JP2003183576A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2003183576A5 JP2003183576A5 JP2001389929A JP2001389929A JP2003183576A5 JP 2003183576 A5 JP2003183576 A5 JP 2003183576A5 JP 2001389929 A JP2001389929 A JP 2001389929A JP 2001389929 A JP2001389929 A JP 2001389929A JP 2003183576 A5 JP2003183576 A5 JP 2003183576A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001389929A JP2003183576A (ja) | 2001-12-21 | 2001-12-21 | プライマー組成物、接着方法、接着物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001389929A JP2003183576A (ja) | 2001-12-21 | 2001-12-21 | プライマー組成物、接着方法、接着物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003183576A JP2003183576A (ja) | 2003-07-03 |
| JP2003183576A5 true JP2003183576A5 (ja) | 2005-07-28 |
Family
ID=27598001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001389929A Pending JP2003183576A (ja) | 2001-12-21 | 2001-12-21 | プライマー組成物、接着方法、接着物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003183576A (ja) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5165208B2 (ja) * | 2006-03-31 | 2013-03-21 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | プライマー組成物、それを用いて得られる物品およびそれを用いる金属基体の保護方法 |
| JP5213351B2 (ja) * | 2006-11-28 | 2013-06-19 | 株式会社朝日ラバー | 接着用基材及びそれを用いたシリコーンゴム接着体 |
| JP4762922B2 (ja) * | 2007-01-12 | 2011-08-31 | 信越ポリマー株式会社 | 電子機器用部品 |
| US9631128B2 (en) | 2007-02-09 | 2017-04-25 | Ngk Insulators, Ltd. | Bonding material and semiconductor supporting device |
| JP5016510B2 (ja) * | 2007-02-09 | 2012-09-05 | 日本碍子株式会社 | 半導体支持装置 |
| JP5162213B2 (ja) * | 2007-11-22 | 2013-03-13 | マツモトファインケミカル株式会社 | プライマー組成物 |
| EP2324071B2 (en) * | 2008-09-10 | 2022-05-04 | Dow Global Technologies LLC | Improved process for bonding reactive adhesives to substrates |
| JP2010261015A (ja) * | 2009-04-07 | 2010-11-18 | Seiko Instruments Inc | チタン系表面処理剤 |
| JP2012193266A (ja) * | 2011-03-16 | 2012-10-11 | Tokyu Construction Co Ltd | 浸透性の透明塗料の塗布量管理塗料と管理方法 |
| US11078386B2 (en) | 2018-10-05 | 2021-08-03 | Hamilton Sundstrand Corporation | Additive for quality determination of adhesive bond primers |
-
2001
- 2001-12-21 JP JP2001389929A patent/JP2003183576A/ja active Pending