JP2003151838A - Coil unit and module part mounting with the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce a module part in size. SOLUTION: A module part 2 is equipped with a circuit board 7 and a plurality of terminals 13 arranged in array on side edge of the circuit board 7. The side edge of the circuit board 7 where the terminals 13 are arranged in array is usually designated as a part-mounting inhibiting region α due to manufacturing problems. Some of core members 4a and 4b and coil pattern 3 of a coil unit 1 are mounted in the part-mounting inhibiting region α for the formation of the coil unit 1. Since some of the coil unit are arranged in the part-mounting inhibiting region α serving as a dead space, the dead space can be reduced. The circuit board 7 can be reduced in size, and a reduction in size of the module part 2 can be promoted. Even if the coil unit 1 is formed in the part-mounting inhibiting region α, the manufacturing problems can be prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coil device such as a transformer and an inductor, and a module component equipped with the coil device.

[0002]

BACKGROUND ART FIG. 9A schematically shows an example of a coil device incorporated in a module component.
In (b), an exploded view of the coil device is shown. The coil device 1 is mounted on a module component 2 such as a switching power supply module and functions as, for example, a transformer or an inductor. The coil device 1 includes a coil pattern 3, a pair of core members 4a and 4b, and a core combination member 5.

The coil pattern 3 is formed on the circuit board 7 constituting the module component 2, and a part of the coil pattern 3 is sandwiched by the core members 4a and 4b from both front and back sides of the circuit board 7.

In the example shown in FIG. 9, core members 4a and 4b are provided.
Both have three core feet 8a, 8b, 8 on the base surface 9
c is a substantially E-shaped core member that is arranged upright with an interval therebetween. The core legs 8a and 8c at both ends of the core members 4a and 4b are arranged outside the formation region of the coil pattern 3, respectively. Also, the central core foot 8
b is arranged in the center of the formation region of the coil pattern 3.

Core foot insertion holes 10a, 10b, 10c are formed in the circuit board 7 at positions corresponding to the positions of the core feet 8a, 8b, 8c of the core members 4a, 4b, respectively. Each of the core legs 8a, 8b, 8c on one side of the core members 4a, 4b (core member 4a in the illustrated example) is the circuit board 7
The core legs 8a, 8b, 8c on the other side (core member 4b) are inserted into the corresponding core leg insertion holes 10a, 10b, 10c from the back side of the circuit board 7, respectively. . Thereby, each core foot 8a, 8b, 8c
The tip surfaces of the are abutted against each other.

As the core combination member 5, for example, both the core members 4a and 4b are fitted from the front surface side of the circuit board 7 and the core members 4a and 4b are combined and mounted on the circuit board 7.

A module component 2 incorporating such a coil device 1 is constituted, for example, by having a circuit board 7 and a plurality of terminals 13 arranged and arranged at the edge of the circuit board. In addition to the coil device 1, other components 12 and a circuit pattern (not shown) are formed on the circuit board 7 to form a circuit. The circuit formed on the circuit board 7 can be connected to an external circuit by utilizing the terminal 13.

By the way, the module component 2 can be manufactured as follows. First, a parent board 15 as shown in FIG. 6A is prepared. The parent board 15 is formed by cutting out a plurality of circuit boards 7 of the module component 2, and a plurality of circuit board forming regions 16 are arranged.

As shown in FIG.
As shown in FIG. 5, a circuit pattern (not shown), a coil pattern 3, and a core foot insertion hole 10 are formed in each circuit board formation region 16, and the component 12 is mounted by soldering, for example. Furthermore, the core device 4 is assembled by mounting the core members 4a and 4b on the coil pattern 3 of each circuit board formation region 16 using the core combination member 5. As a result, the circuit of the module component 2 is formed in each circuit board formation region 16.

Then, after that, the parent board 15 is cut along the boundary line of each circuit board formation region 16 to cut out a plurality of circuit boards 7 on which circuits have been formed.

Thereafter, the terminal 13 is attached to the end surface of the circuit board 7. For example, as shown in FIG. 7, the terminal 13 has a clip-shaped portion to be attached to the circuit board 7, and the end portion of the circuit board 7 is sandwiched by the clip so that the terminal 13 is fixed to the circuit board 7. Can be installed.

Then, as shown in FIG.
The edge portion of the circuit board 7 on which the
It is dipped in the solder melt 19 in 8. As a result, the terminal 13
Solder adheres to the clip part of. After that, the solder is cooled and solidified to connect the terminals 13 to the circuit board 7 by soldering.

In this way, the module component 2 can be manufactured.

[0014]

By the way, there is a demand for miniaturization of the module component 2, and various methods have been proposed to meet this demand. However, further miniaturization has been demanded, and a new method for meeting this demand is desired.

An object of the present invention is to provide a coil device which can reduce the size of module parts and a module part equipped with the coil device.

[0016]

In order to achieve the above object, the present invention has the following constitution as means for solving the above problem. That is, the first invention is
A coil device comprising: a coil pattern formed on a circuit board; a pair of core members that sandwich at least a part of the coil pattern from both front and back sides of the circuit board; and a core combination member that combines the pair of core members. And at least a part of the core member is arranged and formed so as to enter a preset component mounting prohibited area of the edge portion of the circuit board, and at least one of the pair of core members has a plurality of core legs on the base surface portion. This core member has a configuration in which the core members are arranged in a direction along the edge of the circuit board, and one core leg is positioned at the center of the coil pattern forming region. The other core foot is located outside the coil pattern forming area and is disposed on the circuit board.

A second invention comprises the structure of the first invention,
At least one of the pair of core members has 3
The core legs of the book are formed into a substantially E-shaped core member in which the core legs are arranged to be spaced apart from each other, and the substantially E-shaped core member has the core legs arranged in the edge direction of the circuit board. The core feet in the center are located in the central part of the coil pattern forming area, and the core feet at both ends are located outside the coil pattern forming area and are arranged on the circuit board. However, the base surface portion of the core member has a width in the depth direction that is substantially orthogonal to the arrangement direction of the core feet to be equal to or larger than the outer diameter in the depth direction of the coil pattern, and the base surface portion covers the entire surface of the coil pattern. It is characterized by being made.

A third invention comprises the structure of the first invention,
At least one of the pair of core members is a substantially U-shaped core member in which two core legs are erected on the base surface portion,
In this substantially U-shaped core member, the arrangement direction of the core legs is along the edge of the circuit board, one core leg is located at the center of the coil pattern forming region, and the other core leg is coiled. The base member of the core member is located outside the pattern formation region and is arranged on the circuit board. The base member of the core member has a width in the depth direction that is substantially perpendicular to the arrangement direction of the core legs and an outer diameter in the depth direction of the coil pattern. It is characterized by the above.

A fourth aspect of the invention has the structure of the second or third aspect of the invention, in which the outer core foot located outside the coil pattern forming region has a width in the depth direction substantially equal to the width of the base surface in the depth direction. The end faces of the core foot and the end face of the base surface portion which are equally formed are arranged on substantially the same plane, and the core foot on the center side located in the center of the coil pattern forming region has a width in the depth direction in the depth direction of the base surface portion. It is formed to be narrower than the width and is recessed from the end face of the base surface part, and a notch is formed in the edge portion of the circuit board through which the outer core leg of the core member is inserted, and the center of the core member is formed. A core foot insertion hole through which the core foot on the side is inserted is formed, and the core member is arranged such that the end surface of the base surface portion and the end surface of the outer core foot are substantially flush with the end surface of the circuit board. It has a feature.

A fifth aspect of the invention comprises the structure of any one of the first to fourth aspects of the invention, wherein the core combination member is attached to the pair of core members from the front surface side or the back surface side of the circuit board to form a pair of core members. It is characterized in that the core member is combined.

According to a sixth aspect of the present invention, in a module component having a circuit board and a plurality of terminals arranged in an edge portion of the circuit board, an edge portion of the circuit board in which the plurality of terminals are arranged is arranged. , A component mounting prohibited area for prohibiting component mounting, and an intermittent portion of an array of terminals is provided at an edge portion of the circuit board, and the intermittent portion has any one of the first to fifth inventions. It is characterized in that at least a part of the coil device of the one invention is arranged so as to be inserted.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In the description of this embodiment, the same components as those of the coil device and the module parts described above are designated by the same reference numerals, and duplicate description of the common portions will be omitted.

The present inventor has paid attention to the following points.
The coil device and module parts of this example embodiment have been devised.

Up to now, in the module component 2 as shown in FIG. 9, for example, the edge portion α where the terminals 13 are arranged is a region where the component mounting is prohibited. That is, the edge portion α connects the terminal 13 to the circuit board 7
It is a portion to be dipped in the solder melt 19 for soldering. Therefore, if the component 12 is mounted on the edge portion α of the circuit board 7 using solder, the solder between the component 12 and the circuit board 7 melts when immersed in the solder melt 19. ,
This is because the component 12 will fall off the circuit board 7. Generally, the edge portion α of the circuit board 7 is considered as a component mounting prohibited area in which any component should not be provided, and is a dead space.

On the other hand, the inventor has noticed the following points. That is, since the surface of the coil pattern 3 of the coil device 1 is protected by resist or the like, the coil pattern 3 is not easily affected by the molten solder, and the core members 4a and 4b are made of, for example, ferrite. It has been found that the core combination member 5 can be easily made of a material that is not easily influenced by solder. Based on these points of interest, the inventor of the present invention arranges at least a part of the coil device 1 at the edge portion α of the circuit board 7 which has been considered to be a component mounting prohibited area, which is an epoch-making breakthrough. Figured out the composition.

That is, FIG. 1 (a) schematically shows the main components of one embodiment of the coil device and module component according to the present invention, which are extracted and schematically shown in FIG. 1 (b). The exploded view of the coil device of (a) is shown typically. A characteristic of this embodiment is that the coil device 1 is arranged such that a part of the core members 4a and 4b and the coil pattern 3 is inserted into the component mounting prohibited area α of the circuit board 7. In other words, the coil device 1 has a configuration in which a part of the coil device 1 is placed in the component mounting prohibited area α which has been a dead space until now.
As a result, the dead space of the circuit board 7 can be reduced, and the module component 2 can be easily downsized.

In this embodiment, in order to reduce the dead space of the circuit board 7 as much as possible, the following specific structure is provided. For example, at the edge of the circuit board 7 where the plurality of terminals 13 are arranged, the terminals 1
Intermittent portions of the three arrays are provided. A part of the coil pattern 3 of the coil device 1 is formed so as to enter the intermittent portion. Further, a core foot insertion hole 21 is formed at the center of the formation area of the coil pattern 3 at the edge of the circuit board 7. The core foot insertion hole 21 is a hole for inserting the central core foot 8b of each of the substantially E-shaped core members 4a and 4b.

Further, the terminal 1 is provided at the edge of the circuit board 7.
Notches 22 and 23 are formed in the intermittent portions of the arrangement of 3 so as to sandwich the formation region of the coil pattern 3. These notches 22 and 23 are for inserting the core legs 8a and 8c of the core members 4a and 4b, respectively. In this embodiment, the cut depths L of the cuts 22 and 23 are substantially equal to the width H of the core feet 8a and 8c in the depth direction (direction substantially orthogonal to the arrangement direction of the core feet 8a, 8b and 8c). Is formed in.

In this embodiment, the core members 4a, 4b
In, the base surface portion 9 and the core feet 8a and 8c at both ends are
The widths H in the depth direction are formed to be substantially equal. As a result, the end surface of the base surface portion 9 and the end surfaces of the core feet 8a and 8c at both ends are arranged substantially on the same plane. Further, the central core foot 8b is formed such that the width h in the depth direction is narrower than the width H in the depth direction of the base surface portion 9, and the central core foot 8b is arranged so as to be retracted from the end surface of the base surface portion 9. There is.

When assembling such core members 4a and 4b into the circuit board 7, for example, the core feet 8a of each of the core members 4a and 4b are formed in the notches 22 and the core feet 8b on the center side are made into the core feet 8a. The core legs 8c are further inserted into the insertion holes 21 and the notches 23, respectively. As a result, the tip surfaces of the core legs 8a, 8b, 8c are butted against each other, and then the core members 4a, 4b in this state and the core combination member 5 described later are fitted together. As a result, the core members 4a and 4b can be incorporated in the circuit board 7. That is, the core members 4 a and 4 b are arranged so that the arrangement direction of the core legs 8 a, 8 b, and 8 c is along the end edge of the circuit board 7 in the state of being incorporated in the circuit board 7. Also,
Core feet 8 on both ends of each of the core members 4a and 4b
a and 8c are arranged outside the formation area of the coil pattern 3, and the central core foot 8b is formed on the coil pattern 3
Will be arranged in the central portion of the formation region.

Furthermore, in this embodiment, when the pair of core members 4a and 4b are thus incorporated in the circuit board 7, the core legs 4a and 4b are provided with end faces of the base surface portion 9 and core feet at both ends. Circuit board 7 and end surfaces of 8a and 8c
And the end surface of is arranged substantially on the same plane.

In this embodiment, the core combination member 5 is a combination of a pair of core members 4a and 4b. Here, a pressing force is applied to the core members 4a and 4b so that each core leg 8a, 8b, 8c. It is provided with a structure for pressing the tip surfaces of the two members into contact with each other.

By the way, a core combination member as shown in FIG. 10 has been proposed. The proposed core combination member 30 has a clip shape, and has a configuration in which the pair of core members 31a and 31b are sandwiched from the lateral direction of the circuit board 32 to combine the core members 31a and 31b. When such a core combination member 30 is used, in the manufacturing process of the module component,
For example, after cutting a parent board as shown in FIG. 6A and dividing and separating each circuit board 32, a pair of core members 31a and 31b are respectively attached to each circuit board 32 by using the core combination member 30. Will be incorporated.

In this case, since the core members 31a and 31b are attached in the state of the circuit board 32 which is significantly smaller than the parent board, compared to the case of attaching the core member in the state of the parent board, It becomes difficult to attach the core member.

Further, in the manufacturing process, after the pair of core members are attached to the circuit board, the operation confirmation inspection of the circuit formed on the circuit board is performed. When the core combination member 30 is used, the core members 31a and 31b are separated from each circuit board 32 and then the circuit board 32 is removed.
Since the circuit boards 32 are attached to each of the circuit boards 32, the circuit operation confirmation inspection can be performed only after the circuit boards 32 are separated. In this case, one inspection is performed for each circuit board, which is inefficient and troublesome.

In this embodiment, the core combination member 5 is provided on the front surface side or the back surface side of the circuit board 7 in order to enable the attachment work of the core member and the operation confirmation inspection of the circuit in the state of the mother board. To core members 4a, 4b
It has a structure in which the core members 4a and 4b are attached to each other and combined.

Further, in this embodiment, the core combination member 5 is made of a material (for example, stainless steel) on the surface of which molten solder is hard to adhere.

In this embodiment, the core combination member 5 is attached to the pair of core members 4a, 4b from the front surface side or the back surface side of the circuit board 7 and the core members 4a, 4b.
The form is not particularly limited as long as it has a configuration in which b can be combined. However, the core combination member 5 is made of an elastic material, and the elasticity is utilized to move the core combination member 5 to the core members 4a,
It is preferable to apply a pressing force to 4b. In this case, from the core combination member 5 to the core members 4a, 4
It becomes easy to apply an appropriate pressing force to b, and problems due to excessive pressing force and problems due to insufficient pressing force can be prevented.

By the way, conventionally, as shown in FIG. 9A, for example, the core members 4a and 4b are configured to cover a part of the coil pattern 3. In other words, part of the coil pattern 3 is covered with the core members 4a and 4b, and the other part is exposed. Therefore, the radiation noise from the coil pattern 3 is easily increased.

In consideration of this, in this embodiment, the width H of the base surface portion 9 of each core member 4a, 4b in the depth direction is equal to or larger than the outer diameter D of the coil pattern 3 in the depth direction. (See FIG. 1B). Thereby, the base surface portion 9 is configured to cover the entire surface of the coil pattern 3. With this configuration, radiation noise from the coil pattern 3 can be significantly reduced.

The present invention is not limited to the form of this embodiment, and various embodiments can be adopted. For example, on the circuit board 7, not only the edge portion where the plurality of terminals 13 are arranged and arranged but also the edge portion where the terminals 13 are not formed and arranged as shown in FIG. Area β is set. The coil device 1 may be arranged such that the core members 4a, 4 and a part of the coil pattern 3 are inserted into the component mounting prohibited area β.

In this embodiment, one coil device 1 is arranged on the circuit board 7 of the module component 2, but the coil device 1 arranged on the circuit board 7 is arranged on the circuit board 7. It is provided as appropriate according to the circuit configuration to be formed, and two or more coil devices 1 may be provided on the circuit board 7.

Further, in this embodiment, the core member 4
Both a and 4b were E-shaped cores having a substantially E shape,
For example, as shown in FIG. 3A, the core members 4a,
One side of 4b may be an E-type core, and the other side may be an I-type core without core legs. Alternatively, as shown in FIG. 3B, an EER type core may be used in which the central core leg 8b of the substantially E-shaped core members 4a and 4b has a cylindrical shape.

Further, the core members 4a, 4b may be substantially U-shaped core members having two core legs 8a, 8b as shown in FIG. In the substantially U-shaped core members 4a and 4b, one core leg 8a has a coil pattern 3
Of the coil pattern 3 is arranged outside the formation area of the circuit pattern 7, and the other core leg 8b is arranged in the central portion of the formation area of the coil pattern 3, and, for example, as shown in FIG. It is installed.

Also in the substantially U-shaped core members 4a and 4b, the coil pattern 3 is formed as in this embodiment.
In order to reduce the radiant noise from the base surface portion 9, the width H of the base surface portion 9 in the depth direction is formed to be equal to or larger than the outer diameter D of the coil pattern 3 in the depth direction, and the area of the portion where the coil pattern 3 is covered by the base surface portion 9. The configuration may be enlarged.

Further, the outer core foot 8a is formed so that the width in the depth direction substantially matches the width in the depth direction of the base surface portion 9, and the center core foot 8b has the width in the depth direction as the depth of the base surface portion 9. The width may be narrower than the width in the direction, and the base surface portion 9 may be retracted from the end surface. In the case of adopting the substantially U-shaped core members 4a and 4b, as shown in FIG. 4C, each core member 4a is provided at the edge of the circuit board 7 as in this embodiment. , 4b outer core foot 8a
Is provided with a notch 22 for inserting the core foot through which
The core foot insertion hole 21 through which the central core foot 8b is inserted may be provided, and the core members 4a and 4b may be arranged on the circuit board 7 so that the end surfaces thereof are substantially flush with the end surface of the circuit board 7.

Furthermore, in this embodiment, the circuit board 7
The core feet 8 at both ends of the core members 4a and 4b.
Notches 22 and 23 for inserting core feet through which a and 8c are inserted
However, instead of the notches 22 and 23, the core legs 8a and 8c are formed as shown in FIG.
The core foot insertion holes 24 and 25 through which the holes are inserted may be provided. In this case, the pair of core members 4a and 4b may be, for example, as shown in FIG.
It will be incorporated in the circuit board 7 as shown in FIG.

Furthermore, in this embodiment, the core combination member 5 is made of stainless steel, but the core combination member 5 may be made of a material that does not adhere molten solder to the surface, for example, on the surface of copper, The core combination member 5 may be formed by coating a material to which molten solder does not adhere.

Further, in this embodiment, the core combination member 5 is attached to the core members 4a and 4b from one side of the front surface side or the back surface side of the circuit board 7 and the core member 4 is attached.
The core combination member 5 is, for example, two members, one arranged on the front surface side of the circuit board 7 and one arranged on the rear surface side of the circuit board 7. And the core members 4a and 4b are sandwiched between the front and back sides of the circuit board 7.
A configuration in which a and 4b are combined may be used.

Further, in this embodiment, the coil device 1 is arranged so as to partially enter the component mounting prohibited area α. However, for example, when the coil device 1 is small, the coil device 1 is, of course, The entire device 1 may be arranged in the component mounting prohibited area α.

[0051]

According to the present invention, at least a part of the coil pattern and the core member is formed so as to enter the part mounting prohibited area of the edge portion of the circuit board. Since a part of the coil device is formed in the component mounting prohibited area which has been a dead space up to now, the dead space can be reduced. As a result, the circuit board can be downsized, and the module component can be downsized.

The core member is substantially E-shaped, and in the case where the base surface of the core member covers the entire surface of the coil pattern, the radiation noise from the coil pattern can be significantly reduced. . Further, in the case where the core member is substantially U-shaped and the width of the base surface portion of the core member in the depth direction is equal to or greater than the outer diameter of the coil pattern in the depth direction, the coil pattern of the coil pattern covered by the base surface portion is formed. Since the area is enlarged, the radiation noise from the coil pattern can be reduced.

When the core member is arranged such that the end face of the base surface portion and the end faces of the outer core legs are substantially flush with the end face of the circuit board, the core member is brought close to the end of the circuit board. It is possible to further arrange the circuit board and to further reduce the dead space of the circuit board.

In the core combination member, which is mounted on the pair of core members from the front surface side or the back surface side of the circuit board to combine the pair of core members,
In the manufacturing process of module parts, coil patterns are formed in each circuit board formation area while the parent board before cutting the circuit board of the module parts is used, and the core member is used as the core pattern for the coil pattern. Can be installed. Since the core member can be attached in the state of the parent board in this manner, the work efficiency can be improved.
In addition, since the operation confirmation inspection of the circuit including the coil device can be performed in the state of the parent board, the inspection can be performed easily and the inspection efficiency can be improved.

A circuit board on which a plurality of terminals are arranged is provided with an intermittent portion in which terminals are arranged, and at least a part of the coil device is inserted into the intermittent portion. In this case, the coil device can be arranged at the edge of the circuit board even at the edge where the plurality of terminals are arranged, and the dead space can be reduced. As a result, it is possible to significantly reduce the size of the module component.

[Brief description of drawings]

FIG. 1 is a main part configuration diagram showing an embodiment of a coil device and a module component according to the present invention.

FIG. 2 is a diagram for explaining another embodiment example.

FIG. 3 is a model diagram showing another example of the shape of the core member.

FIG. 4 is a diagram for explaining an example of a substantially U-shaped core member.

FIG. 5 is a diagram for explaining another embodiment example.

FIG. 6 is a diagram for explaining an example of a manufacturing process of a module component.

FIG. 7 is a view for explaining an example of the manufacturing process of the module component, following FIG. 6;

FIG. 8 is a view for explaining an example of the manufacturing process of the module component, following FIG. 7.

FIG. 9 is a model diagram showing a conventional example of a coil device and a module component.

FIG. 10 is a model diagram showing another conventional example of the coil device.

[Explanation of symbols]

1 coil device 2 module parts 3 coil pattern 4a, 4b core member 5 core combination member 7 circuit board 8a, 8b, 8c core foot 9 Base surface 21 core foot insertion hole 22,23 notches

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 4E351 BB09 BB11 BB15 GG20                 5E070 AA01 AA11 CB03 CB12                 5E338 BB80 CC10 CD17 EE22

Claims (6)

[Claims] 1. A coil having a coil pattern formed on a circuit board, a pair of core members sandwiching at least a part of the coil pattern from both sides of the circuit board, and a core combination member that combines the pair of core members. In the device, at least a part of the coil pattern and the core member are arranged and formed so as to enter the preset component mounting prohibited area of the edge portion of the circuit board, and at least one of the pair of core members is formed on the base surface portion. The plurality of core legs are arranged to be spaced apart from each other, and the core member has a direction in which the core legs are arranged along the edge of the circuit board, and one core leg is formed into a coil pattern forming region. Is disposed on the circuit board with the other core leg positioned outside the coil pattern formation region. And coil device. 2. At least one of the pair of core members is a substantially E-shaped core member in which three core legs are arranged and formed on a base surface portion with a space therebetween. The E-shaped core member is such that the arrangement direction of the core feet is along the edge of the circuit board, the central core feet are located in the central part of the coil pattern forming region, and the core feet at both ends are respectively The base member of the core member is positioned outside the coil pattern forming region, and the base surface of the core member has a width in the depth direction that is substantially perpendicular to the arrangement direction of the core legs in the depth direction of the coil pattern. 2. The coil device according to claim 1, wherein the base surface portion has an outer diameter or more, and the base surface portion covers the entire surface of the coil pattern. 3. At least one of the pair of core members is a substantially U-shaped core member in which two core legs are erected on a base surface portion, and the substantially U-shaped core member comprises: The arrangement direction of the core feet is along the edge of the circuit board, and one core foot is located in the center of the coil pattern forming area, and the other core foot is located outside the coil pattern forming area. The base member of the core member has a width in a depth direction substantially orthogonal to the arrangement direction of the core legs and is equal to or larger than an outer diameter in the depth direction of the coil pattern. The coil device according to claim 1. 4. The outer core foot located outside the coil pattern forming region is formed such that the width in the depth direction is substantially equal to the width in the depth direction of the base surface portion, and the end surface of the core foot and the end surface of the base surface portion are substantially formed. The core feet on the center side, which are arranged on the same plane and located in the center of the coil pattern forming area, are formed such that the width in the depth direction is narrower than the width in the depth direction of the base surface portion, and the core feet are recessed from the end surface of the base surface portion. The circuit board is provided with a notch at the edge of the circuit board, through which the outer core foot of the core member is inserted, and a core foot insertion hole is formed through which the core foot on the center side of the core member is inserted. 3. The core member is arranged such that the end surface of the base surface portion and the end surface of the outer core foot are substantially flush with the end surface of the circuit board.
Alternatively, the coil device according to claim 3. 5. The core combination member is configured to be mounted on the pair of core members from the front surface side or the back surface side of the circuit board to combine the pair of core members. The coil device according to any one of 1. 6. A module component having a circuit board and a plurality of terminals arranged in an edge portion of the circuit board, wherein the edge portion of the circuit board in which the plurality of terminals are arranged is mounted with a component. 6. The component mounting prohibition region for prohibiting the above is formed, and an intermittent portion of an array of terminals is provided at an edge portion of the circuit board, and the intermittent portion has any one of claims 1 to 5.
7. A module component, wherein at least a part of the coil device according to claim 3 is arranged so as to be inserted.