JP2003149170A - Automatic creation method of image examination set data - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an automatic creation method of image examination set data which can shorten the data creation time and can create the data by only simple correction. SOLUTION: In order to examine the abnormality of a wiring pattern on a print board by an image pickup means and a computer, the following two steps are repetitively carried out within a search condition range. The method automatically creates image examination set data from wiring pattern data of bit map format. (1) Examination shape data achieved by enlarging or reducing reference shape data of a wiring patter needed to be examined with any or fixed magnification, and orienting the data by any or fixed angle are searched in the wiring pattern data, and (2) the examination shape data and necessary examination data are set to image examination set data together with the search position.

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for automatically creating image inspection setting data. 2. Description of the Related Art Conventionally, in order to inspect an abnormality of a wiring pattern on a printed circuit board by an image pickup means and a computer, an operator checks wiring pattern data on a monitor while checking inspection pattern data one by one. Input and created image inspection setting data. The wiring pattern data is in a bitmap format so as to enable a search. [0005] The image inspection setting data includes inspection shape data, a position, an inspection type, an allowable value used for quality judgment, and the like for each inspection location. The inspection shape data is a wiring pattern having a specific shape that requires a change in inspection sensitivity or a different type of inspection. The inspection shape data has a common shape on many printed boards, and differs depending on product specifications. Or For example, the wiring pattern shown in FIG. 1 has a circular opening in a part of the surface covered with the resist resin 2, and a circular copper wiring pattern 1 is provided at the center of the opening.
Having. The copper wiring pattern 1 that is not covered with the resist resin 2 is plated with gold, and a solder ball is placed thereon, and the wiring is connected by a solder flow. The circular portion of the copper wiring pattern 1 is an important place for product performance management, and the lack of the wiring pattern or the gold plating becomes a serious defect. Therefore, it is set as an inspection frame to specify an inspection. On the other hand, the length of the drawn portion is not important so that the length changes due to the displacement of the mask of the resist resin 2. Therefore, it is set as a non-inspection frame so as to escape the inspection specification. As described above, as the image inspection setting data including one inspection frame and one non-inspection frame is created,
Image inspection setting data including a required number of inspection frames and non-inspection frames for one printed circuit board is created. In particular, in the case of a wiring pattern containing a large number of similar shapes, there is a problem that inputting the inspection shape data one by one increases the time required to create the image inspection setting data. Was. [0008] It is relatively easy to have a geometrically regular array, but the irregular shapes may be irregular, such as not equally spaced, have various orientations, or be scaled up or down. In many cases, it takes more time. SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a method for automatically creating image inspection setting data which can be reduced in time and can be created only by making simple corrections. The purpose is to provide. A method for automatically creating image inspection setting data according to the present invention includes a method for inspecting an abnormality of a wiring pattern on a printed circuit board by an imaging means and a computer within a range of search conditions. The following two steps are repeatedly performed to automatically create image inspection setting data from wiring pattern data in a bitmap format. (1) Inspection shape data obtained by enlarging or reducing to an arbitrary or fixed magnification and orienting at an arbitrary or fixed angle from the reference shape data of the wiring pattern requiring inspection is converted into wiring pattern data. Exploring within. (2) A step of setting the inspection shape data and necessary inspection data together with the searched position in image inspection setting data. An embodiment of a method for automatically creating image inspection setting data according to the present invention will be described. An inspection apparatus for inspecting an abnormality of a wiring pattern on a printed circuit board by an imaging means and a computer is the same as the above-described conventional case. The image inspection setting data is automatically generated from the wiring pattern data in the bitmap format by repeatedly performing the following two steps within the range of the search condition. (1) Inspection shape data obtained by enlarging or reducing to an arbitrary or fixed magnification and orienting at an arbitrary or fixed angle from the reference shape data of the wiring pattern requiring an inspection is converted into wiring pattern data. Exploring within. (2) A step of setting the inspection shape data and necessary inspection data together with the searched position in image inspection setting data. The reference shape data is a frequently used shape such as a contour of a circular wiring pattern. An arbitrary magnification for enlarging or reducing the reference shape data is appropriately determined. For example, the magnification from the minimum pattern width for the reference shape data to the magnification for the length of the wiring board may be divided into several stages. The arbitrary angle for orienting the reference shape data may be divided into several stages from 0 ° to 360 °. If not rotationally symmetric, it is preferable to prepare two sets of reference shape data obtained as mirror images. The range of the search condition is appropriately set according to the scale of the wiring board. The inspection data necessary to form the image inspection setting data includes, for example, inspection shape data, position, inspection type, and data such as an allowable value used for quality judgment. A program-based technique for searching the inspection shape data from the wiring pattern data in the bitmap format is performed by a known technique. More specifically, for example, an image processing library (manufactured by Sumitomo Metal System Solutions Co., Ltd., Ro
bast Finder). The search for a shape similar to the inspection shape data in the image processing library is performed by a technique such as pattern matching using normalized correlation. In the actual work, the work of registering a plurality of inspection shape data in the image processing library is performed in advance,
The search is automatically performed by giving the wiring pattern data in the bitmap format. The search result is provided as a data file in which a plurality of blocks each having a position, an angle, a magnification, and a degree of coincidence with reference shape data are arranged. Image inspection setting data is created by inserting the above-described inspection data, which differs for each inspection shape data, into this data file and then reading the inspection data into the above-described inspection program. By providing the image inspection setting data to the computer and the inspection program described above, it is possible to automatically inspect the wiring pattern on the printed board for abnormalities. In order to shorten the search time, it is also effective to limit the magnification and the degree of coincidence with the reference shape data to specific values. During the search, an allowable range of the similarity is set. However, depending on the magnitude of the similarity, the position, angle, and magnification may not always be correctly given. Further, unnecessary inspection data may be generated due to interference with an adjacent wiring pattern. For such a case, it is preferable that the operator makes a simple correction to the image inspection setting data. The actual correction work is performed by correcting the position and size of the inspection shape data in the data file, or by deleting blocks that the operator has determined are unnecessary. (Embodiment) The wiring pattern shown in FIG.
Image inspection setting data was automatically created for a 20 mm × 20 mm P-CSP package including four locations. In this embodiment, image inspection setting data could be obtained in 30 minutes. (Comparative Example) With respect to the same P-CSP package as in the embodiment, image inspection setting data was created by a conventional method. In this comparative example, image inspection setting data was obtained in 2 hours. As described in detail above, according to the method for automatically creating image inspection setting data of the present invention, the time required can be reduced, and the image inspection setting data can be automatically created only by making a simple correction. It became possible to do.

[Brief description of the drawings] FIG. 1 is a plan view showing an example of a wiring pattern. [Explanation of symbols] 1 Wiring pattern 2 Resist resin

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Claims (1)

Claims: 1. In order to inspect an abnormality of a wiring pattern on a printed board by an imaging means and a computer, the following two steps are repeatedly performed within a range of a search condition. A method of automatically creating image inspection setting data from wiring pattern data in a map format; (1) Enlarging or reducing to an arbitrary or fixed magnification from reference shape data of a wiring pattern requiring inspection, and arbitrary or fixed Searching for inspection shape data obtained by orienting at an angle in the wiring pattern data; (2) setting the inspection shape data and necessary inspection data together with the searched position in image inspection setting data; Step.