JP2003183401A5 - - Google Patents
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- Publication number
- JP2003183401A5 JP2003183401A5 JP2001386912A JP2001386912A JP2003183401A5 JP 2003183401 A5 JP2003183401 A5 JP 2003183401A5 JP 2001386912 A JP2001386912 A JP 2001386912A JP 2001386912 A JP2001386912 A JP 2001386912A JP 2003183401 A5 JP2003183401 A5 JP 2003183401A5
- Authority
- JP
- Japan
- Prior art keywords
- ethanol solution
- potassium hydroxide
- cured product
- product according
- acid value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Description
【００１３】
［１１］ ［１］〜［８］のいずれか一つに記載の硬化性樹脂組成物を含むレジストインク。
［１２］ ［９］または［１０］に記載の硬化物からなるソルダーレジスト。
［１３］ ［９］または［１０］に記載の硬化物からなる保護膜。
［１４］ ［９］または［１０］に記載の硬化物［で一部分、または全面が被覆されたプリント配線基板。[0013]
[11] A resist ink comprising the curable resin composition according to any one of [1] to [ 8 ].
[12] A solder resist comprising the cured product according to [9] or [10].
[13] A protective film comprising the cured product according to [9] or [10].
[14] A printed wiring board partially or entirely coated with the cured product according to [9] or [10].
【００２９】
なお、本明細書を通して、樹脂の酸価は以下の方法により測定したものである。１００ｍｌ三角フラスコに試料約０．２ｇを精密天秤にて精秤し、これにピリジン１０ｍｌを加えて溶解する。更に、この容器に指示薬としてフェノールフタレインエタノール溶液を１〜３滴添加し、試料が均一になるまで十分に攪拌する。これを、０．０５Ｎ水酸化カリウム−エタノール溶液で滴定し、指示薬の微紅色が３０秒間続いたときを、中和の終点とする。その結果を下記の計算式を用いて得た値を、樹脂の酸価とする。
酸価（ｍｇＫＯＨ／ｇ）＝〔Ｂ×ｆ×５．６１１〕／Ｓ
Ｂ：０．０５Ｎ水酸化カリウム−エタノール溶液の使用量（ｍｌ）
ｆ：０．０５Ｎ水酸化カリウム−エタノール溶液のファクター
Ｓ：試料の採取量（ｇ）[0029]
In addition, the acid value of resin is measured by the following method throughout this specification. About 0.2 g of a sample is precisely weighed in a 100 ml Erlenmeyer flask using a precision balance, and 10 ml of pyridine is added to dissolve it. Further, 1 to 3 drops of a phenolphthalein ethanol solution as an indicator are added to the container, and the mixture is sufficiently stirred until the sample becomes uniform. This is titrated with a 0.05 N potassium hydroxide-ethanol solution, and the end point of neutralization is taken when the slight pink color of the indicator lasts for 30 seconds. The value obtained by using the following calculation formula as the result is taken as the acid value of the resin.
Acid value (mg KOH / g) = [B x f x 5.611] / S
B: Use amount of 0.05 N potassium hydroxide-ethanol solution (ml)
f: Factor S of 0.05 N potassium hydroxide-ethanol solution: Collection amount of sample (g)
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001386912A JP2003183401A (en) | 2001-12-20 | 2001-12-20 | Curable resin composition and cured product thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001386912A JP2003183401A (en) | 2001-12-20 | 2001-12-20 | Curable resin composition and cured product thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003183401A JP2003183401A (en) | 2003-07-03 |
| JP2003183401A5 true JP2003183401A5 (en) | 2005-03-17 |
Family
ID=27595904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001386912A Pending JP2003183401A (en) | 2001-12-20 | 2001-12-20 | Curable resin composition and cured product thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003183401A (en) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004359742A (en) * | 2003-06-03 | 2004-12-24 | Fujitsu Ltd | Conductive resin composition, conductive membrane, and electronic device |
| JP3849789B2 (en) * | 2003-10-20 | 2006-11-22 | 東洋紡績株式会社 | Laminated body |
| JP4701632B2 (en) * | 2004-05-17 | 2011-06-15 | 凸版印刷株式会社 | Photosensitive resin composition for resistance element and laminate or element built-in substrate using the same |
| JP4557614B2 (en) * | 2004-06-28 | 2010-10-06 | 旭化成ケミカルズ株式会社 | Filler |
| JP4504275B2 (en) * | 2005-07-06 | 2010-07-14 | 株式会社有沢製作所 | Photosensitive thermosetting resin composition, photosensitive coverlay using the composition, and flexible printed wiring board |
| JP5237790B2 (en) * | 2006-03-16 | 2013-07-17 | 昭和電工株式会社 | Surface protection film of flexible circuit board |
| EP2182019B1 (en) * | 2007-07-18 | 2018-02-21 | Showa Denko K.K. | Heat curable resin compositon |
| JP5201396B2 (en) * | 2008-04-25 | 2013-06-05 | 日立化成株式会社 | Photosensitive resin composition, photosensitive permanent resist using the same, and photosensitive film |
| JP2013035974A (en) * | 2011-08-10 | 2013-02-21 | Tokai Rubber Ind Ltd | Flexible conductive material |
| JP5507023B1 (en) * | 2013-08-28 | 2014-05-28 | 太陽インキ製造株式会社 | Photosensitive resin composition, dry film, cured product, and printed wiring board |
| JP6345947B2 (en) * | 2014-02-27 | 2018-06-20 | 株式会社タムラ製作所 | Photosensitive resin composition |
| KR102029853B1 (en) * | 2016-10-31 | 2019-10-08 | 스미또모 베이크라이트 가부시키가이샤 | Thermally Conductive Pastes and Electronic Devices |
| JP6789193B2 (en) * | 2017-08-09 | 2020-11-25 | 太陽インキ製造株式会社 | Photosensitive resin compositions, dry films, cured products, and printed wiring boards |
| JP6637087B2 (en) | 2018-02-08 | 2020-01-29 | 株式会社ノリタケカンパニーリミテド | Photosensitive composition and its use |
| JP2019196444A (en) * | 2018-05-09 | 2019-11-14 | 太陽インキ製造株式会社 | Curable resin composition, dry film, cured product and electronic component |
| WO2022070593A1 (en) | 2020-09-30 | 2022-04-07 | 富士フイルム株式会社 | Ink set, laminate, and method for producing laminate |
| JP7043568B2 (en) * | 2020-11-02 | 2022-03-29 | 太陽インキ製造株式会社 | Photosensitive resin compositions, dry films, cured products, and printed wiring boards |
| CN116218333A (en) * | 2023-01-10 | 2023-06-06 | 江南大学 | Photo-curing coating and preparation method thereof |
-
2001
- 2001-12-20 JP JP2001386912A patent/JP2003183401A/en active Pending
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