JP2003124428A - Surface-mounting type el driver - Google Patents
Surface-mounting type el driverInfo
- Publication number
- JP2003124428A JP2003124428A JP2001316105A JP2001316105A JP2003124428A JP 2003124428 A JP2003124428 A JP 2003124428A JP 2001316105 A JP2001316105 A JP 2001316105A JP 2001316105 A JP2001316105 A JP 2001316105A JP 2003124428 A JP2003124428 A JP 2003124428A
- Authority
- JP
- Japan
- Prior art keywords
- driver
- coil
- circuit board
- mounting
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は携帯電話、ＰＨＳ、
通信機、時計等の液晶表示装置のバックライトに用いる
ＥＬ（エレクトロルミネッセンス）素子を発光させるた
めの表面実装されたデバイス（ＳＭＤ）としての表面実
装型ＥＬドライバーに関するものである。TECHNICAL FIELD The present invention relates to a mobile phone, PHS,
The present invention relates to a surface-mounted EL driver as a surface-mounted device (SMD) for causing an EL (electroluminescence) element used as a backlight of a liquid crystal display device such as a communication device and a watch to emit light.
【０００２】[0002]
【従来の技術】従来から、携帯電話、ＰＨＳ、通信機、
時計等の液晶表示装置のバックライトに用いるＥＬ素子
を発光させるためにＥＬドライバーモジュールが普及し
てきている。従来の一般的な表面実装型ＥＬドライバー
の構造について説明する。図３は、表面実装型ＥＬドラ
イバーの断面図、図４は、ＥＬドライバーの平面図であ
る。2. Description of the Related Art Conventionally, mobile phones, PHS, communication devices,
EL driver modules have become widespread in order to emit light from EL elements used for backlights of liquid crystal display devices such as watches. The structure of a conventional general surface mount EL driver will be described. FIG. 3 is a cross-sectional view of the surface mount EL driver, and FIG. 4 is a plan view of the EL driver.
【０００３】図３、図４において、略矩形形状をした回
路基板１は、ガラスエポキシ樹脂あるいは紙フェノール
樹脂等よりなる基板で、回路基板１の上面にはプリント
形成された図示しない配線パターンと、外周に複数個
（例えば４個）のスルーホール２を有し、それぞれのス
ルーホール２の内面は金属メッキされて表面実装用の側
面電極端子（スルーホール電極）３が形成され、所定の
配線パターンと接続している。また、回路基板１の裏面
のスルーホール電極３の近傍に必要に応じて設けられた
図示しない裏面パターンとも接続している。In FIGS. 3 and 4, a circuit board 1 having a substantially rectangular shape is a board made of glass epoxy resin or paper phenolic resin, and a wiring pattern (not shown) printed on the upper surface of the circuit board 1. A plurality of (for example, four) through holes 2 are provided on the outer periphery, and the inner surface of each through hole 2 is metal-plated to form side surface electrode terminals (through hole electrodes) 3 for surface mounting, and a predetermined wiring pattern is formed. Connected with. In addition, it is also connected to a back surface pattern (not shown) provided as needed near the through hole electrode 3 on the back surface of the circuit board 1.
【０００４】前記回路基板１上に形成されたコイル収納
部にコイル４を収納し、回路基板１上に形成された配線
パターン上に、前記コイル４と平面的に重ならないよう
にして同一平面上に並べてＩＣチップ５及びチップコン
デンサ６を配置し、封止樹脂７によって封止されること
により、ＥＬドライバー８が構成される。The coil 4 is accommodated in the coil accommodating portion formed on the circuit board 1 so that it does not overlap the coil 4 on the wiring pattern formed on the circuit board 1 in the same plane. The EL driver 8 is configured by arranging the IC chip 5 and the chip capacitor 6 side by side with each other and sealing with the sealing resin 7.
【０００５】前記回路基板１に形成されたスルーホール
電極３の内面の金属メッキ部及び裏面パターンは、完成
したＥＬ駆動回路を他の実装基板（マザーボード基板）
９の配線パターンに半田１０等で電気的に接続・固定さ
れる。The metal plating portion and the back surface pattern on the inner surface of the through-hole electrode 3 formed on the circuit board 1 have the completed EL drive circuit mounted on another mounting board (mother board).
The wiring pattern 9 is electrically connected and fixed with solder 10 or the like.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、前述し
た表面実装型ＥＬドライバーには次のような問題点があ
る。即ち、前記コイル、ＩＣチップ及びチップコンデン
サ等の電子部品を回路基板上に平面的に分散実装するた
め、各部品間に所定のスペース及び隙間が必要となり、
小型化した表面実装型ＥＬドライバーができない。However, the above-mentioned surface mount type EL driver has the following problems. That is, since electronic components such as the coil, the IC chip, and the chip capacitor are two-dimensionally distributed and mounted on the circuit board, a predetermined space and gap are required between each component,
A miniaturized surface mount EL driver is not possible.
【０００７】また、大面積ＥＬシートを駆動するために
は、大体積のコイルを使用する必要があり、現在のＥＬ
ドライバーの構造では、コイル容積に比例して実装面積
が大きくなってしまうなどの問題がある。Further, in order to drive a large-area EL sheet, it is necessary to use a coil with a large volume.
The driver structure has a problem that the mounting area increases in proportion to the coil volume.
【０００８】本発明は上記従来の課題に鑑みなされたも
のであり、その目的は、回路基板の上下面に電子部品を
配置することにより、小面積で実装することが可能で、
顧客の要望に合わせたコイルを実装するすることで、Ｅ
Ｌシートの大面積から小面積までをＥＬドライバーの実
装面積の同じスペースで対応が可能な表面実装型ＥＬド
ライバーを提供するものである。The present invention has been made in view of the above-described conventional problems, and an object thereof is to arrange electronic components on the upper and lower surfaces of a circuit board so that they can be mounted in a small area.
By mounting the coil according to the customer's request,
The present invention provides a surface-mount EL driver capable of handling a large area to a small area of an L sheet in the same EL driver mounting area.
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するため
に、本発明における表面実装型ＥＬドライバーは、コイ
ル、ＩＣチップ、チップコンデンサ、トランジスター及
び抵抗等の電子部品で構成されたＥＬ発光基板用の昇圧
駆動回路が、外周にスルーホール電極を有する回路基板
に実装され、樹脂封止されたＥＬドライバーを、実装基
板上の配線パターンに半田付けした表面実装型ＥＬドラ
イバーにおいて、前記ＥＬドライバーを構成する電子部
品の内、回路基板の上面に前記コイルを除く電子部品例
えばＩＣチップ及びチップコンデンサを実装・樹脂封止
し、回路基板の下面に前記コイルを、前記コイルを除く
電子部品例えば前記ＩＣチップ及びチップコンデンサと
平面的に重なるように対向配置することにより、平面的
な実装面積を小さくしたことを特徴とするものである。In order to achieve the above object, a surface mount type EL driver according to the present invention is used for an EL light emitting substrate composed of electronic parts such as a coil, an IC chip, a chip capacitor, a transistor and a resistor. The step-up drive circuit is mounted on a circuit board having through-hole electrodes on the outer periphery, and a resin-sealed EL driver is soldered to a wiring pattern on the mounting board to form a surface mount type EL driver, which constitutes the EL driver. Among the electronic components, an electronic component excluding the coil, such as an IC chip and a chip capacitor, is mounted and resin-sealed on the upper surface of the circuit board, and the coil is mounted on the lower surface of the circuit substrate, and the electronic component except the coil, such as the IC chip Also, the planar mounting area can be reduced by arranging them so that they overlap the chip capacitors in a plane It is characterized in that the.
【００１０】また、前記実装基板にコイル収納部を形成
し、該コイル収納部に回路基板の下面に配置したコイル
を収納し、回路基板を実装基板上の配線パターンに半田
付けしたことを特徴するものである。Further, a coil housing portion is formed on the mounting board, the coil arranged on the lower surface of the circuit board is housed in the coil housing portion, and the circuit board is soldered to a wiring pattern on the mounting board. It is a thing.
【００１１】[0011]
【発明の実施の形態】以下、図面に基づいて本発明にお
ける表面実装型ＥＬドライバーについて説明する。図
１、図２は本発明の実施の形態である表面実装型ＥＬド
ライバーに係わり、図１は、表面実装型ＥＬドライバー
の断面図。図２は、図１のＥＬドライバーの平面図であ
る。図において、従来技術と同一部材は同一符号で示
す。DESCRIPTION OF THE PREFERRED EMBODIMENTS The surface mount EL driver according to the present invention will be described below with reference to the drawings. 1 and 2 relate to a surface-mounted EL driver according to an embodiment of the present invention, and FIG. 1 is a sectional view of the surface-mounted EL driver. FIG. 2 is a plan view of the EL driver of FIG. In the drawings, the same members as those in the conventional technique are designated by the same reference numerals.
【００１２】図１、図２において、従来技術では、回路
基板１の同一平面上に電子部品を実装していたものを、
本実施の形態では、前記ＥＬドライバー８を構成する電
子部品の内、回路基板１の上面にＩＣチップ５及びチッ
プコンデンサ６を実装・樹脂封止し、回路基板１の下面
にコイル４を前記ＩＣチップ５及びチップコンデンサ６
と平面的に重なるように対向配置するものである。一
方、前記実装基板９にコイル収納部９ａを形成し、該コ
イル収納部９ａに回路基板１の下面に配置したコイル４
を収納し、回路基板１のスルーホール電極３を実装基板
９上に形成された図示しない配線パターンに半田１０で
半田付けして電気的に接続・固定することにより表面実
装型ＥＬドライバーが構成される。In FIGS. 1 and 2, in the prior art, a circuit board 1 having electronic components mounted on the same plane is
In the present embodiment, among the electronic components forming the EL driver 8, the IC chip 5 and the chip capacitor 6 are mounted and resin-sealed on the upper surface of the circuit board 1, and the coil 4 is mounted on the lower surface of the circuit board 1 with the IC. Chip 5 and chip capacitor 6
Are arranged so as to overlap each other in a plane. On the other hand, a coil housing portion 9a is formed in the mounting board 9, and the coil 4 arranged on the lower surface of the circuit board 1 in the coil housing portion 9a.
The surface mount type EL driver is configured by housing the through-hole electrodes 3 of the circuit board 1 and soldering them to a wiring pattern (not shown) formed on the mounting board 9 with solder 10 to electrically connect and fix them. It
【００１３】以上の構成により、回路基板の上下面に電
子部品を配置することにより、平面的な実装面積を小さ
くすることができる。With the above-mentioned structure, the planar mounting area can be reduced by disposing the electronic components on the upper and lower surfaces of the circuit board.
【００１４】[0014]
【発明の効果】以上説明したように、本発明によれば、
従来のコイル実装に用いられた方法と同様にしてＥＬド
ライバーを実装することにより、小面積で実装すること
が可能となる。また、この方法では、基板にＩＣ、コン
デンサ、トランジスター及び抵抗を実装・樹脂封止した
ベースを作っておき、顧客の要望に合わせたコイルを実
装することで、大面積から小面積までを同じベースで対
応が可能となる。As described above, according to the present invention,
By mounting the EL driver in the same manner as the method used for the conventional coil mounting, it is possible to mount in a small area. Also, in this method, a base in which an IC, a capacitor, a transistor, and a resistor are mounted / resin-sealed on a substrate is prepared, and a coil is mounted according to a customer's request, so that the same base can be used from a large area to a small area. Will be possible.
【００１５】小型化が実現でき、軽薄短小を指向する電
子部品として満足でき、安価な表面実装型ＥＬドライバ
ーを提供することができる。It is possible to provide a low-cost surface-mount EL driver which can be miniaturized, which can be satisfied as an electronic component that aims to be light, thin, short, and small.
【図１】本発明の実施の形態に係わる表面実装型ＥＬド
ライバーの断面図である。FIG. 1 is a cross-sectional view of a surface mount EL driver according to an embodiment of the present invention.
【図２】図１のＥＬドライバーの平面図である。FIG. 2 is a plan view of the EL driver of FIG.
【図３】従来の表面実装型ＥＬドライバーの断面図であ
る。FIG. 3 is a cross-sectional view of a conventional surface mount EL driver.
【図４】図３のＥＬドライバーの平面図である。FIG. 4 is a plan view of the EL driver of FIG.
１ 回路基板 ３ スルーホール電極 ４ コイル ５ ＩＣチップ ６ チップコンデンサ ７ 封止樹脂 ８ ＥＬドライバー ９ 実装基板 ９ａ コイル収納部 １０ 半田 1 circuit board 3 Through-hole electrode 4 coils 5 IC chip 6 chip capacitors 7 Sealing resin 8 EL driver 9 Mounting board 9a coil storage 10 Solder
Claims (2)
サ、トランジスター及び抵抗等の電子部品で構成された
ＥＬ発光基板用の昇圧駆動回路が、外周にスルーホール
電極を有する回路基板に実装され、樹脂封止されたＥＬ
ドライバーを、実装基板上の配線パターンに半田付けし
た表面実装型ＥＬドライバーにおいて、前記ＥＬドライ
バーを構成する電子部品の内、回路基板の上面に前記コ
イルを除く電子部品を実装・樹脂封止し、回路基板の下
面に前記コイルを、前記コイルを除く電子部品と平面的
に重なるように対向配置することにより、平面的な実装
面積を小さくしたことを特徴とする表面実装型ＥＬドラ
イバー。1. A step-up drive circuit for an EL light emitting substrate, which is composed of electronic components such as a coil, an IC chip, a chip capacitor, a transistor and a resistor, is mounted on a circuit board having a through hole electrode on the outer periphery and is resin-sealed. EL
In a surface mount type EL driver in which a driver is soldered to a wiring pattern on a mounting board, among the electronic parts constituting the EL driver, electronic parts except the coil are mounted and resin-sealed on the upper surface of the circuit board, A surface mounting type EL driver, wherein a planar mounting area is reduced by arranging the coil on the lower surface of a circuit board so as to overlap the electronic components other than the coil in a planar manner.
コイル収納部に回路基板の下面に配置したコイルを収納
し、回路基板を実装基板上の配線パターンに半田付けし
たことを特徴する請求項１記載の表面実装型ＥＬドライ
バー。2. A coil housing portion is formed on the mounting board, the coil arranged on the lower surface of the circuit board is housed in the coil housing portion, and the circuit board is soldered to a wiring pattern on the mounting board. The surface mount type EL driver according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001316105A JP2003124428A (en) | 2001-10-12 | 2001-10-12 | Surface-mounting type el driver |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001316105A JP2003124428A (en) | 2001-10-12 | 2001-10-12 | Surface-mounting type el driver |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003124428A true JP2003124428A (en) | 2003-04-25 |
Family
ID=19134167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001316105A Pending JP2003124428A (en) | 2001-10-12 | 2001-10-12 | Surface-mounting type el driver |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003124428A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006184879A (en) * | 2004-12-02 | 2006-07-13 | Semiconductor Energy Lab Co Ltd | Display device |
| JP2006245435A (en) * | 2005-03-04 | 2006-09-14 | Ricoh Co Ltd | Assembly component, mother board therefor, module substrate therefor, module substrate manufacturing method therefor, electronic circuit device and electronic equipment |
| KR101090016B1 (en) | 2008-02-26 | 2011-12-05 | 후지쯔 가부시끼가이샤 | Electronic device |
| US8243220B2 (en) | 2004-12-02 | 2012-08-14 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| WO2015087463A1 (en) * | 2013-12-10 | 2015-06-18 | パナソニック株式会社 | Organic el display device |
| JP2016510513A (en) * | 2013-01-30 | 2016-04-07 | 日本テキサス・インスツルメンツ株式会社 | Circuit assembly |
-
2001
- 2001-10-12 JP JP2001316105A patent/JP2003124428A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006184879A (en) * | 2004-12-02 | 2006-07-13 | Semiconductor Energy Lab Co Ltd | Display device |
| US8243220B2 (en) | 2004-12-02 | 2012-08-14 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| US9166190B2 (en) | 2004-12-02 | 2015-10-20 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| JP2006245435A (en) * | 2005-03-04 | 2006-09-14 | Ricoh Co Ltd | Assembly component, mother board therefor, module substrate therefor, module substrate manufacturing method therefor, electronic circuit device and electronic equipment |
| JP4545615B2 (en) * | 2005-03-04 | 2010-09-15 | 株式会社リコー | Assembly parts, module substrate, module substrate manufacturing method, electronic circuit device, and electronic apparatus |
| KR101090016B1 (en) | 2008-02-26 | 2011-12-05 | 후지쯔 가부시끼가이샤 | Electronic device |
| JP2016510513A (en) * | 2013-01-30 | 2016-04-07 | 日本テキサス・インスツルメンツ株式会社 | Circuit assembly |
| WO2015087463A1 (en) * | 2013-12-10 | 2015-06-18 | パナソニック株式会社 | Organic el display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8053953B2 (en) | Electronic component for surface mounting | |
| JP4995527B2 (en) | Piezoelectric oscillator for surface mounting | |
| US7123108B2 (en) | Surface mount crystal oscillator | |
| JP2003124428A (en) | Surface-mounting type el driver | |
| JP2005244639A (en) | Temperature compensated crystal oscillator | |
| JP2007124591A (en) | Communication module | |
| JP2000114877A (en) | Piezoelectric oscillator | |
| JP2009105776A (en) | Crystal device for surface mounting | |
| JP2003124600A (en) | Surface mount el driver | |
| JP2003124599A (en) | Surface mount el driver | |
| JP3700889B2 (en) | EL SMD driver module and manufacturing method thereof | |
| JP4089964B2 (en) | Piezoelectric oscillator | |
| JP4046246B2 (en) | Circuit with coil magnetic path on circuit board | |
| JP2005253007A (en) | Temperature compensated crystal oscillator | |
| JP2004147221A (en) | Piezoelectric oscillator | |
| JP2007235388A (en) | Crystal oscillator | |
| JPH0458189B2 (en) | ||
| JP2004135091A (en) | Surface mounted piezoelectric oscillator and manufacturing method therefor | |
| JP3145472B2 (en) | Surface mount type piezoelectric oscillator | |
| JP2005244641A (en) | Temperature compensated crystal oscillator | |
| JP2006060715A (en) | Method of manufacturing temperature-compensated crystal-controlled oscillator | |
| JP2000252748A (en) | Surface mounted type piezoelectric oscillator | |
| JP2005244671A (en) | Temperature compensated crystal oscillator | |
| JP2005217782A (en) | Piezoelectric oscillator | |
| JP5196976B2 (en) | Piezoelectric devices for surface mounting |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040712 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060725 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060809 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061003 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20061102 |