JP2003178671A - Method of manufacturing for plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a plasma display panel holding the shape of a raised dielectric layer patterned in a baking process, and sufficiently displaying a function suppressing the spreading of discharge on a bus electrode. <P>SOLUTION: When a first dielectric layer 14a and a second dielectric layer 15a having the specified pattern are laminated on a substrate 11 on which electrodes 12, 13 having the specified patterns of a plasma display panel are formed, a non-photosensitive resin layer 14 containing first glass material and a photosensitive resin layer 15 containing a second glass material and a filler are formed on an electrode forming surface of the substrate 11, the photosensitive resin layer 15 is exposed and developed with a mask 16a having the specified pattern, the photosensitive resin layer 15 is patterned, and the non- photosensitive resin layer 14 and the photosensitive resin layer 15 are simultaneously baked to form the first dielectric layer 14a and the second dielectric layer 15a having the specified pattern. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a plasma display panel, and more particularly to a method for manufacturing a plasma display panel to which formation of a dielectric layer and a raised dielectric layer can be applied.

[0002]

2. Description of the Related Art The structure of a conventional plasma display panel will be described with reference to the drawings. FIG. 5 is a plan view schematically showing a conventional cell structure of a surface discharge plasma display panel, FIG. 6 is a sectional view taken along line VV of FIG. 5, and FIG. 7 is taken along line WW of FIG. FIG. 5 to 7, the front glass substrate 1 which is the display surface
On the back surface of 10, a plurality of row electrode pairs (X, Y) are arranged so as to extend in the row direction (horizontal direction, display line L direction).

The row electrode X is an ITO formed in a T shape.
And the like, and a bus electrode Xb made of a metal film extending in the row direction and connected to the end of the narrow portion of the transparent electrode Xa. Similarly, the row electrode Y includes a transparent electrode Ya formed of a transparent conductive film such as ITO formed in a T shape and a bus formed of a metal film extending in the row direction and connected to the end of the narrow portion of the transparent electrode Ya. Electrode Yb
It is composed by. The row electrodes X and Y are arranged alternately in the column direction (vertical direction), and the transparent electrodes X and
a and Ya extend in the vertical direction so as to face each other in each discharge cell C, and the wide portions of the transparent electrodes Xa and Ya face each other via the discharge gap G.

A dielectric layer is further formed on the rear surface of the front glass substrate so as to cover the row electrode pair (X, Y), and bus electrodes Xb and Yb are formed on the dielectric layer. The raised dielectric layer 111A extends in the horizontal direction at the facing position and at the position facing the region (between the bus electrodes) surrounded by the bus electrodes Xb and Yb between the row electrode pairs (between the display lines L). Has been formed. This raised dielectric layer 11
1A suppresses the spread of discharge and prevents erroneous discharge of the adjacent discharge cells C.

The dielectric layer 111 is formed by uniformly applying a low melting point glass paste to a predetermined thickness, drying it, and firing it at a predetermined temperature.
A is formed by screen-printing a low-melting-point glass paste on the dielectric layer 111 to a predetermined thickness, drying, and then firing. A protective layer 112 made of MgO is formed on the surfaces of the dielectric layer 111 and the raised dielectric layer 111A.

On the other hand, the front glass substrate 110 and the discharge space S
On the rear glass substrate 113 which is arranged to face each other via the column electrodes D, the column electrodes D are arranged at the positions facing the transparent electrodes Xa and Ya forming the pairs of the row electrode pairs (X, Y). They extend in a direction orthogonal to (column direction, vertical direction) and are arranged in parallel with each other at a predetermined interval. Further, the rear glass substrate 113 includes the rear glass substrate 11
White dielectric layer 114 covering the inner surface of the column 3 and the column electrode D
And a partition wall 115 is formed on the dielectric layer 114. The white dielectric layer 114 is formed by uniformly applying a glass paste containing a white pigment to the inner surface of the rear glass substrate 113 and the column electrodes D, drying the paste, and then firing the paste at a predetermined temperature.

The partition 115 is formed so as to extend in the vertical direction at a position between the column electrodes D arranged in parallel with each other. The partition wall 115 divides the discharge space S along the display line L into discharge cells C. The partition wall 115 extending in the vertical direction in a strip shape is formed by uniformly coating and drying a glass paste containing a white pigment on the dielectric layer 114 to a predetermined thickness, and then sandblasting the glass layer through a mask having a predetermined pattern. Is selectively cut, a partition pattern is formed, and then firing is performed at a predetermined temperature. A phosphor layer 116 is formed on the side surface of the partition wall 115 facing the discharge space S and the surface of the dielectric layer 114. The color of the phosphor layer 116 is R for each discharge cell C,
The colors G and B are set so as to be sequentially arranged in the display line L direction.

In the above plasma display panel, each row electrode pair (X, Y) constitutes one display line L of the matrix display screen, and one row electrode pair (X, Y) and each column electrode D are respectively intersected with each other. Two discharge cells C are formed.

[0009]

In the conventional manufacturing method for manufacturing the above plasma display panel, the dielectric layer (the dielectric layer covering the row electrode pairs X and Y) is provided on the front glass substrate 110 side. ) 111 and the raised dielectric layer 111A, or the rear glass substrate 1
On the 13 side, when forming the white dielectric layer (dielectric layer that covers the column electrodes D) 114 and the partition 115, the application, drying, and firing of the glass paste were repeatedly performed by respective independent steps. .

Therefore, the conventional method of manufacturing a plasma display panel has a problem that the number of steps is large and the working efficiency is poor. Further, since the firing process is repeatedly performed, the row electrode pair (X, Y) and the raised dielectric layer 111A are formed.
Between the column electrodes D or between the column electrodes D and the partition walls 115 has been a problem.

To solve these problems, for example,
Dielectric layer 111 and patterned raised dielectric layer 1
It is possible to fire 11A and 11A simultaneously. Next, as an example of the cell structure in the case of simultaneous firing as described above, FIG. 8 shows a cross section at a position where the bus electrodes Xb and Yb on the front glass substrate 110 side face each other. As shown in FIG. 8, the dielectric layer 111 and the raised dielectric layer 111A patterned.
If both and are fired at the same time, the edge portion 111B of the raised dielectric layer 111A formed after firing may sag. If the edge portion 111B sags, the function of suppressing the spread of discharge onto the bus electrodes (Xb, Yb), which is the original function of the raised dielectric layer 111A, may be insufficient.

The present invention has been made to solve the above problems, and its purpose is to maintain the shape of the second dielectric layer (bulk dielectric layer) having a predetermined pattern in the firing step. And a method of manufacturing a plasma display panel capable of sufficiently exhibiting the original function of the raised dielectric layer (the function of suppressing the spread of discharge on the bus electrode).

[0013]

A method of manufacturing a plasma display panel according to the present invention comprises, as described in claim 1, a first method for forming a plasma display panel on a substrate on which electrodes having a predetermined pattern are formed. When laminating and forming a dielectric layer and a second dielectric layer having a predetermined pattern, a non-photosensitive resin layer containing a first glass material, a second glass material, and A photosensitive resin layer containing a filler is formed, and the photosensitive resin layer is exposed and developed using a mask having a predetermined pattern, then the photosensitive resin layer is patterned, and then the non-photosensitive resin layer is formed. By co-firing the photosensitive resin layer, the first
And a second dielectric layer having the predetermined pattern are formed. As a result, the shape of the second dielectric layer (bulked dielectric layer) having a predetermined pattern in the firing step can be maintained, and the original function of the raised dielectric layer (the spread of discharge on the bus electrode can be prevented). Suppressing function) can be fully exerted.

In the plasma display panel manufacturing method according to the present invention, as described in claim 2, the average particle diameter R of the filler is the film thickness of the second dielectric layer having the predetermined pattern. When t, 0.5t ≦ R ≦ 0.1
It is characterized in that it is t. By using the filler having such an average particle diameter R, it is possible to reduce the sag of the edge portion of the second dielectric layer (bulk dielectric layer) having a predetermined pattern to a negligible amount.

The plasma display panel manufacturing method according to the present invention is characterized in that, as described in claim 3, the filler has an average particle diameter R of 10 μm or more. Since the film thickness of each of the first dielectric layer and the second dielectric layer (bulk dielectric layer) having a predetermined pattern in the plasma display panel is about 20 μm to 40 μm, a filler having an average particle diameter R of 10 μm or more. By using, the sag of the edge portion of the raised dielectric layer can be reduced to a negligible amount.

In the plasma display panel manufacturing method according to the present invention, as described in claim 4, the softening point of the filler is higher than the firing temperature at the time of the co-firing. This can prevent the filler from melting during firing.

In the method for manufacturing a plasma display panel according to the present invention, as described in claim 5, the photosensitive resin layer contains a filler having a relative dielectric constant smaller than that of the second glass material. It is characterized by including. As a result, it is possible to reduce the relative permittivity of the second dielectric layer (bulk dielectric layer) having a predetermined pattern formed by patterning and baking the photosensitive resin layer, and to reduce the relative dielectric constant on the bus electrode. The discharge can be suppressed to a smaller level.

Further, in the method for manufacturing a plasma display panel according to the present invention, as described in claim 6, the non-photosensitive resin layer and / or the photosensitive resin layer formed on the supporting film is transferred onto the substrate. Then, the non-photosensitive resin layer and / or the photosensitive resin layer is formed.
As a result, the drying step can be omitted as compared with the laminating method by applying and drying the resin paste, and the first dielectric layer and the second dielectric layer (bulk dielectric layer) having a predetermined pattern to be formed. Thickness accuracy is improved. Furthermore, by using a multilayer film, the step of laminating the non-photosensitive resin layer and the photosensitive resin layer can be simplified.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings.

(First Embodiment) The first embodiment will be described below. First, an electrode formed in a predetermined pattern is formed on a glass substrate. A row electrode pair (X, Y) formed on the front glass substrate whose electrodes serve as the display surface
If so, a transparent conductive film such as ITO is deposited on the surface of the substrate to form a transparent electrode, patterned into a T shape as shown in FIG. 5 by a photolithography method, and then a photosensitive silver paste is applied. Then, the bus electrode is formed by drying, then patterning by a photolithography method and baking.

When this electrode is the column electrode D formed on the rear glass substrate, it is formed by, for example, depositing an Al alloy on the surface of the substrate and patterning it by the photolithography method.

The first dielectric layer and the second dielectric layer (bulk dielectric layer) having a predetermined pattern are formed on the glass substrate on which the row electrode pair (X, Y) is formed as described above. A method of doing so will be described below with reference to the process chart of FIG. FIG. 1 is sectional views (a) to (d) shown in the order of steps.

As shown in FIG. 1A, the glass substrate 1
The non-photosensitive resin layer 14 containing the first glass material is formed on the surface on which the bus electrode 12 (corresponding to Xb and Yb in FIG. 5) on 1 and the transparent electrode 13 are formed. This non-photosensitive resin layer 1
No. 4 is formed by applying a non-photosensitive resin paste (low melting point glass paste) containing the first glass material by a screen printing method and drying it.

The first glass material has a softening point of about 580 ° C.
Is a glass material containing bismuth oxide, lead oxide, boron oxide, or zinc oxide as a main component. The non-photosensitive resin is, for example, an acrylic polymer.

Next, as shown in FIG. 1B, a negative photosensitive resin layer 15 containing a second glass material is formed so as to be laminated on the non-photosensitive resin layer 14. The photosensitive resin layer 15 is formed by applying a mixture of a photosensitive resin paste (low melting glass paste) containing a second glass material with a filler by a screen printing method and then drying it.

The second glass material is a glass material having a softening point substantially equal to that of the first glass material (a glass material containing bismuth oxide or lead oxide, boron oxide, or zinc oxide as a main component). The photosensitive resin is, for example, an acrylic monomer or oligomer. The softening point of the filler is 650
High melting point glass powder having a temperature of ℃ or more, for example, alumina, titania, silica, barium titanate and the like.

Next, as shown in FIG. 1C, the photosensitive resin layer 15 is patterned by performing exposure and development using a mask 16a having a photoresist formed in a predetermined pattern.

Then, as shown in FIG. 1D, the non-photosensitive resin layer 14 and the patterned photosensitive resin layer 1 are formed.
5 is simultaneously baked at a temperature near the softening point (for example, 560 ° C. to 580 ° C.) to uniformly cover the electrodes (bus electrode 12 and transparent electrode 13) and the predetermined dielectric layer 14a and a predetermined pattern. The second dielectric layer (bulk dielectric layer) 15a of the pattern is simultaneously formed.

As described above, the method of forming the first dielectric layer and the raised dielectric layer on the front glass substrate on which the row electrode pair (X, Y) is formed has been described. The same method can be used to form the dielectric layer (white dielectric layer) covering the electrode D and the patterned partition wall.

In the present embodiment, in order to simplify the firing process, the first dielectric layer and the raised dielectric layer are fired at the same time. However, the raised dielectric layer that has conventionally occurred after the simultaneous firing. It is possible to prevent the edge portion from sagging and maintain its shape, and to sufficiently exhibit the original function of the raised dielectric layer (the function of suppressing the spread of discharge on the bus electrode).

(Second Embodiment) Next, a second embodiment will be described with reference to FIG. First, the electrodes are formed in the same manner as in the first embodiment. Next, a method for forming the first dielectric layer and the second dielectric layer (bulk dielectric layer) having a predetermined pattern on the glass substrate on which the row electrode pair (X, Y) is formed will be described below. This will be described with reference to the process chart of FIG. 2A to 2C are sectional views (a) to FIG.
It is (d).

In the present embodiment, the support film 2
The 1st film 21 which laminated | stacked the non-photosensitive resin layer 24 and the protective film 21b on 1a is formed. The non-photosensitive resin layer 24 is made of a non-photosensitive resin paste (low-melting-point glass paste) containing the first glass material.
It is formed by coating on a and drying.

The first glass material has a softening point of about 580 ° C.
Is a glass material containing bismuth oxide, lead oxide, boron oxide, or zinc oxide as a main component. The non-photosensitive resin is, for example, an acrylic polymer. Further, the protective film 21b is laminated to form the first film 21.

Further, the photosensitive resin layer 25, the photoresist layer 26, and the protective film 2 are provided on the support film 22a.
The 2nd film 22 which laminated | stacked 2b is formed. The photosensitive resin layer 25 is formed by applying a mixture of a photosensitive resin paste containing a second glass material (a glass paste having a low melting point) and a filler onto the support film 22a and drying it.

The second glass material is a glass material having a softening point substantially equal to that of the first glass material (glass material containing bismuth oxide or lead oxide, boron oxide, zinc oxide as a main component). The photosensitive resin is, for example, an acrylic monomer or oligomer. The softening point of the filler is 650
High melting point glass powder having a temperature of ℃ or more, for example, alumina, titania, silica, barium titanate and the like.

Further, the photoresist layer 26 and the protective film 22b are laminated to form the second film 22.

Then, as shown in FIG. 2A, while the support film 21a and the protective film 21b are separated from the first film 21, the non-photosensitive resin layer 24 is applied to the roller 27.
To apply heat and pressure.

Next, as shown in FIG. 2B, the second film 22 to the support film 22a and the protective film 2 are formed.
While peeling off 2b, the photosensitive resin layer 25 and the photoresist layer 26 are heated and pressed by a roller 27 to be thermocompression bonded.

Next, as shown in FIG. 2C, a mask 26a having a photoresist layer 26 formed in a predetermined pattern.
Exposure and development are performed to pattern the photosensitive resin layer 25.

Then, as shown in FIG. 2D, the non-photosensitive resin layer 24 and the patterned photosensitive resin layer 2 are formed.
5 is simultaneously baked at a temperature near the softening point (for example, 560 ° C. to 580 ° C.) to uniformly cover the electrodes (bus electrode 12 and transparent electrode 13) and the predetermined dielectric layer 24a and a predetermined pattern. The second dielectric layer (bulk dielectric layer) 25a of the pattern is simultaneously formed.

As described above, the method of forming the first dielectric layer and the raised dielectric layer on the front glass substrate having the row electrode pair (X, Y) formed thereon has been described. The same method can be used to form the dielectric layer (white dielectric layer) covering the electrode D and the patterned partition wall.

In the present embodiment, the first film 2
By using 1 (film-shaped non-photosensitive resin layer) and the second film 22 (film-shaped photosensitive resin layer and photoresist layer), application and drying of the resin paste as in the first embodiment. The drying step can be omitted as compared with the laminating method according to, and the accuracy of the film thickness of the first dielectric layer and the bulking dielectric layer formed is improved.

Further, as in the first embodiment, in order to simplify the firing process, the first dielectric layer and the raised dielectric layer are fired at the same time. The sagging of the edge part of the raised dielectric layer can be prevented and the shape can be maintained, and the original function of the raised dielectric layer (the function of suppressing the spread of discharge on the bus electrode) can be fully exerted. be able to.

(Third Embodiment) Next, a third embodiment will be described with reference to FIG. First, the electrodes are formed in the same manner as in the first embodiment. Next, a method for forming the first dielectric layer and the second dielectric layer (bulk dielectric layer) having a predetermined pattern on the glass substrate on which the row electrode pair (X, Y) is formed will be described below. This will be described with reference to the process chart of FIG. 3A to 3C are cross-sectional views (a) to FIG.
It is (c).

In the present embodiment, the support film 3
A multilayer film 31 in which a non-photosensitive resin layer 34, a photosensitive resin layer 35, a photoresist layer 36, and a protective film 31b are laminated is formed on 1a. The non-photosensitive resin layer 34 is formed by applying a non-photosensitive resin paste (low-melting-point glass paste) containing the first glass material onto the support film 31a and drying it.

The first glass material has a softening point of about 580 ° C.
Is a glass material containing bismuth oxide, lead oxide, boron oxide, or zinc oxide as a main component. The non-photosensitive resin is, for example, an acrylic polymer.

As the photosensitive resin layer 35, a photosensitive resin paste containing a second glass material (a low melting point glass paste) mixed with a filler is used as the non-photosensitive resin layer 34.
It is formed by coating on top and drying.

The second glass material is a glass material having a softening point substantially equal to that of the first glass material (a glass material containing bismuth oxide or lead oxide, boron oxide, or zinc oxide as a main component). The photosensitive resin is, for example, an acrylic monomer or oligomer. The softening point of the filler is 650
High melting point glass powder having a temperature of ℃ or more, for example, alumina, titania, silica, barium titanate and the like.

Further, the photoresist layer 36 and the protective film 31b are laminated to form the multilayer film 31.

Next, as shown in FIG. 3A, from the multilayer film 31 to the support film 31a and the protective film 31.
While removing b, the non-photosensitive resin layer 34 and the photosensitive resin layer 3
5. The photoresist layer 36 is heated and pressed by the roller 37 to be thermocompression bonded.

Next, as shown in FIG. 3B, a mask 36a having a photoresist layer 36 formed in a predetermined pattern.
Is used for exposure and development to pattern the photosensitive resin layer 35.

Then, as shown in FIG. 3C, the non-photosensitive resin layer 34 and the patterned photosensitive resin layer 3 are formed.
5 is simultaneously fired at a temperature near the softening point (for example, 560 ° C. to 580 ° C.) to uniformly cover the electrodes (bus electrode 12 and transparent electrode 13) and the predetermined dielectric layer 34a and a predetermined pattern. The second dielectric layer (bulk dielectric layer) 35a of the pattern is simultaneously formed.

As described above, the method of forming the first dielectric layer and the raised dielectric layer on the front glass substrate on which the row electrode pair (X, Y) is formed has been described. The same method can be used to form the dielectric layer (white dielectric layer) covering the electrode D and the patterned partition wall.

In this embodiment, the multilayer film 31 is used.
By using, the step of laminating the non-photosensitive resin layer and the photosensitive resin layer is simplified. Further, as in the first embodiment, in order to simplify the firing process, the first dielectric layer and the raised dielectric layer are fired at the same time. The edge of the dielectric layer can be prevented from sagging and the shape can be maintained, and the original function of the raised dielectric layer (the function of suppressing the spread of discharge on the bus electrode) can be sufficiently exerted. .

As described in each embodiment, the present invention is characterized in that the shape of the elevated dielectric layer can be maintained by mixing the filler in the photosensitive resin layer.

That is, as shown in FIG. 4, the raised dielectric layer 15a formed in each of the embodiments of the present invention.
Edge portion 15b (25b, 35a) of (25a, 35a)
b) retains the shape before firing and can fulfill the function of suppressing the spread of the discharge on the bus electrode.

On the other hand, in the conventional manufacturing method, as shown in FIG. 8 described above, since the edge portion 111B of the raised dielectric layer 111A cannot maintain the shape before firing, the edge portion 111B is sagging. The function of suppressing the spread of the discharge is insufficient.

However, even when a filler is mixed in the photosensitive resin layer, if the average particle diameter R of the filler is less than 0.5 t, when the thickness of the dielectric layer is raised, the padding is increased. Whose dielectric layer cannot be ignored. Therefore, the filler mixed in the photosensitive resin layer preferably has an average particle diameter R of the filler in the range of 0.5t ≦ R ≦ 0.1t.

Furthermore, as shown in FIG. 4, the first dielectric layer 14a (24a, 34a) and the raised dielectric layer 15a.
The film thicknesses d1 and d2 of (25a, 35a) are 20 respectively.
The average particle diameter R of the filler is about 40 μm to 40 μm.
Is preferably 10 μm or more in order to maintain the shape of the edge portion 15b (prevent sagging).

Further, the softening point of the filler is preferably higher than the firing temperature at the time of simultaneous firing so as not to be melted at the time of firing.

By mixing a filler having a relative permittivity smaller than that of the second glass material into the photosensitive resin layer, the relative permittivity of the photosensitive resin layer can be reduced and the photosensitive resin layer can be reduced. The raised dielectric layer formed by patterning and firing the layer can further suppress the spread of discharge on the bus electrode. Since the relative permittivity of the second glass material is about 10, the relative permittivity is 8
It is more preferable to mix the following fillers (for example, SiO ₂ ).

Further, in each of the above-mentioned embodiments, the dielectric layer having a two-layer structure is used, but the present invention is not limited to this, and a structure having three or more layers can be adopted. For example, the first layer and the second layer may be non-photosensitive resin layers, and the third layer (uppermost layer) may be a photosensitive resin layer.

[0063]

As described above in detail, according to the invention described in claim 1, the first dielectric layer and the raised dielectric layer are conventionally formed by including the filler in the photosensitive resin layer. After firing at the same time, it is possible to prevent the edge of the raised dielectric layer from sagging and maintain its shape. The original function of the raised dielectric layer (to suppress the spread of discharge on the bus electrode) Function).

According to the invention described in claim 2,
The average particle diameter R of the filler contained in the photosensitive resin layer is the second
When the film thickness of the dielectric layer is 0.5t ≦ R ≦ 0.
When it is 1 t, the sagging of the raised dielectric layer can be reduced to a negligible amount.

According to the invention described in claim 3,
Since the average particle diameter R of the filler is 10 μm or more, the film thickness of each of the first dielectric layer and the raised dielectric layer in the plasma display panel is 20 μm to 40 μm.
Since the average particle diameter R is about 10 μm, by using a filler having an average particle diameter R of 10 μm or more, the sagging of the edge portion of the raised dielectric layer can be reduced to a negligible amount.

According to the invention described in claim 4,
When the softening point of the filler is higher than the firing temperature during simultaneous firing, it is possible to prevent the filler from melting during firing.

According to the invention described in claim 5,
The photosensitive resin layer contains a filler having a relative dielectric constant smaller than that of the second glass material, so that the photosensitive resin layer is patterned and baked to form a second dielectric having a predetermined pattern. The relative permittivity of the layer (bulk dielectric layer) can be reduced, and the discharge onto the bus electrode can be further suppressed.

According to the invention described in claim 6,
Application of a resin paste by transferring a non-photosensitive resin layer and / or a photosensitive resin layer formed on a supporting film onto a substrate to form a non-photosensitive resin layer and / or a photosensitive resin layer, The drying step can be omitted as compared with the stacking method by drying, and the accuracy of the film thickness of the first dielectric layer and the second dielectric layer formed can be improved. Furthermore, by using a multilayer film, the step of laminating the non-photosensitive resin layer and the photosensitive resin layer can be simplified.

[Brief description of drawings]

1A to 1D are cross-sectional views (a) to (d) showing the order of steps for explaining a first embodiment according to the present invention.

2A to 2D are cross-sectional views (a) to (d) showing the order of steps for explaining a second embodiment according to the present invention.

3A to 3C are cross-sectional views (a) to (c) showing a process sequence for explaining a third embodiment according to the present invention.

FIG. 4 is a cross-sectional view showing the shape of the edge portion of the raised dielectric layer according to the manufacturing method of the present invention.

FIG. 5 is a plan view schematically showing a conventional cell structure of a surface discharge type plasma display panel.

6 is a cross-sectional view taken along the line VV of FIG.

7 is a cross-sectional view taken along the line WW of FIG.

FIG. 8 is a cross-sectional view showing a shape of an edge portion of a raised dielectric layer according to a conventional manufacturing method.

[Explanation of symbols]

11 glass substrate 12 bus electrode 13 transparent electrodes 14, 24, 34 non-photosensitive resin layers 14a, 24a, 34a first dielectric layer 15, 25, 35 photosensitive resin layers 15a, 25a, 35a second of a predetermined pattern Dielectric layer (bulk dielectric layer) 15b, 25b, 35b (bulk dielectric layer) edge portions 16a, 26a, 36a Mask 21, 22 Film 21a, 22a, 31a Support film 21b, 22b, 31b Protective film 26, 36 Photoresist layer 27, 37 Roller 31 Multi-layer film

Continued front page    (72) Inventor Tomoyuki Nakatani             Yamanashi Prefecture Nakatoma-gun Tatomi Town Nishi Hanawa 2680 Shizu Shizu             Oka Pioneer Corporation Kofu Office (72) Inventor Hisayuki Itoi             Yamanashi Prefecture Nakatoma-gun Tatomi Town Nishi Hanawa 2680 Shizu Shizu             Oka Pioneer Corporation Kofu Office F-term (reference) 5C027 AA05 AA06                 5C040 GD02 GD07 GD09 JA02 JA15                       JA22 KA16 KB03 KB09 KB19                       KB29 LA17 MA23 MA26

Claims (6)

[Claims] 1. An electrode of a substrate for forming a first dielectric layer and a second dielectric layer of a predetermined pattern on a substrate of a plasma display panel on which an electrode of a predetermined pattern is formed. A non-photosensitive resin layer containing a first glass material and a photosensitive resin layer containing a second glass material and a filler are formed on the formation surface, and the photosensitive resin layer is formed using a mask having a predetermined pattern. By exposing and developing, the photosensitive resin layer is patterned, and then the non-photosensitive resin layer and the photosensitive resin layer are co-fired, whereby the first dielectric layer and the predetermined pattern are formed. 2. A method of manufacturing a plasma display panel, comprising forming the second dielectric layer of 2. The average particle diameter R of the filler is, when the thickness of the second dielectric layer having the predetermined pattern is t,
The method of manufacturing a plasma display panel according to claim 1, wherein 0.5t ≦ R ≦ 0.1t. 3. The average particle diameter R of the filler is 10 μm.
It is above, The manufacturing method of the plasma display panel of Claim 1 or 2 characterized by the above-mentioned. 4. The softening point of the filler is higher than the firing temperature during the simultaneous firing.
4. The method for manufacturing a plasma display panel according to any one of 3 to 3. 5. The plasma display panel according to claim 1, wherein the photosensitive resin layer contains a filler having a relative dielectric constant smaller than that of the second glass material. Production method. 6. A non-photosensitive resin layer and / or a photosensitive resin layer formed on a support film is transferred onto a substrate to form the non-photosensitive resin layer and / or the photosensitive resin layer. The method for manufacturing a plasma display panel according to claim 1, wherein