JP2003193219A - Vacuum arc vaporization source - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vacuum arc vaporization source in which arc is stably controlled to be confined in a prescribed area on a vaporization surface even if heavy current discharge from several 100A to ≥1000A is carried out. <P>SOLUTION: A magnetic field producing source having the angle of line of magnetic force and an arc current value which are set to confine an arc spot into a nearly elliptic discharge region extending in the axial direction of a columnar evaporation material is provided on the evaporation surface of the columnar evaporation material. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum arc evaporation source used for wear resistant coating on cutting tools, machine parts and the like.

[0002]

2. Description of the Related Art Various methods have been hitherto proposed for reducing droplets (molten particles), which is a fatal drawback of the vacuum arc vapor deposition method. For example, Japanese Patent Publication No. 5-4829
Japanese Unexamined Patent Publication No. 8 (Prior Art 1) discloses that an arc follows an endless path by a magnetic field having a magnetic field component parallel to the surface of a cathode (evaporated substance), or a magnetic means for generating the magnetic field is provided to the cathode. And a relative movement of the vaporized material. It was said that automatic re-ignition associated with arc extinguishing is unnecessary.

Further, Japanese Patent Laying-Open No. 11-36063 (conventional example 2) states, "A magnetic field of 700 Oe or more is formed on the evaporation surface of an arc evaporation source, and the magnetic field travels in parallel or diverges in front of the evaporation surface, The angle between the normal and the magnetic line is 0
It was an arc type evaporation source having a temperature of 30 degrees, and provided an arc evaporation source with reduced droplets and a long cathode life. Further, Japanese Patent Application Laid-Open No. 1-234562 (Prior art example 3) states that "a magnetic generator is installed inside a hollow rotating body having a cathode evaporation material on its outer surface, and the evaporation material / magnetism generator is rotated or moved. A device that generates a discharge. "
That is, the purpose is to accurately control the arc path and not form groove-like erosion in the cathode.

[0004]

DISCLOSURE OF THE INVENTION Conventional Example 1 described above, that is, a magnetic field source that generates a magnetic force of a level that is usually available, gives a magnetic field parallel to the evaporation surface to cause an endless path of the arc on the evaporation surface. According to the method of drawing and moving, the orbit is stable if the arc current is a relatively small value of 100 A or less, but as the arc current increases, the ratio of deviating from the orbit increases, and if it exceeds 200 A, the orbit becomes stable. We have found experimentally that it will be difficult to secure a trajectory.

Further, in order to secure a trajectory for a discharge current exceeding 200 A, the magnetic force must be increased. Then, the speed of the arc spot increases and the discharge voltage increases, and the voltage is usually around 20V. It has also been confirmed that the voltage that can be discharged exceeds 40 V, and that a voltage near 100 V is required by further increasing the magnetic force and current, and that an extremely special and expensive arc power supply is required.
Also, if the magnetic means is not moved, the vaporized material will be consumed so as to be deeply scooped linearly along the endless path,
The movement of the magnetic means is substantially essential.

When the discharge current is about 150 A in the actual device using the technique of the above-mentioned conventional example 2, the arc spot is unevenly distributed on the evaporation surface and is locally consumed at the outer peripheral portion of the evaporation surface. have done. Furthermore, it was found that cracks were generated on the entire evaporation surface. Further, in order to generate a magnetic field of 700 Oe on the evaporation surface by the usual means, the diameter of the evaporation surface must be suppressed to 50 mm to 60 mm, and the current load (thermal load) for a small evaporation area is large. A certain amount of gas such as nitrogen or argon must be introduced to the actual discharge by this technique, which is a great restriction on the process.

Further, as the evaporation material is consumed, the relationship between the magnetic lines of force and the evaporation surface changes greatly, and since the evaporation area is small due to the small evaporation area as described above, it is necessary to actually maintain a desired magnetic field form for a long time. Is difficult. According to the embodiment, when the evaporation surface is retracted from the center of the coil due to wear, the magnetic field on the evaporation surface changes from a divergent shape to a convergent shape, and this prior art (conventional example 2) cannot be established. Furthermore, the arc spot pops out due to the consumption of the outer periphery of the evaporation surface,
May cause abnormal discharge. Conventional example 3 described above
According to the paper, in reality, only placing the magnet inside the hollow evaporation material imposes very large restrictions on the stable discharge as described. For example, it is only when the discharge current is 100 A or less and the chamber pressure is 1 Pa or less that the arc spot can be moved along the path as shown in the figure or trapped and controlled by the magnetic field lines as shown in the figure. It was actually confirmed that under the current and pressure conditions of, it was completely out of control. This is illustrated by the general phenomenon in vacuum arc discharge in which multiple arc spots are generated by increasing the arc current, or when the pressure increases, the movement of the arc spot becomes wide. In addition to the above, the lines of magnetic force that are actually generated will come into action, and this is inevitable.

According to the present invention, in the vacuum arc vapor deposition method, in order to obtain a film having a high roughness even at the production level film formation, the arc is stably evaporated even if a large current discharge of several 100 A to 1000 A or more is performed. It is an object of the present invention to provide a vacuum arc evaporation source capable of controlling confinement in a predetermined area and further controlling generation of droplets.

[0009]

In order to achieve the above-mentioned object, the present invention takes the following technical means. That is, the vacuum arc evaporation source according to claim 1 is a vacuum arc evaporation source that discharges by forming a magnetic field in a region including the evaporation surface of the columnar evaporation material, and the evaporation surface of the columnar evaporation material is It is characterized in that it is provided with a magnetic field generation source in which the angle of the magnetic force lines and the arc current value are set so that the arc spot is confined in a substantially elliptical discharge region extending in the axial direction.

The vacuum arc evaporation source according to a second aspect is a vacuum arc evaporation source that forms a magnetic field in a region including the evaporation surface of the columnar evaporation material to discharge, and the evaporation surface of the columnar evaporation material has a columnar shape. It is characterized in that it is provided with a magnetic field generation source in which the angle of the lines of magnetic force and the arc current value are set so as to confine the arc spot in a substantially strip-shaped discharge region extending in the circumferential direction of the vaporized substance. Furthermore, in the vacuum arc evaporation source according to claim 2, it is recommended that the two pairs of permanent magnets are arranged so that the same magnetic poles face each other and are magnetic field generation sources that repel magnetic force lines (claim 3).

Further, in claim 3, it is recommended that the magnets arranged to face each other have different magnetic forces (claim 4).
In claim 2, it is recommended that the magnets arranged so as to face each other have opposite poles (claim 5). In addition, claim 1
In ~ 5, it is recommended that the magnetic field strength on the evaporation surface is 5 millitesla or more (claim 6). Further, in claim 1 or 2, it is recommended that the arc current value is 200 A or more (claim 7).

Further, in claim 1 or 2, it is recommended that the maximum angle θ of the magnetic force line with respect to the normal line on the evaporation surface is θ ≧ 60 ° (claim 8). Further, in claim 1, it is recommended that the magnetic field including the minimum angle φ portion of the magnetic force line with respect to the normal line on the evaporation surface be moved parallel to the axis of the columnar evaporation material or rotated around the axis (claim). Item 9). Further, in the above-mentioned claim 2, it is recommended to move the magnetic field including the minimum angle φ portion of the magnetic line of force with respect to the normal line on the evaporation surface in parallel with the axis of the columnar evaporation material (claim 10), and further described above. Claim 1 or 2
In, the anode part of the arc discharge can be moved parallel to the axis of the columnar evaporation material (claim 11), and in the above-mentioned claim 1, the minimum angle φ part of the magnetic force line with respect to the normal line on the evaporation surface can be defined. It is also possible to rotate the included magnetic field and the anode synchronously about the axis of the columnar evaporation material (claim 12). Further, in the above-mentioned claim 1 or 2, a plurality of power feeding portions are provided for the columnar evaporation material, It is also possible to switch this power feeding unit or change the current value of each power feeding unit (claim 13).

In the above-mentioned claim 1 or 2, the magnetic field generation source is characterized in that the angle on the acute angle side formed by the normal line of the evaporation surface on the evaporation surface and the magnetic force line is α, the minimum angle φ is 0 ° to 20 °, and the maximum angle. When θ is set to 30 ° to 90 °, φ ≦ α ≦ θ is distributed, and the region of α = φ is surrounded by the region of α = θ, and is discharged by an arc current of a certain value or more. , Α = φ, which means that the arc spot is confined in a region inside α = θ and discharge is performed.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an embodiment according to claim 1, FIG. 1 (1) is a cross section of the evaporated substance and the magnetic field,
FIG. 1 (2) shows the direction (angle) of the magnetic force line with respect to the normal to the evaporation surface, FIG. 1 (3) shows a perspective view showing the columnar evaporation material and the magnetic field generation source, and FIG. 1 (4) shows 1 (3) is an arrow A and shows a substantially elliptic discharge portion extending in the axial direction of the columnar evaporation material.

In FIG. 1, a magnetic field generation source 2 exemplified by a permanent magnet having an N pole and an S pole is arranged in a hollow portion (inside) of a columnar evaporation substance 1 exemplified by a cylindrical shape, and the magnetic field generation source. The reference numeral 2 indicates the angle of the magnetic lines of force and the arc current value so that the arc spot is confined on the evaporation surface 1A of the columnar evaporation material 1 in a substantially elliptic discharge region (discharge portion) 1B extending in the axial direction of the columnar evaporation material 1. Is set. That is, in the vacuum arc evaporation source in which the evaporation material 1 has a columnar shape, a magnetic field having a certain strength or more is formed in a region including the evaporation surface 1A of the evaporation material 1, and the evaporation surface 1A on the evaporation surface 1A The angle (hereinafter referred to as α) on the acute angle side formed by the normal line Q and the magnetic force line X is φ ≦ α ≦ θ (φ ≦ 20 °, θ ≧ 30
Area of α = φ and the area of α = φ is surrounded by the area of α = θ, and is discharged by an arc current of a certain value or more, and the area inside α = θ is centered around α = φ. The arc spot is confined in the (substantially elliptical discharge portion 1B) for discharging.

Here, the angle φ is the minimum angle with respect to the normal line, and the angle θ is also the maximum angle. The principle of operation of the embodiment shown in FIG. 1 will be described. This principle is not definitive, but is thought to be as follows. Generally, in the region of α = θ, the action of magnetic field on the electron and ion currents forming the arc discharge (Lorentz force)
Is strong, the movement of the arc spot is strongly restrained,
Since the randomness disappears and the moving speed increases, the discharge voltage increases. The rise in discharge voltage becomes a factor that hinders discharge in that region. On the other hand, in the region of α = φ, the restraint force of the arc spot due to the Lorentz force is weak, but the discharge voltage is at a level that is almost the same as the normal voltage. Here, if the arc current is small, the action force due to the Lorentz force is superior to the discharge blocking force due to the rise in the discharge voltage, and the arc spot is restricted to the region near α = θ (in the case of θ = 90 ° in prior art 1, ).

However, when the arc current exceeds a certain value, the discharge blocking force due to the arc voltage rising exceeds the restraining force due to the Lorentz force, and the discharge voltage α lower than that in the region near α = θ. = Discharge in the vicinity of φ (φ = 0 °, magnetic force = 20 mT, discharge current = 600 A,
(See FIG. 8 which is a photograph of the discharge site observed from the side at a nitrogen pressure of 2 Pa). As a result, the arc spot randomly moves around α = φ inside the area surrounded by α = θ. Therefore, the arc spot can be reliably confined inside α = θ, and the discharge region can be installed at an appropriate position on the evaporation surface. In particular, by providing a portion where α = θ on the outer peripheral portion of the evaporation surface, abnormal discharge due to consumption of the outer peripheral surface of the evaporation surface, which is a problem in the prior art 2, is prevented, and the effective evaporation surface is effectively consumed. (White line part: α = 90 °, black line part: α = 0 °, an example of a substantially elliptical discharge region is shown in a photograph) (see FIG. 9).

Further, since the arc spot moves in a plane inside α = θ, only the part of the endless circular locus as in the case of the static magnetic field of Prior Art 1 is linear without moving the magnetic field generation source. It is possible to avoid exhaustion that is deeply scooped out. Further, in the discharge area, the direction of the arc current near the evaporation surface becomes close to the direction of the magnetic field lines, and the electrons forming the discharge are wound around the magnetic field lines at a small radius to increase the discharge current density, and the arc spot 1 In order to exceed the current density that an individual can have, the number of arc spots is split into more than the usual number (eg, 200 A has an average of about 2). As a result, the current value per arc spot decreases, and the probability of droplet generation at the arc spot and the diameter of the droplet can be greatly reduced.

Further, the arc discharge plasma is activated along the lines of magnetic force extending from the region centered on α = φ, the ionization of the evaporated vaporized substance is promoted, and a dense film can be formed on the object to be treated. . When a thick film of chromium nitride was formed by this technique, a film with good roughness was obtained compared to the conventional standard film, even if the film was thicker. That is, FIG. 10 is a micrograph of the surface of the CrN film formed according to the present invention, in which the film thickness = 76 μm, Ra (average roughness) = 0.12 μm, Rmax (maximum roughness) = 2.10.
μm. On the other hand, FIG. 11 is a photomicrograph of the surface of a conventional standard CrN film, where film thickness = 30 μm and Ra = 0.
75 μm and Rmax = 8.2 μm.

The experimental condition of FIG. 10 is that the magnetic field strength is 30 mT,
The arc current is 800 A and the voltage is 25 v, and FIG. 11 shows the magnetic field strength of 0 mT, the arc current 800 A, and the voltage 20 v. However, the target shape is φ9 in both FIGS.
It has a cylindrical shape of 0 mm × L900 mm. Further, in the present invention, it is not necessary to introduce a gas into the arc discharge, and a pressure range that completely covers the pressure range normally required for the film forming process,
For example, it has been confirmed that discharge is possible without gas introduction to a nitrogen pressure of 6 Pa or more. This is because a very high density arc plasma is formed in front of the discharge area.
It is considered that the arc plasma itself regulates the discharge form and is not affected by other discharge environments such as gas introduction.

Further, in the present invention, even if the evaporation material is consumed, the magnetic field form of the present means can be maintained, so that the above effects can be always enjoyed. In the vacuum arc evaporation source shown in FIG. 1, the strength of the magnetic field in the direction of the magnetic lines on the evaporation surface is 5
It is said to be mT (millitesla) or higher. By setting such a magnetic field strength, the discharge voltage when the arc spot moves near α = θ is surely 40 v or more, so that the arc spot is in a region where the discharge voltage is low around α = φ. The arc spot can be reliably transferred, and the arc spot can be more stably restrained by the desired evaporation surface area. In particular, it is desirable to increase the strength of the magnetic field when increasing the discharge current. For example, at 400 A, 10 mT or more is desirable, and at 800 A, 20 mT or more is desirable.

A vacuum arc vapor deposition apparatus using the evaporation source shown in FIG. 1 is shown in FIG. 2, in which the work 3 is provided on a turntable 4.
The vacuum chamber 5 rotates about the vertical axis, and an example in which the chamber 5 is used as an anode is shown. In the vacuum arc evaporation source shown in FIG. 2, the arc current value is set to 200 A or more, and due to the repulsive force between the spots caused by the generation of a plurality of arc spots, α = θ Since the arc spot cannot exist stably in the central area, α = φ
The arc spot surely shifts to the region centered around and is stably restrained by the desired evaporation surface region.

Further, in the above-mentioned vacuum arc evaporation source, θ ≧ 60 °, and with such a configuration, the discharge voltage when there is an arc spot near α = θ exceeds 40 v, The arc spot is α =
It is possible to reliably shift to a region where the discharge voltage is low around φ and to stably constrain the arc spot to a desired evaporation surface region. FIG. 3 shows an example of moving a magnetic field in the above-mentioned vacuum arc evaporation source. In FIG. 3 (1), a magnetic field including a portion of α = φ is parallel to the axis of the evaporated substance,
Alternatively, as shown in FIG. 3B, the magnetic field generation source is moved so as to rotate about an axis and move.

FIG. 4 shows the above-mentioned vacuum arc evaporation source in which the anode part of the arc discharge is moved in parallel with the axis of the evaporation material. In FIG. 4 (1), the anode itself is moved up and down. An example is shown, and FIG. 4 (2) shows an example in which the portion acting as the anode is vertically moved. FIG. 5 shows a plan view and a front view of an example in which a magnetic field generation source and an anode are synchronously rotated. In the above-mentioned vacuum arc evaporation source, the magnetic field and the anode including the part of α = φ, It is configured to rotate synchronously as a center.

FIG. 6 shows a case in which a plurality of (two in the figure) power supply units (arc power supplies 1 and 2) are provided for the columnar evaporation material, and the power supply units are switched or the current value of each power supply unit is changed. FIG. 6 shows the discharge current values I ₁ , I ₂
Is I ₁ > I ₂ or I ₁ <I ₂ . That is, if I ₁ <I _{2, the} arc spot goes downward, I ₁ > I
If it is _2, it moves upward. FIG. 7 shows a modified example of the present invention, in which a magnetic field coil is adopted as a magnetic field generation source, and the columnar evaporation material is provided in the constricted portion of the vacuum chamber with its axis centered laterally, and this constricted portion is the magnetic field generation source. Electromagnetic coils are arranged, and other configurations are common to the above-described examples.

According to the embodiments shown in FIGS. 3 to 6, the evaporation surface is consumed more uniformly and the evaporation material can be effectively used. Further, the present invention is characterized by operation at a large current,
The temperature rise of the vaporized substance due to the arc current can be made uniform throughout the vaporized substance, and the thermal stress of the vaporized substance due to the uneven distribution of the heat generation portion is reduced to prevent the occurrence of cracks. In particular, it is effective when a large-area evaporation source has a very wide range of α = φ. It is possible to use that the arc spot is distributed mainly around α = φ, and that the arc spot tends to be closer to the anode or to the side closer to the power feeding portion for the evaporated substance.

FIG. 12 shows another example of the columnar evaporation material, and FIG. 12 shows a prismatic evaporation material having a circular hollow portion inside. As described above, the shape of the evaporation material is cylindrical, prismatic, or Any solid cylinder (see FIG. 7), solid prism, flat plate, or the like can be used. 13 to 16 show an embodiment of the present invention according to claims 2 to 5. That is, in FIG. 13, the angle of the lines of magnetic force and the arc current value are set so that the arc spot is confined in the substantially strip-shaped (annular) discharge region extending in the circumferential direction of the columnar evaporation material on the evaporation surface of the columnar evaporation material. It is equipped with a magnetic field source.

More specifically with reference to FIG. 13, a magnetic field source 2 shown by a pair of permanent magnets 2 having a donut shape and an end face serving as a magnetic pole is placed so that the same magnetic poles face each other to repel magnetic force lines. And α = 0 ° at the middle position of both magnets
However, on both sides (upper and lower sides in FIG. 13), sites of α = 90 ° are formed in a band shape in the circumferential direction of the evaporation source. In this case α =
It is possible to discharge at a band-shaped portion centered at 0 ° and sandwiched by α = 90 °. FIG. 14 shows an example in which the magnets arranged facing each other have different magnetic forces (in FIG. 14, the case where the top is strengthened, but the case where the bottom is strengthened is also included).

In the embodiment of FIG. 14, in FIG.
As shown in 5, the Lorentz force acting on the arc spot (strictly speaking, the metal ion flow generated from the arc spot) when the main magnetic field direction (the sum of the components of the magnetic field lines in the target surface direction at the discharge site) is directed downward, Since it is fixed in one direction counterclockwise when viewed from above, the arc spot makes a circular motion in that direction at a substantially constant speed. However, since the Lorentz force that works here is weak, there is almost no increase in the discharge voltage as described above, and it does not become a factor that hinders discharge.

When the magnetic forces of the upper and lower magnets are equal, the main magnetic field direction is the same as the direction of the metal ion flow. Therefore, the Lorentz force does not work, so that the arc spot randomly moves in the left and right directions at the discharge site. Due to the asymmetry of the (anode) arrangement and the chamber structure, the vaporized substance may be biased in one direction and discharged. By making the upper and lower magnets have different magnetic forces, the arc spot can be surely discharged over the entire circumference of the vaporized substance. FIG. 16 shows an embodiment in which the magnets arranged facing each other have opposite poles. According to this, when the size and arrangement of the magnets are appropriately selected, the result is as shown in FIG. 16, and α = 90 ° appears at three points. It was It is expected that two discharge sites will appear, but if the magnetic force at the point of α = 90 ° in the middle is weak, the arc spot will move back and forth between the upper and lower discharge sites.

When the upper and lower magnets are made to have different magnetic forces in this magnetic field configuration (the configuration shown in FIG. 16), if the vertical magnetic force difference is large, there is no discharge site on the weak side. 13 and 1
In No. 4, since the discharge portion of the columnar evaporation material becomes a band shape, it is not necessary to rotate the columnar evaporation material and the magnetic field generation source synchronously as illustrated in FIG. However, FIG.
The anode can be moved as illustrated in the above. 13 to 14, the minimum angle φ and the maximum angle θ described above are the same as described above, and the arc current value (2
00A or more) and the strength of the magnetic field is 5 millitesla, 400 m is 10 mT or more, and 800 A is 20 mT.
The same applies to the above.

Further, in the present invention, it is free to freely combine the above-mentioned embodiments.

[0033]

As described in detail above, according to the present invention,
In order to obtain a film with a high degree of roughness even during production level film formation,
Even if a large current discharge of several 100 A to 1000 A or more is performed, the arc can be stably confined and controlled in a predetermined area on the evaporation surface, and the generation of droplets can be controlled.

[Brief description of drawings]

FIG. 1 shows an embodiment of the present invention, (1) shows a cross section of an evaporated substance and a magnetic field, (2) shows an angle of a magnetic force line with respect to a normal line, and (3) is a perspective view of an evaporation source, (4) is an arrow A view.

2 shows a vacuum arc vapor deposition apparatus using the evaporation source of FIG.

FIG. 3 shows an example of moving a magnetic field. (1) is a plan view and a front view of axial parallel movement (including relative movement), and (2) rotational movement around an axis (including relative rotation). is there.

FIG. 4 shows an example of moving an anode, (1) is vertical movement (including horizontal movement) of the anode itself, and (2) is vertical movement (including horizontal movement) of a portion acting as an anode.

5A and 5B are a plan view and a front view for synchronously rotating a magnetic field generation source and an anode.

FIG. 6 is an explanatory diagram in which a plurality of power supply units are provided on the evaporation material.

FIG. 7 is a configuration diagram showing another example of the present invention.

FIG. 8 is a photograph of a discharge site observed from the side.

FIG. 9 is a photograph of a discharge area.

FIG. 10 is a photomicrograph of the surface of the CrN film according to the present invention.

FIG. 11 is a photomicrograph of the surface of a conventional standard CrN film.

FIG. 12 is a cross-sectional view of a prismatic evaporation material.

13 shows an embodiment according to claim 2, (1) is a perspective view, (2) is a plan view, and (3) is a front view.

FIG. 14 shows an example in which upper and lower magnets have different magnetic forces,
(1) is a perspective view, (2) is a plan view, and (3) is a front view.

FIG. 15 is a diagram for explaining the operation of FIG.

FIG. 16 is a semi-broken front view when the upper and lower magnets are opposed to each other with different poles.

[Explanation of symbols]

1 Column evaporation material 2 Magnetic field source

Claims (13)

[Claims] 1. A vacuum arc evaporation source for discharging by forming a magnetic field in a region including an evaporation surface of a columnar evaporation material, wherein the evaporation surface of the columnar evaporation material has a substantially oval shape extending in the axial direction of the columnar evaporation material. A vacuum arc evaporation source characterized by comprising a magnetic field generation source in which the angle of the magnetic force lines and the arc current value are set so that the arc spot is confined in the discharge area. 2. A vacuum arc evaporation source for forming a magnetic field in a region including an evaporation surface of a columnar evaporation material for discharging, wherein the evaporation surface of the columnar evaporation material has a substantially strip-shaped discharge extending in a circumferential direction of the columnar evaporation material. A vacuum arc evaporation source characterized by comprising a magnetic field generation source in which an angle of magnetic force lines and an arc current value are set so as to confine an arc spot in an area. 3. The vacuum arc evaporation source according to claim 2, wherein the permanent magnet is a magnetic field generation source that arranges two pairs of permanent magnets so that the same magnetic poles face each other to repel magnetic force lines. 4. The vacuum arc evaporation source according to claim 3, wherein the magnets arranged to face each other have different magnetic forces. 5. The vacuum arc evaporation source according to claim 2, wherein the magnets arranged to face each other have different polarities. 6. The vacuum arc evaporation source according to claim 1, wherein the strength of the magnetic field on the evaporation surface is 5 millitesla or more. 7. The vacuum arc evaporation source according to claim 1, wherein an arc current value is 200 A or more. 8. The maximum angle θ of the magnetic lines of force with respect to the normal line on the evaporation surface is θ ≧ 60 °.
Or the vacuum arc evaporation source according to 2. 9. A magnetic field including a minimum angle φ portion of a magnetic line of force with respect to a normal line on the evaporation surface is moved in parallel with or rotated about the axis of the columnar evaporation material. The vacuum arc evaporation source described. 10. The vacuum arc evaporation source according to claim 2, wherein a magnetic field including a portion of a minimum angle φ of a magnetic line of force with respect to a normal line on the evaporation surface is moved in parallel with an axis of the columnar evaporation material. 11. The vacuum arc evaporation source according to claim 1, wherein the anode part of the arc discharge is moved in parallel with the axis of the columnar evaporation material. 12. A magnetic field including a portion of a minimum angle φ of a magnetic line of force with respect to a normal line on an evaporation surface and an anode are synchronously rotated about an axis of a columnar evaporation material.
Vacuum arc evaporation source according to. 13. The vacuum arc evaporation source according to claim 1, wherein a plurality of power supply units are provided for the columnar evaporation material, and the power supply units are switched or the current value of each power supply unit is changed. .