JP2003160247A - Method of taking out thin plate-like chip parts - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To positively take out only one thin plate-like chip part by a head. <P>SOLUTION: In this method of taking out thin plate-like chip parts, a large number of thin plate-like chip parts are stacked and stored in holes formed in a magazine, and the bottom faces of the stored chip parts are pushed up by a pusher while sucking the uppermost one of the pushed-up chip parts by a head. Gas is blown to the sucked chip part from the side to blow off the stuck chip parts on the lower side, and then the chip part sucked by the head is taken out. In a process of sucking the uppermost chip part by the head to take it out, the uppermost chip part is sucked by stopping the head with a slight distance kept between the uppermost chip part and the head so that the head does not abut on the uppermost chip part. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of taking out thin plate-shaped chip components from a thin plate-shaped chip component storage mechanism that stores a large number of thin plate-shaped chip components in a stacked state.

[0002]

2. Description of the Related Art Conventionally, for example, as shown in FIG. 9, a lid 8 made of a rectangular thin plate is placed on a frame 803 provided on the outer periphery of a rectangular surface mount type crystal resonator 801.
05 is attached and the inside is sealed.
This sealing operation is automated and is performed mechanically continuously. In this lid, the vertical and horizontal dimensions of 805 are actually as small as 6 × 4 mm.

Here, FIG. 10 is an exploded perspective view of a main part showing a chip component storage mechanism in which the lid 805 is stored in advance before being attached to the crystal unit 801. As shown in the figure, the conventional chip component storage mechanism includes two magazine members 807 and 809.
09 are provided with grooves 811 and 813 extending in the vertical direction, respectively.

After a large number of lids 805 are stacked and housed in the respective grooves 811 of one magazine member 807, the grooves 811 and 813 of both magazine members 807 and 809 are stored.
The surfaces provided with are brought into close contact with each other, and both magazine members 807 and 809 are integrated by a fixing means (not shown).

As a result, both magazine members 807, 8
This means that a large number of lids 805 are stored in a hole formed by matching the grooves 811 and 813 provided in 09.

A pusher 815 is inserted into the hole from the bottom surface side to support the bottom surface of the housed lid 805. A suction head 817 is arranged above the uppermost lid 805.

It should be noted that slits 81 are formed on the upper portions of the grooves 811 and 813 of both magazine members 807 and 809, respectively.
9, 821 are provided. Both slits 819,
A light emitting element 823 and a light receiving element 825 are arranged on both sides of 821 (both sides of the magazine members 807, 809), and it is detected that the uppermost lid 805 has risen to a predetermined position in the slits 819, 821. .

Then, the pusher 815 is attached to the lid 805.
When the light emitting element 823 and the light receiving element 825 detect the uppermost lid 805 by pushing up, the suction head 817 descends to suck the uppermost lid 805, and pulls it up and transfers it to a desired place.

[0009]

However, the above-mentioned conventional chip component storage mechanism has the following problems. Since the head was in contact with the lid and adsorbed,
The entire lid that is stacked due to the pressing force of the head contracts, and when pulling up the head, the top lid is momentarily flipped up by the elastic force due to the contraction, and the lid stands up. Because there is a fear.

The present invention has been made in view of the above points, and it is an object of the present invention to solve the above-mentioned problems and to reliably pull up only one lid, and even if the lid has a different shape. It is an object of the present invention to provide a method for taking out thin plate-shaped chip parts that requires only a small number of members to be replaced and can easily perform a lid packing operation.

[0011]

According to the present invention for solving the above problems, a large number of thin plate chip components are stacked and stored in a hole formed by a magazine, and the bottom face of the stored chip components is stored. While pushing up with the pusher, the topmost chip component pushed up is adsorbed by the head, gas is blown from the side to the adsorbed chip component and the attached lower chip component is blown off, and then it is adsorbed to the head. In the method of taking out a thin plate-shaped chip component, the step of adsorbing and taking out the uppermost chip component in the head in the method of taking out the thinned chip component is the uppermost chip component so that the head does not contact the uppermost chip component. And a head for maintaining a short distance between them and stopping, and proposes a method for taking out a thin plate-shaped chip component that sucks the uppermost chip component. Is.

[0012]

In order to prevent the head from coming into contact with the uppermost chip component, the head is stopped by maintaining a small distance between the uppermost chip component and the head, and in this state, the uppermost chip component is moved to the head. Since the head does not press the lid, the entire stacked lid does not contract due to the pressing force, and the top lid is elastic due to contraction when the head is pulled up. The force does not cause the lid to be instantly flipped up to stand up, so that the thin plate chip component can be reliably taken out.

[0013]

Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is an exploded perspective view showing a main part of such a chip component storage mechanism according to an embodiment of the present invention.

As shown in FIG. 1, this chip component storage mechanism includes two magazine members 10 and 30, and both magazine members 10 and 30 each have a groove 11 extending in the vertical direction.
31 is provided, and grooves 11 and 31 of both magazine members 10 and 30 are provided.
The grooves 11 and 31 provided on both sides form a hole extending in the vertical direction by closely adhering the surfaces provided with, and a large number of thin plate-like lids 40 are stacked and housed in the hole and integrated. A bottom plate 50 is attached to the lower surface of both magazine members 10 and 30, and a pusher 60 that pushes up the stored lid 40 from its bottom surface and a head that sucks up the pushed uppermost lid 40 and raises it to a desired location. And 71. Hereinafter, each component will be described.

Here, FIG. 2A shows the magazine member 10
2 is a view of the groove 11 viewed from the side where the groove 11 is not provided, and FIG. 2B is an enlarged view of a main part of the groove 11 viewed from the upper side. As shown in FIGS. 1 and 2, the groove 11 has a rectangular chip storage portion 13,
Three slit-shaped pusher storage portions 15 extending outward from the center of each of three sides of the chip storage portion 13
And is configured. The groove 11 is provided over the entire length of the magazine member 10 in the vertical direction.

Here, the chip storage portion 13 is formed so that the entire lid 40 just fits in. Further, the pusher storage portion 15 is formed in a size and shape in which the three protrusions 63 of the pusher 50 described below are stored so as to be vertically movable.

Next, at the upper end of the groove 11 of the magazine member 10, there is provided a light-transmitting slit 17 having a predetermined depth that communicates with one pusher storage portion 15. A screw hole 19 and a knock pin 20 are provided at predetermined positions of the magazine member 10.

Next, FIG. 3A is a view of the magazine member 30 as seen from the side where the groove 31 is provided, and FIG. 3B is a view showing the groove 3
It is a principal part enlarged view which looked at 1 from the upper side. As shown in FIGS. 1 and 3, the groove 31 is composed of one pusher storage portion 35. The pusher storage portion 35 is provided over the entire length of the magazine member 30 in the vertical direction. This pusher storage portion 35 is also one protrusion 63 of the pusher 50 described below.
Is formed so that it can be moved up and down.

Further, a translucent slit 37 having a predetermined depth is provided at the upper end of the groove 31 of the magazine member 30 so as to communicate with the pusher storage portion 35. Further, the screw hole 39 and the knock pin 20 are also provided at predetermined positions of the magazine member 30.
A hole 38 for insertion is provided.

Next, as shown in FIG. 1, the bottom plate 50 is formed to have the same size and shape as the bottom surface when both magazine members 10 and 30 are integrated, and both magazine members 10 and 30 are formed.
Substantially cruciform through-holes 51 are provided at positions facing the grooves 11 and 31 provided in the.

These through-holes 51 are formed in a substantially cross shape having substantially the same shape as the pusher 60 described below. In addition, a hole 55 penetrating at a predetermined position of the bottom plate 50.
Is provided.

Next, as shown in FIG. 1, the pusher 60 has a substantially cruciform planar shape and a central base portion 61.
Is formed by projecting four protrusions 63. The protrusions 63 are formed to have a size protruding outward from the outer shape of the lid 40.

A translucent slit 65 is provided in the center of the two protrusions 63 extending in the width direction (direction A in FIG. 1). The light-transmitting slits 65 are light-transmitting slits 17, 37 provided in the magazine members 10, 30, respectively.
Is provided at a position opposite to.

The pusher 60 is fixed to a rod 67 attached to the lower surface of the pusher 60. The rod 67 is vertically movably driven by a driving means (not shown).

Next, in order to assemble this chip component storage mechanism, first, the bottom plate 50 is brought into close contact with the bottom of one magazine member 10, and the screw 80 is provided on the bottom surface of the magazine member 10 by penetrating the hole 55 of the bottom plate 50. Both are fixed by being screwed into a screw hole (not shown).

Next, the groove 11 provided in the magazine member 11
A large number of lids 40 are stored in the chip storage portion 13 so as to be stacked. At this time, the chip storage portion 13 is formed in such a shape that the entire lid 40 fits into the snap ring, so that the lid 40 that has been packed once is difficult to come out, and the storage work is facilitated.

Further, when the lid 40 is stored, the lid 40 may rise inside the groove 11 and stick to the side surface of the chip storage portion 13 as shown in FIG.
However, in the groove 11 according to the present invention, since the pusher storage portion 15 is provided around the chip storage portion 13, the lid 40 can be easily tilted by inserting tweezers or the like into the pusher storage portion 15. . Therefore, the work of housing the lid 40 is also easy from this point.

Next, as shown in FIG. 1, the magazine member 30 is attached to the magazine member 10 accommodating the lid 40 so as to be in close contact (the knock pin 20 is inserted into the hole 38), and the screw 81 is screwed into the screw hole 39, By inserting into 19, the two are firmly fixed.

The integrated magazine members 10, 30, etc. are arranged on the pusher 60. The pusher 60 is inserted into the through hole 51 of the bottom plate 50.

Here, FIG. 5 is a diagram showing the relationship between the integrated magazine members 10 and 30, the lid 40, and the pusher 60. As shown in the figure, two magazine members 10,
The groove 30 is formed with a single cross-shaped hole A by aligning the grooves 11 and 31 with each other.

The pusher 60 is accommodated in the substantially cross-shaped hole A with a predetermined play. In addition, a stopper and a lid 40 are stored in the chip storage portion 13.

Here, the lid 40 is pushed by the pusher 60.
When the pusher 60 is gradually pushed up, the pusher 60 has four protrusions 63 protruding outward from the outer shape of the lid 40.
Since the lid 40 is provided in the hole A even if the lid 40 rises in the hole A due to some impact,
There is no risk of digging into the gap between 1, 31 and pusher 60.

Therefore, the gap (play) between the hole A formed by the grooves 11 and 31 and the pusher 60 may be increased,
The dimensional tolerance of both can be loosened, and its manufacture becomes easy.

Further, since the dimensional tolerance between the grooves 11 and 31 and the pusher 60 can be loosened, both magazine members 10 and 30 can be made.
There is no problem even if some assembly error occurs when joining and unifying, and the unifying operation becomes extremely easy.

Next, FIG. 6 is a schematic view showing the overall arrangement configuration of this chip component storage mechanism. FIG. 6A is a plan view of a main part and FIG. 6B is a side view of the main part. However, in FIG. 7A, the suction head device 7 shown in FIG.
The description of 0 is omitted.

As shown in the figure, the slit 17 for light transmission is formed on the upper portion of the integrated magazine members 10, 30 and the like.
And a position detecting means 90 comprising a pair of light emitting / receiving elements 91, 93 for emitting / receiving light passing through the light transmitting slit 37.
Is provided.

A nozzle 97 of a gas blowing device 95 that blows dry gas into the hole A through the light-transmitting slit 17 is arranged near one of the light-transmitting slits 17.

In addition, the integrated magazine member 10,
A suction head device 70 is arranged on the upper part of the unit 30.

The suction head device 70 includes the movable member 7
5 is moved up and down by the drive mechanism 73, and the slider 8 is attached to the rail 79 integrally attached to the movable member 75.
1 is attached so as to be vertically movable, and a head 71 is fixed to a slider 81. The slider 81
Is a stopper 85 fixed near the lower end of the rail 79.
Is supported by abutting against.

Next, a method of taking out the lids 40 stored in the magazine members 10 and 30 one by one will be described. Here, FIG. 7 is a diagram showing this extraction method.

That is, as shown in FIG. 4A, when the pusher 60 raises the lid 40 and the uppermost lid 40 blocks the passage of light between the light emitting / receiving elements 91, 93, Stop climbing. Light emitting / receiving elements 91, 9
Since 3 is obliquely arranged with respect to the surface of the lid 40, light is blocked at one point on the outer periphery of the lid 40. Therefore, the stop position of the lid 40 can be reliably made constant.

Next, as shown in FIG. 2B, the head 71 is lowered to perform the uppermost lid 40 and the head 7.
Stop with a little gap between 1. At this time, at the same time, the uppermost lid 40 is sucked up by the head 71 and sucked as shown by the dotted line.

The reason why the head 71 is not brought into contact with the lid 40 is that when the head 71 presses the lid 40, the entire lid 40 contracted by an amount corresponding to the pressing force and the head 71 is moved upward. When the lid 40 is pulled up, the lid 40 below the top lid 40 is instantly flipped up due to the elastic force due to contraction.
This is because there is a risk of standing up.

Next, as shown in FIG. 6C, the entire lid 40 is lowered by the pusher 60 by a predetermined distance (arrow B). The descending distance is such a distance that the lid 40 cannot rise in the gap between the lid 40 attracted to the head 71 and the descending uppermost lid 40, and is about 1 mm in this embodiment. .

Next, as shown in FIG.
The dry gas is blown from 7 (arrow C), and the gas is blown to the side surface of the lid 40 adsorbed to the head 71. As a result, if another lid 40 is attached below the lid 40 that is attached to the head 71, the other lid 40 can be blown off, and only one lid 40 can be attached to the head 71 without fail. .

At this time, the lid 40 blown off,
Since the gap between the lid 40 and the lid 40 below the lid 40 is such that the lid 40 cannot stand up, the blown-off lid 40 does not stand up.

Then, as shown in FIG. 7D, the head 71 is pulled up and transferred to another place.

When the number of the lids 40 on the pusher 60 is reduced by repeating the above operation and the lids 40 are gone, the light receiving slit 65 provided in the pusher 60 shown in FIG. Light is transmitted between the light emitting elements 91 and 93. That is, it is possible to detect that the lid 40 on the pusher 60 has all disappeared in the vicinity of the upper viewpoint of the pusher 60. In other words, since the light-transmitting slit 65 is provided in the pusher 60, all the lids 40 placed on the pusher 60 can be taken out.

By the way, the attraction head device 70 is provided with the rail 79 and the slider 81 because the head 71 escapes upward when an overload is applied to the head 71 when the lid 40 is attracted to the head 71. This is to prevent unnecessary force over the weight of the head 71 from being applied.

On the other hand, in the present invention, as shown in FIG.
One magazine member 1 even when stored in 30
It is only necessary to change the dimensions of the grooves 11-1 to 11-4 provided in the 0, and other members (magazine member 30, bottom plate 5).
0, pusher 60) can use the same thing as the said Example.

If the protrusions 63 of each pusher storage portion 15 and pusher 60 are dimensioned so as to extend further outward than the outer shape of the lid 40 having the largest dimension, members other than the magazine member 10 are All can be shared.

In the above embodiments, the lid of the surface mount type crystal resonator is described as an example of the chip component housed in the magazine member, but the present invention is not limited to this, and various other thin plate shapes are used. It goes without saying that it can be applied to the chip parts of. Further, it is obvious that the chip component takeout method of the second invention can be applied to a magazine having a conventional structure.

[0053]

As described in detail above, the present invention has the following excellent effects. The head is stopped by keeping a small distance between the uppermost chip component and the head so that the head does not contact the uppermost chip component, and in this state, the uppermost chip component is attracted to the head. Since the head does not press the lid, the pressing force does not cause the entire stacked lid to contract, and the top lid is elastic due to contraction when the head is pulled up,
Since the lid is prevented from being instantly flipped up to stand up, the thin plate chip component can be reliably taken out.

Since the chip component attracted to the head and the chip component below it are separated by a predetermined width so that the chip component does not rise, gas is blown from the side to the chip component attracted to the head. Even if another chip component is stuck under the uppermost chip component adsorbed by the head, the other chip component can be blown off, and only one chip component can be surely removed. It can be attached to the head.

Even for chip parts having different sizes and shapes, by changing only one magazine member, all the other members can be made common, which not only reduces the cost but also facilitates the replacement work. . In addition, since the entire chip component fits into the chip housing portion of the groove provided in one magazine member, the chip once packed does not easily come out, and the housing work becomes easy.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a main part of a chip component storage mechanism according to an embodiment of the present invention.

2A is a view of the magazine member 10 as seen from a side where the groove 11 is not provided, and FIG. 2B is an enlarged view of a main part of the groove 11 as seen from above.

3A is a view of the magazine member 30 as viewed from the side where the groove 31 is provided, and FIG. 3B is an enlarged view of a main part of the groove 31 as viewed from above.

FIG. 4 is a view showing a state in which a lid 40 stands up inside the groove 11.

FIG. 5 is a diagram showing a positional relationship between the integrated magazine members 10 and 30, the lid 40, and the pusher 60.

6A and 6B are schematic views showing an overall arrangement configuration of a chip component storage mechanism, FIG. 6A is a plan view of a main part, and FIG. 6B is a side view of the main part.

7 (a) to 7 (d) are both magazine members 1. FIG.
It is a figure which shows the method of taking out the lid 40 accommodated in 0, 30 one by one.

[FIG. 8] Both magazine members 1 with lids 40 of different sizes
It is a figure which shows the state accommodated in 0 and 30.

FIG. 9 is a diagram showing a state in which a lid 805 is mounted on a surface mount type crystal resonator 801.

FIG. 10 is an exploded perspective view of essential parts showing a conventional chip component storage mechanism.

[Explanation of symbols]

10, 30 Magazine member 11,31 groove 13 Chip storage 15 Pusher storage A hole 40 lid (chip parts) 50 bottom plate 60 pushers 63 Projection 70 Suction head device 71 head 95 Gas blowing device 97 nozzles

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Tsutomu Ishino             335 Kayajuku, Nakahara-ku, Kawasaki, Kanagawa             Inside Engineering Co., Ltd. F term (reference) 3F343 FA13 FB19 FC01 GA01 GB01                       GC04 GD04 JB02 JB20 JD28                       KB04 KB05 KB18 LA04 MB04                       MB13 MB14 MC08 MC10 MC13                       MC19                 5E313 AA03 AA12 AA22 AA31 CC02                       CC03 CC04 CC09 DD18 DD20                       DD23 EE02 EE24 EE33 FG10

Claims (3)

[Claims] 1. A plurality of thin plate chip parts are stacked and housed in a hole formed by a magazine, the bottom surface of the housed chip parts is pushed up by a pusher, and the topmost chip part pushed up by a head. Adsorbed, blow off the lower chip component adhered by blowing a gas from the side to the adsorbed chip component, then in the extraction method of a thin plate-shaped chip component to take out the chip component adsorbed to the head, The step of adsorbing and taking out the uppermost chip component from the head is stopped by maintaining a small distance between the uppermost chip component and the head so that the head does not contact the uppermost chip component, A method for taking out a thin plate-shaped chip component, characterized in that the uppermost chip component is sucked. 2. The method for taking out thin plate chip parts according to claim 1, wherein when the head adsorbs the uppermost chip part, the pusher descends and then the gas is blown. 3. The method for removing a thin plate chip component according to claim 2, wherein the distance by which the pusher descends is a gap in which the thin plate chip component cannot stand up.