JP2003149833A - Transfer member, method for manufacturing the same, electronic parts and pattern forming method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transfer member which suppresses defective formation and defective transfer of an electric conductor and can form and transfer a fine pattern and to provide a method for manufacturing the transfer member, electronic parts adaptable to high frequency and a pattern forming method. SOLUTION: In the transfer member comprising a base plate 11, at least the surface of which has electric conductivity, and an insulating layer 12 disposed on the base plate 11 and formed in a prescribed pattern and having transfer regions 15 in which the base plate 11 is exposed in the insulating layer 12, wherein a transfer pattern is formed in the transfer regions 15, an insulator releasing layer 17 is disposed on the surface of the insulating layer 12 by irradiating the surface of the insulating layer 12 with an energy beam.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer member for producing a conductive pattern and a method for producing the transfer member, and by using the transfer technique, it is possible to improve the size and thickness of digital electronic equipment. The present invention relates to an electronic component and a pattern forming method, which are one of noise suppression components that suppress noise from a densely mounted circuit board.

[0002]

2. Description of the Related Art Electroforming techniques for forming the same conductor as a transfer member have been widely used. Also, during electroforming, it was common to peel off the insulating layer and transfer only the conductor, but the method of transferring without peeling the insulating layer has also been developed, and continuous use of transfer members is possible. It was

Hereinafter, a conventional transfer member and a laminated chip component as an electronic component will be described with reference to the drawings.

FIG. 9 is a sectional view of a conventional transfer member.

As shown in FIG. 9, a conventional transfer member is provided with an insulating layer on the upper surface of a conductive base plate 11 and an insulating layer 1 having a predetermined pattern except for the insulating material in the transfer area 15.
Two are provided. By impregnating this transfer member in a plating solution and energizing the base plate 11, the base plate 1
A conductive film 18 having a predetermined pattern was formed on the transfer member by forming a plating film on the transfer region 15 surrounded by the first insulating layer 12. The transfer object 19 was pressure-bonded to the surface of the transfer member on which the conductor was formed, the conductor was pulled out from the transfer region 15, and the conductor was transferred to the transfer object. By embedding the conductor thus formed in an object to be transferred, an internal conductor and an extraction electrode are provided, and an external electrode is formed on an end face to form a laminated chip component.

[0006]

However, in the above-mentioned conventional transfer member, when the conductor 18 is formed as shown in FIG. 10 (especially when it is immersed in the plating solution for the first time), the plating of the surface of the base plate in the transfer region is performed. The wettability with the liquid is poor, and when the insulating layer on the transfer area on the surface of the base plate 11 is removed, a part of the insulating layer remains as an insulator residue 16 and, as a result, the formation of a conductor is hindered. Therefore, there is a problem that the conductor 18 is not accurately formed.

Therefore, in the case of a fine pattern, it was difficult to form an accurate conductor. For this reason, the transfer member was degreased, but a clean transfer area of the base plate surface without insulating residue could not be obtained.

As another problem, even when the conductor is accurately formed as shown in FIG. 11, when the conductor 18 is transferred to the transfer object, the insulating layer 12 and the transfer object 19 are simultaneously pressed to each other. In addition to the problem that the transfer target object 19 is transferred to the insulating layer 12 of the transfer member and destroyed due to the close contact with the product, the insulating layer 12 of the transfer member is transferred to the transfer target object 19, There is a problem that the insulating layer of the transfer member is peeled off and the transfer member is destroyed.

The present invention solves the above-mentioned problems of the prior art. A transfer member capable of forming and transferring a fine pattern by reducing formation defects and transfer defects of conductors, a method of manufacturing the same, and an electronic device capable of handling high frequencies. It is intended to provide a component and a pattern forming method.

[0010]

SUMMARY OF THE INVENTION The present invention comprises at least a conductive base on the surface and an insulating layer formed on the base and having a predetermined pattern, and a transfer region in which the base is exposed is provided between the insulating layers. A transfer member which is provided and forms a transfer pattern in the transfer area, and a release layer is provided on the surface of the insulating layer by irradiating the surface of the insulating layer with energy rays.

[0011]

According to a first aspect of the present invention, there is provided a base having conductivity at least on a surface thereof, and an insulating layer formed on the base and having a predetermined pattern, and the base is provided between the insulating layers. A transfer member having an exposed transfer area and forming a transfer pattern in the transfer area, wherein a release layer is provided on the surface of the insulating layer by irradiating the surface of the insulating layer with energy rays. By using the transfer member as described above, it is not necessary to apply another member to form the mold release portion, and the productivity is improved, and moreover, the surface of the insulating layer is irradiated with energy rays. Since the insulator residue in the transfer region can be removed, the conductor having good characteristics can be transferred reliably and without damaging the conductor pattern. In addition, since the mold release portion is provided, it is possible to prevent a part of the insulating layer from adhering to the transferred body.

According to a second aspect of the invention, the transfer layer according to the first aspect is characterized in that the insulating layer is a positive photoresist, so that the insulating layer can be easily patterned.

According to a third aspect of the present invention, the width W of the transfer area is 4 μm to 15 μm, and when the depth of the transfer area is t, t / W is 1.0 or more. By using the transfer member according to item 1, it is particularly suitable for forming a fine pattern of a conductor, and moreover, damage to the conductor can be reduced.

According to a fourth aspect of the present invention, an insulating layer is formed on at least a surface of the base having conductivity, and the insulating layer is patterned and processed into a predetermined shape to expose a part of the base. A transfer region is formed, and an insulating material residue existing in the transfer region is removed by irradiating the insulating layer with an energy ray, and a release part is formed on the surface of the remaining insulating layer. By using the manufacturing method of the member, the mold release portion can be formed without providing a separate member,
Moreover, since the insulator residue can be removed, the workability is improved and the productivity is improved.

According to a fifth aspect of the present invention, the insulating layer is composed of a photoresist, a photoresist film is formed on the base, a mask is covered, the first ultraviolet ray is irradiated, and development is performed to insulate a predetermined pattern. By providing a layer and then irradiating a second ultraviolet ray having a shorter wavelength than the first ultraviolet ray,
By removing the insulator residue and forming a mold release portion on the surface of the remaining insulating layer, the method for producing a transfer member according to claim 4, wherein the patterning of the insulating layer is easy, Moreover, since ultraviolet rays having different wavelengths are used, the manufacturing process is simplified.

According to a sixth aspect of the present invention, there is provided an electronic component comprising a base body, an element body provided on the base body, and a terminal portion electrically connected to the conductor. Item 1. An electronic component characterized in that a conductor is formed in the transfer region of the transfer member, and the conductor is transferred onto a substrate, thereby forming an element part having a fine pattern. Since it can be formed, performance can be improved and miniaturization can be realized.

According to a seventh aspect of the present invention, there is provided an electronic component according to the sixth aspect, wherein the base is formed by laminating sheets, and the element body is sandwiched between the sheets.
Since it is possible to provide a plurality of element bodies in one substrate, it is possible to easily adjust the characteristics and downsize the electronic component.

According to an eighth aspect of the invention, the sheet is made of a magnetic material, and the element body is made of a spiral conductor, so that the electronic component capable of improving noise in a high frequency range can be improved. You can get the parts.

According to a ninth aspect of the present invention, an insulating layer is formed on at least a surface of the base having conductivity, and the insulating layer is patterned and processed into a predetermined shape to expose a part of the base. A transfer region is formed, and an insulating material residue existing in the transfer region is removed by irradiating the insulating layer with an energy beam, and a transfer member having a release part formed on the surface of the remaining insulating layer is prepared. By forming a conductor on the transfer area and then pressing the transfer member against the transfer target to transfer the conductor onto the transfer target, a fine pattern is formed. Since the conductor can be formed and the conductor is not damaged, it is possible to obtain a wiring board or an electronic component having improved characteristics.

A transfer member according to an embodiment of the present invention and a laminated chip inductor, which is a kind of electronic component manufactured by using the transfer member, will be described as an example with reference to the drawings.

FIG. 1 is a sectional view showing a transfer member according to an embodiment of the present invention, and FIG. 2 is a sectional view showing a method of manufacturing the transfer member.

The transfer member is an insulating layer 12 made of an insulating material that forms a predetermined pattern on the upper surface of the base plate 11 excluding the transfer region 15, and an insulating material obtained by treating the insulating material on at least the surface of the insulating layer 12. A mold release part 17 is provided.

At least the surface of the base plate 11 on which the insulating layer 12 is formed needs to be conductive,
(1) The entire base plate 11 may be formed of a conductive metal material, or (2) a conductive substrate may be attached to an insulating substrate, or a plurality of conductive substrates may be laminated. You may. Further, (3) a conductive thin film may be formed in a single layer or a plurality of layers may be laminated on an insulating substrate or a conductive substrate by using plating, sputtering, vapor deposition or the like. Alternatively, (4) a conductive foil may be attached to the insulating substrate or the conductive substrate.

In the above configuration (1), since the base plate 11 is made of a plate-shaped body made of a single material, the structure is simple and the productivity is good. In the configuration of (2), for example, when the conductive substrate forming the insulating layer 12 has low mechanical strength and the like, a glass epoxy substrate having high mechanical strength and resistance to bending may be attached. Further, for the same reason, a conductive substrate suitable for forming the insulating layer 12 and a conductive substrate having excellent mechanical strength are laminated to form a transfer member having excellent mechanical strength. be able to. In the case of the above (3), even if the surface condition of the insulating substrate or the conductive substrate is bad, the surface condition can be made good by forming the conductive thin film. A good transfer member can be produced without spending a lot of time on the surface treatment, and a conductive thin film suitable for transfer can be arbitrarily formed, so that workability is improved. In the case of (4) above, since the conductor can be formed on the substrate without using a thin film forming apparatus,
The cost of manufacturing equipment can be reduced.

Specifically, as the base plate 11, for example, a nickel plate, a stainless steel plate, a plastic plated with nickel on the upper surface, or a clad with a nickel foil can be used.

In this embodiment, the base plate 11 is a rectangular plate, but may be a circular plate, a polygonal plate, an elliptical plate, or a bulk rather than a plate. Also, a columnar (or cylindrical) body (roller body) or a prismatic body can be used.

The insulating layer 12 is provided on the upper surface of the base plate 11 and has a predetermined thickness. The transfer region 15 is provided so as to have an opening on the upper surface of the base plate 11, and a conductor 18 is formed later so as to fill the transfer region 15 as shown in FIG.

First, as shown in FIG. 2, a positive type photoresist 15 is formed on the upper surface of the base plate 11 using a spin coater or the like.
85 ℃ ~ 11 after coating to a film thickness of about μm
Prebaking is performed in an oven at 0 ° C. for 30 minutes to form the insulating layer 12. Next, as shown in FIG.
A mask 13 having a predetermined pattern formed thereon is placed, and a first ultraviolet ray is irradiated from above with a predetermined energy amount to form an insulator dissolving portion 14 having a width of about 10 μm on the surface of the base plate 11. . Next, as shown in FIG. 4, the mask 13 is removed, the exposed base plate 11 is dipped in a developing solution to remove the insulator dissolving portion 14, and a transfer area 15 having a predetermined pattern is formed. However, at this stage, a small amount of the insulating residue 16 remains on the base plate 11 in the transfer region 15. The base plate on which the insulating layer 12 is formed is 100 to 1
It is baked and cured in an oven at 20 ° C. for 30 minutes and 200 to 220 ° C. for 30 minutes. The entire surface of the transfer member on which the insulating layer 12 is formed has a wavelength of 254 nm (22 nm, which is shorter than the first ultraviolet light).
0 to 290 nm) and a second ultraviolet ray having a wavelength of 1 to 5
1 minute irradiation (preferably 2.5 minutes to 3.5 minutes: 3 minutes) to remove the insulator residue 16 and form an insulator release layer 17 on the surface of the insulator to form the transfer member shown in FIG. To get

It is considered that the insulator residue 16 is decomposed by irradiating the second ultraviolet ray, that is, the ultraviolet ray having a shorter wavelength than the first ultraviolet ray, and almost all the insulator residue 16 is removed in the transfer region 15. And a second wavelength shorter than the first ultraviolet wavelength used for patterning.
By irradiating the ultraviolet rays of, the insulating material releasing portion 17 is formed on the surface of the insulating layer 12. Although the mechanism by which the insulator releasing portion 17 is formed by irradiating the second ultraviolet ray is not specifically known, the surface portion of the insulating layer 12 is hardened by irradiating the second ultraviolet ray. It is considered that the release property of the insulating layer 12 is improved. Therefore, the releasability of the conductor to be described later is improved, and the insulating layer 12 hardly adheres to the transfer target. In such a configuration, the insulator releasing portion 17 is not provided with a different material, but a part of the insulating layer 12 has a releasing property, so that the number of parts is reduced and the man-hour is reduced. Productivity and the like can be improved.

The present embodiment is particularly effective for forming a fine pattern. Specifically, as shown in FIG. 1, the width W of the transfer region 15 formed between the insulating layers 12 of the transfer member is 4 μm to 15 μm, and the thickness t of the insulating layer 12 is t / W is 1. This is effective for forming a fine pattern using a transfer member set to be 0 or more. In other words, it is particularly effective for a transfer member in which the cross-sectional shape (minimum cross-sectional shape) of the transfer area 15 is represented by W and t.

Next, a method of manufacturing an electronic component using the above transfer member will be described. As the electronic component, a planar inductor having a spiral conductor provided on the main surface of the substrate and terminal portions connected to the spiral conductor at both ends of the substrate, or a spiral conductor between magnetic sheets There is a laminated electronic component (noise elimination element) in which spiral conductors are sandwiched between and are connected via through holes provided in a magnetic sheet, and terminal portions which are also connected to both ends of the conductors are provided.

In the present embodiment, a laminated type hyperopic component will be described as an example.

First, as shown in FIG. 6, the transfer member 1 is acid-activated and the base plate 11 is energized in a plating solution to transfer the transfer region 1 surrounded by the insulating layer 12 of the base plate 11.
On 5, an electric conductor 18 having a predetermined pattern is formed by a plating film made of an electrically conductive material such as silver, silver alloy, copper, copper alloy, gold, gold alloy or the like. As a result, the insulator opening width w
Is 10 μm and the insulating layer thickness t is 15 μm, a conductor 18 can be formed in the transfer region 15 having t / w of 1.0 or more. As shown in FIG. 7, the transfer member having the conductor 18 formed thereon is thermocompression-bonded to the magnetic sheet 19, and the transfer member is peeled off from the magnetic sheet 19. The magnetic sheet 1 having the conductor 18 having a spiral pattern is formed.
Get 9. A magnetic body in which one or a plurality of such magnetic body sheets 19 are prepared (two magnetic body sheets 19 are prepared in the present embodiment) and the conductor 18 is not formed between the pair of magnetic body sheets 19 One or a plurality of magnetic material sheets 20a are provided so as to sandwich the sheet 20c and further sandwich the magnetic material sheet 19 to form a laminated body.

At this time, as shown in FIG.
9 and the magnetic substance sheet 20c are provided with through holes 21, and conductive through holes are formed by filling the through holes 21 with a conductive material such as silver paste. The conductive through holes are formed on the pair of magnetic sheets 19. The conductor 18 is electrically connected. Since the conductor 18 has a portion as seen between the outer edges of the laminated body, a non-contact terminal portion is formed on the outer peripheral portion of the laminated body. The terminal portion is formed, for example, by applying a conductive material such as silver paste on the laminated body and plating the upper surface thereof with nickel, tin, or the like.

The defective occurrence rate during the manufacture of the laminated electronic component thus constructed is shown in Table 1 below.

[0036]

[Table 1]

As can be seen from Table 1, in the laminated electronic component formed by using the transfer member of this embodiment,
It can be seen that there are almost no defects during the manufacturing process, and good characteristics are exhibited. For defective plating,
Since the insulator residue 16 can be reliably removed, defective plating formation is substantially suppressed, and since the insulator release portion 17 is formed on the surface of the insulating layer 12, the release failure of the conductor 18 is prevented. Since it can be reduced, it is possible to prevent destruction of the transfer target and destruction of the insulating layer 12.

Further, by using the above transfer member, a conductor 18 is formed.
By forming the conductor 18, the conductor 18 can form a spiral pattern having a narrow line width and a narrow pitch, and the transfer member does not have the residue of the insulator 16 and has good releasability. Since it is possible to prevent the occurrence of defects and damages, it is possible to improve the characteristics particularly in a high frequency region as shown in FIG.

Although the present embodiment is applied to an electronic component, a conductor pattern such as a single wiring board or a laminated wiring board may be formed by using the transfer member, and a wiring pattern with a very fine pitch can be obtained. Since it can be configured, the mounting density and the like can be improved.

[0040]

According to the present invention, at least a conductive base is provided on the surface, and an insulating layer provided on the base and having a predetermined pattern is provided, and a transfer region where the base is exposed is provided between the insulating layers. A transfer member that forms a transfer pattern in a transfer area, and by providing a release layer on the surface of the insulating layer by irradiating the surface of the insulating layer with energy rays,
Eliminating the trouble of applying another member to form the mold release part improves productivity, and by irradiating the surface of the insulating layer with energy rays, the insulating residue in the transfer area can be removed. Since it can be removed, the conductor having good characteristics can be transferred reliably and without damaging the conductor pattern. In addition, since the mold release portion is provided, it is possible to prevent a part of the insulating layer from adhering to the transferred body.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a transfer member according to an embodiment of the present invention.

FIG. 2 is a sectional view showing a method of manufacturing a transfer member according to an embodiment of the present invention.

FIG. 3 is a sectional view showing a method of manufacturing a transfer member according to the embodiment of the present invention.

FIG. 4 is a sectional view showing a method of manufacturing a transfer member according to the embodiment of the present invention.

FIG. 5 is a cross-sectional view showing the method for manufacturing the transfer member according to the embodiment of the present invention.

FIG. 6 is a cross-sectional view in which a conductor is formed on the transfer member.

FIG. 7 is a cross-sectional view showing a method of transferring a conductor to a transfer target using the transfer member.

FIG. 8 is an exploded perspective view showing a method for manufacturing a laminated electronic component according to an embodiment of the present invention.

FIG. 9 is a sectional view of a conventional transfer member.

FIG. 10 is a cross-sectional view in which a conductor is formed on a conventional transfer member.

FIG. 11 is a cross-sectional view showing a method for transferring a conductor to a transfer target using a conventional transfer member.

FIG. 12 is a graph showing characteristics of one embodiment of the present invention and a conventional electronic component.

[Explanation of symbols] 11 base plate 12 Insulation layer 13 masks 14 Insulator melting part 15 Transfer area 16 Insulator residue 17 Insulator release layer 18 conductor 19, 20a, 20b, 20c Magnetic sheet 21 through holes

Continued front page    (72) Inventor Eiichi Uryu             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F term (reference) 2H096 AA27 BA09 EA02 HA03 HA07                       HA27 JA04 LA30                 5E001 AB03 AC01 AH01 AH09 AJ01                 5E070 AA01 AB02 BA12 CB03 CB08                       CB13 CB15                 5E082 AA01 AB03

Claims (9)

[Claims] 1. A transfer region having a conductive base on at least a surface thereof and an insulating layer formed on the base and having a predetermined pattern, wherein a transfer region exposing the base is provided between the insulating layers. A transfer member for forming a transfer pattern on the surface of the insulating layer, wherein the surface of the insulating layer is irradiated with energy rays to provide a release layer on the surface of the insulating layer. 2. The transfer member according to claim 1, wherein the insulating layer is a positive photoresist. 3. The width W of the transfer area is 4 μm to 15 μm,
The transfer member according to claim 1, wherein t / W is 1.0 or more, where t is the depth of the transfer region. 4. An insulating layer is formed on a base having conductivity at least on the surface, and the insulating layer is patterned and processed into a predetermined shape to form a transfer region exposing a part of the base, By irradiating the insulating layer with energy rays, the insulating residue present in the transfer region is removed,
A method of manufacturing a transfer member, characterized in that a release part is formed on the surface of the remaining insulating layer. 5. An insulating layer is composed of a photoresist, a photoresist film is formed on a base, a mask is covered, the first ultraviolet ray is irradiated, and development is performed to provide an insulating layer having a predetermined pattern. A second wavelength shorter than the first ultraviolet ray
5. The method for producing a transfer member according to claim 4, wherein the insulating residue is removed by irradiating the ultraviolet ray of 1. and a mold release portion is formed on the surface of the remaining insulating layer. 6. An electronic component comprising a base body, an element body provided on the base body, and a terminal portion electrically connected to the conductor, wherein the element body is any one of claims 1 and 2. An electronic component, characterized in that a conductor is formed in a transfer region of the transfer member described above, and the conductor is transferred onto a substrate. 7. The substrate is constructed by stacking sheets, and the element body is sandwiched between the sheets.
Electronic components listed. 8. The electronic component according to claim 7, wherein the sheet is made of a magnetic material and the element body is made of a spiral conductor. 9. An insulating layer is formed on a base having conductivity on at least the surface, and the insulating layer is patterned and processed into a predetermined shape to form a transfer region exposing a part of the base, By irradiating the insulating layer with energy rays, the insulating residue present in the transfer region is removed,
A transfer member having a release part formed on the surface of the remaining insulating layer is prepared, a conductor is grown in the transfer region, and then the transfer member is pressed against the transfer target to transfer the conductive material to the transfer target. A pattern forming method characterized in that a body is transferred.