JP2003156617A - Method for manufacturing black matrix substrate and color filter using substrate manufactured with the method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a black matrix substrate having a practically sufficient adhesion property to a transparent substrate and a color filter with an excellent adhesion property to both the black matrix and the transparent substrate and with high film strength. SOLUTION: The method for manufacturing the black matrix substrate consists of applying a black photoresist on the transparent substrate, making active energy beams irradiate the substrate surface from the side of the surface coated with the black photoresist via a photomask, developing it thereafter and subsequently making the active energy beams irradiate the substrate surface from the transparent substrate side. In addition, the color filter comprises filter segments with at least two colors other than the black color formed on the black matrix substrate manufactured with the method.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a black matrix substrate using a black photosensitive resist, and a color filter using the substrate manufactured by the method.

[0002]

2. Description of the Related Art Conventionally, in the outer peripheral portion of a filter segment of a color filter, in order to prevent leakage of backlight light from the outer peripheral portion of the panel when forming the color filter into a liquid crystal panel, a frame shape of about 1 to 10 mm Pattern (black matrix) is formed. Usually, the black matrix is often formed of a metal thin film having a fine pattern on a transparent substrate. For example, a method of forming a fine pattern by photolithography after forming a thin film of a metal or the like by a vacuum film forming method such as a vapor deposition method or a sputtering method using a metal or a metal compound such as chromium, nickel or aluminum. Is common. More specifically,
A photoresist is applied on a thin film of metal or the like, dried, irradiated with ultraviolet rays through a photomask, and developed to form a resist pattern, and then a black matrix is formed through an etching step and a resist stripping step.

However, the black matrix substrate manufactured by the above method has a problem that the manufacturing cost is very high due to the complicated process and the cost of the color filter using the same is also high. In addition, since the surface of a metal thin film (for example, a chrome thin film) that is generally used for manufacturing a black matrix has high reflectance, a color filter having a black matrix made of a metal thin film is used in a transmissive liquid crystal display. When mounted, there is a problem that the display quality is significantly reduced when strong external light enters the color filter. Therefore, a color filter having a black matrix formed using a black photosensitive resist is being studied.

[0004]

However, in the above color filter, since the adhesion between the black matrix and the transparent substrate is weak, the black matrix may peel off from the interface with the transparent substrate when it is formed into a panel. there were. In order to improve the adhesion with a transparent substrate, JP-A-10-133
Japanese Patent No. 370 discloses a black photosensitive resist containing a silane coupling agent. When this black photosensitive resist is used, it is effective in improving the adhesion to a transparent substrate. Residue on the transparent substrate surface occurs.
Further, since the silane coupling agent reacts with moisture in the air in the resist, recovery and recovery cannot be performed, which is economically disadvantageous.

Therefore, the present invention provides a method for producing a black matrix substrate having sufficient practical adhesion to a transparent substrate, and a color filter having good adhesion between the black matrix and the transparent substrate and high film strength. The purpose is to do.

[0006]

As a result of intensive studies to solve the above problems, the inventors of the present invention applied a black photosensitive resist on a transparent substrate, and applied a photo resist from the black photosensitive resist applied surface side. By irradiating an active energy ray through a mask and developing to form a black matrix pattern, and then irradiating the active energy ray from the transparent substrate side, a black matrix substrate having practically sufficient adhesion to the transparent substrate is obtained. It was found that a color filter having good adhesiveness between a black matrix and a transparent substrate and high film strength can be obtained by using the black matrix substrate produced by the method and the present invention, and completed the present invention.

That is, according to the present invention, a black photosensitive resist is coated on a transparent substrate, active energy rays are irradiated from the black photosensitive resist coated surface side through a photomask, followed by development, and then the transparent substrate side. There is provided a method for producing a black matrix substrate, which comprises irradiating an active energy ray from the substrate. In the above manufacturing method, the active energy dose irradiated from the transparent substrate side is 0.1 to 150 times the active energy dose irradiated from the resist coated surface side.
% Is preferable. The present invention also provides a color filter characterized in that at least two color filter segments other than black are formed on a black matrix substrate manufactured by the above method.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION The black matrix substrate of the present invention means a substrate in which a black matrix is formed on a transparent substrate. As a transparent substrate, soda lime glass,
A glass plate such as low-alkali borosilicate glass or non-alkali aluminoborosilicate glass, or a resin plate such as polycarbonate, polymethylmethacrylate, or polyethylene terephthalate is used. Especially when a glass substrate is used,
Since the adhesion between the black matrix and the transparent substrate tends to be low, the effect of adopting the method of the present invention is high. In addition, a transparent electrode made of indium oxide, tin oxide or the like may be formed on the surface of the glass plate or the resin plate for driving the liquid crystal after paneling.

The black photosensitive resist used in the present invention contains at least a black pigment and an active energy ray-curable compound. As the black pigment, carbon black, titanium black, aniline black, anthraquinone black pigment, perylene black pigment, specifically CI
Pigment black 1, 6, 7, 12, 20, 31, 3
2 and the like can be used, but it is preferable to use carbon black in terms of price and light-shielding property. The carbon black may be surface-treated with a resin or the like.

Black photosensitive resists include azo pigments other than black pigments, phthalocyanine pigments, slene pigments, indigo pigments, perinone pigments, perylene pigments, and phthalone pigments for the purpose of improving dispersibility and adjusting hue. Pigments, dioxazine pigments, quinacridone pigments, isoindolinone pigments, metal complex pigments, methine / azomethine pigments,
Diketopyrrolopyrrole pigments and derivatives of these pigments may be added. The content of the black pigment in the black photosensitive resist is preferably 3 to 80% by weight based on the black photosensitive resist. Black pigment content is 3% by weight
If it is less than 80% by weight, the light-shielding property per unit film thickness of the black matrix is lowered, and if it exceeds 80% by weight, thin film formation becomes difficult.

As the active energy ray-curable compound,
Monomers, oligomers, photosensitive resins and the like can be used. Monomers and oligomers include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, cyclohexyl (meth) acrylate, polyethylene glycol di (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa. (Meth) acrylate, tricyclodecanyl (meth) acrylate, melamine (meth) acrylate, epoxy (meth) acrylate and other various acrylic acid esters and methacrylic acid esters, (meth) acrylic acid, (meth) acrylamide,
Examples thereof include N-hydroxymethyl (meth) acrylamide, styrene, vinyl acetate, acrylonitrile and the like.

As the photosensitive resin, a linear polymer having a reactive substituent such as a hydroxyl group, a carboxyl group, an amino group or the like is added to a (meth) acrylic compound, a cinnamic acid compound, via an isocyanate group, an aldehyde group or an epoxy group. A resin in which a photocrosslinkable group such as an acid is introduced is used. In addition, a linear polymer containing an acid anhydride such as a styrene-maleic anhydride copolymer or an α-olefin-maleic anhydride copolymer is treated with a (meth) acrylic compound having a hydroxyl group such as hydroxyalkyl (meth) acrylate. A half-esterified polymer is also used.

The black photosensitive resist used in the present invention may further contain a non-photosensitive thermosetting resin or thermoplastic resin which is not cured by active energy rays.
However, since high-temperature heat treatment is performed in the manufacturing process of the color filter, it is preferable to use a resin having good resistance even in the heat treatment. Further, in the manufacturing process of the color filter, treatment with various solvents and chemicals is also performed, and therefore it is preferable to use a resin having excellent solvent resistance and chemical resistance.

Examples of the thermosetting resin and the thermoplastic resin include butyral resin, styrene-maleic acid copolymer, chlorinated polyethylene, chlorinated polypropylene, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polyacetic acid. Vinyl, polyurethane resin, phenol resin, polyester resin, acrylic resin, alkyd resin, styrene resin, polyamide resin, rubber resin, cyclized rubber, epoxy resin, celluloses, polybutadiene, polyimide resin, benzoguanamine resin, melamine resin, Examples include urea resins.

When the black photosensitive resist is cured by irradiation with ultraviolet rays to form a black matrix, the black photosensitive resist contains a photoinitiator. As a photoinitiator, 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, diethoxyacetophenone, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropan-1-one,
Acetophenone photoinitiators such as 1-hydroxycyclohexyl phenyl ketone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin Benzoin-based photoinitiators such as isopropyl ether and benzyl dimethyl ketal, benzophenone-based photoinitiators, benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4-benzoyl-4'-methyldiphenyl sulfide. Such as benzophenone-based photoinitiator, thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diisopropylthioki Thioxanthone photoinitiators such as Sanson, 2,4,6-trichloro-s-triazine, 2-
Phenyl-4,6-bis (trichloromethyl) -s-triazine, 2- (p-methoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (p-
Tolyl) -4,6-bis (trichloromethyl) -s-triazine, 2-pipenyl-4,6-bis (trichloromethyl) -s-triazine, 2,4-bis (trichloromethyl) -6-styryl s-Triazine, 2- (naphth-1-yl) -4,6-bis (trichloromethyl)-
s-Triazine, 2- (4-methoxy-naphth-1-yl) -4,6-bis (trichloromethyl) -s-triazine, 2,4-trichloromethyl- (piperonyl) -6
Compounds such as triazine, 2,4-trichloromethyl (4′-methoxystyryl) -6-triazine, and other triazine-based photoinitiators, carbazole-based photoinitiators, and imidazole-based photoinitiators are used.

The above photoinitiators can be used alone or in combination of two or more, and as the sensitizer, α-acyloxime ester, acylphosphine oxide, methylphenylglyoxylate, benzyl, 9,10 can be used. −
Phenanthrenequinone, camphorquinone, ethylanthraquinone, 4,4′-diethylisophthalophenone,
Compounds such as 3,3 ′, 4,4′-tetra (t-butylperoxycarbonyl) benzophenone and 4,4′-diethylaminobenzophenone can also be used in combination.

The black photosensitive resist used in the present invention may contain a solvent in order to sufficiently disperse the black pigment and to coat the transparent substrate with a desired film thickness. Examples of the solvent include cyclohexanone, ethyl cellosolve acetate, butyl cellosolve acetate, 1-methoxy-2-propyl acetate, diethylene glycol dimethyl ether, ethylbenzene, ethylene glycol diethyl ether, xylene, ethyl cellosolve, methyl-n amyl ketone, propylene glycol monomethyl ether toluene, methyl ethyl ketone. , Ethyl acetate, methanol, ethanol, isopropyl alcohol, butanol, isobutyl ketone, petroleum solvent and the like, and these are used alone or in combination.

The black photosensitive resist used in the present invention is coarse particles of 5 μm or more, preferably 1 μm or more, more preferably 0.5 μm or more by means of centrifugation, sintering filter, membrane filter or the like. It is preferable to remove coarse particles and mixed dust. The photosensitive black resist prepared as a solvent development type or an alkali development type is applied on a transparent substrate such as a glass plate by a coating method such as spin coating, slit coating, or roll coating. Then, after irradiating an active energy ray from the resist coated surface side through a photomask, the developer is sprayed with a solvent or an alkali developing solution or sprayed with a developing solution to remove the unexposed area, that is, the uncured area. Development is performed to form a desired black matrix pattern. The coating thickness of the black photosensitive resist is 0.2 to 5 μm.
It is preferably in the range of m (when dried), and more preferably in the range of 0.5 to 2 μm, which makes it easy to balance the coating property and the light shielding property.

As the alkaline developer, an aqueous solution of sodium carbonate, sodium hydroxide or the like is used, and an organic alkali such as dimethylbenzylamine or triethanolamine can also be used. Further, an antifoaming agent or a surfactant can be added to the developing solution. In order to increase the exposure sensitivity by the active energy ray, a black photosensitive resist is applied and dried, and then a water-soluble or alkali water-soluble resin such as polyvinyl alcohol or water-soluble acrylic resin is applied and dried to prevent oxygen from inhibiting polymerization. After forming the film, it is also possible to irradiate the active energy ray from the resist coated surface side.

As the active energy rays, electron rays, ultraviolet rays and visible light of 400 to 500 nm can be used. A thermionic emission gun, a field emission gun, or the like can be used as the source of the electron beam irradiated from the resist coated surface side. Further, as a source (light source) of ultraviolet rays and visible light of 400 to 500 nm, for example, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a metal halide lamp, a gallium lamp, a xenon lamp, a carbon arc lamp or the like can be used. Specifically, an ultra-high pressure mercury lamp and a xenon mercury lamp are often used because they are point light sources and have stable brightness. The active energy dose irradiated from the resist coated surface side can be appropriately set within the range of 5 to 1000 mJ, but is easy to manage in the process of 50 to 3
It is preferably in the range of 00 mJ.

As the source of active energy rays emitted from the transparent substrate side, various fluorescent lamps can be used in addition to the source of active energy rays emitted from the resist coated surface side. The active energy dose irradiated from the transparent substrate side is preferably 0.1 to 150% of the active energy dose irradiated from the resist coated surface side. It is more preferably from 0.1 to 90%, which is sufficient for practical use with a small amount of energy, and particularly preferably from 1 to 60%, which is easy to control in the process. If the active energy dose irradiated from the transparent substrate side is less than 0.1% of the active energy dose irradiated from the resist coated surface side, sufficient adhesion cannot be obtained, and if it exceeds 150%, the effect of improving the adhesion becomes low. The mechanism of improving the adhesion to the transparent substrate by irradiation of the active energy ray from the transparent substrate side is not clear, but the effect of improving the adhesion becomes low if the active energy dose irradiated from the transparent substrate side is not increased enough. Therefore, unlike accelerating curing by simply increasing the active energy dose,
This is probably due to some change in the curing state at the contact surface between the transparent substrate and the black matrix.

The color filter of the present invention is such that at least two color filter segments other than black are formed on the black matrix substrate manufactured by the above method. Filter segment colors are blue, green, red,
2-6 from cyan, yellow, magenta, orange, purple, etc.
Color degree is selected. Filter segments having the same color and different densities may be formed. The method of forming the filter segment on the black matrix substrate includes a gravure offset printing method, a waterless offset printing method, a silk screen printing method, a photolithography method using a solvent developing type or an alkali developing type colored resist, and an electrophoresis of colloidal particles. Examples of the method include an electrodeposition method in which the coloring material is electrodeposited on the transparent conductive film, and a transfer method in which the filter segment layer previously formed on the surface of the transfer base sheet is transferred onto the black matrix substrate.

Since the printing method can form a pattern by simply repeating printing and drying, the manufacturing method of the color filter is low in cost and excellent in mass productivity. Further, the development of printing technology enables printing of fine patterns having high dimensional accuracy and smoothness. When a color filter is manufactured by a printing method, it is important to control the fluidity of the ink on a printing machine, and the ink viscosity can be adjusted by a dispersant or an extender pigment.

In the photolithography method using a solvent-developing or alkali-developing colored resist, the colored resist is coated on a black matrix substrate by a coating method such as spin coating, slit coating or roll coating.
Next, it is a method of producing a color filter by performing ultraviolet exposure through a photomask, washing the unexposed portion with a solvent or an alkali developing solution to form a desired pattern, and then repeating the same operation for other colors. This manufacturing method can manufacture a color filter with higher accuracy than the above printing method.

The colored resist is a resist containing a colorant of a desired color in place of the black pigment contained in the black photosensitive resist used in the present invention. As the colorant, various colorants having excellent resistance are used, but light resistance,
From the viewpoint of heat resistance and solvent resistance, it is preferable to use a pigment, and it is particularly preferable to use an organic pigment because of its high light absorbing ability. Specific examples of typical pigments are shown by color index (CI) numbers. Pigment Yellow 12, 13, 14, 20, 2 can be used as a colorant for yellow.
4,83,86,93,94,109,110,11
7,125,137,138,139,147,14
8, 153, 154, 166, 173 and the like.

Examples of orange colorants include pigment oranges 13, 31, 36, 38, 40, 42, 43, 51,
55, 59, 61, 64, 65 and the like. Pigment Red 9, red and magenta colorants
97, 122, 123, 144, 149, 166, 16
8,177,190,192,215,216,22
4,254,255 and the like. Examples of purple colorants include pigment violet 19, 23, 29, 3
2, 33, 36, 37, 38 and the like.

Pigment Blue 15 (15, 15: 1, 15: 2, 15:
3, 15: 4, 15: 6, etc.), 21, 22, 60, 64
Etc. Examples of green colorants include Pigment Green 7, 10, 36, 47 and the like. These colorants may be used in combination of two or more kinds in order to obtain a desired color. Hereinafter, the present invention will be described based on examples, but the present invention is not limited thereto. In the examples and comparative examples, “parts” means “parts by weight”.
And wt% respectively.

[0028]

Example (Preparation of Acrylic Resin Solution) 800 parts of cyclohexanone was placed in a reaction vessel, heated to 100 ° C. while injecting nitrogen gas into the vessel, and styrene 60.
0 parts, methacrylic acid 60.0 parts, methyl methacrylate 6
A mixture of 5.0 parts, butyl methacrylate 65.0 parts, and azobisisobutyronitrile 10.0 parts was added dropwise over 1 hour, and the mixture was further reacted at 100 ° C. for 3 hours. A solution prepared by dissolving 2.0 parts of nitrile in 50 parts of cyclohexanone was added, and further added at 100 ° C. to 1
The reaction was continued for a time to synthesize a resin solution. After cooling to room temperature, sample about 2g of resin solution and
The nonvolatile content was measured by heating and drying for 0 minutes, and cyclohexanone was added to the resin solution synthesized above so that the nonvolatile content was 20% to prepare an acrylic resin solution. The weight average molecular weight of the acrylic resin was 40,000.

(Preparation of Black Photosensitive Resist) 8 parts of carbon black (“Pritex 75” manufactured by Degussa), 0.5 part of a dispersant, 24 parts of the acrylic resin solution, and 40 parts of cyclohexanone were uniformly mixed, and the diameter was 1 mm. After dispersing for 5 hours with a sand mill using the glass beads of
A black dispersion was prepared by filtering with a μm filter. 72.5 parts of the obtained black dispersion, trimethylolpropane triacrylate (“NK Ester ATM”, manufactured by Shin Nakamura Chemical Co., Ltd.
PT ”) 5.4 parts, photoinitiator (“ Irgacure 907 ”manufactured by Ciba-Geigy) 0.3 parts Sensitizer (“ EAB-F ”manufactured by Hodogaya Chemical Co., Ltd.) 0.2 parts, and cyclohexanone 21.6 parts After uniformly stirring and mixing the mixture of
An alkali developing black photosensitive resist was produced by filtering with a filter of m.

[Example 1] 100 mm x 100 mm,
The above black photosensitive resist was applied onto a 1.1 mm thick glass substrate using a spin coater and dried at 70 ° C. for 20 minutes. The dry film thickness of the resist was 1.0 μm.
Ultraviolet light having a light intensity of 200 mJ was irradiated from the resist coated surface side through a mask film using an ultrahigh pressure mercury lamp. Approximately 2 times this coated substrate in 2% sodium carbonate aqueous solution.
It was dipped for 0 second and developed to form a black matrix pattern. Next, ultraviolet rays having a light intensity of 40 mJ were irradiated from the glass substrate side of the coated substrate using an ultrahigh pressure mercury lamp.
Then, it heated at 230 degreeC for 1 hour, and created the black matrix substrate.

Comparative Example 1 A black matrix substrate was prepared in the same manner as in Example 1 except that the ultraviolet irradiation from the glass substrate side was not performed. [Examples 2 to 5] Black matrix substrates were prepared in the same manner as in Example 1 except that the irradiation conditions of ultraviolet rays from the glass substrate side were changed to those shown in Table 1.

[Examples 6 to 7] Carbon black was used as "MONARCH 280" manufactured by Cabot Corporation, and a photoinitiator was used as B.
A black matrix substrate was prepared in the same manner as in Example 1 except that the "Lucirin TPO" manufactured by ASF was used. [Comparative Example 2] A black matrix substrate was prepared in the same manner as in Example 6 except that the ultraviolet irradiation from the glass substrate side was not performed.

The black matrix substrates obtained in the examples and comparative examples were left for 50 hours under the conditions of 120 ° C., 100% RH and 2 atm using a pressure cooker tester, and then adhered to a substrate according to JIS K5400. The adhesiveness was evaluated by the property test method, and the number of peeled pieces was counted in 100 cross-cuts. The results are shown in Table 1.

[0034]

[Table 1]

(Preparation of red photosensitive resist) Red pigment C.I. I. Pigment Red 254 (“Irgafore Red B-CF” manufactured by Ciba-Geigy), 108 parts of the acrylic resin solution, and 10 cyclohexanones
0 parts were uniformly mixed and dispersed with a sand mill for 5 hours using glass beads having a diameter of 1 mm, and then filtered with a 5 μm filter to prepare a red dispersion. 228 parts of the obtained red dispersion, trimethylolpropane triacrylate (“NK ester ATMPT” manufactured by Shin Nakamura Chemical Co., Ltd.) 13
Part, photoinitiator (“Irgacure 90 manufactured by Ciba Geigy”
7 ") 3 parts, sensitizer (" EAB- "manufactured by Hodogaya Chemical Co., Ltd.)
F ”) and 1 part of cyclohexanone and 153 parts of cyclohexanone were uniformly stirred and mixed, and then filtered with a 1 μm filter to prepare a red resist.

(Production of Green Photosensitive Resist) Green Pigment C.I. I. Pigment Green 36 ("Rionol Green 6YK" manufactured by Toyo Ink Mfg. Co., Ltd.), a yellow pigment C.I. I. Pigment Yellow 150 ("Funcheon First Yellow Y-568" manufactured by Bayer Co., Ltd.
8 "), 102 parts of the acrylic resin solution, trimethylolpropane triacrylate (" N "manufactured by Shin-Nakamura Chemical Co., Ltd.
K ester ATMPT ") 14 parts, photoinitiator (Ciba Geigy" Irgacure 907 ") 4 parts, sensitizer (Hodogaya Chemical Co." EAB-F ") 2 parts, and cyclohexanone 257 parts are mixed to give a red color. A green photosensitive resist was prepared in the same manner as the photosensitive resist.

(Preparation of Blue Photosensitive Resist) Blue Pigment C.I. I. Pigment Blue 15: 6 (“Ryonor Blue ES” manufactured by Toyo Ink Mfg. Co., Ltd.) 30 parts, 97 parts of the acrylic resin solution, trimethylolpropane triacrylate (“NK Ester ATMP” manufactured by Shin Nakamura Chemical Co., Ltd.)
T ") 18 parts, photoinitiator (Ciba-Geigy" Irgacure 907 ") 4 parts, sensitizer (Hodogaya Chemical Co.," E "
AB-F ") 2 parts and cyclohexanone 267 parts were mixed to prepare a blue photosensitive resist in the same manner as the red photosensitive resist.

[Examples 8 to 12] Examples 1 to 3 and 6
A red photosensitive resist was applied onto the black matrix substrate prepared in steps 1 to 7 in the same manner as the black photosensitive resist and dried. Next, ultraviolet rays are irradiated (exposed) from the resist coating surface side through a photomask having a stripe-shaped opening having a width of 100 μm, the unexposed portion is rinsed with a 5% sodium carbonate aqueous solution, and hot air is blown at 230 ° C. for 30 minutes. By baking in an oven, stripe-shaped red filter segments having a width of 100 μm were formed on a black matrix substrate. Then, using a green photosensitive resist and a blue photosensitive resist, a green filter segment and a blue filter segment were sequentially formed on a black matrix substrate in the same manner as the red filter segment, to form a color filter.

[Comparative Examples 3 and 4] A color filter was prepared in the same manner as in Example 8 except that the black matrix substrates prepared in Comparative Examples 1 and 2 were changed. With respect to the color filters prepared in Examples and Comparative Examples, the adhesiveness of the black matrix portion was evaluated. The adhesiveness was evaluated in the same manner as the adhesiveness of the black matrix substrate. The results are shown in Table 2.

[0040]

[Table 2]

[0041]

According to the present invention, it is possible to manufacture a black matrix substrate having a practically sufficient adhesion with a transparent substrate. Further, by using the black matrix substrate manufactured by the method of the present invention, it becomes possible to produce a color filter having good adhesion between the black matrix and the transparent substrate and high film strength.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Gotsugu Miyamura             2-3-13, Kyobashi, Chuo-ku, Tokyo Toyo             Nki Manufacturing Co., Ltd. (72) Inventor Kazunori Yamada             2-3-13, Kyobashi, Chuo-ku, Tokyo Toyo             Nki Manufacturing Co., Ltd. F term (reference) 2H048 BA02 BA11 BA45 BA48 BA55                       BA66 BB02 BB14 BB15 BB42                 2H091 FA02Y FA35Y FB02 FB12                       FC12 FC23 FD05 FD21 GA01                       GA03 LA30                 2H096 AA30 BA05 HA03 HA30

Claims (4)

[Claims] 1. A black photosensitive resist is coated on a transparent substrate, and an active energy ray is irradiated from the black photosensitive resist coated surface side through a photomask, followed by development, and then the transparent substrate side is irradiated with the active energy ray. And a method of manufacturing a black matrix substrate. 2. The active energy dose irradiated from the transparent substrate side is 0.1 to 150% of the active energy dose irradiated from the resist coated surface side.
A method for manufacturing the black matrix substrate described. 3. A black matrix substrate manufactured by the method according to claim 1. 4. A color filter comprising a black matrix substrate according to claim 3 and filter segments of at least two colors other than black formed thereon.