JP2003151856A - Laminated electronic component and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated electronic component of a structure used for a high frequency range which can reduce an interval between terminal electrodes in order to obtain reduction in size thereof. SOLUTION: Insulators and conductors are laminated to form an element at the inside thereof, and a plurality of terminal electrodes T1 to T11 and GND are provided at the side surface thereof. Concave areas 9 are provided between the terminal electrodes T1 to T11 at the side surface and the GND to alleviate coupling between the adjacent terminal electrodes.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency laminated electronic component, and more particularly to a component suitable for use as a component constituting a mobile communication device such as a mobile phone.

[0002]

2. Description of the Related Art As a multi-band high-frequency switch module (front-end module), transmission / reception switching is performed in a branching diplexer connected to an antenna, a relatively high-frequency circuit, and a relatively low-frequency circuit. There is a miniaturized one in which a high frequency switch and a high frequency switch are configured in a chip which is one laminated electronic component.

[0003]

In the above-mentioned conventional module, since it is used in the high frequency region near GHz or higher, even a very small capacitance has a great influence on the characteristics. Therefore, it is necessary to make unnecessary coupling as small as possible, and there are particularly severe restrictions on insertion loss and the like. Therefore, even a slight coupling between the terminal electrodes is not allowed, and in order to suppress it, it is necessary to provide a sufficient space between the terminal electrodes, which makes it difficult to reduce the size.

The present invention has been made in view of the above problems of the prior art.
It is an object of the present invention to provide a laminated electronic component having a structure in which a space between terminal electrodes can be made small in a laminated electronic component used in a high frequency region, and thus a size can be reduced.

[0005]

According to another aspect of the laminated electronic component of the present invention, an insulator and a conductor are laminated to form an element inside,
Further, the laminated electronic component has a plurality of terminal electrodes provided on its side surface, characterized in that a concave portion is provided between the terminal electrodes on the side surface to reduce coupling between adjacent terminal electrodes.

As described above, when the concave portions are provided between the terminal electrodes on the side surfaces, the terminal electrodes are coupled to each other through the air layer having a low dielectric constant, so that the isolation between the terminal electrodes is enhanced. The distance between the terminal electrodes can be made smaller than before, and the size can be reduced.

According to a second aspect of the present invention, there is provided the laminated electronic component according to the first aspect, wherein the insulator is made of resin or a composite material obtained by mixing resin and functional material powder.

As described above, when a resin or a composite material is used as the insulator, that is, the base material, it is easy to obtain a base material having a lower dielectric constant than that of the ceramic chip. Therefore, an internal circuit suitable for high frequency with a small capacitance component is obtained. In addition, the capacitive coupling between the terminal electrodes becomes smaller than that of the case of using ceramics, and the miniaturization becomes easier.

According to a third aspect of the present invention, there is provided a laminated electronic component manufacturing method, wherein a sheet made of resin or a composite material obtained by mixing resin and functional material powder is laminated with a conductor, and a plurality of elements for the laminated electronic component are internally provided. A step of arranging vertically and horizontally to form a laminated substrate, and a first step for forming a terminal electrode on the laminated substrate along a position corresponding to a cutting line to each laminated electronic component after the step.
Forming a through hole, attaching a terminal electrode conductor to each of the first through holes, and after the attachment of the conductor, along a portion corresponding to the cutting line and located between the terminal electrodes. The step of forming a second through hole at a location, and cutting the laminated substrate into individual laminated electronic components along the cutting line and along the centers of the first and second through holes, A step of forming the terminal electrode conductor in the remaining portion of the first through hole as a terminal electrode and forming the remaining portion of the second through hole as a recess between the terminal electrodes.

By such a method, a recess between the terminal electrodes is formed on the side surface of the laminated electronic component at the same time as cutting, and the laminated electronic component which can be miniaturized is obtained.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a laminated electronic component, comprising a step of laminating a plurality of ceramic green sheets each having a conductor pattern for an element, a step of pressure-bonding the ceramic green sheets after the layering step, and a step of pressure-bonding the ceramic green sheets. Forming a through hole along a portion of the laminated sheet corresponding to a cutting line to each laminated electronic component, and cutting the crimped laminated sheet along the cutting line to form a portion of the through hole. A step of obtaining individual laminated electronic components so that the concave portions remain on the side surfaces of the laminated electronic component, a step of firing the individual laminated electronic components, and a terminal that sandwiches the concave portion on the side surface of the laminated electronic component after firing. And a step of providing an electrode.

[0012] Such a method is a manufacturing method for obtaining ceramics as a base body of a laminated electronic component. By this method, a recess between terminal electrodes is formed on a side surface of the laminated electronic component at the same time as cutting, thereby reducing the size. A possible laminated electronic component is obtained.

[0013]

1 is a block circuit diagram showing an example of a front end module to which the present invention is applied.
In this embodiment, the GSM system (900 MHz band) and DC
This is also used for the S system (1.8 GHz band), and an example of configuring a front end module is shown. In FIG. 1, 1 is a front end module, 2 is an antenna, T
Reference numerals 1 and T5 are terminal electrodes connected to the GSM transmission circuit and the reception circuit, respectively, and T11 and T7 are terminal electrodes connected to the DCS transmission circuit and the reception circuit, respectively. Arrows indicate the signal flow of each system.

Reference numerals 3 and 4 are low-pass filters for removing harmonics contained in DCS and GSM transmission signals, 5 is a DCS transmission / reception switch, and 6 is G.
An SM system transmission / reception switching switch 7 is a diplexer provided as a demultiplexing circuit for separating a DCS system signal and a GSM system signal.

FIG. 2 is a circuit diagram for explaining the circuit configuration of the front end module 1. In FIG. 2, T1
˜T11 are terminal electrodes provided on the outside of a laminated body 8 (see FIG. 3) described later. The terminal electrode T9 is a terminal electrode to the antenna, and the inductors L1, L2, L11 and the capacitors C1, C11, C12 configure the diplexer 7 which is a demultiplexing circuit.

Here, the diplexer 7 constitutes two notch circuits. That is, one notch circuit is formed by the inductor L11 and the capacitor C11, and the inductor L1
And the capacitor C1 constitute the other notch circuit. The one notch circuit is the capacitor C1.
2, grounded via C15. The two capacitors C12 and C15 are connected for the purpose of improving the low-pass filter characteristic of the branching characteristic. The other notch circuit is grounded via an inductor L2 and a capacitor C4 connected in series. The inductor L2 and the capacitor C4 are connected for the purpose of improving the high-pass filter characteristic of the branching characteristic.

A circuit on the side from the inductor L1 and the capacitor C1 to the terminal electrode T11 (the circuit on the right side in the drawing).
Is a circuit corresponding to the DCS system. Inductor L11
The circuit from the capacitor C11 to the terminal electrode T1 (the circuit on the left side in the drawing) is a circuit compatible with the GSM system.

In the circuit corresponding to the DCS system on the right side, T11 is a terminal electrode connected to the DCS system transmission circuit. T7 is a terminal electrode connected to the DCS type receiving circuit. T8 and T10 are terminal electrodes to which a control signal for switching the DCS transmission / reception is applied. The inductor L6 and the capacitors C6 to C8 form the low pass filter 3. Diodes D1 and D2, inductors L3 and L4, choke coil L5, and capacitors C2 to C2.
C5 and C9 constitute the transmission / reception changeover switch 5.

In the circuit corresponding to the GSM system on the left side, T1 is a terminal electrode connected to the GSM system transmission circuit. T5 is a terminal electrode connected to the GSM type receiving circuit. T2 and T4 are terminal electrodes for applying a control signal for switching transmission / reception of the GSM system. The inductor L14 and the capacitors C17 to C19 form the low pass filter 4. The diodes D11 and D12, the inductor L12, the choke coil L13, and the capacitors C13 to C16 form the transmission / reception changeover switch 6.

In this front end module,
When transmitting using the switch 6 (5), the terminal electrode T
2 (T10) by applying a positive bias voltage to the terminal electrode T
A negative bias voltage is applied to 4 (T8). This voltage acts as a forward bias voltage with respect to the diodes D11 (D1) and D12 (D2).
11 (D1) and D12 (D2) are turned on. At this time, the capacitors C13 to C16, C18, C19 (C2
-C4, C7-C9) cuts the direct current component, and the voltage applied to the terminal electrodes T2 (T10) and T4 (T8) is applied only to the circuit including the diodes D11 (D1) and D12 (D2). Therefore, inductor L12 (L4)
Is grounded by the diode D12 (D2) and resonates at the transmission frequency, and the impedance becomes almost infinite.
From the transmission circuit GSM / TX (DCS / TX) to the terminal electrode T
The transmission signal passed through 1 (T11) is the terminal electrode T5 (T7).
There is almost no transmission to the receiving circuit GSM / RX (DCS / RX) side through the diode D11 (D1).
And transmitted to the diplexer 7. Since the choke coil L13 (L5) is grounded via the capacitor C16 (C9), it resonates at the transmission frequency, the impedance becomes almost infinite, and the transmission signal is prevented from leaking to the ground side.

On the other hand, during reception, the terminal electrode T2 (T1
0) by applying a negative bias voltage to the terminal electrode T4 (T
A positive bias voltage is applied to 8). This voltage acts as a bias voltage in the reverse direction with respect to the diodes D11 (D1) and D12 (D2).
(D1) and D12 (D2) are turned off, and the reception signal from the antenna 2 passes through the inductor L12 (L4) and the terminal electrode T5 (T7) and the reception circuit GSM / RX (D
CS / RX) but not to the transmission circuit GSM / TX (DCS / TX) side of the terminal electrode T1 (T11).

In this way, the switch 6 (5) can switch the signal transmission / reception by controlling the bias voltage applied to the terminal electrodes T2, T4 (T8, T10).

The series circuit of the inductor L3 and the capacitor C5 is composed of the capacitor C5 and the diode D when it is off.
By configuring a resonance circuit that resonates with the combined capacitance of No. 1 and the value of the inductor L3, and resonating the resonance circuit at a frequency that matches the frequency of the received signal, the inductor L3 when the diode D1 is off. It is used to increase the impedance at the connection point with and to reduce insertion loss and reflection loss.

FIG. 3A is a perspective view showing the overall structure of a laminated electronic component (front end module) according to an embodiment of the present invention, and FIG. 3B is a layer structure diagram of the module. As shown in FIG. 3 (A), the front-end module includes a laminated body 8 having a laminated structure of an insulator and a conductor,
The diodes D1, D2, D mounted on the laminated body 8
11, D12, resistors R1 and R11, an inductor L3, and a capacitor C5.

Ground terminal electrodes GND are formed on both side surfaces of the laminated body 8, and five terminal electrodes T1 to T10 and ground terminal electrodes GND are formed on the side surfaces orthogonal to these side surfaces. Further, between the adjacent ones of the terminal electrodes T1 to T10 and the ground terminal electrode GND, there is provided a recess 9 for preventing coupling due to parasitic capacitance between them.

As shown in FIG. 3B, the laminated body 8 has dielectric layers 10a to 10k (dielectric constants of these layers) in which a resin in which glass cloth is buried or a resin is mixed with a dielectric powder as required. May be changed or a magnetic layer may be provided)
And the inductor conductor 1 formed on each layer and on the front and back surfaces.
1 and the capacitor electrode 12 are integrally laminated. Thirteen
Is a wiring pattern for fixing the mounted parts, and 14 is a ground electrode formed on the bottom surface of the laminated body 8. These inductor conductor 11, capacitor electrode 12, wiring pattern 1
3, conductor patterns 15a to 1 including the ground electrode 14
Another example of 5k is shown in FIG.

This laminated body 8 is generally manufactured as follows. The central layer 10f is used as a core substrate, and the conductor patterns 15f are formed on the front and back surfaces thereof by a general method by etching.
Form 15 g. Then, prepregs to be the layers 10e and 10g are superposed on the front and back surfaces of the layer 10f on which the conductor pattern is formed, and the conductor patterns 15e and 15 are formed above and below them.
The copper foils for forming h are superposed, semi-cured by hot pressing, and attached. After that, the upper and lower copper foils are patterned by etching as described above. Such work is performed up to the front and back layers 10a and 10k. By such a process, by the capacitor electrodes 12 on the front and back surfaces of the layers 10b to 10f, among the capacitors C1 to C19,
A capacitor is formed except for C5. In addition, the layer 10g ~
Inductor (including choke coil) L on the bottom surface of 10i
Among L1 to L6 and L11 to L14, inductors other than L3 are formed.

In the resin substrate thus laminated, the conductor patterns on the front and back surfaces of the substrate shown in FIG. 5A (FIG. 5A shows a part of a plurality of conductor patterns formed vertically and horizontally) are masked. Then, a first through hole 19 for forming the terminal electrodes T1 to T11 and the ground terminal electrode GND is provided by a dicer, a drill or a laser along the portions corresponding to the vertical and horizontal cutting lines 16 and 17. After that, a conductor film is attached to the first through hole 19 by plating or the like to form a conductor film to be the terminal electrodes T1 to T11 and GND on the inner wall of the first through hole 19. After that, the resist is removed, and before or after this resist removal, as shown in FIG. 5 (B), the concave portion 9 (shown in FIG. 3 (A)) is formed along the portion corresponding to the cutting line 17. Two
The through hole 20 is opened by a dicer, a drill or a laser. Here, the second through hole 20
Considering the width of the cutting line 17, it is preferable to make the slot as shown.

Then, the diodes D1, D2, D1
After mounting the mounting parts of 1, D12 and other electronic components, cutting is performed along cutting lines 16 and 17 to obtain individual chips.

Since the laminated electronic component (front-end module) thus obtained has the concave portion 9 between the terminal electrodes on the side surface, the relative dielectric constant of this portion becomes 1 and the coupling between the terminal electrodes due to the parasitic capacitance. Can be reduced.

In FIG. 6, vinyl benzyl resin is used for the dielectric layer of the laminated electronic component, the total thickness is 800 μm, the diameter of the through hole 19 serving as the terminal electrode is 400 μm, and the distance between the centers of the terminal electrodes is 1 mm. 400 between terminal electrodes
The results of the transmission characteristics with and without the concave portion 9 having a width of μm are shown by the frequency (GHz) on the horizontal axis and the isolation (dB) on the vertical axis. As can be seen from FIG. 6, in the absence of the recessed portion 9, the higher the frequency, the more the isolation cannot be obtained. On the other hand, when the concave portion 9 is provided, the attenuation degree can be improved by about 10 dB and the isolation can be improved. Thus, if the recesses 9 are provided between the terminal electrodes, the coupling between the terminal electrodes can be reduced even if the distance between the terminal electrodes is narrower than in the conventional case, so that the laminated electronic component can be miniaturized. it can.

As the resin forming each of the layers 10a to 10k, a vinylbenzyl resin with or without glass cloth embedded therein, an epoxy resin, a phenol resin, a bismaleimide triazine resin (BT resin),
Polyphenylene ether resin (PPE) or the like is used. Further, as the functional material powder mixed with these resins, BaTiO ₃ system, CaTiO ₃ system, SrTiO ₃ system is used.
₃ series, BaTiO ₃ —BaZrO ₃ series, BaO—TiO
A ceramic dielectric powder such as a _2- Nd ₂ O ₃ system, a BaO-4TiO ₂ system, an alumina system, a dielectric single crystal powder, a metal powder having a dielectric film, or the like is used. Of course, the dielectric powder and resin used in the present invention are not limited to those materials.

Further, a magnetic layer in which magnetic powder is mixed with resin may be formed in the inductor forming portion, and the magnetic powder mixed with resin may be Mn-Mg-Zn system or Ni-.
A Zn-based ferrite powder, a metal magnetic powder, a magnetic single crystal powder, a magnetic metal powder having an insulating film, or the like is used.

The conductors used for the conductor patterns 15a to 15k include silver, nickel, tin, zinc, in addition to copper.
Aluminum or the like can be used.

The present invention can also be carried out by a sheet method of laminating ceramic green sheets. Figure 7
FIG. 7 is a layout view of through holes 21 of a green sheet for forming the recess 9 when the sheet method is used. When this sheet method is used, a plurality of ceramic green sheets 22 in which conductor patterns for a plurality of laminated electronic components are vertically and horizontally arranged are laminated and pressure-bonded. A through hole 21 formed of a long hole is provided by a drill or a laser along the portion corresponding to the cutting line 17 of the pressure-bonded laminated sheet. After that, by cutting along the cutting lines 16 and 17, individual laminated electronic components are obtained such that the portions of the through holes 21 remain as concave portions 9 on the side surfaces of the laminated electronic components. Then, after baking this, the terminal electrode is baked and formed by plating.

As described above, when the laminated electronic component is made of ceramics, the ceramic chip has a low hygroscopic property, and therefore, there is an advantage that the deterioration over time is small and the characteristics are stable, but it is difficult to obtain a low dielectric constant. By providing the recesses 9, the coupling between the terminals can be reduced. On the other hand, if a laminated electronic component is realized with a resin or a laminated structure of resin and functional material powder, one with a low dielectric constant can be easily obtained, so it is easy to obtain one with a small coupling between elements or terminal electrodes at high frequencies. By the synergistic effect of providing the concave portion 9, the coupling between the terminals can be reduced, and warpage and cracks are less likely to occur as compared with the laminated sintered body, and the yield is improved.

In the present invention, the frequency used is 0.8 GHz.
Suitable for laminated electronic components used at the above high frequencies, specifically, voltage controlled oscillator, power amplifier module,
Modules such as high frequency superposition module, PLL module, oscillator module, high frequency unit, antenna-front end module, power amplifier-isolator module, tuner unit, DC-DC converter, various filters, balun transformers, couplers, antennas, transformers, etc. It can also be applied to passive element components.

[0038]

According to the present invention, in the laminated electronic component used in the high frequency region, since the recess is provided between the terminal electrodes provided on the side surfaces, it is possible to reduce the capacitive coupling between the terminal electrodes. Therefore, it is possible to reduce the distance between the terminal electrodes, and thus it is possible to reduce the size of the laminated electronic component.

[Brief description of drawings]

FIG. 1 is a block diagram of a mobile communication device module which is an example of a laminated electronic component to which the present invention is applied.

FIG. 2 is an example diagram of an equivalent circuit for realizing the module for mobile communication devices of FIG.

FIG. 3A is a perspective view showing the overall configuration of the module of the present embodiment, and FIG. 3B is a layer structure diagram of the module.

FIG. 4 is a diagram showing another example of the conductor pattern of each layer of the present module.

5A and 5B are process diagrams for forming a terminal electrode and a recess in the present embodiment.

FIG. 6 is a comparison diagram of transmission characteristics with and without a recess provided between terminal electrodes.

FIG. 7 is an explanatory diagram for forming the recess when the sheet method is used.

[Explanation of symbols]

1: front end module, 2: antenna, 3,
4: low pass filter, 5, 6: switch, 7: diplexer, 8: laminated body, 9: concave portion, 10a to 10k: dielectric layer, 11: inductor conductor, 12: capacitor electrode,
13: wiring pattern, 14: ground electrode, 15a-1
5k: conductor pattern, 16 and 17: cutting line, 19: first
Through hole, 20: second through hole, 21: through hole, 22: green sheet

Claims (4)

[Claims] 1. A laminated electronic component in which an insulator and a conductor are laminated to form an element inside and a plurality of terminal electrodes are provided on a side surface of the electronic component, which are adjacent to each other between the terminal electrodes on the side surface. A laminated electronic component having a recess for reducing coupling between terminal electrodes. 2. The laminated electronic component according to claim 1, wherein the insulator is made of resin or a composite material obtained by mixing resin and functional material powder. 3. A laminated substrate is formed by laminating a sheet made of a resin or a composite material in which a resin and a functional material powder are mixed and a conductor, and arranging a plurality of elements for laminated electronic components vertically and horizontally inside. A step of forming a first through hole for forming a terminal electrode in the laminated board along a position corresponding to a cutting line to each laminated electronic component after the step, and each of the first through holes Attaching a conductor for a terminal electrode to the substrate, forming a second through hole along a portion corresponding to the cutting line after attaching the conductor, and at a portion located between the terminal electrodes; Along the cutting line, and the first and second
By cutting into individual laminated electronic components along the center of the through hole, the conductor for terminal electrode in the remaining portion of the first through hole is formed as a terminal electrode, and the remaining portion of the second through hole is formed. Forming a recess between the terminal electrodes. 4. A step of laminating a plurality of ceramic green sheets on which a conductor pattern for an element is formed, a step of crimping the ceramic green sheets after the laminating step, and a step of pressing the laminated sheets to individual laminated electronic components. A step of forming a through hole along a portion corresponding to the cutting line, and by cutting the pressure-bonded laminated sheet along the cutting line, the portion of the through hole remains as a recess on the side surface of the laminated electronic component. As described above, including a step of obtaining individual laminated electronic components, a step of firing the individual laminated electronic components, and a step of providing terminal electrodes so as to sandwich the recesses on the side surfaces of the laminated electronic components after firing. And a method for manufacturing a laminated electronic component.