JP2003132324A - Manufacturing method for ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the manufacturing cost by improving a manufacturing yield of the IC card in the manufacturing method for the non-contact type IC card. SOLUTION: This manufacturing method for the non-contact type IC card is so formed that a card sheet formed by connecting coil antennas between a first insulating base material and a second insulating base material and embedding IC chips therein is punched out in its prescribed region into separate pieces using a metal mold. This manufacturing method detects the positions of the coil antennas embedded in the card sheet, regulates the punching region of the card sheet based on the positions of the coil antennas, and positions the punching region of the card sheet and the metal mold.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an IC card, and is particularly effective when applied to a method for manufacturing a non-contact type IC card in which an IC chip to which a coil antenna is connected is embedded in an insulating base material. Technology.

[0002]

2. Description of the Related Art Conventionally, in an IC card having an IC chip built in a card-shaped insulating base material such as a plastic card,
There are a contact type that transmits information by physical contact to a contact, and a non-contact type that transmits information at a spatial distance using electromagnetic waves. The contact-type IC card has drawbacks such as wear of a contact portion with a controller and troublesome insertion / removal of the card when used.
Cards are attracting attention.

The non-contact type IC card is shown in FIG.
As shown in FIGS. 13A and 13B, the first insulating substrate 1
The IC chip 4 to which the coil antenna 3 for wireless communication is connected is embedded between the second insulating base material 2 and the second insulating base material 2. here,
FIG. 13B is a sectional view taken along the line BB ′ of FIG.

The coil antenna 3 is, for example,
A conductor wire (copper wire) covered with enamel is wound a predetermined number of times, and although not shown, it is connected to an external electrode (bonding pad) of the IC chip 4. Also,
The IC chip 4 includes, for example, a transmission / reception circuit, a control circuit,
And a storage circuit (memory), etc.
As in I, a circuit in which each of the circuits is provided on one semiconductor chip or a circuit in which a plurality of semiconductor chips are mounted on a wiring board such as a multi-chip module (MCM) are used.

Further, the IC card is considered to be applied to various fields such as various credit cards, prepaid cards and commuter passes, as well as medical fields and identification, so that each card can be distinguished. As shown in FIG. 13B, the first insulating base material 1 and the second insulating base material 2 are
The decorative sheet 5 is often provided on the surface of the.

The method of manufacturing the non-contact type IC card will be briefly described. First, FIGS. 14A and 14B.
As shown in, the IC chip 4 to which the coil antenna 3 is connected is arranged on the sheet-shaped first insulating base material 1.
Here, FIG. 14B is a cross-sectional view taken along the line CC ′ of FIG.

Further, when manufacturing the IC card,
Large first insulating base material 1 for easy mass production
A plurality of IC chips 4 to which the coil antenna 3 is connected are arranged on the first insulating base material 1 in a matrix form as shown in FIG. 14A. At this time, since the IC chip 4 to which the coil antenna 3 is connected is easily deformed and automatic placement by a machine is difficult,
As shown in FIG. 14B, a positioning guide plate 1 having a predetermined region opened on the first insulating base material 1.
5, the IC chip 4 to which the coil antenna 3 is connected is placed in the opening of the guide plate 15.

At this time, in order to prevent the displacement of the IC chips 4, for example, as shown in FIG. 14A, the first insulating base material 1 and the guide plate 15 are formed.
Is fixed on the base 16 provided with the fixing member 16A.

Next, as shown in FIG. 15A, after mounting the second insulating base material 2 on the first insulating base material 1 on which the IC chip 4 to which the coil antenna 3 is connected is arranged, For example, for a card in which the first insulating base material 1 and the second insulating base material 2 are bonded by thermocompression bonding and the IC chip 4 to which the coil antenna 3 is connected is embedded as shown in FIG. 15 (b). The sheet S is formed.

Next, if necessary, for example, FIG.
As shown in (c), after the decorative sheet 5 is adhered to the surface of the card sheet S, that is, the surfaces of the first insulating base material 1 and the second insulating base material 2, the card sheet S When the predetermined area is cut into individual pieces, a non-contact type IC card as shown in FIGS. 13 (a) and 13 (b) is obtained.

When the card sheet S is divided into individual pieces, for example, the card sheet S is cut along the cutting line SL shown in FIG. 14, and as shown in FIG. Band), that is, after the IC chips 4 to which the coil antennas 3 are connected are divided into rows arranged, the punching area L of the strip-shaped card sheet S ′ is punched using a punching die. Separate into individual pieces.

At this time, the IC chip 4 to which the coil antenna 3 is connected is the strip-shaped card sheet S '.
However, the position of the coil antenna 3 cannot be confirmed from the surface. Therefore, as shown in FIG. 16, a mark 17 for aligning the punching die and the punching region L is provided on the surface of the strip-shaped card sheet S ′.

The positioning mark 17 is generally composed of
The mark 17 is printed on the surface of the decorative sheet 5, and the relative positional relationship between the mark 17 and the punching area L is defined by the distance between the mark 17 and the center line of the punching area L, for example. For example, as shown in FIG. 17, it is set that the center line CXL1 of the first punching region L1 is located at a position XX5 from the mark 17.

When the strip-shaped card sheet S'is conveyed to align the punching die (punch 6) with the first punching region L1, first, FIG. 17 is shown. As described above, the center line C of the die (punch 6) when the strip-shaped card sheet S ′ is placed at the reference position
The sheet is conveyed based on the distance XX1 from X to the center line CXL1 of the first punching area L1.

At this time, while the card sheet S'is being conveyed, the positioning mark 17 is detected by the sensor 18.
Is detected and the center line CXL of the first punched region L1 is detected.
1 is obtained, and then the distance XX from the mark 17 to the center line CXL1 of the first punched region L1.
5 and the distance XX6 from the sensor 18 to the center line CX of the punching die 6, the amount of movement of the card sheet S ′ is calculated. Then, when the strip-shaped card sheet S ′ is conveyed by a distance XX1, the positions of the center line CX of the punching die (punch 6) and the center line CXL1 of the first punching region L1 are displaced. In that case, the amount of the deviation is corrected, and the center line CX of the punching die 6 and the center line CXL1 of the first punching region L1 are aligned as shown in FIG.

In this state, the first punched area L1
After punching, the center line CX of the first punching region L1 is processed in the same procedure, for example, as shown in FIG.
Based on the distance XX7 from L1 to the center line CXL2 of the second punching area L2, the positioning mark 17 is detected while the belt-shaped card sheet S ′ is conveyed, and the card sheet S ′ Second punched area L2
After the center line CXL2 and the center line CX of the punching die 6 are aligned, the second punching region L2 is punched, and the above procedure is repeated.

[0017]

However, in the above-mentioned conventional technique, the step of disposing the IC chip 4 to which the coil antenna 3 is connected on the first insulating substrate 1 is as shown in FIGS. Since the guide plate 15 as shown in FIG. 14 (b) is used to perform the manual work, a positional shift easily occurs when the IC chip 4 to which the coil antenna 3 is connected is arranged.

If a displacement occurs when the IC chip 4 to which the coil antenna 3 is connected is arranged, when the band-shaped card sheet S'is formed, the position of the coil antenna 3 is, for example, as shown in FIG. As shown in 19, the center of the first punched region L1 is deviated. At this time, since the position of the punching die (punch 6) and the first punching region L1 is aligned based on the position of the center line CXL1 determined by the positioning mark 17, as shown in FIG. The coil antenna 3 is punched at a position close to the outer periphery of the first punching region L1, that is, at the end of the punching die (punch 6).

At this time, if the degree of positional displacement of the coil antenna 3 is large and the coil antenna 3 reaches the outer periphery of the first punched region L1, the coil antenna 3 is punched out and the coil The antenna 3 may be disconnected. Therefore, there is a problem that the manufacturing yield of the non-contact IC card is reduced and the manufacturing cost of the IC card is increased.

Further, since the positioning at the time of punching with the punching die is performed based on the positioning mark 17 printed on the surface of the decorative sheet 5, the coil antenna 3 has the outer periphery of the punching area L. There was a problem that it was difficult to perform alignment so that it would not cover the department.

In addition, the first insulating base material 1 and the second insulating base material 2 have weak adhesive strength in the vicinity of the coil antenna 3 and air may remain, so that the first punching is performed. If the coil antenna 3 is located near the outer circumference of the region L1, there is a problem that the first insulating base material 1 and the second insulating base material 2 may be peeled off after punching. Further, when the first insulating base material 1 and the second insulating base material 2 are peeled off and the coil antenna 3 is exposed, the coil antenna 3 is scratched and broken, or is oxidized or corroded, so that the operation reliability is improved. May decrease.

An object of the present invention is to provide a technique capable of improving the manufacturing yield of an IC card and reducing the manufacturing cost in a method for manufacturing a non-contact type IC card.

[0023] Another object of the present invention is to provide a technique capable of improving the positioning accuracy when dividing into individual pieces in a method for manufacturing a non-contact type IC card.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0025]

The outline of the invention disclosed in the present invention will be described below.

(1) A card sheet in which an IC chip to which a coil antenna is connected is embedded is formed between a first insulating base material and a second insulating base material, and a die is used to form the card sheet. Non-contact type I that punches out a predetermined area and divides into individual pieces
In the method of manufacturing a C card, the position of the coil antenna embedded in the card sheet is detected, the punching area of the card sheet is defined based on the position of the coil antenna, and the punching area of the card sheet is determined. And a method of manufacturing an IC card for aligning the mold.

According to the above-mentioned means (1), the punching area is determined based on the position of the coil antenna embedded between the first insulating base material and the second insulating base material, and the punching area is positioned. By performing the matching, the coil antenna can be punched in a state of being located near the center of the punched region. Therefore, disconnection of the coil antenna due to punching can be prevented, the manufacturing yield of the IC card can be improved, and the manufacturing cost can be reduced.

At this time, the position of the coil antenna is
For example, the position of the coil antenna can be easily detected by irradiating the card sheet with light and detecting the shadow at that time, and the alignment accuracy can be easily improved.

Further, in the card sheet, generally, IC chips to which the coil antennas are connected are arranged in a matrix on the first insulating substrate,
On the surface of the insulating substrate on which the IC chip is arranged, the second
An insulating base material is placed, and the first insulating base material and the second insulating base material are adhered to each other. Before punching using the mold,
Strips (strips) in which the IC sheets to which the coil antenna is connected are embedded in a line by cutting the card sheet
It is divided into card sheets. Therefore, by aligning the punching area of the strip-shaped card sheet with the mold in the transport direction of the card sheet, punching is performed due to the positional deviation of the strip-shaped card sheet in the transport direction. It is possible to reduce defects and improve the manufacturing yield of IC cards.

When the card sheet is cut and divided into the strip-shaped card sheets, the positions of the coil antennas are detected and the center line of the coil antennas in the cutting direction is defined. By correcting the cutting position of the card sheet based on the center line of each coil antenna, the misalignment in the direction orthogonal to the conveying direction when punching the strip-shaped card sheet with a die is reduced. Therefore, the manufacturing yield of the IC card can be further improved.

Hereinafter, the present invention will be described in detail with reference to the drawings together with the embodiments (embodiments).

In all the drawings for explaining the embodiments, parts having the same function are designated by the same reference numerals and their repeated description will be omitted.

[0033]

BEST MODE FOR CARRYING OUT THE INVENTION Before describing the embodiments according to the present invention, first, a non-contact type IC card according to the present invention and a method for manufacturing the same will be briefly described.

FIG. 1 is a schematic diagram showing a schematic structure of an IC card according to the present invention. FIG. 1 (a) is a plan view of the IC card, and FIG. 1 (b) is AA of FIG. 1 (a). It is sectional drawing in a line.

In FIG. 1, 1 is a first insulating base material, 2 is a second insulating base material, 3 is a coil antenna, 4 is an IC chip, 5
Is a decorative sheet.

The IC card according to the present invention is shown in FIG.
Also, as shown in FIG. 1B, an IC chip 4 in which a coil antenna 3 for wireless communication is connected between a card-shaped first insulating base material 1 and a second insulating base material 2 such as a plastic card. It is a non-contact type IC card in which is embedded.

The coil antenna 3 is, for example,
A conductor wire (copper wire) covered with enamel is wound a predetermined number of times, and although not shown, it is connected to an external electrode (bonding pad) of the IC chip 4. Also,
The IC chip 4 includes, for example, a transmission / reception circuit, a control circuit,
And a storage circuit (memory), etc.
As in I, a circuit in which each of the circuits is provided on one semiconductor chip or a circuit in which a plurality of semiconductor chips are mounted on a wiring board such as a multi-chip module (MCM) are used.

The IC card is considered to be applied to a wide variety of fields such as various credit cards, prepaid cards, commuter passes for transportation, medical care, and identification, so that each card can be distinguished. As shown in FIG. 1B, the decorative sheet 5 is often provided on the surfaces of the first insulating base material 1 and the second insulating base material 2.

The method for manufacturing the non-contact type IC card is as follows.
The procedure is the same as the conventional procedure. First, as shown in FIGS. 14A and 14B, the guide plate 15 is placed on the sheet-shaped first insulating base material 1 and the guide plate 15 A plurality of IC chips 4 to which the coil antenna 3 is connected are arranged in the opening of 15, for example, in a matrix.

Next, as shown in FIG. 15 (a),
After the second insulating base material 2 is placed on the first insulating base material 1 on which the IC chip 4 to which the coil antenna 3 is connected is arranged, the first insulating base material 1 and the second insulating base material 1 are insulated from each other by, for example, thermocompression bonding. The base material 2 is adhered to form a card sheet S in which the IC chip 4 to which the coil antenna 3 is connected is embedded, as shown in FIG.

Then, if necessary, for example, FIG.
As shown in (c), the surface of the card sheet S,
That is, the first insulating base material 1 and the second insulating base material 2
After adhering the decorative sheet 5 to the surface of the card, the predetermined area of the card sheet S is cut into individual pieces, and the non-contact type IC card as shown in FIGS. 1 (a) and 1 (b) is obtained. Is obtained.

FIG. 2 is a schematic diagram for explaining a method of manufacturing an IC card according to the present invention.

When separating the card sheet S into individual pieces, for example, the card sheet S is separated from the sheet shown in FIG.
It cut | disconnects by the cutting line SL shown to (a), and was divided | segmented into the strip shape (band shape), ie, as shown in FIG. 2, the state in which the IC chip 4 to which the said coil antenna 3 was connected was located in a line. After that, using a punching die, the punching region L of the belt-shaped card sheet S ′ is punched into individual pieces.
At this time, the positioning mark may not be printed on the surface of the strip-shaped card sheet S ′, unlike the conventional card sheet S ′ shown in FIG.

The method of positioning when punching out the punching region L of the card sheet S'will be described below.

(Embodiment 1) FIGS. 3 to 8 are schematic views for explaining a method of manufacturing an IC card according to Embodiment 1 of the present invention, and FIG. 3 shows a schematic structure of an individualizing device. FIG. 4 is a schematic plan view, FIG. 4 is a front view of FIG. 3, and FIGS. 5, 6, 7, and 8 are schematic diagrams for explaining a positioning method.

In FIGS. 3 and 4, 6 is a punch, 7 is a die, 8 is a stripper, 9 is a feed roll, 10 is a sheet guide, 11 is a coil antenna detection sensor, 12 is a stop pin, 13 is a light source, and 14 is It is a support member. 5 to 8, L1 is the first punching area, CXL1 is the center line of the first punching area, L2 is the second punching area, CXL2 is the center line of the second punching area, and CX is the punching area. 6, XX1 is the distance from the center line CXL1 of the first punching area at the reference position to the center line CX of the punch 6, and XX2 is the center line of the first punching area from the reference end surface of the card sheet S ′. XX3 is the distance from the center line CXL1 of the first punched area to the center line CXL2 of the second punched area, X is the distance to CXL1
X4 is the distance from the coil antenna detection sensor to the center line CX6 of the punch 6.

As shown in FIGS. 3 and 4, the device for dividing into pieces used in manufacturing the IC card of the first embodiment is a punching die composed of a punch 6, a die 7 and a stripper 8, and A feed roll 9 and a sheet guide 10 for feeding the strip-shaped card sheet S ′, and an antenna detection sensor for detecting the coil antenna 3 embedded in the card sheet S ′ fed by the feed roll 9. 11, a stop pin 12 for setting a reference position, and a light source 13. Although not shown in the drawings, the respective constituent elements are integrally supported by the support member 14.

When the strip-shaped card sheet S'as shown in FIG. 2 is singulated by using the singulation device, first, for example, as shown in FIG. From the center line CXL1 of the first punching region L1 of the card sheet to the center line CX of the punching die (punch 6) in a state where the strip-shaped card sheet S ′ is stopped by the stop pins 12. The distance XX1 is set in advance, the card sheet S ′ is moved (conveyed) by the set distance XX1 by the feed roll 9, and the first punching region L1 of the card sheet S ′ and the punch 6 are moved. Align the.

At this time, the first punched region L1
Is an initial punching area determined when the IC chip 4 to which the coil antenna 3 is connected is arranged on the first insulating base material 1, and is, for example, the card sheet S ′.
The distance XX2 from the reference end face to the center line CXL1 is set in advance. Similarly, the center line CXL1 of the first punched region L1 and the second punched region L
The distance XX3 of the center line CXL2 of 2 is also set in advance.

In the first embodiment, as shown in FIG. 5, the IC chip 4 to which the coil antenna 3 is connected is arranged so as to be displaced from the center of the first punched region L1. .

Next, while the card sheet S'is being conveyed based on a preset distance XX1,
The light from the light source 13 is applied to the card sheet S ′,
Sensor 1 installed above the card sheet S ′
At 1, the intensity of light transmitted through the card sheet S ′ is detected. At this time, the intensity of the light detected by the sensor 11 is low in the portion of the coil antenna 3 embedded in the card sheet S ′, as shown in FIG. 6, since the light does not pass therethrough. Therefore, it is determined that the coil antenna 3 is located at a position where the intensity of light detected by the sensor 11 is less than or equal to a preset threshold value, and the coil antenna 3 from the reference end surface of the card sheet S ′ is detected.
The position of can be calculated. At this time, for example, in the coil antenna 3 in the first punched region L1, the displacement X from the reference end face of the card sheet S ′ is X1 and X.
The coil antenna 3 is detected at the position 1 ', and the position CXL1' of the center line of the coil antenna 3 can be defined from the displacements X1 and X1 '.

Center line CX of the first punching region L1
When the alignment is performed based on L1, as shown in FIG. 7, the center line CXL of the first punching region L1 is used.
1 and the center line CX of the punch 6 are aligned with each other, the position of the coil antenna 3 is set to the first punching region L.
It deviates from the center of 1.

Therefore, the center line CXL1 'of the coil antenna 3 is obtained by the above procedure, and the first line is calculated using the distance XX4 from the sensor 11 to the center line CX of the punch 6 shown in FIG. The difference ΔX between the center line CXL1 of the punched area L1 and the center line CXL1 ′ of the coil antenna 3 is obtained, and the movement amount of the card sheet S ′ is corrected based on the difference ΔX of the center lines. As shown, the center line CXL1 ′ of the coil antenna 3 is aligned with the center line CX of the punching die (punch 6).

At this time, the initial first punching area L1 set in the strip-shaped card sheet S'is displaced with respect to the punch 6, as shown in FIG.
A new punching area L1 'after correction is punched out. Therefore, the coil antenna 3 can be punched in the vicinity of the center of the punching region L1 ′, and the coil antenna 3 can be prevented from being broken when punching with the punching die.

Next, when punching out the second punching region L2, the center line CXL1 of the first punching region L1 and the second punching region L2 which are set in advance are set.
The card sheet S ′ is conveyed based on the distance XX3 of the center line CXL2 of FIG. Also at this time, as shown in FIG. 6, the positions X2 and X2 ′ of the coil antenna 3 in the second punched region L2 are detected to obtain the center line CXL2 ′ of the coil antenna 3, and the center line CXL2 ′ is obtained. CXL
By aligning 2'and the center line CX of the punch 6 so that they coincide with each other, the coil antenna 3 can be punched in the vicinity of the center of the punching region,
It is possible to prevent disconnection of the coil antenna 3.

Thereafter, the position of the coil antenna 3 in each punched area is detected by the same procedure, the difference between the center line of the coil antenna 3 and the center line of each punched area is corrected, and each coil antenna 3 is detected. The coil antenna 3 can be prevented from being broken by aligning the center line of the punch 6 with the center line CX of the punch 6 and punching.

As described above, according to the method of manufacturing the IC card of the first embodiment, the position of the coil antenna 3 embedded in the strip-shaped card sheet S'is detected and the coil antenna 3 is detected. By performing alignment with the punching die (punch 6) based on the position of, the coil antenna 3 can be punched in a state of being located at the center of the die (punch 6). Therefore, disconnection of the coil antenna 3 due to punching can be prevented, the manufacturing yield of the IC card can be improved, and the manufacturing cost can be reduced.

The position of the coil antenna 3 is detected by irradiating the card sheet S ′ with light and detecting it by the shadow at that time, as described in the first embodiment. The position can be easily detected, and the alignment accuracy can be easily improved.

(Embodiment 2) FIGS. 9 to 12 are schematic views for explaining a method of manufacturing an IC card according to Embodiment 2 of the present invention. FIG. 9 is a plan view of a card sheet, and FIG.
9 is an enlarged plan view of FIG. 9, FIG. 11 is a schematic diagram for explaining a method of determining a cutting position, and FIG. 12 is a plan view for explaining the function and effect.

9 and 10, S is a card sheet, S'is a rectangular card sheet, SL is a cutting line,
L1 is a first punching area, L2 is a second punching area, and L3 is a third punching area. Further, in FIG. 11, CYL1 ′ is the center line of the first punching region in the Y direction, CYL2 ′ is the center line of the second punching region in the Y direction, and CYL3 ′ is the center line of the third punching region in the Y direction. , SL is a cutting line, SL 'is a corrected cutting line,
In FIG. 12, L1 ′ is the corrected first punching area, L2 ′ is the corrected second punching area, and L3 ′ is the corrected third punching area.

In the second embodiment, a method for cutting a card sheet S having IC chips 4 connected to the coil antenna 3 arranged in a matrix into strips (belts) will be described.

In the method of manufacturing the IC card of the first embodiment, the coil antenna 3 is aligned only in the conveying direction (X direction) of the belt-shaped card sheet S '.

However, actually, as shown in FIG. 9, when the card sheet S in which the IC chips 4 to which the coil antenna 3 is connected is arranged in a matrix is formed as shown in FIG. In the first punched area L
In addition to the case of the first coil antenna 3 being displaced in the X direction, the case of being displaced in the X direction and the Y direction like the coil antenna 3 of the second punching region L2, or the Y being like the third punching region L3. In some cases, the degree of positional deviation of the coil antenna 3 is different in each punching area. Therefore, if there is a displacement in the Y direction like the coil antennas 3 in the second punched region L2 and the third punched region L3, only by performing the alignment in the X direction as in the first embodiment. Is likely to cause disconnection of the coil antenna 3.

Therefore, before cutting the card sheet S as shown in FIG. 9, as shown in FIG. 11, for example, the center line CXL1 in the X direction of the first punched region L1,
Center line CXL in the X direction of the second punched region L2
2. The position of the coil antenna 3 in each punched area is detected along the center line CXL3 of the third punched area L3, and the position of the center line in the Y direction of each coil antenna 3 is obtained. The method of detecting the position of the coil antenna is the same as the method of the first embodiment, and is detected by the shadow when the card sheet is irradiated with light.

At this time, as shown in FIG. 11, the center line CYL1 'in the Y direction of the first punched region L1 and the center line CYL2' in the Y direction of the second punched region L2.
And the center line CY in the Y direction of the third punched region L3
If L3 'is obtained, the center lines are averaged and the cutting position of the card sheet is corrected so that the average position of the center lines becomes a new center line.

When the cutting line SL 'corrected by this method is used for cutting, the position of the center line of the strip-shaped card sheet S'is shifted, and the punching regions are shifted. The relative position to the coil antenna 3 changes. Therefore, as shown in FIG.
The coil antennas 3 in the new second punching region L2 ′ and the new third punching region L3 approach the direction of the center line CY, respectively, and in the subsequent steps, along the procedure of the first embodiment, in the carrying direction. When punching with correction in the (X direction), the probability that the coil antenna 3 comes near the outer periphery of the punching region can be lowered, and the coil antenna 3 can be prevented from being disconnected.

As described above, according to the method of manufacturing the IC card of the first embodiment, the position of the coil antenna 3 embedded in the card sheet is detected and based on the position of the coil antenna 3. By performing alignment with the die by performing alignment with the die, the coil antenna 3 can be punched in a state of being located in the center of the punching region. Therefore, disconnection of the coil antenna 3 due to punching can be prevented, the manufacturing yield of the IC card can be improved, and the manufacturing cost can be reduced.

Further, the position of the coil antenna 3 can be easily detected by, for example, irradiating the card sheet with light and detecting the position by shading. The accuracy of alignment can be easily improved.

Further, as in the second embodiment, when the card sheet S is cut into strips, by correcting the deviation of the coil antenna 3 in the direction orthogonal to the cutting direction, It is possible to prevent disconnection of the coil antenna 3 due to a positional shift in a direction orthogonal to the alignment direction (conveyance direction) described in Example 1, and to further improve the manufacturing yield of the IC card as compared with the case of Example 1. Can be improved.

Although the present invention has been specifically described based on the above embodiment, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the invention. Of course.

[0071]

Of the inventions disclosed in the present invention,
The following is a brief description of the effects obtained by the typical ones.

(1) In the non-contact type IC card manufacturing method, the manufacturing yield of the IC card can be improved and the manufacturing cost can be reduced.

(2) In the method of manufacturing a non-contact type IC card, it is possible to improve the positioning accuracy when dividing into individual pieces.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing a schematic configuration of an IC card according to the present invention, FIG. 1 (a) is a plan view of the IC card, and FIG.
FIG. 1B is a sectional view taken along the line AA ′ of the IC card shown in FIG.

FIG. 2 is a schematic plan view for explaining a method for manufacturing an IC card according to the present invention.

FIG. 3 is a schematic view for explaining the method of manufacturing the IC card according to the first embodiment of the present invention, and is a plan view showing a schematic configuration of an apparatus for dividing the IC card into individual pieces.

FIG. 4 is a schematic diagram for explaining the method of manufacturing the IC card according to the first embodiment, and is a front view of the device shown in FIG.

FIG. 5 is a schematic diagram for explaining the method for manufacturing the IC card according to the first embodiment, and is a plan view for explaining the method for alignment.

FIG. 6 is a schematic diagram for explaining the method of manufacturing the IC card according to the first embodiment, and is a diagram for explaining a method of positioning.

FIG. 7 is a schematic diagram for explaining the method for manufacturing the IC card according to the first embodiment, and is a plan view for explaining the method for positioning.

FIG. 8 is a schematic diagram for explaining the method for manufacturing the IC card according to the first embodiment, and is a plan view for explaining the method for alignment.

FIG. 9 is a schematic diagram for explaining a method for manufacturing an IC card of Example 2 according to the present invention, and a plan view showing a schematic configuration of an IC card sheet.

FIG. 10 is a schematic view for explaining the method of manufacturing the IC card of the second embodiment, and is a partially enlarged view of the IC card sheet shown in FIG.

FIG. 11 is a schematic diagram for explaining the method for manufacturing the IC card of the second embodiment, and is a diagram for explaining a method for determining the cutting position.

FIG. 12 is a schematic plan view for explaining the function and effect of the method of manufacturing an IC card according to the second embodiment.

13A and 13B are schematic diagrams showing a schematic configuration of a conventional non-contact type IC card, wherein FIG. 13A is a plan view of the IC card, and FIG. 13B is a schematic view of the IC card shown in FIG. B-
It is sectional drawing in a B'line.

FIG. 14 is a schematic diagram for explaining a conventional method for manufacturing a non-contact type IC card, FIG. 14 (a) is a plan view of a step of arranging an IC chip to which a coil antenna is connected, and FIG. 14) is a cross-sectional view taken along the line CC ′ of FIG.

FIG. 15 is a schematic diagram for explaining a conventional method for manufacturing a non-contact type IC card, and FIGS.
15B and FIG. 15C are cross-sectional views of each step.

FIG. 16 is a schematic plan view for explaining a conventional method for manufacturing a non-contact type IC card.

FIG. 17 is a schematic diagram for explaining a conventional method for manufacturing a non-contact type IC card, and a plan view for explaining a method for alignment when separating into pieces.

FIG. 18 is a schematic diagram for explaining a conventional method for manufacturing a non-contact type IC card, and is a plan view for explaining a method for alignment when separating into pieces.

FIG. 19 is a schematic plan view for explaining a problem in a conventional non-contact type IC card manufacturing method.

FIG. 20 is a schematic plan view for explaining problems in the conventional method for manufacturing a non-contact type IC card.

[Explanation of symbols]

1 1st insulating base material 2 2nd insulating base material 3 coil antenna 4 IC chip 5 decorative sheet 6 punch 7 die 8 stripper 9 feed roll 10 sheet guide 11 coil antenna detection sensor 12 stop pin 13 light source 14 support member 15 guide plate 16 Base 16A Fixing member S Card sheet S'Strip card sheet SL Cutting line L1 First punching area L2 Second punching area L3 Third punching area CXL1 Center line CXL2 of the first punching area Center line CXL3 of punching area Center line CX of third punching area Center line CXL1 'of punch 6 Center line CXL2' of coil antenna in first punching area CXL3 'Center line of coil antenna in second punching area The center line CYL1 of the coil antenna in the third punched area The center line of Y direction of the center line CYL3 third punching area in the Y direction of the center line CYL2 second punching area in the Y direction of the bled areas

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takamitsu Nakabayashi             1-6-1, Otemachi, Chiyoda-ku, Tokyo             Standing Wire Co., Ltd. F-term (reference) 2C005 MA19 NA08 NA09 RA22                 5B035 AA03 AA04 BA05 BB09 CA01                       CA23

Claims (4)

[Claims] 1. A card sheet in which an IC chip to which a coil antenna for wireless communication is connected is embedded is formed between a first insulating base material and a second insulating base material, and the card is formed by using a mold. In a method for manufacturing a non-contact type IC card in which a predetermined area of a sheet for sheeting is punched into individual pieces, the position of the coil antenna embedded in the sheet for card is detected, and the card is detected based on the position of the coil antenna. A method for manufacturing an IC card, characterized in that a punching area of a sheet for use is defined, and the punching area of the card sheet and the mold are aligned. 2. The method of manufacturing an IC card according to claim 1, wherein the position of the coil antenna is detected by a shadow when the card sheet is irradiated with light. 3. The card sheet, wherein the IC chips to which the coil antennas are connected are arranged in a matrix on the first insulating base material, and the IC chips of the first insulating base material are arranged. The second insulating base material is placed on the arranged surface, the first insulating base material and the second insulating base material are adhered to each other to be formed, and the card sheet is formed before punching using the mold. A strip shape (band shape) in which IC chips to which the coil antennas are connected by cutting are embedded in rows
3. The card sheet according to claim 1, wherein the punching area of the strip-shaped card sheet and the mold are aligned with respect to the conveying direction of the card sheet. The method for manufacturing an IC card according to 1. 4. When the card sheet is cut and divided into the strip-shaped card sheets, the position of each coil antenna is detected, and the center line of each coil antenna in the cutting direction is defined. The method for manufacturing an IC card according to claim 3, wherein the cutting position of the card sheet is corrected based on the center line of each of the coil antennas.