JP2003133349A - Resin encapsulating unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin encapsulating unit, which is capable of sealing up various kinds of devices with resin by the use of the same molding die, without replacing the molding die for each device. SOLUTION: A resin sealing unit is equipped with a first die and a second die, which are arranged so as to enable their opposed parting faces to bear against one another, a cavity which is formed between the opposed parting faces of the first and the second die so as to specify a resin encapsulating region and where a part to seal up with resin is disposed, and a support frame which is mounted in a detachable manner in the cavity of the first die. The support frame is equipped with a guide groove, which guides sealing resin to the cavity, and sealing resin is injected into the cavity via the guide groove.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing device, and more particularly to a lead frame and a TAB (Tape Automate).
CSP (Chip Size Pa) using d Bonding) tape
ckage) for a resin sealing device.

[0002]

2. Description of the Related Art In recent years, semiconductor devices to be mounted on electronic equipment have been adopted for portable terminals such as mobile phones and PDAs, and therefore have been required to be smaller, thinner and lighter.

[0003] And downsizing, thinning and weight reduction,
Furthermore, various proposals have been made in mounting semiconductor devices in order to realize high integration, such as TAB (tape automated bonding), BGA (ball grid array), and recently CSP (chip size package).
Called wafer scale C, which is equivalent to the chip size
SP or C slightly larger than the chip size
SP etc. are being developed.

In this CSP, a large number of semiconductor chips are mounted on a TAB substrate formed by forming a wiring pattern on a flexible tape such as a polyimide tape, and resin is encapsulated by encapsulation, and then separated into individual elements. It is something that is done.

When manufacturing such a package,
Generally, a resin sealing device including a mold including an upper mold part and a lower mold part is used. A cavity for resin molding is formed between the facing surfaces of the upper mold part and the lower mold part, and as shown in FIGS. 9A and 9B,
With each semiconductor component 101 held by a lead frame or a film-shaped tape substrate held in the cavity 102, a molten resin material 103 is extruded by a plunger having one mold part to extrude a resin pellet. Is guided from the pot in which each cavity is arranged to the respective cavities through the guide portion 104 including the cull, the runner, and the gate.

By curing the resin material in the cavity, a package is molded, the package is taken out of the mold, and unnecessary portions of the resin material cured in the guide portion are removed from the mold. In order to allow the unnecessary portion to be taken out of the mold, the guide portion is formed between the parting surfaces of both mold portions, similarly to the molding cavity.

It is desirable to arrange the cavities in alignment with each other in order to improve the efficiency of package manufacturing. However, in order to properly guide the molten resin material to the multiple cavities arranged in a matrix, for example, it is necessary to arrange the guide portions between the aligned cavities. Therefore, in order to form the guide portion, it has been impossible to set the cavity interval on both sides where the guide portion is provided to 3 or 4 mm or less.

[0008]

As described above, in the resin encapsulation process in the manufacturing of CSP using the conventional lead frame, TAB substrate, etc., the resin for discarding other than the products called kull and runner for transfer molding is discarded. There was a problem that a large amount was generated.

Further, since the gate and runner have a complicated shape, there is a problem that the shape of the mold becomes complicated.

Further, since a die apparatus in which such a cull or a runner is provided in a different shape for each product is used, there is a problem that the cost increase cannot be avoided.
In addition, since the distance between the runners is long, there is a problem that the resin is wasted a lot.

There is also a problem that waste is increased from the viewpoint of environmental improvement.

The present invention has been made in view of the above circumstances, and it is not necessary to change the mold apparatus for each device, and the same mold apparatus can perform resin sealing of many kinds of devices. The purpose is to provide.

It is an object of the present invention to provide a resin sealing device that is inexpensive and can perform highly reliable resin sealing.

An object of the present invention is to provide a resin encapsulation device which can reduce waste of material by reducing unnecessary guide grooves and can provide a small-sized and highly reliable semiconductor device.

[0015]

Therefore, a resin sealing device according to the present invention includes a first mold portion and a second mold portion, which are arranged such that opposite surfaces thereof can come into contact with each other, and a resin sealing member. A part to be placed is defined, and a cavity defined between the facing surfaces of the first and second mold parts is defined in the cavity of the first mold part so as to define a resin sealing region. A support frame detachably mounted, the support frame includes a guide groove for guiding the sealing resin into the cavity, and the sealing resin is injected into the cavity through the guide groove. It is characterized in that it is configured to be.

According to this structure, the support frame can be replaced without actually modifying the first or second mold part, and thus the invention can be applied to different types of semiconductor devices. Further, since the runner can be short, it is possible to reduce waste of material resin.

Preferably, the guide groove of the support frame is formed so as to open to a supply port formed on the bottom surface of the cavity of the first mold part.

According to this structure, since the sealing resin can be directly supplied from the supply port under the support frame, the apparatus can be further simplified.
The device configuration becomes simple. Further, the alignment of the groove is easy, and the productivity is improved.

Preferably, the guide groove of the support frame is in contact with the bottom surface of the cavity of the first mold part, and the first mold part constitutes one inner wall of the guide groove. To do.

According to this structure, since it is only necessary to form the concave groove in the support frame, the structure of the device is simplified. Further, the alignment of the groove is easy, and the productivity is improved.

Preferably, the supply port is provided with a push-out mechanism for pushing out the sealing resin, and the push-out portion of the push-out mechanism is formed so as to be in contact with the support frame.

According to this structure, since the pushing mechanism is used directly toward the guide portion, there is no useless area, and it is possible to perform resin sealing satisfactorily.

Preferably, the cavity is provided with a plurality of guide grooves arranged in parallel with each other.

According to this structure, even when the cavity region is large and a plurality of injection ports are required, it is possible to easily form the groove in the shortest distance without increasing the area.

Preferably, the guide groove is formed perpendicular to the pushing direction of the pushing mechanism.

With this structure, the groove can be easily formed in the shortest distance without increasing the occupied area.

Preferably, a plurality of the guide grooves are formed so as to be substantially vertical to one side of the cavity, and a common dam portion is formed immediately before the cavity along one side of the cavity, Furthermore, one of the cavities
It is characterized in that the resin is configured to be injected toward the cavity through the slits formed on the sides.

According to this structure, the common dam portion is formed along one side of the cavity, and the resin is injected toward the cavity through the slit formed on one side of the cavity. Since it is configured, the injection into the cavity can be performed efficiently at once. Further, since the dam is ejected through the slit, it is possible to efficiently eject.

Preferably, the guide groove and the push-out mechanism are provided within an area where the support frame is provided.

With this structure, the resin can be introduced into the cavity in the shortest distance without increasing the occupied area.

Desirably, the cavity is configured so that a plurality of individually separable semiconductor chips can be collectively sealed after resin sealing.

According to this structure, it is possible to easily form a highly reliable CSP without increasing the occupied area.

For example, in the above structure, a lead frame or a film carrier is often used.

[0034]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The resin sealing device according to the first embodiment of the present invention will be described. As shown in FIG. 1, this resin sealing device includes a lower mold part (first mold part) 1 and an upper mold part (second mold part) which are arranged such that opposite surfaces thereof can come into contact with each other. Mold part 2 and four semiconductor chips 7 to be resin-sealed, for example, and a cavity defined between the surfaces facing the lower and upper mold parts so as to define the resin-sealed region, A support frame 3 which is detachably mounted in the cavity of the lower mold part 1, and the support frame 3 includes a guide groove 4 for guiding a sealing resin into the cavity. It is characterized in that the sealing resin is injected into the cavity through the line 4.

The TAB substrate 8 on which the semiconductor chip 7 is mounted is placed on the support bar 3 via the mount frame 10.

2A and 2B are a top view and a sectional view showing a state where the support frame 3 is mounted on the lower mold part 1, and FIG. 3 is a perspective view of the support frame 3.

Four guide grooves 4 are formed so as to be substantially perpendicular to one side of the cavity, and six air holes 9 are formed on the opposite side thereof so that the air of the injection resin can be removed. It is formed so that it can be pulled out in one direction.

The guide groove 4 of the support frame 3 is formed so as to open to the supply port 5 formed on the bottom surface of the cavity of the lower mold part 2. Here, the support frame 3 is detachably formed, and the support frame 3 can be replaced.

Further, the distance of the guide groove serving as the runner is configured to be as short as possible, but the length is greatly reduced as compared with the conventional guide portion as shown in FIG.

Further, the guide groove 4 of the support frame 3
Contacts the bottom surface of the cavity of the lower mold part 1, and the upper surface of the lower mold part constitutes one inner wall of the guide groove 4. The resin is supplied by pushing the sealing resin directly from the supply port 5 under the support frame 3 with the plunger 6.

As described above, the guide groove is formed between the support frame 3 and the lower mold surface only by forming the recessed groove, which simplifies the construction of the apparatus.
Groove alignment is easy and productivity is improved.

Further, the number of guide grooves and air holes formed in the support frame is not limited to this embodiment, and can be set appropriately according to the size and type of the product. Furthermore, desirably, the supply port includes a plunger 6 (pushing mechanism) for pushing out the sealing resin, and the plunger is formed so as to be able to contact the support frame 3.

According to this structure, since the pushing mechanism is used directly toward the guide portion, there is no useless area, and it is possible to perform good resin sealing.

Further, even when the cavity region is large and a plurality of injection ports are required, it is possible to easily form the groove in the shortest distance without increasing the area.

Furthermore, since the guide groove is formed perpendicularly to the pushing direction of the plunger, it is possible to easily form the groove in the shortest distance without increasing the occupied area.

After injection molding in this way, the upper mold part 2 and the lower mold part 1 are separated from each other, and the package formed in the cavity is taken out and separated into four pieces. In this way, the resin sealing of the CSP package can be performed very easily. The resin sealing device is not limited to the CSP package and can be used for resin sealing of various IC packages such as BGA, flip chip, and lead frame package.

According to this structure, the support frames can be replaced without actually modifying the mold part, and thus the invention can be applied to the case of different types of semiconductor devices.

Also, since the runner can be short, it is possible to reduce waste of material resin.

As a modification of the support frame used in the first embodiment, the one shown in FIG. 4 is also effective. In this example, the guide groove 4 of the support frame 3
Is formed by half etching, a hole P is formed below the guide groove 4, and the pot portion abuts on the hole P. The resin is supplied by pushing the sealing resin directly from the supply port 5 under the support frame 3 through the pot portion with the plunger 6. According to this structure, resin leakage is reduced.

Furthermore, as shown in FIG.
The guide groove 4 is provided to face the short side of the cavity,
The air holes 9 may be provided on the long sides so as to face each other.
Further, as shown in FIG. 6, a structure in which one guide groove 4 is provided on each short side of the cavity and an air hole 9 is provided so as to face the guide groove 4 is also effective.

Next, a second embodiment of the present invention will be described. As a second embodiment of the present invention, as shown in FIGS. 7 (a) and 7 (b), the guide groove 4 is formed in the cavity 1
Four pieces are formed in the same manner so that they are almost perpendicular to the sides,
Immediately before the cavity, a common dam portion 4d is formed along one side of the cavity.
It is characterized in that the resin is configured to be injected toward the cavity through the slits 4S formed on the sides. The other parts are formed in the same manner as in the first embodiment.

According to this structure, the common dam portion 4d is formed along one side of the cavity, and the resin is injected toward the cavity through the slit 4S formed on one side of the cavity. Since it is configured, the injection into the cavity can be performed efficiently at once. Further, since the dam is ejected through the slit, it is possible to efficiently eject.

Next, a third embodiment of the present invention will be described. As a third embodiment of the present invention, a resin sealing device for a semiconductor device using a film carrier is shown. This resin sealing device, as shown in FIG.
0 is arranged on the peripheral portion of the TAB substrate 8 and fixed by the tape 12, the support frame 3 is arranged in the same manner as in the first and second embodiments, and the cavity of the lower mold 1 is arranged. The surface forming the is adhered with a cover film 11 made of a polyimide tape, and has a structure for preventing resin from entering the gap. Other parts are formed in the same manner as in the above embodiment. Further, in the first embodiment, the cavity is formed only by the lower mold and the support frame, but in this embodiment, the upper mold part is also formed with a recess, and the upper mold part and the lower mold part are formed. The cavity is composed of and.

The other parts are formed in the same manner as in the first embodiment.

According to this resin sealing device, in addition to the effects of the first and second embodiments, resin wraparound in the gap is reduced, and a high quality resin sealing body can be obtained. Become.

In the first and second embodiments, TA
I used the mount frame because I used the B board,
The mount frame does not necessarily have to be used as long as it is a rigid body such as a printed circuit board or a lead frame.

[0057]

As described above, according to the present invention, the first mold part and the second mold part, which are arranged so that the facing surfaces can contact each other, and the resin should be sealed. The first and second parts are arranged so that the parts are arranged and define the resin sealing area.
A cavity defined between the surfaces facing the mold part of
A support frame detachably mounted in the cavity of the first mold portion, the support frame comprises a guide groove for guiding a sealing resin into the cavity, the guide groove Since the sealing resin is configured to be injected into the cavity through the semiconductor, different types of semiconductors can be obtained by replacing the support frame without actually modifying the first or second mold part. It can be applied to a device.

Further, the mold apparatus can be downsized and the runner can be shortened, so that the waste of material resin can be reduced. In this way, it is possible to provide a resin sealing device that is easy to mount and has high reliability.

[Brief description of drawings]

FIG. 1 is a diagram showing a resin sealing device according to a first embodiment of the present invention.

FIG. 2 is a top view and a cross-sectional view of a lower mold part of the resin sealing device according to the first embodiment of the present invention.

FIG. 3 is a perspective view showing a support frame used in the resin sealing device according to the first embodiment of the present invention.

FIG. 4 is a perspective view showing a modified example of a support frame used in the resin sealing device according to the first embodiment of the present invention.

FIG. 5 is a perspective view showing a modified example of a support frame used in the resin sealing device according to the first embodiment of the present invention.

FIG. 6 is a perspective view showing a modified example of a support frame used in the resin sealing device according to the first embodiment of the present invention.

7A and 7B are a top view and a cross-sectional view of a lower mold part of the resin sealing device according to the second embodiment of the present invention.

FIG. 8 is a diagram showing a resin sealing device according to a third embodiment of the present invention.

FIG. 9 is an explanatory view showing a conventional resin sealing device.

[Explanation of symbols]

1 Lower mold part 2 Upper mold part 3 support frames 4 guide groove 5 supply ports 6 Plunger 7 semiconductor chips 8 TAB board 9 air holes 10 mount frame 11 cover film 12 Polyimide tape

Claims (6)

[Claims] 1. The opposing surfaces are arranged so that they can contact each other,
Between the first mold part and the second mold part, the parts to be resin-sealed are arranged, and between the facing surfaces of the first and second mold parts so as to define the resin-sealing area. And a support frame detachably mounted in the cavity of the first mold part, the support frame having a guide groove for guiding a sealing resin into the cavity. A resin sealing device, comprising: a sealing resin injected into the cavity through the guide groove. 2. The guide groove of the support frame,
The resin sealing device according to claim 1, wherein the resin sealing device is formed so as to open to a supply port formed on the bottom surface of the cavity of the first mold part. 3. The resin sealing device according to claim 1, wherein the cavity includes a plurality of guide grooves arranged in parallel with each other. 4. The resin sealing device according to claim 3, wherein the guide groove is formed perpendicularly to a pushing direction of the pushing mechanism. 5. A plurality of the guide grooves are formed so as to be substantially perpendicular to one side of the cavity, and a common dam portion is formed immediately before the cavity along one side of the cavity, The resin sealing device according to claim 1, wherein the resin is configured to be injected toward the cavity through a slit formed on one side of the cavity. 6. The guide groove and the pushing mechanism are
The resin sealing device according to any one of claims 3 to 5, wherein the resin sealing device is provided within an area where the support frame is provided.