JP2003124607A - Forming method for conductor pattern - Google Patents

Forming method for conductor pattern

Info

Publication number
JP2003124607A
JP2003124607A JP2001319500A JP2001319500A JP2003124607A JP 2003124607 A JP2003124607 A JP 2003124607A JP 2001319500 A JP2001319500 A JP 2001319500A JP 2001319500 A JP2001319500 A JP 2001319500A JP 2003124607 A JP2003124607 A JP 2003124607A
Authority
JP
Japan
Prior art keywords
insulating film
filter paper
conductive
conductive pattern
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001319500A
Other languages
Japanese (ja)
Other versions
JP3942398B2 (en
Inventor
Yoshiyuki Kokubu
義幸 国分
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Priority to JP2001319500A priority Critical patent/JP3942398B2/en
Publication of JP2003124607A publication Critical patent/JP2003124607A/en
Application granted granted Critical
Publication of JP3942398B2 publication Critical patent/JP3942398B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a forming method for a conductive pattern which can deter and prevent an insulating film and filter paper from shifting in position during conveyance after printing and prevent the insulating film, etc., from having an outward shape defect, a leak defect, etc. SOLUTION: On a surface of the continuous flexible insulating film 1, a plurality of 1st conductive patterns are printed with conductive paste 9 and dried and a through hole is bored in the respective 1st conductive patterns; and the insulating film 1 is turned over and the flexible filter paper 15 is put over its surface and brought into electrostatic contact by an electrostatic charging device 3. A plurality of 2nd conductive patterns are printed on the reverse surface of the insulating film 1 with conductive paste 17, the 1st and 2nd conductive patterns are brought into electric contact with each other, and the insulating film 1 and filter paper 15 are separated to dry the 2nd conductive patterns.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、電気、電子、半導
体等の分野で使用される導電パターンの形成方法に関す
るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a conductive pattern used in the fields of electricity, electronics, semiconductors and the like.

【0002】[0002]

【従来の技術】従来、連続した可撓性の絶縁フィルム1
に導電パターンを形成する場合には、図3ないし図5に
示すように、先ず、絶縁フィルム1の上面である表面上
に複数の第一の導電パターン8を流動性の導電ペースト
9によりそれぞれスクリーン印刷して各第一の導電パタ
ーン8を乾燥機12で乾燥させ(図3(a)、(b)参照)、
乾燥した各第一の導電パターン8にスルーホール14を
上方から穿孔する(図4(a)、(b)参照)。
2. Description of the Related Art Conventionally, a continuous flexible insulating film 1
In the case of forming a conductive pattern on the surface of the insulating film 1, first, a plurality of first conductive patterns 8 are formed on the surface, which is the upper surface of the insulating film 1, by a fluid conductive paste 9 to form a screen. After printing, each first conductive pattern 8 is dried by a dryer 12 (see FIGS. 3 (a) and 3 (b)),
Through holes 14 are punched from above in each dried first conductive pattern 8 (see FIGS. 4A and 4B).

【0003】こうして第一の導電パターン8にスルーホ
ール14を穿孔したら、絶縁フィルム1を上下逆にして
その下面である表面に連続した可撓性のろ紙15を重ね
合わせ、これら一体化した絶縁フィルム1とろ紙15を
下流に搬送して絶縁フィルム1の上面である裏面上に複
数の第二の導電パターン16を流動性の導電ペースト1
7によりそれぞれスクリーン印刷し、第一、第二の導電
パターン8・16を貫通したスルーホール14と導電ペ
ースト17により電気的に導通する(図5(a)、(b)参
照)。
After the through holes 14 are formed in the first conductive pattern 8 in this manner, the insulating film 1 is turned upside down and a continuous flexible filter paper 15 is superposed on the lower surface of the insulating film 1 to form an integrated insulating film. 1 The filter paper 15 is conveyed downstream and a plurality of second conductive patterns 16 are formed on the back surface which is the upper surface of the insulating film 1 and the fluid conductive paste 1
7 is screen-printed respectively, and the through holes 14 penetrating the first and second conductive patterns 8 and 16 are electrically connected to the conductive paste 17 (see FIGS. 5A and 5B).

【0004】この際、スルーホール14内に導電ペース
ト17が導通接続のために流入するが、絶縁フィルム1
にろ紙15が既に付着しているので、絶縁フィルム1や
テーブル7が導電ペースト17で汚れるのをある程度防
止することができる。そしてその後、絶縁フィルム1と
ろ紙15とを分離してろ紙15を巻き取り、絶縁フィル
ム1の第二の導電パターン16を乾燥機12で乾燥させ
れば、連続した可撓性の絶縁フィルム1に導電パターン
を形成することができる。
At this time, the conductive paste 17 flows into the through holes 14 for conductive connection.
Since the filter paper 15 is already attached, it is possible to prevent the insulating film 1 and the table 7 from being soiled with the conductive paste 17 to some extent. Then, after that, the insulating film 1 and the filter paper 15 are separated, the filter paper 15 is wound up, and the second conductive pattern 16 of the insulating film 1 is dried by the dryer 12, whereby a continuous flexible insulating film 1 is obtained. A conductive pattern can be formed.

【0005】[0005]

【発明が解決しようとする課題】従来における導電パタ
ーンの形成方法は、以上のようになされ、絶縁フィルム
1にろ紙15を単に重ね合わせるに止まるので、スクリ
ーン印刷後の搬送時に絶縁フィルム1とろ紙15とが摩
擦抵抗値の相違から位置ズレを起こすことが少なくな
い。このような位置ズレが生じると、ろ紙15に導電ペ
ースト17が付着しているので、導電ペースト17が絶
縁フィルム1等を汚染し、その結果、外観不良やリーク
不良を引き起こすこととなる。
The conventional method for forming a conductive pattern is as described above, and since the filter paper 15 is simply superposed on the insulating film 1, the insulating film 1 and the filter paper 15 can be conveyed during transportation after screen printing. It is not uncommon for and to cause positional deviation due to the difference in frictional resistance. When such a positional deviation occurs, the conductive paste 17 adheres to the filter paper 15, so that the conductive paste 17 contaminates the insulating film 1 and the like, resulting in a poor appearance and a defective leak.

【0006】本発明は、上記に鑑みなされたもので、印
刷後の搬送時に絶縁フィルムとろ紙とが位置ズレを起こ
すのを抑制防止し、絶縁フィルム等に外観不良やリーク
不良等が生じるのを防ぐことのできる導電パターンの形
成方法を提供することを目的としている。
The present invention has been made in view of the above, and it is possible to prevent the insulating film and the filter paper from being displaced from each other during conveyance after printing, and to prevent the insulating film and the like from having a poor appearance and a leak defect. It is an object of the present invention to provide a method of forming a conductive pattern that can be prevented.

【0007】[0007]

【課題を解決するための手段】請求項1記載の発明にお
いては、上記課題を達成するため、可撓性の絶縁フィル
ムに導電パターンを形成する方法であって、上記絶縁フ
ィルムの表面に第一の導電パターンを形成して乾燥さ
せ、この第一の導電パターンにスルーホールを開け、上
記絶縁フィルムを表裏逆にしてその表面にろ紙を重ねて
静電密着させ、その後、該絶縁フィルムの裏面に第二の
導電パターンを形成して第一、第二の導電パターンを上
記スルーホールで電気的に接続することを特徴としてい
る。
In order to achieve the above-mentioned object, a method of forming a conductive pattern on a flexible insulating film, wherein the first surface is formed on the surface of the insulating film. To form a conductive pattern and dry it, open a through hole in this first conductive pattern, reverse the insulating film to the front and back and put a filter paper on the surface to electrostatically adhere, and then to the back surface of the insulating film. It is characterized in that a second conductive pattern is formed and the first and second conductive patterns are electrically connected by the through hole.

【0008】なお、密着した上記絶縁フィルムと上記ろ
紙のうち、絶縁フィルムに電源に接続された帯電電極
を、ろ紙に導電プレートをそれぞれ対向させ、これら帯
電電極と導電プレート間の距離を5〜15mmに形成す
ることが好ましい。
Of the above-mentioned insulating film and the filter paper which are in close contact with each other, a charging electrode connected to a power source is opposed to the insulating film and a conductive plate is opposed to the filter paper, and the distance between the charging electrode and the conductive plate is 5 to 15 mm. It is preferable to form it.

【0009】ここで、特許請求の範囲における第一、第
二の導電パターンは、単数複数いずれでも良いし、いか
なる図形でも良い。この第一、第二の導電パターンの形
成に際しては、スクリーン印刷法を採用するのが主であ
るが、他の印刷方法でも良い。また、絶縁フィルムとろ
紙の静電密着に際しては、絶縁フィルムを損傷させない
という条件下でコロナ放電や誘導帯電等の方法を適宜利
用することができる。
Here, the first and second conductive patterns in the claims may be singular or plural, and may be any figure. A screen printing method is mainly used for forming the first and second conductive patterns, but another printing method may be used. When electrostatically contacting the insulating film and the filter paper, a method such as corona discharge or induction charging can be appropriately used under the condition that the insulating film is not damaged.

【0010】[0010]

【発明の実施の形態】以下、図面を参照して本発明の好
ましい実施形態を説明すると、本実施形態における導電
パターンの形成方法は、図1や図2に示すように、可撓
性の絶縁フィルム1の表面上に第一の導電パターン8を
導電ペースト9によりスクリーン印刷して乾燥させ、第
一の導電パターン8にスルーホール14を穿孔し、絶縁
フィルム1を上下逆にしてその下方の表面に可撓性のろ
紙15を重ね合わせて静電気により帯電密着させるとと
もに、絶縁フィルム1の裏面上に第二の導電パターン1
6を導電ペースト17によりスクリーン印刷して第一、
第二の導電パターン8・16をスルーホール14と導電
ペースト17で電気的に導通し、その後、絶縁フィルム
1とろ紙15とを分離して絶縁フィルム1の第二の導電
パターン16を乾燥させるようにしている。
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. A method of forming a conductive pattern in this embodiment will be described with reference to FIG. 1 and FIG. The first conductive pattern 8 is screen-printed on the surface of the film 1 with a conductive paste 9 and dried, the through holes 14 are punched in the first conductive pattern 8, and the insulating film 1 is turned upside down. A flexible filter paper 15 is superposed on the upper surface of the insulating film 1 to be electrostatically charged and adhered thereto, and the second conductive pattern 1 is formed on the back surface of the insulating film 1.
6 by screen printing with conductive paste 17
The second conductive patterns 8 and 16 are electrically connected to the through holes 14 by the conductive paste 17, and then the insulating film 1 and the filter paper 15 are separated to dry the second conductive pattern 16 of the insulating film 1. I have to.

【0011】次に、この導電パターンの形成に用いる形
成装置について説明すると、この導電パターンの形成装
置は、同図に示すように、上流から下流にかけて回転駆
動軸のロールに巻回される絶縁フィルム1、この絶縁フ
ィルム1よりも上流にセットされて回転駆動軸のロール
に巻回されるろ紙15、帯電装置3、テーブル7、スク
リーン印刷装置10、複数の針を並べ備えた上下動可能
な穿孔機13(この点に関しては、図4参照)、ろ紙15
用の巻き取りロール18、及び赤外線や熱風等を使用す
る絶縁フィルム1用の乾燥機12等を備えている。
Next, the forming device used for forming the conductive pattern will be explained. As shown in the figure, the forming device for the conductive pattern is an insulating film wound around a roll of a rotary drive shaft from upstream to downstream. 1. Filter paper 15 set upstream of the insulating film 1 and wound around a roll of a rotation drive shaft, a charging device 3, a table 7, a screen printing device 10, and a vertically movable perforation provided with a plurality of needles. Machine 13 (see Fig. 4 in this regard), filter paper 15
And a dryer 12 for the insulating film 1 that uses infrared rays or hot air.

【0012】絶縁フィルム1としては、連続した長尺の
ポリエチレンテレフタレート(PET)、ポリブチレンテ
レフタレート(PBT)、ポリエチレンナフタレート(P
EN)等のポリエステル、ポリカーボネート、ポリフェ
ニレンサルファイド等があげられる。これらの中でも、
導電ペースト9・17の密着性や寸法安定性、耐折り曲
げ性に優れ、光や熱に対して安定な厚さ10〜50mm
のポリエチレンテレフタレートが材料としては好適であ
る。
As the insulating film 1, continuous long polyethylene terephthalate (PET), polybutylene terephthalate (PBT) and polyethylene naphthalate (P) are used.
Examples thereof include polyesters such as EN), polycarbonate, polyphenylene sulfide, and the like. Among these,
The conductive paste 9 and 17 have excellent adhesion, dimensional stability, and bending resistance, and a thickness of 10 to 50 mm that is stable against light and heat.
Polyethylene terephthalate of is suitable as a material.

【0013】ろ紙15は、例えば合成繊維不織布や多孔
質のセルロース紙等を用いて絶縁フィルム1の表面を覆
うよう連続した略同じ大きさ、あるいはやや小さく形成
され、0.2〜1.0mmの厚さに形成される。このろ
紙15の厚さが0.2〜1.0mmの範囲なのは、この
範囲の値よりも厚いと取り扱いに難を生じ、逆に薄過ぎ
ると導電ペースト17がろ紙15の裏側に回りこむから
である。ろ紙15の保留粒子径は、空気の通過を向上さ
せ、スクリーン印刷に悪影響を及ぼさない滑らかさを得
る観点から1〜5μmに形成される。
The filter paper 15 is made of, for example, synthetic fiber non-woven fabric or porous cellulose paper, and is formed to have a continuous size of approximately the same or slightly smaller so as to cover the surface of the insulating film 1, and has a size of 0.2 to 1.0 mm. Formed to a thickness. The reason why the thickness of the filter paper 15 is in the range of 0.2 to 1.0 mm is that if it is thicker than this range, it will be difficult to handle, and if it is too thin, the conductive paste 17 will wrap around to the back side of the filter paper 15. is there. The retention particle size of the filter paper 15 is formed to be 1 to 5 μm from the viewpoint of improving the passage of air and obtaining smoothness that does not adversely affect screen printing.

【0014】帯電装置3は、図2に示すように、高圧電
源4に接続されて上方の絶縁フィルム1に隙間を介して
近接する帯電電極5と、下方のろ紙15に相対的に摺接
して帯電させる導電プレートであるSUSプレート6と
を備え、これら高電界を形成する帯電電極5とSUSプ
レート6の距離Lが5〜15mm、好ましくは8〜12
mm、より好ましくは10mmに形成される。帯電電極
5とSUSプレート6の距離Lが5〜15mmの範囲な
のは、5mm未満の場合には、絶縁フィルム1に帯電電
極5が接触するおそれがあるからである。逆に、15m
mを超える場合には、帯電量が弱化するからである。
As shown in FIG. 2, the charging device 3 is relatively connected to the charging electrode 5 which is connected to the high voltage power source 4 and is close to the upper insulating film 1 with a gap, and the lower filter paper 15. A SUS plate 6 that is a conductive plate to be charged is provided, and a distance L between the charging electrode 5 and the SUS plate 6 that forms the high electric field is 5 to 15 mm, preferably 8 to 12
mm, more preferably 10 mm. The reason that the distance L between the charging electrode 5 and the SUS plate 6 is in the range of 5 to 15 mm is that the charging electrode 5 may come into contact with the insulating film 1 if the distance L is less than 5 mm. On the contrary, 15m
This is because, when it exceeds m, the charge amount is weakened.

【0015】帯電装置3の電圧値は、1〜10kV、特
に3〜5kVの範囲が好ましい。これは、1kVよりも
弱い場合には、絶縁フィルム1とろ紙15の密着が弱
く、位置ズレが生じるからであり、逆に10kVよりも
強い場合には、絶縁フィルム1とろ紙15の密着が強過
ぎ、絶縁フィルム1とろ紙15とを容易に分離すること
ができないからである。帯電電極5としては、例えば平
板、円筒の電極、細いタングステン線やステンレス線等
を使用することができる。
The voltage value of the charging device 3 is preferably in the range of 1 to 10 kV, particularly 3 to 5 kV. This is because when it is weaker than 1 kV, the insulating film 1 and the filter paper 15 are weakly adhered to each other and a positional deviation occurs. On the contrary, when it is stronger than 10 kV, the insulating film 1 and the filter paper 15 are strongly adhered. This is because the insulating film 1 and the filter paper 15 cannot be easily separated. As the charging electrode 5, for example, a flat plate, a cylindrical electrode, a thin tungsten wire, a stainless wire or the like can be used.

【0016】テーブル7は、その作業面に多数の吸着孔
がXY方向に並べて穿孔され、この多数の吸着孔が図示
しない真空装置に接続されている。スクリーン印刷装置
10、穿孔機13、巻き取りロール18、及び乾燥機1
2については、それぞれ周知の技術が採用される。
A large number of suction holes are formed on the work surface of the table 7 side by side in the XY direction, and the many suction holes are connected to a vacuum device (not shown). Screen printing device 10, perforator 13, take-up roll 18, and dryer 1
Well-known techniques are adopted for each item.

【0017】上記構成において、連続した可撓性の絶縁
フィルム1の表裏面に導電パターンを形成する場合に
は、先ず、ロール状の絶縁フィルム1を上流から複数の
ローラ2を介してテーブル7上に搬送し、このテーブル
7上に絶縁フィルム1を真空吸着してその上面である表
面に複数の第一の導電パターン8を流動性の導電ペース
ト9によりスクリーン印刷装置10でスクリーン印刷
し、絶縁フィルム1をテーブル7から複数のローラ11
を介して下流の乾燥機12に搬送して各第一の導電パタ
ーン8を乾燥させる(この点に関しては、図3参照)。導
電ペースト9としては、カーボン、金、銀、銅、ニッケ
ル等の導電性付与粉末をポリエステル樹脂、ポリウレタ
ン樹脂、エポキシ樹脂、アクリル樹脂等のバインダーに
40〜95重量%含有させ、体積抵抗率を0.05〜1
0Ωcmとしたペーストが好ましい。
In the above structure, when conductive patterns are formed on the front and back surfaces of the continuous flexible insulating film 1, first, the roll-shaped insulating film 1 is placed on the table 7 from the upstream side through a plurality of rollers 2. The insulating film 1 is vacuum-sucked on the table 7, and a plurality of first conductive patterns 8 are screen-printed on the surface which is the upper surface of the table 7 with the fluid conductive paste 9 by the screen printing device 10. 1 to the plurality of rollers 11 from the table 7
The first conductive pattern 8 is conveyed to the downstream dryer 12 via the to dry the first conductive pattern 8 (see FIG. 3 in this regard). As the conductive paste 9, 40 to 95% by weight of conductivity imparting powder of carbon, gold, silver, copper, nickel or the like is contained in a binder such as polyester resin, polyurethane resin, epoxy resin or acrylic resin, and the volume resistivity is 0. .05 to 1
A paste having 0 Ωcm is preferable.

【0018】次いで、ロール状の絶縁フィルム1を上流
から複数のローラ2を介してテーブル7上に搬送し、こ
のテーブル7上に絶縁フィルム1を真空吸着してその表
面の各第一の導電パターン8にスルーホール14を穿孔
機13で上方から穿孔し、下流に搬送する(この点に関
しては、図4参照)。この際、穿孔するスルーホール1
4の直径は0.1〜0.5mmが好ましい。これは、
0.1mm未満だと穿孔機13の針が折れ易くなり、逆
に0.5mmを超えると配線密度の観点から大き過ぎる
からである。
Next, the roll-shaped insulating film 1 is conveyed from the upstream side to the table 7 through a plurality of rollers 2, and the insulating film 1 is vacuum-sucked on the table 7 to form each first conductive pattern on the surface thereof. A through hole 14 is punched from above by a punching machine 13 and is conveyed downstream (see FIG. 4 for this point). At this time, the through hole 1 to be drilled
The diameter of 4 is preferably 0.1 to 0.5 mm. this is,
This is because if it is less than 0.1 mm, the needle of the punching machine 13 is easily broken, and if it exceeds 0.5 mm, it is too large from the viewpoint of wiring density.

【0019】次いで、絶縁フィルム1を表裏逆にしてロ
ール状に巻回し、これを再度上流の回転駆動軸にセット
し、この絶縁フィルム1の上流には、ロール状のろ紙1
5をセットする。こうして絶縁フィルム1とろ紙15と
をセットしたら、これら絶縁フィルム1とろ紙15とを
上流から複数のローラ2を介して下流方向にそれぞれ搬
送し、絶縁フィルム1の下方の表面にろ紙15を重ね合
わせるとともに、絶縁フィルム1とろ紙15とを帯電装
置3の誘導帯電に基づく静電気により帯電密着させて積
層一体化し、下流のテーブル7上に搬送する。
Then, the insulating film 1 is turned upside down and wound into a roll, and the roll is set again on the upstream rotary drive shaft. On the upstream side of the insulating film 1, the roll-shaped filter paper 1 is placed.
Set 5. After the insulating film 1 and the filter paper 15 are set in this manner, the insulating film 1 and the filter paper 15 are conveyed in the downstream direction from the upstream through the plurality of rollers 2, and the filter paper 15 is superposed on the lower surface of the insulating film 1. At the same time, the insulating film 1 and the filter paper 15 are electrostatically brought into close contact with each other by static electricity based on the induction charging of the charging device 3 to be laminated and integrated, and are conveyed onto the downstream table 7.

【0020】一体化した絶縁フィルム1とろ紙15とを
テーブル7上に搬送したら、テーブル7上に真空吸着し
て絶縁フィルム1の上面である裏面に第二の導電パター
ン16を流動性の導電ペースト17によりスクリーン印
刷装置10でスクリーン印刷し、第一、第二の導電パタ
ーン8・16を貫通したスルーホール14とこれに流入
する導電ペースト17で電気的に導通する。この際に使
用する導電ペースト17は、導通の安定性の観点から第
一の導電パターン8用の導電ペースト9と同様の組成と
するのが好ましいが、異なるものでも良い。そして、一
体化した絶縁フィルム1とろ紙15とを複数のローラ1
1を介して下流に搬送し、ろ紙15を巻き取りロール1
8に巻き取って絶縁フィルム1から剥離した後、絶縁フ
ィルム1の第二の導電パターン16を下流の乾燥機12
で乾燥させれば、連続した可撓性の絶縁フィルム1の表
裏面に導電パターンを形成することができる。
After the integrated insulating film 1 and filter paper 15 are conveyed onto the table 7, the second conductive pattern 16 is formed on the back surface which is the upper surface of the insulating film 1 by vacuum suction on the table 7 and a fluid conductive paste. Screen printing is performed by the screen printing device 10 by means of 17, and the through holes 14 penetrating the first and second conductive patterns 8 and 16 and the conductive paste 17 flowing into the through holes 14 are electrically connected. The conductive paste 17 used at this time preferably has the same composition as the conductive paste 9 for the first conductive pattern 8 from the viewpoint of stability of conduction, but may be different. Then, the integrated insulating film 1 and filter paper 15 are combined into a plurality of rollers 1.
1 through which the filter paper 15 is conveyed to the downstream and the roll 1 is wound up.
After being wound around 8 and peeled off from the insulating film 1, the second conductive pattern 16 of the insulating film 1 is placed on the downstream dryer 12.
When dried, the conductive pattern can be formed on the front and back surfaces of the continuous flexible insulating film 1.

【0021】上記構成によれば、絶縁フィルム1にろ紙
15を単に重ね合わせるだけでなく、これらを静電気を
応用して密着させ、密着度を著しく向上させるので、ス
クリーン印刷後の搬送時に絶縁フィルム1とろ紙15と
が摩擦抵抗値の相違から位置ズレを起こすのをきわめて
有効に抑制防止することができる。したがって、ろ紙1
5に付着した導電ペースト17が絶縁フィルム1の表面
等を汚染し、これにより外観不良やリーク不良が発生す
るのを抑制防止することができる。
According to the above structure, not only the filter paper 15 is simply superposed on the insulating film 1, but also the filter paper 15 is brought into close contact with each other by applying static electricity to remarkably improve the degree of adhesion. It is possible to very effectively suppress and prevent the displacement of the filter paper 15 due to the difference in frictional resistance value. Therefore, filter paper 1
It is possible to prevent the conductive paste 17 adhering to 5 from contaminating the surface or the like of the insulating film 1 and thereby preventing appearance defects and leak defects from occurring.

【0022】[0022]

【実施例】以下、本発明に係る導電パターンの形成方法
の実施例を説明する。先ず、ロール状の絶縁フィルムを
複数のローラを介してテーブル上に搬送し、このテーブ
ル上に絶縁フィルムを真空吸着してその上面である表面
に複数の第一の導電パターンを流動性の導電ペーストに
よりスクリーン印刷し、絶縁フィルムをテーブルから複
数のローラを介して下流の乾燥機に搬送して各第一の導
電パターンを乾燥させた。絶縁フィルムとしては、幅5
00mm、厚さ25μm、長さ200mのPETを使用
した。また、導電ペーストとしては、市販のDW‐25
0H‐5[東陽紡績株式会社製 商品名]を使用した。テ
ーブルの各吸着孔はφ0.5mmとした。
EXAMPLES Examples of the conductive pattern forming method according to the present invention will be described below. First, a roll-shaped insulating film is conveyed onto a table through a plurality of rollers, the insulating film is vacuum-adsorbed on the table, and a plurality of first conductive patterns are formed on the upper surface, which is a fluid conductive paste. Screen printing was carried out, and the insulating film was conveyed from the table through a plurality of rollers to a downstream dryer to dry each first conductive pattern. As an insulating film, width 5
PET of 00 mm, thickness of 25 μm, and length of 200 m was used. Further, as the conductive paste, commercially available DW-25
0H-5 [trade name of Toyo Boseki Co., Ltd.] was used. Each suction hole of the table had a diameter of 0.5 mm.

【0023】次いで、ロール状の絶縁フィルムを上流か
ら複数のローラを介してテーブル上に再度搬送し、この
テーブル上に絶縁フィルムを真空吸着してその表面の各
第一の導電パターンにφ0.2mmのスルーホールを穿
孔機で上方から穿孔し、下流に搬送した。
Then, the roll-shaped insulating film is conveyed again from upstream to the table through a plurality of rollers, the insulating film is vacuum-adsorbed on the table, and each first conductive pattern on the surface has a diameter of 0.2 mm. The through-hole was punched from above with a punch and conveyed downstream.

【0024】次いで、絶縁フィルムを表裏逆にしてロー
ル状に巻回し、これを再度上流の回転駆動軸にセット
し、この絶縁フィルムの上流にロール状のろ紙をセット
した。ろ紙としては、保留粒子径2μm、幅400m
m、厚さ0.5mm、長さ200mのものを使用した。
絶縁フィルムとろ紙とをセットしたら、これら絶縁フィ
ルムとろ紙とを上流から複数のローラを介してテーブル
方向にそれぞれ搬送し、絶縁フィルムの下方の表面にろ
紙を重ね合わせるとともに、絶縁フィルムとろ紙とを帯
電装置の静電気により帯電密着させて一体化し、下流の
テーブル上に搬送した。帯電装置の帯電電極には、4k
Vの直流高電圧を印加した。
Next, the insulating film was turned upside down and wound into a roll, which was set again on the upstream rotary drive shaft, and a roll-shaped filter paper was set upstream of this insulating film. As filter paper, retention particle diameter 2μm, width 400m
m, thickness 0.5 mm, and length 200 m were used.
After setting the insulating film and the filter paper, the insulating film and the filter paper are respectively conveyed from the upstream to the table direction through a plurality of rollers, the filter paper is superposed on the lower surface of the insulating film, and the insulating film and the filter paper are put together. The electrostatic charge of the charging device was used to bring them into close contact with each other by charging, and they were conveyed to a downstream table. 4k for the charging electrode of the charging device
A DC high voltage of V was applied.

【0025】一体化した絶縁フィルムとろ紙とをテーブ
ル上に搬送したら、テーブル上に真空吸着して絶縁フィ
ルムの上面である裏面に第二の導電パターンを流動性の
導電ペーストによりスクリーン印刷し、第一、第二の導
電パターンを貫通したスルーホールと導電ペーストで電
気的に導通した。この際に使用する導電ペーストは、第
一の導電パターン用の導電ペーストと同様とした。そし
て、一体化した絶縁フィルムとろ紙とを複数のローラを
介して下流に搬送し、ろ紙を巻き取りロールに巻き取っ
て絶縁フィルムから分離し、その後、第二の導電パター
ンを下流の乾燥機で乾燥させた。
After the integrated insulating film and filter paper are conveyed onto the table, they are vacuum-sucked on the table and a second conductive pattern is screen-printed on the back surface which is the upper surface of the insulating film with a fluid conductive paste. The through holes penetrating the first and second conductive patterns were electrically connected with the conductive paste. The conductive paste used at this time was the same as the conductive paste for the first conductive pattern. Then, the integrated insulating film and the filter paper are conveyed downstream via a plurality of rollers, the filter paper is wound on a winding roll and separated from the insulating film, and then the second conductive pattern is dried by a downstream dryer. Dried.

【0026】本実施例によれば、ろ紙に付着した導電ペ
ーストがスルーホールを介して絶縁フィルム等を汚染
し、これにより外観不良やリーク不良が発生するという
問題(従来は10〜30%生じた)をゼロにすることがで
き、製品率の向上に寄与することができるのを確認し
た。
According to the present embodiment, the conductive paste adhered to the filter paper contaminates the insulating film and the like through the through holes, which causes the appearance defect and the leakage defect (the conventional problem is 10 to 30%). ) Can be reduced to zero and it can contribute to the improvement of the product rate.

【0027】[0027]

【発明の効果】以上のように本発明によれば、第二の導
電パターンの印刷後の搬送時に絶縁フィルムとろ紙が位
置ズレを起こすのを抑制防止し、絶縁フィルム等に外観
不良やリーク不良等が生じるのを有効に防ぐことができ
るという効果がある。
As described above, according to the present invention, it is possible to prevent the positional deviation of the insulating film and the filter paper from occurring during the transportation after the printing of the second conductive pattern, and to prevent the insulating film and the like from having a poor appearance and a leak failure. It is possible to effectively prevent such problems.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る導電パターンの形成方法の実施形
態を示す全体説明図である。
FIG. 1 is an overall explanatory view showing an embodiment of a conductive pattern forming method according to the present invention.

【図2】本発明に係る導電パターンの形成方法の実施形
態を示す要部説明図である。
FIG. 2 is an explanatory view of a main part showing an embodiment of a conductive pattern forming method according to the present invention.

【図3】従来における導電パターンの形成方法を示す説
明図で、(a)図は絶縁フィルムの表面上に第一の導電パ
ターンを導電ペーストでスクリーン印刷してこれを乾燥
させる状態を示す全体図、(b)図は(a)図における第一
の導電パターンを示す説明図である。
FIG. 3 is an explanatory view showing a conventional method of forming a conductive pattern, and FIG. 3 (a) is an overall view showing a state in which a first conductive pattern is screen-printed with a conductive paste on the surface of an insulating film and then dried. , (B) are explanatory views showing the first conductive pattern in (a).

【図4】従来における導電パターンの形成方法を示す説
明図で、(a)図は第一の導電パターンにスルーホールを
上方から穿孔する状態を示す全体図、(b)図は穿孔され
たスルーホールを示す説明図である。
4A and 4B are explanatory views showing a conventional method for forming a conductive pattern, wherein FIG. 4A is an overall view showing a state where a through hole is punched from above in a first conductive pattern, and FIG. 4B is a punched through hole. It is explanatory drawing which shows a hole.

【図5】従来における導電パターンの形成方法を示す説
明図で、(a)図は一体化した絶縁フィルムとろ紙を搬送
して絶縁フィルムの裏面上に第二の導電パターンを導電
ペーストでスクリーン印刷し、第一、第二の導電パター
ンをスルーホールで導通し、絶縁フィルムとろ紙を分離
してろ紙を巻き取り、第二の導電パターンを乾燥機で乾
燥させる状態を示す全体図、(b)図は(a)図における第
二の導電パターンを示す説明図である。
FIG. 5 is an explanatory view showing a conventional method of forming a conductive pattern, in which (a) is a screen in which a second conductive pattern is printed on the back surface of the insulating film by carrying an integrated insulating film and filter paper with a conductive paste. Then, the first and second conductive patterns are conducted through the through holes, the insulating film and the filter paper are separated, the filter paper is wound up, and the second conductive pattern is dried by a dryer, (b). The figure is an explanatory view showing the second conductive pattern in FIG.

【符号の説明】[Explanation of symbols]

1 絶縁フィルム 3 帯電装置 4 高圧電源(電源) 5 帯電電極 6 SUSプレート(導電プレート) 7 テーブル 8 第一の導電パターン 9 導電ペースト 10 スクリーン印刷装置 12 乾燥機 14 スルーホール 15 ろ紙 16 第二の導電パターン 17 導電ペースト 1 insulating film 3 charging device 4 High-voltage power supply (power supply) 5 charging electrode 6 SUS plate (conductive plate) 7 table 8 First conductive pattern 9 Conductive paste 10 Screen printing device 12 dryer 14 through holes 15 filter paper 16 Second conductive pattern 17 Conductive paste

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 5E317 AA24 BB01 BB12 BB13 BB14 BB15 CC22 CC25 CD21 CD23 CD32 GG17 5E343 AA03 AA12 AA33 BB23 BB24 BB25 BB44 BB58 BB72 DD03 ER33 FF02 FF09 FF30 GG20   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 5E317 AA24 BB01 BB12 BB13 BB14                       BB15 CC22 CC25 CD21 CD23                       CD32 GG17                 5E343 AA03 AA12 AA33 BB23 BB24                       BB25 BB44 BB58 BB72 DD03                       ER33 FF02 FF09 FF30 GG20

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 可撓性の絶縁フィルムに導電パターンを
形成する方法であって、 上記絶縁フィルムの表面に第一の導電パターンを形成し
て乾燥させ、この第一の導電パターンにスルーホールを
開け、上記絶縁フィルムを表裏逆にしてその表面にろ紙
を重ねて静電密着させ、その後、該絶縁フィルムの裏面
に第二の導電パターンを形成して第一、第二の導電パタ
ーンを上記スルーホールで電気的に接続することを特徴
とする導電パターンの形成方法。
1. A method of forming a conductive pattern on a flexible insulating film, comprising forming a first conductive pattern on a surface of the insulating film and drying the conductive film, and forming a through hole in the first conductive pattern. Open, reverse the insulating film, and put a filter paper on the surface to electrostatically adhere it, then form a second conductive pattern on the back surface of the insulating film and pass the first and second conductive patterns through the above. A method for forming a conductive pattern, characterized by electrically connecting through a hole.
【請求項2】 密着した上記絶縁フィルムと上記ろ紙の
うち、絶縁フィルムに電源に接続された帯電電極を、ろ
紙に導電プレートをそれぞれ対向させ、これら帯電電極
と導電プレート間の距離を5〜15mmに形成した請求
項1記載の導電パターンの形成方法。
2. Of the closely adhered insulating film and the filter paper, a charging electrode connected to a power source is made to face the insulating film, and a conductive plate is made to face the filter paper, and the distance between the charging electrode and the conductive plate is 5 to 15 mm. The method for forming a conductive pattern according to claim 1, wherein the conductive pattern is formed.
JP2001319500A 2001-10-17 2001-10-17 Method for forming conductive pattern Expired - Fee Related JP3942398B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001319500A JP3942398B2 (en) 2001-10-17 2001-10-17 Method for forming conductive pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001319500A JP3942398B2 (en) 2001-10-17 2001-10-17 Method for forming conductive pattern

Publications (2)

Publication Number Publication Date
JP2003124607A true JP2003124607A (en) 2003-04-25
JP3942398B2 JP3942398B2 (en) 2007-07-11

Family

ID=19137041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001319500A Expired - Fee Related JP3942398B2 (en) 2001-10-17 2001-10-17 Method for forming conductive pattern

Country Status (1)

Country Link
JP (1) JP3942398B2 (en)

Also Published As

Publication number Publication date
JP3942398B2 (en) 2007-07-11

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