JP2003188227A5 - - Google Patents

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Publication number
JP2003188227A5
JP2003188227A5 JP2002315860A JP2002315860A JP2003188227A5 JP 2003188227 A5 JP2003188227 A5 JP 2003188227A5 JP 2002315860 A JP2002315860 A JP 2002315860A JP 2002315860 A JP2002315860 A JP 2002315860A JP 2003188227 A5 JP2003188227 A5 JP 2003188227A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002315860A
Other versions
JP4370086B2 (ja
JP2003188227A (ja
Filing date
Publication date
Priority claimed from US10/016,610 external-priority patent/US6821082B2/en
Application filed filed Critical
Publication of JP2003188227A publication Critical patent/JP2003188227A/ja
Publication of JP2003188227A5 publication Critical patent/JP2003188227A5/ja
Application granted granted Critical
Publication of JP4370086B2 publication Critical patent/JP4370086B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002315860A 2001-10-30 2002-10-30 ウェーハ管理システムおよびウェーハ管理方法 Expired - Fee Related JP4370086B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/016610 2001-10-30
US10/016,610 US6821082B2 (en) 2001-10-30 2001-10-30 Wafer management system and methods for managing wafers

Publications (3)

Publication Number Publication Date
JP2003188227A JP2003188227A (ja) 2003-07-04
JP2003188227A5 true JP2003188227A5 (ja) 2005-12-15
JP4370086B2 JP4370086B2 (ja) 2009-11-25

Family

ID=21778026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002315860A Expired - Fee Related JP4370086B2 (ja) 2001-10-30 2002-10-30 ウェーハ管理システムおよびウェーハ管理方法

Country Status (2)

Country Link
US (1) US6821082B2 (ja)
JP (1) JP4370086B2 (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6761085B1 (en) * 2002-02-06 2004-07-13 Novellus Systems Incorporated Method and apparatus for damping vibrations in a semiconductor wafer handling arm
JP4096359B2 (ja) * 2003-03-10 2008-06-04 セイコーエプソン株式会社 製造対象物の製造装置
US6990721B2 (en) * 2003-03-21 2006-01-31 Brooks Automation, Inc. Growth model automated material handling system
US6931303B2 (en) * 2003-10-02 2005-08-16 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated transport system
JP4490124B2 (ja) * 2004-01-23 2010-06-23 セイコーエプソン株式会社 搬送状況提示システムおよび方法、プログラム並びに情報記憶媒体
DE102004057754B4 (de) * 2004-11-30 2007-08-09 Steag Hama Tech Ag Verfahren und Vorrichtung zum Behandeln von ein Innenloch aufweisenden Substratscheiben
JP4666213B2 (ja) * 2005-07-05 2011-04-06 株式会社ダイフク 物品収納設備
US20080107507A1 (en) * 2005-11-07 2008-05-08 Bufano Michael L Reduced capacity carrier, transport, load port, buffer system
US8267634B2 (en) 2005-11-07 2012-09-18 Brooks Automation, Inc. Reduced capacity carrier, transport, load port, buffer system
US20070201967A1 (en) * 2005-11-07 2007-08-30 Bufano Michael L Reduced capacity carrier, transport, load port, buffer system
WO2007056443A2 (en) * 2005-11-07 2007-05-18 Brooks Automation, Inc. Reduced capacity carrier, transport, load port, buffer system
WO2007114293A1 (ja) * 2006-03-31 2007-10-11 Youthengineering Co., Ltd. ウエハー用保管庫及びその保管制御方法
JP2007317944A (ja) * 2006-05-26 2007-12-06 Toshiba Corp 局所クリーン化ロボット搬送工場及びロボット搬送式製造方法
WO2008024225A2 (en) 2006-08-18 2008-02-28 Brooks Automation, Inc. Reduced capacity carrier, transport, load port, buffer system
JP4670808B2 (ja) * 2006-12-22 2011-04-13 ムラテックオートメーション株式会社 コンテナの搬送システム及び測定用コンテナ
DE102007035836B4 (de) * 2007-07-31 2017-01-26 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Zweidimensionale Transferstation, die als Schnittstelle zwischen einer Prozessanlage und einem Transportsystem dient, und Verfahren zum Betreiben der Station
CN104979232B (zh) * 2014-04-02 2017-09-22 中芯国际集成电路制造(上海)有限公司 晶圆传送盒的存储方法及实现晶圆传送盒存储的系统

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4178113A (en) * 1977-12-05 1979-12-11 Macronetics, Inc. Buffer storage apparatus for semiconductor wafer processing
US4293249A (en) * 1980-03-03 1981-10-06 Texas Instruments Incorporated Material handling system and method for manufacturing line
US5536128A (en) * 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
US5668056A (en) * 1990-12-17 1997-09-16 United Microelectronics Corporation Single semiconductor wafer transfer method and manufacturing system
ATE129361T1 (de) * 1992-08-04 1995-11-15 Ibm Fertigungsstrasse architektur mit vollautomatisierten und rechnergesteuerten fördereinrichtungen geeignet für abdichtbaren tragbaren unter druck stehenden behältern.
US6157866A (en) * 1997-06-19 2000-12-05 Advanced Micro Devices, Inc. Automated material handling system for a manufacturing facility divided into separate fabrication areas
DE59706043D1 (de) * 1997-07-28 2002-02-21 Infineon Technologies Ag Transportsystem und Verfahren zur Steuerung des Transportsystems
JPH11121582A (ja) * 1997-10-15 1999-04-30 Mitsubishi Electric Corp 半導体ウェハ製造設備制御方法および半導体ウェハ製造設備
US6223886B1 (en) * 1998-06-24 2001-05-01 Asyst Technologies, Inc. Integrated roller transport pod and asynchronous conveyor
US6016611A (en) * 1998-07-13 2000-01-25 Applied Komatsu Technology, Inc. Gas flow control in a substrate processing system
DE19922936B4 (de) * 1999-05-19 2004-04-29 Infineon Technologies Ag Anlage zur Bearbeitung von Wafern
US6354781B1 (en) * 1999-11-01 2002-03-12 Chartered Semiconductor Manufacturing Company Semiconductor manufacturing system

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