JP2003139944A - Method for manufacturing multicolor pattern sheet and device for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a multicolor pattern sheet and a manufacturing device therefor by which a multicolor pattern sheet can be manufactured at a low cost in a small number of processes. SOLUTION: Three kinds of single color films 11a, 11b, 11c having color ink layers 12a, 12b, 12c of RGB three colors on the surfaces, respectively, are formed by applying inks of RGB three colors on films 10 and drying. Then the single color film 11a, for example, of the color R is superposed on a sheet 20 and the superposed sheet 20 and the single color film 11a are pressed by a pressing member 30 having a protruding part 23 of a specified pattern on its surface so as to transfer the part of the color ink layer 12a corresponding to the pattern of the protruding part 23 to the sheet 20. This procedure is repeated for the RGB three colors to form a multicolor pattern by the color ink layers 21a, 21b, 21c of RGB three colors in specified patterns on the sheet 20.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a color filter,
The present invention relates to a method and an apparatus for manufacturing a multicolor pattern sheet used as an electronic display material such as an organic EL.

[0002]

2. Description of the Related Art Conventionally, RGB has been used as a material for electronic displays such as color filters and organic EL on a sheet.
A multicolor pattern sheet is used in which a thin colored film having a thickness of 3 μm or less and having a microscopic stripe or matrix pattern of three colors is formed.

The following various methods have been proposed as a method of manufacturing this multicolor pattern sheet.

1) Relief dyeing method: After the surface of a sheet is patterned into a predetermined shape by using a photosensitive resist, the sheet is dipped in a dyeing solution for coloring (RGB color meter 3
Times).

2) Pigment dispersion method: A photosensitive resist in which a pigment is dispersed is applied to the surface of a sheet, exposed, and developed to form a pattern (3 times for each RGB color meter).

3) Vacuum evaporation method: The coloring material particles are heated and evaporated to adhere to the masked sheet surface to form a pattern (3 times for each RGB color meter).

4) Ink jet method: By the ink jet method, minute amounts of three color inks of RGB are jetted to predetermined positions for patterning.

5) Electrodeposition method: The transparent electrode is patterned into a predetermined shape, and electrodeposition is repeated three times on the transparent electrode to form a colored pattern.

6) Offset printing method: The ink in which the pigment is dispersed is printed three times on the sheet surface by the offset printing method.

[0010]

However, these methods have the following problems, and none of them are satisfactory manufacturing methods.

1. The relief dyeing method, pigment dispersion method, and electrodeposition method have many steps and are not suitable for mass production.

2. It is difficult to manufacture a large-area multicolor pattern sheet by the vacuum evaporation method.

3. The vacuum evaporation method requires a large amount of equipment cost.

4. In all of the above-mentioned 6 methods, it is necessary to add a special chemical such as a curable resin to the ink, and it is necessary to develop a formulation, and there is a concern that the special chemical may affect the electronic display performance.

5. It is difficult for the inkjet method and the offset printing method to obtain an ink layer having a constant thickness.

6. In the offset printing method, it is difficult to maintain high precision of alignment when forming patterns of each color.

Among these problems, there is a demand for a manufacturing method that can satisfy the following points. That is, firstly, the number of steps is small and mass production can be performed with inexpensive equipment. Secondly, the degree of freedom in ink selection is large, and
There are two points that it is not necessary to add a special chemical to the ink.

As a manufacturing method close to such conditions, Japanese Patent Application Laid-Open No. 9-90117 discloses a resin in which a coloring material is dispersed for each color when three kinds of coloring layers are formed in a predetermined pattern on a sheet. From a dry film having a colored solidified film composed of the composition, after removing unnecessary portions of the colored solidified film by migrating to an intaglio surface having a predetermined pattern, the colored solidified film having a predetermined pattern remaining on the dry film is formed on the sheet. A method of transferring is disclosed.

However, in this manufacturing method, after the dry film is manufactured, a step of removing unnecessary portions of the colored solidified film on the dry film for each color, and the colored solidified film remaining on the dry film on the sheet. It is difficult to reduce the manufacturing cost because it requires two steps, that is, the step of transferring to.

In view of the above circumstances, it is an object of the present invention to provide a method for manufacturing a multicolor pattern sheet and a manufacturing apparatus for the multicolor pattern sheet, which has a small number of steps and can be manufactured at low cost.

[0021]

In the method for producing a multicolor pattern sheet of the present invention which achieves the above object, a color ink layer is formed on the surface by applying ink of each color to each of a plurality of films and drying. And a monochromatic film production process for producing a monochromatic film of a plurality of colors, and a predetermined color sheet, one color monochromatic film of the monochromatic film of the plurality of colors, so that the color ink layer of the monochromatic film contacts the sheet. Overlapping, by overlapping the sheet and the monochromatic film with a pressing member having a convex portion of a predetermined pattern formed on the surface, a portion of the color ink layer corresponding to the pattern of the convex portion is formed into a sheet. A transfer step of repeating the transfer operation for the plurality of colors to form a multicolor pattern of the color inks of the plurality of colors on the sheet. And wherein the Rukoto.

According to the method for producing a multicolor pattern sheet of the present invention, a multicolor pattern sheet is produced only by the above transferring step after producing a monocolor film corresponding to the dry film mentioned in the above-mentioned conventional example. According to the method for producing a multicolor pattern sheet of the present invention, a low cost multicolor pattern sheet can be produced with a small number of steps.

Here, even if the monochromatic film producing step includes a step of applying an ink of a predetermined color onto the sheet by any one of a die coater, a bar coater, a spin coater and a gravure coater. Good.

In the method for producing a multicolor pattern sheet of the present invention, a multicolor pattern sheet can be produced at low cost by any of these coating steps.

Further, the transfer step may be one in which the transfer is performed by using a pressing member on the surface of which convex portions having a stripe or matrix pattern are formed.

In the method for producing a multicolor pattern sheet of the present invention, a multicolor pattern sheet having a pattern of any of the above shapes can be produced at low cost.

Further, in the multicolor pattern sheet manufacturing apparatus of the present invention which achieves the above object, a plurality of monochromatic films each having a color ink layer of each color formed on the surface thereof are superposed on a predetermined sheet to form a monochromatic film on the monochromatic film. In a multicolor pattern sheet manufacturing apparatus for manufacturing a multicolor pattern sheet in which a multicolor pattern formed by a plurality of color inks is formed on the surface by repeating the operation of sequentially transferring the color ink layers onto the sheet, Transfer the color ink layer of the monochromatic film onto the sheet, which is composed of a patterning roll having a convex portion of the pattern formed thereon and an opposing roll arranged opposite to the patterning roll with the sheet and the monochromatic film sandwiched therebetween. A transfer means for the plurality of colors, and a sheet supply means for sequentially supplying the sheets to the transfer means for the plurality of colors Between the sheet supplied to the nip portion sandwiched between the patterning roll and the opposing roll and the patterning roll, a monochromatic film of one color among the monochromatic films of the plurality of colors is formed by a color ink layer of the monochromatic film. It is characterized in that it is provided with a monochromatic film supplying means for the above-mentioned plurality of colors, which is supplied in a superposed state so as to come into contact with the above-mentioned sheets.

The multicolor pattern sheet manufacturing apparatus of the present invention is
With this configuration, it is possible to realize a multicolor pattern sheet manufacturing apparatus capable of manufacturing a multicolor pattern sheet with a small number of steps and at low cost.

[0029]

BEST MODE FOR CARRYING OUT THE INVENTION Here, a method for producing an organic thin film element using the method for producing a patterning sheet of the present invention will be described, then an organic thin film layer transfer material will be explained, and finally an organic thin film element will be explained. [1] Method of Manufacturing Organic Thin Film Element In the method of manufacturing an organic thin film element of the present embodiment, a plurality of transfer materials each having an organic thin film layer formed on a temporary support are used to form an organic thin film layer on a substrate by a peel transfer method. The method includes a step of transferring and a step of bonding a substrate having at least one of an electrode, a transparent conductive layer and an organic thin film layer formed on the organic thin film layer provided by the peeling transfer method.

In the peeling transfer method, the organic thin film layer is softened by heating and / or pressurizing the transfer material so that the organic thin film layer is adhered to the film formation surface of the substrate, and then the temporary support is peeled off to remove the organic thin film layer. This is a transfer method in which only the film remains on the film formation surface. Further, the bonding method is a method of bonding the interfaces of at least two surfaces by contact, pressure bonding, fusion bonding, or the like. Specifically, by stacking the organic thin film layer transferred to the film formation surface and the substrate on which at least one of the electrode, the transparent conductive layer and the organic thin film layer is formed, and then applying heat and / or pressure. It is a method of softening the organic thin film layer and adhering it to a substrate on which at least one of an electrode, a transparent conductive layer and an organic thin film layer is formed. In the transfer method and the laminating method used in the present embodiment, heating and pressure may be used alone or in combination.

As the heating means, a generally known method can be used, and for example, a laminator, an infrared heater, a roller heater, a laser, a thermal head or the like can be used. When transferring a large area, a planar heating means is preferable, and a laminator, an infrared heater, a roller heater and the like are more preferable. The temperature for transfer is not particularly limited and may be changed depending on the material of the organic thin film layer and the heating member, but is generally preferably 40 ° C to 250 ° C, and further 50 ° C
-200 degreeC is preferable and 60 to 180 degreeC is especially preferable. However, the preferable range of the temperature for transfer is a heating member,
It is related to the heat resistance of the transfer material and the substrate, and changes as the heat resistance improves.

The pressing means is not particularly limited, but when using a substrate such as glass which is easily broken by strain, it is preferable that it can be uniformly pressed. For example, it is preferable to use a pair of rollers in which one or both of them are made of rubber. Specifically, a laminator (first laminator VA-400III) is used.
(Manufactured by Taisei Laminator Co., Ltd.) and a thermal head for thermal transfer printing can be used.

In the present embodiment, it is also possible to repeat the transfer and peeling process to laminate a plurality of organic thin film layers on the substrate. The plurality of organic thin film layers may have the same composition or different compositions. In the case of the same composition, there is an advantage that it is possible to prevent the layer from coming off due to a transfer failure or a peeling failure.
In the case where different layers are provided, the function can be separated so that the light emission efficiency can be improved. For example, a transparent conductive layer / a light-emitting organic thin film layer / electron can be formed on the deposition surface by the transfer method of this embodiment. Transportable organic thin film layer / electron injection layer / back electrode, transparent conductive layer / hole injection layer / hole transportable organic thin film layer / luminescent organic thin film layer / electron transportable organic thin film layer / electron injection layer /
The back electrode can be stacked. At this time, the transfer temperature is set so that the first transfer layer is not reversely transferred to the next transfer layer.
It is preferable that the temperature at which the previous transfer material is heated be equal to or higher than the temperature at which the next transfer material is heated.

It is preferable to reheat the organic thin film layer transferred to the substrate or the new organic thin film layer transferred to the previously transferred organic thin film layer, if necessary. The reheating causes the organic thin film layer to adhere more closely to the substrate or the previously transferred organic thin film layer. It is preferable to apply pressure as needed during reheating. The reheating temperature is preferably within the range of the transfer temperature ± 50 ° C.

In order to prevent reverse transfer of the previous transfer layer to the next transfer layer, a surface treatment may be performed between the previous transfer step and the next transfer step so as to improve the adhesion to the film-forming surface. Good. Examples of such surface treatment include activation treatments such as corona discharge treatment, flame treatment, glow discharge treatment, and plasma treatment. When the surface treatment is also used, the transfer temperature of the first transfer material may be lower than the transfer temperature of the next transfer material unless reverse transfer is performed.

As an apparatus for producing an organic thin film element, an apparatus for feeding a transfer material having an organic thin film layer formed on a temporary support, and a method for pressing the transfer material against a film formation surface of a substrate by heating the transfer material, An apparatus having a device for transferring the organic thin film layer to the film formation surface of the substrate and a device for peeling the temporary support from the organic thin film layer after the transfer can be used.

The manufacturing apparatus used in this embodiment preferably has a means for preheating the transfer material and / or the substrate before feeding the transfer material to the transfer apparatus. Further, it is preferable to have a cooling device in the latter stage of the transfer device.

It is preferable that a front surface of the transfer device is provided with an entrance angle adjusting section for setting the entrance angle of the transfer material with respect to the substrate to 90 ° or less. On the rear surface of the transfer device or the cooling device, the peeling angle of the temporary support with respect to the organic thin film layer is 9
It is preferable to provide a peeling angle adjusting section for adjusting the angle to 0 ° or more. Details of the method and apparatus for manufacturing these organic thin film elements are described in Japanese Patent Application No. 2001-089663. [2] Transfer Material (1) As the constituent transfer material, a material having an organic thin film layer on a temporary support is used. The transfer material can be prepared by appropriately using a known method, but it is preferable to use the wet method from the viewpoint of productivity. The transfer material provided with the organic thin film layer may be prepared as an independent transfer material, or may be provided in a frame sequential manner.
That is, a plurality of organic thin film layers may be provided on one temporary support. By using this transfer material, a plurality of organic thin film layers can be continuously formed without the need to replace the transfer material.

If a transfer material in which two or more organic thin film layers are preliminarily laminated on the temporary support is used, the multilayer film can be laminated on the film formation surface of the substrate in one transfer process. When preliminarily laminating on a temporary support, if the interface of each organic thin film layer to be laminated is not uniform, uneven movement of holes and electrons will occur, so it is necessary to carefully select the solvent to make the interface uniform. In addition, it is necessary to select an organic compound for the organic thin film layer that is soluble in the solvent. (2) Temporary Support The temporary support used in this embodiment should be made of a material that is chemically and thermally stable and has flexibility, and specifically, a fluororesin [for example, Tetrafluoroethylene resin (PTFE), trifluoroethylene chloride resin (PC
TFE)], polyester (for example, polyethylene terephthalate, polyethylene naphthalate (PEN)), polyarylate, polycarbonate, polyolefin (for example, polyethylene, polypropylene), a thin sheet of polyether sulfone (PES), or a laminate thereof is preferable. The thickness of the temporary support is preferably 1 μm to 100 μm, more preferably 2 μm to 50 μm, and particularly 3 μm.
It is preferably m to 30 μm. (3) Formation of Organic Thin Film Layer on Temporary Support The organic thin film layer containing a polymer compound as a binder is preferably formed on the temporary support by a wet method. For this, the material for the organic thin film layer is dissolved in an organic solvent to a desired concentration, and the resulting solution is applied to a temporary support. The coating method is not particularly limited as long as a dry film thickness of the organic thin film layer is 200 nm or less and a uniform film thickness distribution can be obtained.
A gravure coating method, a die coating method, a bar coating method and the like can be mentioned. (4) Organic thin film layer The organic thin film layer is a layer that constitutes an organic thin film element, and from the characteristics of each, a light emitting organic thin film layer, an electron transporting organic thin film layer, a hole transporting organic thin film layer, an electron injection layer, and hole injection. Layers and the like. The organic thin film layer does not have a photothermal conversion layer (a layer capable of performing photothermal conversion by laser). Further, various layers for improving the color developability can be mentioned. Specific examples of the compound used for each layer are described, for example, in "Organic EL Display" (Techno Times Co., Ltd.), which is a separate volume of "Monthly Display" October 1998 issue.

The glass transition temperature of the organic thin film layer itself or the components therein is preferably 40 ° C. or higher and the transfer temperature + 40 ° C. or lower, more preferably 50 ° C. or higher and the transfer temperature + 20 ° C. or lower, particularly 60 ° C. or higher. And preferably below the transfer temperature. The flow starting temperature of the organic thin film layer of the transfer material itself or the components therein is 40 ° C. or higher, and the transfer temperature is +4.
The temperature is preferably 0 ° C or lower, more preferably 50 ° C or higher and the transfer temperature + 20 ° C or lower, and particularly preferably 60 ° C or higher and the transfer temperature or lower. The glass transition temperature can be measured by a differential scanning calorimeter (DSC). The flow starting temperature can be measured using, for example, a flow tester CFT-500 manufactured by Shimadzu Corporation. (A) Light-Emitting Organic Thin Film Layer As the light-emitting organic thin film layer, one containing at least one light-emitting compound is used. The light emitting compound is not particularly limited, and may be a fluorescent light emitting compound or a phosphorescent light emitting compound. Further, the fluorescent compound and the phosphorescent compound may be used at the same time. In the present embodiment, it is preferable to use a phosphorescent compound from the viewpoint of luminous brightness and luminous efficiency.

Examples of the fluorescent compound include benzoxazole derivatives, benzimidazole derivatives, benzothiazole derivatives, styrylbenzene derivatives, polyphenyl derivatives, diphenylbutadiene derivatives, tetraphenylbutadiene derivatives, naphthalimide derivatives, coumarin derivatives, perylene derivatives, and perinone. Derivatives, oxadiazole derivatives, aldazine derivatives, pyraridine derivatives, cyclopentadiene derivatives, bisstyrylanthracene derivatives, quinacridone derivatives, pyrrolopyridine derivatives, thiadiazolopyridine derivatives, styrylamine derivatives, aromatic dimethylidene compounds, metal complexes (8-quinolinol Derivative metal complex, rare earth complex, etc.), polymer light-emitting compound (polythiophene derivative, polyphenylene derivative, polyphenylene vinyl) Emissions derivatives, polyfluorene derivatives and the like) and the like can be used. These may be used alone or in combination of two or more.

The phosphorescent compound is preferably a compound capable of emitting light from triplet excitons, and orthometallated complex and porphyrin complex are preferred. Among the porphyrin complexes, the porphyrin platinum complex is preferable. The phosphorescent compounds may be used alone or in combination of two or more.

The ortho-metallated complex referred to in the present embodiment is described in Akio Yamamoto, "Organometallic Chemistry: Fundamentals and Applications," 150.
Pp. And 232, Sokabosha (1982), H.M. Ye
Rsin, "Photochemistry and
Photophysics of Coordinat
Ion Compounds ", pp. 71-77 and 13
5 to 146, Springer-Verlag (1
987) and the like.
The ligand forming the ortho-metallated complex is not particularly limited, but a 2-phenylpyridine derivative, a 7,8-benzoquinoline derivative, a 2- (2-thienyl) pyridine derivative,
It is preferably a 2- (1-naphthyl) pyridine derivative or a 2-phenylquinoline derivative. These derivatives may have a substituent. In addition to these ligands essential for forming the orthometalated complex, other ligands may be contained. As the central metal forming the orthometalated complex,
Any transition metal can be used, and rhodium, platinum, gold, iridium, ruthenium, palladium and the like can be preferably used in the present embodiment. The organic thin film layer containing such an orthometallated complex is excellent in light emission brightness and light emission efficiency. Specific examples of the orthometalated complex are described in Japanese Patent Application No. 2000-254171.

The orthometallated complex used in this embodiment is described in Inorg. Chem. , 30, 1685, 199
1, Inorg. Chem. , 27, 3464, 198
8, Inorg. Chem. , 33,545,199
4, Inorg. Chim. Acta, 181, 24
5, 1991, J. Organomet. Chem. ，
335, 293, 1987, J. Am. Chem. So
c. , 107, 1431, 1985 and the like, and can be synthesized by a known method.

The content of the luminescent compound in the luminescent organic thin film layer is not particularly limited, but is preferably 0.1% by mass to 70% by mass, more preferably 1% by mass to 20% by mass. preferable. If the content of the luminescent compound is less than 0.1% by mass or exceeds 70% by mass, the effect may not be sufficiently exhibited.

The luminescent organic thin film layer may contain a host compound, a hole transport material, an electron transport material, an electrically inactive polymer binder and the like, if necessary. The functions of these materials may be simultaneously achieved by one compound. For example, a carbazole derivative functions not only as a host compound but also as a hole transport material.

The host compound is a compound that causes energy transfer from its excited state to the light emitting compound, and as a result causes the light emitting compound to emit light. Specific examples thereof include a carbazole derivative, a triazole derivative, an oxazole derivative, an oxadiazole derivative, an imidazole derivative, a polyarylalkane derivative, a pyrazoline derivative, a pyrazolone derivative, a phenylenediamine derivative, an arylamine derivative, an amino-substituted chalcone derivative, and a styrylanthracene derivative. , Fluorenone derivative, hydrazone derivative, stilbene derivative, silazane derivative, aromatic tertiary amine compound, styrylamine compound, aromatic dimethylidene compound, porphyrin compound, anthraquinodimethane derivative, anthrone derivative, diphenylquinone derivative, thiopyran dioxide Heterocyclic tetra derivatives such as derivatives, carbodiimide derivatives, fluorenylidenemethane derivatives, distyrylpyrazine derivatives, and naphthaleneperylene Rubonic acid anhydride, phthalocyanine derivative, metal complex of 8-quinolinol derivative, metal phthalocyanine, metal complex having benzoxazole or benzothiazole as a ligand, polysilane compound, poly (N-vinylcarbazole) derivative, aniline copolymer Conductive polymers such as thiophene oligomers and polythiophenes, polythiophene derivatives, polyphenylene derivatives, polyphenylene vinylene derivatives, and polyfluorene derivatives. The host compounds may be used alone or in combination of two or more. The content of the host compound in the light emitting organic thin film layer is preferably 0% by mass to 99.9% by mass, and 0% by mass to 9% by mass.
9.0 mass% is more preferable.

The hole transport material is not particularly limited as long as it has any of the function of injecting holes from the anode, the function of transporting holes, and the function of blocking the electrons injected from the cathode. It may be a low molecular weight material or a high molecular weight material. Specific examples thereof include a carbazole derivative, a triazole derivative, an oxazole derivative, an oxadiazole derivative, an imidazole derivative, a polyarylalkane derivative, a pyrazoline derivative, a pyrazolone derivative, a phenylenediamine derivative, an arylamine derivative, an amino-substituted chalcone derivative, and a styrylanthracene derivative. , Fluorenone derivatives, hydrazone derivatives, stilbene derivatives, silazane derivatives, aromatic tertiary amine compounds, styrylamine compounds, aromatic dimethylidene compounds, porphyrin compounds, polysilane compounds, poly (N
-Vinylcarbazole) derivatives, aniline copolymers, thiophene oligomers, conductive polymers such as polythiophenes, polythiophene derivatives, polyphenylene derivatives, polyphenylenevinylene derivatives, polyfluorene derivatives and the like. These may be used alone or in combination of two or more. The content of the hole transport material in the light emitting organic thin film layer is preferably 0% by mass to 99.9% by mass, more preferably 0% by mass to 80.0% by mass.

The electron transport material is not particularly limited as long as it has one of the function of injecting electrons from the cathode, the function of transporting electrons, and the function of blocking the holes injected from the anode. Specific examples thereof include triazole derivatives, oxazole derivatives, oxadiazole derivatives, fluorenone derivatives, anthraquinodimethane derivatives, anthrone derivatives, diphenylquinone derivatives,
Thiopyran dioxide derivative, carbodiimide derivative,
Fluorenylidene methane derivative, distyrylpyrazine derivative, heterocyclic tetracarboxylic acid anhydride such as naphthalene perylene, phthalocyanine derivative, metal complex such as 8-quinolinol derivative, metallophthalocyanine, benzoxazole, benzothiazole, etc. as ligands Metal complex,
Examples thereof include aniline copolymers, thiophene oligomers, conductive polymers such as polythiophene, polythiophene derivatives, polyphenylene derivatives, polyphenylenevinylene derivatives, polyfluorene derivatives and the like. These may be used alone or in combination of two or more. The content of the electron transport material in the light emitting organic thin film layer is 0% by mass to 9%.
9.9 mass% is preferable, and 0 mass% -80.0 mass% is more preferable.

As the polymer binder, polyvinyl chloride, polycarbonate, polystyrene, polymethyl methacrylate, polybutyl methacrylate, polyester, polysulfone, polyphenylene oxide, polybutadiene, hydrocarbon resin, ketone resin, phenoxy resin,
Polyamide, ethyl cellulose, vinyl acetate, ABS resin, polyurethane, melamine resin, unsaturated polyester, alkyd resin, epoxy resin, silicone resin, polyvinyl butyral, polyvinyl acetal and the like can be used. These may be used alone or in combination of two or more. The luminescent organic thin film layer containing a polymer binder can be easily formed by coating on a large area by a wet film forming method.

The thickness of the light emitting organic thin film layer is 10 nm to 20.
The thickness is preferably 0 nm, more preferably 20 nm to 80 nm. If the thickness exceeds 200 nm, the driving voltage may increase. On the other hand, if it is less than 10 nm, the organic thin film element may be short-circuited. (B) Hole Transporting Organic Thin Film Layer The organic thin film element may have a hole transporting organic thin film layer made of the above hole transporting material, if necessary. The hole transporting organic thin film layer may contain the above polymer binder. The thickness of the hole transporting organic thin film layer is 10 nm to 200 nm.
nm is preferable, and 20 nm to 80 nm is more preferable. If the thickness exceeds 200 nm, the driving voltage may increase, and if it is less than 10 nm, the organic thin film element may short-circuit. (C) Electron Transporting Organic Thin Film Layer The organic thin film element may have an electron transporting organic thin film layer made of the above electron transporting material, if necessary. The electron transporting organic thin film layer may contain the polymer binder.
The thickness of the electron transporting organic thin film layer is preferably 10 nm to 200 nm, more preferably 20 nm to 80 nm. If the thickness exceeds 200 nm, the driving voltage may increase, and if it is less than 10 nm, the organic thin film element may short-circuit.

When the organic thin film layer is formed by the wet film forming method, the solvent used for dissolving the material of the organic thin film layer to prepare the coating solution is not particularly limited, and may be a hole transport material, an orthometallated complex, It can be appropriately selected depending on the type of host compound, polymer binder and the like. For example,
Halogen-based solvent (chloroform, carbon tetrachloride, dichloromethane, 1,2-dichloroethane, chlorobenzene, etc.), ketone-based solvent (acetone, methyl ethyl ketone,
Diethyl ketone, n-propyl methyl ketone, cyclohexanone, etc.), aromatic solvents (benzene, toluene, xylene, etc.), ester solvents (ethyl acetate, n-propyl acetate, n-butyl acetate, methyl propionate, ethyl propionate) , Γ-butyrolactone, diethyl carbonate, etc., ether solvents (tetrahydrofuran, dioxane, etc.), amide solvents (dimethylformamide, dimethylacetamide, etc.), dimethyl sulfoxide, water and the like. The solid content in the coating liquid for the organic thin film layer is not particularly limited, and its viscosity can be arbitrarily selected according to the wet film forming method.

When forming a plurality of organic thin film layers, in addition to the transfer method, dry film forming methods such as vapor deposition and sputtering, dipping, spin coating, dip coating, casting,
A wet film forming method such as a die coating method, a roll coating method, a bar coating method and a gravure coating method, a printing method and the like can be used together. [3] Organic thin film element (1) Structure The whole structure of the organic thin film element is as follows:
Light emitting organic thin film layer / back electrode, transparent conductive layer / light emitting organic thin film layer / electron transporting organic thin film layer / back electrode, transparent conductive layer / hole transporting organic thin film layer / light emitting organic thin film layer / electron transporting organic Thin film layer / back electrode, transparent conductive layer / hole transporting organic thin film layer / light emitting organic thin film layer / back electrode, transparent conductive layer / light emitting organic thin film layer / electron transporting organic thin film layer / electron injection layer / back electrode, A structure in which a transparent conductive layer / hole injection layer / hole transporting organic thin film layer / light emitting organic thin film layer / electron transporting organic thin film layer / electron injection layer / back electrode is laminated in this order,
A configuration in which these are laminated in reverse may be used. The light-emitting organic thin film layer contains a fluorescent light-emitting compound and / or a phosphorescent light-emitting compound, and light is usually taken out from the transparent conductive layer. Specific examples of the compound used for each layer are described, for example, in "Organic EL Display" (Techno Times Co., Ltd.), which is a separate volume of "Monthly Display" October 1998 issue. (2) Substrate support The substrate support is a zirconia-stabilized yttrium (YS
Z), inorganic materials such as glass, polyesters such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate, polystyrene, polycarbonate, polyether sulfone, polyarylate, allyl diglycol carbonate, polyimide, polycycloolefin, norbornene resin, polychloro Polymer materials such as trifluoroethylene, Teflon (registered trademark), polytetrafluoroethylene-polyethylene copolymers, metal foils such as aluminum foil, copper foil, stainless steel foil, gold foil, silver foil, polyimide, and liquid crystalline polymer plastic sheet And the like. In the present embodiment, it is preferable to use a flexible substrate support from the viewpoints of difficulty in breaking, bending, lightness, and the like. Materials for forming such a substrate support include heat resistance, dimensional stability, solvent resistance,
Polyimide, polyester, polycarbonate, polyether sulfone, metal foil (aluminum foil, copper foil, which has excellent electric insulation and processability, and low air permeability and low moisture absorption)
Stainless steel foil, gold foil, silver foil, etc.), liquid crystal polymer plastic sheet, fluorine atom-containing polymer materials (polychlorotrifluoroethylene, Teflon (registered trademark), polytetrafluoroethylene-polyethylene copolymer, etc.)
Etc. are preferred.

The shape, structure, size and the like of the substrate support can be appropriately selected according to the use and purpose of the organic thin film element. The shape is generally a plate. The structure may be a single layer structure or a laminated structure. The substrate support may be formed of a single member or two or more members. The substrate support may be either transparent or opaque. However, when the emitted light is taken out from the support side because the transparent electrode described later is on the substrate support side from the organic layer including the light emitting layer, it is preferable that the substrate support is colorless transparent or colored transparent, and light scattering and attenuation From the viewpoint of suppressing, colorless and transparent is preferable.

As a flexible substrate support which does not short-circuit when an electrode is formed to produce a light emitting device, a substrate support having an insulating layer provided on one side or both sides of a metal foil is preferable. The metal foil is not particularly limited, and metal foil such as aluminum foil, copper foil, stainless steel foil, gold foil, and silver foil can be used. Among them, aluminum foil or copper foil is preferable from the viewpoint of ease of processing and cost. The insulating layer is not particularly limited, and examples thereof include inorganic substances such as inorganic oxides and inorganic nitrides, polyesters such as polyethylene terephthalate, polybutylene phthalate and polyethylene naphthalate, polystyrene, polycarbonate, polyether sulfone, polyarylate, allyl diglycol. It can be formed of a plastic such as carbonate, polyimide, polycycloolefin, norbornene resin, poly (chlorotrifluoroethylene), or polyimide.

The substrate support has a coefficient of linear thermal expansion of 20 pp.
It is preferably m / ° C or lower. The coefficient of thermal expansion is measured by a method of heating at a constant rate and detecting a change in the length of the sample, and is mainly measured by the TMA method. Thermal expansion coefficient is 2
If it is higher than 0 ppm / ° C., it may cause peeling of the electrode or the organic thin film layer due to heat during the laminating process or during use, resulting in deterioration of durability.

The coefficient of linear thermal expansion of the insulating layer provided on the substrate support is also preferably 20 ppm / ° C. or less. Materials for forming the insulating layer having a coefficient of thermal expansion of 20 ppm / ° C. or less include metal oxides such as silicon oxide, germanium oxide, zinc oxide, aluminum oxide, titanium oxide, and copper oxide, and silicon nitride, germanium nitride, and aluminum nitride. And the like, and these can be used alone or in combination of two or more. The thickness of the inorganic insulating layer of metal oxide and / or metal nitride is preferably 10 nm to 1000 nm. If the inorganic insulating layer is thinner than 10 nm, the insulating property is too low. Also. If the inorganic insulating layer is thicker than 1000 nm, cracks are likely to occur, pinholes are formed, and the insulating property is deteriorated. The method for forming an insulating layer of a metal oxide and / or a metal nitride is not limited, and a dry method such as a vapor deposition method, a sputtering method, a CVD method, a wet method such as a sol-gel method, or a metal oxide. And / or a method of dispersing particles of metal nitride in a solvent and coating the particles can be used.

As the plastic material having a coefficient of linear thermal expansion of 20 ppm or less, particularly polyimide or liquid crystal polymer can be preferably used. Details of the properties of these plastic materials are described in "Plastic Data Book" (edited by Asahi Kasei Amidas "Plastic" editorial department). When polyimide or the like is used as the insulating layer, it is preferable to laminate a sheet of polyimide or the like and an aluminum foil. The thickness of the sheet such as polyimide is 10
It is preferably in the range of μm to 200 μm. If the thickness of the sheet of polyimide or the like is less than 10 μm, handling during lamination becomes difficult. The thickness of the sheet of polyimide is 2
If it is thicker than 00 μm, the flexibility is impaired and the handling becomes inconvenient. The insulating layer may be provided on only one side of the metal foil, or may be provided on both sides. When provided on both sides, both sides may be a metal oxide and / or a metal nitride, and both sides may be a plastic insulating layer such as polyimide. Further, one side may be an insulating layer made of metal oxide and / or metal nitride, and the other side may be a polyimide sheet insulating layer. If necessary, a hard coat layer or an undercoat layer may be provided.

A moisture permeation preventive layer (gas barrier layer) may be provided on the surface of the substrate support on the electrode side, the surface opposite to the electrode, or both. As a material forming the moisture permeation preventive layer, it is preferable to use an inorganic substance such as silicon nitride or silicon oxide. The moisture permeation preventive layer can be formed by a high frequency sputtering method or the like.
If necessary, the substrate support may be provided with a hard coat layer or an undercoat layer.

A substrate in which an insulating layer is provided on one side or both sides of a metal foil is preferable. The metal foil is not particularly limited, and metal foil such as aluminum foil, copper foil, stainless steel foil, gold foil, and silver foil can be used. Among them, aluminum foil or copper foil is preferable from the viewpoint of ease of processing and cost. The insulating layer is not particularly limited, for example, inorganic materials such as inorganic oxides and inorganic nitrides, polyester such as polyethylene terephthalate, polybutylene phthalate, polyethylene naphthalate, polystyrene, polycarbonate, polyether sulfone, polyarylate, allyl diglycolate. It can be formed of a plastic such as carbonate, polyimide, polycycloolefin, norbornene resin, poly (chlorotrifluoroethylene), or polyimide.

The water permeability of the substrate support is 0.1 g / m.
² · day or less, preferably 0.05 g / m ² ·
It is more preferably less than or equal to day, and is 0.01 g / m ²
It is particularly preferable that it is not more than day. The oxygen permeability is preferably not more than ^{0.1ml / m 2 · day · atm} , more preferably not more than ^{0.05ml / m 2 · day · atm} , 0.01ml / m 2 · day ·
It is particularly preferable that it is atm or less. Water permeability is JI
Method based on SK7129B method (mainly MOCON
Method). Oxygen permeability is JISK7126
It can be measured by a method based on the B method (mainly MOCON method). By doing so, it becomes possible to prevent moisture and oxygen from entering the light emitting element, which causes deterioration of durability. (3) Electrode (Cathode or Anode) Either the transparent conductive layer or the back electrode can be used as a cathode or an anode, and either one is determined by the composition of the organic thin film element. It is sufficient that the anode usually has a function as an anode for supplying holes to the organic thin film layer, and there is no particular limitation on its shape, structure, size, etc. Accordingly, it can be appropriately selected from known electrodes.

As a material for forming the cathode, a simple metal, an alloy, a metal oxide, an electrically conductive compound, a mixture thereof or the like can be used, and the work function is preferably 4.
A material of 5 eV or less is used. Specific examples include alkali metals (eg, Li, Na, K, Cs, etc.), alkaline earth metals (eg, Mg, Ca, etc.), gold, silver, lead, aluminum, sodium-potassium alloy, lithium-aluminum alloy, magnesium-. Examples include silver alloys, indium, rare earth metals (ytterbium, etc.), and the like. One of these may be used alone, but it is preferable to use two or more of them together from the viewpoint of achieving both stability and electron injection properties.

Among these, alkali metals and alkaline earth metals are preferable from the viewpoint of electron injection property, and materials mainly containing aluminum are preferable from the viewpoint of storage stability. Here, the material containing aluminum as the main component is not limited to aluminum alone, or an alloy of aluminum and 0.01% by mass to 10% by mass of an alkali metal or an alkaline earth metal (for example, lithium-aluminum alloy, magnesium-aluminum). Alloy, etc.) or mixture.

When taking out light from the cathode side, it is necessary to use a transparent cathode. The transparent cathode may be substantially transparent to light. In order to achieve both electron injection property and transparency, a two-layer structure of a thin metal layer and a transparent conductive layer may be used. The material of the thin film metal layer is described in detail in JP-A-2-15595 and JP-A-5-121172. The metal layer of the thin film has a thickness of 1 n
It is preferably m to 50 nm. When it is 1 nm or less, it becomes difficult to uniformly form a thin film layer. Again 5
When it is thicker than 0 nm, the transparency to light becomes poor.

The material used for the transparent conductive layer is not particularly limited as long as it is a transparent material having conductivity or semiconductivity.
The material used for the above anode can be preferably used. Examples of preferable materials include tin oxide (ATO, FTO) doped with antimony and fluorine, tin oxide, zinc oxide, indium oxide, indium tin oxide (ITO), zinc indium oxide (IZO), and the like. .
The thickness of the transparent conductive layer is preferably 30 nm to 500 nm. If the transparent conductive layer is thinner than 30 nm, the conductivity or semiconductivity is poor, and if it is thicker than 500 nm, the productivity is poor.

The method of forming the cathode is not limited, and a known method can be adopted, but it is preferably performed in a vacuum device. For example, it is appropriately selected from physical methods such as vacuum deposition method, sputtering method and ion plating method and chemical methods such as CVD and plasma CVD method in consideration of suitability for the material of the cathode. For example, when a metal or the like is selected as the material of the cathode, one kind or two or more kinds of metals can be simultaneously or sequentially formed by a sputtering method or the like. When an organic conductive material is used, a wet film forming method may be used.

The patterning of the cathode can be performed by chemical etching such as photolithography, physical etching using laser or the like, vacuum vapor deposition method using a mask, sputtering method, lift-off method or printing method.

A dielectric layer made of a fluoride of an alkali metal or an alkaline earth metal is provided between the cathode and the organic thin film layer.
It may be inserted with a thickness of 1 nm to 5 nm. The dielectric layer is
For example, it can be formed by a vacuum vapor deposition method, a sputtering method, an ion plating method, or the like. (4) Patterning At this time, the multicolor patterning method of this embodiment is applied. That is, a pattern corresponding to a plurality of colors is formed by the following steps. Details will be shown in Examples described later.

I) Three types of monochromatic films corresponding to RGB are prepared by coating a temporary support with a uniform film thickness.

Ii) The coated surface of one type of monochromatic film is superposed on the sheet to be patterned.

Iii) From the back side of the single-color film, a pressing member having convex portions of a predetermined pattern is pressed to transfer only the pattern portion corresponding to the convex portions to the sheet.

Iv) Still another monochromatic film iii)
Similarly to the above, the pattern portion is transferred to the sheet.

However, at this time, the position of the pattern transferred in step iii) is read, and the predetermined position alignment is performed, and then the second transfer is performed.

V) Transfer of the third color is performed in the same manner as in iv).

As a result, a patterned organic thin film layer on which a plurality of organic thin film layers having different compositions are formed can be manufactured. (5) Other layers As a layer constituting the organic thin film element, it is preferable to provide a protective layer or a sealing layer in order to prevent deterioration of light emitting performance. Furthermore, if the transfer material does not affect the light emitting performance, a release layer may be provided between the temporary support and the organic thin film layer or an adhesive layer may be provided between the organic thin film layer and the film formation surface in order to improve transferability. It may be provided. (A) The protective layer organic thin film element is described in JP-A-7-85974 and JP-A-7-85974.
No. 192866, No. 8-22891, No. 10
It may have a protective layer described in JP-A-275682 and JP-A-10-106746. The protective layer is formed on the uppermost surface of the organic thin film element. Here, the top surface refers to the outer surface of the back electrode when, for example, a substrate support, a transparent conductive layer, an organic thin film layer, and a back electrode are laminated in this order, and also, for example, the substrate support, back electrode, and organic thin film layer. When the transparent conductive layer is laminated in this order, it means the outer surface of the transparent conductive layer. The shape, size, thickness, etc. of the protective layer are not particularly limited. The material forming the protective layer is not particularly limited as long as it has a function of suppressing entry or permeation of an organic thin film element such as water or oxygen that may deteriorate the element,
For example, silicon monoxide, silicon dioxide, germanium monoxide, germanium dioxide, etc. can be used.

The method for forming the protective layer is not particularly limited, and examples thereof include vacuum deposition method, sputtering method, reactive sputtering method, molecular sen epitaxy method, cluster ion beam method, ion plating method, plasma polymerization method, plasma CVD method, A laser CVD method, a thermal CVD method, a coating method or the like can be applied. (B) Sealing Layer It is preferable that the organic thin film element is provided with a sealing layer for preventing intrusion of water and oxygen. As a material for forming the sealing layer, a copolymer of tetrafluoroethylene and at least one comonomer, a fluorine-containing copolymer having a cyclic structure in the copolymer main chain, polyethylene, polypropylene, polymethylmethacrylate, polyimide, Copolymers of polyurea, polytetrafluoroethylene, polychlorotrifluoroethylene, polydichlorodifluoroethylene, chlorotrifluoroethylene or dichlorodifluoroethylene with other comonomers, water-absorbing substances with a water absorption of 1% or more, water absorption of 0. Moisture-proof substances less than 1%, metals (In, S
n, Pb, Au, Cu, Ag, Al, Ti, Ni, etc.),
Metal oxides (MgO, SiO, SiO ₂ , Al ₂ O ₃ , G
eO, NiO, CaO, BaO, Fe ₂ O ₃ , Y ₂ O ₃ , T
iO _2, etc.), metal fluorides (MgF ₂ , LiF, Al
F ₃ , CaF _2, etc.), liquid fluorinated carbon (perfluoroalkane, perfluoroamine, perfluoroether, etc.), liquid fluorinated carbon in which an adsorbent for water or oxygen is dispersed, and the like can be used.

For the purpose of blocking moisture and oxygen from the outside,
It is preferable to seal the organic thin film layer with a sealing member such as a sealing plate or a sealing container. The sealing member may be provided only on the back electrode side, or the entire light emitting laminate may be covered with the sealing member. The shape, size, thickness, etc. of the sealing member are not particularly limited as long as the organic thin film layer can be sealed and the outside air can be blocked. As a material used for the sealing member, glass, stainless steel, metal (aluminum or the like), plastic (polychlorotrifluoroethylene, polyester, polycarbonate or the like), ceramic or the like can be used.

When the sealing member is installed on the light emitting laminate,
A sealing agent (adhesive) may be used as appropriate. When the entire light emitting laminate is covered with the sealing member, the sealing members may be heat-sealed without using the sealing agent. An ultraviolet curable resin, a thermosetting resin, a two-component curable resin, or the like can be used as the sealing agent.

Further, a water absorbent or an inert liquid may be inserted in the space between the sealed container and the organic thin film element. The water absorbent is not particularly limited, and specific examples include barium oxide,
Sodium oxide, potassium oxide, calcium oxide, sodium sulfate, calcium sulfate, magnesium sulfate, phosphorus pentoxide, calcium chloride, magnesium chloride, copper chloride,
Cesium fluoride, niobium fluoride, calcium bromide, vanadium bromide, molecular sieves, zeolite, magnesium oxide and the like can be mentioned. As the inert liquid, paraffins, liquid paraffins, fluorine-based solvents (perfluoroalkane, perfluoroamine, perfluoroether, etc.), chlorine-based solvents, silicone oils and the like can be used.

In the light emitting device of this embodiment, a direct current voltage (which may include an alternating current component if necessary) is applied between the anode and the cathode.
Light can be emitted by applying (normally 2V to 40V) or a direct current. Regarding the driving method of the light emitting element, JP-A-2-146887 and 6-30
No. 1355, No. 5-29080, No. 7-13.
No. 4558, No. 8-234685, No. 8-2
The methods described in JP41047, US Pat. No. 5,828,429, US Pat. No. 5,023,308, Japanese Patent No. 2784615, etc. can be used.

[0081]

Embodiments of the present invention will be described below only with respect to the contents described in the above section "Patterning".

FIG. 1 is a process drawing showing an embodiment of the method for producing a multicolor pattern sheet of the present invention.

FIG. 1A shows three types of monochromatic films 11a, 11b, produced by the monochromatic film production process.
11c is shown. In the monochromatic film production process of the present embodiment, RGB3 color inks (luminescent materials) are applied on the film 10 and dried to form RGB3 on the surface.
Three kinds of monochromatic films 11a, 11b, 11 on which color color ink layers 12a, 12b, 12c are respectively formed
Create c. In the above description, the sheet is called a temporary support. Details of these coating methods will be described later.

Next, the transfer process will be described.

The transfer process is shown in FIGS. 1 (b) to 1 (c). In this transfer step, the sheet 20 is provided on the sheet 20 with a single color film of one of the three types of single color films 11a, 11b and 11c, for example, an R color single color film 11a.
Are superposed so that the color ink layer 12a of the monochromatic film 11a contacts the sheet 20, and the superposed sheet 20 and monochromatic film 11a
The back surface 13a of the surface 1a on which the color ink layer 12a is formed
Then, the color ink layer 12a is pressed by the pressing member 30 on the surface of which the convex portions 23 having a predetermined pattern are formed.
The portion corresponding to the pattern of the convex portion 23 of the sheet 2
The operation of transferring to 0 is repeated for three colors of RGB, and
As shown in (d), a predetermined pattern of R is formed on the sheet 20.
Patterns 21a, 21 formed by color ink layers of three colors of GB
A multicolor pattern sheet 21 having b and 21c formed is manufactured.

As the sheet 20, a material such as resin, metal, glass or the like can be used.

Further, the transfer method is preferably a transfer method in which a pressing means and a heating means are used in combination.

As the pressing member 30, for example, a flat plate or the like can be used to manufacture a multicolor pattern sheet in a batch system. As the pressing member 30, for example, a multicolor pattern sheet shown in FIG. 5 is manufactured. As in the apparatus, it is preferable to produce a multicolor pattern sheet as a continuous process by using a transfer means composed of a patterning roll having a convex pattern of a predetermined pattern formed on the surface and a facing roll.

FIG. 2 is a diagram showing a striped pattern of the multicolor pattern sheet of this embodiment.

As shown in FIG. 2, the multicolor pattern sheet 21 has a stripe-shaped pattern 21 of three colors RGB.
a, 21b, 21c are formed.

FIG. 2 shows an example of a multicolor pattern sheet on which a stripe pattern is formed, but a matrix pattern may be formed instead of such a stripe pattern.

FIG. 3 is a diagram showing a matrix pattern of the multicolor pattern sheet of this embodiment.

As shown in FIG. 3, the multicolor pattern sheet 21 has a matrix pattern 22 of RGB three colors.
a, 22b, 22c are formed. In order to manufacture a multicolor pattern sheet having this matrix-shaped pattern, convex portions 23 are formed in a matrix on the surface of the pressing member 30 shown in FIG. 1B, and the pressing member is used. A transfer process may be performed.

Next, the coating method in this embodiment will be described.

FIG. 4 is a schematic diagram of the coating method adopted in this embodiment.

FIG. 4A shows a die coater type coating method, in which the ink contained in the die 31 is supplied onto the film 10 conveyed in the direction of the arrow A to form the film 10.
Ink 32 is applied on top.

FIG. 4 (b) shows a coating method of the bar coater method, in which the film 10 conveyed in the direction of arrow A is moved by the bar 34 which is partially immersed in the ink in the ink tank 33 and rotates in the direction of arrow B. Ink 32 is applied.

FIG. 4C shows a coating method of a gravure coater method, which is immersed in the ink in the ink tank 33 and rotates in the direction of arrow B, and the direction of arrow C facing the coating roll 35. The pressure roller 36 rotating in the direction of
Apply.

Next, the multicolor pattern sheet manufacturing apparatus of the present invention will be described.

FIG. 5 is a schematic block diagram showing an embodiment of the multicolor pattern sheet manufacturing apparatus of the present invention.

As shown in FIG. 5, this multicolor pattern sheet manufacturing apparatus has a transparent glass substrate 22 on which RGB color ink layers 12a, 12b and 12c are formed.
These kinds of monochromatic films 11a, 11b, 11c (see FIG. 1) are sequentially superposed and these monochromatic films 11a, 11b
Color ink layers 12a, 12b, 12 on 1b, 11c
The operation of sequentially transferring c to the transparent glass substrate 22 is repeated for three colors to produce a multicolor pattern sheet having a multicolor pattern formed of three color inks on the surface.

That is, in this multicolor pattern sheet manufacturing apparatus, the patterning rolls 41a, 41b and 41c having the projections of the striped pattern formed on the surface thereof, the transparent glass substrate 22 and the monochromatic films 11a and 11 are formed.
The color ink layer of the monochromatic film, which is composed of opposed rolls 42a, 42b and 42c arranged to face the patterning rolls 41a, 41b and 41c with one of b and 11c interposed therebetween, is transparent glass. Transferring means 40 for three colors to be transferred to the substrate 22, and transparent glass substrate 22
Sheet supplying means 50 for supplying R to the transfer means 40 for R color
And the nip portion 4 sandwiched between the patterning rolls 41a, 41b, 41c and the opposing rolls 42a, 42b, 42c.
Between the transparent glass substrate 22 and the patterning rolls 41a, 41b, 41c supplied to the No. 4, one of the monochromatic films 11a, 11b, 11c of three colors, and the color ink layer of the monochromatic film is transparent. Supply in a state of overlapping so as to contact the glass substrate 22 3
A monochromatic film supply means 60 for each color is provided.

The monochromatic film supply means 60 for three colors is composed of feed rolls 61a, 61b and 61c and winding rolls 62a, 62b and 62c.

The transparent glass substrate 22 in this embodiment corresponds to the sheet according to the present invention, and the sheet is not limited to glass, and various resins can be used.

An example of manufacturing a multicolor pattern sheet by this multicolor pattern sheet manufacturing apparatus will be described below.

Binders, alcohols, and coating aids are mixed in advance with the three types of RGB pigments and dispersed to prepare three types of RGB inks. These 3 types of RGB inks were applied to a PET (polyethylene terephthalate) film surface having a thickness of 20 μm with a die coater shown in FIG. 4A at a width of 1 m and a coating speed of 20 m / min.
By coating and drying, the three types of monochromatic films 11a, 11b, 11c having color ink layers 12a, 12b, 12c of RGB three colors formed on the surface (see FIG. 1).
To make. The coating thickness of each color ink is about 20 μ in the wet state and about 0.1 μ in the dried state.

Next, each of these monochromatic films 11a, 1
1b and 11c are respectively loaded into the monochromatic film supply means 60 including the delivery rolls 61a, 61b and 61c and the winding rolls 62a, 62b and 62c of the multicolor pattern sheet manufacturing apparatus shown in FIG.

Next, the sheet supply means 50 conveys the transparent glass substrate 22 in the direction of arrow A and supplies it to the nip portion 44 sandwiched between the patterning roll 41a for R color and the counter roll 42b. In the nip portion 44, the R color monochromatic film 11a supplied from the delivery roll 61a and wound by the take-up roll 62a is superposed so that the color ink layer 12a thereof contacts the transparent glass substrate 22. By the patterning roll 41a which is supplied and has the projections of the striped pattern formed on the surface,
A portion of the color ink layer 12a corresponding to the pattern of the convex portion 23 is transferred to the transparent glass substrate 22. At this time, the temperature of each patterning roll is 150 ° C., the transfer pressure is 5 kg / cm ² , and the feeding speed of each monochromatic film is 2 m /
It is min.

Thus, the transparent glass substrate 22 has a width of 200
A stripe-shaped pattern having a width of μ and a distance of 550 μ is formed. A multicolor pattern sheet is continuously manufactured by performing the above-mentioned transfer with respect to monochromatic films of three types of RGB.

Next, the patterning roll used in the present multicolor pattern sheet manufacturing apparatus will be described.

FIG. 6 is a sectional view of the patterning roll in the present embodiment taken along the rotational axis.

As shown in FIG. 6, the patterning roll 4
1a, 41b, and 41c (see FIG. 5) are formed with stripe-shaped convex portions 23 in the circumferential direction, but the positions of the convex portions 23 of each patterning roll in the roll width direction are different from each other. Thus, stripes of respective colors are formed at different positions in the rotation axis direction of the glass substrate 22 (see FIG. 5).

The diameter of each patterning roll is 200.
mm, and the width of the convex portion 23 in the roll rotation axis direction is 200.
μ, the width of the concave portions other than the convex portion 23 in the roll rotation axis direction is 55
It is patterned to 0 μ.

Each patterning roll has a built-in heat source, and the monochromatic film and the transparent glass substrate are pressed by the heating by the heat source and the patterning roll and the facing roll positioned opposite to the patterning roll. Then, the color ink layer is transferred from the monochromatic films 11a, 11b, 11c to the transparent glass substrate 22.

The convex pattern formed on the patterning roll is not limited to the stripe pattern shown in FIG. 6, but may be a matrix pattern shown in FIG.

Next, another embodiment will be described.

The three types of RGB inks were changed as follows, and by the die coater shown in FIG. 4A, the color ink layers 12a, 12b, 12c of three RGB colors were formed on the surface of a PET (polyethylene terephthalate) film having a thickness of 6 μm.
Types of monochromatic films 11a, 11b, 1 on which
1c (see FIG. 1) was produced. The coating thickness of each color ink was adjusted to be about 0.05 μm in a dried state. -RGB ink composition: Compound selected from structural formula [Chemical formula 1]: 1 part by mass Structural formula [Chemical formula 2] (weight average molecular weight 17,000): 40 parts by mass Dichloroethane: 3200 parts by mass

[0118]

[Chemical 1]

[0119]

[Chemical 2]

Regarding the compound selected from [Chemical Formula 1], B is selected from B-1 and B-2, and G is G-1 and G-.
2 was selected, R was selected from R-1, R-2, and R-3, and two types each of B and G and R3 types of single color films were prepared.

Then, the following substrate A was used in place of the transparent glass substrate 22, but a multicolor pattern could be similarly created. -Production of Substrate A: A polyimide film (UPILEX-50S, manufactured by Ube Industries, Ltd.) having a thickness of 50 μm was placed in a cleaning container, washed with isopropyl alcohol (IPA), and then subjected to oxygen plasma treatment. Al was vapor-deposited on one surface of the glass plate which had been subjected to the oxygen plasma treatment in a reduced pressure atmosphere of about 0.1 mPa to form an electrode having a film thickness of 0.3 μm.
Further, as a dielectric layer, LiF was vapor-deposited in the same pattern as the Al layer to have a film thickness of 3 nm. An aluminum lead wire was connected to the Al electrode to form a laminated structure. Next, an electron transporting compound having the following structural formula [Chemical Formula 3] was vapor-deposited in a reduced pressure atmosphere of about 0.1 mPa to form an electron transporting organic thin film layer having a thickness of 9 nm on LiF.

[0122]

[Chemical 3]

Then, the following transparent substrate B or C and substrate A
And are overlapped so that the electrodes face each other with the light-emitting organic thin film layer sandwiched therebetween, and a pair of heat rollers are used at 160 ° C., 0.
When heat and pressure were applied at 3 MPa and 0.05 m / min to bond them, good RGB pattern color development was obtained. -Preparation of transparent substrate B Using a glass plate having a thickness of 0.5 mm, this substrate support was introduced into a vacuum chamber, and the SnO ₂ content was 10% by mass.
Using an ITO target (indium: tin = 95: 5 (molar ratio)) of DC magnetron sputtering (conditions: substrate support temperature 250 ° C., oxygen pressure 1 × 10 ⁻³ P
According to a), a transparent electrode made of an ITO thin film having a thickness of 0.2 μm was formed. The surface resistance of the ITO thin film was 10Ω / □. Aluminum releasable from transparent electrode (ITO)
The lead wires were connected to form a laminated structure. The glass plate on which the transparent electrode was formed was placed in a cleaning container, washed with isopropyl alcohol (IPA), and then subjected to oxygen plasma treatment. A coating solution having the following composition was applied on the surface of the treated transparent electrode by a die coater shown in FIG. 4 (a) and dried at room temperature to form a hole transporting organic thin film layer having a thickness of 100 nm.

Hole transporting compound (PTPDES) represented by the structural formula [Chemical Formula 4]: 40 parts by mass Additive (TBPA) represented by the structural formula [Chemical Formula 5]: 10 parts by mass Dichloroethane: 3200 parts by mass

[0125]

[Chemical 4]

[0126]

[Chemical 5]

Preparation of Substrate C An aqueous dispersion of polyethylenedioxythiophene / polystyrenesulfonic acid (Bayer P, Baytron P: solid content 1.
3% by mass), and the substrate B was prepared in the same manner as the substrate B except that drying was performed at 150 ° C. for 2 hours under vacuum.

The results of BGR pattern emission are summarized in the table below.

The uniformity of patterning was observed with a microscope of × 100. When there was a lack, it was evaluated as ×, and when there was no defect and it was good, it was evaluated as ◯.

The light emission voltage is shown in the table below when the light emission is 100 cd / m ² . As a result, it was confirmed that the patterning according to the present invention caused uniform light emission.

[0131]

[Table 1]

[0132]

As described above, according to the method for producing a multicolor pattern sheet of the present invention, a monochromatic film producing step of producing a monochromatic film of a plurality of colors having a color ink layer formed on the surface thereof, An operation of transferring a color ink layer to a sheet by stacking a single color film of one of the plurality of color single color films and pressing the same with a pressing member having a convex portion of a predetermined pattern formed on the surface. Since the multicolor pattern sheet is manufactured by the transfer step of repeatedly forming the multicolor pattern on the sheet, it is possible to manufacture the multicolor pattern sheet at a low cost with a small number of steps.

Further, it is possible to manufacture a multicolor pattern sheet having a color ink layer having a uniform thickness, without being affected by the physical properties and formulation of the colored ink.

Further, according to the multicolor pattern sheet manufacturing apparatus of the present invention, transfer of a plurality of colors including a patterning roll having convex portions of a predetermined pattern formed on the surface and an opposing roll arranged to face the patterning roll is performed. Unit, a sheet supply unit that sequentially supplies the sheets to the transfer units for a plurality of colors, and a single-color film of one color between the sheet and the patterning roll that are supplied to the nip portion sandwiched between the patterning roll and the opposing roll. It is possible to realize a multicolor pattern sheet manufacturing apparatus having a low equipment cost and a high productivity by providing a plurality of colors of monochromatic film supplying means for supplying in a state of being superposed on the sheet.

[Brief description of drawings]

FIG. 1 is a process drawing showing an embodiment of a method for producing a multicolor pattern sheet of the present invention.

FIG. 2 is a diagram showing a striped pattern of the multicolor pattern sheet of the present embodiment.

FIG. 3 is a diagram showing a matrix pattern of the multicolor pattern sheet of the present embodiment.

FIG. 4 is a schematic diagram of a coating method adopted in this embodiment.

FIG. 5 is a schematic configuration diagram showing an embodiment of a multicolor pattern sheet manufacturing apparatus of the present invention.

FIG. 6 is a cross-sectional view of the patterning roll in the present embodiment in the rotation axis direction.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Tadahiro Kigazawa             200, Onakazato, Fujinomiya City, Shizuoka Prefecture Fuji Photo             Within Film Co., Ltd. (72) Inventor Ryuichi Katsumoto             200, Onakazato, Fujinomiya City, Shizuoka Prefecture Fuji Photo             Within Film Co., Ltd. F term (reference) 2H048 BA02 BA42 BB02 BB42                 3K007 AB04 AB18 BB06 DB03

Claims (4)

[Claims] 1. A monochromatic film producing step of producing a monochromatic film of a plurality of colors having a color ink layer formed on the surface thereof by applying inks of respective colors to a plurality of films and drying the inks. One of multiple color monochromatic films
A color monochromatic film is superposed such that the color ink layer of the monochromatic film contacts the sheet, and the superposed sheet and monochromatic film are pressed by a pressing member having a convex portion of a predetermined pattern formed on the surface. Transfer by which the operation of transferring a portion of the color ink layer corresponding to the pattern of the convex portion to the sheet is repeated for the plurality of colors to form a multicolor pattern of the color inks of the plurality of colors on the sheet. A method for producing a multicolor pattern sheet, which comprises: 2. The monochromatic film producing step includes a step of applying an ink of a predetermined color onto the sheet by any one of a die coater, a bar coater, a spin coater and a gravure coater. Item 2. A method for producing a multicolor pattern sheet according to Item 1. 3. The transfer method according to claim 1, wherein the transfer step is performed by using a pressing member having a convex portion having a stripe-shaped or matrix-shaped pattern formed on a surface thereof. Color pattern sheet manufacturing method. 4. An operation of superposing a plurality of monochromatic films each having a color ink layer of each color on a surface of a predetermined sheet and sequentially transferring the color ink layers on the monochromatic film to the sheet. In a multicolor pattern sheet manufacturing apparatus for manufacturing a multicolor pattern sheet in which a multicolor pattern formed by a plurality of color inks is repeatedly formed on the surface, a patterning roll having a convex portion of a predetermined pattern formed on the surface, and the sheet. And a transfer means for transferring the color ink layer of the monochromatic film to the sheet, the transfer means comprising a counter roll arranged to face the patterning roll with the monochromatic film interposed therebetween, and the sheet. Is sandwiched between the patterning roll and the opposing roll, and a sheet supply unit that sequentially supplies the plurality of colors to the transfer unit. Between the sheet supplied to the nip portion and the patterning roll, a monochromatic film of one color of the monochromatic films of the plurality of colors was superposed such that the color ink layer of the monochromatic film was in contact with the sheet. An apparatus for producing a multicolor pattern sheet, comprising: a single-color film supply means for supplying a plurality of colors.