JP2003149826A - Aligner and exposure method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an aligner capable of eliminating failure partially caused on a conductor pattern on a printed circuit board due to post-stages. SOLUTION: In this aligner (100) to form a circuit pattern drawn on a mask (20) on a board (10) by using light sources (U1, U2...) including a plurality of light emitting parts respectively radiating light toward the board (10), light quantity data showing a relationship between positions where the respective light emitting parts radiate the light and light quantity to be outputted by the light emitting parts is preserved in a storage means (120) on the basis of post-stage characteristics information showing, for every different area on the board, the characteristics of the circuit pattern on the board to which the post- exposure processing is applied. Then, the light quantity of each of the light emitting parts is controlled on the basis of the light quantity data stored in the storage means.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus for exposing a circuit pattern drawn on a mask onto a substrate, and more particularly to an exposure apparatus in which a light source includes a plurality of light emitting portions.

[0002]

2. Description of the Related Art Recent electronic devices are manufactured by mounting various electronic devices on a printed circuit board and connecting them to each other. A printed circuit board used for mounting an electronic device exposes a base material coated with a photoresist through a mask on which a circuit pattern is formed, and then performs post-processes such as development and etching on the exposed substrate. It is manufactured by Ideally, the circuit pattern exposed on the substrate is developed and etched in its original shape. However, in reality, so-called thickening or thinning may occur in the circuit pattern finally formed on the printed board due to the characteristics of the individual devices for developing and etching. Moreover, such thickening and thinning may not be uniform on the entire printed circuit board but may partially occur.

In the case where the above-mentioned problem in circuit pattern generation occurs, it is possible to deal with it by forming a circuit pattern drawn on a photomask in advance so as to correct the characteristics of the subsequent process. However, since it takes a lot of time and cost to produce a photomask, a means for solving the above problems without changing the photomask has been desired.

[0004]

Therefore, the present invention considers the characteristics of the post-process after exposing the printed circuit board so that a circuit pattern faithful to the pattern on the photomask is formed on the substrate. An object of the present invention is to provide an exposure apparatus and an exposure method for performing exposure.

[0005]

In order to achieve the above object, the present invention is a printed circuit board manufacturing method for manufacturing a printed circuit board by exposing a circuit pattern drawn on a mask to a substrate and performing a predetermined post-process. An exposure apparatus used in a system, wherein each light source includes a plurality of light emitting units that emit light toward the substrate, and each of the light emitting units defined based on the post-process characteristic information emits light. A light quantity data storage unit that stores light quantity data indicating the relationship between the position and the light quantity that the light emitting unit should output, and the light quantity of each light emitting unit is controlled based on the light quantity data stored in the light quantity data storage unit. An exposure apparatus including a light amount control means is provided. Here, the post-process characteristic information is information indicating the characteristics of the circuit pattern on the substrate subjected to the post-process after exposure for each different region of the substrate. In such an exposure apparatus, the light amount control means sets the light amount of the light emitting unit that exposes the different regions of the substrate according to the subsequent process characteristics in accordance with the light amount data. Therefore, the above exposure apparatus can expose the substrate so as to reduce the influence of the habits of various apparatuses involved in the post-process on the post-process characteristics. In particular, the light amount data is such that the position where each of the light emitting portions emits light and the light emitting portion is such that the characteristics of the circuit pattern on the substrate subjected to the post-process are substantially constant regardless of the area of the substrate. If the relationship with the output light quantity is defined, such a benefit can be effectively obtained. In addition, the exposure apparatus,
The exposure apparatus further includes post-process characteristic information setting means for setting post-process characteristic information, and light amount data calculation means for generating light amount data based on the post-process characteristic information stored in the post-process characteristic setting means. The light amount data may be generated in.

In addition to the above, the present invention provides a light source including a plurality of light emitting portions each for emitting light toward a substrate, and post-process characteristic information indicating characteristics of a circuit pattern on the substrate subjected to a post-process. And the light quantity data computing means for generating light quantity data indicating the quantity of light to be emitted by each of the light emitting units based on the post-process characteristic information set in the post-process characteristic information setting means. Also provided is an exposure apparatus including: and a light amount control unit that controls the light amount of each light emitting unit based on the generated light amount data. Even in such an exposure apparatus, it is possible to perform exposure in consideration of the characteristics of the post-process based on the post-process characteristic information. In particular,
If the post-process characteristic information is information indicating the characteristic of the circuit pattern for each different region of the substrate, it becomes possible to adjust the light amount of each light emitting unit so that appropriate exposure is performed for each region of the substrate. This means that, for example, the light quantity data calculation means
This is possible by obtaining the light amount data indicating the relationship between the position where each light emitting unit emits light and the light amount that the light emitting unit should output.

In the above, the post-process includes at least one of a developing process for developing the substrate after exposure and an etching process for etching the substrate.

The above two exposure apparatuses according to the present invention provide scanning means for scanning the light emitted from the light source on the substrate in a predetermined scanning direction, and position information regarding the position of the light emitted from the light source on the substrate. The light quantity control means may further include position information output means for outputting, and the light quantity control means may control the light quantity of each of the plurality of light emitting units based on the position information.
When the exposure apparatus is configured in this way, a pulse wave laser, X
The present invention can be applied to an apparatus that utilizes a light source such as a radiation source or a light emitting diode that cannot irradiate light onto a large area at once. In this case, it is particularly preferable that the scanning unit scans the light emitted from the light source in the scanning direction by moving the light source and the substrate relatively. By doing so, it is not necessary to dispose a rotating mirror or the like for scanning light between the light source and the substrate, and the exposure apparatus can be made compact.

In the above-described exposure apparatus, the light source arranges a plurality of light emitting unit units in which a plurality of light emitting units are arranged under a constant condition in the scanning direction, and the light amount adjusting means among the plurality of light emitting unit units. The light amount may be adjusted only for the light emitting units included in some of the light emitting unit units set in advance. In this case, there is an advantage that the load of the light quantity adjusting means can be reduced by reducing the objects controlled by the light quantity adjusting means.

Further, in the exposure apparatus according to the present invention, it is preferable that the plurality of light emitting units are a plurality of light emitting diodes arranged two-dimensionally. This is because the light source can be downsized, the durability can be improved as compared with a high pressure mercury lamp, and the power consumption can be reduced.

Further, the exposure apparatus according to the present invention may further include a mask data storage means for storing the data of the circuit pattern in the test photomask. In this case, the post-process characteristic information is acquired from the substrate on which the circuit pattern is exposed using the test photomask. Then, the light quantity data calculating means also uses the data of the test photomask stored in the mask data storing means to generate the light quantity data.

In addition to the above, the present invention is an exposure method for exposing a circuit pattern drawn on a mask to a substrate by using a light source including a plurality of light emitting units each of which emits light toward the substrate. , The position where each light emitting unit is radiating light and the light emitting unit outputs based on the post process characteristic information indicating the characteristics of the circuit pattern in the substrate subjected to the post process after exposure for each different region of the substrate. Provided is an exposure method characterized in that light quantity data indicating a relationship with a light quantity to be stored is stored in a storage means, and the light quantity of each light emitting unit is controlled based on the light quantity data stored in the storage means.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of an exposure apparatus according to the present invention will be described below with reference to the drawings. An exposure apparatus according to the present invention exposes a substrate using a light source composed of an array of a plurality of light emitting elements. In this embodiment, first, a test pattern is exposed on the substrate using a test photomask. After exposure, the substrate is post-processed, as is generally known. Here, the post-process refers to a process performed on the substrate after the mask pattern of the photomask is exposed by the exposure device, and in the present embodiment, it particularly refers to a process of development and etching.

After the post-process is completed, that is, in the case of the present embodiment, after the substrate is developed and etched,
Post-process characteristic information is acquired from the substrate. Here, the post-process characteristic information is information indicating the characteristics of the test pattern formed on the substrate subjected to the post-process, particularly the geometrical characteristics of the test pattern. The post-process characteristic information includes, for example, the line width of the test pattern that appears on the resist film of the substrate after development and the line width of the test pattern that appears on the copper plate portion of the substrate after etching. Particularly in the case of the present embodiment, the post-process characteristic information means the latter.

The acquired post-process characteristic information is input to the exposure apparatus of this embodiment. Then, the exposure apparatus is configured such that a conductor pattern faithful to the mask pattern is formed on the substrate based on the post-process characteristic information, and there is no difference in the extent that the conductor pattern reproduces the mask pattern in each part of the substrate. Then, the exposure condition of each light emitting element is reset. As a result, the exposure apparatus suppresses local thickening or thinning of the circuit pattern, for example, on the substrate after the post-process.

FIG. 1 shows an exposure apparatus 100 according to this embodiment.
3 is a block diagram showing the configuration of FIG. The exposure apparatus 100 will be described below with reference to FIG. 2 and the like. In the following description, a plane parallel to the exposure surface of the substrate is referred to as an xy plane, and x
Two directions orthogonal to each other in the y-plane will be referred to as an x-direction and a y-direction, respectively.

As shown in FIG. 1, the exposure apparatus 100.
Is a substrate stage 102 that holds the substrate 10 and can move the substrate 10 in the x and y2 directions, a substrate table control unit 104 that controls the operation of the substrate stage 102, and an exposure surface of the substrate 10. A mask stage 106 holding the photomask 20 is provided in parallel. In the present embodiment, the mask stage 106 holds the photomask 20 at a distance of several microns to several tens of microns from the exposed surface of the substrate 10. Alternatively, the mask stage 106 holds the photomask 20 so that the photomask 20 is in close contact with the exposed surface of the substrate 10. Therefore,
In this embodiment, the pattern drawn on the photomask 20 is exposed on the substrate 10 at a scale ratio of about 1: 1.

The exposure apparatus 100 also includes a light source 108 for irradiating the substrate 10 with light. In the case of the present embodiment, each of the light sources 108 has a substrate 10 as described later.
It is provided with a plurality of light emitting elements arranged two-dimensionally so as to irradiate light toward.

The exposure apparatus 100 further controls a light source drive unit 110 that drives the light source 108 back and forth in a predetermined scanning direction (x direction in this embodiment), and the operation of the light source drive unit 110. Thus, the light source scanning control unit 112 that scans the light source, and the position detection unit 114 such as an encoder that detects the scanning direction position of the light source 108 and outputs the position to the light source scanning control unit 112 are provided. Also, the exposure apparatus 100
Is a light amount control unit 1 that controls the amount of light output from the light source 108.
16 and for each light-emitting element included in the light source 108, the supplied power-light amount relational data storage that stores data indicating the relationship between the power (or current, voltage) supplied to the light-emitting device and the resulting light amount. And a section 132. The light quantity control unit 116 refers to the data stored in the supplied power-light quantity relation data storage unit 132 while referring to the light source 1
By adjusting the power (or current or voltage) supplied to each light emitting element included in 08, the light amount output by each of them is individually controlled. In addition, the light quantity control unit 116 includes the position detection unit 11
The light amount of each light emitting element is controlled according to the position of the light emitting element in the scanning direction by using the position information of the light source 108 output from the light emitting element 4.

The exposure apparatus 100 further includes a light source scanning section 1
12, a light amount controller 116, and a main controller 118 that controls the operations of the substrate table 104 and thereby achieves a smooth exposure operation of the exposure apparatus 100.

The exposure apparatus 100 further includes a light amount control section 1
A light quantity data storage unit 120 that stores data to be referred to when 16 controls the light quantity of the light source 108, that is, light quantity data indicating the relationship between the scanning direction position of each light emitting element and the light quantity of the light emitting element, and And a light quantity data calculation unit 122 for generating light quantity data. Also, the exposure apparatus 100
Is a mask data storage unit 124 that stores data to be referred to when the light amount data calculation unit 122 generates the above light amount data, a post-process characteristic setting unit 126, a light amount correction data storage unit 128, and a reference light amount. Setting unit 130
Is equipped with.

The standard light amount setting section 130 receives and sets a standard light amount to be output by each light emitting element of the light source 108. In the present embodiment, for example, the test photomask 2
When exposing a test pattern on a substrate using 00,
Each light emitting element of the light source 108 has a reference light amount setting unit 130.
With the light amount set to, that is, all the light emitting elements emit light with the same light amount.

The mask data storage section 124 is used for generating the light amount data, and the test photomask 2 is required.
00 is a storage device that stores data regarding 00. The test photomask 200 is a photomask used to acquire the post-process characteristic information, as described above.

FIG. 2 shows a perspective view of an example of the test photomask 200 used in this embodiment. In the test photomask 200, a plurality of areas A1 to A9 shown by phantom lines in the figure are defined, and a test pattern is drawn in each area. Further, reference marks 202 for alignment are provided on, for example, four corners of the photomask 200. In the present embodiment, the position on the photomask 200 is represented by an xy orthogonal coordinate system whose origin is one predetermined reference mark 202.
For example, the positions of the four corners of the area A1 are (x0, y0) using the xy coordinate system, as shown in the figure,
(X1, y0), (x1, y1), and (x0, y1)
Represented by This test photomask 200
Are prepared in various different sizes to accommodate substrates 10 of various sizes. Although FIG. 2 shows an example in which nine areas A1 to A9 are defined in the test photomask 200, this does not limit the number of areas defined on the test photomask. Instead, the test photomask 200 can define any number of areas.

FIG. 3 is a diagram showing an example of the data contents stored in the mask data storage unit 124 in this embodiment. As shown in the figure, the mask data storage unit 124 stores mask numbers, area numbers, area range data, and pattern line widths in association with each other.

The mask number is a number given to each test photomask 200 as identification information for identifying different size test photomasks 200. The area number is a number given to each area as identification information for identifying each area defined on the test photomask. A attached to each area in FIG.
The numbers 1 to A9 correspond to this. The area range data is data indicating the range of each area on the test photomask. In the case of the present embodiment, the coordinates of the four corners of each area described in FIG. 2 are used as area range data.

The pattern line width is the same as that of the test photomask 2.
The test pattern drawn in each area 00 is the target line width. Test photomask 20
When a test pattern having a different target line width is provided in each area of 0, one pattern line width is recorded for each area number. In this embodiment, since the test pattern having the same line width W1 as the target value is provided in all areas,
As for the pattern line width, only one value is recorded for all mask numbers.

Returning to FIG. 1, the post-process characteristic setting section 126 receives and sets the post-process characteristic information. Figure 4
An example of the post-process characteristic information input to the post-process characteristic setting unit 126 in the present embodiment is shown in FIG. As illustrated, the post-process characteristic information includes the mask number of the test photomask 200 used to acquire the post-process characteristic information, the area number of the area defined on the test photomask, and The pattern line width corresponding to each area number is included. The pattern line width is the photomask 200 for the test.
Is the line width of each conductor pattern formed on the substrate as a result of the test pattern in each area being exposed, developed and etched on the substrate. If the development or etching is biased due to the characteristics of the developing device that develops the substrate after exposure or the etching device that performs etching, and if the pattern formed on the substrate is partially thickened or thinned as a result, , That appears as a variation in the value of the pattern line width of the post-process characteristic information.

Returning to FIG. 1, the light quantity correction data storage unit 12
Reference numeral 8 denotes a storage unit that stores the relationship between the pattern line width ratio and the light amount correction amount of the light source. Here, the pattern line width ratio is the line width w (see FIG. 4) of the pattern obtained by actually developing and etching the substrate with respect to the pattern line width W (see FIG. 3) of the test photomask 200. Ratio (w /
W). The light amount correction amount is a ratio at which the light amount output from the light emitting element of the light source 108 should be changed from the reference light amount set by the reference light amount setting unit 130.

FIG. 5 shows the light quantity correction data storage unit 1 when a positive resist film is used on the exposed surface of the substrate 10.
28 shows an example of data stored by 28. As shown,
The light amount correction data storage unit 128 stores a plurality of pattern width ratios and light amount correction amounts in a one-to-one correspondence. In the figure, α takes a positive value to increase the light amount, and β takes a negative value to decrease the light amount.

In the figure, the pattern width ratio "1.00"
Indicates that a conductor pattern having the same line width as the line width of the test pattern drawn on the test photomask 200 was formed on the substrate after etching. That is, it is shown that neither thick nor thin is generated in the conductor pattern formed on the substrate. In FIG. 5, the light quantity correction amount of 0% is associated with the pattern line width ratio “1.00”. That is, when the pattern formed on the substrate 10 is neither thick nor thin, the light source 108
It is shown that the light quantity output from the light emitting element is maintained at the reference light quantity set in the reference light quantity setting unit 130 and is not changed.

On the other hand, the pattern width ratio “1.02” means that the line width of the conductor pattern formed on the substrate is 2% larger than the line width of the test pattern drawn on the test photomask 200. It indicates that overweight is occurring. When a positive resist film is used and the pattern formed on the substrate becomes thick, the thickness can be suppressed by increasing the exposure amount of the resist film. For this reason, as shown in FIG. 5, the light amount correction amount + α2% is associated with the pattern width ratio “1.02”, and the light amount output from the light emitting element of the light source 108 is changed from the reference light amount to α2. It has been shown to increase by%.

Next, the structure of the light source 108 used in the exposure apparatus 100 will be described in more detail. Figure 6
FIG. 4 is a perspective view showing a light source 108 when viewed obliquely from the substrate stage 102 side. The light source 108 includes a plurality of units U1, U2, ... Arranged in the scanning direction (x direction) of the light source 108.
..., equipped with Un. Each light source unit includes a plurality of light emitting elements 136 arranged two-dimensionally in a plane parallel to the exposure surface of the substrate 10. Each light emitting element 136 is connected to the light amount control unit 116 (see FIG. 1) by a wiring (not shown) so that each light amount can be controlled independently.

FIG. 7 is a partial cross-sectional view of the light source unit U1, showing a part of the cross section of the light source unit U1 along a plane perpendicular to the exposure surface of the substrate 10 and parallel to the y direction. There is. In the light source unit U1, a printed circuit board 134 is provided.
Are arranged, and the plurality of light emitting elements 136 described above are attached to the printed circuit board 134. In the case of this embodiment, a light emitting diode (LE) is used as the light emitting element 136.
It is desirable to use D). This is because when the light emitting diode is used, the durability of the light source 108 can be improved and the power consumption thereof can be suppressed. Further, when the substrate 10 is coated with a resist film of a type that reacts with ultraviolet rays, it is also possible to use a light emitting diode that emits light in the ultraviolet region.

A lens panel 138 is provided on the substrate stage 102 side of the light emitting element 136. The lens panel 138 is made of glass or light-transmissive resin,
A collimator lens 140 is formed at a position where the light emitted from each light emitting element 136 passes. Therefore, the light emitted from each light emitting element 136 is converted into parallel light by the collimator lens 140, and thereafter, is irradiated onto the substrate 10 or the photomask 20.

FIG. 8 is a diagram for explaining the arrangement of the light emitting elements 136 in each light source unit. In FIG. 8, a black dot p indicates the position of the light emitting element 136, and a circular portion q indicated by a broken line is a beam formed by the light emitted from each light emitting element 136 through the collimator lens 140 on the substrate 10 or the photomask 20. It represents a spot.

In the light source unit of this embodiment, the equal intervals a
The rows of the light emitting elements 136 arranged in the y direction are
That is, a plurality of columns are arranged at equal intervals b in the scanning direction. Each row of the light emitting elements 136 has two light emitting elements 1 in one light source unit when the light source unit is scanned in the x direction.
In order that the beam spots q formed by 36 do not completely overlap each other in the scanning direction, they are displaced from each other by a constant distance c in the y direction.

Further, assuming that the diameter of the beam spot is d and the number of rows of the light emitting elements 136 in one light source unit is m, the light emitting elements 136 are arranged so that the following equation holds: (d × m) ≧ a ... (1) (c × m) = a ... (2) When the expressions (1) and (2) are satisfied, when the light source unit is scanned in the x direction, FIG. , Shaded area r
And s, the light-emitting elements 136 in successive columns
The areas where the beam spots of the above pass on the substrate 10 partially overlap. For this reason, when the light source unit is scanned in the x direction, the light from the light source unit is applied to the entire surface of the substrate 10 and the light is not applied.

Next, the operation of the exposure apparatus 100 of this embodiment described above will be described. FIG. 9 is a flowchart showing an example of the operation of the exposure apparatus 100 when a test pattern is exposed on the substrate 10 using the test photomask 200. Further, FIG. 10 shows the relationship between the scanning direction position X of the light emitting element 136 included in the light source 108 and the light amount L output from the light emitting element 136 when the test pattern is exposed on the substrate 10 using the test photomask 200. FIG. 3 is a diagram illustrating a specific light emitting element 136a as an example.

As shown in FIG. 9, when exposure is performed using the test photomask 200, the substrate 10 and the test photomask 200 are attached to the exposure apparatus 100, and their alignment is performed. After that, the reference light amount L1 is input and set in the reference light amount setting unit 130 (S102). The input reference light amount L1 is the light source 108.
Can be set to an arbitrary value within the light amount range that can be output by the light emitting element 136 included in the light emitting element 136. However, in consideration of making the light amount adjustable range as large as possible later, the light amount adjustable range is almost It is desirable to set the central light amount as the reference light amount L1.

Next, the light source 108 is moved to a scanning start position for starting scanning as shown in FIG. 10 (S1).
04). In the case of the present embodiment, the scanning start position is the light source 10
8, the light emitting element 13 located at the foremost position in the scanning direction
6 is located in front of the substrate 10 and the light emitting element 136
This is a position where the light from does not directly expose the substrate 10.

Next, the light quantity control unit 116 lights up and emits light from each light emitting element 136 included in the light source 108 (S10).
6). At this time, the light amount control unit 116 reads the reference light amount L1 from the reference light amount setting unit 130, and all the light emitting elements 1
The power supplied to each light emitting element 136 is adjusted so that the light amount of 36 becomes the read reference light amount L1.

Next, the light source scanning control unit 112 controls the light source driving unit 110, and at a constant speed from the scanning start position of the light source 108 to the scanning end position where the entire light source 108 has completely passed through the substrate 10. It is moved (S108). Figure 10
In the example of the light emitting element 136a in FIG.
While the light source 8 is scanning from the scan start position X1 to the scan end position X2, the light quantity control unit 116 controls the light quantity L of each light emitting element 136.
Is maintained at the reference light amount L1. Therefore, in S108, the entire surface of the substrate 10 is exposed with a substantially uniform light amount.

When the light source 108 is scanned to the scanning end position, the light quantity control unit 116 turns off each light emitting element 136 (S110). As a result, the exposure of the substrate 10 using the test photomask 200 by the exposure apparatus 100 is completed.

After the above-mentioned exposure, as described above, the exposed substrate 10 is passed to a post-process and subjected to post-processes such as development and etching. In the case of the present embodiment, the test photomask 20 is formed after the etching process is completed.
The line width of each test pattern formed on the substrate 10 is measured in each area A1 to A9 of 0. The measured line width is used as the post-process characteristic information described in FIG.

FIG. 11 is a flow chart showing the operation of the exposure apparatus 100 when the light amount data is generated based on the post-process characteristic information. Further, FIG. 12 is a flowchart showing the operation of the exposure apparatus 100 when performing exposure using the light amount data stored in the light amount data storage unit 120. Further, FIG. 13 shows that the light emitting element 136 included in the light source 108 when the exposure apparatus 100 performs exposure using the light amount data stored in the light amount data storage unit 120.
FIG. 3 is a diagram for explaining the relationship between the position X in the scanning direction and the light amount L output by the light emitting element 136, using two light emitting elements 136b and 136c as an example.

As shown in FIG. 11, when the light amount data is generated, first, the reference light amount L1 and the post-process characteristic information (see FIG. 4) acquired by the above-described procedure are respectively set to the reference light amount setting section 130. And is input and set in the post-process characteristic setting unit 126 (S202).

Next, the light amount data calculation unit 122 stores the post-process characteristic information stored in the post-process characteristic setting unit 126,
The pattern width ratio is calculated for each area number based on the data (see FIG. 3) regarding the test photomask 200 stored in the mask data storage unit 124 (S20).
4). Specifically, the light amount data calculation unit 122 first
The pattern line width stored in the mask data storage unit 124 in association with the same mask number as the post-process characteristic information is acquired. Explaining according to the example of the data shown in FIGS. 3 and 4, since the mask number 1 is recorded in the post-process characteristic information, the light amount data calculation unit 122 causes the mask data storage unit 124 to read the mask number 1 Pattern line width W stored in association with
Read 1. Next, the light amount data calculation unit 122 divides the pattern line width (w1 to w9) associated with each area number in the post-process characteristic information by the pattern line width W1 to obtain a pattern for each area number. Calculate the line width ratio. Here, for simplicity, area number A5
The following description will be made on the assumption that the pattern line width ratios obtained with respect to the area numbers are 0.99 and the pattern line width ratios obtained with respect to the other area numbers are all 1.00.

Next, the light amount data calculation unit 122 obtains the light amount correction amount of the light emitting element for each area number (S206).
Specifically, the light amount data calculation unit 122 obtains the light amount correction amount corresponding to the pattern line width ratio obtained for each area number in S204 by referring to the data stored in the light amount correction data storage unit 128. . In this embodiment, -β1% is obtained as the light amount correction amount for the area number A5 whose pattern line width ratio was 0.99 (see FIG. 5), and 0% is obtained for the other area numbers.

Next, the light quantity data calculator 122 determines that the light source 1
For each light emitting element 136 included in 08, the relationship between the position X in the scanning direction and the light amount L to be output at that position, that is, the light amount data is obtained (S208 to S218). That is, the light amount data calculation unit 122 first determines the number of the target area to which the data should be referred to as A1. (S20
8). Next, the light amount data calculation unit 122 is preset in the range of the y coordinate stored in the mask data storage unit 124 corresponding to the target area and in the program executed by the light amount data calculation unit 122, for example. Y of the light emitting element
The light emitting element 136 located within the y coordinate range of the target area is specified by comparing the directional position (S21).
0). For example, if the target area is A5, y1 to y2
The light emitting element 136 located within the range is specified (see FIG. 13).
, Light emitting elements 136b to 136g). This allows
The light amount data calculation unit 122 can determine the light emitting element 136 that will expose the target area when the light source 108 is scanned in the x direction.

Next, the light quantity data calculation unit 122 determines in S21.
Each light emitting element 136 specified by 0 determines the light amount L2 to be output when it is located in the x coordinate range of the target area during scanning (S212). The light quantity L2 is calculated by the following equation, where γ% is the light quantity correction amount of the target area calculated in S206. L2 = L1 × (1 + γ / 100) (2) If the area A5 described above is taken as an example, the light amount data calculation unit 122 determines that each of the light emitting elements 136b to 136g is x.
The amount of light to be output when located in the range of 1 to x2 is defined as L2 = L1 × (1 + β1 / 100). If the target area is, for example, A2, the light amount data calculation unit 122 determines that each of the light emitting elements 136b to 136g is x.
The amount of light to be output when located in the range of 0 to x1 is set to L2 = L1 × (1 + 0/100), that is, L1.

The light quantity data calculator 122 sequentially performs the processing of S210 and S212 for all areas A1 to A9 (S214: y, S216). As a result, the light amount data calculation unit 122 can obtain the relationship between the position X in the scanning direction and the light amount to be output at that position, that is, the light amount data, for each light emitting element 136 that passes over the substrate 10. The obtained light amount data is transmitted from the light amount data calculation unit 122 to the light amount data storage unit 120 and stored in the light amount data storage unit 120 (S21).
8). As described above, the exposure apparatus 1 for generating the light amount data
A series of operations of 00 ends.

Next, with reference to FIG. 12, description will be given of a case where exposure is performed by using the light amount data generated as described above. As shown in FIG. 12, in this case, after the substrate 10 and the photomask 20 are attached to the exposure apparatus 100 and their alignment is performed,
The light source scanning controller 112 controls the light source driver 110,
The light source 108 is moved to the exposure start position (S302).
Next, the light amount control unit 116 turns on each light emitting element 136 included in the light source 108 and starts controlling the light amount (S).
304). At this time, the light amount control unit 116 refers to the information on the position in the scanning direction of the light source 108 output by the position detection unit 114, and determines the light amount of the light emitting element 136 based on the light amount data stored in the light amount data storage unit 120. Control.

Next, the light source scanning controller 112 controls the light source driver 110 to scan the light source 108 from the exposure start position to the exposure end position (S306). During scanning, the light amount control unit 116 controls the light amount of each light emitting element based on the light amount data. Therefore, as illustrated by the light emitting elements 136b and 136g in FIG. The amount of light to be output is changed according to the position X, in other words, according to the post-process characteristics in the area where the light is irradiated. This makes it possible to expose the substrate 10 so that the conductor pattern formed on the substrate 10 after the post-process is not partially thickened or thinned.

After the light source 108 is scanned to the exposure end position, the light amount control section 116 ends the light amount control of each light emitting element 136 and turns them off (S308). As a result, the exposure apparatus 100 ends the series of operations.

Although one embodiment of the present invention has been described above, the exposure apparatus according to the present invention is not limited to the above embodiment, and various modifications can be made to the above embodiment within the scope of the technical idea of the present invention. It is possible to add. For example, in the above-described embodiment, the light amount control unit 116 causes the light emitting elements 136 to operate.
The case of controlling the amount of light output by the above has been described. In this case, a plurality of liquid crystal elements capable of changing the light transmittance in a plurality of steps are arranged two-dimensionally between the light source 108 and the mask table 106. By providing a liquid crystal shutter and controlling the light transmittance of each liquid crystal element by the light amount control unit 116, the light source 108 is provided in each area of the substrate 10 and the mask 20.
It is also possible to adjust the amount of light emitted from. In this case, as the light source 108, instead of an array of a plurality of light emitting elements, a light source such as a mercury lamp capable of irradiating light over a large area at once can be used. Further, instead of scanning the light source as in the above embodiment, the light source is stopped,
The liquid crystal shutter, or the substrate and the mask may be moved in the scanning direction. Alternatively, the light passing through the liquid crystal shutter may be reflected by a rotating mirror to scan the light on the substrate and the mask.

In the above embodiment, an example in which the line width of the conductor pattern formed on the substrate after etching the substrate is used as the post-process characteristic information has been described. However, as the post-process characteristic information, development processing is performed. The line width of the pattern formed on the resist film after etching may be used.

Further, in the above embodiment, the example in which the light source 108 has the plurality of light source units U1 to Un has been described, but the light source 108 may be provided with only one light source unit. When the light source 108 includes a plurality of light source units, the light amount control unit 116 may control the light amounts of the light emitting elements in all the light source units based on the light amount data stored in the light amount data storage unit 120. It is good to control only the light amount of the light emitting elements in some of the light source units based on the light amount data so that the light emitting elements in the other light source units emit the reference light amount L1 and other predetermined light amounts. It may be controlling.

[0059]

As described above, in the exposure apparatus of the present invention, the light source has a plurality of light emitting portions, and the light amount control means controls the light amounts of the light emitting portions based on the post-process characteristic information. A circuit pattern faithful to the pattern on the photomask can be formed on the substrate.

[Brief description of drawings]

FIG. 1 is a block diagram showing a configuration of an exposure apparatus according to an embodiment of the present invention.

FIG. 2 shows an exemplary perspective view of a test photomask used in an embodiment of the present invention.

FIG. 3 is a diagram showing an example of data contents stored in a mask data storage unit in the embodiment of the present invention.

FIG. 4 shows an example of post-process characteristic information input to a post-process characteristic setting unit in an embodiment of the present invention.

FIG. 5 shows an example of data stored in a light quantity correction data storage unit when a positive resist film is used as a resist film provided on an exposed surface of a substrate.

FIG. 6 is a perspective view showing a light source when viewed obliquely from the substrate stage side.

FIG. 7 is a partial cross-sectional view of a light source unit.

FIG. 8 is a diagram for explaining an arrangement of light emitting elements in a light source unit.

FIG. 9 is a flowchart showing an example of the operation of the exposure apparatus when a test pattern is exposed on a substrate using a test photomask.

FIG. 10 is a diagram illustrating the relationship between the scanning direction position X of a light emitting element and the light amount L when a test pattern is exposed on a substrate using a test photomask.

FIG. 11 is a flowchart showing an operation of the exposure apparatus when generating light amount data based on post-process characteristic information.

FIG. 12 is a flowchart showing the operation of the exposure apparatus when performing exposure using the light amount data stored in the light amount data storage section.

FIG. 13 is a diagram illustrating the relationship between the scanning direction position X of the light emitting element and the light amount L when performing exposure using light amount data.

[Explanation of symbols]

100 exposure equipment 108 light source 110 Light source driver 112 Light Source Scanning Control Unit 114 position detector 116 Light intensity control unit 120 Light intensity data storage 122 Light intensity data calculation unit 126 Post-process characteristic setting section

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Yoshinori Kobayashi             2-36 Maeno-cho, Itabashi-ku, Tokyo Asahikou             Gaku Kogyo Co., Ltd. F term (reference) 2H097 AA04 BA10 BB01 CA03 CA11                       JA03 LA09                 5F046 DA02 DB01

Claims (12)

[Claims] 1. An exposure apparatus used in a printed circuit board manufacturing system for manufacturing a printed circuit board by exposing a circuit pattern drawn on a mask to a substrate and performing a predetermined post-process, each of which is directed toward the substrate. A light source including a plurality of light emitting units for irradiating light, and the light emission determined based on post-process characteristic information indicating characteristics of the circuit pattern on the substrate subjected to the post-process for different regions of the substrate. Based on the light quantity data storage means for storing the light quantity data indicating the relationship between the position where each of the parts emits light and the light quantity to be output by the light emitting part, and the light quantity data stored by the light quantity data storage means, An exposure apparatus comprising: a light quantity control unit that controls the light quantity of each of the light emitting units. 2. A post-process characteristic information setting unit for setting the post-process characteristic information, and light amount data for generating the light amount data based on the post-process characteristic information set in the post-process characteristic setting unit. A calculation means is further provided, Claim 1 characterized by the above-mentioned.
The exposure apparatus according to. 3. An exposure apparatus used in a printed circuit board manufacturing system for manufacturing a printed circuit board by exposing a circuit pattern drawn on a mask to a substrate and performing a predetermined post-process, each of which is directed toward the substrate. A light source including a plurality of light emitting units for irradiating light by a post process, a post process characteristic information setting unit in which post process characteristic information indicating a characteristic of the circuit pattern on the substrate subjected to the post process is set, and the post process Based on the post-process characteristic information set in the characteristic information setting means, light amount data calculation means for generating light amount data indicating the amount of light to be emitted by each of the light emitting portions, and the light emitting portion of the light emitting portion based on the light amount data. An exposure apparatus comprising: a light amount control unit that controls each light amount. 4. The exposure apparatus according to claim 3, wherein the post-process characteristic information indicates a characteristic of the circuit pattern for each different area of the substrate. 5. The exposure apparatus according to claim 4, wherein the light amount data indicates a relationship between a position at which each of the light emitting units emits light and a light amount to be output by the light emitting unit. 6. The post-process includes at least one of a developing process of developing the substrate after exposure and an etching process of etching the substrate.
Or the exposure apparatus according to item 3. 7. The light amount data is such that each of the light emitting units emits light so that the characteristic of the circuit pattern on the substrate subjected to the post-process is substantially constant regardless of the region of the substrate. The relationship between the irradiation position and the amount of light output from the light emitting unit is defined, and the relationship is defined.
The exposure apparatus according to. 8. A scanning unit for scanning the light emitted from the light source on the substrate in a predetermined scanning direction, and position information output for outputting position information regarding the position of the light emitted from the light source on the substrate. 4. The exposure apparatus according to claim 1, further comprising a means, wherein the light quantity control means controls the light quantity of each of the plurality of light emitting units based on the position information. 9. The scanning means scans light emitted from the light source in the scanning direction by moving the light source and the substrate relative to each other.
The exposure apparatus according to. 10. The exposure apparatus according to claim 1, wherein the plurality of light emitting units are a plurality of light emitting diodes arranged two-dimensionally. 11. A mask data storage unit for storing data of the circuit pattern in a test photomask, wherein the post-process characteristic information is obtained by exposing the circuit pattern using the test photomask. The light amount data calculation unit, which is acquired from the substrate, also generates the light amount data by using the data stored in the mask data storage unit. Exposure equipment. 12. An exposure method for exposing a circuit pattern drawn on a mask to the substrate by using a light source including a plurality of light emitting units each of which emits light toward the substrate, after the exposure. Based on the post-process characteristic information indicating the characteristics of the circuit pattern on the processed substrate for each different region of the substrate, the position at which each of the light emitting units emits light and the amount of light to be output by the light emitting unit. Is stored in a storage unit, and the light amount of each of the light emitting units is controlled based on the light amount data stored in the storage unit.