JP2003129006A5 - - Google Patents

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Publication number
JP2003129006A5
JP2003129006A5 JP2001332091A JP2001332091A JP2003129006A5 JP 2003129006 A5 JP2003129006 A5 JP 2003129006A5 JP 2001332091 A JP2001332091 A JP 2001332091A JP 2001332091 A JP2001332091 A JP 2001332091A JP 2003129006 A5 JP2003129006 A5 JP 2003129006A5
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Japan
Prior art keywords
resin
weight
parts
adhesive
total
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JP2001332091A
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Japanese (ja)
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JP3965964B2 (en
JP2003129006A (en
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Priority to JP2001332091A priority Critical patent/JP3965964B2/en
Priority claimed from JP2001332091A external-priority patent/JP3965964B2/en
Publication of JP2003129006A publication Critical patent/JP2003129006A/en
Publication of JP2003129006A5 publication Critical patent/JP2003129006A5/ja
Application granted granted Critical
Publication of JP3965964B2 publication Critical patent/JP3965964B2/en
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Expired - Fee Related legal-status Critical Current

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Claims (6)

（Ａ）メタクリル酸メチルを主体とする単官能不飽和単量体を５０〜９９重量部、（Ｂ）メタクリル酸メチルを主体とする不飽和単量体の重合体を１〜５０重量部、（Ｃ）ラジカル重合可能な二重結合を分子内に少なくとも２個有する多官能不飽和単量体を成分（Ａ）および（Ｂ）の合計１００重量部に対して０．０１〜２重量部、および（Ｄ）１０時間半減期温度が４０〜６０℃の有機過酸化物を成分（Ａ）および（Ｂ）の合計１００重量部に対して０．０１〜１重量部含有することを特徴とする樹脂用接着剤。(A) 50 to 99 parts by weight of monofunctional unsaturated monomer mainly composed of methyl methacrylate, (B) 1 to 50 parts by weight polymer of unsaturated monomer mainly composed of methyl methacrylate, C) 0.01 to 2 parts by weight of a polyfunctional unsaturated monomer having at least two radically polymerizable double bonds in the molecule with respect to 100 parts by weight of the total of components (A) and (B), and (D) A resin comprising 0.01 to 1 part by weight of an organic peroxide having a 10-hour half-life temperature of 40 to 60 ° C. with respect to a total of 100 parts by weight of components (A) and (B) Adhesive. さらに、（Ｅ）１０時間半減期温度が６１〜１２０℃の有機過酸化物を成分（Ａ）および（Ｂ）の合計１００重量部に対して０．０１〜２重量部含有する請求項１記載の樹脂用接着剤。Furthermore, (E) 0.01-2 weight part of organic peroxides with a 10-hour half-life temperature of 61-120 degreeC are contained with respect to a total of 100 weight part of component (A) and (B). Adhesive for resin. 少なくとも２枚の樹脂板を、請求項１または２に記載の樹脂用接着剤で接着してなる樹脂積層板。A resin laminate obtained by adhering at least two resin plates with the resin adhesive according to claim 1. 少なくとも２枚の樹脂板を請求項１または請求項２に記載の樹脂用接着剤で接着することを特徴とする請求項３に記載の樹脂積層板の製造方法。4. The method for producing a resin laminate according to claim 3, wherein at least two resin plates are bonded with the resin adhesive according to claim 1 or 2. 樹脂板と樹脂板との間に空隙を設け、該空隙に請求項１または請求項２に記載の樹脂用接着剤を入れて重合硬化させる請求項４に記載の製造方法。The manufacturing method according to claim 4, wherein a gap is provided between the resin plate and the resin adhesive according to claim 1 or 2 is placed in the gap and polymerized and cured. 樹脂板の表面に請求項１または請求項２に記載の樹脂用接着剤を塗布し、その上に別の樹脂板を重ねた後、前記接着剤を重合硬化させる請求項４に記載の製造方法。The manufacturing method according to claim 4, wherein the resin adhesive according to claim 1 or 2 is applied to the surface of the resin plate, another resin plate is overlaid thereon, and then the adhesive is polymerized and cured. .
JP2001332091A 2001-10-30 2001-10-30 Resin adhesive and resin laminate Expired - Fee Related JP3965964B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001332091A JP3965964B2 (en) 2001-10-30 2001-10-30 Resin adhesive and resin laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001332091A JP3965964B2 (en) 2001-10-30 2001-10-30 Resin adhesive and resin laminate

Publications (3)

Publication Number Publication Date
JP2003129006A JP2003129006A (en) 2003-05-08
JP2003129006A5 true JP2003129006A5 (en) 2005-04-07
JP3965964B2 JP3965964B2 (en) 2007-08-29

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ID=19147561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001332091A Expired - Fee Related JP3965964B2 (en) 2001-10-30 2001-10-30 Resin adhesive and resin laminate

Country Status (1)

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JP (1) JP3965964B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5111711B2 (en) * 2002-01-31 2013-01-09 日立化成工業株式会社 Adhesive composition, adhesive composition for circuit connection, and circuit connection method
JP2012224775A (en) * 2011-04-21 2012-11-15 Panasonic Corp Radically curable resin composition for molding, and resin-molded article
JP6393994B2 (en) * 2014-01-29 2018-09-26 日立化成株式会社 Adhesive composition, electronic member using adhesive composition, and method for manufacturing semiconductor device

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