JP2003188494A - Method of preparing electrolytic corrosion test sample from defect generating base material of through hole section of printed board - Google Patents

Method of preparing electrolytic corrosion test sample from defect generating base material of through hole section of printed board

Info

Publication number
JP2003188494A
JP2003188494A JP2001387883A JP2001387883A JP2003188494A JP 2003188494 A JP2003188494 A JP 2003188494A JP 2001387883 A JP2001387883 A JP 2001387883A JP 2001387883 A JP2001387883 A JP 2001387883A JP 2003188494 A JP2003188494 A JP 2003188494A
Authority
JP
Japan
Prior art keywords
printed board
corrosion test
electrolytic corrosion
glass cloth
test sample
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001387883A
Other languages
Japanese (ja)
Inventor
Akira Inami
章 稲見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2001387883A priority Critical patent/JP2003188494A/en
Publication of JP2003188494A publication Critical patent/JP2003188494A/en
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of preparing electrolytic corrosion test samples from which the declined insulation reliability of glass cloth which is in contact with the through hole of a printed board using a glass epoxy copper-plated laminated plate and the occurrence of copper migration in the glass cloth can be detected when hollow fibers occur in threads of the glass cloth. <P>SOLUTION: In this method, the electrolytic corrosion test sample from which the declined insulation reliability of the glass cloth and the occurrence of copper migration in the cloth can be detected when hollow fibers occur in threads of the glass cloth which is in contact with the plated through hole of the printed board using a glass epoxy copper-plated laminated plate are prepared during a swelling time of ≥6 minutes by using swelling liquid heated to ≥80°C in the de-smearing step of a printed board manufacturing process. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】 【0001】 【発明の属する技術分野】本発明は、スルーホール部基
材欠陥発生品の電食試験サンプル作製方法に関する。 【0002】 【従来の技術】ガラスエポキシ銅張り積層板を使用した
プリント板にて、基材に使用しているガラスクロスの糸
にホローファイバーが確認された場合、信頼性の確認と
して電食試験を実施する。従来、試験サンプルは、一般
的なプリント板製造方法である銅張り積層板の穴あけ、
デスミア工程、スルーホールメッキ、回路加工により作
製し電食試験を実施する方法が採用されている。特に、
デスミアの膨潤については、スウェラーあるいは膨潤液
といわれるデスミア液にて処理するが、この膨潤処理液
温度は60〜80℃で処理時間は2〜5分が一般的であ
る。 【0003】 【発明が解決しようとする課題】ところが、一般的なプ
リント板製造方法のデスメア工程により作製した試験サ
ンプルでの電食試験では、スルーホールメッキに接触し
ているガラスクロスの糸にホローファイバーが発生して
も、膨潤液温度が低く膨潤処理時間が短いため、溶剤系
のアルカリ液の浸透性が低いことから絶縁信頼性低下お
よび銅マイグレーションを検出することができないとい
う課題がある。本発明は、ガラスエポキシ銅張り積層板
を使用したプリント板にて、スルーホールと接触するガ
ラスクロスの糸に、ホローファイバーが発生している場
合の絶縁信頼性低下および銅マイグレーションを検出可
能とする電食試験サンプルの作製方法を提供することを
目的とする。 【0004】 【課題を解決するための手段】本発明のデスミア処理の
膨潤は、スウェラーあるいは膨潤液といわれるデスミア
液に処理する前に、デスミア性を加速するために用いら
れる処理条件に関するものである。具体的には、スルー
ホール部の基材のガラスクロスの糸に、ホローファイバ
ーが発生している場合の電食試験サンプルの作製方法を
特徴とする。本発明者らは、スルーホール部の基材のガ
ラスクロスの糸に、ホローファイバーが発生しているプ
リント板のマイグレーション検出方法について種々実験
を行った結果、プリント板製造時のデスメア工程の膨潤
液の温度を高くし、膨潤時間を長くすることによって、
通常では検出できない絶縁信頼性低下および銅マイグレ
ーションが検出可能となることを見出し、本発明に至っ
た。 【0005】 【発明の実施の形態】本発明のデスメア処理の膨潤は、
一般的にスウェラーあるいは膨潤液と言われるデスミア
液に処理する前にデスミア性を加速するために用いられ
る処理工程がある。スウェラーあるいは膨潤液は、溶剤
系のアルカリ液が用いられる場合が多い。例えば、水6
〜8割、ジエチレングリコールモノブチルエーテル2〜
4割、カセイソーダ2〜10kg/l、液温80〜90
℃、処理時間6〜30分で処理する。この溶剤系のアル
カリ液は、樹脂またはガラスクロスの糸のクラックへの
浸透性が高いが、確実に浸透するように液温度を高くし
処理時間を長くする。その後、過マンガン酸で溶解す
る。 【0006】 【実施例】ガラスクロスの糸にホローファイバーが確認
された銅張り積層板を用い、ドリル穴あけ後デスミア工
程の膨潤条件を、水7割、ジエチレングリコールモノブ
チルエーテル3割、カセイソーダ5g/l、液温80
℃、処理時間15分で処理したものを過マンガン酸液で
溶解しスルーホールメッキした後、回路形成したスルー
ホール壁間0.5mm、1000穴の電食試験サンプル
において、85℃85%RH、DC5V印加で電食試験
を実施したところ、100時間で絶縁抵抗が105 Ω以
下になることが確認された。また、このサンプルの絶縁
低下した箇所のスルーホール部について表面より研磨し
観察した結果、ホローファイバーの箇所に銅のマイグレ
ーションが発生していることが確認された。また、上記
同一銅張り積層板を用い、上記同一デスミア工程にて膨
潤液の処理温度を70℃、処理時間を5分で処理したも
のについて、上記同一電食試験を確認した結果、500
時間処理しても絶縁抵抗が1010Ω以上で絶縁信頼性低
下が確認されなかった。 【0007】 【発明の効果】以上のように、本発明のデスミア工程の
膨潤処理温度を高くし、処理時間を長くして作製した電
食試験サンプルは、スルーホールに接触したガラスクロ
スの糸のホローファイバーに対して溶剤系のアルカリ液
の浸透性が向上するため、確実に絶縁信頼性低下が確認
できる。
Description: BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a method for producing an electrolytic corrosion test sample of a product having a defect in a through-hole base material. 2. Description of the Related Art In a printed board using a glass epoxy copper-clad laminate, if hollow fibers are found in a glass cloth thread used as a base material, an electrolytic corrosion test is performed to confirm reliability. Is carried out. Conventionally, test samples were drilled in copper-clad laminates, a common printed board manufacturing method,
A method of performing an electrolytic corrosion test using a desmear process, through-hole plating, and circuit processing has been adopted. In particular,
Regarding the swelling of desmear, treatment is performed with a desmear solution called a swerler or a swelling solution. The temperature of the swelling solution is generally 60 to 80 ° C., and the treatment time is generally 2 to 5 minutes. [0003] However, in an electrolytic corrosion test using a test sample prepared by the desmear process of a general printed board manufacturing method, a hollow of glass cloth in contact with through-hole plating is hollowed out. Even if fibers are generated, the swelling liquid temperature is low and the swelling time is short, and therefore, there is a problem that insulation reliability is lowered and copper migration cannot be detected due to low permeability of the solvent-based alkaline liquid. The present invention makes it possible to detect a decrease in insulation reliability and copper migration when a hollow fiber is generated in a thread of a glass cloth in contact with a through hole in a printed board using a glass epoxy copper-clad laminate. An object of the present invention is to provide a method for preparing an electrolytic corrosion test sample. [0004] The swelling of the desmear treatment of the present invention relates to the treatment conditions used for accelerating the desmear property before the desmear treatment, which is called a swerler or swelling liquid, is applied. . Specifically, the method is characterized by a method of preparing an electrolytic corrosion test sample in a case where hollow fibers are generated in a glass cloth thread of a base material in a through hole portion. The present inventors have conducted various experiments on a method of detecting migration of a printed board in which hollow fibers are generated in a glass cloth thread of a base material of a through-hole portion. By increasing the temperature of the
The present inventors have found that a decrease in insulation reliability and copper migration that cannot be normally detected can be detected, and have led to the present invention. [0005] The swelling of the desmear treatment of the present invention is as follows:
There is a processing step used to accelerate desmear property before processing into a desmear liquid generally called a swerler or swelling liquid. As the sweller or the swelling liquid, a solvent-based alkaline liquid is often used. For example, water 6
~ 80%, diethylene glycol monobutyl ether 2-
40%, caustic soda 2-10 kg / l, liquid temperature 80-90
The treatment is performed at a temperature of 6 ° C. for 6 to 30 minutes. This solvent-based alkaline liquid has a high permeability to cracks of resin or glass cloth yarns, but the liquid temperature is increased and the processing time is lengthened to ensure penetration. Then, dissolve with permanganate. [0006] Using a copper-clad laminate in which hollow fibers were confirmed as the yarn of the glass cloth, the swelling conditions of the desmear process after drilling were as follows: water 70%, diethylene glycol monobutyl ether 30%, caustic soda 5g / l, Liquid temperature 80
After processing at 15 ° C. for 15 minutes and dissolving with a permanganic acid solution and plating through holes, a circuit formed through hole between 0.5 mm and 1000 holes in an electrolytic corrosion test sample at 85 ° C. and 85% RH was used. When an electrolytic corrosion test was performed with DC 5 V applied, it was confirmed that the insulation resistance became 10 5 Ω or less in 100 hours. In addition, as a result of polishing and observing the through-hole portion of the sample where the insulation was reduced from the surface, it was confirmed that copper migration occurred at the hollow fiber portion. In addition, the same electrolytic corrosion test was performed on the same copper-clad laminate, which was treated in the same desmearing step at a processing temperature of 70 ° C. and a processing time of 5 minutes.
Even after the time treatment, the insulation resistance was 10 10 Ω or more, and no decrease in insulation reliability was confirmed. As described above, the electrolytic corrosion test sample prepared by increasing the swelling temperature in the desmear process of the present invention and lengthening the processing time is the same as the glass cloth thread in contact with the through hole. Since the permeability of the solvent-based alkaline liquid to the hollow fiber is improved, a decrease in insulation reliability can be surely confirmed.

Claims (1)

【特許請求の範囲】 【請求項1】ガラスエポキシ樹銅張り積層板を使用した
プリント板にて、スルーホールメッキと接触しているガ
ラスクロスの糸にホローファイバーが発生していた場
合、絶縁信頼性低下および銅マイグレーションを検出可
能とするプリント板製造工程のデスミア工程での膨潤処
理液温度80℃以上、膨潤処理時間6分以上で作成する
電食試験サンプル作製方法。
Claims: 1. In a printed board using a glass epoxy copper-clad laminate, if hollow fibers are generated in a glass cloth thread that is in contact with through-hole plating, the insulation reliability is reduced. A method for preparing an electrolytic corrosion test sample in which a swelling solution temperature is 80 ° C. or more and a swelling time is 6 minutes or more in a desmearing step of a printed board manufacturing process that enables detection of deterioration in properties and copper migration.
JP2001387883A 2001-12-20 2001-12-20 Method of preparing electrolytic corrosion test sample from defect generating base material of through hole section of printed board Pending JP2003188494A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001387883A JP2003188494A (en) 2001-12-20 2001-12-20 Method of preparing electrolytic corrosion test sample from defect generating base material of through hole section of printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001387883A JP2003188494A (en) 2001-12-20 2001-12-20 Method of preparing electrolytic corrosion test sample from defect generating base material of through hole section of printed board

Publications (1)

Publication Number Publication Date
JP2003188494A true JP2003188494A (en) 2003-07-04

Family

ID=27596576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001387883A Pending JP2003188494A (en) 2001-12-20 2001-12-20 Method of preparing electrolytic corrosion test sample from defect generating base material of through hole section of printed board

Country Status (1)

Country Link
JP (1) JP2003188494A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7776606B2 (en) * 2006-03-03 2010-08-17 Concurrent Technologies Corporation Processes to create discrete corrosion defects on substrates and establish corrosion NDI test standards

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7776606B2 (en) * 2006-03-03 2010-08-17 Concurrent Technologies Corporation Processes to create discrete corrosion defects on substrates and establish corrosion NDI test standards
US8448490B2 (en) 2006-03-03 2013-05-28 Concurrent Technologies Corporation Processes to create discrete corrosion defects on substrates and establish corrosion NDI test standards
US8532952B2 (en) 2006-03-03 2013-09-10 Concurrent Technologies Corporation Processes to create discrete corrosion defects on substrates and establish corrosion NDI test standards

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