of manufacturing a semiconductor device, comprising the method of manufacturing a wiring board according to claim 14, further comprising mounting the semiconductor chip in the mounting region.