JP2003133353A - Device for forming metal projection - Google Patents
Device for forming metal projectionInfo
- Publication number
- JP2003133353A JP2003133353A JP2001323753A JP2001323753A JP2003133353A JP 2003133353 A JP2003133353 A JP 2003133353A JP 2001323753 A JP2001323753 A JP 2001323753A JP 2001323753 A JP2001323753 A JP 2001323753A JP 2003133353 A JP2003133353 A JP 2003133353A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- bell
- capillary tube
- projection
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、金属突起の製作装
置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal projection manufacturing apparatus.
【0002】[0002]
【従来の技術】フリップチップ接合技術は、世界的チッ
プ(低入力脚数−低I/O数ICチップ式組合せ(flip
chip on board, FCOB)または高I/O数ICチッ
プのフリップチップパッケージ(flip chip in packag
e, FCIP)に拘らず)の主流パッケージ技術であ
る。現在、チップに金属突起を製作する技術は多種存在
し、それぞれ長所を有する。よく見られる技術は、蒸し
メッキ、スパッタリングメッキ、電気メッキ、印刷、ジ
ェット成型およびボンディング成型である。図1Aに示
すように、ボンディング成型の金属突起技術は、一般
に、古いワイヤボンディング技術の毛細管2’ が使用
されている。毛細管2’ の中心部には内周部21’が
設けられ、内周部21’の内壁部22’は下端部が狭
く、上端部が広く尖った形状に形成されている。図1B
に示すように、金属ワイヤ3’は毛細管2 ’の口部で
球状31’に焼結され、超音波振動および加圧変形加工
により金属ワイヤ3’はチップ1’の脚敷き11’に連
接される。図1Cに示すように、毛細管2’ が移動さ
れると、金属突起32’が形成され、金属突起32’に
錫ボール4’が溶接される。2. Description of the Related Art Flip chip bonding technology is a worldwide chip (low input leg count-low I / O count IC chip type combination (flip
chip on board (FCOB) or high I / O count IC chip flip chip in packag
e, FCIP)) mainstream packaging technology. At present, there are various techniques for producing metal protrusions on a chip, and each technique has advantages. Common techniques are steam plating, sputtering plating, electroplating, printing, jet molding and bonding molding. As shown in FIG. 1A, the metal protrusion technique of bonding molding generally uses the capillary 2 ′ of the old wire bonding technique. An inner peripheral portion 21 ′ is provided at the center of the capillary tube 2 ′, and an inner wall portion 22 ′ of the inner peripheral portion 21 ′ has a narrow lower end and a wider upper end. Figure 1B
As shown in Fig. 3, the metal wire 3'is sintered into a spherical shape 31 'at the mouth of the capillary tube 2', and the metal wire 3'is connected to the foot pad 11 'of the chip 1'by ultrasonic vibration and pressure deformation. It As shown in FIG. 1C, when the capillary tube 2'is moved, a metal projection 32 'is formed, and the tin ball 4'is welded to the metal projection 32'.
【0003】しかしながら、上述の従来の金属突起3
2’は、突起が形成されるとき、毛細管2 ’の制限に
より突起底面と脚敷き11’の接触面の周縁部は大きな
球面の凹弧状になり、接触面が減少するため、接着構造
が不安定である。毛細管2 ’が下方に押さえられると
き、金属突起32’は外方に押し出されるため、金属突
起32’の面積は毛細管2 ’の口部の面積を超過す
る。このため、金属突起32’の面積の調節は困難であ
る。さらに、金属突起32’の下半分は突出する構造で
あるため、図1Dに示すように、錫ボール4’が溶接さ
れるとき、接触面積が不足する。また、金属突起32’
の柱身の長さが短いため、錫ボール4’が金属突起3
2’に溶接されるとき、チップと導線枠、チップ、金属
突起または基板の溶接脚敷きとの溶接の間隔が不足し、
合格率が低下する。However, the above-mentioned conventional metal protrusion 3 is used.
In 2 ', when the protrusion is formed, the peripheral surface of the contact surface between the bottom surface of the protrusion and the leg pad 11' becomes a large spherical concave arc due to the limitation of the capillary tube 2 ', and the contact surface is reduced. It is stable. When the capillary tube 2 ′ is pressed downward, the metal projection 32 ′ is pushed outward, so that the area of the metal projection 32 ′ exceeds the area of the mouth portion of the capillary tube 2 ′. Therefore, it is difficult to adjust the area of the metal protrusion 32 '. Further, since the lower half of the metal protrusion 32 'has a protruding structure, the contact area is insufficient when the tin ball 4'is welded, as shown in FIG. 1D. Also, the metal protrusion 32 '
Due to the short length of the pillar, the tin ball 4'is
When welded to 2 ', the welding interval between the tip and the lead frame, tip, metal projection or welding foot laid on the substrate is insufficient,
The pass rate decreases.
【0004】[0004]
【発明が解決しようとする課題】そこで、本発明の目的
は、チップの脚敷きとの結合度を向上でき、錫ボールが
溶接されるときの接触面積を増加でき、より小さく、柱
身が長い金属突起の製作装置を提供することにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to improve the degree of bonding of the tip to the foot pad and to increase the contact area when the tin balls are welded, and to make the size smaller and the column longer. An object of the present invention is to provide an apparatus for manufacturing a metal protrusion.
【0005】[0005]
【課題を解決するための手段】本発明の請求項記載の金
属突起の製作装置によると、堅固な錐形の硬管の中心部
に内周部が設けられ、硬管の内壁部の下側は鐘状部に連
結されている。鐘状部は柱身が高く形成され、底面に内
環の毛細管が設けられている。毛細管の内周部の内部に
金属線が差し入れられ、金属線の末端部は球形に焼結さ
れ、金属球が形成される。毛細管がチップの脚敷きに接
近するとき、脚敷きは下側から持続的に金属球との接触
面を加熱される。超音波エネルギーにより金属球は鐘状
部に充填され、金属突起が形成される。金属突起は脚敷
きに溶接される。毛細管が移動され、鐘状部の頚部から
金属線が除去され、金属突起は鐘状に形成される。金属
突起には鐘状部の底部内環の作用により突出する凸縁底
部が形成されている。According to the apparatus for manufacturing a metal projection according to the present invention, an inner peripheral portion is provided at the center of a rigid conical hard tube, and the inner wall portion of the hard tube is underside. Is connected to the bell. The bell-shaped part has a high pillar shape, and a capillary tube of an inner ring is provided on the bottom surface. A metal wire is inserted inside the inner peripheral portion of the capillary tube, and the end portion of the metal wire is sintered into a spherical shape to form a metal sphere. As the capillaries approach the foot pad of the tip, the foot pad is continuously heated from below on the contact surface with the metal ball. Ultrasonic energy fills the metal spheres into the bells, forming metal protrusions. The metal projections are welded to the foot pad. The capillaries are moved, the metal wire is removed from the neck of the bell, and the metal projection is formed into a bell. The metal protrusion is formed with a convex edge bottom portion protruding by the action of the inner ring at the bottom of the bell-shaped portion.
【0006】毛細管の内壁部の鐘状形状により形成され
る金属突起は鐘状の開口で制限されるため、より小さく
形成される。金属突起の底面外周には凸縁が設けられて
いるため、金属突起とチップの脚敷きとの結合度を増加
できる。チップの脚敷きに形成される金属突起が鐘状で
あるとき、金属突起はより高い柱身を有し、錫ボールが
溶接されるときの他の基板またはチップとの結合性が向
上する。金属突起は錫ボールと溶接されるときの接触面
積が増加し、より確実に溶接される。Since the metal projection formed by the bell-shaped shape of the inner wall portion of the capillary is restricted by the bell-shaped opening, it is formed smaller. Since the convex edge is provided on the outer periphery of the bottom surface of the metal protrusion, the degree of coupling between the metal protrusion and the chip leg pad can be increased. When the metal projections formed on the foot pad of the chip are bell-shaped, the metal projection has a higher columnar shape, which improves the bondability with other substrates or chips when tin balls are welded. The metal projection has a larger contact area when it is welded to the tin ball, and is more reliably welded.
【0007】[0007]
【発明の実施の形態】以下、本発明の実施の形態を図面
に基づいて説明する。図2に示すように、本発明の一実
施例による金属突起の製作装置によると、堅固な錐形の
硬管20の中心部に内周部21が設けられ、内周部21
の下側は鐘状部23の内壁部22に連結されている。鐘
状部23は柱身232が高く形成され、底面に内環23
1の毛細管2が設けられている。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. As shown in FIG. 2, according to the apparatus for manufacturing a metal protrusion according to an embodiment of the present invention, an inner peripheral portion 21 is provided at the center of a rigid conical hard tube 20, and an inner peripheral portion 21 is provided.
The lower side is connected to the inner wall portion 22 of the bell portion 23. The bell-shaped portion 23 is formed so that the pillar body 232 is formed high, and the inner ring 23 is formed on the bottom surface.
One capillary tube 2 is provided.
【0008】毛細管2の内周部21の内部に金属線3が
差し入れられ、硬管20の内壁部22の鐘状部23に配
置される金属線3の末端部は球形31に焼結される。毛
細管2がチップ1の脚敷き11に接近するとき、脚敷き
11は下側から持続的に金属線3との接触面が加熱され
る。超音波エネルギーにより金属球が鐘状部23に充填
され、金属突起32は脚敷き11に溶接される。毛細管
2が移動され、鐘状部23の頚部から金属線が除去さ
れ、鐘状の金属突起32が形成される。金属突起32に
は鐘状部23の底部内環231の作用により突出する凸
縁底部321が形成されている。The metal wire 3 is inserted into the inner peripheral portion 21 of the capillary tube 2, and the end portion of the metal wire 3 arranged in the bell-shaped portion 23 of the inner wall portion 22 of the hard tube 20 is sintered into a spherical shape 31. . When the capillary tube 2 approaches the foot pad 11 of the chip 1, the foot pad 11 is continuously heated from the lower side in contact with the metal wire 3. Metal spheres are filled into the bell-shaped portion 23 by ultrasonic energy, and the metal protrusions 32 are welded to the foot pad 11. The capillary tube 2 is moved, the metal wire is removed from the neck portion of the bell-shaped portion 23, and the bell-shaped metal projection 32 is formed. The metal projection 32 is formed with a convex bottom portion 321 protruding by the action of the inner ring 231 of the bottom portion of the bell-shaped portion 23.
【0009】毛細管2の内壁面22の鐘状部23および
内環231により形成される鐘状の金属突起32が占め
る面積は毛細管2の鐘状底部の面積より小さく、より小
さい面積の金属突起を形成することができる。金属突起
32の柱身232は高いため、金属突起32とチップ1
の脚敷き11との溶接力は増大し、金属突起32と錫ボ
ール4との接触面積33は増大し、より大きい溶接力を
有する。The area occupied by the bell-shaped metal projections 32 formed by the bell-shaped portion 23 and the inner ring 231 of the inner wall surface 22 of the capillary tube 2 is smaller than the area of the bell-shaped bottom portion of the capillary tube 2, and a metal projection having a smaller area is used. Can be formed. Since the pillar 232 of the metal protrusion 32 is high, the metal protrusion 32 and the chip 1
The welding force with the foot pad 11 is increased, and the contact area 33 between the metal protrusion 32 and the tin ball 4 is increased, resulting in a larger welding force.
【図1】従来の金属突起の製作装置を示す模式図であ
る。FIG. 1 is a schematic view showing a conventional apparatus for manufacturing metal protrusions.
【図2】本発明の一実施例による金属突起の製作装置の
毛細管を示す断面図である。FIG. 2 is a cross-sectional view showing a capillary tube of a metal projection manufacturing apparatus according to an embodiment of the present invention.
【図3】本発明の一実施例による金属突起の製作装置を
示す模式図である。FIG. 3 is a schematic view showing a metal projection manufacturing apparatus according to an embodiment of the present invention.
2 毛細管 20 硬管 21 内周部 22 内壁部 23 鐘状部 32 金属突起 231 内環 232 柱身 321 凸縁底部 2 capillaries 20 hard tube 21 Inner circumference 22 Inner wall 23 Bell 32 metal protrusion 231 Inner ring 232 Pillar 321 convex edge bottom
───────────────────────────────────────────────────── フロントページの続き (72)発明者 陳 慧萍 台湾高雄県鳳山市海洋二路58号 (72)発明者 ▲将▼ 華文 台湾高雄市三民区昌富街57号3樓之2 (72)発明者 張 衷銘 台湾嘉義県布袋鎮見龍里109号 (72)発明者 ▲余▼ 豐昌 台湾高雄県鳥松郷中正路367之9号 (72)発明者 黄 富裕 台湾高雄市新興区光耀里22隣渤海街29号 (72)発明者 張 軒睿 台湾高雄市前鎮区中山二路55巷35号 (72)発明者 胡 嘉傑 台湾高雄市楠梓区後昌路546巷11弄12号之 5 (72)発明者 呂 文隆 台湾澎湖県馬公市中興里光復路25号 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Chen Hui No.58 Marine Second Road, Fengshan City, Kaohsiung, Taiwan (72) Inventor ▲ Sho ▼ Chinese literature No. 57, 3 No. 57, Chang Fu Street, Sanmin District, Kaohsiung, Taiwan (72) Inventor Zhang Hotei Shinryuu Nori 109, Chibu, Taiwan (72) Inventor ▲ Yu ▼ Fengchang 367-9, Zhongzheng Road, Torimatsu Township, Kaohsiung, Taiwan (72) Inventor Huang Fuyu No.29, Bohai Street, 22, Gwangolli, Emerging District, Kaohsiung, Taiwan (72) Inventor Zhang Jiang No.35, No.35, No. 55, Zhongshan 2nd Road, Qianzhen District, Kaohsiung City, Taiwan (72) Inventor Hu Jia Jie 546, No.11, No.12, 546, Gochang-ro, Kusunagi-ku, Kaohsiung, Taiwan 5 (72) Fumitaka Lu No.25 Zhongxingli Guangfu Road, Magong City, Penghu County, Taiwan
Claims (2)
けられ、前記硬管の内壁部の下側は鐘状部に連結され、
前記鐘状部は柱身が高く形成され、底面に内環の毛細管
が設けられていることを特徴とする金属突起の製作装
置。1. An inner peripheral portion is provided at a central portion of a rigid conical hard tube, and a lower side of an inner wall portion of the hard tube is connected to a bell-shaped portion.
The bell-shaped part has a high pillar shape, and a capillary tube of an inner ring is provided on the bottom surface of the bell-shaped part.
し入れられ、前記硬管の前記鐘状部に配置される前記金
属線の末端部は球形に焼結されて金属球が形成され、前
記毛細管がチップの脚敷きに接近するとき、前記脚敷き
の下側から持続的に前記金属球との接触面が加熱され、
超音波エネルギーにより前記金属球は前記鐘状部に充填
されて金属突起が形成され、前記金属突起が前記脚敷き
に溶接され、前記毛細管が移動し、前記鐘状部の頚部か
ら前記金属線が引き切られ、前記金属突起は鐘状に形成
され、前記鐘状部の底部内環の作用により突出する凸縁
底部が形成されることを特徴とする金属突起の製作装
置。2. A metal wire is inserted into the inner peripheral portion of the capillary tube, and the end portion of the metal wire arranged in the bell-shaped portion of the hard tube is sintered into a spherical shape to form a metal ball. When the capillary approaches the foot pad of the chip, the contact surface with the metal ball is continuously heated from the lower side of the foot pad,
The metal spheres are filled into the bell-shaped portion by ultrasonic energy to form metal projections, the metal projections are welded to the foot pad, the capillaries move, and the metal wire from the neck of the bell-shaped portion is moved. An apparatus for manufacturing a metal projection, wherein the metal projection is formed into a bell shape by being cut off, and a convex edge bottom portion protruding by the action of the inner ring at the bottom of the bell shape portion is formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001323753A JP2003133353A (en) | 2001-10-22 | 2001-10-22 | Device for forming metal projection |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001323753A JP2003133353A (en) | 2001-10-22 | 2001-10-22 | Device for forming metal projection |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2003133353A true JP2003133353A (en) | 2003-05-09 |
Family
ID=19140595
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001323753A Pending JP2003133353A (en) | 2001-10-22 | 2001-10-22 | Device for forming metal projection |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2003133353A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1317751C (en) * | 2005-01-12 | 2007-05-23 | 哈尔滨工业大学 | Production of direct brazing filler metal button by double electrothermal filament smelting and cutting method |
-
2001
- 2001-10-22 JP JP2001323753A patent/JP2003133353A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1317751C (en) * | 2005-01-12 | 2007-05-23 | 哈尔滨工业大学 | Production of direct brazing filler metal button by double electrothermal filament smelting and cutting method |
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