JP2003170351A - Tool plate of polishing device - Google Patents
Tool plate of polishing deviceInfo
- Publication number
- JP2003170351A JP2003170351A JP2001369950A JP2001369950A JP2003170351A JP 2003170351 A JP2003170351 A JP 2003170351A JP 2001369950 A JP2001369950 A JP 2001369950A JP 2001369950 A JP2001369950 A JP 2001369950A JP 2003170351 A JP2003170351 A JP 2003170351A
- Authority
- JP
- Japan
- Prior art keywords
- tool plate
- polishing
- polishing apparatus
- tool
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Oxide Ceramics (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、研磨装置の研磨定
盤に貼り付けられ、工作物を研磨(ポリシング、ラッピ
ング)する研磨装置の工具プレートに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tool plate of a polishing device which is attached to a polishing surface plate of a polishing device and polishes (polishing, lapping) a workpiece.
【0002】[0002]
【従来の技術】研磨装置の工具プレートは、工作物を研
磨する研磨布(研磨パッド)の代わりに砥粒を保持した
無数のキャリア(メディア)微粒子を保持するものであ
り、従来、約Ra4μmの表面粗さを有するすりガラス
からなるものが知られている(2000年度砥粒加工学
会学術講演会講演論文集第47〜48頁参照)。2. Description of the Related Art A tool plate of a polishing apparatus holds innumerable carrier (medium) fine particles holding abrasive grains instead of a polishing cloth (polishing pad) for polishing a workpiece, and has conventionally been about Ra 4 μm. Those made of frosted glass having a surface roughness are known (see 2000 Proceedings of Academic Conference of the Japan Society for Abrasive Grain Processing, pages 47 to 48).
【0003】[0003]
【発明が解決しようとする課題】しかし、従来の研磨装
置の工具プレートでは、ガラスからなるため、摩耗し易
く、耐用寿命が短い不具合がある。又、作業面の凹凸
は、珪砂等を用いたサンドブラスト処理により物理的
(機械的)に形成されているため、凹部が外方に向けて
拡開する(断面V字状を呈する)一方、凸部が外方に向
く尖突状となり、キャリア微粒子の拡散が円滑に行われ
ない不具合がある。However, since the tool plate of the conventional polishing apparatus is made of glass, it has a problem that it is easily worn and its service life is short. Further, since the unevenness of the work surface is physically (mechanically) formed by sandblasting using silica sand or the like, the concave portion is expanded outward (having a V-shaped cross section), while the convex portion is convex. The part has a pointed shape that faces outward, and there is a problem that the carrier fine particles cannot be diffused smoothly.
【0004】そこで、本発明は、耐用寿命を長くし得る
と共に、キャリア微粒子の拡散を円滑になし得る研磨装
置の工具プレートを提供することを目的とする。Therefore, an object of the present invention is to provide a tool plate of a polishing apparatus which can prolong the service life and can smoothly diffuse carrier fine particles.
【0005】[0005]
【課題を解決するための手段】前記課題を解決するた
め、本発明の研磨装置の工具プレートは、純度95%以
上の緻密質セラミックスからなる円板状の工具本体の少
なくとも作業面が表面粗さRa4〜20μmの丸みを帯
びた凹凸に形成されていることを特徴とする。In order to solve the above problems, the tool plate of the polishing apparatus of the present invention is such that at least the working surface of a disk-shaped tool body made of dense ceramics having a purity of 95% or more has a surface roughness. It is characterized in that it is formed in a rounded unevenness of Ra 4 to 20 μm.
【0006】前記緻密質セラミックスは、理論密度の9
0%を超える密度であることが好ましい。The dense ceramic has a theoretical density of 9
A density of more than 0% is preferred.
【0007】又、前記緻密質セラミックスは、アルミ
ナ、イットリウムアルミニウムガーネット、イットリ
ア、窒化アルミニウム、窒化珪素又はジルコニアである
ことが好ましい。The dense ceramics are preferably alumina, yttrium aluminum garnet, yttria, aluminum nitride, silicon nitride or zirconia.
【0008】[0008]
【作用】本発明の研磨装置の工具プレートにおいては、
ガラスより硬度の高いものとなり、又、キャリア微粒子
の凹部間の移動が容易となる一方、接着剤を用いた接着
の際の裏面のアンカー効果(投錨効果)が高まる。In the tool plate of the polishing apparatus of the present invention,
The hardness is higher than that of glass, and the movement of the carrier fine particles between the concave portions is facilitated, while the anchor effect (anchoring effect) on the back surface at the time of adhesion using an adhesive is enhanced.
【0009】緻密質セラミックスの純度が、95%未満
であると、工作物の汚染を生じるおそれがあると共に、
著しく工作物の諸特性を低下させる原因となる。緻密質
セラミックスの純度は、99%以上がより好ましい。凹
凸の表面粗さRaが、4μm未満であると、無数のキャ
リア微粒子の保持力が弱まり又は流れたりする。一方、
20μmを超えると、研磨効率が極端に低くなる。凹凸
の表面粗さRaは、キャリア微粒子の直径にもよるが、
10〜20μmがより好ましい。If the density of the dense ceramics is less than 95%, the workpiece may be contaminated, and
This causes the properties of the work to be remarkably deteriorated. The purity of the dense ceramics is more preferably 99% or more. If the surface roughness Ra of the irregularities is less than 4 μm, the holding power of innumerable carrier fine particles is weakened or flows. on the other hand,
If it exceeds 20 μm, the polishing efficiency becomes extremely low. The surface roughness Ra of the unevenness depends on the diameter of the carrier fine particles,
10 to 20 μm is more preferable.
【0010】緻密質セラミックスの密度が、理論密度の
90%以下であると、工作物の不純物汚染等で製品の悪
化を来す。緻密質セラミックスの密度は、理論密度の9
9%以上がより好ましい。If the density of the dense ceramics is 90% or less of the theoretical density, the product will be deteriorated due to impurity contamination of the workpiece. The density of dense ceramics is 9 which is the theoretical density.
9% or more is more preferable.
【0011】なお、緻密質セラミックスとしては、上述
した様々の種類が挙げられるのが、特に効果的なものの
一つとしてアルミナセラミックスがあり、アルミナセラ
ミックスの中でも、高純度で粒径の大きなものが望まし
く、緻密であることも好ましい。不純物が多いと、理想
的エッチングが行われにくくなるからであり、純度とし
ては、99%以上が好ましく、99.5%以上がより好
ましい。特に好ましくは、99.9%以上である。又、
平均粒径も5〜50μmの範囲でできるだけ大きいもの
が好ましい。50μmより大きな粒径では、セラミック
ス自体の強度的不具合を生じ易くなる。一方、あまり粒
径が小さいと本発明の効果が得られ難くなる。平均粒径
は、10〜50μmがより好ましく、10〜45μmが
特に好ましい。このようなアルミナセラミックスの代表
として、例えば、透光性を有するものが本発明に適して
いる。As the dense ceramics, the above-mentioned various types can be cited. One of the particularly effective ones is alumina ceramics. Among the alumina ceramics, those of high purity and large particle size are desirable. It is also preferable to be precise. This is because if the amount of impurities is large, it becomes difficult to perform ideal etching, and the purity is preferably 99% or more, more preferably 99.5% or more. Especially preferably, it is 99.9% or more. or,
The average particle size is preferably as large as possible within the range of 5 to 50 μm. If the particle size is larger than 50 μm, the strength of the ceramic itself tends to be inferior. On the other hand, if the particle size is too small, it becomes difficult to obtain the effects of the present invention. The average particle diameter is more preferably 10 to 50 μm, particularly preferably 10 to 45 μm. As a representative of such alumina ceramics, for example, one having translucency is suitable for the present invention.
【0012】[0012]
【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照して説明する。図1は本発明に係る研磨装
置の工具プレートの実施の形態の一例を示す概念的な断
面図である。この研磨装置の工具プレートは、純度95
%以上(好ましくは99%以上)で、論理密度の90%
を超える密度の緻密質セラミックスからなる円板状の工
具本体1の作業面(図1においては上面)と裏面(図1
においては下面)の両面が、丸みを帯びた多数の凹部2
a,3aと凸部2b,3bからなる表面粗さRa4〜2
0μmの凹凸2,3に形成されているものである。緻密
質セラミックスとしては、アルミナ、イットリウムアル
ミニウムガーネット、イットリア、窒化アルミニウム、
窒化珪素又はジルコニアが用いられる。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a conceptual sectional view showing an example of an embodiment of a tool plate of a polishing apparatus according to the present invention. The tool plate of this polisher has a purity of 95
% Or more (preferably 99% or more), 90% of the logical density
Working surface (top surface in FIG. 1) and back surface (FIG. 1) of the disk-shaped tool body 1 made of dense ceramics having a density exceeding
Both sides of the lower surface in FIG.
a, 3a and convex portions 2b, 3b, surface roughness Ra4 to 2
It is formed on the unevenness 2 and 3 of 0 μm. Dense ceramics include alumina, yttrium aluminum garnet, yttria, aluminum nitride,
Silicon nitride or zirconia is used.
【0013】上述した研磨装置の工具プレートは、純度
95%以上で、論理密度の90%を超える密度の緻密質
セラミックスからなり、表面が平滑な円板状の工具本体
1を、100〜230℃の温度に保持した濃度18〜5
0%の硫酸水溶液又は濃度95%以上のリン酸水溶液
(エッチング液)に10〜16時間浸漬し、工具本体1
の表面を表面粗さRa4〜20μmの丸みを帯びた凹凸
2,3となるように徐々にケミカルエッチングして製造
されるものである。The tool plate of the polishing apparatus described above is made of dense ceramics having a purity of 95% or more and a density exceeding 90% of the logical density, and the disk-shaped tool body 1 having a smooth surface is heated at 100 to 230 ° C. 18 to 5 concentration maintained at the temperature
The tool body 1 is dipped in a 0% sulfuric acid aqueous solution or a 95% or more concentrated phosphoric acid aqueous solution (etching solution) for 10 to 16 hours.
Is gradually chemical-etched so as to form rounded irregularities 2 and 3 having a surface roughness Ra of 4 to 20 μm.
【0014】ここで、純度99.7%、嵩密度3.97
g/cm2、平均粒径40μmのアルミナセラミックス
からなり、表面が平滑な円板状(直径1000mm,厚
み10〜30mm)の工具本体1を、230℃の温度に
保持した濃度25%の硫酸水溶液に16時間浸漬し、作
業面と裏面の両面が表面粗さRa4μmの丸みを帯びた
凹凸2,3を呈する工具プレートを得た。得られた工具
プレートを研磨装置の研磨定盤の上面に接着剤(エポキ
シ樹脂)を工具プレートの裏面との間に介在して接着
し、平均粒径10〜20nmのコロイダルシリカの水溶
液(濃度5wt%、pH10.3)にキャリア微粒子と
して平均粒径2μmのポリマ微粒子1wt%と平均粒径
15μmのポリマ微粒子3wt%を添加した混合液を研
磨液として用い、シリコンウェーハを研磨したところ、
表面粗さ4μmのすりガラスを工具プレートとして用
い、同様の条件でシリコンウェーハを研磨した場合に比
べ、耐用寿命を2〜3倍とすることができると共に、キ
ャリア微粒子の作業面への拡散が円滑に行われた。又、
研磨定盤に対する工具プレートの接着を容易に行うこと
ができ、かつ、接着強度も1.2〜2.0倍高かった。Here, the purity is 99.7% and the bulk density is 3.97.
g / cm 2, made from the average grain size 40μm of alumina ceramics, a smooth surface disc shape (diameter 1000 mm, thickness 10 to 30 mm) tool body 1, 230 ° C. 25% strength aqueous sulfuric acid maintained at a temperature of Then, the tool plate was obtained by presenting rounded irregularities 2 and 3 with a surface roughness Ra of 4 μm on both the working surface and the back surface for 16 hours. The obtained tool plate is adhered to the upper surface of the polishing surface plate of the polishing apparatus with an adhesive (epoxy resin) interposed between the tool plate and the back surface of the tool plate, and an aqueous solution of colloidal silica having an average particle diameter of 10 to 20 nm (concentration: 5 wt %, PH 10.3), a mixed solution of 1 wt% of polymer fine particles having an average particle diameter of 2 μm and 3 wt% of polymer fine particles having an average particle diameter of 15 μm was used as a polishing liquid to polish a silicon wafer.
Compared with the case of polishing a silicon wafer under the same conditions by using frosted glass with a surface roughness of 4 μm as a tool plate, the service life can be increased by 2 to 3 times and carrier fine particles can be smoothly diffused to the work surface. It was conducted. or,
The tool plate could be easily bonded to the polishing platen, and the bonding strength was 1.2 to 2.0 times higher.
【0015】なお、上述した実施の形態においては、工
具本体1の両面に凹凸2,3が形成されている場合につ
いて説明したが、これに限定されるものではなく、作業
面となる片面のみに凹凸2を形成するようにしてもよ
い。In the above-described embodiment, the case where the tool body 1 has the concavities and convexities 2 and 3 formed on both sides has been described, but the present invention is not limited to this and only one side serving as a work surface is described. The unevenness 2 may be formed.
【0016】[0016]
【発明の効果】以上説明したように、本発明の研磨装置
の工具プレートによれば、ガラスより硬度の高いものと
なり、又、キャリア微粒子の凹部間の移動が容易となる
ので、耐用寿命を大幅に長くすることができ、又、キャ
リア微粒子の拡散を円滑にすることができる。一方、裏
面にも凹凸を形成した場合、接着剤を用いた接着の際の
裏面のアンカー効果が高まるので、研磨定盤に対する工
具プレートの接着を容易に行うことができ、かつ接着強
度も格段に高めることができる。As described above, according to the tool plate of the polishing apparatus of the present invention, the hardness is higher than that of glass, and the carrier fine particles can be easily moved between the concave portions, so that the useful life is greatly extended. The length can be made very long and the diffusion of carrier fine particles can be made smooth. On the other hand, when unevenness is also formed on the back surface, the anchor effect on the back surface at the time of bonding with an adhesive is increased, so that the tool plate can be easily bonded to the polishing platen and the bonding strength is remarkably high. Can be increased.
【図1】本発明に係る研磨装置の工具プレートの実施の
形態の一例を示す概念的な断面図である。FIG. 1 is a conceptual sectional view showing an example of an embodiment of a tool plate of a polishing apparatus according to the present invention.
1 工具本体 2 凹凸 2a 凹部 2b 凸部 1 Tool body 2 unevenness 2a recess 2b convex part
───────────────────────────────────────────────────── フロントページの続き (72)発明者 徳岳 文夫 神奈川県泰野市曽屋30番地 東芝セラミッ クス株式会社開発研究所内 (72)発明者 上本 英雄 神奈川県泰野市曽屋30番地 東芝セラミッ クス株式会社開発研究所内 Fターム(参考) 3C058 AA07 AA09 CB05 DA02 4G030 AA12 AA17 AA36 AA51 AA52 BA18 CA07 GA32 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Fumio Tokutake 30 Soya, Taino City, Kanagawa Prefecture Toshiba Cerami Kusu Co., Ltd. Development Laboratory (72) Inventor Hideo Uemoto 30 Soya, Taino City, Kanagawa Prefecture Toshiba Cerami Kusu Co., Ltd. Development Laboratory F-term (reference) 3C058 AA07 AA09 CB05 DA02 4G030 AA12 AA17 AA36 AA51 AA52 BA18 CA07 GA32
Claims (3)
らなる円板状の工具本体の少なくとも作業面が表面粗さ
Ra4〜20μmの丸みを帯びた凹凸に形成されている
ことを特徴とする研磨装置の工具プレート。1. A polishing apparatus characterized in that at least a working surface of a disk-shaped tool body made of dense ceramics having a purity of 95% or more is formed into rounded irregularities having a surface roughness Ra of 4 to 20 μm. Tool plate.
0%を超える密度であることを特徴とする請求項1記載
の研磨装置の工具プレート。2. The dense ceramics has a theoretical density of 9
The tool plate of a polishing apparatus according to claim 1, wherein the tool plate has a density of more than 0%.
ットリウムアルミニウムガーネット、イットリア、窒化
アルミニウム、窒化珪素又はジルコニアであることを特
徴とする請求項1又は2記載の研磨装置の工具プレー
ト。3. The tool plate of the polishing apparatus according to claim 1, wherein the dense ceramic is alumina, yttrium aluminum garnet, yttria, aluminum nitride, silicon nitride or zirconia.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001369950A JP2003170351A (en) | 2001-12-04 | 2001-12-04 | Tool plate of polishing device |
KR1020020004418A KR100712715B1 (en) | 2001-01-31 | 2002-01-25 | Ceramics member of which fine projections are formed in the surface and method for producing it |
CNB021031320A CN1288113C (en) | 2001-01-31 | 2002-01-31 | Ceramic parts formed micro crowning on its surface and its mfg. method |
US10/059,133 US6861122B2 (en) | 2001-01-31 | 2002-01-31 | Ceramic member with fine protrusions on surface and method of producing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001369950A JP2003170351A (en) | 2001-12-04 | 2001-12-04 | Tool plate of polishing device |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2003170351A true JP2003170351A (en) | 2003-06-17 |
Family
ID=19179261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001369950A Pending JP2003170351A (en) | 2001-01-31 | 2001-12-04 | Tool plate of polishing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2003170351A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010052408A (en) * | 2008-08-30 | 2010-03-11 | Nagaoka Univ Of Technology | Ceramic calcined body with fine uneven pattern on surface and method for manufacturing the same |
JP2016165769A (en) * | 2015-03-09 | 2016-09-15 | 有限会社進功ブラスト工業所 | Free abrasive grain processing polishing tool, manufacturing method for the tool, and free abrasive grain polishing device |
-
2001
- 2001-12-04 JP JP2001369950A patent/JP2003170351A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010052408A (en) * | 2008-08-30 | 2010-03-11 | Nagaoka Univ Of Technology | Ceramic calcined body with fine uneven pattern on surface and method for manufacturing the same |
JP2016165769A (en) * | 2015-03-09 | 2016-09-15 | 有限会社進功ブラスト工業所 | Free abrasive grain processing polishing tool, manufacturing method for the tool, and free abrasive grain polishing device |
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