JP2003123883A - Electric connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric connector without possibility of physical break of conduction pattern, which can restrain partial discontinuity and high resistance variation. SOLUTION: An electric connection comprises a ZIF housing 2 electrically connected to a circuit board, and a heat seal connector 10 electrically connected to a transparent conductive oxide film base board through a part of a conductor pattern 12. The circuit board is electrically connected to the transparent conductive oxide film base board by inserting the heat seal connector 10 into the ZIF housing 2, and by making a conductive contact 3 of the ZIF housing 2 contact the other end part 14 of the conductor pattern 12 with pressure. The other end part 14 of the conductor pattern 12 is formed into a two layer structure and a lower layer is applied to the conductor pattern 12 and an upper layer covering the conductor pattern 12 is formed by carbon paste 15. The carbon paste 15 is prepared from carbon black 16 with the grain diameter of 0.001-10 μm and conductive grain 17 with the grain diameter of 5-50 μm.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric connector used for electrical connection between a display body composed of a liquid crystal display, a plasma display or the like and a circuit board, a semiconductor package such as a BGA and a circuit board, and the like. Relates to a heat seal connector forming part of an electrical connector.

[0002]

2. Description of the Related Art Conventionally, various electrical connectors have been used to electrically connect a circuit board and a transparent conductive oxide film substrate. One of them is ZIF (Zero Ins).
ertForce) connector is used. Although not shown, the ZIF connector includes a ZIF housing electrically connected to the circuit board.
The heat seal connector connected to the transparent conductive oxide film substrate is removably inserted into the housing, so that the circuit board and the transparent conductive oxide film substrate are electrically connected. Z
The IF housing is formed in a substantially hollow box shape with an open front surface, and a plurality of conductive contacts electrically connected to the circuit board are juxtaposed above or below the inside, and each conductive contact serves as a heat seal connector. Make electrical pressure contact.

In the heat seal connector, a plurality of conductive patterns are juxtaposed on the surface thereof, one end of each conductive pattern is electrically connected to the transparent conductive oxide film substrate through an anisotropic conductive adhesive, and each conductive pattern is electrically connected. The other end of the pattern is pressed against the conductive contact. When this conductive pattern is formed of a metal component other than gold or platinum, the other end is coated with a carbon paste containing a conductive carbon black powder, and this carbon paste effectively oxidizes or oxidizes the surface. Prevent suppression.

[0004]

The conventional heat-seal connector is constructed as described above, and since the other end of each conductive pattern is simply coated with the carbon paste, the surface oxidation or the other end of each conductive pattern is prevented. Although it is possible to suppress and prevent sulfuration, when the heat seal connector is inserted into or removed from the ZIF housing, there is a possibility that the other end of the conductive pattern is physically broken by the conductive contact that is pressed against the ZIF housing. Further, when the carbon paste is left in various environments, the carbon paste cannot follow the deformation and the flow, and as a result, there is a problem that partial conduction failure and high resistance value change occur.

The present invention has been made in view of the above, and provides an electrical connector which eliminates the possibility of physical destruction of a conductive pattern and suppresses partial conduction failure and high resistance change. Is intended.

[0006]

In order to achieve the above-mentioned object, in the invention according to claim 1, the inserted body electrically connected to the first electrical joint and the second electrical joint are provided. A heat-seal connector electrically connected through a conductive pattern, wherein the heat-seal connector is inserted into the inserted body and the conductive contact of the inserted body is brought into contact with the conductive pattern, , For electrically connecting the second electrical joint, forming at least a contact portion of the conductive pattern with the conductive contact in a two-layer structure and forming a lower layer in the conductive pattern, and forming the conductive pattern. The upper layer to cover is a conductive protective layer, and the conductive protective layer is formed of a plurality of first and second conductive materials so that the hardness of the second conductive material is higher than the hardness of the first conductive material. Is it a conductive material Is projected a second conductive material, it is characterized in that so as to contact the conductive contacts to the second conductive material.

The conductive protection layer is a carbon paste, the first conductive material is carbon black having a particle size of 0.001 to 10 μm, and the second conductive material is a conductive particle having a particle size of 5 to 50 μm. It is preferable that The conductive particles are preferably carbon particles, carbon particles whose surface is plated with metal, metal particles, plastic particles whose surface is plated with metal, or ceramic particles.

[0008] Here, at least the liquid crystal display (L
CDs, displays such as plasma displays (PDPs), flexible boards, printed circuit boards, various circuit boards such as transparent conductive oxide film boards, and semiconductor packages such as BGAs. The heat-seal connector mainly has a plurality of conductive patterns, but is not limited to this, and a single pattern may be used. The sizes of the first and second conductive materials are preferably such that the first conductive material is smaller and the second conductive material is larger than the first conductive material.

According to the first aspect of the present invention, the second conductive material which is chemically stable and hard to break is added to the conductive protective layer made of the first conductive material, and the second conductive material which is hard from the first conductive material is added. Since the conductive material is projected, the conductive contact comes into contact with the second conductive material. Therefore, not only can the surface of the conductive pattern of the heat-seal connector be oxidized or sulfided, but also the contact portion of the conductive pattern with the conductive contact can be prevented from being damaged by the conductive contact.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION A preferred embodiment of the present invention will be described below with reference to the drawings. The electrical connector in this embodiment is a first electrical joint as shown in FIGS. 1 to 7. The ZIF housing 2 electrically fitted and connected to the peripheral portion of the circuit board 1 and the transparent conductive oxide film substrate (second electrical joint) with a drive circuit (not shown) are provided with one end portions 13 of the conductive patterns 12. And a heat-seal connector 10 electrically connected through the conductive pattern 12
The other end 14 of the above is formed into a two-layer structure, the lower layer thereof is the conductive pattern 12, the upper layer covering the conductive pattern 12 is the carbon paste 15, and the carbon paste 15 is composed of the small carbon black 16 and the large conductive particles. I am preparing from 17 and.

As shown in FIGS. 1 and 2, the ZIF housing 2 is formed in a substantially hollow box shape with a front opening using a predetermined resin, and has a transparent conductive oxide film substrate heat seal connector 10 inside. The other end is insertably and removably inserted to electrically connect the circuit board 1 and the transparent conductive oxide film substrate. In the ZIF housing 2, a plurality of conductive contacts 3 having a substantially V-shaped cross section that are electrically connected to the circuit board 1 are arranged side by side at a predetermined pitch above the inside of the ZIF housing 2, and the bent portions of each elastic conductive contact 3 are heat-sealed. Connector 10
Opposite the other end. The front of the opening of the ZIF housing 2 is above the locking portion 4 for the heat seal connector 10.
Is projected downward, and a slider 5 carrying a heat seal connector 10 is slidably inserted below.

As shown in FIGS. 1 to 7, the heat-seal connector 10 includes an insulating film 11 mounted on the slider 5 and a plurality of conductive films arranged on the surface of the film 11 at a predetermined pitch. Pattern 12 and film 1
An insulating film 18 which is optionally attached to the central part of the surface of the film 1 and covers the central part of the plurality of conductive patterns 12, and the plurality of conductive patterns 12 on one end of the film 11 are different from the transparent conductive oxide film substrate. It is electrically adhered by the one-way conductive adhesive 19.

The film 11 is made of a predetermined material 1
It is formed into a cross-sectional plate shape having a thickness of 0 to 50 μm and has flexibility. The material of the film 11 is not particularly limited, but for example, polyethylene terephthalate, polyethylene naphthalate, polyimide,
Polyamide, polycarbonate, polyphenylene sulfide, polybutylene naphthalate, polyarylate,
A liquid crystal polymer or the like is preferably used. Further, each conductive pattern 12 is made of a material other than gold or platinum, for example, a material obtained by etching a metal such as copper, tin, or solder, or an organic binder mixed with conductive particles such as carbon powder or metal powder to form a solvent. It is made of a melted conductive paste or the like, and is formed into an elongated filament by a method such as screen printing or gravure printing.

The carbon paste 15 is prepared from the fine carbon black 16 and the conductive particles 17 as described above, and is formed into a long thin strip by a method such as screen printing or gravure printing. Carbon black 16 and conductive particles 1
7 means that the hardness of the conductive particles 17 is set to be higher than the hardness of the powdery carbon black 16, and a large number of the hard conductive particles 17 project upward from the carbon black 16 and the other end portion 14 of the conductive pattern 12 is formed. To conductive contact 3
It effectively regulates that it bites and destroys. The mixing ratio of carbon black 16 and conductive particles 17 is 0.1 to 30 parts by volume, preferably 1 to 15 parts by volume of carbon black 16. On the other hand, the conductive particles 17 contained in the carbon black 16 are 0.1 to 50 parts by volume, preferably 5 to 20 parts by volume.

The particle size of carbon black 16 is as follows.
It is selected from the range of 0.001 to 10 μm, but 0.1
The optimum range is ˜5 μm. The conductive particles 17 include carbon particles, carbon particles whose surfaces are metal-plated, metal particles made of gold, silver, silver-plated copper, nickel, palladium, stainless steel, brass, solder, and aluminum,
Plastic particles whose surfaces are metal-plated or ceramic particles are used. The particle size of the conductive particles 17 is
It is selected from the range of 5 to 50 μm, but 10 to 30 μm
The optimum range is.

The insulating film 18 is made of, for example, a synthetic resin such as polyamide or polyester, various synthetic rubbers, or a mixture thereof, and if necessary, additives such as a curing agent, a vulcanizing agent, and a deterioration preventing agent. Examples thereof include those obtained by screen-printing those to which is added, or those obtained by adhering an adhesive such as an acrylic resin to a film such as polyester or vinyl chloride. These are selected in consideration of required insulation properties, surface protection properties, costs, and the like.

The anisotropic conductive adhesive 19 is prepared by mixing an insulating adhesive and a large number of conductive particles, and is screen-printed or gravure-printed on one end of the surface of the film 11 or on the entire surface of the film 11. It is glued by the method.
The mixing ratio of the insulating adhesive and the conductive particles is 0.1 to 30 parts by volume, preferably 1 to 15 parts by volume. Insulating adhesive, if it exhibits adhesiveness by heating and pressure,
Either a thermoplastic type or a thermosetting type may be used. In addition, additives such as a curing agent, a vulcanizing agent, an anti-degradation agent, and a tackifier are added as needed, based on synthetic resins such as polyamide-based and polyester-based, various synthetic rubbers, or a mixture thereof. .

The conductive particles of the anisotropic conductive adhesive 19 are gold,
Examples thereof include metals such as silver, solder, and copper, carbon particles, polymer core materials, and carbon particles coated with a metal. The particle size of the conductive particles is not particularly limited, but is 5
It is preferably selected from the range of 150 μm.

In the above structure, when electrically connecting the circuit board 1 and the transparent conductive oxide film substrate, one end of the heat seal connector 10, that is, each conductive pattern 12 is connected to the transparent conductive oxide film substrate. One end 13 is bonded with an anisotropic conductive adhesive 19, the other end of the heat seal connector 10 not coated with the anisotropic conductive adhesive 19 is inserted into the ZIF housing 2, and the ZIF housing 2 When sandwiched between the engaging portion 4 and the slider 5, the conductive contact 3 is electrically pressed against the conductive particles 17 of the carbon paste 15 covering the other end 14 of each conductive pattern 12, and the circuit board 1 and the transparent conductive material. The oxide film substrate can be electrically connected.

According to the above structure, a large number of large conductive particles 17 which are chemically stable and are not easily crushed are added, and the conductive particles 17 having excellent rigidity are projected from the small carbon black 16 in the direction opposite to the conductive pattern 12. Although the conductive contact 3 digs into the carbon paste 15 to some extent, the conductive pattern 1 is formed by the conductive contact 3 that is pressed against the carbon paste 15.
It is possible to very effectively eliminate the possibility that the other end portion 14 of 2 will be physically destroyed. Further, similar to the conventional example, it is possible to suppress and prevent the surface oxidation and sulfurization of the other end portion 14 of the conductive pattern 12.

In addition, regardless of environmental changes (for example, outdoors in the summer or in the car), the carbon paste 15 does not follow the deformation or flow, and it is effective that partial conduction failure and high resistance change occur. Can be prevented from being suppressed.
Further, by adding the conductive particles 17 having a uniform particle size distribution, it becomes possible to directly contact the conductive contact 3 and the conductive particles 17 which was not possible with only the carbon black 16 having a small diameter, and the reliability of stable electrical connection is improved. It can be significantly improved.

In the above embodiment, the film 11 is merely shown, but the invention is not limited to this.
For example, a reinforcing plate may be attached to the back surface of the other end of the film 11. Further, in the above embodiment, the first conductive material is carbon black 16 and the second conductive material is conductive particles 17, but other materials may be used as long as the same effect can be expected. good. Further, although the anisotropic conductive adhesive 19 is used as the anisotropic conductive means, the anisotropic conductive adhesive 19 is not limited to this. For example, the above-described insulating adhesive may be formed on the conductive paste forming the conductive pattern 12.
In this case, the conductive particles protruding from the conductive pattern 12 are selected, and the protruding amount of the conductive particles is 3 to 30.
μm is preferred. In this case, the mixing ratio of the conductive particles to the conductive pattern 12 is 0.1 to 30 parts by volume, preferably 1 to 15 parts by volume.

[0023]

EXAMPLES Examples of electrical connectors according to the present invention will be described below together with comparative examples. Example First, a plurality of conductive patterns were printed by screen printing at a predetermined pitch on the surface of a film made of a polyester film having a thickness of 25 μm, and carbon paste was printed and solidified by screen printing on the other end of each conductive pattern. To completely cover the other end of each conductive pattern. As the conductive pattern, a conductive paste prepared by mixing 10 parts by weight of the polyester-based synthetic resin with 70 parts by weight of scale-like silver particles was used. The carbon paste has a particle size of 0.1 to 5
7 parts by weight of carbon black powder of μm and average particle size of 20μ
A paste was prepared by mixing 10 parts by weight of gold-plated carbon particles of m.

Next, the deterioration preventing agent 5 is added to the anisotropic conductive adhesive.
An insulating adhesive is prepared by adding parts by weight, and 100 parts by volume of this insulating adhesive is mixed with 8 parts by volume of projecting carbon particles and applied to one end of each conductive pattern.
An insulating film was formed on the center of the surface of the film to cover the center of the plurality of conductive patterns. Anisotropically conductive adhesive is carboxyl-organized styrene-ethylene-styrene copolymer 1
00 parts by weight, 50 parts by weight of a terpene phenol-based tackifier, and 3 parts by weight of gold-plated carbon particles having an average particle size of 20 μm are mixed.

Then, a film having a thickness of 21 is formed on the back surface of the other end of the film.
Stick a reinforcing plate made of 0 μm polyester sheet,
The outer shape was adjusted with a punching die in which a Victoria blade was embedded in ABS resin, and a heat seal connector as shown in FIG. 2 was produced.

After the heat seal connector is manufactured in this manner, the anisotropic conductive adhesive at one end of the heat seal connector is coated with a transparent conductive oxide film substrate (I) having an area resistance of 50Ω / □.
(TO) connection terminal at 150 ° C, 30 kgf / cm ² , 12
Thermocompression bonding was performed under the condition of seconds, and the other end of the heat seal connector was inserted into the ZIF housing. And 60 in this state
Conductivity resistance values after standing for 0, 240, 500, and 1000 hours in a high-temperature and high-humidity atmosphere of ℃, 95% RH, and a high-temperature atmosphere of 85 ℃ were measured, and the measurement results are summarized in Tables 1 and 2. It was

Comparative Example Basically the same as the example, except that the carbon paste coating the other end of each conductive pattern had an average particle size of 0.1 to 5 μm.
It was prepared from only 7 parts by weight of m carbon black powder.
Then, as in the example, 0, 240, 5 in a high temperature and high humidity atmosphere of 60 ° C. and 95% RH and a high temperature atmosphere of 85 ° C.
The conduction resistance value after standing for 00 or 1000 hours was measured, and the measurement results are summarized in Tables 1 and 2.

[0028]

[Table 1]

[0029]

[Table 2]

As is clear from Tables 1 and 2, the heat-sealing connectors of the examples had a slight increase in conduction resistance even after being left for 1000 hours in a harsh environment. On the other hand, the heat seal connector of the comparative example,
The conduction resistance value increased with the passage of time, and eventually it opened.

[0031]

As described above, according to the present invention, it is possible to eliminate the possibility that the connection portion of the conductive pattern with the conductive contact is physically destroyed, and further, the conductive pattern is partially defective in conduction and has a high resistance value. There is an effect that the change can be suppressed.

[Brief description of drawings]

FIG. 1 is an overall perspective view showing an embodiment of an electrical connector according to the present invention.

FIG. 2 is an explanatory cross-sectional view of main parts showing an embodiment of an electric connector according to the present invention.

FIG. 3 is a plan view showing a heat seal connector in the embodiment of the electric connector according to the present invention.

FIG. 4 is a sectional view taken along line IV-IV of FIG.

5 is a sectional view taken along line VV of FIG.

FIG. 6 is a cross-sectional view of essential parts showing the other end of the heat seal connector in the embodiment of the electric connector according to the present invention.

FIG. 7 is a cross-sectional view of an essential part showing one end of the heat seal connector at the time of connection in the embodiment of the electric connector according to the present invention.

[Explanation of symbols]

1 circuit board (first electrical junction) 2 ZIF housing (inserted body) 3 Conductive contact 10 Heat seal connector 12 Conductive pattern 13 One end 14 other end 15 Carbon paste (conductive protection layer) 16 carbon black (first conductive material) 17 Conductive particles (second conductive material) 19 Anisotropically conductive adhesive

Claims (3)

[Claims] 1. An object to be inserted electrically connected to the first electrical joint, and a heat seal connector electrically connected to the second electrical joint via a conductive pattern. An electrical connector for electrically connecting the first and second electrical joints by inserting the heat-seal connector into the insert and bringing a conductive contact of the insert into contact with the conductive pattern of the insert. At least the contact portion of the conductive pattern with the conductive contact is formed into a two-layer structure, the lower layer thereof is formed into the conductive pattern, the upper layer covering the conductive pattern is used as the conductive protective layer, and the conductive protective layer is used as the first and second conductive layers. The second conductive material is formed of two or more conductive materials so that the hardness of the second conductive material is higher than the hardness of the first conductive material, and the second conductive material is projected from the first conductive material. Conductive contact on material Electrical connector being characterized in that so as to contact the. 2. The conductive protection layer is a carbon paste, the first conductive material is carbon black having a particle size of 0.001 to 10 μm, and the second conductive material is a conductive particle having a particle size of 5 to 50 μm. The electrical connector according to claim 1. 3. The electrical connector according to claim 2, wherein the conductive particles are carbon particles, carbon particles having a surface plated with metal, metal particles, plastic particles having a surface plated with metal, or ceramic particles.