JP2003178404A - Thin-film magnetic head and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately control a track width and to prevent the saturation of a magnetic flux on the midway of a magnetic path even when the track width of a recording head is reduced, and to reduce a magnetic path length. <P>SOLUTION: A recording head is provided with a lower magnetic pole layer 8 (8a to 8c), an upper magnetic pole layer 13, a recording gap layer 12 and a thin-film coil 10. The lower magnetic pile layer 8 has a first part 8a arranged in a position opposite to the thin-film coil 10 and a second part 8b connected to the first part 8a to define a throat height, and the thin-film coil 10 is arranged on the side of the second part 8b. The tip of the side of the track width defining part of the upper magnetic pole layer 13 opposite to an air bearing surface 30 is arranged on the air bearing surface 30 side more than the tip of the side of the second part 8b opposite to the air bearing surface 30. A part of the second part 8b has a width equal to that of the track width defining part. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film magnetic head having an inductive magnetic conversion element and a method of manufacturing the thin film magnetic head.

[0002]

2. Description of the Related Art In recent years, as the areal recording density of hard disk devices has increased, there has been a demand for improved performance of thin film magnetic heads. The thin-film magnetic head is a composite type having a structure in which a recording head having an inductive magnetic conversion element for writing and a reproducing head having a magnetoresistive (hereinafter also referred to as MR) element for reading are laminated. Thin film magnetic heads are widely used.

By the way, in the performance of the recording head, in order to increase the recording density, it is necessary to increase the track density in the magnetic recording medium. For this purpose, a recording head having a narrow track structure in which the width of the lower magnetic pole and the upper magnetic pole formed above and below the recording gap layer on the air bearing surface, that is, the track width is narrowed from a few microns to a submicron dimension is used. It has to be realized and semiconductor processing technology is used to achieve this.

Now, referring to FIGS. 23 to 26,
As an example of a conventional method of manufacturing a thin film magnetic head, an example of a method of manufacturing a composite thin film magnetic head will be described. 23 to 26, (a) shows a cross section perpendicular to the air bearing surface, and (b) shows a cross section parallel to the air bearing surface of the magnetic pole portion.

In this manufacturing method, first, as shown in FIG.
Like Altic (Al ₂O₃・ From TiC)
On the substrate 101 made of, for example, alumina (Al₂O₃)
The insulating layer 102 having a thickness of about 5 to 10 μm is deposited.
Pile up. Next, a magnetic material is formed on the insulating layer 102.
The lower shield layer 103 for the reproducing head is formed.

Next, on the lower shield layer 103, for example, alumina is sputter-deposited to a thickness of 100 to 200 nm to form a lower shield gap film 104 as an insulating layer. Next, on the lower shield gap film 104,
The MR element 105 for reproduction is formed to have a thickness of several tens nm. Next, on the lower shield gap film 104, MR
A pair of electrode layers 106 electrically connected to the element 105 is formed.

Next, an upper shield gap film 107 as an insulating layer is formed on the lower shield gap film 104 and the MR element 105, and the MR element 105 is embedded in the shield gap films 104 and 107.

Next, on the upper shield gap film 107, a lower magnetic pole layer 108 of the recording head, which is made of a magnetic material and also serves as an upper shield layer of the reproducing head, is formed to a thickness of about 3 μm.

Next, as shown in FIG. 24, a recording gap layer 109 made of an insulating film, for example, an alumina film is formed to a thickness of 0.2 μm on the lower magnetic pole layer 108. Next, in order to form a magnetic path, the recording gap layer 109 is partially etched to form a contact hole 109a. Next, the upper magnetic pole tip 1 made of a magnetic material for the recording head is formed on the recording gap layer 109 in the magnetic pole portion.
10 is formed to a thickness of 0.5 to 1.0 μm. At this time, at the same time, the contact hole 109a for forming the magnetic path is formed.
On the magnetic layer 11 made of a magnetic material for forming a magnetic path.
9 is formed.

Next, as shown in FIG. 25, by ion milling using the top pole tip 110 as a mask,
The recording gap layer 109 and the bottom pole layer 108 are etched. As shown in FIG. 25B, the upper pole portion (upper pole tip 110), the recording gap layer 109, and a part of the sidewalls of the lower pole layer 108 are vertically formed in a self-aligned structure. (Trim) structure.

Next, an insulating layer 111 made of, for example, an alumina film is formed on the entire surface to a thickness of about 3 μm. Next, the insulating layer 111 is polished and planarized to reach the surfaces of the top pole tip 110 and the magnetic layer 119.

Next, on the planarized insulating layer 111,
The first for an inductive recording head made of, for example, copper (Cu)
The thin film coil 112 of the layer is formed. Next, the insulating layer 11
1 and the coil 112, a photoresist layer 113
Are formed into a predetermined pattern. Next, heat treatment is performed at a predetermined temperature to flatten the surface of the photoresist layer 113. Next, the second layer thin film coil 114 is formed on the photoresist layer 113. Next, the photoresist layer 1 is formed on the photoresist layer 113 and the coil 114.
15 is formed into a predetermined pattern. Next, heat treatment is performed at a predetermined temperature to flatten the surface of the photoresist layer 115.

Next, as shown in FIG. 26, an upper magnetic pole layer 116 made of a magnetic material for a recording head, such as permalloy, is formed on the upper magnetic pole tip 110, the photoresist layers 113 and 115, and the magnetic layer 119. To do. next,
An overcoat layer 117 made of alumina, for example, is formed on the upper magnetic pole layer 116. Finally, the slider is polished to form the air bearing surfaces 118 of the recording head and the reproducing head, and the thin film magnetic head is completed.

FIG. 27 is a plan view of the thin film magnetic head shown in FIG. In this figure, the overcoat layer 117 and other insulating layers and films are omitted.

In FIG. 26, TH represents throat height and MR-H represents MR height. In addition,
The throat height is the length (height) from the end on the air bearing surface side to the end on the opposite side of the portion where the two magnetic pole layers face each other with the recording gap layer in between, that is, the magnetic pole portion. The MR height means the length (height) from the end of the MR element on the air bearing surface side to the end on the opposite side. Further, in FIG. 26, P2W represents the magnetic pole width, that is, the track width of the recording head (hereinafter referred to as the recording track width). Factors that determine the performance of the thin-film magnetic head include the throat height, the MR height, and the like, as well as the Apex Angle as shown by θ in FIG. The apex angle is a top surface of the insulating layer 111 and a straight line that connects the corners of the side surface on the magnetic pole side in the coil portion (hereinafter referred to as the apex portion) that is covered with the photoresist layers 113 and 115 and rises like a mountain. Is the angle formed by.

[0016]

To improve the performance of the thin film magnetic head, the throat height TH, MR height MR-H, and apex angle .theta. Shown in FIG.
It is important to accurately form the recording track width P2W.

In particular, in recent years, in order to enable high areal density recording, that is, to form a recording head having a narrow track structure, the track width P2W is required to have a submicron dimension of 1.0 μm or less. Therefore, it is necessary to use a semiconductor processing technique to process the upper magnetic pole into a submicron size.

Here, the problem is that it is difficult to finely form the upper magnetic pole layer formed on the apex portion.

By the way, as a method of forming the top pole layer, for example, a frame plating method is used as disclosed in Japanese Patent Laid-Open No. 7-262519. When the top pole layer is formed using the frame plating method, first, a thin electrode film made of, for example, permalloy is formed on the apex portion by sputtering, for example. Next, a photoresist is applied thereon and patterned by a photolithography process to form a frame (outer frame) for plating. Then, the upper magnetic pole layer is formed by a plating method using the electrode film previously formed as a seed layer.

However, the height difference between the apex portion and the other portion is, for example, 7 to 10 μm or more. A photoresist is applied to the apex portion so as to have a thickness of 3 to 4 μm. If the film thickness of the photoresist on the apex portion is required to be at least 3 μm or more, the fluid photoresist is gathered in the lower part, so that the photoresist having a thickness of 8 to 10 μm or more is formed below the apex portion. A resist film is formed.

In order to realize the recording track width of the submicron size as described above, it is necessary to form the frame pattern of the submicron size width by the photoresist film. Therefore, a submicron-sized fine pattern must be formed on the apex portion with a photoresist film having a thickness of 8 to 10 μm or more. However, it has been extremely difficult in the manufacturing process to form such a thick photoresist pattern with a narrow pattern width.

Moreover, at the time of photolithography exposure,
The light for exposure is reflected by the base electrode film as the seed layer,
The reflected light also sensitizes the photoresist, causing the photoresist pattern to collapse, making it impossible to obtain a sharp and accurate photoresist pattern.

In particular, in the region on the slope of the apex part, not only the reflected light in the vertical direction but also the reflected light of the exposure light reflected by the base electrode film is returned from the slope of the apex part. Since the reflected light in the oblique direction or the lateral direction is also included, the photoresist is exposed to the reflected light, and the collapse of the photoresist pattern becomes large.

On the other hand, it is required that the track width does not change depending on the polishing amount at the time of polishing the slider.

Therefore, when forming the upper magnetic pole layer on the apex portion, it is necessary to devise such that the track width is less likely to be affected by the light reflected by the base electrode film during the exposure of photolithography. It was

The shape of the upper magnetic pole layer in the conventional thin film magnetic head is, for example, only 3 to 5 μm from the zero throat height position (the position of the end portion of the magnetic pole portion opposite to the air bearing surface) to the apex portion side. The part from the advanced position to the air bearing surface has a width equal to the track width, and the width from this part to the coil side is 30 ° or 45 °.
It had a shape that spreads out at a gentle angle like.

However, if the top pole layer has the above-mentioned shape, saturation of the magnetic flux occurs near the zero throat height position, and the magnetomotive force generated in the thin film coil cannot be efficiently used for recording. There was a problem. As a result, the overwrite characteristic, that is, the value indicating the characteristic when the data is overwritten in the area where the data has already been written on the recording medium is
The value becomes as low as a certain degree, and there arises a problem that a sufficient overwrite characteristic cannot be secured.

Further, when the top pole layer has the above-mentioned shape, a portion where the width of the top pole layer starts to widen is arranged on the slope of the apex portion. However, in the case of such a shape and arrangement of the top pole layer, the photoresist pattern is particularly susceptible to the reflected light from the underlying electrode film, and it becomes difficult to control the track width accurately.

As described above, conventionally, when the track width becomes a submicron dimension, it is difficult to control the track width accurately, and saturation of the magnetic flux is likely to occur near the throat height zero position. There was a problem.

In the future, for example, a thin film magnetic head capable of supporting an areal recording density of 10 to 40 gigabits / (inch) ² ,
For example, in order to realize a thin film magnetic head capable of performing a good recording operation in a high frequency band of 300 to 600 MHz, particularly, a fine track width is formed uniformly and the magnetomotive force generated in the thin film coil is efficiently generated. It is important to make it available for recording well, and it is strongly required to solve the above-mentioned problems.

From the above, the conventional example shown in FIG.
4 to FIG. 26, after the track width of 1.0 μm or less is formed by the upper magnetic pole tip 110 effective for forming the narrow track of the recording head, the yoke connected to the upper magnetic pole tip 110 is formed. A method of forming the upper magnetic pole layer 116 to be a part is also adopted (see JP-A-62-245509 and JP-A-60-10409). Thus, by dividing the normal upper magnetic pole layer into the upper magnetic pole tip 110 and the upper magnetic pole layer 116 to be the yoke portion, the upper magnetic pole tip 110 that determines the recording track width is formed on the recording gap layer 109. It becomes possible to form finely to some extent on a flat surface.

However, even the thin film magnetic head having the structure shown in FIG. 26 has the following problems.

First, in the thin film magnetic head shown in FIG. 26, since the recording track width is defined by the upper magnetic pole chip 110, the upper magnetic pole layer 116 is formed in the upper magnetic pole chip 1.
It can be said that it is not necessary to process finely as much as 10. Even so, when the recording track width becomes extremely fine, particularly 0.5 μm or less, the upper magnetic pole layer 116 is required to have a processing accuracy of a submicron width. However, in the thin film magnetic head shown in FIG. 26, since the upper magnetic pole layer 116 is formed on the apex portion, it is difficult to finely form the upper magnetic pole layer 116 for the above reason. Further, since the upper magnetic pole layer 116 needs to be magnetically connected to the narrow upper magnetic pole chip 110, the upper magnetic pole layer 116 needs to be formed to have a width wider than that of the upper magnetic pole chip 110. For these reasons, in the thin film magnetic head shown in FIG.
It was formed wider than. In addition, the top pole layer 11
The tip end surface of 6 is exposed to the air bearing surface. Therefore, in the thin film magnetic head shown in FIG.
Writing is also performed on the 16 side, and data is also written to an area other than the area to be originally recorded on the recording medium, so-called side write, or data in the area other than the area to be recorded is erased. However, there is a problem that so-called side erase occurs. Such a problem is that when the coil is formed in two layers or three layers in order to improve the performance of the recording head, the height of the apex portion becomes higher than that in the case where the coil is formed in one layer. It becomes more prominent.

Further, in the thin film magnetic head shown in FIG. 26, the upper magnetic pole tip 110 defines the recording track width and the throat height. Therefore, in this thin film magnetic head, the recording track width is extremely fine, especially 0.5 μm.
In the following cases, the size of the top pole tip 110 becomes extremely small, and the pattern edge becomes rounded, which makes it difficult to form the top pole tip 110 with high accuracy. Therefore, in the thin-film magnetic head having the structure shown in FIG. 26, when the recording track width becomes extremely fine, it is difficult to control the recording track width accurately.

Further, in the thin film magnetic head shown in FIG. 26, the cross-sectional area of the magnetic path sharply decreases at the contact portion between the upper magnetic pole layer 116 and the upper magnetic pole chip 110, so that saturation of magnetic flux occurs at this portion. There is a problem that the magnetomotive force generated in the thin film coils 112 and 114 cannot be efficiently used for recording.

Further, the conventional thin film magnetic head has a problem that it is difficult to shorten the magnetic path length (Yoke Length). That is, the smaller the coil pitch,
It is possible to realize a head with a short magnetic path length, and it is possible to form a recording head with excellent high-frequency characteristics. Was a major factor that prevented the magnetic path length from being shortened. Since the magnetic path length of the two-layer coil can be made shorter than that of the one-layer coil, many recording heads for high frequency use the two-layer coil. However, in the conventional magnetic head, after forming the coil of the first layer, the photoresist film is formed with a thickness of about 2 μm in order to form the insulating film between the coils. Therefore, a small rounded apex portion is formed on the outer peripheral end of the coil of the first layer. Next, a coil of the second layer is formed on it. At that time,
In the inclined portion of the apex portion, the seed layer of the coil cannot be etched and the coil is short-circuited, so the second layer coil needs to be formed in the flat portion.

Therefore, for example, the thickness of the coil is 2 to 3 μm.
m, the thickness of the inter-coil insulating film is 2 μm, and the apex angle is 45 ° to 55 °, the magnetic path length is the length of the portion corresponding to the coil, and the throat height is zero from the outer peripheral end of the coil. Twice the distance of 3 to 4 μm, which is the distance to the vicinity of the position (the distance from the contact portion between the upper magnetic pole layer and the lower magnetic pole layer to the inner circumferential edge of the coil is also 3 to 4 μm
necessary. ) Of 6 to 8 μm is required. The length other than the portion corresponding to this coil has been a factor that hinders the reduction of the magnetic path length.

Here, for example, the coil line width is 1.5 μm.
Consider a case where an 11-turn coil having m and a space of 0.5 μm is formed in two layers. In this case, as shown in FIG.
If the first layer is 6 rolls and the second layer is 5 rolls, of the magnetic path length,
The length of the portion corresponding to the coil 112 of the first layer is 11.5.
μm. In addition to this, the magnetic path length includes the coil 11 of the first layer from the outer peripheral edge and the inner peripheral edge of the coil 112 of the first layer.
A total length of 6 to 8 μm is required as the distance to the end of the photoresist layer 113 for insulating the second layer. Therefore, the magnetic path length is 17.5 to 19.5 μm. In addition,
In the present application, the magnetic path length is represented by the length of a portion of the pole layer excluding the pole portion and the contact portion, as indicated by the symbol L ₀ in FIG. As described above, conventionally, it is difficult to reduce the magnetic path length, which hinders improvement of high frequency characteristics.

The present invention has been made in view of the above problems, and an object thereof is to accurately control the track width even when the recording head has a small track width and prevent saturation of magnetic flux in the middle of the magnetic path. To be able to
Another object of the present invention is to provide a thin film magnetic head capable of reducing the magnetic path length and a manufacturing method thereof.

[0040]

A thin-film magnetic head of the present invention includes a medium facing surface facing a recording medium and magnetic pole portions facing each other on the medium facing surface side, and is magnetically coupled to each other. And a second magnetic layer, a gap layer provided between the magnetic pole portion of the first magnetic layer and the magnetic pole portion of the second magnetic layer, and at least a part of the first and second magnetic layers.
A thin film coil provided between the first and second magnetic layers in an insulated state between the first and second magnetic layers, and a substrate,
The first and second magnetic layers, the gap layer, and the thin-film coil are stacked on the substrate, and the first and second magnetic layers are arranged such that the first magnetic layer is closer to the substrate. Is.

In the thin film magnetic head of the present invention, the first magnetic layer is connected to the first portion arranged at a position facing at least a part of the thin film coil and the surface of the first portion on the thin film coil side. And a second portion including the magnetic pole portion of the first magnetic layer. The second portion faces the second magnetic layer via the gap layer, and thus the throat height is defined by the end of the second portion opposite to the medium facing surface. At least a part of the thin-film coil has a second
It is located to the side of the part. The second magnetic layer has a track width defining portion that defines the track width. The end of the track width defining portion opposite to the medium facing surface is arranged closer to the medium facing surface than the end of the second portion opposite to the medium facing surface. A portion of the second portion that faces the track width defining portion via the gap layer has the same width as the track width defining portion. The width of the second magnetic layer at a position corresponding to the end of the second portion opposite to the medium facing surface is larger than the width of the track width defining portion.

A method of manufacturing a thin film magnetic head according to the present invention includes a medium facing surface facing a recording medium and magnetic pole portions facing each other on the medium facing surface side, and is magnetically coupled to each other. A magnetic layer, a gap layer provided between the magnetic pole portion of the first magnetic layer and the magnetic pole portion of the second magnetic layer, and at least a part of the gap layer between the first and second magnetic layers. A method of manufacturing a thin film magnetic head including a thin film coil provided in a state of being insulated from a first magnetic layer and a second magnetic layer.

The method of manufacturing a thin film magnetic head of the present invention comprises the steps of forming a first magnetic layer, forming a gap layer on the first magnetic layer, and forming a second magnetic layer on the gap layer. A step of forming a layer and at least a portion of the first and second
And a step of forming a thin film coil so as to be arranged between the magnetic layers in such a manner as to be insulated from the first and second magnetic layers.

In the method of manufacturing a thin film magnetic head of the present invention, the step of forming the first magnetic layer includes the first portion arranged at a position facing at least a part of the thin film coil,
The first portion is connected to the surface on the thin film coil side,
And a second portion including the magnetic pole portion of the magnetic layer. The second portion faces the second magnetic layer via the gap layer, and thus the throat height is defined by the end of the second portion opposite to the medium facing surface. In the step of forming the thin film coil, at least a part of the thin film coil is arranged laterally of the second portion. The second magnetic layer has a track width defining portion that defines the track width. The end of the track width defining portion opposite to the medium facing surface is arranged closer to the medium facing surface than the end of the second portion opposite to the medium facing surface. The width of the second magnetic layer at a position corresponding to the end of the second portion opposite to the medium facing surface is larger than the width of the track width defining portion.

In the method of manufacturing the thin film magnetic head of the invention, further, the width of a part of the second portion, which opposes the track width defining portion via the gap layer, is made equal to the width of the track width defining portion. And a step of etching the gap layer and the second portion using the track width defining portion as a mask.

In the thin film magnetic head or the method of manufacturing the same of the present invention, at least a part of the thin film coil disposed on the side of the second portion is covered, and the surface on the side of the second magnetic layer is the second portion. A flattened insulating layer may be provided together with the surface on the second magnetic layer side.

In the thin film magnetic head or the method of manufacturing the same of the present invention, the second magnetic layer may be composed of one layer.

In the thin film magnetic head or the method of manufacturing the same according to the present invention, the second magnetic layer includes a pole portion layer including a track width defining portion, and a yoke portion layer connected to the pole portion layer and serving as a yoke portion. May have. The end surface of the yoke portion layer on the medium facing surface side may be arranged at a position away from the medium facing surface. The thin-film coil may have a first layer portion arranged beside the second portion and a second layer portion arranged beside the magnetic pole portion layer. The thin-film magnetic head of the present invention further covers the first layer portion of the thin-film coil, and the second magnetic layer side surface thereof is flattened together with the second magnetic layer side surface of the second portion. Insulation layer,
The second layer portion of the thin-film coil may be covered with a second insulating layer whose surface on the yoke portion layer side is flattened together with the surface of the magnetic pole portion layer on the yoke portion layer side.

[0049]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. [First Embodiment] First, a thin film magnetic head and a method of manufacturing the same according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 6, (a) shows a cross section perpendicular to the air bearing surface, and (b) shows a cross section parallel to the air bearing surface of the magnetic pole portion.

In the method of manufacturing the thin-film magnetic head according to the present embodiment, first, as shown in FIG. 1, for example, alumina (Al ₂ O ₃ .TiC) is placed on a substrate 1 made of Altic (Al ₂ O ₃ .TiC). Insulating layer 2 made of ₂ O ₃ ) is about 5 μm
Deposited at a thickness of. Next, on the insulating layer 2, a magnetic material,
For example, the lower shield layer 3 made of permalloy for the reproducing head is formed to a thickness of about 3 μm. Lower shield layer 3
Is selectively formed on the insulating layer 2 by a plating method using a photoresist film as a mask, for example. next,
Although not shown, an insulating layer made of alumina, for example, is formed to a thickness of, for example, 4 to 5 μm, and is formed by CMP, for example.
The lower shield layer 3 is polished by (chemical mechanical polishing) until it is exposed, and the surface is flattened.

Next, as shown in FIG. 2, a lower shield gap film 4 as an insulating film is formed on the lower shield layer 3.
Is formed with a thickness of, for example, about 20 to 40 nm. next,
The MR element 5 for reproduction is formed on the lower shield gap film 4.
To a thickness of several tens of nm. The MR element 5 is formed, for example, by selectively etching an MR film formed by sputtering. As the MR element 5, an element using a magneto-sensitive film exhibiting a magnetoresistive effect such as an AMR element, a GMR element, or a TMR (tunnel magnetoresistive effect) element can be used. Next, on the lower shield gap film 4, a pair of electrode layers 6 electrically connected to the MR element 5 are formed with a thickness of several tens nm. next,
An upper shield gap film 7 as an insulating film is formed on the lower shield gap film 4 and the MR element 5, for example, about 2
The MR element 5 is formed to a thickness of 0 to 40 nm and embedded in the shield gap films 4 and 7. Shield gap film 4,
Alumina, aluminum nitride, diamond-like carbon (DLC) and the like are used as the insulating material for No. 7. The shield gap films 4 and 7 may be formed by a sputtering method, for example, a chemical vapor deposition (CVD) method using trimethyl aluminum (Al (CH ₃ ) ₃ ) and H ₂ O. You may. When the CVD method is used, it is possible to form the shield gap films 4 and 7 that are thin, dense and have few pinholes.

Next, on the upper shield gap film 7,
The first portion 8a of the lower magnetic pole layer 8 of the recording head, which is made of a magnetic material and also serves as the upper shield layer of the reproducing head, is selectively formed with a thickness of about 1.0 to 1.5 μm. The bottom pole layer 8 is composed of this first portion 8a, and a second portion 8b and a third portion 8c which will be described later. The first portion 8a of the bottom pole layer 8 is arranged at a position facing at least a part of a thin film coil described later.

Next, on the first portion 8a of the bottom pole layer 8, the second portion 8b and the third portion 8 of the bottom pole layer 8 are formed.
c is formed to a thickness of about 1.5 to 2.5 μm. The second portion 8b forms the magnetic pole portion of the lower magnetic pole layer 8 and is connected to the surface of the first portion 8a on the side where the thin film coil is formed (the upper side in the drawing). The third portion 8c is a portion for connecting the first portion 8a and an upper pole layer described later. The position of the end of the second portion 8b opposite to the air bearing surface 30 in the portion facing the top pole layer defines the throat height. That is, the portion of the second portion 8b that faces the top pole layer is the portion that defines the throat height. In addition, the air bearing surface 3 in the portion of the second portion 8b facing the upper magnetic pole layer
The position of the end portion on the side opposite to 0 is the throat height zero position.

The second portion 8b and the third portion of the bottom pole layer 8
8c is a NiFe (Ni: 80% by weight, Fe: 2
0 wt%) or NiFe (N
i: 45% by weight, Fe: 55% by weight) or the like, and may be formed by a plating method, or may be formed by sputtering using a material such as FeN or FeZrN which is a high saturation magnetic flux density material. Other than this, CoFe, a Co-based amorphous material or the like, which is a high saturation magnetic flux density material, may be used.

Next, as shown in FIG. 3, an insulating film 9 made of, for example, alumina is formed to a thickness of about 0.3 to 0.6 μm.
To the thickness of.

Next, the photoresist is patterned by a photolithography process to form a frame 19 for forming the thin film coil by the frame plating method. Next, using the frame 19, a thin film coil 10 made of, for example, copper (Cu) is formed by a frame plating method.
Is, for example, about 1.0 to 2.0 μm thick and 1.2 to
The coil pitch is 2.0. Next, the frame 19
To remove. In the figure, reference numeral 10a is a thin film coil 1.
0 indicates a connecting portion for connecting 0 to a conductive layer (lead) described later.

Next, as shown in FIG. 4, an insulating layer 11 made of alumina, for example, is formed over the entire surface to a thickness of about 3 to 4 μm. Next, the insulating layer 11 is polished by CMP, for example, until the second portion 8b and the third portion 8c of the bottom pole layer 8 are exposed, and the surface is planarized. Here, in FIG. 4, although the thin-film coil 10 is not exposed,
The thin film coil 10 may be exposed.

Next, a recording gap layer 12 made of an insulating material is formed on the exposed second and third portions 8b and 8c of the bottom pole layer 8 and the insulating layer 11, for example, 0.2 to 0.
It is formed to a thickness of 3 μm. Insulating materials used for the recording gap layer 12 are generally alumina, aluminum nitride, silicon oxide based materials, silicon nitride based materials, diamond-like carbon (DLC) and the like.

Next, in order to form a magnetic path, the recording gap layer 12 is partially etched on the third portion 8c of the lower magnetic pole layer 8 to form a contact hole. Further, the recording gap layer 12 and the insulating layer 11 are partially etched in the portion above the connection portion 10a of the thin film coil 10 to form a contact hole.

Next, as shown in FIG. 5, an upper magnetic pole layer 13 of about 2. is formed on the recording gap layer 12 from the air bearing surface 30 to a portion above the third portion 8c of the lower magnetic pole layer 8. While forming to a thickness of 0 to 3.0 μm,
The conductive layer 21 is formed to have a thickness of about 2.0 to 3.0 μm so as to be connected to the connection portion 10a of the thin film coil 10. The upper magnetic pole layer 13 is connected to the third portion 8c of the lower magnetic pole layer 8 through a contact hole formed in a portion above the third portion 8c of the lower magnetic pole layer 8.

The upper magnetic pole layer 13 is made of NiFe (Ni: 80).
%, Fe: 20% by weight) or NiFe (Ni: 45% by weight, Fe: 55% by weight) which is a high saturation magnetic flux density material.
Etc., may be formed by a plating method, or may be formed by sputtering using a material such as FeN or FeZrN which is a high saturation magnetic flux density material. Other than this, CoFe, a Co-based amorphous material or the like, which is a high saturation magnetic flux density material, may be used. Also, to improve high frequency characteristics,
The upper magnetic pole layer 13 may have a structure in which an inorganic insulating film and a magnetic layer such as permalloy are stacked in multiple layers.

Next, the recording gap layer 12 is selectively etched by dry etching using the top pole layer 13 as a mask. In this dry etching, for example, chlorine-based gas such as BCl ₂ , Cl ₂ or CF ₄ , SF _{6 is used.}
Reactive ion etching (RIE) using a gas such as a fluorine-based gas is used. Next, the second portion 8b of the bottom pole layer 8 is formed by, for example, argon ion milling.
Is selectively etched by about 0.3 to 0.6 μm,
The trim structure is as shown in FIG. With this trim structure, it is possible to prevent an effective increase in the track width due to the spread of the magnetic flux generated when writing a narrow track.

Next, an overcoat layer 17 made of alumina, for example, is formed over the entire surface to a thickness of 20 to 40 μm, the surface thereof is flattened, and an electrode pad (not shown) is formed thereon. Finally, the slider is polished to form the air bearing surfaces 30 of the recording head and the reproducing head, and the thin film magnetic head according to the present embodiment is completed.

In this embodiment, the first portion 8a and the second portion
Bottom pole layer 8 composed of the portion 8b and the third portion 8c
Corresponds to the first magnetic layer of the present invention, and the top pole layer 13 corresponds to the second magnetic layer of the present invention.

FIG. 7 is a plan view (a diagram arranged on the upper side in FIG. 7) and a sectional view (a diagram arranged on the lower side in FIG. 7) of a main part of the thin film magnetic head according to the present embodiment. It is explanatory drawing which matches and shows. In FIG. 7, the overcoat layer 17, other insulating layers and insulating films are omitted. In FIG. 7, the symbol TH represents the throat height, TH0 represents the zero throat height position, and MR-H represents the MR height.

FIG. 8 is a partial cutout of the portion from the lower shield layer 3 to the second portion 8b of the lower magnetic pole layer 8, the insulating film 9 and the thin film coil 10 in the thin film magnetic head according to the present embodiment. It is a perspective view shown. In FIG.
Reference numeral 8B represents a portion where the second portion 8b of the lower magnetic pole layer 8 is etched to have a trim structure.

FIG. 9 is a perspective view showing a part in which the recording gap layer 12 and the top pole layer 13 are further added to the part shown in FIG.

As described above, the thin film magnetic head according to this embodiment includes the reproducing head and the recording head. The reproducing head is arranged so that the MR element 5 and a part of the side facing the recording medium are opposed to each other with the MR element 5 interposed therebetween. Bottom pole layer 8).

The recording heads are magnetically coupled to each other,
The lower magnetic pole layer 8 (first portion 8a, second portion 8b and third portion 8c) and the upper magnetic pole layer 13 each including at least one magnetic pole portion on the side facing the recording medium and facing each other. A recording gap layer 12 provided between the magnetic pole portion of the lower magnetic pole layer 8 and the magnetic pole portion of the upper magnetic pole layer 13, and at least a part of the recording gap layer 12 between the lower magnetic pole layer 8 and the upper magnetic pole layer 13. The thin film coil 10 is arranged in an insulated state.

In the present embodiment, the lower magnetic pole layer 8 has a first portion 8a arranged at a position facing at least a part of the thin film coil 10 and the thin film coil 10 side of the first portion 8a (see FIG. A second portion 8 which is connected to the upper surface of the magnetic head and forms a magnetic pole portion and defines the throat height.
b, the thin-film coil 10 is disposed laterally (right side in the drawing) of the second portion 8b of the lower magnetic pole layer 8.

In the present embodiment, the length from the end on the air bearing surface 30 side of the second portion 8b of the bottom pole layer 8 which defines the throat height to the end on the opposite side (hereinafter That is, the throat height TH is more than the length from the end on the air bearing surface 30 side of the MR element 5 to the end on the opposite side, that is, the MR height MR-H. It is getting bigger. The length of the second portion 8b is 150 to 60 of the MR height MR-H.
0% is preferable, and 300 to 500% is particularly preferable. In other words, when the MR height MR-H is 0.5 μm, the length of the second portion 8b is 0.75 to 3.0.
μm is preferable, and 1.5 to 2.5 μm is particularly preferable.

Further, in the present embodiment, the end of the second portion 8b of the lower magnetic pole layer 8 facing the upper magnetic pole layer 13 has the end opposite to the air bearing surface 30 as the air bearing surface 30. It is formed in parallel straight lines. An end of the other portion of the second portion 8b of the lower magnetic pole layer 8 on the side opposite to the air bearing surface 30 is formed in an arc shape similar to the outer peripheral shape of the thin film coil 10. In the present embodiment, as described above, the second portion 8b of the bottom pole layer 8 is formed.
Since the end of the part of the portion facing the upper magnetic pole layer 13 opposite to the air bearing surface 30 is formed in a straight line parallel to the air bearing surface 30, the throat height and the zero throat height position can be accurately controlled. You can

Further, in this embodiment, the top pole layer 13 is formed.
Defines the track width. As shown in FIG.
The upper magnetic pole layer 13 has a first portion 13A, a second portion 13B, and a third portion 13C which are sequentially arranged from the air bearing surface 30 side. The width of the first portion 13A is equal to the recording track width, and the width of the second portion 13B is the first
Is larger than the width of the portion 13A, and the width of the third portion 13C is larger than the width of the second portion 13B. First
The portion 13A corresponds to the track width defining portion in the present invention.

The width of the third portion 13C becomes gradually smaller as it approaches the air bearing surface 30. The widthwise end edge of the portion of the third portion 13C where the width changes is 30 with respect to the direction orthogonal to the air bearing surface 30.
It is preferable that the angle is between 60 ° and 60 °. Also, the second portion 13
The width of B also becomes gradually smaller as it approaches the air bearing surface 30.

In the upper magnetic pole layer 13, the edge connecting the widthwise edge of the first portion 13A and the widthwise edge of the second portion 13B is parallel to the air bearing surface 30. There is. Similarly, in the top pole layer 13, the edge connecting the widthwise edge of the second portion 13B and the widthwise edge of the third portion 13C is also parallel to the air bearing surface 30.

In the top pole layer 13, the first portion 13
The position of the boundary between A and the second portion 13B is arranged near the MR height zero position (the position of the end of the MR element 5 opposite to the air bearing surface 30).

Further, in the top pole layer 13, the position of the boundary between the second portion 13B and the third portion 13C (the position in the vicinity of the step portion between the second portion 13B and the third portion 13C in FIG. 7). Is the position of the end of the second portion 8b of the lower magnetic pole layer 8 opposite to the air bearing surface 30 (the right side in FIG. 7) in the portion facing the upper magnetic pole layer 13,
That is, it is arranged on the air bearing surface 30 side (left side in FIG. 7) with respect to the zero throat height position TH0. Therefore, in the present embodiment, the width W1 of the top pole layer 13 at the zero throat height position TH0 is the recording track width W that is the width of the first portion 13A of the top pole layer 13.
It is larger than 2.

As described above, according to the present embodiment, the throat height is defined by the second portion 8b of the lower magnetic pole layer 8, and the thin film coil 10 is provided with the first portion 8a of the lower magnetic pole layer 8. Since the upper surface of the insulating layer 11 covering the thin film coil 10 is flattened together with the upper surface of the second portion 8b of the lower magnetic pole layer 8, the recording track width is reduced. The defining top pole layer 13 can be formed on a flat surface. Therefore, according to the present embodiment, even if the recording track width is reduced to, for example, a half micron size or a quarter micron size, the upper magnetic pole layer 13 can be accurately formed, and the recording track width is accurately controlled. It will be possible.

Further, according to the present embodiment, since the width of the top pole layer 13 at the zero throat height position is made larger than the recording track width, the saturation of the magnetic flux in the vicinity of the throat height zero position of the top pole layer 13 is prevented. Can be prevented. Further, according to the present embodiment, the width of the top pole layer 13 is gradually reduced as it approaches the air bearing surface 30, so that the cross-sectional area of the magnetic path does not suddenly decrease and the magnetic path It is possible to prevent saturation of magnetic flux on the way. Therefore, according to the present embodiment, the magnetomotive force generated in the thin film coil 10 can be efficiently used for recording, and the overwrite characteristic can be improved.

Further, according to the present embodiment, since the upper magnetic pole layer 13 which defines the recording track width is formed on the flat surface, the width of the upper magnetic pole layer 13 at the zero throat height position is set as described above. When the width is larger than the recording track width, it is possible to prevent the width of the first portion 13A defining the recording track width from increasing. When forming the upper magnetic pole layer on the apex portion, if the width of the upper magnetic pole layer at the throat height zero position is made larger than the recording track width, the portion of the upper magnetic pole layer that defines the recording track width is defined. Easy to grow up to width.

Further, in this embodiment, the top pole layer 13 is formed.
The end of the second portion 13B on the air bearing surface 30 side is parallel to the air bearing surface 30, and the first portion 13A of the top pole layer 13 is connected to this end.
Therefore, the photomask used for forming the top pole layer 13 by photolithography has a recess corresponding to the first portion 13A on the side corresponding to the end of the second portion 13B on the air bearing surface 30 side. Alternatively, the shape is such that a convex portion is added. Whether the portion corresponding to the first portion 13A is the concave portion or the convex portion depends on whether a negative photomask or a positive photomask is used. By forming the top pole layer 13 on the flat surface using the photomask having such a shape, the width of the first portion 13A, that is, the recording track width can be accurately controlled. .

Further, in the present embodiment, the throat height is defined by the second portion 8b of the bottom pole layer 8, but
The length of the second portion 8b is the length from the end of the MR element 5 on the air bearing surface 30 side to the end on the opposite side, that is, M.
It is made larger than the R height MR-H. Therefore, according to the present embodiment, the contact area between the first portion 8a and the second portion 8b of the bottom pole layer 8 can be increased, and the saturation of the magnetic flux in this portion can be prevented.

As the length of the second portion 8b of the lower magnetic pole layer 8 is larger than the MR height MR-H, the contact area between the first portion 8a and the second portion 8b of the lower magnetic pole layer 8 is increased. growing. Therefore, if the difference between the length of the second portion 8b of the bottom pole layer 8 and the MR height MR-H is small, the effect of preventing saturation of the magnetic flux becomes small, and the degree of improvement in overwrite characteristics becomes small. On the other hand, if the length of the second portion 8b of the bottom pole layer 8 becomes too large, the magnetic path length becomes large, and conversely the overwrite characteristic deteriorates. Therefore, the second portion 8b of the bottom pole layer 8
There is a preferred range for the length of
As described above, the length of the second portion 8b of the bottom pole layer 8 is preferably 150 to 600% of the MR height MR-H, and particularly preferably 300 to 500%.

As described above, according to the present embodiment, even when the recording track width is made small, the recording track width can be accurately controlled and the saturation of the magnetic flux in the middle of the magnetic path can be prevented. .

Further, in the present embodiment, the thin film coil 10
Are arranged beside the second portion 8b of the bottom pole layer 8 and are formed on the flat insulating film 9. Therefore, according to the present embodiment, the thin film coil 10 can be formed minutely and accurately. Furthermore, according to the present embodiment, since the apex portion does not exist, the thin film is formed near the end of the second portion 8b of the lower magnetic pole layer 8 opposite to the air bearing surface 30, that is, near the throat height zero position. The ends of the coil 10 can be arranged.

From the above, according to the present embodiment, it is possible to reduce the magnetic path length by, for example, about 30 to 40% as compared with the conventional case, and as a result, the magnetomotive force generated in the thin film coil 10 can be efficiently generated. It can be used for recording. Therefore, according to the present embodiment, the high frequency characteristics of the recording head and the non-linear transition shift (Non-linear Transi
It is possible to provide a thin film magnetic head having excellent overwrite characteristics.

Further, according to the present embodiment, since the magnetic path length can be reduced, the total length of the thin film coil 10 can be greatly shortened without changing the number of turns. As a result, the resistance of the thin film coil 10 can be reduced, and the thickness of the thin film coil 10 can be correspondingly reduced.

Further, in the present embodiment, since the insulating film 9 made of an inorganic material that is thin and has a sufficient withstand voltage is provided between the first portion 8a of the lower magnetic pole layer 8 and the thin film coil 10, A large withstand voltage can be obtained between the first portion 8a of the bottom pole layer 8 and the thin film coil 10.

In the present embodiment, the thin film coil 10
Is covered with the insulating layer 11 made of an inorganic insulating material, it is possible to prevent the magnetic pole portion from protruding toward the recording medium due to expansion due to heat generated around the thin film coil 10 during use of the thin film magnetic head. .

[Second Embodiment] Next, with reference to FIG. 10, a thin film magnetic head and a method of manufacturing the same according to a second embodiment of the present invention will be described. FIG. 10 is a plan view showing the main part of the thin film magnetic head according to the present embodiment. In FIG. 10, the overcoat layer and other insulating layers and films are omitted.

In the present embodiment, the first portion 8a of the bottom pole layer 8 is wider than that in the first embodiment, specifically, the area where the entire thin film coil 10 is arranged. It is formed in the area. Further, in the present embodiment, the second portion 8b of the bottom pole layer 8 is formed so as to surround the periphery of the thin film coil 10. The length from the end on the air bearing surface 30 side of the second portion 8b of the lower magnetic pole layer 8 that defines the throat height to the end on the opposite side,
That is, the throat height TH is larger than the length from the end of the MR element 5 on the air bearing surface 30 side to the end on the opposite side, that is, the MR height MR-H, as in the first embodiment. .

According to the present embodiment, by making the second portion 8b of the bottom pole layer 8 have the above-described shape, the accuracy of flattening the insulating layer 11 can be improved.

Further, the top pole layer 1 according to the present embodiment.
Reference numeral 3 denotes a first arranged in order from the air bearing surface 30 side.
Portion 13A, second portion 13B and third portion 13
Has C. First part 13A and second part 1
The shape of 3B is similar to that of the first embodiment. The width of the third portion 13C changes as follows. That is, the width of the third portion 13C widens from the end on the air bearing surface 30 side so as to form, for example, 30 ° to 60 ° with respect to the direction orthogonal to the air bearing surface 30, and then becomes larger. It spreads at an angle and then becomes a constant width.

Other configurations, operations and effects in this embodiment are the same as those in the first embodiment.

[Third Embodiment] A thin film magnetic head according to a third embodiment of the present invention and a method of manufacturing the same will be described below with reference to FIG. FIG. 11 is a plan view showing a main part of the thin film magnetic head according to the present embodiment. In FIG. 11, the overcoat layer and other insulating layers and films are omitted.

The second part of the bottom pole layer 8 in the present embodiment
The portion 8b has a T shape in which the width of a portion on the air bearing 30 side is smaller than the widths of other portions. The end of the second portion 8b of the lower magnetic pole layer 8 opposite to the air bearing surface 30 is formed in a straight line parallel to the air bearing surface 30 and is arranged at the zero throat height position TH0. .

According to the present embodiment, the width of the second portion 8b of the lower magnetic pole layer 8 at the air bearing surface 30 is set by forming the second portion 8b of the lower magnetic pole layer 8 as described above. By making it smaller, it is possible to prevent an increase in the effective track width. Further, according to the present embodiment, the width of the second portion 8b of the lower magnetic pole layer 8 is gradually reduced toward the air bearing surface 30, so that saturation of magnetic flux in the lower magnetic pole layer 8 is prevented. can do. Also,
According to the present embodiment, the second portion 8b of the bottom pole layer 8 is formed.
Since the end portion on the opposite side of the air bearing surface 30 is formed in a straight line parallel to the air bearing surface 30, it is possible to accurately control the throat height and the zero throat height position.

Other configurations, operations and effects in this embodiment are the same as those in the first embodiment.

[Fourth Embodiment] A thin film magnetic head and a method of manufacturing the same according to a fourth embodiment of the present invention will now be described with reference to FIG. FIG. 12 is a plan view showing the main part of the thin film magnetic head according to the present embodiment. Note that, in FIG. 12, the overcoat layer and other insulating layers and insulating films are omitted.

The second part of the bottom pole layer 8 in the present embodiment
8b has a central portion 8b ₁ that faces the top pole layer 13 and defines the throat height, and lateral portions 8b ₂ and 8b ₃ formed on both sides of the central portion 8b _{1 in} the width direction. ing. Air bearing surface 30 in the central portion 8b ₁
The end portion on the side opposite to is formed in a straight line parallel to the air bearing surface 30 and is arranged at the throat height zero position TH0. The length from the end on the air bearing surface 30 side to the end on the opposite side of the side portions 8b ₂ and 8b ₃ is
At the boundary with the central portion 8b ₁ , it is equal to the throat height, and after changing from the boundary toward the outside, the size becomes constant.

Further, in this embodiment, the top pole layer 13 is formed.
Has a first portion 13A and a second portion 13D which are sequentially arranged from the air bearing surface 30 side. The width of the first portion 13A is equal to the recording track width, and the width of the second portion 1A
The width of 3D is equal to the recording track width at the boundary with the first portion 13A, and gradually increases as the distance from the air bearing surface 30 increases. It is preferable that the widthwise end edge of the portion where the width of the second portion 13D changes is 30 ° to 60 ° with respect to the direction orthogonal to the air bearing surface 30. The position of the boundary between the first portion 13A and the second portion 13D is arranged closer to the air bearing surface 30 than the throat height zero position TH0. Therefore, the width W1 of the top pole layer 13 at the zero throat height position TH0 is larger than the recording track width W2 which is the width of the first portion 13A of the top pole layer 13.
The position of the boundary between the first portion 13A and the second portion 13D is preferably at a position of 0 to 1.0 μm in the direction away from the air bearing surface 30 from the MR height zero position.

According to this embodiment, the first pole layer of the bottom pole layer 8 is
The central portion 8b of the second portion 8b ₁Air bearing
The end opposite the surface 30 is parallel to the air bearing surface 30
Since it is formed in a straight line, throat height and throw
The height zero position can be accurately controlled. Well
In addition, according to the present embodiment, the second portion of the bottom pole layer 8 is formed.
8b lateral portion 8b₂, 8b₃Air bearing surface
The length from the end on the 30 side to the end on the opposite side,
8b₁The central portion 8b except for the boundary portion with₁Greater than
As a result, the entire second portion 8b has a constant length.
Compared to the case, the volume of the second portion 8b and the first portion
It is possible to increase the contact area between 8a and the second portion 8b.
Even if the throat height is small, the first
Of the magnetic flux at the connection between the portion 8a and the second portion 8b
Saturation can be prevented.

Further, according to the present embodiment, the width of the second portion 13D of the top pole layer 13 is set to the air bearing surface 30.
Since it is gradually reduced as it approaches the side, saturation of the magnetic flux in the top pole layer 13 can be prevented.

Other configurations, operations and effects of this embodiment are the same as those of the first embodiment.

[Fifth Embodiment] A thin film magnetic head according to a fifth embodiment of the present invention and a method of manufacturing the same will be described below with reference to FIG. FIG. 13 is a plan view showing a main part of the thin film magnetic head according to the present embodiment. Note that, in FIG. 13, the overcoat layer, other insulating layers and insulating films are omitted.

The second part of the bottom pole layer 8 in the present embodiment
8b has a central portion 8b ₁ that faces the top pole layer 13 and defines the throat height, and lateral portions 8b ₂ and 8b ₃ formed on both sides of the central portion 8b _{1 in} the width direction. ing. Air bearing surface 30 in the central portion 8b ₁
The end portion on the side opposite to is formed in a straight line parallel to the air bearing surface 30 and is arranged at the throat height zero position TH0. The length from the end on the air bearing surface 30 side to the end on the opposite side of the side portions 8b ₂ and 8b ₃ is
At the boundary with the central portion 8b ₁ , it is equal to the throat height, and after changing from the boundary toward the outside, the size becomes constant. Side part 8
Of b ₂ and 8b ₃ , the end opposite to the air bearing surface 30 in the portion where the length from the end on the air bearing surface 30 side to the end on the opposite side changes is the third end of the upper magnetic pole layer 13. The portion 13C is arranged along the position of the end portion in the width direction.

According to this embodiment, the first magnetic pole layer 8 of the lower magnetic pole layer 8 is formed.
The central portion 8b of the second portion 8b ₁Air bearing
The end opposite the surface 30 is parallel to the air bearing surface 30
Since it is formed in a straight line, throat height and throw
The height zero position can be accurately controlled. Well
In addition, according to the present embodiment, the second portion of the bottom pole layer 8 is formed.
8b lateral portion 8b₂, 8b₃Air bearing surface
The length from the end on the 30 side to the end on the opposite side,
8b₁The central portion 8b except for the boundary portion with₁Greater than
As a result, the entire second portion 8b has a constant length.
Compared to the case, the volume of the second portion 8b and the first portion
It is possible to increase the contact area between 8a and the second portion 8b.
Even if the throat height is small, the first
Of the magnetic flux at the connection between the portion 8a and the second portion 8b
Saturation can be prevented.

Other configurations, operations, and effects in this embodiment are the same as those in the first embodiment.

[Sixth Embodiment] A thin film magnetic head according to a sixth embodiment of the present invention and a method for manufacturing the same will be described below with reference to FIGS. 14 to 19, (a) shows a cross section perpendicular to the air bearing surface, and (b) shows a cross section parallel to the air bearing surface of the magnetic pole portion.

In the method of manufacturing a thin film magnetic head according to the present embodiment, first, as shown in FIG. 14, for example, alumina (Al ₂ O ₃ .TiC) is placed on a substrate 1 made of, for example, alumina (Al ₂ O ₃ .TiC). Insulating layer 2 consisting of ₂ O ₃ )
Deposit with a thickness of m. Next, a lower shield layer 3 for a reproducing head made of a magnetic material such as permalloy is selectively formed on the insulating layer 2 with a thickness of about 3 μm. Next, although not shown, an insulating layer made of alumina, for example, having a thickness of 4 to 5 μm, for example, is formed on the entire surface by, for example, CM.
The lower shield layer 3 is polished with P until the surface is flattened.

Next, as shown in FIG. 15, a lower shield gap film 4 as an insulating film is formed on the lower shield layer 3 to have a thickness of, for example, about 20 to 40 nm. Next, the MR element 5 for reproduction is formed on the lower shield gap film 4 to have a thickness of several tens nm. Next, on the lower shield gap film 4, a pair of electrode layers 6 electrically connected to the MR element 5 are formed with a thickness of several tens nm. Next, an upper shield gap film 7 as an insulating film is formed on the lower shield gap film 4 and the MR element 5 to have a thickness of, for example, about 20 to 40 nm, and the MR element 5 is formed in the shield gap films 4 and 7. Buried.

Next, on the upper shield gap film 7,
The first portion 8a of the bottom pole layer 8 made of a magnetic material is selectively formed with a thickness of about 1.0 to 2.0 μm. The first portion 8a of the bottom pole layer 8 is arranged at a position facing at least a part of a thin film coil described later.

Then, as shown in FIG. 16, the second portion 8b and the third portion 8c of the lower magnetic pole layer 8 are formed on the first portion 8a of the lower magnetic pole layer 8 by about 1.5. It is formed to a thickness of ˜2.5 μm. The second portion 8b forms the magnetic pole portion of the lower magnetic pole layer 8 and is connected to the surface of the first portion 8a on the thin film coil side. The third portion 8c is a portion for connecting the first portion 8a and an upper pole layer described later. The position of the end of the second portion 8b opposite to the air bearing surface 30 in the portion facing the top pole layer defines the throat height. That is, the air bearing surface 30 in the portion of the second portion 8b facing the upper magnetic pole layer.
The position of the end on the opposite side to is the throat height zero position.

Next, an insulating film 9 made of alumina, for example, is formed on the entire surface to a thickness of about 0.3 to 0.6 μm.

Next, the photoresist is patterned by a photolithography process to form a frame 19 for forming the thin film coil by the frame plating method. Next, using this frame 19, a first layer portion 31 of a thin-film coil made of, for example, copper is formed by frame plating to a thickness of, for example, about 1.0 to 2.0 μm and 1.
It is formed with a coil pitch of 2 to 2.0 μm. Next, the frame 19 is removed. In the figure, reference numeral 31a indicates a connecting portion for connecting the first layer portion 31 of the thin film coil to a second layer portion described later.

Next, as shown in FIG. 17, an insulating layer 32 made of alumina, for example, is formed to a thickness of about 3 to 4 μm on the entire surface. Next, the insulating layer 32 is polished by CMP, for example, until the second portion 8b and the third portion 8c of the bottom pole layer 8 are exposed, and the surface is planarized.
Here, in FIG. 17, the first layer portion 31 of the thin film coil is not exposed, but the first layer portion 31 of the thin film coil may be exposed.

Then, as shown in FIG. 18, the recording gap layer 12 made of an insulating material is formed on the exposed second and third portions 8b and 8c of the bottom pole layer 8 and the insulating layer 32.
Is formed to have a thickness of, for example, 0.2 to 0.3 μm. Next, in order to form a magnetic path, the third portion 8c of the lower magnetic pole layer 8 is formed.
Then, the recording gap layer 12 is partially etched to form a contact hole.

Next, the pole portion layer 41 including the pole portion of the upper pole layer that defines the recording track width is formed on the recording gap layer 12 to have a thickness of, for example, 2 to 3 μm, and
The magnetic layer 42 is formed in a thickness of 2 to 3 μm at the position of the contact hole formed on the portion of the lower magnetic pole layer 8 located on the third portion 8c. The magnetic layer 42 is a portion for connecting the yoke portion layer of the upper magnetic pole layer described later and the lower magnetic pole layer 8. In the present embodiment, the length from the end on the air bearing surface 30 side of the pole portion layer 41 of the upper magnetic pole layer to the end on the opposite side is the opposite side from the end on the air bearing surface 30 side of the MR element 5. Is greater than the length from the end on the air bearing surface 30 side of the second portion 8b of the bottom pole layer 8 that defines the throat height to the end on the opposite side. Is formed.

The magnetic pole part layer 41 and the magnetic layer 42 of the upper magnetic pole layer are made of NiFe (Ni: 80% by weight, Fe: 20% by weight) or NiFe (Ni: 4) which is a high saturation magnetic flux density material.
5% by weight, Fe: 55% by weight) or the like, and may be formed by a plating method, or Fe which is a high saturation magnetic flux density material.
It may be formed by sputtering using a material such as N or FeZrN. Besides this, C which is a high saturation magnetic flux density material
An amorphous material such as oFe or Co may be used.

Next, by using the pole portion layer 41 of the top pole layer as a mask, the recording gap layer 1 is dry-etched.
2 is selectively etched. For the dry etching at this time, for example, chlorine-based gas such as BCl ₂ or Cl ₂ or
Reactive ion etching (RIE) using a gas such as a fluorine-based gas such as CF ₄ or SF ₆ is used. Next, the second portion 8b of the bottom pole layer 8 is selectively etched by about 0.3 to 0.6 μm by, for example, argon ion milling to obtain a trim structure as shown in FIG. 18B. .

Next, an insulating film 33 made of alumina, for example, is formed on the entire surface to a thickness of about 0.3 to 0.6 μm.
Next, the contact hole is formed by partially etching the insulating film 33, the recording gap layer 12, and the insulating layer 32 in the portion above the connection portion 31a of the first layer portion 31 of the thin film coil. Next, the second layer portion 34 of the thin-film coil made of, for example, copper is formed by frame plating, for example, with a thickness of about 1.0 to 2.0 μm and a coil pitch of 1.2 to 2.0 μm. In the figure, reference numeral 34a indicates
A connecting portion for connecting the second layer portion 34 of the thin film coil to the first layer portion 31 through the contact hole is shown.

Next, as shown in FIG. 19, an insulating layer 35 made of alumina, for example, is formed to a thickness of about 3 to 4 μm on the entire surface. Next, by CMP, for example, until the pole portion layer 41 and the magnetic layer 42 of the top pole layer are exposed,
The insulating layer 35 is polished to planarize the surface. Here, although the second layer portion 34 of the thin film coil is not exposed in FIG. 19, the second layer portion 34 of the thin film coil may be exposed. When the second layer portion 34 is exposed, another insulating layer is formed on the second layer portion 34 and the insulating layer 35.

Next, a yoke portion layer forming a yoke portion of the upper pole layer made of a magnetic material for a recording head is formed on the pole portion layer 41, the magnetic layer 42 and the insulating layer 35 of the flattened upper pole layer. 43 is formed to a thickness of, for example, about 2 to 3 μm. The yoke portion layer 43 is in contact with the third portion 8c of the lower magnetic pole layer 8 via the magnetic layer 42 and is magnetically coupled to the third portion 8c. The yoke portion layer 43 of the upper magnetic pole layer is made of Ni.
Fe (Ni: 80% by weight, Fe: 20% by weight) and NiFe (Ni: 45% by weight, F) which is a high saturation magnetic flux density material
e: 55% by weight) or the like, and may be formed by a plating method, or FeN, FeZr which is a high saturation magnetic flux density material.
It may be formed by sputtering using a material such as N.
In addition to these, CoFe and Co which are high saturation magnetic flux density materials
A system amorphous material or the like may be used. Further, in order to improve high frequency characteristics, the yoke portion layer 43 of the upper magnetic pole layer may have a structure in which an inorganic insulating film and a magnetic layer such as permalloy are superposed.

In this embodiment, the end surface of the yoke portion layer 43 of the top pole layer on the air bearing surface 30 side is arranged at a position away from the air bearing surface 30 (on the right side in the drawing). In the present embodiment, particularly, the distance from the air bearing surface 30 to the end of the yoke portion layer 43 on the air bearing surface 30 side is determined by the air bearing surface 3 of the MR element 5.
The length from the end on the 0 side to the end on the opposite side is not less than the length.

Next, an overcoat layer 37 made of alumina, for example, is formed over the entire surface to a thickness of 20 to 40 μm, the surface thereof is flattened, and an electrode pad (not shown) is formed thereon. Finally, the slider is polished to form the air bearing surfaces 30 of the recording head and the reproducing head, and the thin film magnetic head according to the present embodiment is completed.

In this embodiment, the upper magnetic pole layer composed of the magnetic pole part layer 41, the magnetic layer 42 and the yoke part layer 43 is
It corresponds to the second magnetic layer of the invention.

FIG. 20 is a plan view showing the main part of the thin film magnetic head according to the present embodiment. Note that the overcoat layer and other insulating layers and films are omitted in FIG. In FIG. 20, the symbol TH represents the throat height, TH0 represents the throat height zero position, and MR-H represents the MR height.

In the present embodiment, the lower magnetic pole layer 8 has a first portion 8a arranged at a position facing the first layer portion 31 of the thin film coil, and the first portion of the thin film coil in the first portion 8a. The first layer portion 31 of the thin-film coil is connected to the surface on the layer portion 31 side and forms a magnetic pole portion and defines a throat height. It is arranged on the side of 8b. Similar to the first embodiment, the length of the portion of the second portion 8b of the bottom pole layer 8 that defines the throat height from the end on the air bearing surface 30 side to the end on the opposite side (hereinafter, (Also referred to as the length of the second portion 8b.) That is, the throat height TH
Is longer than the length from the end on the air bearing surface 30 side of the MR element 5 to the end on the opposite side, that is, the MR height MR-H. The length of the second portion 8b is preferably 150 to 600% of the MR height MR-H, particularly 30.
0 to 500% is preferable. In other words, MR height M
When RH is, for example, 0.5 μm, the second portion 8b
The length is preferably 0.75 to 3.0 μm, and particularly 1.
5 to 2.5 μm is preferable.

Further, in this embodiment, the track width is defined by the magnetic pole part layer 41 of the upper magnetic pole layer. As shown in FIG. 20, the magnetic pole portion layer 41 of the upper magnetic pole layer has a first portion 41 arranged in order from the air bearing surface 30 side.
It has A, the 2nd part 41B, and the 3rd part 41C. The width of the first portion 41A is equal to the recording track width, and the width of the second portion 41B is larger than the width of the first portion 41A. The width of the third portion 41C is equal to the width of the second portion 42B at the boundary portion with the second portion 42B, and after changing so as to increase from the boundary portion toward the side opposite to the air bearing surface 30. , Has a certain size.

In the pole portion layer 41 of the top pole layer, the widthwise edge of the first portion 41A and the second portion 41 are formed.
The edge connecting the widthwise edge of B is the air bearing surface 3
It is parallel to 0.

In the pole portion layer 41 of the top pole layer, the position of the boundary between the first portion 41A and the second portion 41B is
It is located near the MR height zero position.

In the pole portion layer 41 of the top pole layer, the position of the boundary between the second portion 41B and the third portion 41C is the pole portion layer 41 of the second portion 8b of the bottom pole layer 8. It is arranged on the air bearing surface 30 side of the position of the end portion on the opposite side of the air bearing surface 30 in the facing portion, that is, the zero throat height position TH0. Therefore, in the present embodiment, the width W1 of the pole portion layer 41 at the zero throat height position TH0 is the recording track width W which is the width of the first portion 41A of the pole portion layer 41.
It is larger than 2.

The yoke portion layer 43 of the upper magnetic pole layer is the first portion 43A sequentially arranged from the air bearing surface 30 side.
And a second portion 43B. York part layer 43
The first portion 43A has a width substantially equal to the maximum width of the pole portion layer 41 in the third portion 41C. The width of the second portion 43B of the yoke portion layer 43 is equal to the width of the first portion 43A at the boundary portion with the first portion 43A, and becomes larger from the boundary portion toward the side opposite to the air bearing surface 30. After that, it has become a certain size. In addition, the first portion 43 of the yoke portion layer 43
A is arranged at a position substantially overlapping the second portion 41B and the third portion 41C of the magnetic pole portion layer 41.

As described above, according to the present embodiment, the throat height is defined by the second portion 8b of the bottom pole layer 8, and the first layer portion 31 of the thin film coil is formed.
Is disposed on the first portion 8a of the lower pole layer 8 and to the side of the second portion 8b, and the upper surface of the insulating layer 32 covering the first layer portion 31 of the thin-film coil is located on the first portion 8a of the lower pole layer 8. 2 part 8b
The upper pole layer is divided into the pole portion layer 41 and the yoke portion layer 43, and the pole portion layer 41 of the upper pole layer that defines the recording track width is formed on the flat surface. be able to. Therefore, according to the present embodiment, even if the recording track width is reduced to, for example, a half-micron size or a quarter-micron size, the magnetic pole portion layer 41 can be accurately formed, and the recording track width is accurately controlled. It will be possible.

Further, according to the present embodiment, the width of the pole portion layer 41 of the upper pole layer at the zero throat height position is made larger than the recording track width.
It is possible to prevent saturation of the magnetic flux in the vicinity of the zero throat height position of 1. Further, according to the present embodiment, the width of the magnetic pole portion layer 41 is gradually reduced as it approaches the air bearing surface 30, so that the cross-sectional area of the magnetic path does not suddenly decrease, and the magnetic path It is possible to prevent saturation of magnetic flux on the way. Furthermore, according to the present embodiment, the width of the pole portion layer 41 of the top pole layer at the zero throat height position is made larger than the recording track width, so that the pole portion layer 41 and the yoke portion layer 43 of the top pole layer are formed.
The contact area with the magnetic pole part layer 41 can be increased.
It is possible to prevent saturation of the magnetic flux in the connection portion between the yoke portion layer 43 and the yoke portion layer 43. Therefore, according to the present embodiment, the magnetomotive force generated in the thin film coils 31 and 34 can be efficiently used for recording, and the overwrite characteristic can be improved.

Further, according to the present embodiment, since the pole portion layer 41 of the upper pole layer which defines the recording track width is formed on the flat surface, the throat height of the pole portion layer 41 is zero as described above. When the width at the position is made larger than the recording track width, it is possible to prevent the width of the first portion 41A defining the recording track width from increasing.

Further, in this embodiment, the magnetic pole portion layer 41.
The end of the second portion 41B on the air bearing surface 30 side is parallel to the air bearing surface 30, and the first portion 41A of the magnetic pole portion layer 41 is connected to this end.
Therefore, the photomask used for forming the pole portion layer 41 by photolithography has a concave portion corresponding to the first portion 41A on the side corresponding to the end portion of the second portion 41B on the air bearing surface 30 side. Alternatively, the shape is such that a convex portion is added. By forming the magnetic pole portion layer 41 on the flat surface using the photomask having such a shape, it becomes possible to accurately control the width of the first portion 41A, that is, the recording track width. .

Further, according to the present embodiment, the second layer portion 34 of the thin film coil is arranged on the side of the magnetic pole portion layer 41 of the upper magnetic pole layer, and the insulating layer 3 covering the second layer portion 34 of the thin film coil.
Since the upper surface of 5 is flattened together with the upper surface of the pole portion layer 41, the yoke portion layer 43 of the recording head can also be formed on the flat surface. Therefore, according to the present embodiment, the yoke portion layer 43 can also be finely formed, and as a result, it is possible to prevent the occurrence of so-called side light and side erase.

Further, in the present embodiment, the end surface of the yoke portion layer 43 of the upper magnetic pole layer on the side of the air bearing surface 30 is arranged at a position away from the air bearing surface 30. Therefore, even when the throat height is small, the yoke portion layer 43 of the upper magnetic pole layer is not exposed to the air bearing surface 30, and as a result, so-called side light and side erase can be prevented from occurring.

Further, in the present embodiment, the length from the end on the air bearing surface 30 side of the pole portion layer 41 of the upper magnetic pole layer to the end on the opposite side is set to the length on the air bearing surface 30 side of the MR element 5. Length from one end to the other, ie M
The height is made larger than the R height, and the end surface of the yoke portion layer 43 on the air bearing surface 30 side is formed by the air bearing surface 30.
It is located away from. Therefore, in the present embodiment, the air bearing surface 3 is located at a position higher than the MR height zero position.
Even at a position away from 0, the pole portion layer 41 of the top pole layer and the yoke portion layer 43 can be in contact with each other.
Therefore, according to the present embodiment, the end surface of the yoke portion layer 43 on the side of the air bearing surface 30 is arranged at a position distant from the air bearing surface 30 to prevent the occurrence of side light and side erase, and at the same time, to form the upper pole layer. In the above, it is possible to prevent the cross-sectional area of the magnetic path from abruptly decreasing and prevent saturation of the magnetic flux in the middle of the magnetic path.

Further, in the present embodiment, the distance from the air bearing surface 30 to the end of the yoke portion layer 43 on the air bearing surface 30 side is determined by the air bearing surface 3 of the MR element 5.
The length from the end on the 0 side to the end on the opposite side, that is, MR
More than height.

Now, with reference to FIG. 21, description will be given of experimental results for obtaining the relationship between the position of the end of the yoke portion layer 43 on the air bearing surface 30 side and the side erase characteristic. In this experiment, the positions of the end portions of the yoke portion layer 43 on the air bearing surface 30 side are the positions of the air bearing surface (referred to as ABS in FIG. 21) 30 and 0.2 μm and 0.4 μm from the air bearing surface 30, respectively. , 0.6 μm, 0.
Seven types of thin-film magnetic heads were used at each position of 8 μm, 1.0 μm, and 1.2 μm. The MR height is 0.6
μm.

In this experiment, for each thin-film magnetic head, after writing data on a certain track on the recording medium by the thin-film magnetic head, the thin-film magnetic head was moved to the adjacent track to write the data on the adjacent track. 20
The operation was performed 0 times, then the thin film magnetic head was moved to the track where the data was first written, the data was read at the track where the data was first written, and the reproduction output at that time was obtained. The current supplied to the recording head during writing was 50 mA. Further, in FIG. 21, the reproduction output is expressed as a percentage (%) with respect to the desired reproduction output. The reproduction output of 100% means that there is no side erase at all, and the smaller the reproduction output, the greater the degree of side erase.

From FIG. 21, it can be seen that the reproduction output increases and the side erase can be prevented as the distance from the air bearing surface 30 to the end of the yoke portion layer 43 on the air bearing surface 30 side increases. Further, it can be seen from FIG. 21 that the side erase hardly occurs when the distance from the air bearing surface 30 to the end of the yoke portion layer 43 on the air bearing surface 30 side is 0.6 μm or more, which is the MR height. The side erase and the side light are both generated by the leakage magnetic flux from the yoke part layer 43, and the generation principle is the same. Therefore, the same applies to the side erase as the side erase.

As described above, the distance from the air bearing surface 30 to the end of the yoke portion layer 43 on the air bearing surface 30 side is set to the MR height or more to further prevent the occurrence of side light and side erase. Is possible.

Further, in the present embodiment, the insulating film 33 made of an inorganic material is provided between the first layer portion 31 and the second layer portion 34 of the thin film coil, in addition to the recording gap layer 12. , First layer portion 31 and second layer portion 3 of the thin film coil
It is possible to obtain a large withstand voltage between 4 and
The leakage of magnetic flux from the thin film coils 31 and 34 can be reduced.

Other configurations, operations and effects in this embodiment are the same as those in the first embodiment.

[Seventh Embodiment] Next, with reference to FIG. 22, a thin film head and a method of manufacturing the same according to a seventh embodiment of the present invention will be described. FIG. 22 is a plan view showing the main part of the thin film magnetic head according to the present embodiment. Note that the overcoat layer and other insulating layers and films are omitted in FIG.

Second Bottom Pole Layer 8 of this Embodiment
The width of a part of the portion 8b on the air bearing 30 side is
It has a shape that is smaller than the widths of other portions and becomes smaller toward the air bearing 30 side. Also,
Air bearing surface 30 of the second portion 8b of the bottom pole layer 8
The end portion on the side opposite to is formed in a straight line parallel to the air bearing surface 30 and is arranged at the throat height zero position TH0.

According to the present embodiment, the width of the second portion 8b of the lower magnetic pole layer 8 at the air bearing surface 30 is set by forming the second portion 8b of the lower magnetic pole layer 8 as described above. By making it smaller, it is possible to prevent an increase in the effective track width. Further, according to the present embodiment, the width of the second portion 8b of the bottom pole layer 8 is set to the air bearing surface 3
Since it gradually decreases as it approaches 0, it is possible to prevent saturation of the magnetic flux in the lower magnetic pole layer 8. Further, according to the present embodiment, since the end portion of the second portion 8b of the lower magnetic pole layer 8 on the side opposite to the air bearing surface 30 is formed in a straight line parallel to the air bearing surface 30, the throat height and The throat height zero position can be accurately controlled.

Other configurations, operations and effects in this embodiment are the same as those in the sixth embodiment.

The present invention is not limited to the above-mentioned embodiments, but various modifications can be made. For example, in each of the above-described embodiments, the thin-film magnetic head having a structure in which the reading MR element is formed on the substrate side and the inductive magnetic conversion element for writing is stacked on the MR element has been described, but the stacking order is reversed. You may

That is, an inductive magnetic conversion element for writing may be formed on the substrate side, and an MR element for reading may be formed thereon. In such a structure, for example, the magnetic film having the function of the upper magnetic pole layer described in the above embodiment is formed as the lower magnetic pole layer on the substrate side, and the magnetic gap film is formed so as to face the recording gap film. This can be realized by forming the magnetic film having the function of the lower magnetic pole layer shown in the embodiment as the upper magnetic pole layer. In this case, it is preferable that the upper magnetic pole layer of the inductive magnetic conversion element also serves as the lower shield layer of the MR element.

[0154]

As described above, in the method of manufacturing the thin film magnetic head according to any one of claims 1 to 7 or the method of manufacturing the thin film magnetic head according to any one of claims 8 to 14, the first magnetic layer is formed. The throat height is defined by the end of the second portion opposite to the medium facing surface, at least a portion of the thin-film coil is arranged laterally of the second portion, and by the track width defining portion of the second magnetic layer. The track width is specified. As a result, according to the present invention, the second magnetic layer can be accurately formed on the flat surface, and as a result, the track width can be accurately controlled. Further, in the present invention, the end of the track width defining portion on the side opposite to the medium facing surface is disposed on the medium facing surface side with respect to the end of the second portion on the side opposite to the medium facing surface, A part of the portion facing the track width defining portion through the gap layer has the same width as the track width defining portion;
The width of the second magnetic layer at a position corresponding to the end portion of the portion (2) opposite to the medium facing surface is larger than the width of the track width defining portion. As a result, according to the present invention, it is possible to prevent saturation of the magnetic flux in the middle of the magnetic path. Further, in the present invention, at least a part of the end portion of the thin film coil is provided with
It is possible to arrange the portion close to the end of the portion, and this makes it possible to reduce the magnetic path length. From the above,
According to the present invention, even when the track width of the recording head is reduced, it is possible to accurately control the track width, prevent saturation of magnetic flux in the middle of the magnetic path, and reduce the magnetic path length. Has the effect that it becomes possible.

Further, in the method of manufacturing a thin film magnetic head according to claim 2 or the thin film magnetic head according to claim 9,
An insulating layer which covers at least a part of the thin-film coil disposed on the side of the second portion and whose surface on the second magnetic layer side is flattened together with the surface on the second magnetic layer side in the second portion. Has been. As a result, according to the present invention, there is an effect that the second magnetic layer can be accurately formed on the flat surface.

In the method of manufacturing a thin film magnetic head according to claim 5 or the thin film magnetic head according to claim 12, the second magnetic layer has a magnetic pole part layer and a yoke part layer, and the medium of the yoke part layer is a medium. The end surface on the facing surface side is arranged at a position away from the medium facing surface. As a result, according to the present invention, it is possible to prevent writing of data in an area other than the area to be recorded and erasure of data in the area other than the area to be recorded.

In the method of manufacturing a thin film magnetic head according to claim 7 or the method of manufacturing a thin film magnetic head according to claim 14, the thin film coil has a first portion disposed laterally of the second portion of the first magnetic layer. The thin film magnetic head further includes a layer portion and a second layer portion disposed on a side of the magnetic pole portion layer of the second magnetic layer, and further covers the first layer portion of the thin film coil and the second portion thereof. The magnetic layer side surface covers the first insulating layer in which the second portion is flattened together with the second magnetic layer side surface and the second layer portion of the thin film coil, and the yoke portion layer side surface is the magnetic pole. The second insulating layer is provided along with the surface of the partial layer on the yoke partial layer side. As a result, according to the present invention, there is an effect that the yoke portion layer of the second magnetic layer can be accurately formed.

[Brief description of drawings]

FIG. 1 is a sectional view for explaining one step in a method of manufacturing a thin film magnetic head according to a first embodiment of the invention.

FIG. 2 is a cross-sectional view for explaining a step following FIG.

FIG. 3 is a cross-sectional view for explaining a step following the step of FIG.

FIG. 4 is a cross-sectional view for explaining a step following the step of FIG.

FIG. 5 is a cross-sectional view for explaining a step following the step of FIG.

FIG. 6 is a cross-sectional view of the thin film magnetic head according to the first embodiment of the invention.

FIG. 7 is an explanatory diagram showing a plan view and a cross-sectional view of a main part of the thin film magnetic head according to the first embodiment of the present invention in association with each other.

FIG. 8 is a perspective view showing a main portion of the thin-film magnetic head according to the first embodiment of the present invention with a part thereof cut away.

FIG. 9 is a perspective view showing a main part of the thin-film magnetic head according to the first embodiment of the present invention with a part thereof cut away.

FIG. 10 is a plan view of a thin-film magnetic head according to a second embodiment of the invention.

FIG. 11 is a plan view of a thin film magnetic head according to a third embodiment of the invention.

FIG. 12 is a plan view of a thin-film magnetic head according to a fourth embodiment of the invention.

FIG. 13 is a plan view of a thin film magnetic head according to a fifth embodiment of the invention.

FIG. 14 is a cross-sectional view for explaining one step in the method of manufacturing the thin-film magnetic head according to the sixth embodiment of the invention.

FIG. 15 is a cross-sectional view for explaining a process following the process in FIG.

16 is a cross-sectional view for explaining a step following FIG.

FIG. 17 is a cross-sectional view illustrating a step following the step of FIG.

FIG. 18 is a cross-sectional view illustrating a step following the step of FIG.

FIG. 19 is a sectional view of a thin-film magnetic head according to a sixth embodiment of the invention.

FIG. 20 is a plan view of a thin film magnetic head according to a sixth embodiment of the invention.

FIG. 21 is a characteristic diagram showing the relationship between the position of the end of the yoke portion layer on the air bearing surface side in FIG. 19 and the side erase characteristic.

FIG. 22 is a plan view of a thin film magnetic head according to a seventh embodiment of the invention.

FIG. 23 is a cross-sectional view for explaining one step in the conventional method of manufacturing a thin film magnetic head.

FIG. 24 is a cross-sectional view for explaining a step following FIG.

25 is a cross-sectional view for explaining a step following FIG. 24. FIG.

FIG. 26 is a cross-sectional view illustrating a step following the step of FIG.

FIG. 27 is a plan view of a conventional magnetic head.

[Explanation of symbols]

1 ... Substrate, 2 ... Insulating layer, 3 ... Bottom shield layer, 5 ... MR
Element, 8 ... Lower magnetic pole layer, 8a ... First portion of lower magnetic pole layer, 8b ... Second portion of lower magnetic pole layer, 8c ... Third portion of lower magnetic pole layer, 10 ... Thin film coil, 11 ... Insulating layer , 12
... recording gap layer, 13 ... upper magnetic pole layer, 17 ... overcoat layer.

Claims (14)

[Claims] 1. A first and second magnetic layer magnetically coupled to each other, which includes a medium facing surface facing a recording medium, magnetic pole portions facing each other on the medium facing surface side, and the first and second magnetic layers. A gap layer provided between the magnetic pole portion of the magnetic layer and the magnetic pole portion of the second magnetic layer, and at least a portion between the first and second magnetic layers,
A thin film coil provided in a state of being insulated from the first and second magnetic layers; and a substrate, wherein the first and second magnetic layers, the gap layer, and the thin film coil are laminated on the substrate. And the first and second
Of the magnetic layers, the first magnetic layer is disposed closer to the substrate, and the first magnetic layer is disposed at a position facing at least a part of the thin film coil. A first portion arranged and a second portion connected to a surface of the first portion on the thin film coil side and including a magnetic pole portion of the first magnetic layer; Faces the second magnetic layer through the gap layer, whereby the throat height is defined by the end portion of the second portion opposite to the medium facing surface, and at least one of the thin film coils. The portion is disposed laterally of the second portion, the second magnetic layer has a track width defining portion that defines a track width, and the second magnetic layer has a track width defining portion on a side opposite to the medium facing surface. The end portion is on the side opposite to the medium facing surface of the second portion. A portion of the second portion, which is arranged closer to the medium facing surface side than the portion and faces the track width defining portion via the gap layer, has the same width as the track width defining portion; A thin-film magnetic head characterized in that a width of the second magnetic layer at a position corresponding to an end of the second portion opposite to the medium facing surface is larger than a width of the track width defining portion. 2. A second magnetic layer in the second portion, the second magnetic layer side surface covering at least a part of the thin film coil arranged laterally of the second portion. 2. The thin film magnetic head according to claim 1, further comprising a flattened insulating layer with the side surface. 3. The thin-film magnetic head according to claim 1, wherein the second magnetic layer is composed of one layer. 4. The second magnetic layer has a magnetic pole portion layer including the track width defining portion and a yoke portion layer which is connected to the magnetic pole portion layer and serves as a yoke portion. 1. The thin film magnetic head described in 1. 5. The thin film magnetic head according to claim 4, wherein an end surface of the yoke portion layer on the medium facing surface side is arranged at a position apart from the medium facing surface. 6. The thin-film coil has a first layer portion arranged laterally of the second portion and a second layer portion laterally arranged of the magnetic pole portion layer. 6. The thin film magnetic head according to claim 4 or 5. 7. A first magnetic layer covering the first layer portion of the thin-film coil, the second magnetic layer side surface of which is flattened together with the second magnetic layer side surface of the second portion. And an insulating layer which covers the second layer portion of the thin-film coil and whose surface on the yoke portion layer side is flattened together with the surface on the yoke portion layer side of the magnetic pole portion layer. 7. The thin film magnetic head according to claim 6, wherein. 8. A first and second magnetic layer magnetically coupled to each other, the medium facing surface facing a recording medium, and magnetic pole portions facing each other on the medium facing surface side, the magnetic layers being magnetically coupled to each other. A gap layer provided between the magnetic pole portion of the magnetic layer and the magnetic pole portion of the second magnetic layer, and at least a portion between the first and second magnetic layers,
A method of manufacturing a thin-film magnetic head, comprising: a thin-film coil provided in a state of being insulated from the first and second magnetic layers, the method comprising: forming the first magnetic layer; Forming the gap layer on the first magnetic layer, forming the second magnetic layer on the gap layer, and at least partially between the first and second magnetic layers. To
A step of forming the thin film coil so as to be arranged in an insulated state with respect to the first and second magnetic layers, wherein the step of forming the first magnetic layer includes: A first portion arranged at a position facing at least a portion, and a second portion connected to a surface of the first portion on the thin film coil side and including a magnetic pole portion of the first magnetic layer. The second portion faces the second magnetic layer via the gap layer, whereby the throat height is defined by the end of the second portion opposite to the medium facing surface. In the step of forming the thin film coil, at least a part of the thin film coil is arranged laterally of the second portion, and the second magnetic layer has a track width defining portion that defines a track width. Having a medium of the track width defining portion The end opposite to the facing surface is located closer to the medium facing surface than the end opposite to the medium facing surface of the second portion, and is opposite to the medium facing surface of the second portion. A width of the second magnetic layer at a position corresponding to an end portion of the second magnetic layer is larger than a width of the track width defining portion, and the thin-film magnetic head manufacturing method further includes the gap of the second portion. The gap layer and the second portion are etched by using the track width defining portion as a mask so that the width of a part of the layer facing the track width defining portion through the layer becomes equal to the width of the track width defining portion. A method of manufacturing a thin-film magnetic head, comprising: 9. The second magnetic layer in the second portion, the second magnetic layer side surface covering at least a part of the thin film coil arranged laterally of the second portion. 9. The method of manufacturing a thin film magnetic head according to claim 8, further comprising the step of forming a flattened insulating layer with the side surface. 10. The method of manufacturing a thin-film magnetic head according to claim 8, wherein the second magnetic layer is a single layer. 11. The step of forming the second magnetic layer comprises:
9. The method of manufacturing a thin-film magnetic head according to claim 8, wherein a pole portion layer including the track width defining portion and a yoke portion layer which is connected to the pole portion layer and serves as a yoke portion are formed. 12. The step of forming the second magnetic layer comprises:
The end surface of the yoke portion layer on the medium facing surface side is arranged at a position distant from the medium facing surface.
A method for manufacturing the thin film magnetic head described. 13. The step of forming the thin film coil includes forming a first layer portion laterally of the second portion and a second layer portion laterally of the pole portion layer. 13. The method of manufacturing a thin film magnetic head according to claim 11 or 12, wherein: 14. A first magnetic layer covering the first layer portion of the thin-film coil, the second magnetic layer side surface of which is flattened together with the second magnetic layer side surface of the second portion. Forming an insulating layer, and a second insulating layer which covers the second layer portion of the thin-film coil and whose surface on the yoke portion layer side is flattened together with the surface on the yoke portion layer side of the magnetic pole portion layer. 14. The method of manufacturing a thin film magnetic head according to claim 13, further comprising: