JP2003124651A - Mounting structure of circuit substrate - Google Patents

Mounting structure of circuit substrate

Info

Publication number
JP2003124651A
JP2003124651A JP2001320100A JP2001320100A JP2003124651A JP 2003124651 A JP2003124651 A JP 2003124651A JP 2001320100 A JP2001320100 A JP 2001320100A JP 2001320100 A JP2001320100 A JP 2001320100A JP 2003124651 A JP2003124651 A JP 2003124651A
Authority
JP
Japan
Prior art keywords
circuit board
frame
marker
mounting structure
circuit substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001320100A
Other languages
Japanese (ja)
Other versions
JP3685120B2 (en
Inventor
Masanori Asakura
正則 朝倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Machinery Ltd
Original Assignee
Murata Machinery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Machinery Ltd filed Critical Murata Machinery Ltd
Priority to JP2001320100A priority Critical patent/JP3685120B2/en
Publication of JP2003124651A publication Critical patent/JP2003124651A/en
Application granted granted Critical
Publication of JP3685120B2 publication Critical patent/JP3685120B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Coupling Device And Connection With Printed Circuit (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a mounting structure of a circuit substrate, which permits easy connection of connectors for both circuit substrates to each other upon mounting the circuit substrate while superposing the same on the frame of a device. SOLUTION: A supporting unit 41, supporting the one side of a second circuit substrate 20 and used both for a marker, is provided on the frame 30 while a marker 25, corresponding to the supporting unit 41, is provided on one side of the circuit substrate 20. The circuit substrate 20 is pushed against the circuit substrate 10 mounted on the frame 30 in the vertical direction under a condition that the marker 25 of the circuit substrate 20 is opposed to the supporting unit 41 used both for a marker while supporting the one side of the circuit substrate 20 by the supporting unit 41 whereby the circuit substrate 20 is erected vertically and the connectors 11, 21 for the circuit substrates 10, 20 are connected.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】この発明は、装置フレームに
回路基板を重ねて取付ける際に両回路基板のコネクタ同
士を接続し易くした回路基板の取付構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board mounting structure for facilitating connection between connectors of both circuit boards when mounting circuit boards on a device frame.

【0002】[0002]

【従来の技術】パーソナルコンピュータ等の各種電子機
器では、限定的なスペースを有効に利用するために装置
フレームに回路基板を重ねて取付けることが多く、回路
基板同士はコネクタにより接続する。
2. Description of the Related Art In various electronic devices such as personal computers, in order to effectively use a limited space, circuit boards are often mounted on a device frame so that the circuit boards are connected by connectors.

【0003】回路基板のサイズが大小に異なる場合で回
路基板を装置フレームに取付ける際、先に小さな第1の
回路基板(例えば中継基板)を装置フレームに取付け、
この第1の回路基板を覆うように第1の回路基板よりも
大きい第2の回路基板を装置フレームに取付けることが
ある。
When the circuit board is mounted on the device frame in the case where the size of the circuit board is large or small, the first small circuit board (for example, a relay board) is mounted on the device frame first.
A second circuit board larger than the first circuit board may be attached to the device frame so as to cover the first circuit board.

【0004】具体的には、例えば図7の(a)に示すよ
うな第1の回路基板10と、図7の(b)に示すような
第2の回路基板20とがあり、両回路基板10,20に
はそれぞれコネクタ11,21が設けられているとす
る。装置フレームへの取付けは、先に第1の回路基板1
0を取付け、この回路基板10を覆うように第2の回路
基板20を装着する。その際、第2の回路基板20のコ
ネクタ21を第1の回路基板10のコネクタ11に結合
させることで、両回路基板10,20がコネクタ11,
21で電気的に接続される。
Specifically, there are, for example, a first circuit board 10 as shown in FIG. 7A and a second circuit board 20 as shown in FIG. 7B. It is assumed that the connectors 10 and 20 are provided on the connectors 10 and 20, respectively. The first circuit board 1 is first attached to the device frame.
0 is mounted, and the second circuit board 20 is mounted so as to cover the circuit board 10. At that time, by connecting the connector 21 of the second circuit board 20 to the connector 11 of the first circuit board 10, the two circuit boards 10 and 20 are connected to each other.
It is electrically connected at 21.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、第2の
回路基板20が第1の回路基板10よりも大きいので、
図8に示すように、第2の回路基板20を装着すると
き、第1の回路基板10のコネクタ11が見えず、コネ
クタ11,21同士の位置合せに苦労し、コネクタ1
1,21を接続するのに時間が掛かり、作業効率が低下
する問題があった。
However, since the second circuit board 20 is larger than the first circuit board 10,
As shown in FIG. 8, when the second circuit board 20 is mounted, the connector 11 of the first circuit board 10 cannot be seen, and it is difficult to align the connectors 11 and 21 with each other.
There is a problem that it takes time to connect 1 and 21 and work efficiency is reduced.

【0006】この発明は、そのような問題点に着目して
なされたものであって、装置フレームに回路基板を重ね
て取付ける際に両回路基板のコネクタ同士の接続を容易
に行えるようにした回路基板の取付構造を提供すること
を目的としている。
The present invention has been made in view of such a problem, and a circuit for facilitating the connection between the connectors of both circuit boards when the circuit boards are stacked and attached to the apparatus frame. It is intended to provide a mounting structure for a substrate.

【0007】[0007]

【課題を解決するための手段】前記目的を達成するため
に、この発明の回路基板の取付構造は、第1の回路基板
と、第2の回路基板とを有し、取付構造のフレームに取
付けてある第1の回路基板のコネクタに第2の回路基板
のコネクタを結合させて第2の回路基板を装着する回路
基板の取付構造において、前記第2の回路基板の1辺を
支持する支持部を前記フレームに設け、第2の回路基板
の前記1辺側とフレームの各々の対応位置にそれぞれマ
ーカーを設け、第2の回路基板の1辺をフレームの支持
部で支持しつつ第2の回路基板とフレームの双方のマー
カーを合わせた状態で第2の回路基板を第1の回路基板
へ押すことにより、両回路基板のコネクタが接続される
ことを特徴とする。
In order to achieve the above object, a circuit board mounting structure of the present invention has a first circuit board and a second circuit board, and is mounted on a frame of the mounting structure. In a circuit board mounting structure for mounting a second circuit board by connecting a connector of the second circuit board to a connector of the first circuit board, a support portion for supporting one side of the second circuit board. Are provided on the frame, markers are provided on the one side of the second circuit board and at corresponding positions on the frame, respectively, and one side of the second circuit board is supported by a supporting portion of the frame to form a second circuit. It is characterized in that the connectors of both circuit boards are connected by pushing the second circuit board to the first circuit board in a state where the markers of both the board and the frame are aligned.

【0008】この取付構造では、第2の回路基板の1辺
をフレームの支持部で支持しながら、第2の回路基板の
1辺側のマーカーをフレームのマーカーに合わせて、第
2の回路基板を第1の回路基板に押せば、両回路基板の
コネクタを結合できるので、組立作業の効率を上げるこ
とができる。つまり、マーカー同士を合わせれば自動的
にコネクタ同士の位置合せも行えるので、マーカー同士
を併せて押付ける作業を機械的に行えばよく、組立作業
を能率良く行うことができる。
In this mounting structure, while supporting one side of the second circuit board by the supporting portion of the frame, the marker on the one side of the second circuit board is aligned with the marker of the frame, and the second circuit board is attached. By pressing on the first circuit board, the connectors of both circuit boards can be connected, so that the efficiency of the assembling work can be improved. That is, since the connectors can be automatically aligned by aligning the markers with each other, the operation of pressing the markers together can be performed mechanically, and the assembling work can be efficiently performed.

【0009】なお、第2の回路基板の1辺側のマーカー
は、例えばシルク印刷で形成すればよい。
The marker on one side of the second circuit board may be formed by silk printing, for example.

【0010】[0010]

【発明の実施の形態】以下、実施の形態により、この発
明を更に詳細に説明する。
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in more detail with reference to embodiments.

【0011】但し、説明の便宜上、第1の回路基板は図
7の(a)に示すものとし、これの説明を省略し、第2
の回路基板は図7の(b)に示すものとする。
However, for convenience of explanation, it is assumed that the first circuit board is as shown in FIG. 7A, and the description thereof is omitted.
The circuit board of is shown in FIG. 7 (b).

【0012】図1に示すように、第2の回路基板20に
おいて、コネクタ21が取付けられた側とは反対側の1
辺側(下部)には、シルク印刷によりマーカー25が施
されている。ここでは、マーカー25の個数は3個で、
形状は半円形であるが、個数は適宜増減すればよく、後
記フレーム側のマーカーとの位置合せが容易であるなら
最低限1個でもよい。また、形状もフレーム側のマーカ
ーとの位置合せが可能であるなら、四角形、三角形、矢
印等、特定されない。
As shown in FIG. 1, in the second circuit board 20, one side on the side opposite to the side on which the connector 21 is attached is mounted.
A marker 25 is applied to the side (lower part) by silk printing. Here, the number of markers 25 is three,
The shape is semicircular, but the number may be appropriately increased or decreased, and at least one may be used if it is easy to align with the marker on the frame side described later. In addition, if the shape can be aligned with the marker on the frame side, the shape such as a quadrangle, a triangle, or an arrow is not specified.

【0013】装置フレームに設けるマーカーは、例えば
図2〜図4に示すようなものである。ここでは、図2〜
図4に示すマーカーは、いずれも第2の回路基板20を
フレーム上に立てて取付ける場合である。
The markers provided on the device frame are as shown in FIGS. 2 to 4, for example. Here, FIG.
The markers shown in FIG. 4 are for the case where the second circuit board 20 is mounted upright on the frame.

【0014】図2では、フレームに直線(一点鎖線)上
に半円形の一対の支持部41が設けられている。一対の
支持部41は第2の回路基板20の1辺側を支持し、マ
ーカーを兼用するものであり、一対の支持部41の間隔
は第2の回路基板20の厚さよりも若干大きめに設定さ
れている。また、一対の支持部41は、第2の回路基板
20のマーカー25の個数に対応して三対設けられ、マ
ーカー25と略同形状及び同サイズであるが、これらは
マーカー25に適宜合わせればよい。なお、支持部41
は、例えばフレームの所定箇所42を半円形に切り起こ
すことにより形成される。
In FIG. 2, the frame is provided with a pair of semicircular support portions 41 on a straight line (one-dot chain line). The pair of support portions 41 support one side of the second circuit board 20 and also serve as markers. The distance between the pair of support portions 41 is set to be slightly larger than the thickness of the second circuit board 20. Has been done. Further, the pair of support portions 41 are provided in three pairs corresponding to the number of the markers 25 on the second circuit board 20 and have substantially the same shape and the same size as the markers 25. Good. The support portion 41
Is formed, for example, by cutting and raising a predetermined portion 42 of the frame in a semicircular shape.

【0015】図3では、フレームに図示のようなレール
状の一対の支持部43が取付けられ、支持部43に半円
形の三対のマーカー44が形成されている。この一対の
支持部43は第2の回路基板20の一辺側を支持し、マ
ーカー44は凸状であり、第2の回路基板20のマーカ
ー25に対応している。
In FIG. 3, a pair of rail-shaped support portions 43 as shown in the figure are attached to the frame, and three pairs of semicircular markers 44 are formed on the support portion 43. The pair of support portions 43 supports one side of the second circuit board 20, and the marker 44 has a convex shape and corresponds to the marker 25 of the second circuit board 20.

【0016】図4では、フレームにレール状の一対の支
持部45が取付けられ、支持部45に三対の半円形のマ
ーカー46が形成されている。この一対の支持部45も
第2の回路基板20の一辺側を支持し、マーカー46は
切欠き状であり、同様に第2の回路基板20のマーカー
25に対応している。
In FIG. 4, a pair of rail-shaped support portions 45 are attached to the frame, and three pairs of semicircular markers 46 are formed on the support portion 45. The pair of support portions 45 also support one side of the second circuit board 20, and the marker 46 has a cutout shape, and similarly corresponds to the marker 25 of the second circuit board 20.

【0017】図2の支持部41は、この支持部41に第
2の回路基板20のマーカー25を合わせたときに回路
基板20のコネクタ21と第1の回路基板10のコネク
タ11とが位置合せされるように、予め装置フレームに
位置決めされている。また、図3及び図4の支持部4
3,45も、それぞれマーカー25をマーカー44,4
6に合わせたときにコネクタ11,21が合致するよう
に、装置フレームに位置決めされている。
In the support portion 41 of FIG. 2, the connector 21 of the circuit board 20 and the connector 11 of the first circuit board 10 are aligned when the marker 25 of the second circuit board 20 is aligned with the support portion 41. As described above, it is pre-positioned on the device frame. In addition, the supporting portion 4 of FIGS.
3, 45 also have markers 25 and 44, 4 respectively.
It is positioned in the device frame so that the connectors 11 and 21 match when the connector 6 is aligned.

【0018】次に、図1の第2の回路基板20と図7の
(a)の第1の回路基板10との取付構造について説明
する。但し、装置フレーム側のマーカーは図2に示すマ
ーカー兼用の支持部41とする。第1の回路基板10
は、図6に示すように、第2の回路基板20の装着に先
立って装置フレーム30に縦方向に取付けられており、
その状態で、図5において、第2の回路基板20の1辺
側をフレーム30の支持部41間に嵌め込みつつ、3つ
のマーカー25をそれぞれ3箇所のマーカー兼用の支持
部41に合わせる。
Next, the mounting structure of the second circuit board 20 of FIG. 1 and the first circuit board 10 of FIG. 7A will be described. However, the marker on the device frame side is the support portion 41 also used as the marker shown in FIG. First circuit board 10
Is attached to the device frame 30 in a vertical direction prior to the mounting of the second circuit board 20, as shown in FIG.
In that state, in FIG. 5, while fitting one side of the second circuit board 20 between the support portions 41 of the frame 30, the three markers 25 are aligned with the support portions 41 also serving as the three markers.

【0019】そして、図6の(a)に示すように、第2
の回路基板20の1辺側を支点にし、回路基板20を垂
直になるように矢印方向に立てる。すると、第2の回路
基板20のコネクタ21が第1の回路基板10のコネク
タ11に接続され、第2の回路基板20が第1の回路基
板11に装着される。勿論、図3及び図4のマーカー付
き支持部43,45でも、同様にして装着作業を行うこ
とができる。
Then, as shown in FIG. 6A, the second
Using one side of the circuit board 20 as a fulcrum, the circuit board 20 is erected in the arrow direction so as to be vertical. Then, the connector 21 of the second circuit board 20 is connected to the connector 11 of the first circuit board 10, and the second circuit board 20 is mounted on the first circuit board 11. Of course, the mounting work can be performed in the same manner with the marker-equipped support portions 43 and 45 shown in FIGS. 3 and 4.

【0020】なお、上記実施形態では、第2の回路基板
20が第1の回路基板10よりも大きいものとして説明
したが、両回路基板10,20が略同サイズである場合
も同様に適用可能である。要するに、第1の回路基板1
0に対して第2の回路基板20を後から装着するとき
に、両回路基板10,20のコネクタ11,21を容易
に接続できるのであれば、基板の大小に限定はない。
In the above embodiment, the second circuit board 20 is described as being larger than the first circuit board 10, but the same is applicable when both circuit boards 10 and 20 have substantially the same size. Is. In short, the first circuit board 1
There is no limitation on the size of the board as long as the connectors 11 and 21 of both circuit boards 10 and 20 can be easily connected when the second circuit board 20 is attached to 0 later.

【0021】また、上記実施形態は、第1及び第2の回
路基板10,20を装置フレームに垂直に立てる場合で
あるが、両回路基板を水平に配置する場合、即ち第1の
回路基板上に第2の回路基板を重ねる場合も同様に適用
できる。
In the above-described embodiment, the first and second circuit boards 10 and 20 are vertically set on the device frame, but both circuit boards are arranged horizontally, that is, on the first circuit board. The same can be applied to the case where the second circuit board is overlapped with.

【0022】[0022]

【発明の効果】以上説明したように、この発明の回路基
板の取付構造によれば、第2の回路基板と装置フレーム
のマーカー同士を合わせれば自動的に第1及び第2の回
路基板のコネクタ同士の位置合せも行えるので、第2の
回路基板の1辺をフレームの支持部で支持しつつマーカ
ー同士を合わせて第2の回路基板を第1の回路基板に押
す作業を機械的に行えばよく、組立作業を効率良く行う
ことができる。
As described above, according to the circuit board mounting structure of the present invention, when the markers of the second circuit board and the device frame are aligned with each other, the connectors of the first and second circuit boards are automatically connected. Since the positions of the second circuit boards can be aligned with each other, it is possible to mechanically perform the work of pressing the second circuit board against the first circuit board while aligning the markers while supporting one side of the second circuit board by the supporting portion of the frame. The assembly work can be efficiently performed.

【0023】請求項2の構成とすれば、第2の回路基板
にマーカーを安価に施すことができる。
According to the structure of claim 2, the marker can be provided on the second circuit board at a low cost.

【図面の簡単な説明】[Brief description of drawings]

【図1】実施形態に係る回路基板の取付構造に使用する
第2の回路基板の平面図である。
FIG. 1 is a plan view of a second circuit board used in a circuit board mounting structure according to an embodiment.

【図2】実施形態に係る回路基板の取付構造における装
置フレームに設けるマーカー兼用の支持部の斜視図であ
る。
FIG. 2 is a perspective view of a support portion which also serves as a marker, which is provided on the device frame in the circuit board mounting structure according to the embodiment.

【図3】実施形態に係る回路基板の取付構造における装
置フレームに設けるマーカー付き支持部の一例の斜視図
である。
FIG. 3 is a perspective view of an example of a support unit with a marker provided on the device frame in the circuit board mounting structure according to the embodiment.

【図4】実施形態に係る回路基板の取付構造における装
置フレームに設けるマーカー付き支持部の別例の斜視図
である。
FIG. 4 is a perspective view of another example of the marker-equipped support portion provided on the device frame in the circuit board mounting structure according to the embodiment.

【図5】実施形態に係る回路基板の取付構造において、
装置フレームのマーカー兼用の支持部に第2の回路基板
の1辺側を嵌め込むときの様子を示す概略正面図であ
る。
FIG. 5 is a circuit board mounting structure according to the embodiment,
It is a schematic front view which shows a mode when one side of a 2nd circuit board is fitted in the support part also used as a marker of a device frame.

【図6】実施形態に係る回路基板の取付構造において、
第2の回路基板を第1の回路基板に押すときの様子を示
す概略側面図(a)、及び第2の回路基板を完全に垂直
に立てたときの様子を示す概略側面図(b)である。
FIG. 6 is a circuit board mounting structure according to the embodiment,
FIG. 2A is a schematic side view showing a state when the second circuit board is pushed onto the first circuit board, and FIG. 3B is a schematic side view showing the state when the second circuit board is erected completely vertically. is there.

【図7】実施形態及び従来例に係る回路基板の取付構造
に使用する第1の回路基板の平面図(a)、及び従来例
に係る回路基板の取付構造に使用する第2の回路基板の
平面図(b)である。
FIG. 7A is a plan view of a first circuit board used for the circuit board mounting structure according to the embodiment and the conventional example, and FIG. 7 is a second circuit board used for the circuit board mounting structure according to the conventional example. It is a top view (b).

【図8】従来例に係る回路基板の取付構造を説明する平
面図である。
FIG. 8 is a plan view illustrating a circuit board mounting structure according to a conventional example.

【符号の説明】[Explanation of symbols]

10 第1の回路基板 11,21 コネクタ 20 第2の回路基板 25 マーカー 30 装置フレーム 41 マーカー兼用支持部 43,45 支持部 44,46 マーカー 10 First circuit board 11,21 connector 20 Second circuit board 25 markers 30 device frame 41 Marker combined support 43, 45 support 44,46 markers

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】第1の回路基板と、第2の回路基板とを有
し、取付構造のフレームに取付けてある第1の回路基板
のコネクタに第2の回路基板のコネクタを結合させて第
2の回路基板を装着する回路基板の取付構造において、 前記第2の回路基板の1辺を支持する支持部を前記フレ
ームに設け、第2の回路基板の前記1辺側とフレームの
各々の対応位置にそれぞれマーカーを設け、第2の回路
基板の1辺をフレームの支持部で支持しつつ第2の回路
基板とフレームの双方のマーカーを合わせた状態で第2
の回路基板を第1の回路基板へ押すことにより、両回路
基板のコネクタが接続されることを特徴とする回路基板
の取付構造。
1. A first circuit board having a first circuit board and a second circuit board, wherein a connector of the second circuit board is connected to a connector of the first circuit board mounted on a frame of a mounting structure. In a circuit board mounting structure for mounting a second circuit board, a supporting portion that supports one side of the second circuit board is provided in the frame, and the one side of the second circuit board corresponds to each of the frames. Markers are provided at the respective positions, and one side of the second circuit board is supported by the supporting portion of the frame while the second circuit board and the frame are both marked with the marker.
The circuit board mounting structure characterized in that the connectors of both circuit boards are connected by pushing the circuit board of (1) to the first circuit board.
【請求項2】前記第2の回路基板の1辺側のマーカー
は、シルク印刷で形成されることを特徴とする請求項1
記載の回路基板の取付構造。
2. The marker on one side of the second circuit board is formed by silk printing.
The circuit board mounting structure described.
JP2001320100A 2001-10-18 2001-10-18 Circuit board mounting structure Expired - Fee Related JP3685120B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001320100A JP3685120B2 (en) 2001-10-18 2001-10-18 Circuit board mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001320100A JP3685120B2 (en) 2001-10-18 2001-10-18 Circuit board mounting structure

Publications (2)

Publication Number Publication Date
JP2003124651A true JP2003124651A (en) 2003-04-25
JP3685120B2 JP3685120B2 (en) 2005-08-17

Family

ID=19137539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001320100A Expired - Fee Related JP3685120B2 (en) 2001-10-18 2001-10-18 Circuit board mounting structure

Country Status (1)

Country Link
JP (1) JP3685120B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010080893A (en) * 2008-09-29 2010-04-08 Murata Mfg Co Ltd Circuit module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010080893A (en) * 2008-09-29 2010-04-08 Murata Mfg Co Ltd Circuit module

Also Published As

Publication number Publication date
JP3685120B2 (en) 2005-08-17

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