JP2003136273A - Laser beam machining line for integrated manufacturing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a process suitable for continuously and efficiently manufacturing a structure which has a structural changing part by emitting an ultrashort pulsed laser to a material to be machined. SOLUTION: A laser beam machining line for integrated manufacturing is one in which a separate line is installed in the front and rear of the laser irradiation line where the material to be machined is irradiated with a laser beam having a pulse width of 10<-12> sec. or below. These lines are characterized in that they are controlled consistent in transporting speed. The laser irradiation line may be provided with a material transportation better unit in both front and rear ends or either one end of the line. The laser irradiation part is desirably set movably in the irradiation line. The separate line installed in the front of the laser irradiation line may be a molding process line and/or a delivery line, while the one installed in the rear may be a post-processing line.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention belongs to the technical field relating to laser processing for improving the functionality and performance of plastic materials. Furthermore, the processing material is irradiated with an ultrashort pulse laser to form a structure. The present invention relates to an integrated manufacturing laser processing line that continuously performs processing that changes physical properties.

[0002]

2. Description of the Related Art In recent years, there has been an increasing demand for highly functionalized surfaces and interiors of parts such as plastics. In order to meet such demands for higher functionality, for example, when the material of the parts is a plastic material, technical response in terms of material for polymer alloying or compounding the plastic structure itself and functional parts according to the requirements Is being implemented, and technical measures are being taken in terms of processing such as controlling the structure. As an example, phase separation (composition change) and recrystallization (change in density and crystallinity) by applying heat.
Or a method of causing a thermal reaction, a method of accelerating molecular orientation (orientation degree, optical / mechanical anisotropy) by applying pressure or stress, a method of accelerating electrical / optical changes, and irradiation with light Methods of causing photoreaction (electrochemical bond reaction), photocrosslinking (crosslinking or curing), photolysis (cleavage of bond), etc. have been studied. Of these methods (techniques), heat or pressure is often applied to the entire plastic structure, and it is applied only to an arbitrary place (site) inside the plastic structure, and the original plastic structure It is not suitable to be formed inside having a different structure from the inside of the body. On the other hand, light is essentially a suitable means to act on any place inside the plastic structure, and it can contribute to the trend of technology with higher functionality and higher performance by finer structure control. There is a nature.

On the other hand, technological advances in laser light sources are remarkable, and in particular, in pulsed lasers, nanoseconds (10 ⁻⁹ seconds)
From the order of the pulse width, picoseconds (10 ^-12 seconds) to the order of the pulse width has progressed ultrashort pulsed More recently, femtosecond (10 to the titanium-sapphire crystals and laser medium ^- A pulse laser having a pulse width of the order of ¹⁵ seconds) has been developed. An ultrashort pulse laser with a pulse width of 10 ^-12 seconds or less (for example, a pulse width on the order of femtoseconds) or a system thereof has a directivity, a spatial / temporal coherence, etc. which a normal laser has. While having the characteristics,
Since the pulse width is extremely narrow, the electric field strength per unit time / unit space is extremely high even with the same average output.

[0004]

However, until now, the ultra-short pulse laser or its system has a low output and has not been a system capable of irradiating in a batch type and continuously and in a continuous flow. .

Therefore, an object of the present invention is to provide a process suitable for continuous and efficient production of a structure having a structurally changed portion whose structure is changed by irradiating a processing material with an ultrashort pulse laser. To provide. Another object of the present invention is to provide a process having excellent workability by irradiation with an ultrashort pulse laser even if the processing material is a plastic material.

[0006]

The present inventors have made the above-mentioned objectives.
As a result of intensive studies to achieve the target, the pulse width is 10
^-12Across the processing line that irradiates laser for less than a second,
Install separate lines before and after this, and
It is excellent to control the transport speed of the transport to be the same speed.
With good workability, continuous and efficient laser processing is possible.
The inventors have found out what can be done and have completed the present invention.

That is, according to the present invention, the pulse width is 10 ^−12.
It is an integrated manufacturing laser processing line in which another line is installed before and after the laser irradiation processing line that irradiates the processing material with a laser for less than a second, and the transport speed in these lines is controlled uniformly This is an integrated manufacturing laser processing line.

In the present invention, it is preferable to have a material-conveying buffer device before or after the laser irradiation processing line or at any one of them. Further, the laser irradiation part in the laser irradiation processing line may be movably provided.

The line installed before the laser irradiation processing line may be a molding process line and / or a payout line, and the line installed after the laser irradiation processing line may be a post-processing process line. Good. Furthermore, the laser irradiation processing line may be provided with a plurality of laser generators and / or a device that splits laser light into a plurality of lights.

As the processing material, a plastic material having a total light transmittance of 10% or more in the visible light wavelength region can be preferably used.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below in detail with reference to the drawings as necessary. In addition, the same code | symbol may be attached | subjected about the same member.

FIG. 1 is a diagram showing an example of the entire process relating to the integrated manufacturing laser processing line of the present invention. FIG. 2 is a diagram showing another example of the whole process relating to the integrated manufacturing laser processing line of the present invention. 1 and 2,
A is a laser irradiation processing line, B is a front line, C is a rear line, D is a material transfer buffer, E is a material transfer buffer,
F is the direction in which the processing material moves on the line (“conveying direction”)
May be called). In FIG. 1, the front line B is installed in front of the laser irradiation processing line A, and the rear line C is installed after it. In addition, in FIG. 2, the process is the same as that of FIG. 1, but a material transfer buffer device D is installed between the laser irradiation processing line A and the front line B, and the laser irradiation processing line A and the rear line B are installed. A material transfer shock absorber E is installed between the line C and the line C.

[Laser irradiation processing line] The laser irradiation processing line A is a laser for processing by irradiating a processing material with a laser having a pulse width of 10 ^-12 seconds or less (sometimes referred to as "ultra-short pulse laser"). It is an irradiation processing line. In this laser irradiation processing line, the processing material conveyed by the belt conveyor is irradiated with an ultra-short pulse laser from the outside to form a structural change portion with a structural change on the surface or inside of the processing material to change the structure. A structure having a portion is manufactured.

(Processing Material) The processing material is not particularly limited, and for example, an organic material such as a plastic material; a metal material, a glass material, an inorganic material such as an inorganic polymer can be used. The processing materials can be used alone or in combination of two or more. The processing material may be a composite material in which another material (for example, a metal material or a glass material) is dispersed in any material (for example, a plastic material), and various materials are layered. It may be a laminated body included in the above state.

A plastic material can be preferably used as the processing material. As a plastic material,
Although not particularly limited, various resins such as a thermoplastic resin, a thermosetting resin, and an ultraviolet curable resin can be used.
The plastic materials may be used alone or in combination of two or more. As the plastic material, a thermoplastic resin, in particular, a plastic material having two or more glass transition temperatures (glass transition points) can be preferably used. A plastic material having two or more glass transition temperatures includes a material system composed of two or more components having different thermal mobilities and incompatible with each other. Such material systems include blends of two or more dissimilar materials (eg, two or more homopolymers and / or
Or a blend of random copolymers, a blend of two or more block copolymers, etc.), a block copolymer composed of two or more different kinds of components, and the like.

For example, in a plastic material, various polymer materials can be used in combination as a blend of two or more different materials. More specifically, as the polymer material constituting the plastic material,
Polydienes such as polyisoprene and polybutadiene;
Polyalkenes such as polyisobutylene; polyacrylic acid esters such as polybutyl acrylate and polyethyl acrylate; polyvinyl esters such as polybutoxymethylene; polyurethanes; polysiloxanes; polysulfides; polyphosphazenes; poly Triazines; Polycarboranes; Polycarbonates (PC);
Methacrylate resins such as polymethylmethacrylate (PMMA); polyethylene terephthalate (PET)
Polyester resin such as: Polyether sulfone (P
ES); polynorbornene; epoxy resin; polyaryl; polyimide; polyamide; polyarylene ether; polyarylate and the like.

As the block copolymer composed of two or more different components, the above-exemplified polymer materials are appropriately combined and polymerized (copolymerized) to form a block copolymer. It may be copolymerized. The polymerization method (copolymerization method) is not particularly limited, and for example, a known living polymerization method such as a living anionic polymerization method, a living cationic polymerization method, a living radical polymerization method can be adopted.

In the plastic structure, the molecular weight of the polymer material (weight average molecular weight etc.) is not particularly limited.
The molecular weight (weight average molecular weight, etc.) of the polymer material can be appropriately selected according to the intended plastic structure. As the weight average molecular weight of the polymer material, for example,
It can be selected from the range of about 10,000 to 500,000.

As a processing material, especially a plastic material, a visible light wavelength region (for example, 400 nm to 800 n) is used.
m), the total light transmittance is 10% or more (preferably 5).
It is preferably 0% or more, and more preferably 85% or more). As described above, when the material has a light transmittance of 10% or more, by irradiation with an ultrashort pulse laser having a pulse width of 10 ^-12 seconds or less and a wavelength in the visible light wavelength region,
Laser processing can be done smoothly. For example, a colored plastic material that significantly absorbs or scatters light in the visible wavelength region or a plastic material that contains a large amount of scattering particles is not desirable. When the transmittance of the processing material (among others, the plastic material) is 10% or more, focusing can be performed without attenuating the laser light intensity in the sample. Further, when the transmittance of the processing material (among others, the plastic material) is 10% or more, the internal state of the processing material can be visually recognized, so that the irradiation position or the focal position of the ultrashort pulse laser or the change in the structure It is possible to visually check the degree of the above, and to effectively irradiate the processing material with the ultrashort pulse laser.

When the processing material is irradiated with the ultra-short pulse laser, the irradiation portion of the processing material irradiated with the ultra-short pulse laser and the vicinity of the irradiation portion are subjected to chemical and physical actions such as plasma generation. The temperature of the irradiated part and its vicinity are normally returned to room temperature when the irradiation is completed or the irradiation part moves after the irradiation part is locally heated to a high temperature. At this time, in the process in which the temperature of the processing material decreases from the high temperature state after the start of laser irradiation to the normal temperature state after the irradiation and solidifies, the structure of the irradiation part and its vicinity is the structure before irradiation. With respect to the above, evaporate, or evaporate at high temperature to form a cavity. Therefore, the structural material has a structurally changed portion whose structure has changed and a structurally unchanged portion whose structure has not changed, and as a result, a structural body having a structurally separated portion and a phase-separated structure composed of the structurally unchanged portion. Is obtained.

(Ultrashort pulse laser) The ultrashort pulse laser is not particularly limited as long as it has a pulse width of 10 ^-12 seconds or less, and a pulse laser having a pulse width of the order of 10 ^-15 seconds is preferably used. it can. Pulse width is 10
Pulsed lasers on the order of ^-15 seconds include pulsed lasers with pulse widths of 1x10 ^-15 seconds to 1x10 ^-12 seconds. More specifically, the pulse width of the ultrashort pulse laser is about 10 × 10 ⁻¹⁵ seconds to 500 × 10 ⁻¹⁵ seconds (preferably 50 × 10 ⁻¹⁵ seconds to 300 × 10 ⁻¹⁵ seconds). Lasers are preferred.

An ultrashort pulse laser having a pulse width of 10 ^-12 seconds or less can be obtained, for example, by reproducing and amplifying a laser using a titanium-sapphire crystal as a medium or a dye laser.

The wavelength of the ultrashort pulse laser is, for example, in the visible light wavelength region (for example, 400 to 400 nm).
800 nm) is preferable. In the ultrashort pulse laser, the repetition is, for example, 1
It can be selected from the range of Hz to 80 MHz, and is usually about 10 Hz to 500 kHz.

The average output or irradiation energy of the ultrashort pulse laser is not particularly limited, and can be appropriately selected according to the size of the target change portion, the type of change, the degree of the change, etc. For example, 500 mW or less (for example, 1 to 500 mW), preferably 5 to 300 m
W, and more preferably from about 10 to 100 mW. As described above, in the present invention, the irradiation energy of the ultrashort pulse laser may be low.

Further, the irradiation spot diameter of the ultra-short pulse laser is not particularly limited, and it depends on the size of the target change portion, the kind of the change or the degree of the change, the size of the lens, the numerical aperture or the magnification. Can be appropriately selected, and for example, can be selected from the range of about 0.1 to 10 μm.

(Laser Irradiation) FIG. 3 shows plastic
When the material is being irradiated with an ultra-short pulse laser
It is the schematic which shows an example. In FIG. 3, 1 is a plastic
Structure, 2 is a structurally changed portion, 3 is a structurally unchanged portion, 1a
Is a plastic material. 4 has a pulse width of 10 ^-12Second
The following ultra-short pulse lasers (simply called “lasers”)
, L is the irradiation direction of the laser 4,
5 is a lens, and 7 is a beam in the laser irradiation processing line A.
The sheet or fiber of the lt conveyor (simply “see
May be referred to as "to". ). Belt conveyor
The plastic material 1a is placed on the sheet 7 of
By processing the plastic material 1a by irradiation of the
The plastic structure 1 has been produced. Structural change part 2
Changes its structure under the influence of laser 4 irradiation.
It is the part where In addition, the structure unchanged portion 3 of the laser 4
Unaffected by irradiation, no change in structure
It is a site and retains its original structure. Ie structure
The unchanged portion 3 retains the original state or form.

The laser 4 irradiates the plastic material 1a in the irradiation direction L, that is, in the direction parallel to the Z axis. The laser 4 can be focused by using the lens 5. Therefore, it is not necessary to use the lens when it is not necessary to focus the laser for focusing.

Reference numeral 6a denotes a first focused position or a central position thereof (may be referred to as "irradiation start position") when the irradiation of the laser 4 is started, and 6b denotes a position when the irradiation of the laser 4 is finished. A final position or a center position thereof (may be referred to as “irradiation end position”) which is focused, and 6c is a focus of irradiation of the laser 4 or a center position thereof (may be simply referred to as “focus position”). Is the moving direction to move from the irradiation start position 6a to the irradiation end position 6b. Reference numeral 6 denotes a locus (sometimes referred to as a "focal point locus") along which the focal position of irradiation of the laser 4 or the central position of the focal point has moved. That is, in FIG. 3, the focus position of the laser 4 is continuously and linearly moved from the irradiation start position 6a to the irradiation end position 6b in the moving direction 6c of the focus position. Is the focal position locus 6. In the focus position locus 6, the direction 6c in which the focus position has moved is a direction parallel to the irradiation direction L of the laser 4 (direction parallel to the Z axis in FIG. 2) and the same direction as the irradiation direction L. Is.

Specifically, when the plastic material 1a is irradiated with the laser 4 in the irradiation direction L, the plastic material 1a is irradiated at each focal position on the focal position locus 6 of the laser 4 and its peripheral portion (near portion). A change in structure occurs and a structure change portion is formed. In addition, since the position of the focal point is continuously moved during irradiation of the laser 4, the portion where the structure of the plastic material is changed also moves continuously in accordance with the movement of the focal position, and moves in the moving direction. The structural change portion 2 is formed of a part that has extended and changed (sometimes referred to as a “change part”).

FIG. 4 is a schematic view showing another example of a state in which a plastic material is irradiated with an ultrashort pulse laser. In FIG. 4, 11 is a plastic structure, 21 is a structurally changed portion, 31 is a structurally unchanged portion, and 1a is a plastic material. 61a is the irradiation start position,
Reference numeral 61b is an irradiation end position, 61c is a moving direction in which the focal position moves from the irradiation start position 61a to the irradiation end position 61b, and 61 is a focal position locus. Note that 4, L, 5 and 7 are the same as in FIG. In FIG. 4, as in FIG.
Plastic material 1a on the sheet 7 of the belt conveyor
Is placed and the plastic structure 11 is produced by irradiation of the laser 4.

In FIG. 4, the focus position of the laser 4 is moved from the irradiation start position 61a to the irradiation end position 61b in the moving direction 61c (direction perpendicular to the irradiation direction L of the laser 4). The direction of the focal position locus 61 is a direction perpendicular to the irradiation direction L of the laser 4 (in FIG. 4, a direction parallel to the X axis). Specifically, the focal position of the laser 4 is maintained at a constant depth from the upper surface of the plastic material 1a, and the irradiation start position is in the moving direction 61c which is a direction perpendicular to the irradiation direction L of the laser 4. It is moved from 61a to the irradiation end position 61b. Therefore, the structure change portion 21 is formed along the direction of the moving direction 61c, that is, the direction perpendicular to the irradiation direction L of the laser 4 (direction parallel to the X axis). The structure unchanged portion 31 is not affected by the irradiation of the laser 4,
It is a site where the structure has not changed (site that retains the original state or morphology).

As described above, by moving the focus position of the laser in a direction parallel or perpendicular to the laser irradiation direction, the structure continuously changes in the moving direction of the focus position. It is possible to form the structural change portion formed by the above. The moving direction of the focus position of the laser (may be referred to as “focus moving direction”) is not particularly limited and may be any direction. For example, the direction parallel to the laser irradiation direction (the same direction as the laser irradiation direction or the opposite direction), the vertical direction, the oblique direction, and the like can be mentioned. Particularly in the present invention, the focal position of the laser can be linearly moved only in any direction, or can be curvedly moved in various directions. Further, in the present invention, the focus position of the laser can be moved continuously or intermittently.

The speed at which the focal position of the laser is moved (moving speed) is not particularly limited and can be appropriately selected according to the material of the processing material, the amount of laser irradiation energy, and the like. By controlling the moving speed, it is possible to control the size and the like of the structural change portion.

The number of structural change portions formed in the processing material is not particularly limited, and may be singular or plural. The structure having a plurality of structure changing portions inside may have a laminated structure in which the structure changing portions are laminated at appropriate intervals. When a plurality of structure-changing portions are provided, the distance between the structure-changing portions can be arbitrarily selected, but is preferably 5 μm or more.

In the present invention, the size, shape, and
The degree of structural change depends on the laser irradiation time, the moving direction and speed of the laser focus position, the type of processing material, the laser pulse width and irradiation energy, and the lens for adjusting the laser focus. It can be adjusted as appropriate depending on the numerical aperture and the like.

As a method for producing a structure having a structure change portion, as shown in FIGS.
^-The ultrashort pulse laser of ^-12 seconds or less is focused and focused using a lens to irradiate any part (or part) of the processing material, and if necessary, the focal position of the ultrashort pulse laser. A method of producing a structure in which the structural change portion is provided at an arbitrary portion (in particular, an internal portion) by moving (or an irradiation position) is preferably adopted. Such movement of the focal position of the ultrashort pulse laser can be achieved by moving the relative position between the ultrashort pulse laser and the lens and the processing material (or the structure having the structural change portion).
For example, it can be performed by moving the ultrashort pulse laser and the lens, and / or the processing material. Specifically, for example, 2 installed on a belt conveyor
A processing material (irradiation sample) is set on a stage that can be precisely moved in three-dimensional or three-dimensional directions, and an ultra-short pulse laser generator (laser generator) and a laser irradiation part including a lens are provided for the processing material. By fixing it so that it is in focus (it may be any part), and moving the stage to move the focus position, it is possible to create a structural change part of the desired shape in any part of the processing material. . Further, by moving the laser irradiation part or parts (laser generator, lens, etc.) in the irradiation part relative to the processing material, the structural change part can be produced at an arbitrary portion of the processing material. .

When the processing material placed on the sheet 7 of the belt conveyor is irradiated with the ultrashort pulse laser, the laser irradiation unit is movable as shown in FIG. It is preferably provided. Figure 5
FIG. 4 is a schematic view showing an example of a state in which a laser irradiation unit is movable on a laser irradiation processing line. Reference numeral 8 is a laser irradiation portion, and 8a is a movable direction of the laser irradiation portion 8. In addition, F, 4, 5, L and 7 are shown in FIGS.
Is the same as. In FIG. 5, the laser irradiation unit 8 is movable in a direction (same and opposite direction) 8a parallel to the conveyance direction F in the laser irradiation processing line A.
The moving speed can be adjusted appropriately. Therefore, for example, in the laser irradiation processing line A, the processing material is conveyed and moved by moving the laser irradiation section 8 at the same speed and the same direction as the conveying speed and the conveying direction of the belt conveyor. Also, the relative positional relationship between the laser irradiation unit 8 and the sheet 7 of the belt conveyor or the processing material or the like placed on the sheet 7 can be kept constant.

The laser irradiating section 8 is arranged in a direction parallel to the conveying direction F in the laser irradiation processing line A (longitudinal direction of the sheet 7 of the belt conveyor) and the conveying direction F.
It may be movable in a direction perpendicular to the direction (a left and right direction (width direction), a vertical direction, etc. of the sheet 7 of the belt conveyor). If the laser irradiation unit 8 is provided so as to be movable not only in the direction parallel to the transport direction F but also in the vertical direction, the laser irradiation unit 8 can be moved to move the focus of the laser 4 without using the stage. The position can be moved. As described above, in the present invention, the laser irradiation unit 8 is preferably provided so as to be movable, and particularly preferably provided so as to be movable in a direction parallel to the transport direction F.

By controlling the moving speed, moving direction, moving time, etc. of the stage, the laser irradiation section or the parts within the irradiation section, the irradiation of the ultrashort pulse laser can be arbitrary with two-dimensional or three-dimensional continuity. Can be done.

The laser irradiation processing line is shown in FIG.
Or a plurality of laser generators, as shown in FIG.
And / or a device for splitting the laser light into a plurality of lights may be provided. FIG. 6 is a schematic diagram showing an example of a state in which a plurality of laser irradiation parts are provided in the laser irradiation processing line. In FIG. 6, 81, 82, 8
3 is a laser irradiation part, 7 and F are the same as FIGS. In FIG. 6, a plurality of laser irradiation units (81, 8
2, 83) and each laser irradiation unit has one laser generator.

FIG. 7 is a schematic view showing an example of a state in which a device for splitting laser light into a plurality of lights is provided in the laser irradiation processing line. In FIG. 7, 51 is a lens, 52 is a lens, 4a is a laser, 4
a1 is a laser, 4a2 is a laser, 9 is a laser light source unit, 91 is a half mirror, and 92 is a mirror. 7, F
Is the same as in FIGS. In FIG. 7, a half mirror 91 and a mirror 92 are provided as a device that splits laser light into a plurality of lights. The laser 4 a from the laser light source unit 9 is split by the half mirror 91 and the mirror 92 and reflected by the half mirror 91.
The laser beam a1 is focused by the lens 51, passes through the half mirror 91, and is reflected by the mirror 92.
a2 is focused by the lens 52 and the sheet 7
The work material conveyed above can be irradiated.

As described above, laser light is emitted using a method of irradiating with a plurality of laser generators or a device for splitting laser light into a plurality of lights (for example, a beam splitter such as a half mirror, a prism or a grating). By adopting a method of radiating a plurality of luminous fluxes by splitting them, for example, a plurality of processing materials can be irradiated with a laser, or a laser can be irradiated by a multi-beam interference (two-beam interference, etc.) method. Therefore, the processing speed can be increased, and the processing by laser irradiation can be performed more efficiently.

[Front Line] The front line B is a line provided in front of the laser irradiation processing line A. The type of the front line B is not particularly limited, but it is preferable that the front line B is formed of a molding process line and / or a feeding line. As the molding process line, for example, various molding methods (for example, hot melt extrusion,
By casting, spreading or rolling the melted material)
A molding line for producing processed materials (for example, sheet-shaped or fiber-shaped molded products) molded in various shapes, and pretreatment for molded products manufactured by the molding line or pre-molded products (Eg heat treatment,
Examples include a pretreatment line for performing a unidirectional or bidirectional stretching treatment, a pretreatment such as a treatment for removing thermal stress, and the like. That is, the molding process line may be composed of only the molding line or the pretreatment line, or may be composed of the molding line and the pretreatment line provided after the molding line.

The feeding line is a line for feeding the molded product produced by the molding line or the molded product pretreated by the pretreatment line to the laser irradiation processing line A. That is, the payout line can be provided after the molding process line. Also,
The payout line may be in a form integrated with the molding process line. That is, the payout line is
It may be a line for molding, molding and pretreatment, or a line for feeding while performing pretreatment.

Therefore, by adopting the front line B, it is possible to supply the laser-irradiation processing line A with the processing material which has been subjected to arbitrary molding and pretreatment.

[Post-Line] The post-line C is a line provided after the laser irradiation processing line A. The type of the rear line C is not particularly limited, but it is preferable that the rear line C is composed of a post-processing process line.
As the post-processing process line, for example, various processing or processing methods (for example, stretching, shrinkage, cutting, and compounding with other members) are applied to the structure having the structurally changed portion produced on the laser irradiation processing line A. Processing or processing method), and a processing line for manufacturing a structure processed or processed into various shapes or forms. Therefore,
By adopting the rear line C, it is possible to perform arbitrary processing or treatment on the structure having the structural change portion.
For example, when the rear line C is provided, the structure having the structural change portion can be used in combination with other members.

[Material Transfer Buffer] The material transfer buffer (D, E) can be provided before or after the laser irradiation processing line or in either of them. The material transfer buffer device (D, E) is a device that temporarily stores the processing material to be supplied to the next line and supplies the processing material to the next line according to the processing speed of the next line. For example, the material transfer shock absorber D
Is a device for continuously supplying a processing material (for example, a processing material for a sheet or a fibrous material) that is continuously supplied according to the processing speed in the laser irradiation processing line A and temporarily storing the supplied amount. Is. Therefore, for example, in the laser irradiation processing line A, even when the movement of the sheet on the belt conveyor is temporarily stopped and the stopped processing material is irradiated with the laser, the material transfer buffer device D is used before the processing material. The supply from line B can be absorbed. Further, when the material transport / buffer device E is used (attached), it is possible to prevent intermittent supply to the rear line C.

The material conveying / buffering device (D, E) may or may not be provided. For example, in the case where the material conveyance buffer device D is not provided, by irradiating while moving the laser irradiation portion of the laser irradiation processing line A, the processing material can be continuously conveyed and moved without delay.

In the present invention, either or both of the front line B before the laser irradiation processing line A and the rear line C after the laser irradiation processing line A are thus provided, and these lines (laser Irradiation processing line A,
The processing speed of the front line B and the rear line C) is unified and controlled to perform laser processing of the processing material. That is,
Laser processing of the processing material is performed by controlling the transfer speed of the front line B and the rear line C according to the transfer speed of the laser irradiation processing line A and using the material transfer buffer device (D, E) as necessary. is doing. Therefore, it is possible to continuously and efficiently manufacture a structure having a structure-changed portion by irradiating a processing material with an ultrashort pulse laser. In particular, even if the processing material is a plastic material, laser processing can be performed with excellent processing workability. In particular, in the present invention, the conveyance speeds of the laser irradiation processing line A, the front line B, and the rear line C can be set to the same speed (if necessary, the material conveyance buffer device (D,
E) may be used), a structure having a structural change portion,
It can be manufactured very efficiently and continuously. Further, when the conveyance speeds of the laser irradiation processing line A, the front line B, and the rear line C are not the same, the material irradiation shock absorbers (D, E) are used and the laser irradiation processing line A and the front line B are used. By uniformly controlling the conveyance speed in the rear line C, it is possible to continuously and efficiently manufacture the structure having the structure change portion.

For example, when the front line B is not provided, the laser irradiation processing line A is usually supplied with a molded product which is molded into a specific shape in advance and, if necessary, is pretreated. Section is provided. When the rear line C is not provided, the structure having the structural change portion can be used as it is or in the form.

In the present invention, the structure change in the structure change portion of the structure obtained by irradiating the processing material with the ultrashort pulse laser is not particularly limited as long as it is a change from the original structure to another structure. Instead, it may be a change in chemical structure or a change in physical structure. Specifically, examples of the structural change include a structural change due to heat melting / cooling, a structural change due to a crosslinking reaction, a structural change due to phase separation, and a structural change due to a decomposition reaction. For example, when the processing material is a plastic material, the plastic material is melted by being irradiated with a laser and is cooled, so that the original structure state or form is changed to another structure state or form (for example, oriented). The change of the structure from the existing state to the non-oriented state can be exemplified. Further, there is a change in the structure from an uncrosslinked state or morphology to a crosslinked state or morphology due to a crosslinking reaction. Further, there is a change in the structure that changes from a mixed or dissolved state to a phase separated state due to phase separation. Furthermore, the change may be a change in the structure from an undecomposed state to a decomposed state due to a decomposition reaction. In the present invention, as the structure change in the structure change portion, a structure change due to a crosslinking reaction, a phase separation, or a decomposition reaction can be preferably used.

More specifically, when the plastic material is a plastic material having two or more glass transition temperatures, a structural change mainly occurs due to phase separation. In this case, along with the structural change due to phase separation, the structural change due to other forms (for example, the structural change due to thermal melting / cooling,
(Structure change due to cross-linking reaction, structure change due to decomposition reaction) may occur.

Physical properties change due to such a change in structure. The physical property that changes is not particularly limited, and for example,
Electrical characteristics (withstand voltage, resistivity, dielectric constant, etc.), optical characteristics (colorability, light absorption, light emission, refractive index, light transmittance,
Optical angle deviation), mechanical characteristics (strength, elongation, viscoelasticity, etc.), thermal characteristics (heat resistance, etc.), physical characteristics (solubility, gas permeability, hygroscopicity, etc.) and the like. When a plastic material is used as the processing material, it is preferable that the refractive index changes due to the change in structure. That is, it is preferable that the structure-changed portion and the structure-unchanged portion have different refractive indices.

The structure having a structural change portion produced by the integrated manufacturing laser processing line of the present invention has, for example, an optical functional member such as a diffusion plate or a scattering element; and a spacer function for forming a precise space or a flow path. Used micromachines and sensors; electrical probes; biodevices; microreactor chips; high-performance laser processed products such as implantable artificial organs, as well as diffraction gratings (transmission diffraction gratings), optical waveguides, etc. be able to.

[0055]

EFFECTS OF THE INVENTION According to the present invention, a structure having a structurally changed portion whose structure is changed by irradiating a processing material with an ultrashort pulse laser can be continuously and efficiently subjected to pretreatment and posttreatment. It can be manufactured well. For example, even if the processing material is a plastic material, the processing workability by irradiation with an ultrashort pulse laser is excellent.

[0056]

The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples. Example 1 Butyl acrylate (BA) and ethyl acrylate (EA) as monomer components were placed in a polymerization container in an equimolar ratio, and ethyl 2-bromoisobutyrate (the above-mentioned monomer component was used as a polymerization initiator). 0.00 for the total amount
12 mol%), copper bromide (0.0012 mol% with respect to the total amount of the monomer components) as a polymerization catalyst, and 2,2′-bipyridine derivative as a co-catalyst (0.0036 mol% with respect to the total amount of the monomer components). By a known living radical polymerization method using
000 butyl acrylate / ethyl acrylate random copolymer [poly (BA.EA) random copolymer] was prepared. Subsequently, methyl methacrylate (MMA) was added as a copolymerizable monomer component for preparing a block copolymer to the reaction mixture containing the poly (BA.EA) random copolymer, and living radical polymerization was further performed. By carrying out, the poly (BA.EA) random copolymer has a block-weight average molecular weight of about 58,
PMMA / (poly (BA / EA) random copolymer) block copolymer [poly (MMA / BA / EA) bonded with 000 polymethylmethacrylate (PMMA)
Block copolymer] was obtained. The poly (MMA / BA · E
In A) block copolymer (sometimes referred to as “block copolymer A”), the weight average molecular weight of the entire block copolymer is about 83,000, and the ratio of PMMA is 70% by weight (weight average molecular weight). Ratio). After the block copolymer A is purified by using a filter or an ion exchange resin, it can be crosslinked by ultraviolet rays (UV) and has a maximum absorption wavelength (λm of about 250 nm and about 360 nm).
1 part by weight of a triazine-based cross-linking agent having ax) is added to 100 parts by weight of a block copolymer (block copolymer A), ethyl acetate is further added, and a solution having a concentration of about 30% by weight (“ (It may be referred to as "Sample solution A")
Was prepared.

A film-like sample having a film thickness of about 50 μm was prepared by the casting method using the sample solution A, and MICC of Murakami Color Research Laboratory Co., Ltd.
When the total light transmittance from 400 nm to 800 nm was measured using a reflection / transmittance meter HR-100, the total light transmittance at the wavelength of the film sample: 400 nm to 800 nm was 92.7%.

The sample solution A was cast
The previous line including the pulse width is 10 ^-12Subsecond laser
Laser irradiation processing line including processing steps by laser irradiation
Cutting process to cut the laser-processed structure.
A series of manufacturing lines consisting of a post-processing line is shown below.
Thus supplied.

First, the sample solution A was supplied to the preceding line, and a sheet having a film thickness of about 800 μm (“irradiation sample A”) was formed by a film forming line including a casting process.
(Hereinafter, may be referred to as ") is continuously produced, and the irradiation sample A is conveyed to a laser irradiation processing line through a conveyance buffer device (accumulator). In the laser irradiation processing line, the irradiation sample A is fixed on a movable stage,
Using a titanium-sapphire femtosecond pulse laser device and an objective lens (magnification: 20 times), a position of about 60 μm from the upper surface of the fixed irradiation sample A was used as a focal point, and an ultrashort pulse laser (irradiation wavelength: 800 nm, pulse width: 150 × 10 ^-15 seconds, repetition: 200 kH
z) under irradiation energy (average output): 20 mW, irradiation spot diameter: about 3 μm, while moving irradiation sample A in a direction perpendicular to the irradiation direction at a moving speed of about 500 μm / sec, When irradiated from the upper surface side, from the focus position (irradiation start position) where irradiation of the ultrashort pulse laser started inside the irradiation sample A to the original irradiation sample A from the focus position where irradiation was stopped (irradiation end position) As a result, a plastic structure having a structure change portion having a different structure was obtained. Then, the laser-processed irradiation sample A was conveyed to the rear line through the conveyance buffer device on the rear line side, and cut into a specific shape.

Therefore, in the first embodiment, since the conveyance buffer can adjust the conveyance to the next line,
It is possible to carry out continuous processing by carrying at a uniformly controlled carrying speed between the laser irradiation processing line and the subsequent line.

Regarding the obtained structure, the difference in refractive index between the structure-changed portion and the structure-unchanged portion in which the structure remains unchanged is 1.9 × 10 ^{−. 3}
Met.

(Embodiment 2) A front line, a laser irradiation processing line, and a laser irradiation processing line are used in the same manner as in Embodiment 1 except that a transfer buffer device is not used and a movable laser irradiation portion of the laser irradiation processing line is used. When supplied to a series of manufacturing lines consisting of a rear line, the laser irradiation part can move according to both the conveyance of the sheet (or fiber) of the belt conveyor and the position adjustment of the laser irradiation. The line, the laser irradiation processing line, and the rear line can be conveyed at a uniformly controlled conveyance speed to perform continuous processing.

(Embodiment 3) A laser irradiation processing line comprises a front line, a laser irradiation processing line and a rear line in the same manner as in Embodiment 1 except that a plurality of laser irradiation portions are used as the laser irradiation portions of the laser irradiation processing line. When it was supplied to a series of production lines, the transportation speed of the laser irradiation processing line could be higher than that in Example 1, and the series of production lines as a whole could be speeded up.

(Embodiment 4) The same procedure as in Embodiment 1 was carried out except that a laser irradiation portion for dividing the light flux of the laser beam with a half mirror was used as the laser irradiation portion of the laser irradiation processing line. , A series of production lines consisting of laser irradiation processing line and rear line,
When supplied, the transportation speed of the laser irradiation processing line could be higher than that of Example 1, and the entire production line could be speeded up.

[Brief description of drawings]

FIG. 1 is a diagram showing an example of an entire process relating to an integrated manufacturing laser processing line of the present invention.

FIG. 2 is a diagram showing another example of the entire process relating to the integrated manufacturing laser processing line of the present invention.

FIG. 3 is a schematic view showing an example of a state in which a plastic material is irradiated with an ultrashort pulse laser.

FIG. 4 is a schematic view showing another example of a state in which a plastic material is irradiated with an ultrashort pulse laser.

FIG. 5 is a schematic view showing an example of a state in which a laser irradiation unit is movable on a laser irradiation processing line.

FIG. 6 is a schematic view showing an example of a state in which a plurality of laser irradiation parts are provided in a laser irradiation processing line.

FIG. 7 is a schematic diagram showing an example of a state in which a device for splitting laser light into a plurality of lights is provided in a laser irradiation processing line.

[Explanation of symbols]

A laser irradiation processing line B front line C rear line D material transfer shock absorber E material transfer shock absorber F direction in which the processing material moves on the line 1,11 plastic structure 1a, 11a plastic material 2,21 structural change part 3, 31 Structure unchanged part 4 Ultrashort pulse laser with pulse width of 10 ^-12 seconds or less 5 Lens L Laser 4 irradiation direction 6,61 Laser 4 focal position locus 6a, 61a Laser 4 irradiation start position 6b, 61b Laser 4 irradiation end positions 6c, 61c moving direction of focal position of laser 4 7 belt conveyor sheet or fiber 8 laser irradiation part 8a movable direction of laser irradiation part 81 laser irradiation part 82 laser irradiation part 83 laser irradiation part 4a Laser 4a1 Laser 4a2 Laser 51 Lens 52 Lens 9 Laser light source 91 Half mirror 92 Mirror

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Mika Horiike             1-2 1-2 Shimohozumi, Ibaraki City, Osaka Prefecture Nitto             Electric Works Co., Ltd. (72) Inventor Kazuyuki Hirao             8-94 Tanaka Shimoyanagicho, Sakyo Ward, Kyoto City, Kyoto Prefecture F-term (reference) 4E068 AA00 CA01 CA11 CD04 CE02                       CE11 DB10                 4F073 AA14 BA18 BB01 CA53 HA09

Claims (7)

[Claims] 1. An integrated manufacturing laser processing line in which another line is installed before and after a laser irradiation processing line for irradiating a processing material with a laser having a pulse width of 10 ⁻¹² seconds or less, and a conveying speed in these lines. An integrated manufacturing laser processing line that is characterized by uniform control. 2. The integrated manufacturing laser processing line according to claim 1, further comprising a material transfer buffer device before or after the laser irradiation processing line. 3. The laser irradiation part in the laser irradiation processing line is movably provided.
Integrated manufacturing laser processing line described. 4. The integrated manufacturing laser processing line according to claim 1, wherein the line installed before the laser irradiation processing line is a molding process line and / or a feeding line. 5. The line installed after the laser irradiation processing line is a post-processing process line.
The integrated manufacturing laser processing line according to any one of 1. 6. The integrated laser processing line according to claim 1, wherein the laser irradiation processing line has a plurality of laser generators and / or a device for splitting laser light into a plurality of lights. . 7. The integrated manufacturing laser processing line according to claim 1, wherein the processing material is a plastic material having a total light transmittance of 10% or more in a visible light wavelength region.