JP2003160765A - Re-peelable self-adhesive sheet - Google Patents

Re-peelable self-adhesive sheet

Info

Publication number
JP2003160765A
JP2003160765A JP2001359663A JP2001359663A JP2003160765A JP 2003160765 A JP2003160765 A JP 2003160765A JP 2001359663 A JP2001359663 A JP 2001359663A JP 2001359663 A JP2001359663 A JP 2001359663A JP 2003160765 A JP2003160765 A JP 2003160765A
Authority
JP
Japan
Prior art keywords
sensitive adhesive
adhesive sheet
pressure
component
adherend
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001359663A
Other languages
Japanese (ja)
Other versions
JP3897236B2 (en
Inventor
Takashi Sato
孝 佐藤
Torao Hayashi
虎雄 林
Satoshi Asai
聡 浅井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Somar Corp
Original Assignee
Somar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Somar Corp filed Critical Somar Corp
Priority to JP2001359663A priority Critical patent/JP3897236B2/en
Publication of JP2003160765A publication Critical patent/JP2003160765A/en
Application granted granted Critical
Publication of JP3897236B2 publication Critical patent/JP3897236B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Application Of Or Painting With Fluid Materials (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a re-peelable self-adhesive sheet, sufficiently keeping self-adhesive properties to a body to be bonded when bonded to the same body at ordinary temperature and elevated temperature, and also generating no staining such as an adhesive transfer when re-peeled from the bonded body. <P>SOLUTION: A self-adhesive composition is composed of (a) a thermal- expandable fine sphere, (b) an acrylic self-adhesive, having a weight average molecular weight of 100,000 to 300,000, and having an acid value of 30 or above, that can react with a crosslinking agent (c) a tackifier resin having a softening point of 90°C or above and a solubility parameter value (a SP value) of 8.9 or above and (d) a crosslinking agent. The re-peelable self-adhesive sheet has a self-adhesive layer formed by coating a side of a base material with the self-adhesive composition. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、粘着剤層中に含有
する熱膨張性微小球が膨張する温度に加熱されることに
より被着体から容易に剥離可能な再剥離性粘着シート、
特にそのガス気化温度よりも25℃低い温度において高
い粘着力を有し、さらに被着体に粘着させた後、加熱
し、被着体から剥離させたときにその被着体に糊残り等
の汚染を生じさせない再剥離性粘着シート及びそれを用
いる加工方法に関する。
TECHNICAL FIELD The present invention relates to a removable pressure-sensitive adhesive sheet which can be easily peeled from an adherend by being heated to a temperature at which the heat-expandable microspheres contained in the pressure-sensitive adhesive layer expand.
In particular, it has a high adhesive strength at a temperature 25 ° C lower than the gas vaporization temperature, and when it is peeled from the adherend after being adhered to the adherend and then heated, the adhesive residue or the like remains on the adherend. The present invention relates to a removable pressure-sensitive adhesive sheet that does not cause contamination and a processing method using the same.

【0002】[0002]

【従来の技術】従来から、被着体に貼り付け、不要とな
った場合に簡単に剥離することのできる再剥離性粘着シ
ートが用いられている。このような再剥離シートとして
は、基材上に紫外線硬化型のオリゴマーを含有した粘着
剤層を設けたものや、アクリル系粘着剤の側鎖に結晶性
を有した粘着剤を基板上に塗布したもの、さらには、基
材上に熱膨張性微小球を含有する粘着剤層を設けた粘着
シート等が提案され用いられている。このような再剥離
性粘着シートは、剥離性の容易さからラベルや電子部品
製造工程用、例えばフレキシブルプリント基板製造工
程、T−BGA基板製造工程、半導体ウェハの切断工程
及び積層セラミックコンデンサーの小片化加工工程等に
用いられている。特に積層セラミックコンデンサーや積
層チップインダクター等のセラミックグリーンシートの
小片化においては、近年その小片化及びその精度が高ま
るとともに、またその小片化の切断効率を高めるため、
セラミックグリーンシートを粘着フィルムに固定した
後、有機バインダーの軟化点温度以上の温度、例えば、
50℃〜90℃に加熱し、切断する加工工程が考えられ
てきた。しかしながら、従来用いられてきた紫外線硬化
型再剥離粘着シートは、加熱時でのグリーンシートとの
粘着性には優れているが、小片化後の再剥離性は悪く、
小片化されたチップが剥離し難いものであるし、側鎖に
結晶性を有したアクリル系粘着剤層を有する再剥離性粘
着シートの場合、その温度領域が低く、かつ粘着力も弱
いため、小型化するチップの小片化に難がある。さらに
粘着剤層中に熱膨張性微小球を含有する再剥離性粘着シ
ートもまた、微小球粒子を含有するため粘着力を高める
ことが難しく、さらにグリーンシートの小片化加工温度
が50℃〜90℃と上昇したため、その初期密着力も大
きく低下する傾向にあり、その小片化精度を著しく低下
し、チップ飛び等の歩留まりを低下するものであった。
尚、グリーンシートの積層枚数が多くなるに従い、その
厚みが厚くなるため、その小片化の加工温度は更に高く
なる傾向であり、120℃程度での加工温度が望まれて
いる。そのため、熱膨張性微小球を含有する粘着剤層を
有する再剥離性粘着シートとして、粘着剤層表面の中心
線平均粗さが0.4μm以下とした加熱剥離型粘着シー
ト及び前記粘着剤層と基材との間にゴム状有機弾性層を
もうけた加熱剥離型粘着シート(特開2001−131
507号公報)が提案されているが、被着体との粘着
性、加工精度の面で満足するものではなかった。
2. Description of the Related Art Conventionally, a re-peelable pressure-sensitive adhesive sheet has been used which can be attached to an adherend and easily peeled off when it is no longer needed. As such a re-releasing sheet, one having a pressure-sensitive adhesive layer containing a UV-curable oligomer on a substrate, or a pressure-sensitive adhesive having crystallinity in the side chain of an acrylic pressure-sensitive adhesive is coated on a substrate. In addition to the above, an adhesive sheet in which an adhesive layer containing heat-expandable microspheres is provided on a substrate has been proposed and used. Such a releasable pressure-sensitive adhesive sheet is used for a label or electronic part manufacturing process, for example, a flexible printed circuit board manufacturing process, a T-BGA substrate manufacturing process, a semiconductor wafer cutting process, and a monolithic ceramic capacitor into small pieces because of its easy releasability. It is used in processing steps. In particular, in the miniaturization of ceramic green sheets such as monolithic ceramic capacitors and monolithic chip inductors, in recent years, the miniaturization and its accuracy have increased, and in addition, the cutting efficiency of miniaturization has been improved.
After fixing the ceramic green sheet to the adhesive film, a temperature above the softening point temperature of the organic binder, for example,
A processing step of heating to 50 ° C. to 90 ° C. and cutting has been considered. However, the ultraviolet-curable re-peelable pressure-sensitive adhesive sheet that has been conventionally used is excellent in the adhesiveness with the green sheet when heated, but the re-peelable property after being made into small pieces is poor,
Chips that are cut into small pieces are difficult to peel off, and in the case of a re-peelable pressure-sensitive adhesive sheet having an acrylic pressure-sensitive adhesive layer with crystallinity in the side chain, its temperature range is low and the adhesive strength is weak, so it is small. It is difficult to make chips into smaller chips. Furthermore, a releasable pressure-sensitive adhesive sheet containing heat-expandable microspheres in the pressure-sensitive adhesive layer also contains microsphere particles, so that it is difficult to increase the adhesive strength, and the green sheet fragmentation processing temperature is 50 ° C to 90 ° C. Since the temperature increased to 0 ° C., the initial adhesive force thereof also tended to be greatly reduced, the accuracy of fragmentation was remarkably reduced, and the yield such as chip flying was reduced.
Since the thickness of the green sheets increases as the number of laminated green sheets increases, the processing temperature for fragmentation tends to become higher, and a processing temperature of about 120 ° C. is desired. Therefore, as a releasable pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer containing heat-expandable microspheres, a heat-peelable pressure-sensitive adhesive sheet having the center line average roughness of the surface of the pressure-sensitive adhesive layer of 0.4 μm or less and the pressure-sensitive adhesive layer. A heat-peelable pressure-sensitive adhesive sheet having a rubber-like organic elastic layer between the base material and the base material (JP 2001-131A).
No. 507) has been proposed, but it was not satisfactory in terms of adhesiveness to an adherend and processing accuracy.

【0003】[0003]

【発明が解決しようとする課題】本発明は、被着体に貼
り付けた場合、常温ではもちろん、50℃〜90℃の環
境においても十分被着体との粘着性を確保でき、しかも
被着体から剥離する際には被着体を破壊せず、被着体に
糊残り等の汚染を生じさせない再剥離性粘着シート及び
それを用いる加工方法を提供することをその課題とす
る。
DISCLOSURE OF THE INVENTION The present invention, when applied to an adherend, can secure sufficient tackiness with the adherend not only at room temperature but also in an environment of 50 ° C. to 90 ° C. It is an object of the present invention to provide a re-peelable pressure-sensitive adhesive sheet that does not destroy the adherend when peeling it from the body and does not cause contamination such as adhesive residue on the adherend and a processing method using the same.

【0004】[0004]

【課題を解決するための手段】本発明者らは、前記課題
を解決するため鋭意研究を重ねた結果、基材の片面に設
ける粘着剤層が、特定の分子量と酸価を有するアクリル
系粘着剤、粘着剤と反応可能な架橋剤、粘着付与樹脂及
び熱膨張性微小球とを有する粘着剤組成物からなる粘着
シートは、常温はもちろんのこと、小片化加工温度にお
いても被着体との粘着性に優れ、かつ剥離性の良好な再
剥離性粘着シートとなることを見出し、この知見に基づ
いて本発明をなすに至った。即ち、本発明によれば、以
下に示す再剥離性粘着シート及び加工方法が提供され
る。 (1)基材の片面に(a)熱膨張性微小球、(b)重量
平均分子量が10万〜30万で架橋剤と反応し得る30
以上の酸価を有するアクリル系粘着剤及び(c)軟化点
が90℃以上、溶解パラメータ値(SP値)が8.9以
上である粘着付与樹脂、(d)架橋剤からなる粘着剤組
成物を塗布して形成した粘着剤層を設けたことを特徴と
する再剥離性粘着シート。 (2)該(b)成分の重量平均分子量(Mw)と数平均
分子量(Mn)との比(Mw/Mn)が、3〜7の範囲
であることを特徴とする前記(1)に記載の再剥離性粘
着シート。 (3)該(b)成分のガラス転移温度が、−30〜0℃
の範囲であることを特徴とする前記(1)又は(2)に
記載の再剥離性粘着シート。 (4)該(c)成分の軟化点が、90℃〜150℃の範
囲である前記(1)〜(3)のいずれかに記載の再剥離
性粘着シート。 (5)該(c)成分が、テルペン系樹脂である前記
(1)〜(4)のいずれかに記載の再剥離性粘着シー
ト。 (6)該(d)成分が、エポキシ系架橋剤であることを
特徴とする前記(1)〜(5)のいずれかに記載の再剥
離性粘着シート。 (7)該(b)成分100質量部に対し、該(a)成分
が15〜100質量部、該(d)成分が0.25〜2.
0質量部の割合で配合されていることを特徴とする前記
(1)〜(6)のいずれかに記載の再剥離性粘着シー
ト。 (8)該(c)成分の配合割合は、該(b)成分100
質量部に対し10〜100質量部であることを特徴とす
る前記(1)〜(7)のいずれかに記載の再剥離性粘着
シート。 (9)基材の少なくとも一方の面に粘着シートを粘着さ
せた後、該基材を加工し、その後該加工された基材から
該粘着シートを剥離させる加工方法において、該粘着シ
ートとして、前記(1)〜(8)のいずれかに記載の再
剥離性粘着シートを用いることを特徴とする加工方法。 (10)該加工が、切断加工であることを特徴とする前
記(9)に記載の加工方法。 (11)該(a)成分のガス気化温度が、該加工温度よ
りも25℃以上高い温度であることを特徴とする前記
(9)〜(10)のいずれかに記載の加工方法。
As a result of intensive studies to solve the above problems, the present inventors have found that an adhesive layer provided on one surface of a substrate has an acrylic adhesive having a specific molecular weight and acid value. A pressure-sensitive adhesive sheet made of a pressure-sensitive adhesive, a pressure-sensitive adhesive composition having a cross-linking agent capable of reacting with a pressure-sensitive adhesive, a tackifying resin and heat-expandable microspheres can be used not only at room temperature but also as an adherend at a fragmentation processing temperature. It has been found that a removable pressure-sensitive adhesive sheet having excellent adhesiveness and good releasability is obtained, and the present invention has been completed based on this finding. That is, according to the present invention, the following removable pressure-sensitive adhesive sheets and processing methods are provided. (1) (a) heat-expandable microspheres on one surface of the substrate, (b) having a weight average molecular weight of 100,000 to 300,000 and capable of reacting with a crosslinking agent 30.
A pressure-sensitive adhesive composition comprising an acrylic pressure-sensitive adhesive having the above acid value, (c) a tackifying resin having a softening point of 90 ° C. or higher and a solubility parameter value (SP value) of 8.9 or higher, and (d) a cross-linking agent. A removable pressure-sensitive adhesive sheet, comprising a pressure-sensitive adhesive layer formed by applying. (2) The ratio (Mw / Mn) of the weight average molecular weight (Mw) and the number average molecular weight (Mn) of the component (b) is in the range of 3 to 7, which is described in (1) above. Removable adhesive sheet. (3) The glass transition temperature of the component (b) is −30 to 0 ° C.
The removable pressure-sensitive adhesive sheet according to (1) or (2) above, wherein (4) The removable pressure-sensitive adhesive sheet according to any one of (1) to (3), wherein the softening point of the component (c) is in the range of 90 ° C to 150 ° C. (5) The removable pressure-sensitive adhesive sheet according to any one of (1) to (4), wherein the component (c) is a terpene resin. (6) The removable pressure-sensitive adhesive sheet according to any one of (1) to (5), wherein the component (d) is an epoxy-based cross-linking agent. (7) For 100 parts by mass of the component (b), 15 to 100 parts by mass of the component (a) and 0.25 to 2.
The removable pressure-sensitive adhesive sheet according to any one of (1) to (6) above, which is blended in a proportion of 0 part by mass. (8) The mixing ratio of the component (c) is 100 parts of the component (b).
The releasable pressure-sensitive adhesive sheet according to any one of (1) to (7) above, which is 10 to 100 parts by mass with respect to parts by mass. (9) In a processing method in which a pressure-sensitive adhesive sheet is adhered to at least one surface of a base material, the base material is processed, and then the pressure-sensitive adhesive sheet is peeled from the processed base material, A processing method characterized by using the removable pressure-sensitive adhesive sheet according to any one of (1) to (8). (10) The processing method according to (9), wherein the processing is a cutting process. (11) The processing method according to any one of (9) to (10), wherein the gas vaporization temperature of the component (a) is 25 ° C. or more higher than the processing temperature.

【0005】[0005]

【発明の実施の形態】本発明の再剥離性粘着シートに用
いられる基材は特に制約されず、粘着シートの利用分野
に応じて適宜選択すればよく、例えば、ポリエチレンテ
レフタレート、ポリエチレンナフタレート、ポリエチレ
ン、ポリカーボネート、トリアセチルセルロース、セロ
ハン、ポリイミド、ポリアミド、ポリフェニレンスルフ
ィド、ポリエーテルイミド、ポリエーテルスルホン、芳
香族ポリアミド、ポリスルホン等の合成樹脂性フィルム
が使用できる。この基材は、透明であっても、基材中に
各種顔料や染料を配合して着色したものや、表面がマッ
ト状となっているものがあってもよい。
BEST MODE FOR CARRYING OUT THE INVENTION The base material used in the removable pressure-sensitive adhesive sheet of the present invention is not particularly limited and may be appropriately selected according to the field of use of the pressure-sensitive adhesive sheet, and examples thereof include polyethylene terephthalate, polyethylene naphthalate and polyethylene. Synthetic resin films such as polycarbonate, triacetyl cellulose, cellophane, polyimide, polyamide, polyphenylene sulfide, polyetherimide, polyether sulfone, aromatic polyamide, and polysulfone can be used. This base material may be transparent, may be colored by mixing various pigments or dyes into the base material, and may have a matte surface.

【0006】粘着シートを50〜90℃程度の環境で長
時間さらす分野で使用する場合には、粘着シートの寸法
変化やカール発生の問題をさけるために、粘着シートに
用いる基材として加熱収縮率が0.5%以下、好ましく
は0.2%以下の基材を用いるとよい。ここで、加熱収
縮率とは、JIS C 2318にて定義されるものあ
る。通常は、ポリエチレンテレフタレートフィルム及び
ポリエチレンナフタレートフィルムのうちから加熱収縮
率が0.2%以下のものを選択するとよい。基材の厚さ
は、粘着シートの利用分野に応じて適宜選択すればよい
が、通常25μm〜250μmの範囲である。切断及び
小片化加工時の被着体保持用途に用いる場合、その厚さ
は25〜250μmの範囲であり、特にセラミック系シ
ートの小片化工程に用いる場合は、100〜188μm
の範囲の厚さにするのがよい。
When the pressure-sensitive adhesive sheet is used in a field where it is exposed to an environment of about 50 to 90 ° C. for a long time, in order to avoid problems such as dimensional change and curling of the pressure-sensitive adhesive sheet, a heat shrinkage ratio is used as a base material for the pressure-sensitive adhesive sheet. Is 0.5% or less, preferably 0.2% or less. Here, the heat shrinkage rate is defined by JIS C 2318. Usually, it is preferable to select a polyethylene terephthalate film or a polyethylene naphthalate film having a heat shrinkage ratio of 0.2% or less. The thickness of the substrate may be appropriately selected depending on the field of use of the pressure-sensitive adhesive sheet, but is usually in the range of 25 μm to 250 μm. When used for holding an adherend during cutting and slicing, the thickness is in the range of 25 to 250 μm, and particularly when used in the step of slicing a ceramic sheet, 100 to 188 μm.
It is recommended that the thickness be within the range.

【0007】これら粘着シート用基材は、公知の添加
剤、耐熱安定剤、耐酸化安定剤、耐候安定剤、紫外線吸
収剤、帯電防止剤などを含有することができる。また、
基材と粘着剤層との密着性を向上させるために、表面処
理及び/又は接着性を有する中間層を設けてもよい。表
面処理としては、例えば(1)コロナ放電処理やグロー
放電処理などの放電処理、(2)プラズマ処理、(3)
火炎処理、(4)オゾン処理、(5)紫外線処理や電子
線、放射線処理などの電離活性線処理、(6)サンドマ
ット処理やヘアライン処理などの粗面化処理、(7)化
学薬品処理などが挙げられる。また中間層としては、例
えば、後述する粘着剤層から熱膨張性微小球を含有しな
い粘着剤層等の基材との密着性が膨張性微小球含有粘着
層よりも高いものが用いることができる。この中間層の
厚さは1〜100μm、特に基材との密着性、生産性の
点から10〜50μmの範囲の厚さが好適に用いられ
る。
These pressure-sensitive adhesive sheet base materials may contain known additives, heat resistance stabilizers, oxidation resistance stabilizers, weather resistance stabilizers, UV absorbers, antistatic agents, and the like. Also,
In order to improve the adhesion between the base material and the pressure-sensitive adhesive layer, an intermediate layer having surface treatment and / or adhesiveness may be provided. As the surface treatment, for example, (1) discharge treatment such as corona discharge treatment or glow discharge treatment, (2) plasma treatment, (3)
Flame treatment, (4) ozone treatment, (5) ionizing actinic ray treatment such as ultraviolet ray treatment, electron beam and radiation treatment, (6) roughening treatment such as sand mat treatment and hairline treatment, (7) chemical treatment, etc. Is mentioned. Further, as the intermediate layer, for example, one having higher adhesiveness from the pressure-sensitive adhesive layer described later to a substrate such as a pressure-sensitive adhesive layer containing no heat-expandable microspheres than the expandable microsphere-containing pressure-sensitive adhesive layer can be used. . The thickness of the intermediate layer is preferably 1 to 100 μm, and particularly preferably 10 to 50 μm in terms of adhesion to a substrate and productivity.

【0008】本発明のシートは、前記基材上もしくは所
望により設けられる表面処理面及び/又は中間層上に、
粘着剤層を積層した構造を有する。粘着剤層に用いられ
る(a)熱膨張性微小球としては、例えばイソブタン、
プロパン、ペンタン等の加熱により容易にガス化して膨
張する物質を、弾性を有する殻内に内包させた微小球で
あればよい。この殻は、熱溶融性物質や熱膨張により破
壊する物質で形成される場合が多い。殻を形成する物質
として、例えば、塩化ビニリデン−アクリロニトリル共
重合体、ポリビニルアルコール、ポリビニルブチラー
ル、ポリメチルメタクリレート、ポリアクリロニトリ
ル、ポリ塩化ビニリデン、ポリスルホン等が挙げられ
る。熱膨張性微小球は、例えばマイクロスフェア[商品
名、松本油脂製薬社製]等の市販品もある。熱膨張性微
小球の選択に際しては、使用する温度により最適なガス
気化温度のものを適宜選択すればよく、特に制限はない
が、好ましくはガス気化温度が、切断や小片化等の加工
温度の25℃以上であるものを用いるのがよい。加熱処
理により粘着層の粘着力を効率よく低下させるため、体
積膨張率が5倍以上、好ましくは7倍以上、特に好まし
くは10倍以上となるまで破裂しない適度な強度を有す
る熱膨張性微小球が好ましい。この熱膨張性微小球の大
きさは平均粒径で10〜17μmの範囲から適宜選択す
るのがよい。
The sheet of the present invention is provided on the above-mentioned base material or on the surface-treated surface and / or intermediate layer which is optionally provided,
It has a structure in which an adhesive layer is laminated. Examples of the (a) heat-expandable microspheres used for the pressure-sensitive adhesive layer include isobutane,
It is sufficient that the material is a microsphere in which a substance that is easily gasified and expanded by heating, such as propane or pentane, is enclosed in an elastic shell. The shell is often formed of a heat-meltable substance or a substance that is destroyed by thermal expansion. Examples of the substance that forms the shell include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, and polysulfone. There are commercially available heat-expandable microspheres such as Microsphere [trade name, manufactured by Matsumoto Yushi-Seiyaku Co., Ltd.]. In selecting the heat-expandable microspheres, the one having an optimum gas vaporization temperature may be appropriately selected depending on the temperature to be used, and there is no particular limitation, but the gas vaporization temperature is preferably a processing temperature such as cutting or fragmentation. It is preferable to use one having a temperature of 25 ° C. or higher. In order to efficiently reduce the adhesive strength of the adhesive layer by heat treatment, heat-expandable microspheres having a suitable strength that does not burst until the volume expansion coefficient becomes 5 times or more, preferably 7 times or more, particularly preferably 10 times or more. Is preferred. The size of the heat-expandable microspheres may be appropriately selected from the range of 10 to 17 μm in average particle diameter.

【0009】次に、粘着剤層を構成する(b)成分のア
クリル系粘着剤において、その重量平均分子量は10万
〜30万の範囲であり、その酸価は30以上である。重
量平均分子量がこの範囲より分子量が小さくなると被着
体への粘着性が低下しやすくなり、30万を超えると糊
残りが生じる傾向にある。熱膨張性微小球の膨張後の剥
離性及び常温付近での粘着力の面から、好ましい範囲は
12万〜25万である。本発明で用いられる(b)成分
は、重量平均分子量(Mw)と数平均分子量(Mn)と
の比(Mw/Mn)が3〜7の範囲であることが望まし
い。Mw/Mnが3未満であると、常温付近での被着体
との粘着力が低くなる傾向が見られ、7を超えると、高
温での被着体との十分な粘着力が得られなかったり、糊
残りなどを起こす傾向が見られるので好ましくない。常
温付近及び高温での被着体との粘着性の面から好ましい
Mw/Mnは4〜6の範囲である。この(b)成分の酸
価は30以上である。酸価が30未満であると、粘着剤
と架橋剤の十分な架橋密度が得られず、高温での十分な
被着体との粘着力が得られず、熱膨張性微小球膨張後の
剥離性が低下する。特に高温での被着体との粘着性及び
熱膨張性微小球膨張後の剥離性の面から、好ましい酸価
は40〜50の範囲である。なお、本明細書で言う酸価
とは、試料1g中に含まれる遊離脂肪酸や、樹脂酸を中
和するのに要する水酸化カリウムのmg数であり、JI
S K 5407に準じて測定され、次式により算出さ
れる。
Next, in the acrylic pressure-sensitive adhesive as the component (b) constituting the pressure-sensitive adhesive layer, its weight average molecular weight is in the range of 100,000 to 300,000, and its acid value is 30 or more. If the weight average molecular weight is smaller than this range, the adhesiveness to the adherend tends to decrease, and if it exceeds 300,000, adhesive residue tends to occur. The preferable range is 120,000 to 250,000 in view of the peelability after expansion of the heat-expandable microspheres and the adhesive strength at around room temperature. The component (b) used in the present invention preferably has a ratio (Mw / Mn) of the weight average molecular weight (Mw) to the number average molecular weight (Mn) in the range of 3 to 7. If Mw / Mn is less than 3, the adhesive strength to the adherend tends to be low at around room temperature, and if Mw / Mn exceeds 7, sufficient adhesive strength to the adherend at high temperature cannot be obtained. It is not preferable because there is a tendency to cause residue or adhesive residue. The preferable Mw / Mn is in the range of 4 to 6 from the viewpoint of the adhesiveness to the adherend at around room temperature and high temperature. The acid value of this component (b) is 30 or more. If the acid value is less than 30, a sufficient crosslink density between the pressure-sensitive adhesive and the crosslinking agent cannot be obtained, and sufficient adhesion to the adherend at high temperature cannot be obtained, resulting in peeling after expansion of the heat-expandable microspheres. Sex decreases. Particularly, the acid value is preferably in the range of 40 to 50 from the viewpoint of the adhesiveness to the adherend at high temperature and the releasability after expansion of the heat-expandable microspheres. The acid value as referred to in this specification is the number of mg of potassium hydroxide required to neutralize the free fatty acid and resin acid contained in 1 g of the sample,
It is measured according to SK 5407 and calculated by the following formula.

【数1】 [Equation 1]

【0010】このアクリル系粘着剤は、架橋剤と反応し
得るものである。このようなものには、アクリル酸アル
キルエステル又はメタクリル酸アルキルエステルの1種
以上の単量体成分と架橋剤と反応し得る官能基を有する
単量体成分との共重合体が包含される。前記アクリル酸
アルキルエステル又はメタクリル酸アルキルエステルの
アルキルエステルとしては、例えばメチルエステル、エ
チルエステル、プロピルエステル、イソプロピルエステ
ル、ブチルエステル、イソブチルエステル、s−ブチル
エステル、t−ブチルエステル、ペンチルエステル、ヘ
キシルエステル、ヘプチルエステル、オクチルエステ
ル、イソオクチルエステル、2−エチルヘキシルエステ
ル、イソデシルエステル、ドデシルエステル、トリデシ
ルエステル、ペンタデシルエステル、オクタデシルエス
テル、ノナデシルエステル、エイコシルエステル等が挙
げられる。架橋剤と反応し得る官能基を有する単量体と
しては、その官能基がカルボキシル基であるアクリル
酸、メタクリル酸、カルボキシエチルアクリレート、カ
ルボキシペンチルアクリレート、イタコン酸、マレイン
酸、フマル酸、クロトン酸、等の他、官能基がヒドロキ
シル基であるアクリル酸ヒドロキシエチル、メタクリル
酸ヒドロキシエチル、アクリル酸ヒドロキシプロピル、
メタクリル酸ヒドロキシプロピル、アクリル酸ヒドロキ
シブチル、メタクリル酸ヒドロキシブチル、アクリル酸
ヒドロキシヘキシル、メタクリル酸ヒドロキシヘキシ
ル、アクリル酸ヒドロキシオクチル、メタクリル酸ヒド
ロキシオクチル、アクリル酸ヒドロキシデシル、メタク
リル酸ヒドロキシデシル、アクリル酸ヒドロキシラウリ
ル、メタクリル酸ヒドロキシラウリル等が挙げられる。
これらの単量体は単独又は2種以上を組み合わせて用い
てもよい。(メタ)アクリル酸アルキルエステルと架橋
剤と反応し得る官能基を有する単量体との比は、質量比
で92:8〜98:2の範囲であることが好ましく、こ
の範囲より架橋剤と反応し得る官能基を有する単量体の
配合比が少ないと、熱膨張性微小球が膨張したとき被着
体との剥離性が損なわれるようになり、この範囲を超え
ると被着体との粘着力が乏しくなる。被着体との粘着性
及び剥離性の面から特に好ましい配合比は95:5〜9
3:7である。
The acrylic pressure-sensitive adhesive is capable of reacting with the crosslinking agent. Such include a copolymer of one or more monomer components of alkyl acrylate or methacrylic acid alkyl ester and a monomer component having a functional group capable of reacting with a crosslinking agent. Examples of the alkyl ester of acrylic acid alkyl ester or methacrylic acid alkyl ester include methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, hexyl ester. , Heptyl ester, octyl ester, isooctyl ester, 2-ethylhexyl ester, isodecyl ester, dodecyl ester, tridecyl ester, pentadecyl ester, octadecyl ester, nonadecyl ester, eicosyl ester and the like. The monomer having a functional group capable of reacting with a cross-linking agent, acrylic acid whose functional group is a carboxyl group, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, In addition, etc., the functional group is a hydroxyl group hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate,
Hydroxypropyl methacrylate, hydroxybutyl acrylate, hydroxybutyl methacrylate, hydroxyhexyl acrylate, hydroxyhexyl methacrylate, hydroxyoctyl acrylate, hydroxyoctyl methacrylate, hydroxydecyl acrylate, hydroxydecyl methacrylate, hydroxylauryl acrylate, Examples thereof include hydroxylauryl methacrylate.
You may use these monomers individually or in combination of 2 or more types. The ratio of the (meth) acrylic acid alkyl ester to the monomer having a functional group capable of reacting with the cross-linking agent is preferably in the range of 92: 8 to 98: 2 in terms of mass ratio. When the compounding ratio of the monomer having a reactive functional group is small, the peelability from the adherend is impaired when the heat-expandable microspheres are expanded, and if it exceeds this range, Adhesion becomes poor. A particularly preferable compounding ratio is 95: 5 to 9 from the viewpoint of adhesiveness and peeling property from an adherend.
3: 7.

【0011】さらに、所望により前記単量体以外の単量
体を併用してもよい。このようなものとしては、例えば
スチレン、酢酸ビニル、アクリロニトリル、アクリルア
ミド、ポリエチレングリコールアクリレート、N−ビニ
ルピロリドン、テトラフルフリルアクリレート等が挙げ
られる。
Furthermore, if desired, a monomer other than the above monomers may be used in combination. Examples of such substances include styrene, vinyl acetate, acrylonitrile, acrylamide, polyethylene glycol acrylate, N-vinylpyrrolidone, and tetrafurfuryl acrylate.

【0012】この(b)成分は、前記単量体をラジカル
共重合させることによって得ることができる。この場合
の共重合法は良く知られており、乳化重合法、溶液重合
法、塊状重合法、懸濁重合法、光重合法等が挙げられ
る。また、(b)成分のガラス転移温度は−30℃〜0
℃の範囲であることが望ましい。ガラス転移温度が0℃
を超えると被着体との粘着力が低下するし、−30℃未
満であると、加熱処理後の剥離時に糊残りを起こしやす
くなり、良好な剥離性が得られない。被着体との粘着性
及び加熱処理後の剥離性の面から好ましいガラス転移温
度は−15℃〜0℃である。
The component (b) can be obtained by radically copolymerizing the above monomer. The copolymerization method in this case is well known, and examples thereof include an emulsion polymerization method, a solution polymerization method, a bulk polymerization method, a suspension polymerization method, and a photopolymerization method. The glass transition temperature of the component (b) is -30 ° C to 0.
It is preferably in the range of ° C. Glass transition temperature is 0 ℃
If it exceeds, the adhesive force with the adherend is reduced, and if it is less than -30 ° C, adhesive residue is likely to occur at the time of peeling after the heat treatment, and good peelability cannot be obtained. The glass transition temperature is preferably −15 ° C. to 0 ° C. from the viewpoint of adhesiveness with an adherend and peelability after heat treatment.

【0013】本発明の粘着剤層においては、前記(b)
成分の粘着剤は(d)架橋剤で架橋されている。ここで
架橋剤は用いられる粘着剤に合せて適宜選択すればよ
く、特に制約を受けず、イソシアネート系架橋剤、金属
キレート架橋剤及びエポキシ系架橋剤等が用いられる
が、特に熱膨張性微小球が膨張する温度に加熱後、被着
体からの剥離性及び糊残り防止性の面から、エポキシ系
の架橋剤を用いることが好ましい。エポキシ系架橋剤と
しては、例えば、ビスフェノール系エポキシ樹脂(例え
ば、ビスフェノールA型、ビスフェノールF型、ビスフ
ェノールAD型)、フェノールノボラック型エポキシ樹
脂、エチレングリコールジグリシジルエーテル、1,6
−ヘキサンジオールグリシジルエーテル、トリメチロー
ルプロパントリグリシジルエーテル、ジグリシジルアニ
リン、ジグリシジルアミン、N,N,N’,N’−テト
ラグリシジル−m−キシレンジアミン、1,3−ビス
(N,N’−ジグリシジルアミノメチル)シクロヘキサ
ン等が挙げられ、常温での被着体との粘着性及び熱膨張
性微小球膨張後の剥離性の面で特に多官能性のもの、好
ましくは4官能のエポキシ系架橋剤が好ましい。このよ
うなものとしては、例えば、N,N,N’,N’−テト
ラグリシジル−m−キシレンジアミン、1,3−ビス
(N,N’−ジグリシジルアミノメチル)シクロヘキサ
ンが挙げられる。このエポキシ系架橋剤は、架橋反応速
度が遅くなる傾向にあり、反応が不十分の場合、粘着剤
層の凝集力が低くなり、被着体表面に糊残り等が発生す
ることがある。架橋反応を促進するために(1)アミン
等の触媒を添加する、(2)粘着剤の構成成分としてア
ミン系官能基を持つ単量体を用いる、(3)架橋剤にア
ジリジン系架橋剤を併用する、等を行うことが望まし
い。特に好ましいものは、N,N,N’,N’−テトラ
グリシジル−m−キシレンジアミン等の架橋剤中に、触
媒効果を有する3級アミンを含有しているものである。
In the pressure-sensitive adhesive layer of the present invention, the above (b)
The component pressure-sensitive adhesive is crosslinked with the (d) crosslinking agent. Here, the cross-linking agent may be appropriately selected according to the pressure-sensitive adhesive to be used, and is not particularly limited, and an isocyanate-based cross-linking agent, a metal chelate cross-linking agent, an epoxy-based cross-linking agent, or the like is used, but particularly the heat-expandable microspheres. After heating to a temperature at which the epoxy resin expands, it is preferable to use an epoxy-based cross-linking agent from the viewpoints of peelability from an adherend and prevention of adhesive residue. Examples of the epoxy-based crosslinking agent include bisphenol-based epoxy resins (for example, bisphenol A type, bisphenol F type, bisphenol AD type), phenol novolac type epoxy resins, ethylene glycol diglycidyl ether, 1,6
-Hexanediol glycidyl ether, trimethylolpropane triglycidyl ether, diglycidyl aniline, diglycidyl amine, N, N, N ', N'-tetraglycidyl-m-xylenediamine, 1,3-bis (N, N'- Diglycidylaminomethyl) cyclohexane and the like, particularly polyfunctional ones in terms of adhesiveness to an adherend at room temperature and peelability after expansion of heat-expandable microspheres, preferably tetrafunctional epoxy cross-linking Agents are preferred. Examples of such compounds include N, N, N ', N'-tetraglycidyl-m-xylenediamine and 1,3-bis (N, N'-diglycidylaminomethyl) cyclohexane. This epoxy-based cross-linking agent tends to slow the rate of cross-linking reaction, and when the reaction is insufficient, the cohesive force of the pressure-sensitive adhesive layer becomes low, and adhesive residue or the like may occur on the surface of the adherend. In order to accelerate the crosslinking reaction, (1) a catalyst such as an amine is added, (2) a monomer having an amine functional group is used as a constituent of the pressure-sensitive adhesive, and (3) an aziridine crosslinking agent is used as the crosslinking agent. It is desirable to use them together. Particularly preferred are those containing a tertiary amine having a catalytic effect in a cross-linking agent such as N, N, N ′, N′-tetraglycidyl-m-xylenediamine.

【0014】発明で用いる(d)成分は、単独で用いて
もよいし、2種以上を組み合わせて用いてもよい。粘着
剤層中の前記(a)成分と(b)成分との配合割合は、
(b)成分100質量部に対し、(a)成分を15〜1
00質量部の範囲である。この範囲より(a)成分の配
合量が少ないと熱膨張性微小球が膨張した後、被着体か
らの剥離性が低下するし、この範囲を超えると常温付近
での被着体との粘着力が低下する。被着体との粘着性及
び剥離性の面から好ましい(a)成分の配合割合は15
〜40質量部である。また、(b)成分と(d)成分の
モル比は、100:1.0〜2.5の範囲である。この
範囲より(d)成分の割合が少ないと被着体に糊残りな
どが発生したり、被着体との剥離性が損なわれるし、こ
の範囲を超えると常温付近での被着体との粘着力が低下
する。被着体への汚染防止、被着体との粘着性及び剥離
性の面から好ましい(b)成分と(d)成分のモル比は
100:1.5〜2.0の範囲である。
The component (d) used in the invention may be used alone or in combination of two or more kinds. The mixing ratio of the component (a) and the component (b) in the adhesive layer is
The component (a) is added in an amount of 15 to 1 to 100 parts by weight of the component (b).
It is in the range of 00 parts by mass. If the amount of component (a) is less than this range, the heat-expandable microspheres will expand and then the releasability from the adherend will decrease. If it exceeds this range, adhesion with the adherend near room temperature will occur. The power decreases. From the viewpoint of adhesiveness and peelability with respect to the adherend, the compounding ratio of the component (a) is preferably 15
~ 40 parts by mass. Further, the molar ratio of the component (b) and the component (d) is in the range of 100: 1.0 to 2.5. If the proportion of the component (d) is less than this range, adhesive residue or the like may occur on the adherend, or the releasability from the adherend may be impaired. The adhesive strength is reduced. The molar ratio of the component (b) to the component (d) is preferably 100: 1.5 to 2.0 in terms of prevention of contamination of the adherend, adhesion to the adherend, and releasability.

【0015】また、(b)成分として30以上の酸価を
有するアクリル系粘着剤を用いる場合、(b)成分の官
能基の残量が90%〜98%となるように架橋剤を配合
することにより初期剥離力と熱膨張性微小球膨張後の剥
離性とのバランスが良好な粘着剤層を得ることができ
る。(b)成分の官能基の残量が90%未満であると初
期剥離力は向上するものの、熱膨張性微小球膨張後の剥
離性、特に糊残りの発生が見られるし、98%を超える
と熱膨張性微小球膨張後の剥離性は向上するが初期剥離
力が低下する。好ましい(b)成分の官能基の残量は9
2%〜96%の範囲である。
When an acrylic pressure-sensitive adhesive having an acid value of 30 or more is used as the component (b), the crosslinking agent is blended so that the residual amount of the functional group of the component (b) is 90% to 98%. This makes it possible to obtain a pressure-sensitive adhesive layer having a good balance between the initial peeling force and the peelability after expansion of the heat-expandable microspheres. When the residual amount of the functional group of the component (b) is less than 90%, the initial peeling force is improved, but the peelability after the expansion of the heat-expandable microspheres, particularly the occurrence of adhesive residue, is observed and exceeds 98%. And the peelability after expansion of the heat-expandable microspheres is improved, but the initial peel force is reduced. The preferred residual amount of functional group of component (b) is 9
It is in the range of 2% to 96%.

【0016】前記粘着剤層には常温付近での被着体との
密着性をコントロールするために(c)軟化点が90℃
以上、SP値が8.9以上である粘着付与樹脂を用いる
必要がある。(c)成分としては、例えば、α−ピネン
系、β−ピネン系、ジペンテン系、テルペンフェノール
系等のテルペン系樹脂やガム系、ウッド系、トール油系
等の天然系ロジン又はこれらに水素化、不均化、重合、
マレイン化、エステル化等の処理をしたロジン系誘導体
等のロジン系樹脂、石油樹脂、クマロン−インデン樹脂
等があげられ、これらの中でも、特に軟化点が90℃〜
150℃の範囲であるものが好ましい。中でもテルペン
フェノール系の粘着付与樹脂は、被着体への汚染、糊残
りが少ないばかりか、50℃〜90℃の環境下での被着
体との粘着性に優れる、しかも熱膨張性微小球膨張後
は、被着体から容易に剥離可能な粘着層を得ることがで
きるので好ましい。この(c)成分の配合割合は、前記
(b)成分100質量部に対し10〜100質量部の範
囲である。この範囲より(c)成分の量が少ないと常温
〜100℃の範囲で被着体との粘着力が低下するし、こ
の範囲を超えると常温での被着体への貼り付け性が低下
する。被着体との粘着性及び常温での貼り付け性の面か
ら好ましい(c)成分の配合割合は20〜60質量部の
範囲である。さらに、溶解パラメータ値(SP)が8.
9以上、好ましくは8.98以上である(d)成分を用
いる必要があり、このことにより被着体への糊残り、汚
染発生を防止しでき、かつ剥離性が極めて良好な粘着剤
層を得ることができる。ここで溶解度パラメータ値(S
P値)とは、下記Holyの計算式より求められるもの
である。
The adhesive layer has a softening point of 90 ° C. (c) in order to control the adhesion with the adherend at room temperature.
As described above, it is necessary to use a tackifying resin having an SP value of 8.9 or more. As the component (c), for example, α-pinene-based, β-pinene-based, dipentene-based, terpene-phenol-based terpene-based resins and gum-based, wood-based, tall oil-based natural rosins, or hydrogenated to these , Disproportionation, polymerization,
Examples thereof include rosin-based resins such as rosin-based derivatives that have undergone maleation and esterification, petroleum resins, coumarone-indene resins, and the like.
It is preferably in the range of 150 ° C. Above all, the terpene phenol-based tackifying resin has little contamination to the adherend and little adhesive residue, and is excellent in the adhesiveness to the adherend in an environment of 50 ° C to 90 ° C, and is a heat-expandable microsphere. After expansion, an adhesive layer that can be easily peeled from the adherend can be obtained, which is preferable. The mixing ratio of the component (c) is in the range of 10 to 100 parts by mass with respect to 100 parts by mass of the component (b). If the amount of the component (c) is less than this range, the adhesive strength to the adherend is lowered in the range of room temperature to 100 ° C, and if it exceeds this range, the sticking property to the adherend at room temperature is deteriorated. . From the standpoints of adhesiveness to an adherend and sticking property at room temperature, the compounding ratio of the component (c) is preferably 20 to 60 parts by mass. Furthermore, the solubility parameter value (SP) is 8.
It is necessary to use the component (d) having a ratio of 9 or more, preferably 8.98 or more. This makes it possible to prevent adhesive residue on the adherend and the occurrence of contamination, and to form a pressure-sensitive adhesive layer having excellent releasability. Obtainable. Here, the solubility parameter value (S
The P value) is obtained from the following Holly calculation formula.

【数2】 δ=d・ΣG/M (2) [δ:溶解度パラメータ(SP値)、d:密度(g/m
l)、G:各官能基の分子引力定数(cal/ml)
1/2/mol、M:分子量(g/mol)] 溶解度パラメータ(SP値)が8.9よりも小さい場合
には、(b)成分との相溶性が悪く、均一な粘着剤層を
得ることが難しくなったり、均一な粘着剤層が得られた
場合でも、被着体との密着性が著しく低下したり、加熱
剥離後、糊残りが生じやすくなる。さらに、この(c)
成分は、水酸基価が30以上であることが好ましい。水
酸基価が30未満であると剥離時において被着体に糊残
りが生じやすくなり好ましくない。
Δ = d · ΣG / M (2) [δ: solubility parameter (SP value), d: density (g / m)
l), G: Molecular attraction constant of each functional group (cal / ml)
1/2 / mol, M: molecular weight (g / mol)] When the solubility parameter (SP value) is smaller than 8.9, the compatibility with the component (b) is poor and a uniform pressure-sensitive adhesive layer is obtained. However, even when a uniform pressure-sensitive adhesive layer is obtained, the adhesiveness to the adherend is significantly reduced, and adhesive residue is likely to occur after heat peeling. Furthermore, this (c)
The component preferably has a hydroxyl value of 30 or more. If the hydroxyl value is less than 30, adhesive residue is likely to occur on the adherend during peeling, which is not preferable.

【0017】本発明の再剥離性粘着シートにおいて、基
材上に粘着剤層を形成するには、前記した成分を適当な
溶剤に溶解又は分散させて固形分濃度を20〜50質量
%程度の粘着剤層形成塗工液を調製し、前記粘着剤層形
成塗工液を基材又は所望により設けたれた表面処理面又
は中間層上に、常法に従って、塗布、乾燥することによ
り、粘着剤層を20〜100μmの範囲で層を設ける。
この範囲より層の厚さが厚いと、加熱処理後の剥離時に
凝集破壊が起こり易くなるため、良好な剥離性が得られ
なくなるし、この範囲より薄いと、被着体との十分な粘
着力が得られなくなる。また、粘着剤層中に残っている
揮発分の量(以下、残存揮発分量という)により粘着剤
層と基材との粘着性や熱膨張性微小球が膨張する温度以
上に加熱後の被着体からの剥離性、糊残り性に悪影響を
及ぼす場合がある。したがって、粘着剤層中の残存揮発
分量は4質量%以下、特に2質量%以下とすることが好
ましい。この際、粘着剤層形成塗工液には、従来慣用さ
れている各種添加剤、例えば界面活性剤、潤滑剤、安定
剤、粘度調整剤などを添加することができる。
In the removable pressure-sensitive adhesive sheet of the present invention, in order to form a pressure-sensitive adhesive layer on a substrate, the above-mentioned components are dissolved or dispersed in a suitable solvent so that the solid content concentration is about 20 to 50% by mass. A pressure-sensitive adhesive is prepared by preparing a pressure-sensitive adhesive layer-forming coating liquid and applying and drying the pressure-sensitive adhesive layer-forming coating liquid on a substrate or a surface-treated surface or an intermediate layer provided as desired according to a conventional method. The layer is provided in the range of 20 to 100 μm.
If the layer thickness is thicker than this range, cohesive failure is likely to occur at the time of peeling after heat treatment, and good peelability cannot be obtained. If it is thinner than this range, sufficient adhesive force with the adherend is obtained. Will not be obtained. In addition, the amount of volatile matter remaining in the pressure-sensitive adhesive layer (hereinafter referred to as the amount of residual volatile matter) causes the adhesiveness between the pressure-sensitive adhesive layer and the substrate and the adhesion after heating above the temperature at which the heat-expandable microspheres expand. It may adversely affect peelability from the body and adhesive residue. Therefore, the residual volatile content in the pressure-sensitive adhesive layer is preferably 4% by mass or less, and particularly preferably 2% by mass or less. At this time, various conventionally used additives such as surfactants, lubricants, stabilizers, and viscosity modifiers can be added to the pressure-sensitive adhesive layer-forming coating liquid.

【0018】[0018]

【実施例】次に、実施例により本発明を更に詳細に説明
するが、本発明はこれらの例によってなんら限定される
ものではない。なお、再剥離性粘着シートの物性は、次
に示す方法に従って評価した。
EXAMPLES Next, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples. The physical properties of the removable pressure-sensitive adhesive sheet were evaluated according to the methods described below.

【0019】(1)初期剥離力(N/25mm) 被着体として、SUS304をJIS K−0237に
従い処理して用い、10mm幅の粘着シートを貼り付け
180°剥離力を求め、25mm幅に換算した。 (2)加熱剥離力 上記(1)で用意したサンプルを80℃のホットプレー
トにのせ、JIS K−0237に従い180°剥離力
を求めた。 (3)剥離性 SUS304に貼り付けた後、130℃で1分間ホット
プレート上で加熱し、放冷後室温にて粘着シートが発泡
し、剥離しているかどうかを以下の基準で評価した。 ◎:放冷後、何も力を加えずに被着体より粘着シートが
剥離する。 ○:粘着シートに指を触れた後、被着体より剥離する。 △:粘着シートに力を加え、糊残りなく剥離する。 ×:被着体より剥離せず、剥離する際、糊残りが見られ
る。 (4)被着体への汚染性 上記試験(3)にて剥離したSUS304の表面を以下
の基準で評価した。 ○:被着体に変色、糊残りが見られない。 ×:被着体に変色又は糊残りが見られる。
(1) Initial peeling force (N / 25 mm) As an adherend, SUS304 was treated according to JIS K-0237 and used, a pressure sensitive adhesive sheet having a width of 10 mm was pasted to obtain a 180 ° peeling force, and converted to a width of 25 mm. did. (2) Heat Peeling Force The sample prepared in (1) above was placed on a hot plate at 80 ° C., and a 180 ° peeling force was determined according to JIS K-0237. (3) Peelability After sticking to SUS304, it was heated at 130 ° C. for 1 minute on a hot plate, allowed to cool, and whether or not the pressure-sensitive adhesive sheet foamed and peeled at room temperature was evaluated according to the following criteria. ⊚: After cooling, the pressure-sensitive adhesive sheet is peeled off from the adherend without applying any force. ◯: Peel from the adherend after touching the adhesive sheet with a finger. Δ: A force is applied to the pressure-sensitive adhesive sheet to peel it off without leaving an adhesive residue. X: Not peeled from the adherend, and when peeled, adhesive residue is seen. (4) Contamination to adherend The surface of SUS304 peeled off in the above test (3) was evaluated according to the following criteria. ◯: No color change or adhesive residue is observed on the adherend. X: Discoloration or adhesive residue is observed on the adherend.

【0020】実施例1 熱膨張性微小球(製品名:マイクロスフィアF−50
D、松本油脂製薬社製、平均粒径15μm、TMA法に
よるガス気化温度115℃)8.8質量部、アクリル酸
2−エチルヘキシル、メタクリル酸、メタクリル酸メチ
ルを常法にて共重合させてなるアクリル系粘着剤(Mw
=18万、Mn=3万、ガラス転移温度−10℃、酸化
45)35質量部、テルペンフェノール系粘着付与樹脂
(軟化点125℃、SP値9.32、水酸基価200)
14質量部、エポキシ系架橋剤(N,N,N’N’−テ
トラグリシジル−m−キシレンジアミン)0.2質量部
及びトルエン42質量部を均一に混合、溶解し、粘着層
形成塗布液を調製した。この塗布液を厚さ100μmの
ポリエチレンテレフタレートシート上にベーカー式アプ
リケーターにて塗布し、80℃にて十分乾燥し、厚み5
0μmの粘着剤層を形成し、再剥離性粘着シートを作製
した。この粘着シートの物性を表1に示す。
Example 1 Thermally expandable microspheres (Product name: Microsphere F-50
D, Matsumoto Yushi-Seiyaku Co., Ltd., average particle diameter 15 μm, gas vaporization temperature 115 ° C. by TMA method) 8.8 parts by mass, 2-ethylhexyl acrylate, methacrylic acid, methyl methacrylate are copolymerized by a conventional method. Acrylic adhesive (Mw
= 180,000, Mn = 30,000, glass transition temperature-10 ° C, oxidation 45) 35 parts by mass, terpene phenol-based tackifying resin (softening point 125 ° C, SP value 9.32, hydroxyl value 200).
14 parts by mass, 0.2 parts by mass of an epoxy-based cross-linking agent (N, N, N'N'-tetraglycidyl-m-xylenediamine) and 42 parts by mass of toluene are uniformly mixed and dissolved to give an adhesive layer forming coating solution. Prepared. This coating solution was applied onto a polyethylene terephthalate sheet having a thickness of 100 μm by a baker type applicator and dried sufficiently at 80 ° C. to give a thickness of 5
A pressure-sensitive adhesive layer having a thickness of 0 μm was formed to prepare a removable pressure-sensitive adhesive sheet. Table 1 shows the physical properties of this pressure-sensitive adhesive sheet.

【0021】実施例2 実施例1において、架橋剤を日本化薬社製、エポキシ樹
脂(N,N’−ジ(グリシジル)−o−トルイジン)
0.4質量部とした以外は、全て実施例1と同様にして
粘着シートを作製した。この粘着シートの物性を表1に
示す。
Example 2 The epoxy resin (N, N'-di (glycidyl) -o-toluidine) manufactured by Nippon Kayaku Co., Ltd. was used as the crosslinking agent in Example 1.
An adhesive sheet was produced in the same manner as in Example 1 except that 0.4 part by mass was used. Table 1 shows the physical properties of this pressure-sensitive adhesive sheet.

【0022】実施例3 実施例1において、粘着付与樹脂をテルペンフェノール
樹脂(軟化点145℃、SP値8.98、水酸基価6
0)を3.5質量部とし、トルエンを52.5質量部と
した以外は、全て実施例1と同様にして粘着シートを作
製した。この粘着シートの物性を表1に示す。
Example 3 In Example 1, the tackifying resin was a terpene phenol resin (softening point 145 ° C., SP value 8.98, hydroxyl value 6).
0) was 3.5 parts by mass and toluene was 52.5 parts by mass, and an adhesive sheet was produced in the same manner as in Example 1. Table 1 shows the physical properties of this pressure-sensitive adhesive sheet.

【0023】実施例4 実施例1において、架橋剤をエポキシ樹脂(1,3−ビ
ス(N,N’−ジグリシジルアミノメチル)シクロヘキ
サン)0.1質量部とした以外は全て実施例1と同様に
して粘着シートを作製した。この粘着シートの物性を表
1に示す。
Example 4 The same as Example 1 except that the crosslinking agent was 0.1 part by mass of an epoxy resin (1,3-bis (N, N'-diglycidylaminomethyl) cyclohexane). Then, an adhesive sheet was produced. Table 1 shows the physical properties of this pressure-sensitive adhesive sheet.

【0024】比較例1 実施例1において、アクリル系粘着剤を綜研化学社製、
SKダイン1501B(Mw=130万、Mn=15
万、酸価8、ガラス転移温度−41℃)とした以外は全
て実施例1と同様にして粘着シートを作製した。この粘
着シートの物性を表1に示す。
Comparative Example 1 In Example 1, the acrylic pressure-sensitive adhesive was manufactured by Soken Chemical Industry Co., Ltd.
SK Dyne 1501B (Mw = 1.3 million, Mn = 15
A pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that the acid value was 8 and the glass transition temperature was -41 ° C. Table 1 shows the physical properties of this pressure-sensitive adhesive sheet.

【0025】比較例2 実施例1において、粘着付与樹脂を常温で液状のもの
(製品名:YP−90LL、ヤスハラケミカル社製)と
した以外は、全て実施例1と同様にして粘着シートを作
製した。この粘着シートの物性を表1に示す。
Comparative Example 2 An adhesive sheet was prepared in the same manner as in Example 1 except that the tackifying resin used in Example 1 was liquid at room temperature (product name: YP-90LL, manufactured by Yasuhara Chemical Co., Ltd.). . Table 1 shows the physical properties of this pressure-sensitive adhesive sheet.

【0026】比較例3 実施例3において、粘着付与樹脂を軟化点が80℃のテ
ルペンフェノール樹脂(製品名:YSポリスターT−8
0、ヤスハラケミカル社製、SP値8.98、水酸基価
60)とした以外は、全て実施例3と同様にして粘着シ
ートを作製した。この粘着シートの物性を表1に示す。
Comparative Example 3 In Example 3, the tackifying resin was a terpene phenol resin having a softening point of 80 ° C. (product name: YS Polystar T-8).
0, manufactured by Yasuhara Chemical Co., SP value 8.98, hydroxyl value 60), except that the adhesive sheet was produced in the same manner as in Example 3. Table 1 shows the physical properties of this pressure-sensitive adhesive sheet.

【0027】比較例4 実施例3において、粘着付与樹脂をフェノール変性ロジ
ン(製品名:ネオトール125P、ハリマ化成社製、軟
化点125℃、SP値7.76、水酸基価26)とした
以外は、全て実施例3と同様にして粘着シートを作製し
た。この粘着シートの物性を表1に示す。本発明の粘着
シートは、粘着層の相溶性が悪く均一な粘着シートが得
られなかった。
Comparative Example 4 Except that in Example 3, the tackifying resin was phenol-modified rosin (product name: Neotol 125P, manufactured by Harima Kasei Co., softening point 125 ° C., SP value 7.76, hydroxyl value 26). An adhesive sheet was produced in the same manner as in Example 3. Table 1 shows the physical properties of this pressure-sensitive adhesive sheet. In the pressure-sensitive adhesive sheet of the present invention, the compatibility of the pressure-sensitive adhesive layer was poor and a uniform pressure-sensitive adhesive sheet could not be obtained.

【0028】[0028]

【表1】 [Table 1]

【0029】[0029]

【発明の効果】本発明の再剥離性粘着シートは、被着体
との粘着性にすぐれるものであり、しかも剥離した際、
被着体に糊残り等による汚染がないものである。また、
本発明の粘着シートを用いたセラミックグリーンシート
の切断及び孔開け加工においては、加工温度が有機バイ
ンダーの軟化点温度以上で切断加工しても、被着体との
剥離力を加工精度に影響のない範囲に維持でき、しかも
熱膨張性微小球膨張後は、被着体を汚染することなく容
易に剥離可能なものである。
EFFECTS OF THE INVENTION The removable pressure-sensitive adhesive sheet of the present invention has excellent adhesiveness to an adherend, and when peeled off,
The adherend is free from contamination such as adhesive residue. Also,
In the cutting and perforating processing of the ceramic green sheet using the pressure-sensitive adhesive sheet of the present invention, even if the processing temperature is higher than the softening point temperature of the organic binder, the peeling force from the adherend affects the processing accuracy. It can be maintained in a range that does not exist, and can be easily peeled off without contaminating the adherend after the expansion of the heat-expandable microspheres.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) // B05D 7/24 301 B05D 7/24 301K (72)発明者 浅井 聡 東京都中央区銀座四丁目11番2号 ソマー ル株式会社内 Fターム(参考) 4D075 BB08Z BB22Z BB23Z CA07 DA06 DB31 DB33 DB34 DB36 DB44 DB48 DB53 DB55 DC19 DC21 EA07 EA31 EA35 EB12 EB22 EB33 EB52 EB53 EB54 EB56 EC41 4J004 AA10 AA13 AA17 AB01 AB04 CA04 CA06 CC02 CD02 CD07 CD08 CD09 CD10 CE01 FA08 4J040 DC072 DD022 DF011 DF041 DF051 DF082 DG001 DN072 EC032 EC042 EC062 EC072 EC162 EJ032 JA09 JB09 KA16 KA26 LA01 LA02 PA23 PA42 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 7 identification code FI theme code (reference) // B05D 7/24 301 B05D 7/24 301K (72) Inventor Satoshi Asai 4-11 Ginza, Chuo-ku, Tokyo No. 2 Somer Co., Ltd. F-term (reference) 4D075 BB08Z BB22Z BB23Z CA07 DA06 DB31 DB33 DB34 DB36 DB44 DB48 DB53 DB55 DC19 DC21 EA07 EA31 EA35 EB12 EB22 EB33 EB52 EB53 EB54 EB56 EC41 4J004 CAA06 AB02 A01 CD07 CD08 CD09 CD10 CE01 FA08 4J040 DC072 DD022 DF011 DF041 DF051 DF082 DG001 DN072 EC032 EC042 EC062 EC072 EC162 EJ032 JA09 JB09 KA16 KA26 LA01 LA02 PA23 PA42

Claims (11)

【特許請求の範囲】[Claims] 【請求項1】 基材の片面に(a)熱膨張性微小球、
(b)重量平均分子量が10万〜30万で架橋剤と反応
し得る30以上の酸価を有するアクリル系粘着剤及び
(c)軟化点が90℃以上、溶解パラメータ値(SP
値)が8.9以上である粘着付与樹脂、(d)架橋剤か
らなる粘着剤組成物を塗布して形成した粘着剤層を設け
たことを特徴とする再剥離性粘着シート。
1. A (a) heat-expandable microsphere on one surface of a substrate,
(B) An acrylic pressure-sensitive adhesive having a weight average molecular weight of 100,000 to 300,000 and an acid value of 30 or more capable of reacting with a cross-linking agent, and (c) a softening point of 90 ° C. or more, and a solubility parameter value (SP
A removable pressure-sensitive adhesive sheet, comprising a tackifier resin having a value of 8.9 or more and a pressure-sensitive adhesive layer formed by applying a pressure-sensitive adhesive composition comprising (d) a crosslinking agent.
【請求項2】 該(b)成分の重量平均分子量(Mw)
と数平均分子量(Mn)との比(Mw/Mn)が、3〜
7の範囲であることを特徴とする請求項1に記載の再剥
離性粘着シート。
2. A weight average molecular weight (Mw) of the component (b).
And the number average molecular weight (Mn) ratio (Mw / Mn) is 3 to
7. The removable pressure-sensitive adhesive sheet according to claim 1, which is in the range of 7.
【請求項3】 該(b)成分のガラス転移温度が、−3
0〜0℃の範囲であることを特徴とする請求項1又は2
に記載の再剥離性粘着シート。
3. The glass transition temperature of the component (b) is -3.
The temperature is in the range of 0 to 0 ° C.
The removable pressure-sensitive adhesive sheet according to.
【請求項4】 該(c)成分の軟化点が、90℃〜15
0℃の範囲である請求項1〜3のいずれかに記載の再剥
離性粘着シート。
4. The softening point of the component (c) is 90 ° C. to 15 ° C.
The removable pressure-sensitive adhesive sheet according to any one of claims 1 to 3, which has a temperature range of 0 ° C.
【請求項5】 該(c)成分が、テルペン系樹脂である
請求項1〜4のいずれかに記載の再剥離性粘着シート。
5. The removable pressure-sensitive adhesive sheet according to claim 1, wherein the component (c) is a terpene resin.
【請求項6】 該(d)成分が、エポキシ系架橋剤であ
ることを特徴とする請求項1〜5のいずれかに記載の再
剥離性粘着シート。
6. The removable pressure-sensitive adhesive sheet according to claim 1, wherein the component (d) is an epoxy-based crosslinking agent.
【請求項7】 該(b)成分100質量部に対し、該
(a)成分が15〜100質量部、該(d)成分が0.
25〜2.0質量部の割合で配合されていることを特徴
とする請求項1〜6のいずれかに記載の再剥離性粘着シ
ート。
7. The component (a) is contained in an amount of 15 to 100 parts by weight, and the component (d) is added in an amount of 0.1 to 100 parts by weight of the component (b).
The removable pressure-sensitive adhesive sheet according to any one of claims 1 to 6, wherein the removable pressure-sensitive adhesive sheet is blended in a proportion of 25 to 2.0 parts by mass.
【請求項8】 該(c)成分の配合割合は、該(b)成
分100質量部に対し10〜100質量部であることを
特徴とする請求項1〜7のいずれかに記載の再剥離性粘
着シート。
8. The re-peeling method according to claim 1, wherein the blending ratio of the component (c) is 10 to 100 parts by mass with respect to 100 parts by mass of the component (b). Adhesive sheet.
【請求項9】 基材の少なくとも一方の面に粘着シート
を粘着させた後、該基材を加工し、その後該加工された
基材から該粘着シートを剥離させる加工方法において、
該粘着シートとして、請求項1〜8のいずれかに記載の
再剥離性粘着シートを用いることを特徴とする加工方
法。
9. A processing method in which an adhesive sheet is adhered to at least one surface of a substrate, the substrate is processed, and then the adhesive sheet is peeled from the processed substrate,
A releasable pressure-sensitive adhesive sheet according to any one of claims 1 to 8 is used as the pressure-sensitive adhesive sheet.
【請求項10】 該加工が、切断加工であることを特徴
とする請求項9に記載の加工方法。
10. The processing method according to claim 9, wherein the processing is cutting processing.
【請求項11】 該(a)成分のガス気化温度が、該加
工温度よりも25℃以上高い温度であることを特徴とす
る請求項9〜10のいずれかに記載の加工方法。
11. The processing method according to claim 9, wherein the gas vaporization temperature of the component (a) is 25 ° C. or more higher than the processing temperature.
JP2001359663A 2001-11-26 2001-11-26 Removable adhesive sheet Expired - Lifetime JP3897236B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001359663A JP3897236B2 (en) 2001-11-26 2001-11-26 Removable adhesive sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001359663A JP3897236B2 (en) 2001-11-26 2001-11-26 Removable adhesive sheet

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JP2005097386A (en) * 2003-09-24 2005-04-14 Somar Corp Adhesive composition and removable adhesive sheet using the same
JP2005229040A (en) * 2004-02-16 2005-08-25 Denki Kagaku Kogyo Kk Pressure-sensitive adhesive sheet for fixing semiconductor base
JP2005330407A (en) * 2004-05-21 2005-12-02 Somar Corp Repeelable adhesive sheet and method for processing adherend by using the same
JP2005330406A (en) * 2004-05-21 2005-12-02 Somar Corp Repeelable adhesive composition and repeelable adhesive sheet using the same
JP2006143961A (en) * 2004-11-24 2006-06-08 Hitachi Chem Co Ltd Pressure-sensitive adhesive sheet with separator, optical component assembly and method for producing the same
JP2006257372A (en) * 2005-03-18 2006-09-28 Somar Corp Removable pressure-sensitive adhesive sheet and method for processing adherend using the same
JP2007091862A (en) * 2005-09-28 2007-04-12 Somar Corp Adhesive sheet
JP2007254658A (en) * 2006-03-24 2007-10-04 Diatex Co Ltd Heat and pressure sensitive adhesive and heat and pressure sensitive adhesive sheet, and method of adhering the same
JP2008021897A (en) * 2006-07-14 2008-01-31 Denki Kagaku Kogyo Kk Adhesive sheet for fixing semiconductor member and method of manufacturing electronic parts using the same
JP2008135639A (en) * 2006-11-29 2008-06-12 Kyocera Corp Method and device for manufacturing of laminated ceramic electronic component
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JP2009149819A (en) * 2007-12-21 2009-07-09 Tokyo Ohka Kogyo Co Ltd Adhesive composition and adhesive film
JP2010195995A (en) * 2009-02-27 2010-09-09 Tomoegawa Paper Co Ltd Colored pressure-sensitive adhesive sheet for processing and protecting green sheet
JP2010214947A (en) * 2009-02-23 2010-09-30 Nitto Denko Corp Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet
JP2010229399A (en) * 2009-03-04 2010-10-14 Nitto Denko Corp Heat-peelable type adhesive sheet for cutting laminated ceramic sheet and cut-processing method of laminated ceramic sheet
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JP2014118325A (en) * 2012-12-17 2014-06-30 Sekisui Chem Co Ltd Gas generating material for micropump and micropump
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JP2015021081A (en) * 2013-07-19 2015-02-02 日東電工株式会社 Thermal peeling type adhesive tape and cutting-off method of electronic component
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JP2005097386A (en) * 2003-09-24 2005-04-14 Somar Corp Adhesive composition and removable adhesive sheet using the same
JP4580629B2 (en) * 2003-09-24 2010-11-17 ソマール株式会社 Adhesive composition and removable adhesive sheet using the same
JP2005229040A (en) * 2004-02-16 2005-08-25 Denki Kagaku Kogyo Kk Pressure-sensitive adhesive sheet for fixing semiconductor base
JP2005330407A (en) * 2004-05-21 2005-12-02 Somar Corp Repeelable adhesive sheet and method for processing adherend by using the same
JP2005330406A (en) * 2004-05-21 2005-12-02 Somar Corp Repeelable adhesive composition and repeelable adhesive sheet using the same
JP2006143961A (en) * 2004-11-24 2006-06-08 Hitachi Chem Co Ltd Pressure-sensitive adhesive sheet with separator, optical component assembly and method for producing the same
JP2006257372A (en) * 2005-03-18 2006-09-28 Somar Corp Removable pressure-sensitive adhesive sheet and method for processing adherend using the same
JP2007091862A (en) * 2005-09-28 2007-04-12 Somar Corp Adhesive sheet
JP2007254658A (en) * 2006-03-24 2007-10-04 Diatex Co Ltd Heat and pressure sensitive adhesive and heat and pressure sensitive adhesive sheet, and method of adhering the same
JP2008021897A (en) * 2006-07-14 2008-01-31 Denki Kagaku Kogyo Kk Adhesive sheet for fixing semiconductor member and method of manufacturing electronic parts using the same
JP2008135639A (en) * 2006-11-29 2008-06-12 Kyocera Corp Method and device for manufacturing of laminated ceramic electronic component
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JP2009149819A (en) * 2007-12-21 2009-07-09 Tokyo Ohka Kogyo Co Ltd Adhesive composition and adhesive film
JP2010214947A (en) * 2009-02-23 2010-09-30 Nitto Denko Corp Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet
JP2010195995A (en) * 2009-02-27 2010-09-09 Tomoegawa Paper Co Ltd Colored pressure-sensitive adhesive sheet for processing and protecting green sheet
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JP2014118325A (en) * 2012-12-17 2014-06-30 Sekisui Chem Co Ltd Gas generating material for micropump and micropump
JP2015021081A (en) * 2013-07-19 2015-02-02 日東電工株式会社 Thermal peeling type adhesive tape and cutting-off method of electronic component
JP2014224263A (en) * 2014-07-14 2014-12-04 ソマール株式会社 Removable adhesive sheet and adherend processing method using the same
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