JP2003163497A - Head unit for electronic part installation device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To shorten the time required for installing an electronic part related to a head unit, in which images of sucking-holding condition of a plurality of electronic parts sucking-held by a plurality of sucking-holding members are taken by an imaging device to recognize the condition, and then, based on the result of recognition, each electronic part is fixed to a circuit board for install. <P>SOLUTION: In the head unit, a reflecting mirror is set at an orthogonal position of a lifting operation axis in the sucking-holding member and a light- irradiating axis in a light-irradiating device. A semi-transmitting reflecting mirror is set at the orthogonal position of an optical axis in the imaging device and the described light-irradiating axis. A lighting part is set at an opposite side of the setting side for the reflecting mirror of the semi-transmitting reflecting mirror on the light-irradiating axis. Consequently, dimension of the reflecting mirror and the semi-transmitting reflecting mirror in the lifting operation direction of the sucking-holding member is reduced. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a head unit for adsorbing and holding electronic components and mounting them on the mounting surface of electronic components on a circuit board, and particularly mounting when mounting a plurality of electronic components on a circuit board. The present invention relates to a head unit for an electronic component mounting device that shortens the time required for.

[0002]

2. Description of the Related Art In recent years, in the mounting process of electronic parts, there has been a strong demand for improving the reliability of the working process and shortening the working tact in order to improve productivity.

Conventionally, in an electronic component mounting apparatus for mounting electronic components such as a chip component and an IC chip on a circuit board, the suction holding state of the electronic component sucked and held by the suction holding member in the head section is imaged by a CCD camera or the like. The operation of the head part and the suction holding member so that the electronic component can be mounted at the predetermined mounting position on the circuit board by recognizing the captured image using the The control was performed and the electronic components were mounted on the circuit board.

A head unit 201, which is an example of a head unit included in such an electronic component mounting apparatus, will be described with reference to FIG.

As shown in FIG. 4, the head unit 201
Is composed of a head section 62 for handling electronic parts and an image pickup device 64 for picking up an image of the electronic parts.

The head portion 62 is provided with ten suction nozzles 51, which are examples of suction holding members, and the suction nozzles 51 are arranged in a row adjacent to the frame of the head portion 62 formed of a rigid body. It is fixed, and electronic parts 2 such as chip parts and IC chips are attached to the tip of each suction nozzle 51.
Are adsorbed and held. Further, each suction nozzle 51 can move up and down, and moves downward when sucking and holding the electronic component 2 and when mounting the electronic component 2 on the circuit board, and when moving the head portion 62, it moves upward. It moves in the direction and retreats to the upper end position so as not to interfere with the electronic components mounted on the circuit board and other members constituting the electronic component mounting apparatus.

Next, in the image pickup device 64, a lens 57 for forming an image of the electronic component 2 and a CCD 59, which is an example of an image pickup element for picking up the image formed by the lens 57, have the same number as the suction nozzles 51. 10 adjacent to each other and arranged in a line, and each lens 57 and each C
The CD 59 has a one-to-one correspondence with each suction nozzle 51. In addition, each lens 57 is held in the lower inside of a prism-shaped lens barrel 58, and each CCD 59 is provided and fixed so as to cover the upper portion and one side surface of the lens barrel 58 and a fixed camera unit 60. Is installed in the connection part with the upper part of the lens barrel 58 inside. The lens barrel 58 is the head unit 6.
It is fixed to the 2nd frame.

The camera unit 60 drives the CCD 59 to output an image pickup timing signal and an image pickup data signal to the CCD 59, and to convert the image pickup data signal, which is a signal containing the image pickup data, into an image signal. It is provided with an electronic shutter function that outputs a signal and can control the imaging time in each CCD 59.

A plurality of illuminating parts 53 are provided on both sides of the outer periphery of the lower portion of the lens barrel 58 along the arrangement direction of the lenses 57.
Is attached downward so that light can be emitted downward, and an illumination control unit 61 for individually controlling the illuminance and turning on / off of each illumination unit 53 is fixed to the upper portion of the camera unit 60. .

Below the lens barrel 58, a fixed fixed mirror 55 is fixed to the lower portion of the lens barrel 58 by tilting the end on the suction nozzle 51 side downward with the reflecting surface as the upper surface. Further, below the suction nozzle 51, a movable mirror 54 is attached to a mirror drive unit 56 that moves the movable mirror 54 by tilting the end on the fixed mirror 55 side downward with the reflecting surface as the upper surface. . The mirror driving unit 56 is fixed to the frame of the head portion 62, and by moving the moving mirror 54 along the reflecting surface, the suction nozzle 51 sucks and holds the electronic component 2 and the electronic component 2 is moved to a circuit. When mounted on the substrate, the suction nozzle 51 may be moved to a retracted position that does not hinder the vertical movement, and when the image of the electronic component 2 is captured, the image of the electronic component 2 may be moved to a reflective position where the image can be reflected. It is possible.

Here, the positional relationship between the constituent parts of the head unit 201 will be described along the path of the light emitted from the illumination section 53. In the image pickup device 64, one CCD 5 will be described.
9 and the respective centers of the lens 57 corresponding thereto are coaxially arranged, and the coaxial is the optical axis, and the light emitted downward from the respective illumination units 53 in parallel along the optical axis is fixed. The light reflected by the mirror 55 in the lateral direction is reflected upward by the moving mirror 54, and the electronic component 2 sucked and held by the suction nozzle 51 corresponding to the CCD 59 and the lens 57 is irradiated from below. To do. As a result, the image of the electronic component 2 is laterally reflected by the moving mirror 54, the reflected light is reflected upward by the fixed mirror 55 in parallel along the optical axis, and is reflected by the lens 57. An image is formed on the CCD 59, and an image is picked up by the CCD 59.

The head portion 62 and the image pickup device 64 formed by the above-mentioned respective portions are movable as a head unit 201. Further, in the image pickup of the image of each electronic component 2 by each CCD 59 in the image pickup device 64, after each suction nozzle 51 in the head portion 62 sucks and holds each electronic component 2, the head unit 201 completes the movement and the electronic component 2 is picked up. It is carried out until it is mounted on the circuit board.

In the head unit 201 having such a structure, during the movement process of the head unit 201 from the suction holding of the plurality of electronic components 2 to the mounting on the circuit board, each electron sucked and held by the suction nozzle 51. Since the suction holding state of the component 2 can be simultaneously picked up by each CCD 59, the time required for picking up the image can be shortened.

[0014]

However, the above structure has the following problems.

First, a plurality of illuminating parts 53 are provided on both side surfaces along the arrangement direction of the lenses 57 on the outer periphery of the lower portion of the lens barrel 58.
Is installed, the light emitted from the illuminating section 53 is moved to the moving mirror 5 arranged below each suction nozzle 51.
4, the fixed mirror 55 is fixed to the lower part of the lens barrel 58 by tilting the end on the suction nozzle 51 side downward with the reflection surface as the upper surface so as to be able to reflect to No. 4, and is orthogonal to the arrangement direction of the lenses 57 in the horizontal direction. In the direction, it is necessary to have a width of about the installation interval of the illumination units 53 installed on the both side surfaces.
Further, the fixed mirror 55 arranged in a tilt needs a height related to the tilt angle and the width in the horizontal direction even in the vertical direction.

As a result, when the head unit 201 moves, the lower end of the fixed mirror 55 does not come into contact with the machine base of the electronic component mounting apparatus, and the circuit board and circuit fixed on the machine base. Electronic component 2 mounted on the board
It is necessary to perform the movement in a state where the height is secured so as not to come into contact with the. Therefore, in the head portion 62 of the head unit 201 which has been moved while ensuring the height, the suction nozzle 51 is moved up and down when the electronic component 2 is picked up and picked up and the electronic component 2 is mounted on the circuit board. There is a problem that the stroke of operation is large and the time required for the stroke cannot be shortened.

On the contrary, in order to shorten the time required for the stroke, it is necessary to shorten the length of the fixed mirror 55 in the direction of the stroke. For that purpose, both side surfaces of the lens barrel 58 are required. Lighting units 5 installed in
It is necessary to narrow the installation interval of 3 and install each illumination unit 53 as close to the optical axis as possible.

However, since the lens barrel 58 needs to have a size that allows the lens 57 to be built therein, when the lens barrel 58 is installed on the both side surfaces of the lens barrel 58, it is not possible to reduce the installation interval of each illumination unit 53. It is difficult, for example, when the illumination unit 53 is installed on the optical axis between the lens 57 and the fixed mirror 55, the size of the fixed mirror 55 is ensured by the required minimum field of view required in the imaging device 54. However, since the light forming the image of the electronic component 2 interferes with the illumination unit 53, the above problem cannot be solved.

Further, since the stroke of the lifting operation of each suction nozzle 51 becomes large, the head portion 62 including each suction nozzle 51 becomes long in the stroke direction, and the head portion 62 is made smaller and lighter. However, there is a problem in that the moving speed of the head unit 201 is hindered, and the efficiency of the mounting work of the electronic components by the head unit 201 cannot be improved.

A movable mirror 54 is disposed below each suction nozzle 51 so as to be movable by a mirror drive unit 56 in a direction parallel to the reflective surface of the movable mirror 54 between a reflection position and a retracted position. But the mirror drive unit 5
When the moving operation of the moving mirror 54 by 6 is repeatedly performed, the relative positional relationship between the moving mirror 54 and the fixed mirror 55 may be slightly changed, and the above positional relationship may be broken. In such a case, In that case, the change in the relative positional relationship causes a shift of the optical axis, and in order to capture an image of the electronic component 2, it is necessary to adjust the relative positional relationship. However, there is a problem that such a work causes a time loss in the work of mounting the electronic component.

Therefore, an object of the present invention is to solve the above-mentioned problems, and an image of a plurality of electronic components suction-held by a plurality of suction-holding members is displayed by an image pickup device in the suction-holding state of each electronic component. Reduction of the time required to mount the electronic component in the head unit that performs the mounting work of the electronic component that captures the image, recognizes the suction holding state, and fixes each electronic component to the circuit board based on the result of the recognition process. It is an object of the present invention to provide a head unit for an electronic component mounting device.

[0022]

In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, in the head unit which holds the electronic component by suction and mounts it on the mounting surface of the electronic component on the circuit board, the electronic component can be moved up and down along the vertical movement axis and An adsorption holding member for adsorbing and holding a lens, an image sensor corresponding to the lens and the lens on the optical axis, and an image of an electronic component sucked and held by the adsorption holding member is formed on the imaging device by the lens. An imaging device that causes the imaging device to capture an image, and a light irradiation device that includes an illumination unit that can emit light along a light irradiation axis, and the lifting operation axis of the suction holding member and the light irradiation axis Arranged to be orthogonal, the optical axis of the imaging device and the light irradiation axis are arranged to be orthogonal, the light irradiation device is installed in the orthogonal position of the lifting operation axis and the light irradiation axis, Or A reflecting mirror capable of reflecting light along one direction of the light irradiation axis or the elevating operation axis along the other direction and reflecting light along the other direction along the one direction; The light, which is installed at a position orthogonal to the optical axis and the light irradiation axis and which is reflected by the reflecting mirror, can reflect the light along the light irradiation axis in the direction along the optical axis, and the light from the illumination unit. A semi-transmissive reflecting mirror capable of transmitting the light emitted along the irradiation axis, and the light emitted from the illuminating unit along the light irradiation axis passes through the semi-transmissive reflecting mirror and reflects the light. It is reflected by the mirror in the direction along the lifting operation axis, and is irradiated to the electronic component in the suction holding state, and the image of the electronic component is reflected by the reflecting mirror in the direction along the light irradiation axis, Reflected in the direction along the optical axis by a semi-transmissive mirror It is, by the lens is focused on the image pickup device to provide a head unit for an electronic component mounting apparatus characterized by being imaged in the imaging device.

According to a second aspect of the present invention, the lifting operation axis, the optical axis, and the light irradiation axis are on a plane substantially orthogonal to the mounting surface of the electronic component on the circuit board. A head unit for an electronic component mounting apparatus according to one aspect is provided.

According to a third aspect of the present invention, in the light irradiating device, the light irradiating device reflects the light emitted from the illuminating section along the light irradiating axis by the reflecting mirror to adsorb and hold the light. In a state in which the electronic component can be irradiated and the image of the electronic component can be reflected by the reflecting mirror along the light irradiation axis, and the suction holding member during the lifting operation of the suction holding member. And a retracting position capable of retracting interference with the reflecting mirror, further comprising a moving device capable of reciprocating the reflecting mirror along the light irradiation axis, There is provided a head unit for an electronic component mounting apparatus according to the first aspect or the second aspect, which is performed after the movement device moves the reflection mirror from the reflection position to the retracted position.

According to a fourth aspect of the present invention, the moving device moves the reflecting mirror and the semi-transmissive reflecting mirror along the light irradiation axis while maintaining a relative positional relationship therebetween. A head unit for the electronic component mounting apparatus according to the aspect is provided.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below in detail with reference to the drawings.

A head unit 1 which is an example of a head unit for an electronic component mounting apparatus according to an embodiment of the present invention.
A schematic explanatory view schematically showing the structure of 01 is shown in FIGS. FIG. 1A is a schematic explanatory view showing the structure of a schematic vertical cross section of the head unit 101.
FIG. 1B is a schematic explanatory view of a schematic bottom surface of the head unit 101, which is partially transparent.

As shown in FIGS. 1A and 1B, the head unit 101 includes a head portion 12 for handling electronic components.
An image pickup device 14 for picking up an image of an electronic component, and a light irradiation device 15 for emitting light for picking up an image of an electronic component.

The head portion 12 is provided with ten suction nozzles 1 as an example of a suction holding member, and the suction nozzles 1 are arranged in a line adjacent to the frame of the head portion 12 formed of a rigid body. It is fixed, and the electronic parts 2 such as chip parts and IC chips are sucked and held at the tip of each suction nozzle 1. Further, each suction nozzle 1 is capable of raising and lowering along the raising and lowering movement axis A with the central axis thereof as the raising and lowering movement axis A, and when sucking and holding the electronic component 2 and when the electronic component 2 is sucked and held.
Is lowered along the lifting operation axis A when it is mounted on the mounting surface of the electronic component on the circuit board, and rises along the lifting operation axis A when the head portion 12 is moved to the circuit board or the circuit board. It is designed not to interfere with the mounted components or other members constituting the electronic component mounting device.

Next, the image pickup device 14 forms a lens 7 for forming an image of the electronic component 2 on the image pickup element, and a CCD 9 which is an example of an image pickup element for picking up the image formed by the lens 7.
10 are arranged adjacent to each other in the same number as the suction nozzles 1, and each lens 7 and each CCD are provided.
9 corresponds to each suction nozzle 1 on a one-to-one basis. Also,
Each lens 7 is held in the lower inner portion of a prism-shaped lens barrel 8, and each CCD 9 is provided and fixed so as to cover the upper portion of the lens barrel 8 and one side surface thereof.
Each CCD 9 is installed in the connection part with the upper part of the lens barrel 8 inside. Further, the centers of one CCD 9 and the corresponding lens 7 are arranged on the same axis, and the same axis is the optical axis B, and the image pickup device 14 moves up and down in the head portion 12 with the optical axis B. It is arranged so as to be substantially parallel to the axis A. The lens barrel 8 is fixed to the frame of the head portion 12.

The camera unit 10 drives the CCD 9 to output an image pickup timing signal and an image pickup data signal to the image pickup data signal which is a signal including the image pickup data output from each CCD 9. It has an electronic shutter function that outputs a signal and can control the imaging time in each CCD 9.

Further, the light irradiation device 15 is an illumination device capable of emitting light on a frame 20 formed of a box-shaped rigid body along a light irradiation axis C which is an axis orthogonal to the lifting operation axis A and the optical axis B. A large number of parts 3 are provided, the light irradiation axis C is located below the head part 12 and the image pickup device 14, and the lifting operation axis A, the optical axis B, and the light irradiation axis C are mounted by the electronic component 2. The circuit board is arranged on a plane substantially orthogonal to the mounting surface of the electronic component. Further, the light irradiation device 15
Is installed at a position orthogonal to the raising / lowering operation axis A and the light irradiation axis C, and transmits light along one direction of the raising / lowering operation axis A or the light irradiation axis C in the other direction and in the other direction. A mirror 18, which is an example of a reflecting mirror capable of reflecting light along the one direction, and a light irradiation axis C which is installed at a position orthogonal to the optical axis B and the light irradiation axis C and which is reflected by the mirror 18. A half mirror 1 which is an example of a semi-transmissive reflecting mirror capable of reflecting light along the optical axis B along the optical axis B and transmitting light emitted from the illumination unit 3 along the light irradiation axis C.
7 and 7 are fixedly provided on the frame 20. Mirror 18
1 has a substantially central portion located at a position orthogonal to the raising / lowering operation axis A and the light irradiation axis C, and its reflection surface is an upper surface.
In (A), tilted from the upper left to the lower right, 45
The head portion 12 is arranged below each suction nozzle 1 at an inclination. In addition, the half mirror 17 has its substantially central portion located at a position orthogonal to the optical axis B and the light irradiation axis C, and is inclined from the upper right to the lower left in FIG. , Is arranged below the imaging device 14 at an inclination of 45 degrees. Further, the illumination unit 3 has a light irradiation axis C.
It is arranged on the lower surface side of the upper half mirror 17 and can emit light through the half mirror 17 to the mirror 18 side on the light irradiation axis C.

As for the positional relationship between the lifting operation axis A, the optical axis B, and the light irradiation axis C, as described above, each of the lifting operation axis A and the optical axis B and the light irradiation axis C are substantially orthogonal to each other. And the vertical movement axis A, the optical axis B, and the light irradiation axis C are
It is preferable that the electronic component is arranged on a plane substantially orthogonal to the mounting surface of the electronic component. This is because in such an arrangement, the head unit 101 can have a simple structure and a compact size. Instead of the above-mentioned arrangement state, the light irradiation axis C and the light irradiation axis C are substantially orthogonal to each other, and are parallel to the mounting surface, and are positioned above the mounting surface. With respect to the plane including the axis C, the center of the tip portion of the suction nozzle 1 on the lifting operation axis A is located above the plane,
In addition, the center of the lens 7 on the optical axis B may be located on the plane or above the plane.

The light irradiating device 15 includes a light guide plate 1 capable of irradiating light above the mirror 18 on the ascending / descending operation axis A.
9 is equipped. In addition, the light guide plate 19 includes an illuminating section 19a capable of emitting light in a direction orthogonal to the raising / lowering operation axis A, and the light emitted in the above direction is moved up and down by a reflection plate provided in the light guide plate 19. It is reflected to the electronic component 2 side along the operation axis A and is irradiated on the electronic component 2. In addition, the light guide plate 19
In order to prevent the light emitted from the illumination unit 3, reflected by the mirror 18 and applied to the electronic component 2 and the light forming the image of the electronic component 2 from being blocked on the vertical movement axis A, Around the A, a circular hole 19b is formed in each of the light passage portions.

The light guide plate 19 is, for example, an acrylic plate, and a reflection sheet is attached to the lower surface of the acrylic plate in FIG. 1, that is, the surface opposite to the electronic component 2 side. It is equipped with. The light emitted from the illumination unit 19a provided on the side surface of the acrylic plate is
Enter the acrylic plate from the side of the acrylic plate,
Inside the acrylic plate, total reflection is repeated,
The light is diffused. Further, the diffused light is also reflected toward the electronic component 2 side by the reflection sheet, so that surface emission can be performed by the entire upper surface of the acrylic plate.

Accordingly, when the electronic component 2 has a rounded corner, for example, when it is a chip capacitor or the like, the light emitted from the illumination unit 3, that is, The contour of the electronic component 2 may be blurred only by the light along the vertical movement axis A. In such a case, it is possible to make the contour clear by irradiating the electronic component 2 with light from another direction using surface emission by the light guide plate 19.

Further, as shown in FIG. 1A, the light irradiation device 15 is driven by a motor, a pneumatic cylinder, or the like included in the moving unit 16 which is an example of the moving device included in the light irradiation device 15. Can be moved substantially parallel to each other along the light irradiation axis C for each frame 20. Specifically, when the mirror 18 is not located on the lifting operation axis A and the suction nozzle 1 performs the lifting operation along the lifting operation axis A, the suction nozzle 1 and the mirror 18 do not interfere with each other. A substantially central portion of the reflecting surface of the mirror 18 is located at a position orthogonal to the retracted position D and the raising / lowering operation axis A and the light irradiation axis C, and the light emitted from the illumination unit 3 along the light irradiation axis C is mirrored. A reflection position where the electronic component 2 reflected by the suction nozzle 1 can be irradiated with the light by the suction nozzle 1, and the image of the electronic component 2 can be reflected by the mirror 18 along the light irradiation axis C. Between E and
The light irradiation device 15 is movable. This allows
When the suction nozzle 1 in the head portion 12 sucks and holds the electronic component 2 and when the electronic component 2 is mounted on the circuit board, the retracted position D is set, and when the image of the electronic component 2 is taken,
The light irradiation device 15 can be moved to the reflection position E as a unit. Instead of the case where the light irradiation device 15 moves as a unit in the above, the light irradiation device 1
When 5 is located at the reflection position E, the light irradiating device 15 integrally moves only the constituent member of the light irradiating device 15 that interferes with the suction nozzle 1 that has been moved up and down, for example, the mirror 18. 18 at the retracted position D and the reflected position E of the light irradiation device 15 in
It is also possible to move between the respective positions.

Here, the arrangement relationship of the respective constituent parts of the head unit 101 will be described along the path of the light emitted from the illumination section 3 in the light irradiation device 15, and it is located at the reflection position E in FIG. 1 (A). In the light irradiation device 15 in the open state, the light emitted from the illumination unit 3 in the direction along the light irradiation axis C passes through the half mirror 17, travels along the light irradiation axis C, and moves up and down by the reflecting surface of the mirror 18. It is reflected upward in the drawing in the direction along the movement axis A. The reflected light passes through the hole 19b in the light guide plate 19 and is applied to the electronic component 2 sucked and held by the suction nozzle 1 from below in the figure. As a result, the image of the electronic component 2 is transmitted through the hole portion 19b in the light guide plate 19 along the vertical movement axis A, is reflected by the reflection surface of the mirror 18 in the direction along the light irradiation axis C, and is reflected by the half mirror 17. The surface reflects the light upward in the drawing along the optical axis B. The reflected image is formed on the CCD 9 by the lens 7 in the image pickup device 14 and picked up by the CCD 9.

Further, the head unit 12, the image pickup device 14, and the light irradiation device 15 constituted by the above-mentioned respective parts are integrally movable as a head unit 101. Also,
The control of the operation of the entire head unit 101 is performed by the control unit 13, and in the control unit 13, the camera unit 10 is controlled.
The recognition processing of the output image signal, the illuminance of each of the illumination unit 3 in the light irradiation device 15 and the illumination unit 19a of the light guide plate 19 and the turning on / off operation, and the movement operation of the light irradiation device 15 are controlled.

Further, in the image pickup device 14, the camera unit 10 outputs the image pickup timing signal to each CCD 9, the image signal conversion processing of the image pickup data signal output from each CCD 9, and the control unit 13 of each image signal. Since it is possible to output the
Reference numeral 4 designates the images formed by the respective lenses 7 to be picked up by the respective CCDs 9 at the same time, and the respective picked-up image data signals are sequentially output from the respective picked-up CCDs 9.
By sequentially performing image signal conversion processing on each image pickup data signal and sequentially outputting each image signal to the control unit 13,
It is configured so that the functions of simultaneous image pickup and sequential image output can be realized.

In order to capture an image of each electronic component 2 by each CCD 9 in the image pickup device 14, each suction nozzle 1 in the head unit 12 sucks and holds each electronic component 2, and then the head unit 101 causes each electronic component 2 to be picked up. This is carried out until the electronic component 2 is mounted on the circuit board by the head unit 12 after the movement from the suction holding position to above the circuit board is completed.

Next, the individual control of the illuminance of each illumination unit 3 by the control unit 13 will be described. FIG. 2 shows each suction nozzle 1.
FIG. 6 is an explanatory diagram showing the relationship between the illuminance of light emitted by each illumination unit 3 on the lower surface of each electronic component 2 adsorbed and held by and the current in each illumination unit 3.

As shown in FIG. 2, when each illumination unit 3 is turned on by a constant current, the illuminance on the surface of each electronic component 2 is such that the suction nozzles 1 near the center of all the suction nozzles 1 arranged. In the above, the average illuminance on the surface of the electronic component 2 sucked and held by each suction nozzle 1 becomes stronger, and the suction nozzles 1 at the end portions become weaker than the above average illuminance. Therefore, in the control unit 13, the current for turning on the illumination units 3 is smaller than the constant current for the illumination units 3 corresponding to the suction nozzles 1 near the center and smaller than the constant current. The illuminance on the surface of each electronic component 2 is made substantially constant by controlling the current of each corresponding illumination unit 3 to be larger than the above constant current. This makes the brightness of the image of each electronic component 2 captured by each CCD 9 more uniform,
It is possible to stabilize the imaging state.

Further, each illuminating unit 3 is configured to be individually replaceable, and the illuminating color, illuminating angle, illuminance or the like can be changed by exchanging a part or all of each illuminating unit 3. .

Head unit 1 constructed as described above
The operation timing chart for each operation of 01 is shown in FIG.
Shown in.

As shown in FIG. 3, when the suction nozzles 1 are performing the electronic component suction operation for sucking and holding the electronic components 2, the light irradiating device 15 moves the light irradiation device 15 to the retracted position D shown in FIG.
Therefore, the suction operation of the suction nozzle 1 is not hindered. After the suction nozzle 1 sucks and holds the electronic component 2, the head unit 1
The head unit 12 of 01 starts the moving operation. Head part 1
After 2 starts the moving operation, the light irradiation device 15 is moved to the reflection position E shown in FIG.

After the light irradiation device 15 has moved to the reflection position E, the illumination unit 19a of the light guide plate 19 is turned on and the illumination unit 3 is illuminated.
Is lit, and the image of each electronic component 2 sucked and held by each suction nozzle 1 by the indirect light irradiation of the illumination unit 3 via the mirror 18 passes through the mirror 18 and the half mirror 17, and the imaging device. CCD 14 by each lens 7 in 14
An image is formed on the upper side, and images are simultaneously picked up by the respective CCDs 9.

After the image pickup of each CCD 9 is completed, the illumination unit 19a and the illumination unit 3 of the light guide plate 19 are turned off, and the moving unit 16 moves the light irradiation device 15 to the retracted position D. At the same time, the image pickup data signal output from each CCD 9 is signal-processed by the camera unit 10 and is converted into an image signal by the control unit 1.
3 is output. At this time, since the imaging data signals output from the CCDs 9 are sequentially output without overlapping,
The camera unit 10 also sequentially performs signal processing and sequentially outputs as an image signal to the control unit 13. Therefore, the recognition processing unit in the control unit 13 that receives the image signal and performs the recognition process needs to include only one system or interface for each image signal, and the size of the recognition processing unit is small. Therefore, the cost of the electronic component mounting apparatus including the head unit 101 can be kept low.

Here, for each suction nozzle 1,
If the mounting order of the electronic components 2 sucked and held by the suction nozzles 1 on the circuit board is determined in advance and the image signals of the CCDs 9 are output in the order corresponding to the order, 1
When the recognition process of the image signal output second is completed, the mounting operation of the electronic component 2 mounted first can be started.

After that, the head portion 1 which was performing the moving operation
The second suction nozzle 1 reaches the circuit board, and the head unit 12
Of the head unit 12 and each suction nozzle 1 are controlled by the control unit 13 based on the recognition result of the image signal by the control unit 13, and each electronic component 2 is stopped.
Are mounted on the circuit board in the order described above.

Further, in the case where the mounting operation of each electronic component 2 by the head unit 12 is started before the recognition processing of the image signals of all the electronic components 2 suction-held by each suction nozzle 1 is completed. Even if there is, the recognition processing of each image signal is performed in the above-described mounting order, so that the mounting operation of the electronic component 2 that can start the mounting operation is sequentially performed from the electronic component 2 to be mounted first. While executing the image signal recognition processing, the image signal recognition processing of the electronic component 2 for which the image signal recognition processing has not been completed is sequentially performed in parallel, and the mounting operation of the electronic component 2 can be sequentially started.

As a specific example, referring to FIG. 3, the electronic component 2 to be mounted first is the electronic component (No. 1) in the order in which the electronic components 2 are mounted on the circuit board.
1), and the electronic components (No.
2) ... Assuming that the electronic component (No. n) to be mounted at the n-th position is used, the electronic component (N
o. During the sequential recognition processing from the image signal of 1), the head unit 101 completes the movement operation and each electronic component 2
However, since the electronic parts (No. 1) to (No. 3) are already available for the mounting operation, the electronic parts (No. 1) are sequentially mounted,
In the meantime, the image signals of the fourth and subsequent electronic components (No. n) are recognized in parallel.

As a result, even if the recognition processing of the image of the suction holding state of all the electronic components is not completed, the electronic components can be mounted in parallel with the recognition processing work. It becomes possible to implement an implementation method that effectively shortens the time required to implement.

The order of outputting image signals from the CCDs 9 may be the same for each movement of the head unit 12, or may be changed to an optimum order by the control unit 13 for each movement. .

The mounting order of the electronic components 2 on the circuit board and the arrangement order of the suction nozzles 1 may be irrelevant, and the suction nozzles 1 for sucking and holding the electronic components 2 are arbitrarily set in the controller 13. It is possible to

Further, even in the case where the number of lenses 7 and CCDs 9 in the image pickup device 14 is not the same as the number of the suction nozzles 1 but is smaller than the number of the suction nozzles 1, the images of the electronic components 2 are gradually displayed. Each CCD 9 captures an image, and each CCD 9 sequentially outputs the captured image data signal of each image to the camera unit 10.
The time required for the step-by-step imaging to 9 is the head unit 1
If the time is short enough that there is no time loss with respect to the time required to move 01 and mount each electronic component 2, the time required to mount the electronic component is effectively shortened as described above. It is possible to implement the mounting method.

The suction nozzles 1 of the head unit 12 and the lenses 7 of the image pickup device 14 can be individually attached and detached. As a result, for example, Q
When a large electronic component 40 such as an FP is mounted on a circuit board, one of the suction nozzles 1 of the suction nozzles 1 in the head portion 12 can suction and hold the electronic component 40 by suction. While replacing with a nozzle,
In the image pickup device 14, by replacing the lens 7 corresponding to the exchanged suction nozzle with a lens compatible with image pickup of QFP, for example, a lens such as a large-field high-resolution lens, a circuit board of the electronic component 40 is obtained. Can be installed.

In addition, for example, when a plurality of types of electronic components such as the electronic component 2 and the electronic component 40 are sucked and held by the suction nozzles 1 of the head portion 12 and mounted on the circuit board, for example. In place of mounting the electronic component 2 and the electronic component 40 on the circuit board after capturing all the images of the electronic component 2 and the electronic component 40 by the imaging device 14, the image of the electronic component 2 by the imaging device 14 is displayed. After imaging, mount the electronic component 2 on the circuit board, and then
There may be a case where an image of the electronic component 40 is picked up by the image pickup device 14 and the electronic component 40 is mounted on the circuit board. The electronic component 40 may be imaged and mounted before the electronic component 2.

When the image of each electronic component 2 is taken by each CCD 9, or each C in the recognition processing section of the control section 13 is taken.
When an imaging error or a recognition error occurs in the recognition processing of the image signal of the image captured by the CD 9, the mounting operation of the electronic component 2 by the suction nozzle 1 corresponding to the CCD 9 in which the imaging error or the recognition error occurs is performed. The control unit 13 controls so as not to perform.

According to the above embodiment of the present invention, the following various effects can be obtained.

First, in the head unit 101 in the above-described embodiment, the mirror 18 is placed at a position orthogonal to the lifting operation axis A and the light irradiation axis C, and the half mirror 17 is placed at a position orthogonal to the optical axis B and the light irradiation axis C. By arranging the respective reflecting surfaces as upper surfaces inclining in a direction in which the respective reflecting surfaces face each other, and installing the illuminating section 3 on the lower surface side of the half mirror 17 on the light irradiation axis C, the illuminating section 3 irradiates light The light emitted along the axis C passes through the half mirror 17 and the mirror 18
Is reflected by the mirror 18 in the direction along the elevation movement axis A so that the electronic component 2 can be irradiated with the image, and the image of the electronic component 2 is reflected by the mirror 18 in the direction along the light irradiation axis C, and the half mirror 17 Thus, the image of the electronic component 2 can be picked up by the image pickup device 14 by being reflected in the direction along the optical axis B. That is, by using the half mirror 17, it is possible to prevent interference between the light forming the image of the electronic component 2 and the illumination unit 3 while installing the illumination unit 3 on the light irradiation axis C. . This makes it possible to reduce the dimension of the suction nozzle 1 in the stroke direction in the mirror 18 that reflects the light emitted from the illumination unit 3 and the half mirror 17 that reflects the image of the electronic component 2. Therefore, the stroke of the lifting operation of each suction nozzle 1 in the head unit 12 can be shortened, and the time required for the lifting operation can be shortened. Further, it is possible to reduce the size and weight of the head unit 101 in the stroke direction, and the electronic component mounting apparatus can be used in such a head unit 10.
In the case of including one, the head unit 10
It is possible to shorten the time required for the mounting work of the electronic component by No. 1 and improve the efficiency of the mounting work.

The light irradiation device 15 is the same as the light irradiation device 15.
The light irradiating device 15 for each frame 20 can be moved in parallel along the light irradiating axis C by the moving unit 16 provided in the head unit 12 when the suction nozzle 1 in the head unit 12 sucks and holds the electronic component 2. When the electronic component 2 is mounted on the circuit board, it moves to the retracted position D that does not hinder the lifting operation of the suction nozzle 1, and when the image of the electronic component 2 is taken, the electronic component 2 can be irradiated with light. Moreover, the light irradiation device 15 can be integrally moved to the reflection position E where the image of the electronic component 2 can be reflected. Since the light irradiating device 15 can be moved as a unit by the moving unit 16, even when such a movement is repeated, the relative movement of the mirror 18 and the half mirror 17 in the light irradiating device 15 can be prevented. Since the arrangement relationship is kept stable, it is possible to reduce the frequency of performing the adjustment operation of the arrangement relationship due to the collapse of the arrangement relationship, and to improve the efficiency of the work of mounting the electronic component by the head unit 101. Becomes

By properly combining the arbitrary embodiments of the aforementioned various embodiments, the effects possessed by them can be produced.

[0065]

According to the first aspect or the second aspect of the present invention, in the head unit for the electronic component mounting apparatus, the reflecting mirror is installed at a position orthogonal to the elevating operation axis and the light irradiation axis. A transflective mirror at a position orthogonal to the axis and the light irradiation axis, and by installing an illumination unit on the side opposite to the installation direction of the reflector of the transflective mirror on the light irradiation axis, the illumination The light emitted by the section along the light irradiation axis is transmitted through the semi-transmissive reflecting mirror, is reflected by the reflecting mirror in the direction along the elevating operation axis, and can be irradiated to the electronic component, and the electron The image of the component is reflected by the reflecting mirror in the direction along the light irradiation axis, and is reflected by the semi-transmissive reflecting mirror in the direction along the optical axis to capture the image of the electronic component by the image pickup device. You can That is, by using the semi-transmissive reflecting mirror, it is possible to prevent interference between the light forming the image of the electronic component and the illumination unit while installing the illumination unit on the light irradiation axis. ing. As a result, it is possible to reduce the dimension in the vertical movement direction of the suction holding member in the reflecting mirror that reflects the light emitted from the illumination unit and the semi-transmissive reflecting mirror that reflects the image of the electronic component. . Therefore, the stroke of the lifting operation of the suction holding member in the head unit can be shortened, and the time required for the lifting operation can be shortened. Further, it is possible to reduce the size and weight of the head unit in the stroke direction, and in the case where the electronic component mounting device includes the head unit, it is possible to mount the electronic component by the head unit. It is possible to shorten the time required and improve the efficiency of the mounting work.

According to the third aspect of the present invention, the light irradiating device is provided with the moving device for moving the reflecting mirror of the light irradiating device between the reflecting position and the retracted position. When the suction holding member is moved up and down, that is, when the suction holding member picks up an electronic component by suction and when the electronic component is mounted on the circuit board, the reflection position, that is, the lower side of the suction holding member. The reflecting mirror located at a position orthogonal to the raising / lowering operation axis and the light irradiation axis, which is the position, can be moved to the retracted position by the moving device, and does not hinder the raising / lowering operation of the suction holding member. Can be made. Therefore, it is possible to provide the head unit which can perform the lifting operation of the suction holding member without interfering with the reflecting mirror and can obtain the effects of the first aspect or the second aspect. .

According to the fourth aspect of the present invention, in the light irradiation device, the reflection mirror and the semi-transmissive reflection mirror in the light irradiation device are provided at the reflection position and the retracted position while maintaining their relative positional relationships. In the head unit, when the suction holding member is moved up and down by providing the moving device that is movable between, that is, when the suction holding member picks up and picks up the electronic component, and the electronic component to the circuit board. During the mounting operation, the reflecting mirror, which is located at the reflection position, that is, at a position below the suction holding member, which is orthogonal to the raising / lowering operation axis and the light irradiation axis, is moved relative to the semi-transmissive reflecting mirror. It is possible to move to the retracted position by the moving device while maintaining such a positional relationship, and it is possible to bring the suction holding member into a state where it does not interfere with the lifting operation. Therefore, even when the lifting and lowering operation of the suction holding member is repeated, the relative positional relationship between the reflecting mirror and the semi-transmissive reflecting mirror in the light irradiation device is kept stable. Therefore, it is possible to provide the head unit that can reduce the frequency of performing the adjustment work of the arrangement relationship due to the collapse of the arrangement relationship, and can obtain the effect of the first aspect or the second aspect. Become.

[Brief description of drawings]

FIG. 1 is a schematic explanatory view showing a structure of a head unit for an electronic component mounting apparatus according to an embodiment of the present invention,
(A) is a schematic explanatory drawing which shows the structure of a typical longitudinal cross section in a head unit, and (B) is a schematic explanatory drawing of the schematic bottom face which a part penetrated in a head unit.

FIG. 2 is an explanatory diagram showing a relationship between illuminance and current in the illumination unit according to the above embodiment.

FIG. 3 is an operation timing chart of each operation in the head unit according to the above embodiment.

FIG. 4 is a schematic explanatory view showing a structure of a head unit for a conventional electronic component mounting apparatus.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Suction nozzle, 2 ... Electronic component, 3 ... Illumination part, 7 ... Lens, 8 ... Lens barrel, 9 ... CCD, 10 ... Camera unit, 1
2 ... Head part, 13 ... Control part, 14 ... Imaging device, 15 ...
Light irradiation device, 16 ... Moving part, 17 ... Half mirror, 18
... Mirror, 19 ... Light guide plate, 19a ... Illumination section, 19b ... Hole section, 20 ... Frame, 40 ... Electronic component, 101 ... Head unit, A ... Elevating operation axis, B ... Optical axis, C ... Light irradiation axis,
D ... retracted position, E ... reflection position.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Shoji Tsujimura             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F term (reference) 5E313 AA02 AA11 CC04 DD03 DD13                       EE02 EE03 EE24 EE25 EE33                       EE35 EE37 FF24 FF26 FF28                       FF31 FG02                 5F047 FA12 FA73

Claims (4)

[Claims] 1. A head unit (101) for adsorbing and holding an electronic component (2) and mounting it on a mounting surface of an electronic component on a circuit board, which is capable of raising and lowering along an ascending and descending movement axis (A), An adsorption holding member (1) for adsorbing and holding the component (2), a lens (7) on the optical axis (B), and an imaging element (9) corresponding to the lens (7) are provided, and the adsorption holding member ( An image pickup device (14) for forming an image of the electronic component (2) adsorbed and held on the image pickup device (1) on the image pickup device (9) by the lens (7) and making the image pickup device (9) pick up the image; A light irradiation device (15) including an illumination unit (3) capable of emitting light along the irradiation axis (C), and the lifting operation axis (A) of the suction holding member (1) and the light irradiation axis. It is arranged so as to be orthogonal to (C), and is on the imaging device (14). The optical axis (B) and the light irradiation axis (C) are arranged so as to be orthogonal to each other, and the light irradiation device (15) is arranged at a position orthogonal to the lifting operation axis (A) and the light irradiation axis (C). The light is installed and along one of the light irradiation axis (C) or the elevation operation axis (A) is directed along the other direction, and light along the other direction is directed along the one direction. A reflection mirror (18) capable of reflecting along the light irradiation axis (C) installed at a position orthogonal to the optical axis (B) and the light irradiation axis (C) and reflected by the reflection mirror (18). ) Is semi-transmissive reflection capable of reflecting light along the optical axis (B) and transmitting light emitted from the illumination unit (3) along the light irradiation axis (C). A mirror (17) is provided, and the light emitted from the illumination unit (3) along the light irradiation axis (C) is Passes over the reflector (17), the elevating operation axis by the reflecting mirror (18) is reflected in the direction along (A), the above electronic components of said suction holding state (2)
The image of the electronic component (2) is reflected by the reflecting mirror (18) in the direction along the light irradiation axis (C), and is reflected by the semi-transmissive reflecting mirror (17). ), Is imaged on the image sensor (9) by the lens (7), and is imaged by the image sensor (9). . 2. The ascending / descending operation axis (A), the optical axis (B), and the light irradiation axis (C) are on a plane substantially orthogonal to the mounting surface of the electronic component on the circuit board. A head unit for the electronic component mounting apparatus according to claim 1. 3. The light irradiating device (15) is configured such that the light irradiating device (15) emits light emitted from the illuminating section (3) along the light irradiating axis (C) to the reflecting mirror (1).
8) It is possible to irradiate the electronic component (2) in the suction holding state by being reflected by 8), and the image of the electronic component (2) is reflected by the reflecting mirror (18) along the light irradiation axis (C). A possible reflection position (E) and a retreat position (D) capable of retreating the interference between the suction holding member (1) and the reflecting mirror (18) when the suction holding member (1) moves up and down. And a moving device (16) capable of reciprocatingly moving the reflecting mirror (18) along the light irradiation axis (C), the lifting and lowering operation of the suction holding member (1) is performed by the moving device. The head unit for an electronic component mounting apparatus according to claim 1, which is performed after the reflection mirror (18) is moved from the reflection position (E) to the retracted position (D) by (16). 4. The moving device (16) maintains the relative arrangement of the reflecting mirror (18) and the semi-transmissive reflecting mirror (17) along the light irradiation axis (C). The head unit for the electronic component mounting apparatus according to claim 3, wherein the head unit is moved.