JP2003157973A - Manufacturing method and manufacturing apparatus of organic electroluminescence device, and manufacturing system and manufacturing method of display device using the same - Google Patents

Manufacturing method and manufacturing apparatus of organic electroluminescence device, and manufacturing system and manufacturing method of display device using the same

Info

Publication number
JP2003157973A
JP2003157973A JP2002133536A JP2002133536A JP2003157973A JP 2003157973 A JP2003157973 A JP 2003157973A JP 2002133536 A JP2002133536 A JP 2002133536A JP 2002133536 A JP2002133536 A JP 2002133536A JP 2003157973 A JP2003157973 A JP 2003157973A
Authority
JP
Japan
Prior art keywords
manufacturing
substrate
vapor deposition
organic
deposition sources
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002133536A
Other languages
Japanese (ja)
Other versions
JP3705237B2 (en
Inventor
Isao Kamiyama
功 紙山
Takao Mori
敬郎 森
Masaru Yamaguchi
優 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2002133536A priority Critical patent/JP3705237B2/en
Priority to US10/428,411 priority patent/US20030232563A1/en
Priority to TW092112232A priority patent/TWI301386B/en
Priority to SG200302489A priority patent/SG120097A1/en
Priority to KR1020030028798A priority patent/KR100945997B1/en
Priority to CNB031786030A priority patent/CN100530743C/en
Publication of JP2003157973A publication Critical patent/JP2003157973A/en
Application granted granted Critical
Publication of JP3705237B2 publication Critical patent/JP3705237B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PROBLEM TO BE SOLVED: To promptly manufacture an organic EL device at low costs by forming a film with short tact time and low material costs. SOLUTION: For the purpose of manufacturing the organic electroluminescence device formed by successively laminating a plurality of layers on a substrate, the plurality of layers are laminated on the position of the substrate 2 to be deposited, by changing relative position of the substrate 2 to be deposited, against respective evaporation sources 142a-142d, by making the substrate sequentially pass through the position facing a plurality of evaporation sources 142a-142d arranged in a row.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、有機電界発光素子
(有機エレクトロルミネッセンス素子;以下「有機EL
素子」という)の製造方法および製造装置並びに有機E
L素子を用いた表示装置の製造システムおよび製造方法
に関する。
TECHNICAL FIELD The present invention relates to an organic electroluminescence device (organic electroluminescence device; hereinafter referred to as “organic EL device”).
Element)) manufacturing method and manufacturing apparatus, and organic E
The present invention relates to a manufacturing system and a manufacturing method of a display device using an L element.

【0002】[0002]

【従来の技術】近年、平面型の表示装置として、有機E
L素子を発光素子としたもの(以下「有機ELディスプ
レイ」という)が注目を集めている。この有機ELディ
スプレイは、バックライトが不要な自発光型のフラット
パネルディスプレイであり、自発光型に特有の視野角の
広いディスプレイを実現できるという利点を有する。ま
た、必要な画素のみを点灯させればよいため消費電力の
点でバックライト型(液晶ディスプレイ等)に比べて有
利であるとともに、今後実用化が期待されている高精細
度の高速のビデオ信号に対して十分な応答性能を具備す
ると考えられている。
2. Description of the Related Art Recently, organic flat panel display devices have been used as organic display devices.
A device in which an L element is used as a light emitting element (hereinafter referred to as “organic EL display”) has been attracting attention. This organic EL display is a self-luminous flat panel display that does not require a backlight, and has an advantage that a display having a wide viewing angle, which is peculiar to the self-luminous type, can be realized. In addition, since only the necessary pixels need to be turned on, it is advantageous in terms of power consumption compared to the backlight type (such as a liquid crystal display), and high-definition, high-speed video signals that are expected to be put to practical use in the future. Is considered to have a sufficient response performance.

【0003】このような有機ELディスプレイに用いら
れる有機EL素子は、一般に、有機材料を上下から電極
(陽極および陰極)で挟み込む構造を持つ。そして、有
機材料からなる有機層に対して、陽極から正孔が、陰極
から電子がそれぞれ注入され、その有機層にて正孔と電
子が再結合して発光が生じるようになっている。このと
き、有機EL素子では、10V以下の駆動電圧で数百〜
数万cd/m2の輝度が得られる。また、有機材料(蛍
光物質)を適宜選択することによって、所望する色彩の
発光も得ることができる。これらのことから、有機EL
素子は、マルチカラーまたはフルカラーの表示装置を構
成するための発光素子として、非常に有望視されてい
る。
An organic EL element used in such an organic EL display generally has a structure in which an organic material is vertically sandwiched between electrodes (anode and cathode). Then, holes are injected from the anode and electrons are injected from the cathode into the organic layer made of an organic material, and the holes and the electrons are recombined in the organic layer to emit light. At this time, in the organic EL element, several hundred to
A brightness of tens of thousands of cd / m 2 can be obtained. In addition, light emission of a desired color can be obtained by appropriately selecting an organic material (fluorescent substance). From these things, organic EL
The element is very promising as a light emitting element for forming a multi-color or full-color display device.

【0004】ところで、有機EL素子における有機層
は、通常、正孔(ホール)注入層、正孔輸送層、発光
層、電荷注入層等といった三〜五層が積層されてなる。
ただし、各層を形成する有機材料は、耐水性が低く、ウ
エットプロセスを利用できない。そのため、有機層を形
成する際には、真空薄膜成膜技術を利用した真空蒸着に
よって各層を順に成膜して積層構造とするのが一般的で
ある。また、例えばフルカラーの画像表示を行う場合で
あれば、R(赤),G(緑),B(青)の各色成分に対
応した3種類の有機材料からなる有機層を、それぞれ異
なる画素位置に成膜しなければならない。そのため、カ
ラー対応の有機層を形成する際には、それぞれの色成分
に対応した開孔パターンのマスクを逐一交換したり、あ
るいは同一パターンのマスクをその都度位置合わせしつ
つ、各色成分毎に各層を順にパターニング成膜する、と
いった手法が用いられている。
By the way, the organic layer in the organic EL element is usually formed by laminating three to five layers such as a hole injection layer, a hole transport layer, a light emitting layer, a charge injection layer and the like.
However, the organic material forming each layer has low water resistance, and the wet process cannot be used. Therefore, when forming the organic layer, it is general that each layer is sequentially formed by vacuum vapor deposition using a vacuum thin film forming technique to form a laminated structure. Further, for example, in the case of performing full-color image display, organic layers made of three kinds of organic materials corresponding to R (red), G (green), and B (blue) color components are respectively provided at different pixel positions. Must be formed into a film. Therefore, when forming an organic layer corresponding to each color, the mask of the opening pattern corresponding to each color component is replaced one by one, or the mask of the same pattern is aligned each time, and each layer is formed for each color component. A method of patterning and depositing in sequence is used.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、従来の
手法では、有機EL素子の有機層を成膜するのにあたっ
て、以下に述べるような難点が生じてしまうことが考え
られる。
However, it is conceivable that the conventional method may cause the following problems in forming the organic layer of the organic EL element.

【0006】例えば、従来は、積層構造の有機層を形成
するのにあたり、真空チャンバ内の蒸着源(有機材料の
種類)を、各層を成膜する度に変更するといった手法を
用いることがあるが、この場合には、各色成分毎に三〜
五回分だけ有機材料の温度上昇を行うための時間が余分
にかかるとともに、蒸発レートの安定化を行うための時
間も必要となってしまう。そのため、有機層の迅速な成
膜が困難になってしまい、結果として有機EL素子を製
造する上でのタクトタイムに難が生じることが懸念され
る。
[0006] For example, conventionally, when forming an organic layer having a laminated structure, a method of changing a vapor deposition source (type of organic material) in a vacuum chamber each time each layer is formed may be used. , In this case, three to three for each color component
It takes extra time to raise the temperature of the organic material by five times, and also requires time to stabilize the evaporation rate. Therefore, it becomes difficult to form the organic layer quickly, and as a result, it is feared that the tact time in manufacturing the organic EL element becomes difficult.

【0007】また、従来は、例えば、同一の真空チャン
バ内に複数の蒸着源を配設するとともに、各蒸着源を開
閉自在なシャッタ等で覆うことにより、各層の選択的な
成膜を迅速に行い得るようにするといった手法を用いる
こともある。ところが、この場合には、各層の有機材料
の温度を安定に維持するのに数十分の時間を要するた
め、シャッタ等で覆われ成膜に用いない有機材料であっ
ても、蒸発レートを安定させるまでの間に多くを消費し
てしまう。つまり、選択的な成膜を行う場合には、有機
材料の無駄が生じてしまい、材料消費量の増加に起因す
る有機EL素子のコスト上昇を招いてしまうおそれがあ
る。
Further, conventionally, for example, a plurality of vapor deposition sources are arranged in the same vacuum chamber, and each vapor deposition source is covered with a shutter or the like which can be opened and closed. There is also a case where a method of making it possible is used. However, in this case, since it takes several tens of minutes to stably maintain the temperature of the organic material of each layer, even if the organic material is covered with a shutter or the like and is not used for film formation, the evaporation rate is stabilized. It consumes a lot until you let it do. In other words, when the selective film formation is performed, the organic material is wasted, which may increase the cost of the organic EL element due to the increase of the material consumption.

【0008】さらには、各層をそれぞれ異なる真空チャ
ンバ内で成膜すること、すなわち一つの真空チャンバと
一つの有機材料とを対応させることも考えられるが、こ
の場合には、有機層の多層化に伴って多くの真空チャン
バが必要になってしまうため、設備コストや設置スペー
ス等の点で難が生じてしまう。
Further, it is conceivable that each layer is formed in a different vacuum chamber, that is, one vacuum chamber and one organic material are made to correspond to each other. As a result, many vacuum chambers are required, which causes difficulties in terms of equipment cost and installation space.

【0009】そこで、本発明は、短いタクトタイムおよ
び少ない材料消費量での成膜を可能にすることで、迅速
かつ低コストで有機EL素子を製造することのできる有
機EL素子の製造方法および製造装置、並びにその有機
EL素子を用いた表示装置の製造システムおよび製造方
法を提供することを目的とする。
Therefore, the present invention enables a film formation with a short tact time and a small material consumption amount, thereby enabling an organic EL element to be manufactured rapidly and at low cost. An object of the present invention is to provide a device, a display device manufacturing system and a manufacturing method using the organic EL element.

【0010】[0010]

【課題を解決するための手段】本発明は、上記目的を達
成するために案出された有機EL素子の製造方法で、基
板上に複数層が順次積層されてなる有機EL素子を製造
する方法であって、並列配置された複数の蒸着源と対向
する位置を順に通過するように、前記基板と前記複数の
蒸着源との相対位置を可変させて、当該基板上の被成膜
箇所に前記複数層を積層させることを特徴とする。
The present invention is a method for manufacturing an organic EL element devised to achieve the above object, which is a method for manufacturing an organic EL element in which a plurality of layers are sequentially laminated on a substrate. That is, the relative positions of the substrate and the plurality of vapor deposition sources are changed so as to sequentially pass through the positions facing the plurality of vapor deposition sources arranged in parallel, and the film formation location on the substrate is It is characterized by stacking a plurality of layers.

【0011】また、本発明は、上記目的を達成するため
に案出された有機EL素子の製造装置で、基板上に複数
層が順次積層されてなる有機EL素子を製造するための
ものであって、前記複数層に対応する複数の蒸着源が並
べて配設されているとともに、前記基板上の被成膜箇所
が前記複数の蒸着源と対向する位置を順に通過するよう
に当該基板と前記複数の蒸着源との相対位置を可変させ
る搬送手段が設けられていることを特徴とするものであ
る。
Further, the present invention is an apparatus for manufacturing an organic EL element devised to achieve the above object, for manufacturing an organic EL element in which a plurality of layers are sequentially laminated on a substrate. A plurality of vapor deposition sources corresponding to the plurality of layers are arranged side by side, and the substrate and the plurality of vapor deposition sources are arranged such that the deposition target portion on the substrate sequentially passes through a position facing the plurality of vapor deposition sources. Is provided with a transporting means for varying the relative position with respect to the vapor deposition source.

【0012】また、本発明は、上記目的を達成するため
に案出された有機EL素子を用いた表示装置の製造シス
テムで、基板上に複数層が順次積層されてなる有機EL
素子を用いた表示装置を製造するためのものであって、
前記複数層に対応する複数の蒸着源が並べて配設されて
いるとともに、前記基板上の被成膜箇所が前記複数の蒸
着源と対向する位置を順に通過するように当該基板と前
記複数の蒸着源との相対位置を可変させる搬送手段が設
けられている有機EL素子の製造装置を複数備え、各製
造装置がそれぞれ異なる色成分に対応した有機EL素子
を形成するように構成されたことを特徴とするものであ
る。
Further, the present invention is a manufacturing system of a display device using an organic EL element devised to achieve the above object, which is an organic EL device in which a plurality of layers are sequentially laminated on a substrate.
For manufacturing a display device using an element,
A plurality of vapor deposition sources corresponding to the plurality of layers are arranged side by side, and the substrate and the plurality of vapor depositions are arranged so that a film formation location on the substrate sequentially passes through a position facing the plurality of vapor deposition sources. A plurality of organic EL element manufacturing apparatuses provided with a conveying means for varying the relative position to the source, and each manufacturing apparatus is configured to form an organic EL element corresponding to a different color component. It is what

【0013】また、本発明は、上記目的を達成するため
に案出された有機EL素子を用いた表示装置の製造方法
で、基板上に複数層が順次積層されてなる有機EL素子
を用いた表示装置を製造する方法であって、並列配置さ
れた複数の蒸着源と対向する位置を順に通過するよう
に、前記基板と前記複数の蒸着源との相対位置を可変さ
せ、当該基板上の被成膜箇所に前記複数層を積層させて
一つの色成分に対応する有機EL素子を形成し、これを
前記基板上の被成膜箇所を相違させて複数回繰り返すこ
とにより、前記基板上に複数の色成分に対応する各有機
EL素子が配設されてなる表示装置を構成することを特
徴とする。
Further, the present invention is a method of manufacturing a display device using an organic EL element devised to achieve the above object, wherein the organic EL element is formed by sequentially laminating a plurality of layers on a substrate. A method of manufacturing a display device, wherein the relative positions of the substrate and the plurality of vapor deposition sources are changed so that the substrates pass through positions facing the plurality of vapor deposition sources arranged in parallel in order, and the target on the substrate is changed. A plurality of layers are stacked on the substrate by forming the organic EL element corresponding to one color component by stacking the plurality of layers at the film forming location and repeating the formation a plurality of times at different deposition locations on the substrate. The display device is configured by arranging each organic EL element corresponding to the color component of.

【0014】上記手順の有機EL素子の製造方法および
上記構成の有機EL素子の製造装置によれば、基板上の
被成膜箇所には、その基板が各蒸着源と対向する位置を
順に通過する度に、各蒸着源からの蒸着材料による成膜
が行われる。つまり、基板が各蒸着源と対向する位置を
通過した後には、その基板上の被成膜箇所に複数層が順
次積層されることになる。したがって、基板上への複数
層の成膜にあたり、各蒸着源に対する処理準備(温度上
昇や蒸着レートの安定化等)を略同時に行え、またその
場合であっても各蒸着源からの蒸着材料が無駄なく成膜
に用いられることになる。
According to the method for manufacturing an organic EL element and the apparatus for manufacturing an organic EL element having the above-described procedure, the film formation location on the substrate sequentially passes through the position where the substrate faces each vapor deposition source. Each time, film formation is performed using the vapor deposition material from each vapor deposition source. That is, after the substrate has passed through the positions facing the respective vapor deposition sources, a plurality of layers are sequentially stacked at the film formation location on the substrate. Therefore, when depositing a plurality of layers on a substrate, preparation for processing (temperature rise, stabilization of vapor deposition rate, etc.) for each vapor deposition source can be performed almost simultaneously, and even in that case, the vapor deposition material from each vapor deposition source It will be used for film formation without waste.

【0015】また、上記構成の表示装置の製造システム
および上記手順の表示装置の製造方法によれば、上述し
た有機EL素子の製造方法および上記構成の有機EL素
子の製造装置の場合と同様に、複数層が順次積層されて
なる有機EL素子を形成するとともに、これを複数の色
成分に対応する分だけ繰り返す。したがって、基板上に
複数の有機EL素子が配設されてなる表示装置を構成す
る場合であっても、各有機EL素子の形成を連続的に行
うことが可能となり、しかも各有機EL素子について成
膜処理準備や蒸着材料消費量の効率化等が実現可能とな
る。
Further, according to the display device manufacturing system having the above structure and the display device manufacturing method having the above procedure, as in the case of the organic EL element manufacturing method and the organic EL element manufacturing apparatus having the above structure, An organic EL element in which a plurality of layers are sequentially laminated is formed, and this is repeated for a plurality of color components. Therefore, even when configuring a display device in which a plurality of organic EL elements are arranged on a substrate, it becomes possible to continuously form each organic EL element, and furthermore, each organic EL element is formed. It is possible to realize film processing preparation and efficient consumption of vapor deposition materials.

【0016】[0016]

【発明の実施の形態】以下、図面に基づき本発明に係る
有機EL素子の成膜方法および製造装置並びに有機電界
発光素子を用いた表示装置の製造システムおよび製造方
法について説明する。図1は本発明に係る製造装置の概
略構成例を示す模式図、図2はその要部の構成例を示す
模式図、図3はその製造装置によって製造される有機E
L素子の概略構成例を示す模式図、図4はその有機EL
素子を製造する際に用いられる搬送治具の概略構成例を
示す模式図、図5は本発明に係る製造装置を用いた製造
システムの構成例を示す模式図である。
BEST MODE FOR CARRYING OUT THE INVENTION A method for manufacturing a film and a manufacturing apparatus for an organic EL element and a manufacturing system and a method for a display device using an organic electroluminescent element according to the present invention will be described below with reference to the drawings. FIG. 1 is a schematic diagram showing a schematic configuration example of a manufacturing apparatus according to the present invention, FIG. 2 is a schematic diagram showing a configuration example of a main part thereof, and FIG. 3 is an organic E manufactured by the manufacturing apparatus.
FIG. 4 is a schematic diagram showing a schematic configuration example of an L element, and FIG.
FIG. 5 is a schematic diagram showing a schematic configuration example of a carrying jig used when manufacturing an element, and FIG. 5 is a schematic diagram showing a configuration example of a manufacturing system using the manufacturing apparatus according to the present invention.

【0017】先ず、はじめに、有機EL素子の概略構成
について簡単に説明する。図3に示すように、本実施形
態において製造される有機EL素子1は、有機ELディ
スプレイを構成するためのガラス基板2上に形成された
もので、それぞれ異なる材料からなる複数の有機層1a
〜1dが順次積層されてなるものである。なお、ここで
は、積層される層数が四つである場合を例に挙げている
が、これに限定されないことは勿論である。
First, a schematic structure of the organic EL element will be briefly described. As shown in FIG. 3, the organic EL element 1 manufactured in this embodiment is formed on a glass substrate 2 for forming an organic EL display, and includes a plurality of organic layers 1a made of different materials.
1d are sequentially laminated. Note that, here, the case where the number of layers to be laminated is four is given as an example, but the number of layers is not limited to this.

【0018】ところで、ガラス基板2上には、図示はし
ていないが、例えばR,G,Bの各色成分に対応した複
数の有機EL素子1が、所定パターンに従ってマトリク
ス状に縦横に配列されている。各有機EL素子1の間の
相違は、有機層1a〜1dを構成する有機材料(蛍光物
質)にある。これにより、これらガラス基板2および各
有機EL素子1を備えて構成された有機ELディスプレ
イでは、各有機EL素子に所定波長の光を選択的に発生
させて、カラー画像の表示を行うことが可能になるので
ある。
Although not shown in the figure, a plurality of organic EL elements 1 corresponding to respective color components of R, G, B are arranged on the glass substrate 2 in a matrix form in a matrix in a matrix according to a predetermined pattern. There is. The difference between the organic EL elements 1 lies in the organic material (fluorescent substance) forming the organic layers 1a to 1d. Accordingly, in the organic EL display including the glass substrate 2 and the organic EL elements 1, it is possible to selectively generate light having a predetermined wavelength in each organic EL element and display a color image. It becomes.

【0019】このようなカラー画像を表示するための各
有機EL素子1の配列は、例えばR,G,Bの各色成分
に対応したパターニング成膜によって各有機EL素子1
を形成することで実現可能となる。ここで、パターニン
グ成膜のために用いられる搬送治具の概略構成について
説明する。パターニング成膜は、図4に示すように、平
板状に形成され、鉄(Fe)やニッケル(Ni)等の強
磁性体からなるメタルマスク3を用いて行われる。メタ
ルマスク3には、所定の成膜パターンに対応した複数の
開孔3aが穿設されている。そして、被成膜物であるガ
ラス基板2の一面側を覆うようにそのガラス基板2と密
着した状態で、ガラス基板2の他面側に配された電磁石
4が発生させる磁力によって固定されるようになってい
る。このように構成される一体型の搬送治具によって、
ガラス基板2上には、所定パターンの成膜を行うことが
でき、また複数種類のメタルマスク3を用意すれば異な
るパターンの多層成膜を行うこともでき、結果として複
数の有機EL素子1を縦横に配列することが可能となる
のである。
The arrangement of each organic EL element 1 for displaying such a color image is, for example, each organic EL element 1 by patterning film formation corresponding to each color component of R, G, B.
Can be realized by forming Here, a schematic configuration of a transfer jig used for patterning film formation will be described. As shown in FIG. 4, the patterning film formation is performed using a metal mask 3 formed in a flat plate shape and made of a ferromagnetic material such as iron (Fe) or nickel (Ni). The metal mask 3 is provided with a plurality of openings 3a corresponding to a predetermined film formation pattern. Then, while being adhered to the glass substrate 2 so as to cover the one surface side of the glass substrate 2 which is the film formation target, the glass substrate 2 is fixed by the magnetic force generated by the electromagnet 4 arranged on the other surface side of the glass substrate 2. It has become. With the integrated transport jig configured in this way,
It is possible to form a predetermined pattern of film on the glass substrate 2, and to prepare a plurality of types of metal masks 3 to form a multi-layered film of different patterns. As a result, a plurality of organic EL elements 1 can be formed. It is possible to arrange them vertically and horizontally.

【0020】次に、以上のような搬送治具を用いてガラ
ス基板2上に有機EL素子1を形成して有機ELディス
プレイを構成するための製造システムについて説明す
る。本実施形態で説明する製造システムは、カラー画像
の表示が可能な有機ELディスプレイを構成すべく、
R,G,Bの各色成分に対応したパターニング成膜を行
って、ガラス基板2上に複数の有機EL素子1を縦横に
配列するためのものである。
Next, a manufacturing system for forming the organic EL element 1 on the glass substrate 2 by using the above-described transport jig to form an organic EL display will be described. The manufacturing system described in the present embodiment configures an organic EL display capable of displaying a color image,
This is for performing patterning film formation corresponding to each color component of R, G, B to arrange a plurality of organic EL elements 1 vertically and horizontally on the glass substrate 2.

【0021】そのために、図5に示すように、本実施形
態で説明する製造システムは、大別すると、外部からガ
ラス基板2が供給される基板供給部11と、そのガラス
基板2に対してクリーニングや活性化等の前処理を行う
前処理部12と、R色に対応したアライメント(ガラス
基板2とメタルマスク3との位置合わせおよび固定)を
行うR色アライメント部13rと、R色に対応したパタ
ーニング成膜を行うR色成膜部14rと、G色に対応し
たアライメントを行うG色アライメント部13gと、G
色に対応したパターニング成膜を行うG色成膜部14g
と、B色に対応したアライメントを行うB色アライメン
ト部13bと、B色に対応したパターニング成膜を行う
B色成膜部14bと、ガラス基板2とメタルマスク3と
の分離等の後処理を行う後処理部15と、ガラス基板2
から分離されたメタルマスク3等をR色アライメント部
13rへ供給するリターン部16と、パターニング成膜
により各色に対応する有機EL素子1が形成された後の
ガラス基板2を排出する基板排出部17と、から構成さ
れている。
Therefore, as shown in FIG. 5, the manufacturing system described in this embodiment is roughly classified into a substrate supply unit 11 to which the glass substrate 2 is supplied from the outside, and a cleaning for the glass substrate 2. A pretreatment unit 12 that performs pretreatment such as activation and activation, an R color alignment unit 13r that performs alignment corresponding to R color (positioning and fixing of the glass substrate 2 and the metal mask 3), and an R color correspondence unit An R-color film forming unit 14r that performs patterning film formation, a G-color alignment unit 13g that performs alignment corresponding to G color, and a G-color alignment unit 13g.
G-color film forming unit 14g for performing patterning film formation corresponding to color
And a B-color alignment section 13b for performing alignment corresponding to B-color, a B-color film forming section 14b for performing patterning film-forming corresponding to B-color, and post-processing such as separation of the glass substrate 2 and the metal mask 3 from each other. The post-processing unit 15 to be performed and the glass substrate 2
A return section 16 for supplying the metal mask 3 and the like separated from the R color alignment section 13r, and a substrate discharge section 17 for discharging the glass substrate 2 after the organic EL element 1 corresponding to each color is formed by patterning film formation. It consists of and.

【0022】これらの各部11〜17のうち、R色成膜
部14r、G色成膜部14gおよびB色成膜部14b
が、本実施形態で説明する有機EL素子の製造装置に該
当する。すなわち、R色成膜部14r、G色成膜部14
gおよびB色成膜部14bが、それぞれR,G,Bの各
色成分に対応した有機EL素子1を形成するように構成
されている。
Among these units 11 to 17, R color film forming unit 14r, G color film forming unit 14g and B color film forming unit 14b.
Corresponds to the organic EL element manufacturing apparatus described in the present embodiment. That is, the R-color film forming unit 14r and the G-color film forming unit 14
The g and B color film forming portions 14b are configured to form the organic EL element 1 corresponding to the respective R, G, and B color components.

【0023】なお、R色アライメント部13rから後処
理部15までの間では、ガラス基板2は、メタルマスク
3および電磁石4と一体型の搬送治具を構成した状態で
取り扱われるものとする。したがって、ガラス基板2、
メタルマスク3および電磁石4からなる搬送治具は、R
色成膜部14r、G色成膜部14gおよびB色成膜部1
4bを順に通過することになる。
Between the R-color alignment section 13r and the post-processing section 15, the glass substrate 2 is handled in a state in which the metal mask 3 and the electromagnet 4 constitute an integral carrying jig. Therefore, the glass substrate 2,
The transfer jig composed of the metal mask 3 and the electromagnet 4 is R
Color film forming unit 14r, G color film forming unit 14g, and B color film forming unit 1
4b will be passed in order.

【0024】また、R色成膜部14r、G色成膜部14
gおよびB色成膜部14bの前段には、それぞれR色ア
ライメント部13r、G色アライメント部13gおよび
B色アライメント部13bが配設されていることから、
互いに異なる状態のアライメント(パターニング成膜)
に対応することが可能である。これらの各部11〜17
の間でのガラス基板2または搬送治具の移載やアライメ
ント調整等は、ここではその説明を省略するが、周知の
ハンドリングロボットや搬送コンベア等を用いて行うも
のとする。
Further, the R color film forming section 14r and the G color film forming section 14 are provided.
Since the R-color alignment section 13r, the G-color alignment section 13g, and the B-color alignment section 13b are arranged in front of the g- and B-color film forming sections 14b, respectively,
Alignment in different states (patterning film formation)
It is possible to correspond to. These parts 11 to 17
The transfer of the glass substrate 2 or the transfer jig between them, alignment adjustment, and the like are performed by using a well-known handling robot, a transfer conveyor, or the like, though the description thereof is omitted here.

【0025】さらに、これらの各部11〜17は、リタ
ーン部16の存在によって閉ループ構造を構築してい
る。これにより、搬送治具を構成するメタルマスク3お
よび電磁石4は、R色成膜部14r、G色成膜部14
g、B色成膜部14bおよびリターン部16からなる閉
ループ内を循環することになる。具体的には、R色成膜
部14r、G色成膜部14g、B色成膜部14bおよび
リターン部16が、R色アライメント部13r、G色ア
ライメント部13g、B色アライメント部13bおよび
後処理部15を頂点とする方形状に配されている。ただ
し、閉ループ構造は、必ずしも方形状である必要はな
い。例えば、直線状に配されたR色アライメント部13
r、G色アライメント部13gおよびB色アライメント
部13bに沿うようにしてリターン部16を配設するこ
とで、閉ループ構造を構築することも考えられる。
Further, each of these parts 11 to 17 forms a closed loop structure due to the presence of the return part 16. As a result, the metal mask 3 and the electromagnet 4 that form the transport jig have the R-color film forming unit 14r and the G-color film forming unit 14r.
g, the B-color film forming unit 14b and the return unit 16 are circulated. Specifically, the R-color film forming unit 14r, the G-color film forming unit 14g, the B-color film forming unit 14b, and the return unit 16 are connected to the R-color alignment unit 13r, the G-color alignment unit 13g, the B-color alignment unit 13b, and the rear unit. It is arranged in a rectangular shape with the processing unit 15 as the apex. However, the closed loop structure does not necessarily have to be rectangular. For example, the R color alignment unit 13 arranged in a straight line
It is also conceivable to construct a closed loop structure by disposing the return section 16 along the r, G color alignment section 13g and the B color alignment section 13b.

【0026】次に、以上のような製造システムにて用い
られる有機EL素子の製造装置、すなわちR色成膜部1
4r、G色成膜部14gおよびB色成膜部14bの詳細
について、図1および図2を参照しながら説明する。
Next, a manufacturing apparatus for the organic EL element used in the above manufacturing system, that is, the R color film forming section 1
Details of the 4r, G-color film forming unit 14g, and B-color film forming unit 14b will be described with reference to FIGS. 1 and 2.

【0027】図1に示すように、R色成膜部14r、G
色成膜部14gおよびB色成膜部14b(以下、これら
を単に「素子製造装置」という)は、いずれも、真空チ
ャンバ141と、その真空チャンバ141内に並列配置
された複数の蒸着源142a〜142dと、ガラス基板
2と各蒸着源142a〜142dとの相対位置を可変さ
せるための搬送手段143と、真空チャンバ141内へ
の一体型の搬送治具の搬入口および排出口(ただし、い
ずれも不図示)と、を備えている。
As shown in FIG. 1, the R color film forming portions 14r, G
The color film forming unit 14g and the B color film forming unit 14b (hereinafter, simply referred to as “element manufacturing apparatus”) each include a vacuum chamber 141 and a plurality of vapor deposition sources 142a arranged in parallel in the vacuum chamber 141. To 142d, a transfer means 143 for varying the relative positions of the glass substrate 2 and the vapor deposition sources 142a to 142d, and an inlet and an outlet of an integrated transfer jig into the vacuum chamber 141 (however, (Not shown), as well.

【0028】このうち、各蒸着源142a〜142d
は、それぞれがガラス基板2上に成膜する複数の有機層
1a〜1dに対応している。例えば、上述したように有
機層1a〜1dの層数が四つの場合には、図2(a)に
示すように、搬送手段143による相対位置可変方向に
沿って一列に並んだ四つの蒸着源142a〜142dを
設け、それぞれに異なる有機材料を蒸発させるようにす
ることが考えられる。ただし、ここでは、並設された蒸
着源142a〜142dの数が四つである場合を例に挙
げているが、上述した有機層1a〜1dの層数と同様
に、これに限定されないことは勿論である。しかも、必
ずしも有機層1a〜1dの層数と蒸着源142a〜14
2dの数とが一致している必要はない。例えば、同じ有
機材料を蒸発させる蒸着源を隣り合って二つ以上設ける
ようにしてもよく、この場合には、有機層1a〜1dの
層数が四つであっても、蒸着源142a〜142dの数
は五つ以上となる。つまり、ここでいう有機層1a〜1
dに対応する数には、有機層1a〜1dと同一の数の他
に、有機層1a〜1dよりも多い数も含む。
Of these, each of the vapor deposition sources 142a to 142d
Respectively correspond to the plurality of organic layers 1a to 1d formed on the glass substrate 2. For example, when the number of the organic layers 1a to 1d is four as described above, as shown in FIG. 2A, four vapor deposition sources arranged in a line along the relative position variable direction by the transport unit 143. It is conceivable that 142a to 142d are provided and different organic materials are evaporated in each. However, here, the case where the number of the vapor deposition sources 142a to 142d arranged in parallel is four is given as an example, but like the number of layers of the organic layers 1a to 1d described above, the number is not limited to this. Of course. Moreover, the number of organic layers 1a to 1d and the vapor deposition sources 142a to 14d are not always required.
The numbers in 2d do not have to match. For example, two or more vapor deposition sources for evaporating the same organic material may be provided adjacent to each other. In this case, even if the number of organic layers 1a to 1d is four, the vapor deposition sources 142a to 142d are provided. Will be five or more. That is, the organic layers 1a to 1 referred to here
The number corresponding to d includes not only the same number as the organic layers 1a to 1d but also a number larger than the organic layers 1a to 1d.

【0029】また、各蒸着源142a〜142dは、図
2(b)に示すように、いずれも、搬送手段143によ
る相対位置可変方向と略直交する方向に延びる線状に構
成されている。つまり、各蒸着源142a〜142d
は、ガラス基板2の進行方向と略直交する辺の長さを充
分にカバーするだけの蒸着幅を有しており、かつ、その
蒸着幅の全域にわたって均一な有機材料の分布が得られ
るようになっている。
As shown in FIG. 2B, each of the vapor deposition sources 142a to 142d is formed in a linear shape extending in a direction substantially orthogonal to the direction in which the relative position of the carrying means 143 is varied. That is, each evaporation source 142a-142d
Has a vapor deposition width sufficient to cover the length of the side substantially orthogonal to the traveling direction of the glass substrate 2, and a uniform distribution of the organic material can be obtained over the entire vapor deposition width. Has become.

【0030】さらに、各蒸着源142a〜142dは、
例えばヒータ144の加熱によって有機材料を蒸発させ
るが、それぞれに独立した温度コントローラ145が接
続しているとともに、各温度コントローラ145が成膜
の厚さを膜厚センサ146によってモニタしているの
で、任意の蒸着レートが安定して保たれるようになって
いる。つまり、温度コントローラ145および膜厚セン
サ146によって、各蒸着源142a〜142dは、そ
れぞれ個別に蒸着レートがコントロールされるようにな
っている。ただし、蒸着レートのコントロールは、温度
コントローラ145等によるものに限定されることはな
く、これとは別に、あるいはこれに追加して、例えば各
蒸着源142a〜142dとガラス基板2との距離を個
別に調整するための機構を設けることも考えられる。
Further, the vapor deposition sources 142a to 142d are
For example, the organic material is evaporated by the heating of the heater 144, but an independent temperature controller 145 is connected to each of them, and each temperature controller 145 monitors the thickness of the film formation by the film thickness sensor 146. The vapor deposition rate of is kept stable. That is, the vapor deposition rates of the vapor deposition sources 142a to 142d are individually controlled by the temperature controller 145 and the film thickness sensor 146. However, the control of the vapor deposition rate is not limited to that by the temperature controller 145 or the like, and separately from this or in addition to this, for example, the distance between each of the vapor deposition sources 142a to 142d and the glass substrate 2 can be individually controlled. It is also conceivable to provide a mechanism for adjusting.

【0031】なお、各蒸着源142a〜142dの周囲
には、将来的な有機層の増加にも容易に対応可能とすべ
く、予備の蒸発源設置スペースを設けておくことが望ま
しい。
It should be noted that it is desirable to provide a spare evaporation source installation space around each of the evaporation sources 142a to 142d in order to easily cope with future increase in organic layers.

【0032】また図1において、搬送手段143は、ガ
ラス基板2を含む一体型の搬送治具を移動させること
で、そのガラス基板2と各蒸着源142a〜142dと
の相対位置を可変させるようになっている。このとき、
搬送手段143では、搬送治具の移動を真空中で行う必
要があることや、蒸着によるゴミの問題等を考慮して、
搬送治具を搭載した台車を閉じたワイヤに接続し、その
ワイヤを外部からサーボモータ等によって定速駆動して
引っ張る、といったシンプルな方式を採用し、これによ
りその搬送治具の移動を実現することが考えられる。た
だし、脱ガスの対策等がなされていれば、周知技術であ
るボールネジやベルトコンベア等による搬送方式を用い
ても構わないことは勿論である。
In FIG. 1, the transfer means 143 moves the integrated transfer jig including the glass substrate 2 so as to change the relative positions of the glass substrate 2 and the vapor deposition sources 142a to 142d. Has become. At this time,
In the transfer means 143, it is necessary to move the transfer jig in a vacuum, and the problem of dust due to vapor deposition is taken into consideration.
A simple method is adopted, in which a trolley equipped with a transfer jig is connected to a closed wire and the wire is externally driven at a constant speed by a servo motor or the like to pull the wire, thereby realizing the movement of the transfer jig. It is possible. However, it goes without saying that a well-known transfer method using a ball screw, a belt conveyor or the like may be used as long as degassing measures are taken.

【0033】次に、以上のように構成された素子製造装
置における処理動作例、すなわち本発明に係る有機EL
素子の製造方法について説明する。
Next, an example of processing operation in the element manufacturing apparatus configured as described above, that is, the organic EL device according to the present invention.
A method of manufacturing the element will be described.

【0034】ガラス基板2上に有機EL素子1を形成す
るのにあたっては、先ず、素子製造装置の前工程、具体
的にはR色アライメント部13r、G色アライメント部
13gまたはB色アライメント部13bにて、ガラス基
板2とメタルマスク3との精密アライメントが行われ
る。この精密アライメントは、例えば、予め付されたア
ライメントマークを画像処理等によって検出認識するこ
とによって行われる。そして、精密アライメントの後、
ガラス基板2とメタルマスク3とは、電磁石4による磁
力を介して一体型の搬送治具を構成し、ハンドリングロ
ボットや搬送コンベア等によって搬入口から素子製造装
置の真空チャンバ141内に搬送される。
In forming the organic EL device 1 on the glass substrate 2, first, a pre-process of the device manufacturing apparatus, specifically, the R color alignment part 13r, the G color alignment part 13g or the B color alignment part 13b is performed. Thus, the precision alignment between the glass substrate 2 and the metal mask 3 is performed. This precision alignment is performed, for example, by detecting and recognizing an alignment mark that is attached in advance by image processing or the like. And after precision alignment,
The glass substrate 2 and the metal mask 3 form an integrated transfer jig through the magnetic force of the electromagnet 4, and are transferred from the carry-in port into the vacuum chamber 141 of the element manufacturing apparatus by a handling robot, a transfer conveyor, or the like.

【0035】真空チャンバ141内では、例えばガラス
基板2上に材料A,B,C,Dの各有機層1a〜1dを
成膜する場合、これらに対応する各蒸着源142a〜1
42dが、搬送手段143による相対位置可変方向に沿
って材料A,B,C,Dの順に配置されている。そし
て、各蒸着源142a〜142dは、既に説明したよう
に、ガラス基板2の横幅を充分にカバーする蒸着幅を持
ち、かつ、均一な分布を持っている。
In the vacuum chamber 141, for example, when the organic layers 1a to 1d of the materials A, B, C, and D are formed on the glass substrate 2, the vapor deposition sources 142a to 142 corresponding to these organic layers 1a to 1d are formed.
42d is arranged in the order of the materials A, B, C, D along the relative position variable direction by the transporting means 143. As described above, each of the vapor deposition sources 142a to 142d has a vapor deposition width that sufficiently covers the lateral width of the glass substrate 2 and has a uniform distribution.

【0036】したがって、真空チャンバ141内に搬送
された一体型の搬送治具を搬送手段143が移動させ、
その搬送治具を構成するガラス基板2の被成膜箇所、す
なわちメタルマスク3の開孔3aが穿設された部分が、
材料A,B,C,Dの順に配置された各蒸着源142a
〜142dと対向する位置を順に通過すると、そのガラ
ス基板2の被成膜箇所には、材料A,B,C,Dの順に
各有機層1a〜1dが積層された状態に成膜されること
になる。つまり、各有機層1a〜1dの成膜は、一体型
の搬送治具が各蒸着源142a〜142d上を通過する
ことによって、連続して行われる。
Therefore, the transfer means 143 moves the integrated transfer jig transferred into the vacuum chamber 141,
The film forming portion of the glass substrate 2 that constitutes the transport jig, that is, the portion where the opening 3a of the metal mask 3 is formed,
Each evaporation source 142a in which materials A, B, C, D are arranged in this order
To 142d, the organic layers 1a to 1d are deposited in the order of the materials A, B, C, and D at the deposition target portion of the glass substrate 2 when the glass substrate 2 is sequentially passed. become. That is, the film formation of the organic layers 1a to 1d is continuously performed by the integral transport jig passing over the vapor deposition sources 142a to 142d.

【0037】このとき、各蒸着源142a〜142d
は、予めの設定に従いつつ、それぞれ個別に温度コント
ローラ145等によって蒸着レートがコントロールされ
るようになっている。蒸着レートの設定は、各有機層1
a〜1dの膜厚比とこれらに対応する各蒸着源142a
〜142dの蒸着レートとの間の比が等しくなり、か
つ、設定後の蒸着レートの値が最大になるようにする。
このようにするためには、有機材料の耐熱特性上最も厳
しいものに蒸着レートを合わせればよい。
At this time, each of the vapor deposition sources 142a to 142d
The vapor deposition rate is individually controlled by the temperature controller 145 and the like, according to preset settings. The vapor deposition rate is set for each organic layer 1
a to 1d film thickness ratio and each vapor deposition source 142a corresponding thereto
The ratio between the vapor deposition rate and the vapor deposition rate of 142d is equal, and the value of the vapor deposition rate after the setting is maximized.
In order to do so, the vapor deposition rate may be adjusted to the most severe heat resistance of the organic material.

【0038】具体的には、以下の述べるように各蒸着源
142a〜142dの蒸着レートを設定することが考え
られる。例えば、必要となる各有機層1a〜1dの膜厚
を成膜するのに、各蒸着源142a〜142dが設定可
能な最大蒸着レートで成膜を行うと、それぞれ10分、
8分、12分、5分といった時間を要する場合を例に挙
げる。この場合、それぞれを最大蒸着レートとすると、
一体型の搬送治具が各蒸着源142a〜142dを一定
速度で通過するため、各有機層1a〜1dが所望する膜
厚とはならない。したがって、この場合に、各蒸着源1
42a〜142dの蒸着レートは、最も時間が掛かり1
2分を要する蒸着源142cに合わせ、その時間内で各
有機層1a〜1dが所望する膜厚となるように設定す
る。このとき、必要ならば、ある有機層に対応する蒸着
源を隣り合って2つ以上設け、全体の蒸着レートを最適
効率化するようにしてもよい。
Specifically, it is possible to set the vapor deposition rates of the vapor deposition sources 142a to 142d as described below. For example, in order to form the required film thicknesses of the respective organic layers 1a to 1d, when the film formation is performed at the maximum evaporation rate that can be set by the respective evaporation sources 142a to 142d, 10 minutes each,
The case where it takes 8 minutes, 12 minutes, and 5 minutes will be taken as an example. In this case, if each is the maximum evaporation rate,
Since the integral transport jig passes through the vapor deposition sources 142a to 142d at a constant speed, the organic layers 1a to 1d do not have a desired film thickness. Therefore, in this case, each evaporation source 1
The evaporation rates of 42a to 142d are the most time consuming.
According to the vapor deposition source 142c that requires 2 minutes, the organic layers 1a to 1d are set to have a desired film thickness within that time. At this time, if necessary, two or more vapor deposition sources corresponding to a certain organic layer may be provided adjacent to each other to optimize the overall vapor deposition rate.

【0039】なお、必要となる各有機層1a〜1dの成
膜にどの程度の時間を要するかは、各蒸着源142a〜
142dの蒸着レートと一体型の搬送治具の移動速度と
から特定することができる。このことから、搬送治具の
移動速度のコントロールによって、各有機層1a〜1d
の膜厚を制御することも考えられる。
The time required to form the required organic layers 1a to 1d depends on the vapor deposition sources 142a to 142d.
It can be specified from the vapor deposition rate of 142d and the moving speed of the integrated transfer jig. From this, each of the organic layers 1a to 1d can be controlled by controlling the moving speed of the transfer jig.
It is also possible to control the film thickness of.

【0040】このようにして、各蒸着源142a〜14
2d上における一体型の搬送治具の通過、すなわち各有
機層1a〜1dの成膜が連続して行われると、成膜の終
わった搬送治具は、ハンドリングロボットや搬送コンベ
ア等によって、搬出口から素子製造装置の真空チャンバ
141外へ搬出される。そして、次の色成分に対応した
素子製造装置へ送られて、再び上述した場合と同様の精
密アライメントおよび成膜処理が行われる。これを繰り
返すことによって、ガラス基板2上には、R,G,Bの
各色成分に対応した有機EL素子1が縦横に配列される
のである。
In this way, each of the vapor deposition sources 142a-14a
After passing through the integrated transport jig on 2d, that is, when the organic layers 1a to 1d are continuously deposited, the transport jig after the deposition is unloaded by a handling robot or a transport conveyor. Is carried out from the vacuum chamber 141 of the element manufacturing apparatus. Then, it is sent to the element manufacturing apparatus corresponding to the next color component, and the same precision alignment and film forming processing as those described above are performed again. By repeating this, the organic EL elements 1 corresponding to the respective color components of R, G, B are arranged vertically and horizontally on the glass substrate 2.

【0041】以上のように、本実施形態で説明した有機
EL素子1の製造方法およびこれを実行する素子製造装
置によれば、並列配置された複数の蒸着源142a〜1
42dと対向する位置を順に通過するように、ガラス基
板2を含む一体型の搬送治具を移動させて、そのガラス
基板2上の被成膜箇所に各有機層1a〜1dを順次積層
させるようになっている。すなわち、ガラス基板2上の
被成膜箇所には、そのガラス基板2が各蒸着源142a
〜142dと対向する位置を順に通過する度に、各蒸着
源142a〜142dからの蒸着材料による成膜が行わ
れることになる。
As described above, according to the method for manufacturing the organic EL device 1 and the device manufacturing apparatus for executing the same described in the present embodiment, the plurality of vapor deposition sources 142a to 142a arranged in parallel are arranged.
The integrated transport jig including the glass substrate 2 is moved so that the organic layers 1a to 1d are sequentially laminated at the film formation locations on the glass substrate 2 so as to sequentially pass through the position facing 42d. It has become. In other words, the glass substrate 2 is located at each film formation location on the glass substrate 2 by the vapor deposition source 142a.
~ 142d, the film is formed by the vapor deposition material from each of the vapor deposition sources 142a to 142d every time it passes through the positions facing each other.

【0042】したがって、本実施形態の有機EL素子1
の製造方法および素子製造装置によれば、ガラス基板2
上への各有機層1a〜1dの成膜にあたり、各蒸着源1
42a〜142dに対する処理準備(温度上昇や蒸着レ
ートの安定化等)を略同時に行うことができる。そのた
め、各有機材料毎に温度上昇を行ったり蒸発レートの安
定化を行ったりする時間が余分に必要となることがない
ので、各有機層1a〜1dの迅速な成膜が実現可能とな
り、結果として有機EL素子1を製造する上でのタクト
タイム向上が期待できる。
Therefore, the organic EL element 1 of the present embodiment
According to the manufacturing method and the element manufacturing apparatus of the glass substrate 2
When depositing each of the organic layers 1a to 1d on top, each vapor deposition source 1
Processing preparations (temperature rise, stabilization of vapor deposition rate, etc.) for 42a to 142d can be performed substantially at the same time. Therefore, no extra time is required to increase the temperature or stabilize the evaporation rate for each organic material, and thus it is possible to realize rapid film formation of the organic layers 1a to 1d. As a result, it is expected that the tact time in manufacturing the organic EL element 1 is improved.

【0043】具体的には、上述した場合と同様、例えば
四層構造の各有機層1a〜1dの膜厚を成膜するのに、
各蒸着源142a〜142dが設定可能な最大蒸着レー
トで成膜を行うと、それぞれ10分、8分、12分、5
分といった時間を要する場合を例に挙げる。この場合、
従来の手法であると、10分+8分+12分+5分=合
計35分を要することが考えられるが、本実施形態の製
造方法および素子製造装置によれば、最も時間の掛かる
蒸着レートに合わせるため、12分+蒸着源142a〜
142d全体の通過時間8分=合計20分となり、結果
として約40%のタクトタイム短縮を実現することがで
きる。
Specifically, as in the case described above, for example, in order to form the film thickness of each of the organic layers 1a to 1d having a four-layer structure,
When film formation is performed at the maximum evaporation rate that can be set by each of the evaporation sources 142a to 142d, 10 minutes, 8 minutes, 12 minutes, and 5 minutes, respectively.
An example is the case where it takes time such as minutes. in this case,
The conventional method may require 10 minutes + 8 minutes + 12 minutes + 5 minutes = 35 minutes in total, but according to the manufacturing method and the element manufacturing apparatus of the present embodiment, it is necessary to adjust to the vapor deposition rate that takes the longest time. , 12 minutes + evaporation source 142a-
The passing time of the entire 142d is 8 minutes = 20 minutes in total, and as a result, it is possible to realize a tact time reduction of about 40%.

【0044】しかも、本実施形態の有機EL素子1の製
造方法および素子製造装置によれば、各蒸着源142a
〜142dと対向する位置をガラス基板2が順に通過す
ることによって、各有機層1a〜1dの成膜が連続して
行われるので、各蒸着源142a〜142dからの蒸着
材料が無駄なく成膜に用いられることになる。各蒸着源
142a〜142dにおける材料消費量の効率向上化が
図れ、タクトタイムの短縮と同様の材料消費率の削減が
見込まれるので、従来よりも有機EL素子1のコスト削
減を実現し得ることが期待できる。
Moreover, according to the method of manufacturing the organic EL device 1 and the device manufacturing apparatus of this embodiment, each vapor deposition source 142a.
~ 142d through the glass substrate 2 in order to sequentially deposit the organic layers 1a ~ 1d, vapor deposition material from the vapor deposition sources 142a ~ 142d can be deposited without waste. Will be used. Since it is possible to improve the efficiency of the material consumption in each of the vapor deposition sources 142a to 142d and to reduce the material consumption rate similarly to the reduction of the tact time, it is possible to realize the cost reduction of the organic EL element 1 as compared with the conventional case. Can be expected.

【0045】さらに、本実施形態の有機EL素子1の製
造方法および素子製造装置では、一つの真空チャンバ1
41内で複数の有機層1a〜1dの成膜を連続して行う
ようになっているので、有機層1a〜1dが多層化する
場合であっても一つの真空チャンバ141があれば済
む。すなわち、多くの真空チャンバを必要としなくて
も、成膜処理の迅速化や材料消費量の効率向上化等が図
れる。したがって、設備コストや設置スペース等の増加
を招くことなく、有機EL素子1の製造タクトタイム向
上やコスト削減等を実現することが可能となる。
Further, in the method of manufacturing the organic EL device 1 and the device manufacturing apparatus of this embodiment, one vacuum chamber 1 is used.
Since the plurality of organic layers 1a to 1d are continuously formed in the film 41, one vacuum chamber 141 is sufficient even when the organic layers 1a to 1d are multilayered. That is, it is possible to speed up the film forming process and improve the efficiency of material consumption without requiring many vacuum chambers. Therefore, it is possible to realize the improvement of the manufacturing tact time of the organic EL element 1 and the cost reduction without increasing the facility cost and the installation space.

【0046】また、本実施形態の素子製造装置では、各
蒸着源142a〜142dが搬送手段143による相対
位置可変方向と略直交する方向に延びる線状に構成され
ている。したがって、当該直交方向において各有機層1
a〜1dの膜厚が均一化するので、各有機層1a〜1d
を連続して成膜する場合であっても、それぞれの膜厚精
度等を確保するのが非常に容易となる。ただし、各蒸着
源142a〜142dは、上述したような線状に構成す
ることが望ましいが、必ずしも線状である必要はなく、
例えば点状に構成されたものであっても、それらを並設
すれば、製造タクトタイム向上やコスト削減等が実現可
能となる。
Further, in the device manufacturing apparatus of this embodiment, each of the vapor deposition sources 142a to 142d is formed in a linear shape extending in a direction substantially orthogonal to the direction in which the relative position of the carrying means 143 is varied. Therefore, in the orthogonal direction, each organic layer 1
Since the film thicknesses of a to 1d are made uniform, the respective organic layers 1a to 1d
Even when the film is continuously formed, it is very easy to ensure the film thickness accuracy and the like. However, although it is desirable that each of the vapor deposition sources 142a to 142d be configured in a linear shape as described above, it is not necessarily required to be a linear shape.
For example, even if they are formed in a dot shape, if they are arranged in parallel, it is possible to improve the manufacturing tact time and reduce the cost.

【0047】また、本実施形態の素子製造装置では、搬
送手段143が一体型の搬送治具を移動させることで、
ガラス基板2と各蒸着源142a〜142dとの相対位
置を可変させるようになっている。したがって、その相
対位置可変を、シンプルな方式で、かつ、高精度に行う
ことが、非常に容易となる。ただし、ガラス基板2では
なく、各蒸着源142a〜142dを移動させても構わ
ないことはいうまでもない。
Further, in the element manufacturing apparatus of this embodiment, the carrying means 143 moves the integrated carrying jig,
The relative positions of the glass substrate 2 and the vapor deposition sources 142a to 142d are made variable. Therefore, it becomes very easy to perform the relative position variable with a simple method and with high accuracy. However, it goes without saying that the vapor deposition sources 142a to 142d may be moved instead of the glass substrate 2.

【0048】また、本実施形態の素子製造装置では、各
蒸着源142a〜142dに対応して温度コントローラ
145等を設けることによって、各蒸着源142a〜1
42d毎に個別に蒸着レートをコントロールし得るよう
になっている。したがって、一体型の搬送治具が各蒸着
源142a〜142d上を一定速度で通過しても、各有
機層1a〜1dの膜厚を所望値に成膜することが可能と
なる。さらには、各蒸着源142a〜142d毎に膜厚
のモニタ結果を基にしたフィードバック制御等を行うこ
とも可能となるので、より一層成膜の高精度化を実現し
得るようにもなる。
Further, in the element manufacturing apparatus of this embodiment, the temperature controllers 145 and the like are provided in correspondence with the vapor deposition sources 142a to 142d, so that the vapor deposition sources 142a to 142a-1.
The vapor deposition rate can be controlled individually for each 42d. Therefore, even if the integrated transport jig passes over the vapor deposition sources 142a to 142d at a constant speed, the film thickness of each of the organic layers 1a to 1d can be formed to a desired value. Further, since it is possible to perform feedback control or the like based on the monitor result of the film thickness for each of the vapor deposition sources 142a to 142d, it is possible to further improve the accuracy of film formation.

【0049】また、本実施形態で説明した有機ELディ
スプレイの製造システムおよびその製造システムを用い
た製造方法によれば、ガラス基板2、メタルマスク3お
よび電磁石4からなる搬送治具が、それぞれ異なる色成
分に対応したR色成膜部14r、G色成膜部14gおよ
びB色成膜部14bを順に通過するようになっている。
したがって、R,G,Bの各色成分に対応した有機EL
素子1からなる有機ELディスプレイを連続的に構成す
ることが可能となり、しかもその際に各有機EL素子1
について上述したように成膜処理準備や蒸着材料消費量
の効率化等が実現可能となる。
Further, according to the organic EL display manufacturing system and the manufacturing method using the manufacturing system described in the present embodiment, the transport jig including the glass substrate 2, the metal mask 3 and the electromagnet 4 has different colors. The R-color film forming unit 14r, the G-color film forming unit 14g, and the B-color film forming unit 14b corresponding to the components are sequentially passed.
Therefore, organic EL corresponding to each color component of R, G, B
It becomes possible to continuously construct an organic EL display comprising the element 1, and at that time, each organic EL element 1
As described above, it is possible to realize the preparation of the film forming process and the efficiency of the consumption of the vapor deposition material.

【0050】さらに、本実施形態の製造システムによれ
ば、R色アライメント部13r、G色アライメント部1
3gおよびB色アライメント部13bが各色に対応した
アライメントを個別に行うので、R色成膜部14r、G
色成膜部14gおよびB色成膜部14bが連続的に各色
の有機EL素子1を形成する場合であっても、各色に対
応したパターニング成膜を適切に行うことが可能とな
る。
Further, according to the manufacturing system of this embodiment, the R color alignment section 13r and the G color alignment section 1 are provided.
3g and the B color alignment section 13b individually perform the alignment corresponding to each color, so that the R color film forming sections 14r, G
Even when the color film forming unit 14g and the B color film forming unit 14b continuously form the organic EL element 1 of each color, it is possible to appropriately perform the patterning film formation corresponding to each color.

【0051】また、本実施形態の製造システムによれ
ば、リターン部16の存在によって閉ループ構造を構築
されていることから、搬送治具が当該閉ループ内を循環
することになる。したがって、各色成分に対応した有機
EL素子1を連続的に形成する場合であっても、その一
連の流れの完全自動化が実現可能となり、有機ELディ
スプレイの製造の効率化を図る上で非常に好適なものと
なる。
Further, according to the manufacturing system of this embodiment, since the closed loop structure is constructed by the presence of the return section 16, the transfer jig circulates in the closed loop. Therefore, even when the organic EL elements 1 corresponding to the respective color components are continuously formed, it is possible to realize the complete automation of the series of flows, which is very suitable for improving the efficiency of manufacturing the organic EL display. It will be

【0052】特に、本実施形態で説明したように、閉ル
ープ構造を方形状とした場合には、リターン部16によ
る搬送治具の移動距離を最も短くすることができ、しか
も製造システムの設置面積も省スペース化が可能となる
ことから、結果としてシステム構成の小型化や低コスト
化等が実現容易となる。
In particular, as described in the present embodiment, when the closed loop structure has a rectangular shape, the movement distance of the transfer jig by the return section 16 can be minimized, and the manufacturing system installation area is also reduced. Since space can be saved, as a result, downsizing of the system configuration and cost reduction can be easily realized.

【0053】なお、本実施形態では、本発明の実施の好
適な具体例を挙げて説明したが、本発明はこれに限定さ
れるものではなく、種々変形することが可能である。す
なわち、本実施形態で説明した素子製造装置を構成する
一連の構成要素の材質、形状、動作機構等は、必ずしも
これらに限られるものではなく、各構成要素の機能を同
様に確保することが可能な限り、自由に変更可能であ
る。この場合においても、本実施形態の場合と同様の効
果を得ることができる。例えば、本実施形態では、板状
のガラス基板2上に有機EL素子1を形成する場合を例
に挙げて説明したが、樹脂材料からなるフィルム素材等
のようなロール状の基板であっても、全く同様に対応す
ることができる。
Although the present embodiment has been described with reference to a preferred specific example for carrying out the present invention, the present invention is not limited to this and can be variously modified. That is, the material, shape, operating mechanism, and the like of the series of constituent elements that make up the element manufacturing apparatus described in the present embodiment are not necessarily limited to these, and the functions of the respective constituent elements can be similarly ensured. It can be freely changed as long as possible. Even in this case, the same effect as that of the present embodiment can be obtained. For example, in the present embodiment, the case where the organic EL element 1 is formed on the plate-shaped glass substrate 2 has been described as an example, but a roll-shaped substrate such as a film material made of a resin material may be used. , Can be handled in exactly the same way.

【0054】[0054]

【発明の効果】以上に説明したように、本発明に係る有
機EL素子の製造方法および製造装置並びに有機EL素
子を用いた表示装置の製造システムおよび製造方法で
は、並列配置された複数の蒸着源と対向する位置を順に
通過するように、有機EL素子が成膜される基板と各蒸
着源との相対位置を可変させて、その基板上の被成膜箇
所に複数層を順次積層させるようになっているので、従
来に比べて短いタクトタイムおよび少ない材料消費量で
の成膜が可能となり、結果として迅速かつ低コストで有
機EL素子を製造することができるようになる。
As described above, according to the method and apparatus for manufacturing an organic EL element and the system and method for manufacturing a display device using the organic EL element according to the present invention, a plurality of vapor deposition sources arranged in parallel are provided. The relative positions of the substrate on which the organic EL element is formed and each vapor deposition source are changed so that the organic EL device is sequentially passed through a position facing each other, and a plurality of layers are sequentially laminated at the film formation location on the substrate. Therefore, it becomes possible to form a film with a shorter takt time and a smaller material consumption amount as compared with the conventional one, and as a result, an organic EL element can be manufactured quickly and at low cost.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る製造装置の概略構成例を示す模式
図である。
FIG. 1 is a schematic diagram showing a schematic configuration example of a manufacturing apparatus according to the present invention.

【図2】本発明に係る製造装置の要部の構成例を示す模
式図であり、(a)はその要部を正面から見た図、
(b)はその要部を側面からみた図である。
FIG. 2 is a schematic view showing a configuration example of a main part of the manufacturing apparatus according to the present invention, FIG. 2 (a) is a view of the main part as seen from the front,
(B) is the figure which looked at the principal part from the side.

【図3】本発明に係る製造装置によって製造される有機
EL素子の概略構成例を示す模式図である。
FIG. 3 is a schematic view showing a schematic configuration example of an organic EL element manufactured by the manufacturing apparatus according to the present invention.

【図4】有機EL素子を製造する際に用いられる搬送治
具の概略構成例を示す模式図である。
FIG. 4 is a schematic view showing a schematic configuration example of a carrying jig used when manufacturing an organic EL element.

【図5】本発明に係る有機EL素子を用いた表示装置の
製造システムの構成例を示す模式図である。
FIG. 5 is a schematic diagram showing a configuration example of a manufacturing system of a display device using the organic EL element according to the present invention.

【符号の説明】[Explanation of symbols]

1…有機EL素子、1a,1b,1c,1d…有機層、
2…ガラス基板、3…メタルマスク、14r…R色成膜
部、14g…G色成膜部、14b…B色成膜部、141
…真空チャンバ、142a,142b,142c,14
2d…蒸着源、143…搬送手段、144…ヒータ、1
45…温度コントローラ、146…膜厚センサ
1 ... Organic EL element, 1a, 1b, 1c, 1d ... Organic layer,
2 ... Glass substrate, 3 ... Metal mask, 14r ... R color film forming part, 14g ... G color film forming part, 14b ... B color film forming part, 141
... Vacuum chambers 142a, 142b, 142c, 14
2d ... Evaporation source, 143 ... Conveying means, 144 ... Heater, 1
45 ... Temperature controller, 146 ... Film thickness sensor

───────────────────────────────────────────────────── フロントページの続き (72)発明者 山口 優 東京都品川区北品川6丁目7番35号 ソニ ー株式会社内 Fターム(参考) 3K007 AB18 DB03 FA01 4K029 AA09 BA62 BB02 BB03 BC07 CA01 DA12 DB14 HA03 KA01   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Yu Yamaguchi             6-735 Kita-Shinagawa, Shinagawa-ku, Tokyo Soni             -Inside the corporation F-term (reference) 3K007 AB18 DB03 FA01                 4K029 AA09 BA62 BB02 BB03 BC07                       CA01 DA12 DB14 HA03 KA01

Claims (11)

【特許請求の範囲】[Claims] 【請求項1】 基板上に複数層が順次積層されてなる有
機電界発光素子の製造方法であって、 並列配置された複数の蒸着源と対向する位置を順に通過
するように、前記基板と前記複数の蒸着源との相対位置
を可変させて、当該基板上の被成膜箇所に前記複数層を
積層させることを特徴とする有機電界発光素子の製造方
法。
1. A method of manufacturing an organic electroluminescent device comprising a substrate and a plurality of layers sequentially stacked, wherein the substrate and the substrate are arranged so as to sequentially pass through a position facing a plurality of vapor deposition sources arranged in parallel. A method for manufacturing an organic electroluminescence device, characterized in that the relative positions with respect to a plurality of vapor deposition sources are varied, and the plurality of layers are laminated at a film formation location on the substrate.
【請求項2】 基板上に複数層が順次積層されてなる有
機電界発光素子の製造装置であって、 前記複数層に対応する複数の蒸着源が並べて配設されて
いるとともに、 前記基板上の被成膜箇所が前記複数の蒸着源と対向する
位置を順に通過するように当該基板と前記複数の蒸着源
との相対位置を可変させる搬送手段が設けられているこ
とを特徴とする有機電界発光素子の製造装置。
2. An apparatus for manufacturing an organic electroluminescence device, which comprises a substrate and a plurality of layers sequentially stacked thereon, wherein a plurality of vapor deposition sources corresponding to the plurality of layers are arranged side by side, and on the substrate. An organic electroluminescence device is provided, which is provided with a transfer unit that changes a relative position between the substrate and the plurality of vapor deposition sources so that a deposition target position sequentially passes through a position facing the plurality of vapor deposition sources. Device manufacturing equipment.
【請求項3】 前記複数の蒸着源は、いずれも前記搬送
手段による相対位置可変方向と略直交する方向に延びる
線状に構成されたものであることを特徴とする請求項2
記載の有機電界発光素子の製造装置。
3. The plurality of vapor deposition sources are each configured in a linear shape extending in a direction substantially orthogonal to a direction in which the relative position of the transport means is varied.
The manufacturing apparatus of the organic electroluminescent element of description.
【請求項4】 前記搬送手段は、前記基板を移動させる
ことで当該基板と前記複数の蒸着源との相対位置を可変
させるものであることを特徴とする請求項2記載の有機
電界発光素子の製造装置。
4. The organic electroluminescent device according to claim 2, wherein the transporting means moves the substrate to change the relative positions of the substrate and the plurality of vapor deposition sources. Manufacturing equipment.
【請求項5】 前記複数の蒸着源毎に個別に蒸着レート
をコントロールする制御手段が設けられていることを特
徴とする請求項2記載の有機電界発光素子の製造装置。
5. The apparatus for manufacturing an organic electroluminescent device according to claim 2, further comprising a control means for individually controlling a vapor deposition rate for each of the plurality of vapor deposition sources.
【請求項6】 基板上に複数層が順次積層されてなる有
機電界発光素子を用いた表示装置の製造システムであっ
て、 前記複数層に対応する複数の蒸着源が並べて配設されて
いるとともに、前記基板上の被成膜箇所が前記複数の蒸
着源と対向する位置を順に通過するように当該基板と前
記複数の蒸着源との相対位置を可変させる搬送手段が設
けられている有機電界発光素子の製造装置を複数備え、 各製造装置がそれぞれ異なる色成分に対応した有機電界
発光素子を形成するように構成されたことを特徴とする
有機電界発光素子を用いた表示装置の製造システム。
6. A manufacturing system of a display device using an organic electroluminescent device comprising a substrate and a plurality of layers sequentially stacked, wherein a plurality of vapor deposition sources corresponding to the plurality of layers are arranged side by side. , Organic electroluminescence provided with a transfer means for varying relative positions of the substrate and the plurality of vapor deposition sources so that a film formation portion on the substrate passes sequentially through positions facing the plurality of vapor deposition sources. A system for manufacturing a display device using an organic electroluminescent device, comprising a plurality of device manufacturing devices, each manufacturing device being configured to form an organic electroluminescent device corresponding to a different color component.
【請求項7】 前記基板および当該基板上の被成膜箇所
のパターニングに用いられるマスクが各製造装置を順に
通過するように構成されたことを特徴とする請求項6記
載の有機電界発光素子を用いた表示装置の製造システ
ム。
7. The organic electroluminescent element according to claim 6, wherein a mask used for patterning the substrate and a film formation portion on the substrate is configured to sequentially pass through each manufacturing apparatus. Display device manufacturing system used.
【請求項8】 各製造装置それぞれの前段に前記基板と
前記マスクとの位置合わせを行うアライメント装置が配
設されていることを特徴とする請求項7記載の有機電界
発光素子を用いた表示装置の製造システム。
8. A display device using an organic electroluminescence device according to claim 7, wherein an alignment device for aligning the substrate and the mask is arranged in front of each manufacturing device. Manufacturing system.
【請求項9】 複数の製造装置および各製造装置に対応
して配設されたアライメント装置に加えて、最後段の製
造装置を通過したマスクを最前段のアライメント装置へ
供給するリターン装置を備え、各製造装置、各アライメ
ント装置およびリターン装置によって閉ループ構造が構
築されていることを特徴とする請求項8記載の有機電界
発光素子を用いた表示装置の製造システム。
9. In addition to a plurality of manufacturing devices and an alignment device arranged corresponding to each manufacturing device, a return device for supplying a mask passing through the last manufacturing device to the foremost alignment device is provided. The manufacturing system of a display device using an organic electroluminescent element according to claim 8, wherein a closed loop structure is constructed by each manufacturing device, each alignment device, and the return device.
【請求項10】 前記閉ループ構造は、各製造装置およ
びリターン装置が各アライメント装置を頂点とする方形
状に配されることで構築されていることを特徴とする請
求項9記載の有機電界発光素子を用いた表示装置の製造
システム。
10. The organic electroluminescent device according to claim 9, wherein the closed loop structure is constructed by arranging each manufacturing apparatus and the return apparatus in a rectangular shape having each alignment apparatus as a vertex. Display device manufacturing system using.
【請求項11】 基板上に複数層が順次積層されてなる
有機電界発光素子を用いた表示装置の製造方法であっ
て、 並列配置された複数の蒸着源と対向する位置を順に通過
するように、前記基板と前記複数の蒸着源との相対位置
を可変させ、当該基板上の被成膜箇所に前記複数層を積
層させて一つの色成分に対応する有機電界発光素子を形
成し、 これを前記基板上の被成膜箇所を相違させて複数回繰り
返すことにより、前記基板上に複数の色成分に対応する
各有機電界発光素子が配設されてなる表示装置を構成す
ることを特徴とする有機電界発光素子を用いた表示装置
の製造方法。
11. A method of manufacturing a display device using an organic electroluminescent device comprising a plurality of layers sequentially stacked on a substrate, the method comprising sequentially passing a position facing a plurality of vapor deposition sources arranged in parallel. , The relative positions of the substrate and the plurality of vapor deposition sources are varied, and the plurality of layers are stacked at a film formation location on the substrate to form an organic electroluminescent device corresponding to one color component. It is characterized in that a display device is formed by arranging each organic electroluminescent element corresponding to a plurality of color components on the substrate by repeating a plurality of times with different deposition positions on the substrate. A method for manufacturing a display device using an organic electroluminescent device.
JP2002133536A 2001-09-05 2002-05-09 Display device manufacturing system and method using organic electroluminescent element Expired - Fee Related JP3705237B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2002133536A JP3705237B2 (en) 2001-09-05 2002-05-09 Display device manufacturing system and method using organic electroluminescent element
US10/428,411 US20030232563A1 (en) 2002-05-09 2003-05-02 Method and apparatus for manufacturing organic electroluminescence device, and system and method for manufacturing display unit using organic electroluminescence devices
TW092112232A TWI301386B (en) 2002-05-09 2003-05-05 Method and apparatus for manufacturing organic electroluminescence device, and system and method for manufacturing display unit using organic electroluminescence devices
SG200302489A SG120097A1 (en) 2002-05-09 2003-05-07 Method and apparatus for manufacturing organic electroluminescence device and system and method for manufacturing display unit using organic electroluminescence devices
KR1020030028798A KR100945997B1 (en) 2002-05-09 2003-05-07 Method and apparatus for manufacturing organic electroluminescence device, and system and method for manufacturing display unit using organic electroluminescence deviecs
CNB031786030A CN100530743C (en) 2002-05-09 2003-05-09 Method, system and apparatus for mfg. organic electroluminescence device and its display apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001268289 2001-09-05
JP2001-268289 2001-09-05
JP2002133536A JP3705237B2 (en) 2001-09-05 2002-05-09 Display device manufacturing system and method using organic electroluminescent element

Publications (2)

Publication Number Publication Date
JP2003157973A true JP2003157973A (en) 2003-05-30
JP3705237B2 JP3705237B2 (en) 2005-10-12

Family

ID=26621676

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002133536A Expired - Fee Related JP3705237B2 (en) 2001-09-05 2002-05-09 Display device manufacturing system and method using organic electroluminescent element

Country Status (1)

Country Link
JP (1) JP3705237B2 (en)

Cited By (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100071623A1 (en) * 2006-09-29 2010-03-25 Tokyo Electron Limited Evaporating apparatus
JP2010126753A (en) * 2008-11-26 2010-06-10 Canon Inc Vapor deposition apparatus and method for manufacturing organic light-emission apparatus
US7915813B2 (en) 2008-03-31 2011-03-29 Toshiba Matsushita Display Technology Co., Ltd. Organic EL display device and method of manufacturing the same
US7928652B2 (en) 2005-07-29 2011-04-19 Toshiba Matsushita Display Technology Co., Ltd. Organic EL emitting layer having specific concentration profile
JP2011140717A (en) * 2010-01-11 2011-07-21 Samsung Mobile Display Co Ltd Thin film deposition apparatus
JP2011191739A (en) * 2010-02-16 2011-09-29 Toshiba Mobile Display Co Ltd Organic electroluminescence device
US8110826B2 (en) 2008-09-26 2012-02-07 Toshiba Mobile Display Co., Ltd. Organic EL display device
US8114703B2 (en) 2009-11-19 2012-02-14 Toshiba Mobile Display Co., Ltd. Organic EL device
US8137466B2 (en) 2009-08-24 2012-03-20 Samsung Mobile Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
WO2012056877A1 (en) * 2010-10-29 2012-05-03 シャープ株式会社 Vapor deposition method, vapor deposition apparatus, and organic el display device
US8358057B2 (en) 2007-03-29 2013-01-22 Japan Display Central Inc. Organic EL display and method of manufacturing the same
US8486737B2 (en) 2009-08-25 2013-07-16 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8536057B2 (en) 2009-06-25 2013-09-17 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light emitting device by using the same
US8709161B2 (en) 2009-08-05 2014-04-29 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8707889B2 (en) 2011-05-25 2014-04-29 Samsung Display Co., Ltd. Patterning slit sheet assembly, organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus, and the organic light-emitting display apparatus
US8802200B2 (en) 2009-06-09 2014-08-12 Samsung Display Co., Ltd. Method and apparatus for cleaning organic deposition materials
US8833294B2 (en) 2010-07-30 2014-09-16 Samsung Display Co., Ltd. Thin film deposition apparatus including patterning slit sheet and method of manufacturing organic light-emitting display device with the same
US8846547B2 (en) 2010-09-16 2014-09-30 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the thin film deposition apparatus, and organic light-emitting display device manufactured by using the method
US8852687B2 (en) 2010-12-13 2014-10-07 Samsung Display Co., Ltd. Organic layer deposition apparatus
US8859043B2 (en) 2011-05-25 2014-10-14 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8859325B2 (en) 2010-01-14 2014-10-14 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8865252B2 (en) 2010-04-06 2014-10-21 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8871542B2 (en) 2010-10-22 2014-10-28 Samsung Display Co., Ltd. Method of manufacturing organic light emitting display apparatus, and organic light emitting display apparatus manufactured by using the method
US8876975B2 (en) 2009-10-19 2014-11-04 Samsung Display Co., Ltd. Thin film deposition apparatus
US8882922B2 (en) 2010-11-01 2014-11-11 Samsung Display Co., Ltd. Organic layer deposition apparatus
US8882921B2 (en) 2009-06-08 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
US8882556B2 (en) 2010-02-01 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8882920B2 (en) 2009-06-05 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
US8894458B2 (en) 2010-04-28 2014-11-25 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8900976B2 (en) 2012-09-21 2014-12-02 Samsung Display Co., Ltd. Organic layer deposition apparatus, organic light-emitting display apparatus, and method of manufacturing the organic light-emitting display apparatus
US8907326B2 (en) 2009-06-24 2014-12-09 Samsung Display Co., Ltd. Organic light-emitting display device and thin film deposition apparatus for manufacturing the same
US8906731B2 (en) 2011-05-27 2014-12-09 Samsung Display Co., Ltd. Patterning slit sheet assembly, organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus, and the organic light-emitting display apparatus
US8916237B2 (en) 2009-05-22 2014-12-23 Samsung Display Co., Ltd. Thin film deposition apparatus and method of depositing thin film
US8920563B2 (en) 2010-12-15 2014-12-30 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8921831B2 (en) 2009-08-24 2014-12-30 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8945979B2 (en) 2012-11-09 2015-02-03 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus by using the same, and organic light-emitting display apparatus manufactured by the method
US8945974B2 (en) 2012-09-20 2015-02-03 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display device using an organic layer deposition apparatus
US8951349B2 (en) 2009-11-20 2015-02-10 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8951610B2 (en) 2011-07-04 2015-02-10 Samsung Display Co., Ltd. Organic layer deposition apparatus
US8956697B2 (en) 2012-07-10 2015-02-17 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus and organic light-emitting display apparatus manufactured by using the method
US8962360B2 (en) 2013-06-17 2015-02-24 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the organic layer deposition apparatus
US8968829B2 (en) 2009-08-25 2015-03-03 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8969858B2 (en) 2012-11-08 2015-03-03 Samsung Display Co., Ltd. Organic light emitting display apparatus and method of manufacturing the same
US8973525B2 (en) 2010-03-11 2015-03-10 Samsung Display Co., Ltd. Thin film deposition apparatus
US8993360B2 (en) 2013-03-29 2015-03-31 Samsung Display Co., Ltd. Deposition apparatus, method of manufacturing organic light emitting display apparatus, and organic light emitting display apparatus
US9012258B2 (en) 2012-09-24 2015-04-21 Samsung Display Co., Ltd. Method of manufacturing an organic light-emitting display apparatus using at least two deposition units
US9018647B2 (en) 2010-09-16 2015-04-28 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US9040330B2 (en) 2013-04-18 2015-05-26 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus
US9051636B2 (en) 2011-12-16 2015-06-09 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus
JP2015140458A (en) * 2014-01-29 2015-08-03 シャープ株式会社 Vapor deposition apparatus, vapor deposition method and method for manufacturing organic electroluminescence element
US9121095B2 (en) 2009-05-22 2015-09-01 Samsung Display Co., Ltd. Thin film deposition apparatus
US9136476B2 (en) 2013-03-20 2015-09-15 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus, and organic light-emitting display apparatus manufactured by the method
US9150952B2 (en) 2011-07-19 2015-10-06 Samsung Display Co., Ltd. Deposition source and deposition apparatus including the same
US9174250B2 (en) 2009-06-09 2015-11-03 Samsung Display Co., Ltd. Method and apparatus for cleaning organic deposition materials
US9206501B2 (en) 2011-08-02 2015-12-08 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus by using an organic layer deposition apparatus having stacked deposition sources
US9234270B2 (en) 2011-05-11 2016-01-12 Samsung Display Co., Ltd. Electrostatic chuck, thin film deposition apparatus including the electrostatic chuck, and method of manufacturing organic light emitting display apparatus by using the thin film deposition apparatus
US9246135B2 (en) 2012-07-10 2016-01-26 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
US9249493B2 (en) 2011-05-25 2016-02-02 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display apparatus by using the same
US9257649B2 (en) 2012-07-10 2016-02-09 Samsung Display Co., Ltd. Method of manufacturing organic layer on a substrate while fixed to electrostatic chuck and charging carrier using contactless power supply module
US9260778B2 (en) 2012-06-22 2016-02-16 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
US9279177B2 (en) 2010-07-07 2016-03-08 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US9306191B2 (en) 2012-10-22 2016-04-05 Samsung Display Co., Ltd. Organic light-emitting display apparatus and method of manufacturing the same
US9347886B2 (en) 2013-06-24 2016-05-24 Samsung Display Co., Ltd. Apparatus for monitoring deposition rate, apparatus provided with the same for depositing organic layer, method of monitoring deposition rate, and method of manufacturing organic light emitting display apparatus using the same
US9388488B2 (en) 2010-10-22 2016-07-12 Samsung Display Co., Ltd. Organic film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9450140B2 (en) 2009-08-27 2016-09-20 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display apparatus using the same
US9461277B2 (en) 2012-07-10 2016-10-04 Samsung Display Co., Ltd. Organic light emitting display apparatus
US9466647B2 (en) 2012-07-16 2016-10-11 Samsung Display Co., Ltd. Flat panel display device and method of manufacturing the same
US9496317B2 (en) 2013-12-23 2016-11-15 Samsung Display Co., Ltd. Method of manufacturing organic light emitting display apparatus
US9496524B2 (en) 2012-07-10 2016-11-15 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
US9512515B2 (en) 2011-07-04 2016-12-06 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9534288B2 (en) 2013-04-18 2017-01-03 Samsung Display Co., Ltd. Deposition apparatus, method of manufacturing organic light-emitting display apparatus by using same, and organic light-emitting display apparatus manufactured by using deposition apparatus
US9570714B2 (en) 2012-08-03 2017-02-14 Samsung Display Co., Ltd Organic layer deposition assembly, organic layer deposition apparatus, organic light-emitting display apparatus and method of manufacturing the same
US9593408B2 (en) 2009-08-10 2017-03-14 Samsung Display Co., Ltd. Thin film deposition apparatus including deposition blade
US9624580B2 (en) 2009-09-01 2017-04-18 Samsung Display Co., Ltd. Thin film deposition apparatus
US9748483B2 (en) 2011-01-12 2017-08-29 Samsung Display Co., Ltd. Deposition source and organic layer deposition apparatus including the same
US9887378B2 (en) 2012-08-17 2018-02-06 Samsung Display Co., Ltd. Organic light-emitting display apparatus and method of manufacturing the same
US9905813B2 (en) 2015-06-29 2018-02-27 Samsung Display Co., Ltd. Organic light-emitting display device, organic layer depositing apparatus, and method of manufacturing organic light-emitting display device using the organic layer depositing apparatus
US10424735B2 (en) 2015-08-04 2019-09-24 Samsung Display Co., Ltd. Organic light-emitting display apparatus, organic layer deposition apparatus, and method of manufacturing the organic light-emitting display apparatus by using the organic layer deposition apparatus
CN115216737A (en) * 2022-07-19 2022-10-21 京东方科技集团股份有限公司 Vapor deposition apparatus and vapor deposition method
KR20230116807A (en) 2020-12-07 2023-08-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Manufacturing method of display device
KR20230153404A (en) 2021-03-11 2023-11-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Manufacturing method of display device
KR20240112204A (en) 2023-01-11 2024-07-18 도쿄엘렉트론가부시키가이샤 Substrate processing method and substrate processing apparatus

Cited By (104)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7928652B2 (en) 2005-07-29 2011-04-19 Toshiba Matsushita Display Technology Co., Ltd. Organic EL emitting layer having specific concentration profile
US20100071623A1 (en) * 2006-09-29 2010-03-25 Tokyo Electron Limited Evaporating apparatus
US8358057B2 (en) 2007-03-29 2013-01-22 Japan Display Central Inc. Organic EL display and method of manufacturing the same
US7915813B2 (en) 2008-03-31 2011-03-29 Toshiba Matsushita Display Technology Co., Ltd. Organic EL display device and method of manufacturing the same
US8283854B2 (en) 2008-03-31 2012-10-09 Japan Display Central Inc. Organic EL display device and method of manufacturing the same
US8716057B2 (en) 2008-09-26 2014-05-06 Japan Display Inc. Organic EL display device
US8110826B2 (en) 2008-09-26 2012-02-07 Toshiba Mobile Display Co., Ltd. Organic EL display device
JP2010126753A (en) * 2008-11-26 2010-06-10 Canon Inc Vapor deposition apparatus and method for manufacturing organic light-emission apparatus
US9121095B2 (en) 2009-05-22 2015-09-01 Samsung Display Co., Ltd. Thin film deposition apparatus
US8916237B2 (en) 2009-05-22 2014-12-23 Samsung Display Co., Ltd. Thin film deposition apparatus and method of depositing thin film
US9873937B2 (en) 2009-05-22 2018-01-23 Samsung Display Co., Ltd. Thin film deposition apparatus
US11920233B2 (en) 2009-05-22 2024-03-05 Samsung Display Co., Ltd. Thin film deposition apparatus
US11624107B2 (en) 2009-05-22 2023-04-11 Samsung Display Co., Ltd. Thin film deposition apparatus
US10689746B2 (en) 2009-05-22 2020-06-23 Samsung Display Co., Ltd. Thin film deposition apparatus
US8882920B2 (en) 2009-06-05 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
US8882921B2 (en) 2009-06-08 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
US9174250B2 (en) 2009-06-09 2015-11-03 Samsung Display Co., Ltd. Method and apparatus for cleaning organic deposition materials
US8802200B2 (en) 2009-06-09 2014-08-12 Samsung Display Co., Ltd. Method and apparatus for cleaning organic deposition materials
US8907326B2 (en) 2009-06-24 2014-12-09 Samsung Display Co., Ltd. Organic light-emitting display device and thin film deposition apparatus for manufacturing the same
US8536057B2 (en) 2009-06-25 2013-09-17 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light emitting device by using the same
US8709161B2 (en) 2009-08-05 2014-04-29 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9593408B2 (en) 2009-08-10 2017-03-14 Samsung Display Co., Ltd. Thin film deposition apparatus including deposition blade
US8137466B2 (en) 2009-08-24 2012-03-20 Samsung Mobile Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8193011B2 (en) 2009-08-24 2012-06-05 Samsung Mobile Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8921831B2 (en) 2009-08-24 2014-12-30 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8486737B2 (en) 2009-08-25 2013-07-16 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8968829B2 (en) 2009-08-25 2015-03-03 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9450140B2 (en) 2009-08-27 2016-09-20 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display apparatus using the same
US9624580B2 (en) 2009-09-01 2017-04-18 Samsung Display Co., Ltd. Thin film deposition apparatus
US9224591B2 (en) 2009-10-19 2015-12-29 Samsung Display Co., Ltd. Method of depositing a thin film
US8876975B2 (en) 2009-10-19 2014-11-04 Samsung Display Co., Ltd. Thin film deposition apparatus
US8114703B2 (en) 2009-11-19 2012-02-14 Toshiba Mobile Display Co., Ltd. Organic EL device
US8202756B2 (en) 2009-11-19 2012-06-19 Toshiba Mobile Display Co., Ltd. Organic EL device
US8951349B2 (en) 2009-11-20 2015-02-10 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9660191B2 (en) 2009-11-20 2017-05-23 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
JP2011140717A (en) * 2010-01-11 2011-07-21 Samsung Mobile Display Co Ltd Thin film deposition apparatus
US10287671B2 (en) 2010-01-11 2019-05-14 Samsung Display Co., Ltd. Thin film deposition apparatus
US10246769B2 (en) 2010-01-11 2019-04-02 Samsung Display Co., Ltd. Thin film deposition apparatus
US8859325B2 (en) 2010-01-14 2014-10-14 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8882556B2 (en) 2010-02-01 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8461577B2 (en) 2010-02-16 2013-06-11 Japan Display Central Inc. Organic EL device
JP2011191739A (en) * 2010-02-16 2011-09-29 Toshiba Mobile Display Co Ltd Organic electroluminescence device
US9453282B2 (en) 2010-03-11 2016-09-27 Samsung Display Co., Ltd. Thin film deposition apparatus
US8973525B2 (en) 2010-03-11 2015-03-10 Samsung Display Co., Ltd. Thin film deposition apparatus
US8865252B2 (en) 2010-04-06 2014-10-21 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9136310B2 (en) 2010-04-28 2015-09-15 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8894458B2 (en) 2010-04-28 2014-11-25 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US9279177B2 (en) 2010-07-07 2016-03-08 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8833294B2 (en) 2010-07-30 2014-09-16 Samsung Display Co., Ltd. Thin film deposition apparatus including patterning slit sheet and method of manufacturing organic light-emitting display device with the same
US9018647B2 (en) 2010-09-16 2015-04-28 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
US8846547B2 (en) 2010-09-16 2014-09-30 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the thin film deposition apparatus, and organic light-emitting display device manufactured by using the method
US8871542B2 (en) 2010-10-22 2014-10-28 Samsung Display Co., Ltd. Method of manufacturing organic light emitting display apparatus, and organic light emitting display apparatus manufactured by using the method
US9388488B2 (en) 2010-10-22 2016-07-12 Samsung Display Co., Ltd. Organic film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8609442B2 (en) 2010-10-29 2013-12-17 Sharp Kabushiki Kaisha Vapor deposition method, vapor deposition device and organic EL display device
WO2012056877A1 (en) * 2010-10-29 2012-05-03 シャープ株式会社 Vapor deposition method, vapor deposition apparatus, and organic el display device
CN103189542A (en) * 2010-10-29 2013-07-03 夏普株式会社 Vapor deposition method, vapor deposition apparatus, and organic el display device
JP5269256B2 (en) * 2010-10-29 2013-08-21 シャープ株式会社 Vapor deposition method and vapor deposition apparatus
US8882922B2 (en) 2010-11-01 2014-11-11 Samsung Display Co., Ltd. Organic layer deposition apparatus
US8852687B2 (en) 2010-12-13 2014-10-07 Samsung Display Co., Ltd. Organic layer deposition apparatus
US8920563B2 (en) 2010-12-15 2014-12-30 Samsung Display Co., Ltd. Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9748483B2 (en) 2011-01-12 2017-08-29 Samsung Display Co., Ltd. Deposition source and organic layer deposition apparatus including the same
US9234270B2 (en) 2011-05-11 2016-01-12 Samsung Display Co., Ltd. Electrostatic chuck, thin film deposition apparatus including the electrostatic chuck, and method of manufacturing organic light emitting display apparatus by using the thin film deposition apparatus
US9076982B2 (en) 2011-05-25 2015-07-07 Samsung Display Co., Ltd. Patterning slit sheet assembly, organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus, and the organic light-emitting display apparatus
US9249493B2 (en) 2011-05-25 2016-02-02 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display apparatus by using the same
US8859043B2 (en) 2011-05-25 2014-10-14 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US8707889B2 (en) 2011-05-25 2014-04-29 Samsung Display Co., Ltd. Patterning slit sheet assembly, organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus, and the organic light-emitting display apparatus
US8906731B2 (en) 2011-05-27 2014-12-09 Samsung Display Co., Ltd. Patterning slit sheet assembly, organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus, and the organic light-emitting display apparatus
US8951610B2 (en) 2011-07-04 2015-02-10 Samsung Display Co., Ltd. Organic layer deposition apparatus
US9512515B2 (en) 2011-07-04 2016-12-06 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9777364B2 (en) 2011-07-04 2017-10-03 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the same
US9150952B2 (en) 2011-07-19 2015-10-06 Samsung Display Co., Ltd. Deposition source and deposition apparatus including the same
US9206501B2 (en) 2011-08-02 2015-12-08 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus by using an organic layer deposition apparatus having stacked deposition sources
US9051636B2 (en) 2011-12-16 2015-06-09 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus
US9260778B2 (en) 2012-06-22 2016-02-16 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
US10431779B2 (en) 2012-07-10 2019-10-01 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
US9496524B2 (en) 2012-07-10 2016-11-15 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
US8956697B2 (en) 2012-07-10 2015-02-17 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus and organic light-emitting display apparatus manufactured by using the method
US9461277B2 (en) 2012-07-10 2016-10-04 Samsung Display Co., Ltd. Organic light emitting display apparatus
US9257649B2 (en) 2012-07-10 2016-02-09 Samsung Display Co., Ltd. Method of manufacturing organic layer on a substrate while fixed to electrostatic chuck and charging carrier using contactless power supply module
US9246135B2 (en) 2012-07-10 2016-01-26 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus using the same, and organic light-emitting display apparatus manufactured using the method
US9466647B2 (en) 2012-07-16 2016-10-11 Samsung Display Co., Ltd. Flat panel display device and method of manufacturing the same
US9570714B2 (en) 2012-08-03 2017-02-14 Samsung Display Co., Ltd Organic layer deposition assembly, organic layer deposition apparatus, organic light-emitting display apparatus and method of manufacturing the same
US9887378B2 (en) 2012-08-17 2018-02-06 Samsung Display Co., Ltd. Organic light-emitting display apparatus and method of manufacturing the same
US8945974B2 (en) 2012-09-20 2015-02-03 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display device using an organic layer deposition apparatus
US8900976B2 (en) 2012-09-21 2014-12-02 Samsung Display Co., Ltd. Organic layer deposition apparatus, organic light-emitting display apparatus, and method of manufacturing the organic light-emitting display apparatus
US9012258B2 (en) 2012-09-24 2015-04-21 Samsung Display Co., Ltd. Method of manufacturing an organic light-emitting display apparatus using at least two deposition units
US9306191B2 (en) 2012-10-22 2016-04-05 Samsung Display Co., Ltd. Organic light-emitting display apparatus and method of manufacturing the same
US8969858B2 (en) 2012-11-08 2015-03-03 Samsung Display Co., Ltd. Organic light emitting display apparatus and method of manufacturing the same
US8945979B2 (en) 2012-11-09 2015-02-03 Samsung Display Co., Ltd. Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus by using the same, and organic light-emitting display apparatus manufactured by the method
US9136476B2 (en) 2013-03-20 2015-09-15 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus, and organic light-emitting display apparatus manufactured by the method
US8993360B2 (en) 2013-03-29 2015-03-31 Samsung Display Co., Ltd. Deposition apparatus, method of manufacturing organic light emitting display apparatus, and organic light emitting display apparatus
US9534288B2 (en) 2013-04-18 2017-01-03 Samsung Display Co., Ltd. Deposition apparatus, method of manufacturing organic light-emitting display apparatus by using same, and organic light-emitting display apparatus manufactured by using deposition apparatus
US9040330B2 (en) 2013-04-18 2015-05-26 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting display apparatus
US8962360B2 (en) 2013-06-17 2015-02-24 Samsung Display Co., Ltd. Organic layer deposition apparatus and method of manufacturing organic light-emitting display device by using the organic layer deposition apparatus
US9347886B2 (en) 2013-06-24 2016-05-24 Samsung Display Co., Ltd. Apparatus for monitoring deposition rate, apparatus provided with the same for depositing organic layer, method of monitoring deposition rate, and method of manufacturing organic light emitting display apparatus using the same
US9496317B2 (en) 2013-12-23 2016-11-15 Samsung Display Co., Ltd. Method of manufacturing organic light emitting display apparatus
JP2015140458A (en) * 2014-01-29 2015-08-03 シャープ株式会社 Vapor deposition apparatus, vapor deposition method and method for manufacturing organic electroluminescence element
US9905813B2 (en) 2015-06-29 2018-02-27 Samsung Display Co., Ltd. Organic light-emitting display device, organic layer depositing apparatus, and method of manufacturing organic light-emitting display device using the organic layer depositing apparatus
US10424735B2 (en) 2015-08-04 2019-09-24 Samsung Display Co., Ltd. Organic light-emitting display apparatus, organic layer deposition apparatus, and method of manufacturing the organic light-emitting display apparatus by using the organic layer deposition apparatus
KR20230116807A (en) 2020-12-07 2023-08-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Manufacturing method of display device
KR20230153404A (en) 2021-03-11 2023-11-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Manufacturing method of display device
CN115216737A (en) * 2022-07-19 2022-10-21 京东方科技集团股份有限公司 Vapor deposition apparatus and vapor deposition method
CN115216737B (en) * 2022-07-19 2024-03-26 京东方科技集团股份有限公司 Vapor deposition device and vapor deposition method
KR20240112204A (en) 2023-01-11 2024-07-18 도쿄엘렉트론가부시키가이샤 Substrate processing method and substrate processing apparatus

Also Published As

Publication number Publication date
JP3705237B2 (en) 2005-10-12

Similar Documents

Publication Publication Date Title
JP3705237B2 (en) Display device manufacturing system and method using organic electroluminescent element
KR100945997B1 (en) Method and apparatus for manufacturing organic electroluminescence device, and system and method for manufacturing display unit using organic electroluminescence deviecs
JP5710734B2 (en) Vapor deposition particle injection apparatus and vapor deposition apparatus
KR101502715B1 (en) Vapor deposition apparatus, vapor deposition method, and organic el display
JP5331264B2 (en) Vapor deposition apparatus and vapor deposition method
KR101597887B1 (en) Vapor deposition method, and vapor deposition device
JP5171964B2 (en) Organic thin film deposition apparatus, organic EL element manufacturing apparatus, and organic thin film deposition method
JP2007332458A (en) Vapor deposition apparatus, and vapor deposition source, and display device manufacturing method
CN103385035B (en) Deposition particle ejecting device and evaporation coating device and evaporation coating method
KR101539874B1 (en) Substrate to which film is formed and organic el display device
WO2012043258A1 (en) Vapor deposition method, vapor deposition device, and organic el display device
WO2012098927A1 (en) Vapor deposition apparatus, vapor deposition method, organic el element, and organic el display apparatus
JP5285187B2 (en) Vapor deposition apparatus and vapor deposition method
US20170104158A1 (en) Vapor deposition method and vapor deposition apparatus
KR20060046290A (en) Film formation source, vacuum film formation apparatus, organic el panel and method of manufacturing the same
US20140315342A1 (en) Deposition apparatus, deposition method, organic el display, and lighting device
JPWO2012053402A1 (en) Vapor deposition equipment
WO2017010512A1 (en) Vapor deposition method and vapor deposition device
TWI621727B (en) Vapor deposition device, vapor deposition method, and method of manufacturing organic electroluminescence device
US20140014036A1 (en) Deposition particle emitting device, deposition particle emission method, and deposition device
JP2004241319A (en) Film forming device
JP2004238688A (en) Apparatus for manufacturing organic light emitting device and system for manufacturing display device
JP4026449B2 (en) Organic electroluminescence device manufacturing equipment
JP4945870B2 (en) Organic electroluminescence device manufacturing equipment
JP2008280575A (en) Film-forming method, film-forming apparatus and manufacturing method of organic electroluminescent device

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20041208

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20041214

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050214

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20050315

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050414

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20050606

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20050705

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20050718

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080805

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090805

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100805

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110805

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110805

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120805

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120805

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130805

Year of fee payment: 8

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees