JP2003124164A - Polishing tool - Google Patents
Polishing toolInfo
- Publication number
- JP2003124164A JP2003124164A JP2001311450A JP2001311450A JP2003124164A JP 2003124164 A JP2003124164 A JP 2003124164A JP 2001311450 A JP2001311450 A JP 2001311450A JP 2001311450 A JP2001311450 A JP 2001311450A JP 2003124164 A JP2003124164 A JP 2003124164A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- felt
- polishing tool
- tool according
- fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 119
- 239000000835 fiber Substances 0.000 claims abstract description 68
- 210000004209 hair Anatomy 0.000 claims abstract description 33
- 241001465754 Metazoa Species 0.000 claims abstract description 9
- 229920002994 synthetic fiber Polymers 0.000 claims abstract description 6
- 239000012209 synthetic fiber Substances 0.000 claims abstract description 6
- 239000006061 abrasive grain Substances 0.000 claims description 28
- 210000002268 wool Anatomy 0.000 claims description 26
- 241000283707 Capra Species 0.000 claims description 17
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- -1 steatite Chemical compound 0.000 claims description 5
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 229910052580 B4C Inorganic materials 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 claims description 3
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 3
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 3
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052839 forsterite Inorganic materials 0.000 claims description 3
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052863 mullite Inorganic materials 0.000 claims description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229910001887 tin oxide Inorganic materials 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 21
- 239000002440 industrial waste Substances 0.000 abstract description 5
- 239000000126 substance Substances 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 238000000227 grinding Methods 0.000 description 6
- 241000282326 Felis catus Species 0.000 description 3
- 241000282330 Procyon lotor Species 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 244000025254 Cannabis sativa Species 0.000 description 2
- 235000012766 Cannabis sativa ssp. sativa var. sativa Nutrition 0.000 description 2
- 235000012765 Cannabis sativa ssp. sativa var. spontanea Nutrition 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- 235000009120 camo Nutrition 0.000 description 2
- 235000005607 chanvre indien Nutrition 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011487 hemp Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002557 mineral fiber Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052895 riebeckite Inorganic materials 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 229920002972 Acrylic fiber Polymers 0.000 description 1
- 241001050985 Disco Species 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、研磨工具、殊に加
工歪を有する半導体ウエーハの裏面を研磨するのに適し
た研磨工具に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing tool, and more particularly to a polishing tool suitable for polishing the back surface of a semiconductor wafer having a processing strain.
【０００２】[0002]
【従来の技術】半導体チップの製造工程においては、半
導体ウエーハの表面に格子状に配列されたストリートに
よって多数の矩形領域を区画し、矩形領域の各々に半導
体回路を配設する。そして、ストリートの各々に沿って
半導体ウエーハを分離することによって矩形領域の各々
を半導体チップにせしめている。半導体チップの小型化
及び軽量化のために、矩形領域を個々に分離するに先立
って半導体ウエーハの裏面を研削し、これによって半導
体ウエーハの厚さを減少せしめることが望まれることも
少なくない。半導体ウエーハの裏面の研削は、通常、ダ
イヤモンド砥粒をレジンボンドの如き適宜のボンドで固
着して形成した研削手段を、高速回転せしめながら半導
体ウエーハの裏面に押圧せしめることによって遂行され
ている。かような研削様式によって半導体ウエーハの裏
面を研削すると、半導体ウエーハの裏面に所謂加工歪が
生成され、これによって抗折強度が相当低減される。半
導体ウエーハの裏面に生成される加工歪を除去し、かく
して抗折強度の低減を回避するために、研削された半導
体ウエーハの裏面を遊離砥粒を使用してポリッシングす
ること、及び研削された半導体ウエーハの裏面を硝酸及
び弗化水素酸を含むエンチング液を使用して化学的エッ
チングすることが提案されている。更に、特開平２００
０−３４３４４０号公報には、適宜の布に砥粒を分散せ
しめて構成された研磨手段を使用して、半導体ウエーハ
の裏面を研磨することが開示されている。2. Description of the Related Art In the process of manufacturing a semiconductor chip, a large number of rectangular regions are divided by streets arranged in a lattice on the surface of a semiconductor wafer, and a semiconductor circuit is arranged in each of the rectangular regions. Then, by separating the semiconductor wafer along each of the streets, each of the rectangular regions is made to be a semiconductor chip. In order to reduce the size and weight of the semiconductor chip, it is often desired to grind the back surface of the semiconductor wafer before the rectangular regions are individually separated, thereby reducing the thickness of the semiconductor wafer. Grinding of the back surface of a semiconductor wafer is usually performed by pressing a grinding means formed by fixing diamond abrasive grains with an appropriate bond such as a resin bond against the back surface of the semiconductor wafer while rotating at high speed. When the back surface of the semiconductor wafer is ground by such a grinding method, so-called processing strain is generated on the back surface of the semiconductor wafer, and thereby the bending strength is considerably reduced. Polishing the backside of the ground semiconductor wafer using loose abrasive grains to remove processing strains generated on the backside of the semiconductor wafer and thus avoid a reduction in die strength, and the ground semiconductor It has been proposed to chemically etch the backside of the wafer using an etching solution containing nitric acid and hydrofluoric acid. Furthermore, JP-A-200
Japanese Unexamined Patent Publication No. 0-343440 discloses polishing a back surface of a semiconductor wafer by using a polishing means configured by dispersing abrasive grains in an appropriate cloth.
【０００３】[0003]
【発明は解決しようとする課題】而して、遊離砥粒を使
用するポリッシングには、遊離砥粒の供給及び回収等に
煩雑な操作が必要である、大量に使用される遊離砥粒を
産業廃棄物として処理しなければならない、という問題
が存在する。エッチング液を使用する化学的エッチング
にも、大量に使用されるエッチング液を産業廃棄物とし
て処理しなければならない、という問題が存在する。一
方、布に砥粒を分散せしめて構成された研磨手段による
研磨においては、産業廃棄物として処理すべき物質が大
量に生成されることがない。しかしながら、未だ充分に
満足し得る研磨効率及び研磨品質を達成することができ
なかった。Therefore, polishing using free abrasive grains requires complicated operations such as supply and recovery of the free abrasive grains. There is a problem that it must be treated as waste. Chemical etching using an etching solution also has a problem in that a large amount of etching solution must be treated as industrial waste. On the other hand, in the polishing by the polishing means configured by dispersing abrasive grains in the cloth, a large amount of substances to be treated as industrial waste is not generated. However, it has not been possible to achieve sufficiently satisfactory polishing efficiency and polishing quality.
【０００４】本発明は上記事実に鑑みてなされたもので
あり、その主たる技術的課題は、産業廃棄物として処理
すべき物質を大量に生成せしめることなく、半導体ウエ
ーハの裏面を高研磨効率及び高研磨品質で研磨して、そ
こに存在していた加工歪を除去することができる、新規
且つ改良された研磨工具を提供することである。The present invention has been made in view of the above facts, and its main technical problem is to achieve high polishing efficiency and high polishing of the back surface of a semiconductor wafer without producing a large amount of a substance to be treated as industrial waste. It is an object of the present invention to provide a new and improved polishing tool capable of polishing with polishing quality and removing the processing strain existing therein.
【０００５】[0005]
【課題を解決するための手段】本発明者等は、先に、平
成１３年３月２８日付け特願２００１−９３３９７の明
細書及び図面において、上記主たる目的を達成すること
ができる研磨工具として、特定のフェルト中に砥粒を分
散せしめて形成した研磨手段を具備する研磨工具を提案
した。然るに、本発明者等は、更に鋭意検討を重ねた結
果、研磨工具における研磨手段を、種々の獣毛を含む天
然繊維及び合成繊維から選択された少なくとも２種の繊
維から形成された塊状体とかかる塊状体中に分散せしめ
られた砥粒とから構成すれば、その理由は必ずしも明確
ではないが、研磨手段が単一繊維から構成されたフェル
トの如き塊状体とかかる塊状体に分散せしめられた砥粒
とから構成された研磨工具と比べて、研磨手段及び又は
被加工物からの放熱効率が一層効果的に実現され、研磨
品質及び研磨効率が向上されることを見出した。The inventors of the present invention have previously proposed, as a polishing tool capable of achieving the above main object, in the specification and drawings of Japanese Patent Application No. 2001-93397 dated March 28, 2001. , A polishing tool provided with a polishing means formed by dispersing abrasive grains in a specific felt. However, as a result of further intensive studies by the present inventors, the polishing means in the polishing tool was a lump formed from at least two kinds of fibers selected from natural fibers and synthetic fibers containing various animal hairs. If it is composed of the abrasive grains dispersed in such a lump, the reason is not always clear, but the polishing means is dispersed in such a lump and a lump like a felt composed of a single fiber. It has been found that the heat radiation efficiency from the polishing means and / or the workpiece is more effectively realized, and the polishing quality and the polishing efficiency are improved, as compared with the polishing tool composed of abrasive grains.
【０００６】即ち、本発明によれば、上記主たる技術的
課題を達成する研磨工具として、支持部材及び該支持部
材に固定さた研磨手段を具備し、該研磨手段は種々の獣
毛を含む天然繊維及び合成繊維から選択された少なくと
も２種の繊維から形成された塊状体と該塊状体中に分散
せしめられた砥粒とから構成されている、ことを特徴と
する研磨工具が提供される。That is, according to the present invention, as a polishing tool for achieving the above-mentioned main technical problems, a supporting member and a polishing means fixed to the supporting member are provided, and the polishing means is a natural tool containing various animal hairs. There is provided a polishing tool comprising an agglomerate formed of at least two kinds of fibers selected from fibers and synthetic fibers, and abrasive grains dispersed in the agglomerate.
【０００７】本明細書において使用する語句「天然繊
維」は、羊毛及び山羊毛のみならず豚毛、馬毛、牛毛、
犬毛、猫毛、狸毛及び狐毛等を含む動物系天然繊維、綿
及び麻等の植物系繊維並びに石綿等の鉱物系繊維を含
む。また、本明細書において使用する語句「塊状体」は
繊維を圧縮して塊状にせしめることによって形成され
る、フェルト及び繊維束の如き物体を意味する。As used herein, the phrase "natural fiber" means not only wool and goat hair, but also pig hair, horse hair, cow hair,
Includes animal natural fibers including dog hair, cat hair, raccoon hair and fox hair, plant fibers such as cotton and hemp, and mineral fibers such as asbestos. Also, as used herein, the phrase "mass" refers to objects such as felts and fiber bundles formed by compressing fibers into a mass.
【０００８】好適実施形態においては、該塊状体は第一
の繊維から形成された第一のフェルトと第二の繊維から
形成された第二のフェルトとから構成されている。第一
の繊維は羊毛又は山羊毛であり、該第二の繊維は山羊毛
又は羊毛でよい。該塊状体は該第一のフェルトに複数個
の空所を形成し、該複数個の空所の各々に該第二のフェ
ルトを嵌入して構成されており、該研磨手段の研磨面に
おいては該第一のフェルト中に該第二のフェルトが分散
配列されているのが好適である。他の好適実施形態にお
いては、該塊状体は第一の繊維から形成されたフェルト
と第二の繊維から形成された繊維束とから構成されてい
る。該第一の繊維は羊毛又は山羊毛であり、該第二の繊
維は羊毛及び山羊毛以外の獣毛でよい。該塊状体は該フ
ェルトに複数個の空所を形成し、該複数個の空所の各々
に該繊維束を嵌入して構成されており、該研磨手段の研
磨面においては該フェルト中に該繊維束が分散配列され
ているのが好適である。更に他の好適実施形態において
は、該塊状体は少なくとも２種の繊維を混合して形成さ
れたフェルトから構成されている。該塊状体は羊毛と山
羊毛とを混合して形成されたフェルトから構成すること
ができる。いずれの実施形態においても、塊状体は密度
が０．２０ｇ／ｃｍ３以上、殊に０．４０ｇ／ｃｍ３以
上、で硬度が３０以上、殊に５０以上、であるのが好適
である。好ましくは、該研磨手段は０．０５乃至１．０
０ｇ／ｃｍ３、殊に０．２０乃至０．７０ｇ／ｃｍ３の
砥粒を含有している。該砥粒は０．０１乃至１００μm
の粒径を有するのが好適である。該砥粒はシリカ、アル
ミナ、ホルステライト、ステアタイト、ムライト、立方
晶窒化硼素、ダイヤモンド、窒化珪素、炭化珪素、炭化
硼素、炭酸バリウム、炭酸カルシウム、酸化鉄、酸化マ
グネシウム、酸化ジルコニア、酸化セリウム、酸化クロ
ム、酸化錫、酸化チタンのうちの１種又は２種以上を含
むことができる。該支持部材は円形支持面を有し、該研
磨手段は該円形支持面に接合された円板形状であるのが
好都合である。In a preferred embodiment, the mass comprises a first felt formed from a first fiber and a second felt formed from a second fiber. The first fiber may be wool or goat and the second fiber may be goat or wool. The agglomerate is formed by forming a plurality of voids in the first felt, and inserting the second felt into each of the plurality of voids. In the polishing surface of the polishing means, It is preferable that the second felt is dispersedly arranged in the first felt. In another preferred embodiment, the mass comprises a felt formed from a first fiber and a fiber bundle formed from a second fiber. The first fiber may be wool or goat hair and the second fiber may be animal hair other than wool and goat hair. The agglomerate is formed by forming a plurality of voids in the felt, and inserting the fiber bundle into each of the plurality of voids. It is preferable that the fiber bundles are dispersed and arranged. In yet another preferred embodiment, the mass comprises a felt formed by mixing at least two fibers. The lumps can be composed of felt formed by mixing wool and goat. In any of the embodiments, it is preferred that the agglomerates have a density of 0.20 g / cm 3 or more, especially 0.40 g / cm 3 or more, and a hardness of 30 or more, especially 50 or more. Preferably, the polishing means is 0.05 to 1.0.
It contains 0 g / cm 3 , in particular 0.20 to 0.70 g / cm 3 of abrasive grains. The abrasive grain is 0.01 to 100 μm
It is preferred to have a particle size of The abrasive grains are silica, alumina, forsterite, steatite, mullite, cubic boron nitride, diamond, silicon nitride, silicon carbide, boron carbide, barium carbonate, calcium carbonate, iron oxide, magnesium oxide, zirconia oxide, cerium oxide, One or more of chromium oxide, tin oxide and titanium oxide may be contained. Conveniently, the support member has a circular support surface and the polishing means is disc-shaped joined to the circular support surface.
【０００９】[0009]
【発明の実施の形態】以下、本発明に従って構成された
研磨工具の好適実施形態を図示している添付図面を参照
して、更に詳述する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of a polishing tool constructed according to the present invention will be described in more detail below with reference to the accompanying drawings.
【００１０】図１及び図２は、本発明に従って構成され
た研磨工具の好適実施形態を図示している。全体を番号
２で示す研磨工具は、支持部材４と研磨手段６とを具備
している。支持部材４はアルミニウムの如き適宜の金属
から形成されているのが好都合であり、円板形状であっ
て平坦な円形支持面即ち下面を有する。図１に図示する
如く、支持部材４にはその上面から下方に延びる盲ねじ
孔８が周方向に間隔をおいて複数個（図示の場合は４
個）形成されている。研磨手段６も円板形状であり、支
持部材４の外径と研磨手段６の外径は実質上同一であ
る。研磨手段６はエポキシ樹脂系接着剤の如き適宜の接
着剤によって支持部材４の下面、即ち平坦な円形支持面
に接合されている。かような研磨工具２は、例えば上記
特願２０００−９３３９７の図９及び図１０に図示する
形態の研削・研磨機における研磨装置に好適に使用され
る。更に詳しくは、研磨装置の回転軸の下端に装着さ
れ、半導体ウエーハの研削された裏面に作用せしめら
れ、かかる裏面を研磨して研削に起因して生成された加
工歪を除去するのに好適に使用される。回転軸の下端に
研磨工具２を装着する際には、回転軸に装備された装着
部材を挿通せしめられる締結ねじが研磨工具２の支持部
材４に形成されている上記盲ねじ孔８に螺合せしめられ
る。研削・研磨機自体の構成についての説明は、上記特
願２０００−９３３９７の明細書及び図面に委ね、本明
細書及び図面においては省略する。1 and 2 illustrate a preferred embodiment of an abrasive tool constructed in accordance with the present invention. The polishing tool, generally designated by the numeral 2, comprises a support member 4 and a polishing means 6. The support member 4 is conveniently formed from a suitable metal such as aluminum and is disc-shaped and has a flat circular support surface or bottom surface. As shown in FIG. 1, the support member 4 is provided with a plurality of blind screw holes 8 extending downward from the upper surface of the support member 4 at intervals in the circumferential direction.
Are formed). The polishing means 6 also has a disk shape, and the outer diameter of the support member 4 and the outer diameter of the polishing means 6 are substantially the same. The polishing means 6 is bonded to the lower surface of the support member 4, that is, a flat circular support surface, by an appropriate adhesive such as an epoxy resin adhesive. Such a polishing tool 2 is preferably used, for example, in a polishing apparatus in a grinding / polishing machine having a configuration shown in FIGS. 9 and 10 of Japanese Patent Application No. 2000-93397. More specifically, it is attached to the lower end of the rotary shaft of the polishing apparatus and is made to act on the ground back surface of the semiconductor wafer, and is suitable for polishing the back surface to remove processing strain generated due to grinding. used. When the polishing tool 2 is mounted on the lower end of the rotary shaft, a fastening screw through which the mounting member mounted on the rotary shaft is inserted is screwed into the blind screw hole 8 formed in the support member 4 of the polishing tool 2. Be punished. The description of the configuration of the grinding / polishing machine itself is left to the specification and drawings of Japanese Patent Application No. 2000-93397, and is omitted in the specification and drawings.
【００１１】研磨手段６は天然繊維及び合成繊維から選
択された少なくとも２種の繊維から構成された塊状体と
かかる塊状体内に分散せしめられた砥粒とから構成れて
いることが重要である。天然繊維としては、羊毛、山羊
毛、豚毛、馬毛、牛毛、犬毛、猫毛、狸毛及び狐毛等の
動物系繊維と共に、綿及び麻等の植物系繊維並びに石綿
の如き鉱物系繊維を挙げることができる。合成繊維とし
ては、ナイロン繊維、ポリエチレン繊維、ポリプロピレ
ン繊維、ポリエステル繊維、アクリル繊維、レーヨン繊
維、ケプラー繊維及びガラス繊維等を挙げることができ
る。繊維を圧縮して塊状にせしめることによって形成さ
れる塊状体はフェルト或いは繊維束でよく、０．２０ｇ
／ｃｍ３、特に０．４０ｇ／ｃｍ３以上の密度を有し、
そしてまた３０以上、特に５０以上の硬度を有するのが
好適である。本明細書のおいて使用する硬度は、ＪＩＳ
規格Ｋ６２５３の５（デュロメータ硬さ試験）に従って
測定される硬さを意味する。密度及び硬度が過小になる
と、研磨効率及び研磨品質が低下する傾向がある。It is important that the polishing means 6 is composed of an agglomerate composed of at least two kinds of fibers selected from natural fibers and synthetic fibers, and abrasive grains dispersed in the agglomerate. Natural fibers include animal fibers such as wool, goat hair, pig hair, horse hair, cow hair, dog hair, cat hair, raccoon hair and fox hair, as well as plant fibers such as cotton and hemp, and mineral fibers such as asbestos. Fibers may be mentioned. Examples of the synthetic fiber include nylon fiber, polyethylene fiber, polypropylene fiber, polyester fiber, acrylic fiber, rayon fiber, Kepler fiber, glass fiber and the like. The lumps formed by compressing the fibers into lumps may be felts or fiber bundles, 0.20 g
/ Cm 3 , especially having a density of 0.40 g / cm 3 or more,
It is also preferable that the hardness is 30 or more, particularly 50 or more. The hardness used in this specification is JIS
It means the hardness measured according to standard K6253 5 (durometer hardness test). If the density and hardness are too small, the polishing efficiency and the polishing quality tend to deteriorate.
【００１２】塊状体中に分散せしめられる砥粒量は、
０．０５乃至１．００ｇ／ｃｍ３、特に０．２０乃至
０．７０ｇ／ｃｍ３、であるのが好適である。塊状体中
に分散せしめられる砥粒自体は、０．０１乃至１００μ
m の粒径を有するものであるのが好適である。砥粒は、
シリカ、アルミナ、ホルステライト、ステアタイト、ム
ライト、立方晶窒化硼素、ダイヤモンド、窒化珪素、炭
化珪素、炭化硼素、炭酸バリウム、炭酸カルシウム、酸
化鉄、酸化マグネシウム、酸化ジルコニア、酸化セリウ
ム、酸化クロム、酸化錫、酸化チタンのいずれかから形
成されたものでよい。必要に応じて、２種乃至３種以上
の砥粒をフェルト中に分散せしめることもできる。塊状
体中に砥粒を適宜に分散せしめるためには、例えば、適
宜の液体中に砥粒を混入し、かかる液体を塊状体に含浸
せしめる、或いは塊状体の製造工程中に塊状体原料繊維
中に砥粒を適宜に混入することができる。塊状体中に砥
粒を適宜に分散せしめた後に、塊状体に適宜の液状接着
剤、例えばフェノール樹脂系接着液又はエポキシ樹脂系
接着剤、を含浸せしめ、かかる接着剤によって塊状体中
に砥粒を結合することができる。The amount of abrasive grains dispersed in the lump is
It is preferably 0.05 to 1.00 g / cm 3 , particularly 0.20 to 0.70 g / cm 3 . The abrasive grain itself dispersed in the lump is 0.01 to 100 μm.
It is preferred that it has a particle size of m 2. Abrasive grains
Silica, alumina, forsterite, steatite, mullite, cubic boron nitride, diamond, silicon nitride, silicon carbide, boron carbide, barium carbonate, calcium carbonate, iron oxide, magnesium oxide, zirconia oxide, cerium oxide, chromium oxide, oxidation It may be formed of either tin or titanium oxide. If necessary, two or more types of abrasive grains may be dispersed in the felt. In order to appropriately disperse the abrasive grains in the agglomerate, for example, the abrasive grains are mixed in an appropriate liquid and the agglomerates are impregnated with such liquid, or during the agglomerate production process Abrasive grains can be appropriately mixed in. After the abrasive particles are appropriately dispersed in the lump, the lump is impregnated with a suitable liquid adhesive, for example, a phenol resin adhesive or an epoxy resin adhesive, and the abrasive is incorporated into the lump by the adhesive. Can be combined.
【００１３】図２を参照することによって明確に理解さ
れる如く、図１及び図２に図示する実施形態において
は、研磨手段６の塊状体は、第一のフェルト１０と複数
個の第二のフェルト１２とから構成されている。第一の
フェルト１０は第一の繊維から形成され、第二のフェル
ト１２は第一の繊維とは異なった第二の繊維から形成さ
れている。第一のフェルト１０は全体として円板形状で
あり、厚さ方向に貫通する複数個の空所１４が適宜の間
隔をおいて形成されている。空所１４の各々の断面形状
は比較的小径の円でよい。複数個の第二のフェルト１２
は比較的小径の円柱形状であり、第一のフェルト１０に
形成されている空所１４の各々に嵌入せしめられてい
る。従って、研磨手段６の研磨面即ち下面においては、
第一のフェルト１０中に第二のフェルト１２が分散配列
されている。空所１４の各々に第二のフェルト１２を圧
入することによって第一のフェルト１０の空所１４に第
二のフェルト１２を固着することができる。これに代え
て、適宜の接着剤によって第二のフェルト１２を第一の
フェルト１０の空所１４に固着することもできる。第一
のフェルト１０を羊毛から形成し、第二のフェルト１２
を山羊毛から形成し、或いは第一にフェルト１０を山羊
毛から形成し、第二のフェルト１２を羊毛から形成する
ことができる。As will be clearly understood by referring to FIG. 2, in the embodiment shown in FIGS. 1 and 2, the mass of the polishing means 6 comprises a first felt 10 and a plurality of second felts. It is composed of a felt 12. The first felt 10 is formed from a first fiber and the second felt 12 is formed from a second fiber different from the first fiber. The first felt 10 has a disk shape as a whole, and a plurality of voids 14 penetrating in the thickness direction are formed at appropriate intervals. The cross-sectional shape of each of the voids 14 may be a circle having a relatively small diameter. A plurality of second felts 12
Has a columnar shape with a relatively small diameter and is fitted into each of the voids 14 formed in the first felt 10. Therefore, on the polishing surface, that is, the lower surface of the polishing means 6,
The second felts 12 are dispersedly arranged in the first felt 10. The second felt 12 can be fixed to the voids 14 of the first felt 10 by press-fitting the second felt 12 into each of the voids 14. Alternatively, the second felt 12 can be fixed to the void 14 of the first felt 10 by an appropriate adhesive. The first felt 10 is formed from wool and the second felt 12
Can be made of goat wool, or first the felt 10 can be made of goat wool and the second felt 12 can be made of wool.
【００１４】図３乃至図５は塊状体を構成する第一のフ
ェルト１０と第二のフェルト１２との組み合わせ様式の
変形例を図示している。図３に図示する研磨工具２の研
磨手段６においては、第一のフェルト１０は円板形状で
あり、第二のフェルト１２は第一のフェルト１０を囲繞
する円環形状である。図４に図示する研磨工具２の研磨
手段６においては、第一のフェルト１０と第二のフェル
ト１２とが交互に同心円状に配列されており、第一のフ
ェルト１０は中心円柱形状部と中間円環形状部との２個
の部分を有し、第二のフェルト１２は中間円環形状部と
外側円環形状部とを有する。図５に図示する研磨工具２
の研磨手段６においては、第一のフェルト１０は６個の
セグメント形状部を有し、第二のフェルト１２は放射状
に延びる６個の直線形状部と外側環形状部とを有する。FIGS. 3 to 5 show modified examples of a combination mode of the first felt 10 and the second felt 12 which form a lump. In the polishing means 6 of the polishing tool 2 shown in FIG. 3, the first felt 10 has a disc shape, and the second felt 12 has an annular shape surrounding the first felt 10. In the polishing means 6 of the polishing tool 2 shown in FIG. 4, the first felts 10 and the second felts 12 are alternately arranged in concentric circles, and the first felts 10 have a central cylindrical portion and an intermediate portion. The second felt 12 has two parts, an annular ring-shaped part and an intermediate ring-shaped part and an outer ring-shaped part. Polishing tool 2 shown in FIG.
In the polishing means 6, the first felt 10 has six segment-shaped portions, and the second felt 12 has six linearly-extending linearly-shaped portions and an outer ring-shaped portion.
【００１５】図６は本発明に従って構成された研磨工具
の他の実施形態を図示している。図６に図示する研磨工
具１０２も支持部材１０４と研磨手段１０６とから構成
されている。支持部材１０４は図１及び図２に図示する
研磨工具２における支持部材２と同一でよい。塊状体と
この塊状体中に分散せしめられている砥粒から構成され
ている研磨手段１０６は円板形状であり、支持部材１０
４の平坦な円形支持下面即ち下面に適宜の接着剤を介し
て接合されている。研磨手段１０６の塊状体は、第一の
繊維から形成されたフェルト１１０と第一の繊維とは異
なった第二の繊維から形成された複数個の繊維束１１２
とから形成されている。フェルト１１０を形成する第一
の繊維は羊毛又は山羊毛でよい。繊維束１１２を構成す
る第二の繊維は羊毛及び山羊毛以外の獣毛、例えば豚
毛、馬毛、牛毛、犬毛、猫毛、狸毛又は狐毛でよい。繊
維束１１２は多数の繊維を束ねて所要圧縮力で圧縮する
ことによって形成することができる。図６に図示する実
施形態においては、フェルト１１０は全体として円板形
状であり、厚さ方向に貫通する複数個の空所１１４が適
宜の間隔をおいて形成されている。空所１１４の各々の
横断面形状は比較的小径の円形である。複数個の繊維束
１１２の各々は比較的小径の円柱形状であり、フェルト
１１０に形成されている空所１１４内に嵌入されてい
る。従って、研磨手段１０６の下面においては、フェル
ト１１０中に繊維束１１２が分散配列されている。繊維
束１１２の各々は、空所１１４の各々内に圧入すること
によって、或いは適宜の接着剤を介して、フェルト１１
０の空所１１４内に固着されている。FIG. 6 illustrates another embodiment of a polishing tool constructed in accordance with the present invention. The polishing tool 102 shown in FIG. 6 also includes a support member 104 and polishing means 106. The support member 104 may be the same as the support member 2 in the polishing tool 2 shown in FIGS. 1 and 2. The polishing means 106, which is composed of lumps and abrasive grains dispersed in the lumps, has a disc shape, and is used as the support member 10.
4 is joined to the flat circular support lower surface, that is, the lower surface via a suitable adhesive. The agglomerate of the polishing means 106 includes a felt 110 formed of a first fiber and a plurality of fiber bundles 112 formed of a second fiber different from the first fiber.
It is formed from and. The first fibers forming the felt 110 may be wool or goat wool. The second fiber constituting the fiber bundle 112 may be animal hair other than wool and goat hair, for example, pig hair, horse hair, cow hair, dog hair, cat hair, raccoon hair or fox hair. The fiber bundle 112 can be formed by bundling a large number of fibers and compressing them with a required compression force. In the embodiment shown in FIG. 6, the felt 110 has a disk shape as a whole, and a plurality of cavities 114 penetrating in the thickness direction are formed at appropriate intervals. The cross-sectional shape of each of the voids 114 is a circle having a relatively small diameter. Each of the plurality of fiber bundles 112 has a columnar shape with a relatively small diameter, and is fitted in a space 114 formed in the felt 110. Therefore, on the lower surface of the polishing means 106, the fiber bundles 112 are dispersed and arranged in the felt 110. Each of the fiber bundles 112 is pressed into each of the voids 114, or via a suitable adhesive, to the felt 11
It is fixed in the void 114 of 0.
【００１６】図７は本発明に従って構成された研磨工具
の更に他の実施形態を図示している。図７に図示する研
磨工具２０２も支持部材２０４と研磨手段２０６とから
構成されている。支持部材２０４は図１及び図２に図示
する研磨工具２における支持部材２と同一でよい。塊状
体とこの塊状体中に分散せしめられている砥粒から構成
されている研磨手段２０６は円板形状であり、支持部材
２０４の平坦な円形支持下面即ち下面に適宜の接着剤を
介して接合されている。研磨手段２０６の塊状体は単一
のフェルト２１０から形成されているが、フェルト２１
０自体は少なくとも２種の繊維を混合して形成されてい
る。例えば羊毛と山羊毛とを適宜の割合で混合してフェ
ルト２１０を形成することができる。FIG. 7 illustrates yet another embodiment of a polishing tool constructed in accordance with the present invention. The polishing tool 202 shown in FIG. 7 also includes a support member 204 and a polishing means 206. The support member 204 may be the same as the support member 2 in the polishing tool 2 shown in FIGS. The polishing means 206 composed of a lump and abrasive grains dispersed in the lump has a disc shape, and is bonded to a flat circular support lower surface of the support member 204, that is, the lower surface via an appropriate adhesive. Has been done. The mass of the polishing means 206 is formed of a single felt 210, but the felt 21
0 itself is formed by mixing at least two kinds of fibers. For example, the felt 210 can be formed by mixing wool and goat wool at an appropriate ratio.
【００１７】[0017]
【発明の効果】本発明の研磨工具によれば、産業廃棄物
として処理すべき物質を大量に生成せしめることなく、
半導体ウエーハの裏面を高研磨効率及び高研磨品質で研
磨して、そこに存在していた加工歪を除去することがで
きる。According to the polishing tool of the present invention, it is possible to produce a large amount of substances to be treated as industrial waste,
The back surface of the semiconductor wafer can be polished with high polishing efficiency and high polishing quality to remove the processing strain existing therein.
【図１】本発明に従って構成された研磨工具の好適実施
形態を示す斜面図。FIG. 1 is a perspective view showing a preferred embodiment of an abrasive tool constructed in accordance with the present invention.
【図２】図１の研磨工具を倒立状態で示す斜面図。2 is a perspective view showing the polishing tool of FIG. 1 in an inverted state.
【図３】研磨手段の塊状体を形成する第一のフェルトと
第二のフェルトとの組み合わせ様式の変形例を図示す
る、図２と同様の斜面図。FIG. 3 is a perspective view similar to FIG. 2, illustrating a variation of the combination mode of the first felt and the second felt forming the mass of the polishing means.
【図４】研磨手段の塊状体を形成する第一のフェルトと
第二のフェルトとの組み合わせ様式の他の変形例を図示
する、図２と同様の斜面図。FIG. 4 is a perspective view similar to FIG. 2, illustrating another modification of the combination mode of the first felt and the second felt forming the mass of the polishing means.
【図５】研磨手段の塊状体を形成する第一のフェルトと
第二のフェルトとの組み合わせ様式の更に他の変形例を
図示する、図２と同様の斜面図。FIG. 5 is a perspective view similar to FIG. 2, illustrating yet another variation of the combination mode of the first felt and the second felt forming the mass of the polishing means.
【図６】本発明に従って構成された研磨工具の他の実施
形態を倒立状態で示す、図２と同様の斜面図。6 is a perspective view similar to FIG. 2, showing another embodiment of a polishing tool constructed in accordance with the present invention in an inverted state.
【図７】本発明に従って構成された研磨工具の更に他の
実施形態を倒立状態で示す、図２と同様の斜面図。FIG. 7 is a perspective view similar to FIG. 2, showing yet another embodiment of a polishing tool constructed in accordance with the present invention in an inverted state.
２：研磨工具 ４：支持部材 ６：研磨手段 １０：第一のフェルト １２：第二のフェルト １０２：研磨工具 １０４：支持部材 １０６：研磨手段 １１０：フェルト １１２：繊維束 ２０２：研磨工具 ２０４：支持部材 ２０６：研磨手段 ２１０：フェルト 2: Polishing tool 4: Support member 6: Polishing means 10: First felt 12: Second felt 102: polishing tool 104: Support member 106: polishing means 110: Felt 112: Fiber bundle 202: Polishing tool 204: Support member 206: Polishing means 210: Felt
フロントページの続き (72)発明者 松谷 直宏 東京都大田区東糀谷２丁目14番３号 株式 会社ディスコ内 Ｆターム(参考） 3C058 AA09 CA05 CB03 DA17 3C063 AA06 AB05 BB25 BC03 BE04 BG07 BH03 EE10 FF23 Continued front page (72) Inventor Naohiro Matsutani 2-14-3 Higashi-Kojiya, Ota-ku, Tokyo Stocks Company disco F term (reference) 3C058 AA09 CA05 CB03 DA17 3C063 AA06 AB05 BB25 BC03 BE04 BG07 BH03 EE10 FF23
Claims (17)
手段を具備し、該研磨手段は種々の獣毛を含む天然繊維
及び合成繊維から選択された少なくとも２種の繊維から
形成された塊状体と該塊状体中に分散せしめられた砥粒
とから構成されている、ことを特徴とする研磨工具。1. A lump formed from a support member and a polishing means fixed to the support member, the polishing means comprising at least two kinds of fibers selected from natural fibers and synthetic fibers containing various animal hairs. A polishing tool comprising a body and abrasive grains dispersed in the lump.
一のフェルトと第二の繊維から形成された第二のフェル
トとから構成されている、請求項１記載の研磨工具。2. The polishing tool of claim 1, wherein the mass comprises a first felt formed of first fibers and a second felt formed of second fibers.
該第二の繊維は山羊毛又は羊毛である、請求項２記載の
研磨工具。3. The first fiber is wool or goat wool,
The polishing tool according to claim 2, wherein the second fiber is goat wool or wool.
空所を形成し、該複数個の空所の各々に該第二のフェル
トを嵌入して構成されており、該研磨手段の研磨面にお
いては該第一のフェルト中に該第二のフェルトが分散配
列されている、請求項２又は３記載の研磨工具。4. The polishing means is formed by forming a plurality of voids in the first felt and inserting the second felt in each of the plurality of voids. The polishing tool according to claim 2 or 3, wherein the second felt is dispersedly arranged in the first felt on the polishing surface of.
ェルトと第二の繊維から形成された繊維束とから構成さ
れている、請求項１記載の研磨工具。5. The polishing tool according to claim 1, wherein the agglomerate comprises a felt formed of a first fiber and a fiber bundle formed of a second fiber.
該第二の繊維は羊毛及び山羊毛以外の獣毛である、請求
項５記載の研磨工具。6. The first fiber is wool or goat wool,
The polishing tool according to claim 5, wherein the second fiber is animal hair other than wool and goat wool.
形成し、該複数個の空所の各々に該繊維束を嵌入して構
成されており、該研磨手段の研磨面においては該フェル
ト中に該繊維束が分散配列されている、請求項５又は６
記載の研磨工具。7. The agglomerate is formed by forming a plurality of voids in the felt, and inserting the fiber bundle into each of the plurality of voids. 7. The fiber bundles are dispersed and arranged in the felt.
The described polishing tool.
して形成されたフェルトから構成されている、請求項１
記載の研磨工具。8. The mass comprises a felt formed by mixing at least two types of fibers.
The described polishing tool.
成されたフェルトから構成されている、請求項８記載の
研磨工具。9. The polishing tool according to claim 8, wherein the agglomerate comprises a felt formed by mixing wool and goat wool.
以上で硬度が３０以上である、請求項１から９までのい
ずれかに記載の研磨工具。10. The mass has a density of 0.20 g / cm 3.
The polishing tool according to any one of claims 1 to 9, which has a hardness of 30 or more.
以上である、請求項１０記載の研磨工具。11. The density of the agglomerates is 0.40 g / cm 3.
The polishing tool according to claim 10, which is the above.
請求項１０又は１１記載の研磨工具。12. The hardness of the lump body is 50 or more,
The polishing tool according to claim 10.
／ｃｍ３の砥粒を含有している、請求項１から１２まで
のいずれかに記載の研磨工具。13. The polishing means is 0.05 to 1.00 g
The polishing tool according to any one of claims 1 to 12, which contains abrasive grains of / cm 3 .
／ｃｍ３の砥粒を含有している、請求項１３記載の研磨
工具。14. The polishing means comprises 0.20 to 0.70 g.
The polishing tool according to claim 13, which contains abrasive grains of / cm 3 .
径を有する、請求項１から１４までのいずれかに記載の
研磨工具。15. The polishing tool according to claim 1, wherein the abrasive grains have a grain size of 0.01 to 100 μm.
ライト、ステアタイト、ムライト、立方晶窒化硼素、ダ
イヤモンド、窒化珪素、炭化珪素、炭化硼素、炭酸バリ
ウム、炭酸カルシウム、酸化鉄、酸化マグネシウム、酸
化ジルコニア、酸化セリウム、酸化クロム、酸化錫、酸
化チタンのうちの１種又は２種以上を含む、請求項１か
ら１５までのいずれにかに記載の研磨工具。16. The abrasive grains are silica, alumina, forsterite, steatite, mullite, cubic boron nitride, diamond, silicon nitride, silicon carbide, boron carbide, barium carbonate, calcium carbonate, iron oxide, magnesium oxide, and oxide. The polishing tool according to any one of claims 1 to 15, containing one kind or two or more kinds of zirconia, cerium oxide, chromium oxide, tin oxide, and titanium oxide.
磨手段は該円形支持面に接合された円板形状である、請
求項１から１６までのいずれかに記載の研磨工具。17. The polishing tool according to claim 1, wherein the support member has a circular support surface, and the polishing means has a disc shape joined to the circular support surface.
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001311450A JP2003124164A (en) | 2001-10-09 | 2001-10-09 | Polishing tool |
| SG200201425-6A SG131737A1 (en) | 2001-03-28 | 2002-03-13 | Polishing tool and polishing method and apparatus using same |
| DE10211342.4A DE10211342B4 (en) | 2001-03-28 | 2002-03-14 | Polishing tool and polishing method and apparatus using the same |
| TW091104995A TW528656B (en) | 2001-03-28 | 2002-03-15 | Polishing tool and polishing method and apparatus using same |
| US10/100,901 US7713107B2 (en) | 2001-03-28 | 2002-03-20 | Polishing tool |
| CNB021198187A CN1246885C (en) | 2001-03-28 | 2002-03-28 | Polish tool and its use method and device |
| KR1020020017003A KR100838028B1 (en) | 2001-03-28 | 2002-03-28 | Polishing tool and polishing method and apparatus using same |
| HK03101637.4A HK1054815B (en) | 2001-03-28 | 2003-03-05 | Polishing tool, polishing method and apparatus using the polishing tool |
| US11/987,382 US7736215B2 (en) | 2001-03-28 | 2007-11-29 | Polishing tool and polishing method and apparatus using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001311450A JP2003124164A (en) | 2001-10-09 | 2001-10-09 | Polishing tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003124164A true JP2003124164A (en) | 2003-04-25 |
Family
ID=19130281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001311450A Pending JP2003124164A (en) | 2001-03-28 | 2001-10-09 | Polishing tool |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003124164A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008183659A (en) * | 2007-01-30 | 2008-08-14 | Disco Abrasive Syst Ltd | Grinder |
| WO2016120516A1 (en) * | 2015-01-28 | 2016-08-04 | Kwh Mirka Ltd | A polishing pad and material and manufacturing method for such |
| JP2016159416A (en) * | 2015-03-05 | 2016-09-05 | 株式会社ディスコ | Polishing pad |
| JP2019527147A (en) * | 2016-07-01 | 2019-09-26 | スリーエム イノベイティブ プロパティズ カンパニー | Non-woven abrasive articles containing abrasive particles |
-
2001
- 2001-10-09 JP JP2001311450A patent/JP2003124164A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008183659A (en) * | 2007-01-30 | 2008-08-14 | Disco Abrasive Syst Ltd | Grinder |
| WO2016120516A1 (en) * | 2015-01-28 | 2016-08-04 | Kwh Mirka Ltd | A polishing pad and material and manufacturing method for such |
| US10632591B2 (en) | 2015-01-28 | 2020-04-28 | Kwh Mirka Ltd | Polishing pad and material and manufacturing method for such |
| JP2016159416A (en) * | 2015-03-05 | 2016-09-05 | 株式会社ディスコ | Polishing pad |
| JP2019527147A (en) * | 2016-07-01 | 2019-09-26 | スリーエム イノベイティブ プロパティズ カンパニー | Non-woven abrasive articles containing abrasive particles |
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