JP2003121492A - Spherical bump and contact structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To confirm a contact state of each spherical bump located at a position invisible from the outside in relation to the contact of the bump in mounting it on a socket or an electronic board, in spherical bumps of two-dimensional array used for an LSI of a small package. SOLUTION: Regarding one spherical bump 10, plural electrically separated contact terminals A11 and B12 are formed, external connection terminals A13 and B14 are electrically connected to the contact terminals A11 and B12, respectively, and electric resistance between the connection terminals A13 and B14 is measured by an electric resistance tester or the like, so that the contact states between the spherical bump 10, and the contact terminal A11 and the contact terminal B12 can be determined, and the contact state can be measured without needing a special device even if the spherical bump 10 is located at an invisible position.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for mounting, for example, a contact pin and an LSI having the contact pin, and more particularly to mounting a semiconductor package LSI having ball-shaped electrode terminals arranged two-dimensionally. The present invention relates to a contact structure with a spherical bump used in the case of

[0002]

2. Description of the Related Art A conventional contact structure will be described below. As the conventional contact structure between the contact pin and the spherical bump, the contact portion supported by the elastic support piece of the contact pin is arranged so as to face the spherical surface excluding the bottom dead center of the spherical bump, and the spherical surface is provided on the contact portion. There is a contact structure in which a protrusion that bites into the spherical surface of the shaped bump is provided and a pressure receiving surface that sets the amount of protrusion of this protrusion is provided (for example, Patent Registration No. 262).
0525).

On the other hand, Japanese Unexamined Patent Publication No. 10-12344 discloses a structure in which one contact terminal is divided into four parts and electrically separated to make contact with four spherical bumps.

[0004]

However, in the above-mentioned conventional structure, it is impossible to determine whether or not the spherical bump and the contact portion are in contact with each other no matter how the shape of the contact portion is devised. Therefore, L using spherical bumps
When the SI is evaluated, it is not possible to judge whether the contact between the spherical bump and the socket is poor or the device is defective. In particular, in a device in which spherical bumps are arranged two-dimensionally, the terminals near the center of the device cannot be visually observed.

That is, in Japanese Patent Registration No. 2620525, one spherical bump has two contact portions, but in the route, it is connected to a terminal through a joint portion electrically connected. Because,
The contact situation cannot be determined by measuring the electric resistance.

On the other hand, in the invention described in Japanese Unexamined Patent Publication No. 10-12344, there is no description that one bump has a plurality of contact portions and the signals are separately taken out, and the contact between the spherical bump and the contact terminal can be confirmed. Since it is not configured, the contact situation cannot be determined by measuring the electric resistance.

In view of the above point, the present invention exists in a two-dimensional array of spherical bumps used in a small package LSI at a position where contact with the spherical bumps when mounted on a socket or an electronic substrate cannot be visually observed from the outside. It is an object of the present invention to provide a contact structure for confirming the contact status of a spherical bump.

[0008]

According to the present invention, in a plurality of contact portions that contact one spherical bump, each contact portion is electrically separated. Further, the contact portion is electrically connected to an external connection terminal which is connected to the outside while being separated from each other.

The contact structure between the spherical bump and the contact portion is measured by measuring the electric resistance between the plurality of contact portions contacting one spherical bump by the contact structure with the spherical bump having the above-mentioned configuration. It is possible to measure the condition.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is a sectional view showing a contact structure with a spherical bump according to Embodiment 1 of the present invention.

In FIG. 1, reference numeral 15 is an electrode terminal with which the spherical bump 10 is contacted. 11 is a contact terminal A, 12
Are contact terminals B, and contact terminals A11 and B12
Both are contact terminals intended for the spherical bump 10. The contact terminal A11 and the contact terminal B12 are electrically separated,
In the positional relationship in FIG. 1, the spherical bumps 10 are not in contact with the contact terminals A11 and B12, so that the contact terminals A11 and B12 are electrically open.

Reference numeral 13 is an external connection terminal A, which is a contact terminal A.
11 and the external connection terminal A13 are electrically connected.
Reference numeral 14 denotes an external connection terminal B, which is electrically connected to the contact terminal B12. Spherical bump 10 and contact terminal A11,
Since the contact terminals B12 are electrically separated from each other, the contact terminals A11 and B12 are in an open state even between the external connection terminal A13 and the external connection terminal B14, the resistance value becomes infinite, and the electrical You can see that they are not connected.

On the other hand, FIG. 2 shows that the spherical bump 10 is in a position in contact with the contact terminals A11 and B12. Since the spherical bump 10 is conductive,
When the contact state of FIG. 2 is established, the contact terminal A11 and the contact terminal B12 are electrically connected via the spherical bumps 10, and the resistance between the external connection terminals A13 and 14 is short-circuited. It can be determined.

As a result, the electrical connection between the external connection terminals A13 and B14 means that the spherical bumps 10, the contact terminals A11 and the contact terminals B1 are connected.
2 is in contact.

Therefore, the spherical bump 10 and the contact terminal A1
1. Even if the contact terminal B12 is not visible from the outside, if the external connection terminal A13 and the external connection terminal B14 can be measured, the contact state of the spherical bump 10 with the contact terminal A11 and the contact terminal B12 is measured. It becomes possible to do.

In the present embodiment, the contact terminal A1
1 and contact terminal B12 are divided into two contact terminals, but any structure may be used as long as two or more contact terminals are in contact with the spherical bump 10.

In FIG. 1, the spherical bumps 10 are in contact with each other at the upper corners of the contact terminals A11 and B12 facing each other. However, the spherical bumps 10 may be in contact with a plurality of contact terminals. However, the shape of the contact terminal is not limited.

(Second Embodiment) FIG. 3 is a sectional view showing a contact structure in contact with a spherical bump according to a second embodiment of the present invention.

In FIG. 3, reference numeral 31 denotes a board connecting terminal connected to the board wiring 33, which is electrically connected to the contact terminal A11 and is electrically connected to the board wiring 33 formed inside the electronic board 34. It The board wiring 33 is formed parallel to the board surface, and the contact terminal A11 is formed perpendicular to the board surface.

On the other hand, 32 is a measuring terminal, which is a contact terminal B
It is electrically connected to the wiring 12, and is installed at a position away from the board wiring 33. The measurement terminal 32 is a contact terminal B12.
Since it suffices to secure the electrical connection with the contact point, it is possible to reduce the additional capacitance to the spherical bump 10 by removing it from the contact terminal B12 except during measurement.

In FIG. 3, the installation angle of the board wiring 33 is set at a right angle to the contact terminal A11, but the installation position and the installation angle are not specified in the present invention.

(Embodiment 3) FIG. 4 shows a contact structure with a spherical bump according to Embodiment 3 of the present invention. In a substrate on which an LSI having a spherical bump-shaped terminal is mounted, the contact of Embodiments 1 and 2 above. A mounting board having a structure, which is used when mounting a spherical bump on an electronic board.

In FIG. 4, 40 is an electronic substrate, 41, 4
Reference numeral 2 denotes a contact terminal C and a contact terminal D that come into contact with the spherical bump 10. 43 is the wiring inside the substrate, 44 is the contact terminal C41
And a component mounting terminal electrically connected to the substrate via the wiring 43 in the board.

On the other hand, reference numeral 46 is a measuring terminal which is electrically connected to the contact terminal D42 through the wiring 45 in the substrate.
47 is an insulating material. Reference numeral 48 is a solder connection portion A that realizes electrical connection between the spherical bump 10 and the in-board wiring 43.
Reference numeral 49 is a solder connection portion B that realizes electrical connection between the spherical bump 10 and the contact terminal D42. Since the spherical bump 10 is conductive, an electrical connection from the component mounting terminal 44 to the measuring terminal 46 is formed in FIG. 4, but it is determined whether or not this electrical connection state is maintained. It can be determined by confirming the continuity between 44 and the measuring terminal 46.

FIG. 4 is a view showing a case where the positional relationship between the spherical bumps 10 and the electronic substrate 40 is appropriate and the solder connecting portions A48 and B49 are normally formed.
In FIG. 5, since the positions of the spherical bump 10 and the electronic substrate 40 are too far apart, the solder connection portion B49 realizes the electrical connection between the spherical bump 10 and the contact terminal D42. This shows that the bump 10 and the contact terminal C41 are not electrically connected.

As shown in FIG. 5, it is possible to measure that there is no electrical conduction between the component mounting terminal 44 and the measuring terminal 46, and from the above measurement, the mounting of the spherical bump 10 and the electronic substrate 40 has failed. I can tell things.

[0028]

According to the present invention, the contact portion to the spherical bump is brought into contact with a plurality of electrically separated contact terminals,
It is advantageous that the contact state and the electrical connection state between the spherical bump and the contact terminal can be measured from the outside, and error analysis in device function measurement and cause analysis such as device failure can be reliably performed at low cost. Can be obtained.

[Brief description of drawings]

FIG. 1 is a sectional view showing a contact structure with a spherical bump according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing a contact state of a contact structure with a spherical bump according to the first embodiment.

FIG. 3 is a cross-sectional view showing a contact structure in contact with a spherical bump according to the second embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a case where a contact structure with a spherical bump according to Embodiment 3 of the present invention is mounted at an appropriate position.

FIG. 5 is a cross-sectional view showing a case where a contact structure with a spherical bump is mounted at an inappropriate position in Embodiment 3 of the present invention.

[Explanation of symbols]

10 Spherical bump 11 Contact terminal A 12 Contact terminal B 13 External connection terminal A 14 External connection terminal B 15 electrode terminals 31 PCB connection terminal 32 measuring terminals 33 board wiring 34 Electronic board 40 electronic board 41 Contact terminal C 42 Contact terminal D 43 In-board wiring 44 Component mounting terminal 45 In-board wiring 46 measuring terminals 47 insulating material 48 Solder connection part A 49 Solder connection part B

Claims (6)

[Claims] 1. A contact structure of a contact terminal for contacting a spherical bump, wherein each contact terminal is electrically separated from an electrode terminal in which two or more contact terminals contact one spherical bump. A contact structure with a spherical bump, which is characterized in that 2. Contact terminals that are in contact with one spherical bump and are electrically separated, and external connection terminals that are electrically connected to the outside at respective independent positions while electrically separating the contact terminals. A contact structure comprising: 3. The contact structure according to claim 2, wherein one of the external connection terminals is a terminal connected to a substrate, and the other is a terminal used for measurement. 4. An external connection terminal for contacting one spherical bump and electrically connecting each electrically isolated contact terminal to the outside at an electrically isolated position. A contact confirmation method between a spherical bump and a contact terminal, which comprises confirming contact between the spherical bump and the contact terminal by measuring a resistance value between the external connection terminals. 5. A mounting substrate having a contact structure according to claim 1, which is a substrate on which an LSI having spherical bump-shaped terminals is mounted. 6. The spherical bump and each of the contact terminals are measured by measuring the electrical resistance between a plurality of electrically separated contact terminals that are in contact with one spherical bump and the connection terminals that are electrically connected to each other. A method for determining an electrical connection state of a contact structure, which comprises determining an electrical connection state.