JP2003121484A - Temperature characteristic measuring jig for electronic part, temperature characteristic measuring device with it, and temperature characteristic measuring method for electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain high reliability for a measurement result of temperature characteristics of an electronic part such as a quartz resonator. SOLUTION: The quartz resonator 10 to be measured and a reference resonator 11 are housed inside a chamber A. A temperature inside the chamber A is set to a predetermined temperature by means of a Pelitier element 6. When a frequency deviation of the reference resonator 11 matching the predetermined temperature is attained, a switching unit 8 is switched for carrying out measuring operation of a resonance frequency on the quartz resonator 10, and a measurement result is outputted to a network analyzer 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention comprises a temperature characteristic measuring jig used for measuring a characteristic change of an electronic component represented by a crystal oscillator or the like due to an environmental temperature change, and a measuring jig thereof. The present invention relates to a temperature characteristic measuring device and a temperature characteristic measuring method for electronic components. In particular, the present invention relates to measures for improving the accuracy of temperature characteristic measurement.

[0002]

2. Description of the Related Art Conventionally, it has been necessary to know in advance how electronic parts such as a crystal oscillator change their characteristics due to temperature changes in the operating environment. For example,
In the case of a crystal unit, the resonance frequency and CI (Crystal Impedance) change according to changes in the ambient temperature.
It is necessary to measure the resonance frequency and CI at various environmental temperatures in advance.

Heretofore, a large temperature characteristic measuring apparatus has been used as an apparatus for measuring the frequency temperature characteristic of the crystal unit. In this type of measuring device, in the measurement temperature range (for example, in the range of -20 ° C to 70 ° C), first, the resonance frequency of the crystal unit is measured with the temperature inside the measurement chamber set to -20 ° C, and then, The temperature in the measuring room is 2deg
The resonance frequency is measured under each temperature environment while increasing the temperature.

However, in the measuring method using this type of temperature characteristic measuring device, the time required to complete the measurement of the resonance frequency over the entire preset measuring temperature range becomes long (for example, 8 hours). If it is necessary to know the measurement result of the temperature characteristics at an early stage, such as the stage of trial manufacture of a crystal unit, it is not possible to meet the demand.

Therefore, the following method is used as a measuring method for obtaining the measurement result of the temperature characteristic at an early stage.
That is, a measurement jig on which the crystal oscillator to be measured can be installed is connected to the network analyzer via the π jig. Then, a crystal oscillator is installed on the measurement jig, and a cooling gas such as carbon dioxide gas or nitrogen gas is sprayed on the crystal oscillator,
The frequency characteristics displayed on the network analyzer are read while changing the environmental temperature around the crystal unit by blowing hot air onto the crystal unit.
According to this, the crystal unit can be rapidly cooled and rapidly heated, and the environmental temperature around the crystal unit can be changed within the measurement temperature range in a short time, and the measurement result of the temperature characteristic can be known at an early stage. It becomes possible.

Further, instead of blowing the cooling gas onto the crystal unit, the crystal unit is placed in a cooling box containing dry ice or the like for a predetermined time to cool, and the crystal unit is removed from the cooling box. After taking it out, install it on the measuring jig,
It is also practiced to read the frequency characteristic displayed on the network analyzer while heating the crystal oscillator by blowing warm air.

[0007]

However, in each of the above methods that enable the measurement result of the temperature characteristic to be known at an early stage, the network analyzer can be used without accurately measuring the ambient temperature around the crystal unit. Since the displayed frequency characteristic is read, it was impossible to measure the temperature characteristic with high accuracy.

That is, for example, in the former method, the time for blowing the cooling gas to the crystal unit is set, the temperature of the crystal unit after the end of the blowing is predicted, and the temperature characteristic measurement is started from this state. After that, hot air is blown to the crystal oscillator, and the frequency characteristic is measured every predetermined time, assuming that the blowing time of the hot air and the temperature rise of the crystal oscillator are in a proportional relationship. In other words, since it is a method of measuring the temperature characteristic without grasping the environmental temperature of the crystal unit, it cannot be said that the measurement result has high reliability.

The present invention has been made in view of the above points, and an object of the present invention is to provide a highly reliable measurement result of temperature characteristics of electronic parts such as a crystal resonator. is there.

[0010]

SUMMARY OF THE INVENTION In order to achieve the above-mentioned object, the present invention uses an object placed under the same environment as an electronic component to be measured to measure the environment of the measurement space. The temperature is recognized, and the temperature characteristic of the electronic component, which is the measurement target, is measured based on the environmental temperature obtained thereby.

-Solution Means-Specifically, it is premised on a measuring jig used for measuring a characteristic change of an electronic component due to a change in environmental temperature. A measurement space for accommodating the measurement target electronic component, a temperature adjusting means capable of arbitrarily adjusting the temperature in the measurement space, and a storage space similar to the measurement target electronic component in the measurement space. A reference electronic component that is placed in a state and whose characteristics change according to the ambient temperature is provided. Then, the characteristic of the reference electronic component is measured, the environmental temperature corresponding to the characteristic that is the measurement result is recognized as the environmental temperature of the measurement target electronic component, and the characteristic measurement of the measurement target electronic component is performed in association with the recognized environmental temperature. Is configured to perform the action.

As another means for solving the problems, a measuring space for accommodating the electronic component to be measured, a temperature adjusting means capable of arbitrarily adjusting the temperature in the measuring space, and an electronic component to be measured in the measuring space are provided. It is equipped with a reference electronic component that is placed in the same accommodation state as that for measuring the temperature in the measurement space,
Based on the temperature measurement result by the reference electronic component, the characteristic measuring operation of the measurement target electronic component is executed in association with the environmental temperature.

By these specific items, it is possible to measure the temperature in the measurement space, that is, the environmental temperature of the measurement target electronic component with high accuracy while measuring the temperature characteristic of the measurement target electronic component. In particular, in the former configuration, by adopting the reference electronic component whose characteristics change according to the ambient temperature, the ambient temperature is recognized without directly measuring the temperature in the measurement space. For this reason, by adopting the reference electronic component having a high trackability of the characteristic change with respect to the temperature change, it becomes possible to measure the temperature characteristic of the electronic component to be measured with high accuracy.

The following are examples of the configuration for performing a specific measurement operation. That is, an output line is provided, and the characteristic measurement result of the reference electronic component is output to the output line until the environmental temperature of the measurement target electronic component reaches the measurement execution temperature, while the measurement target electronic component is output according to the characteristic measurement result of the reference electronic component. An output switching means for outputting the characteristic measurement result of the measurement target electronic component to the output line when it is determined that the environmental temperature has reached the measurement execution temperature. According to this, the output line of the characteristic measurement result of the reference electronic component and the output line of the characteristic measurement result of the measurement target electronic component can be shared, and the circuit configuration can be simplified.

When the electronic component to be measured is a crystal vibrating device and the reference electronic component is also a crystal vibrating device of the same type as the electronic component to be measured, the temperature in the measurement space can be determined by recognizing the frequency deviation of the reference electronic component. It is possible to measure with high accuracy, and it is possible to measure the temperature characteristics of the electronic component to be measured with extremely high accuracy.

Further, in this case, the quartz crystal vibration device used as the reference electronic component has a frequency deviation uniquely determined with respect to the environmental temperature, and the variation of the frequency deviation with respect to the variation of the environmental temperature is " It is desirable to have a characteristic larger than the amount of change of the quartz crystal vibrating device having the characteristic of “zero frequency temperature coefficient”. The crystal vibrating device having the characteristic of "zero frequency temperature coefficient" here has a characteristic that the variation of the frequency deviation with respect to the variation of the environmental temperature becomes extremely small near a certain temperature (for example, 25 ° C). Yes, the temperature coefficient when the characteristic is expressed by a mathematical expression is “0”. An AT-cut crystal resonator or the like is generally used that has this characteristic. As in the present solution, by adopting the reference electronic component having a large variation amount of the frequency deviation with respect to the variation amount of the environmental temperature, it is possible to measure the temperature in the measurement space with high accuracy by measuring the frequency deviation of the reference electronic component. You can do it.

When a Peltier element is used as the temperature adjusting means, the temperature in the measurement space can be easily set to an arbitrary value, and the heating source and the cooling heat source can be downsized, which is a cure. It is possible to reduce the size of the entire tool. Further, since the environmental temperature can be lowered without using a cooling gas as in the conventional case, the cost can be reduced.

A temperature characteristic measuring device constructed by connecting an output means for outputting the measurement result to the temperature characteristic measuring jig described above is also within the scope of the technical idea of the present invention. In particular,
When a network analyzer is used as this output means, it becomes possible to continuously monitor the state of change in the resonance characteristics of the measurement target electronic component due to temperature change.
For example, it is possible to continuously monitor the state of spurious generation and its change when measuring the resonance frequency of the crystal vibrating device. Also, by repeating the operation of storing the resonance waveform measured by the network analyzer for each predetermined temperature as numerical data in the vicinity of the temperature point to be measured, the continuous change of the resonance waveform due to the temperature change can be seen. You can record and check. This makes it possible to obtain effective data when specifying the failure mode and the like.

The temperature characteristic measuring method executed by the temperature characteristic measuring jig and the temperature characteristic measuring device is also within the scope of the technical idea of the present invention.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, a case where a crystal oscillator is applied as an electronic component whose temperature characteristic is measured will be described. That is, a case will be described in which the present invention is applied as a jig and a device for measuring how the resonance frequency of the crystal unit changes according to the ambient temperature.

(First Embodiment) -Description of Configuration of Temperature Characteristic Measuring Apparatus-FIG. 1 is a diagram showing a schematic configuration of a temperature characteristic measuring apparatus 1 according to the present embodiment. As shown in this figure, the temperature characteristic measuring device 1 includes a temperature characteristic measuring jig 2 and a temperature characteristic measuring jig 2
And a network analyzer 3 as output means connected to the. The temperature characteristic measuring jig 2 will be described below.

The temperature characteristic measuring jig 2 is a jig base 4 on which both the crystal oscillator 10 to be measured and a reference oscillator 11 described later can be placed, and a chamber (measurement An openable / closable cover 5 that constitutes a space A, a Peltier element 6 as a temperature adjusting means that is in close contact with the upper surface of the cover 5, and a heat sink 7 that is in close contact with the upper surface of the Peltier element 6.

The jig base 4 has a flat plate shape, and has a first concave portion 41 for mounting the crystal resonator 10 as an electronic component to be measured and a reference oscillator 11 as a reference electronic component on the upper surface thereof. Second recesses 42 for mounting are formed respectively. Further, in a state where the crystal oscillator 10 and the reference oscillator 11 are mounted on the jig base 4, the oscillator 10 and 11 penetrate in the base thickness direction at positions corresponding to external terminals (not shown). Through holes 43 and 44 are formed. Then, the first and second contact probes 45, 46 capable of contacting the external terminals of the vibrators 10, 11 are inserted through the through holes 43, 44. Here, those facing the first recess 41 are referred to as first contact probes 45, 45, and those facing the second recess 42 are referred to as second contact probes 46, 46.

The cover 5 is a hat-shaped member made of thin plate aluminum and has a hat-shaped cross section. When the cover 5 is attached to the jig base 4, the entire periphery of the outer peripheral edge portion 51 is the jig base 4. The chamber A, which is in close contact with the jig base 4 and constitutes the closed space, is formed. Further, the height dimension of the cover 5 is such that
The distance between the bottom surface of 2 and the top surface of the cover 5 is the vibrator 10,
It is set to match the height dimension of 11. That is, by mounting the cover 5 on the jig base 4 with the vibrators 10 and 11 placed on the jig base 4, the cover 5 and the upper surfaces of the vibrators 10 and 11 are in close contact with each other. There is. As a structure for attaching the cover 5 to the jig base 4, bolting or other fastening means is adopted. Moreover, as a constituent material of the cover 5,
The material is not limited to aluminum as long as it has a high thermal conductivity, and copper or the like can be used. By adopting such a material, it becomes possible to quickly and uniformly transfer the hot or cold heat from the Peltier element 6 into the chamber A.

Although not shown, the Peltier element 6 is formed by sandwiching a semiconductor between a pair of metal plates, and is constructed so that heat is absorbed on one surface and heat is generated on the other surface when a current is applied. It is a thing. Then, the heat absorption surface and the heat generation surface can be switched by switching the direction of the electric current, which makes it possible to switch cooling and heating inside the chamber A through the cover 5. The relationship between the applied voltage to the Peltier element 6 and the temperature difference generated on the front and back surfaces is, for example, by adjusting the applied voltage in the range of 0 to 15 V, so that the temperature difference generated on the front and back surfaces is within the range of 0 to 90 deg. It can be set to a desired value. Thereby, the temperature in the chamber A can be set to an arbitrary value within the range of -20 ° C to + 70 ° C.

The heat sink 7 is for promoting heat dissipation on the upper surface side of the Peltier element 6, and substantially the entire lower surface of the heat sink is in close contact with the entire upper surface of the Peltier element 6, and the upper surface of the heat sink is A plurality of radiating fins 71, 71, ... Are formed.

Next, the connection state between the temperature characteristic measuring jig 2 and the network analyzer 3 configured as described above will be described. The first contact probes 45, 45 facing the first recess 41 of the temperature characteristic measuring jig 2 and the second contact probes 46, 46 facing the second recess 42 are connected to the network analyzer 3 via the switching unit 8 as an output switching means. It is connected. This switching unit 8 connects the first contact probes 45, 45 to the network analyzer 3 as shown by the broken line in the figure, and connects the second contact probes 46, 46 to the network analyzer 3 as shown by the solid line in the figure. It is possible to switch between the state of turning on and the state of turning on. Due to this switching operation, in the former case, the crystal resonator 10 to be measured is
While the frequency characteristic of 1 is displayed on the network analyzer 3, the frequency characteristic of the reference oscillator 11 is displayed on the network analyzer 3 in the latter case.

Next, the reference oscillator 11 will be described. In the present embodiment, the crystal oscillator 10 that is the measurement target is A
In the case of a T-cut crystal oscillator, an AT-cut crystal oscillator is also used as this reference oscillator 11. Further, the reference oscillator 11 includes a package of the same material and the same shape as the package of the crystal oscillator 10 to be measured. As the reference oscillator 11, one having the following frequency-temperature characteristic is adopted. A commonly used AT-cut crystal unit has an environment near a certain temperature (25 ° C. in FIG. 2) as shown by a broken line in FIG. 2 (a diagram showing the relationship between environmental temperature and frequency deviation). A characteristic is used in which the amount of change in frequency deviation with respect to the amount of change in temperature is small. This is because when used near this temperature, fluctuations in frequency deviation are suppressed even if the environmental temperature changes to some extent, and the crystal resonator maintains stable performance. On the other hand, in the AT-cut crystal unit used as the reference oscillator 11, as shown by the solid line in FIG. AT
It has a characteristic that it is larger than the cut crystal unit. In other words, the value of the frequency deviation and the value of the environmental temperature uniquely correspond to each other with high accuracy. The characteristics of the general AT-cut crystal resonator described above have a temperature coefficient of "0" when this characteristic is expressed by a mathematical expression, and are generally called "zero frequency temperature coefficient" characteristics. . On the other hand, the reference oscillator 1
The AT-cut crystal unit adopted as No. 1 uses a crystal unit having a cutting angle different from that of the crystal unit used in the general AT-cut crystal unit, and has a frequency deviation with respect to temperature. Has a characteristic that is uniquely determined, and is called a characteristic rotated counterclockwise (or CCW direction) with respect to a vibrator having a characteristic of zero frequency temperature coefficient.

By adopting such a reference oscillator 11, the temperature inside the chamber A can be measured with high accuracy by measuring the frequency deviation of the reference oscillator 11.

As described above, the reference oscillator 11 is preferably of the same type as the crystal oscillator 10 to be measured (all of the above are AT-cut crystal oscillators), but different types. It may be a crystal oscillator.
For example, while the crystal oscillator 10 to be measured is an AT cut crystal oscillator, a tuning fork type crystal oscillator or a BT cut crystal oscillator may be adopted as the reference oscillator 11. These vibrators have a second-order temperature characteristic as shown in FIG. In this case, if the vertex of the quadratic curve shown by the broken line in the figure is set to about 25 ° C., the value of the frequency deviation and the value of the environmental temperature cannot be uniquely associated with each other within the measured temperature range. . Therefore, when adopting these oscillators as the reference oscillator 11, the vertex of the quadratic curve in the figure is set to a significantly high value or a significantly low value,
It is preferable that the value of the frequency deviation and the value of the environmental temperature can be uniquely associated with each other within the above measurement temperature range (the peak is set to 70 ° C. in the quadratic curve shown by the solid line in the figure). ing). This can be easily obtained by appropriately setting the cutting angle of the crystal piece.

-Explanation of Measuring Operation by Temperature Characteristic Measuring Device 1- Next, the measuring operation of the frequency temperature characteristic of the crystal unit 10 by the temperature characteristic measuring device 1 constructed as described above will be explained. In this embodiment, the measurement temperature range is −20 ° C. to +70.
A case will be described in which the measurement of the frequency-temperature characteristic is started after the temperature is set to be 0 ° C. and the chamber temperature is set to −20 ° C., and the frequency-temperature characteristic of the crystal resonator 10 is sequentially measured up to + 70 ° C. every 2 deg.

First, the cover 5 is removed from the jig base 4 to open the inner space of the chamber A, and the vibrators 10 and 1 described above are opened.
1 is placed in each recess 41, 42. After this placement, the cover 5 is attached to the jig base 4 to make the chamber A a closed space. Further, the switching unit 8 includes the second contact probe 46, as shown by the solid line in FIG.
46 is connected to the network analyzer 3,
The frequency characteristic of the reference oscillator 11 is displayed on the network analyzer 3.

From this state, the Peltier element 6 is energized so that its lower surface performs a heat absorbing operation and its upper surface performs a heat radiating operation. As a result, the space inside the chamber A is cooled. In this case, the voltage applied to the Peltier device 6 has a value such that the lower surface temperature is −20 ° C. The resonance frequency of the reference oscillator 11 changes with the cooling operation. The state of this change is displayed on the network analyzer 3.

Then, when the frequency deviation of the reference oscillator 11 coincides with the value at the ambient temperature of -20 ° C., the measurement of the frequency temperature characteristic is started. That is, the switching unit 8 is brought into a state in which the first contact probes 45, 45 are connected to the network analyzer 3, as shown by the broken line in FIG. 1, and the frequency characteristic of the crystal oscillator 10 to be measured is displayed on the network analyzer 3. To be done. Then, this state is stored in the storage device of the network analyzer 3 or output.

Thereafter, the switching unit 8 is switched again as shown by the solid line in FIG.
A voltage of 18 ° C. is applied to the Peltier device 6. As a result, the temperature of the space inside the chamber A rises, and the resonance frequency of the reference oscillator 11 changes accordingly. The state of this change is displayed on the network analyzer 3.

Then, when the frequency deviation of the reference oscillator 11 coincides with the value at the ambient temperature of -18 ° C., the switching unit 8 is switched to the state shown by the broken line in FIG.
The frequency characteristic of the crystal resonator 10 to be measured is displayed on the network analyzer 3, and this state is stored or output in the storage device of the network analyzer 3.

After that, the switching unit 8 is switched again as shown by the solid line in FIG. 1, and the voltage at which the lower surface temperature becomes −16 ° C. is applied to the Peltier element 6.

The measurement of the frequency deviation of the reference oscillator 11 and the measurement of the frequency characteristic of the crystal oscillator 10 due to the switching of the applied voltage to the Peltier element 6 are alternately performed, and the temperature in the chamber A is +70. Chamber A up to ℃
The frequency characteristic of the crystal resonator 10 is measured every 2 deg while gradually increasing the internal environmental temperature. When the environmental temperature in the chamber A is raised to room temperature or higher, the lower surface of the Peltier element 6 performs the heat radiation operation and the upper surface thereof performs the heat absorption operation. And the crystal oscillator 10 at + 70 ° C
When the measurement of the frequency characteristic is completed, the power supply to the Peltier element 6 is stopped, the cover 5 is opened, the crystal oscillator 10 is taken out from the chamber A, and the measurement operation of the frequency temperature characteristic is completed.

-Effect of Embodiment-As described above, in the present embodiment, the reference oscillator 11 is housed in the chamber A, and the crystal vibration to be measured is recognized by recognizing this characteristic (frequency deviation). The ambient temperature of the child 10 is recognized. Therefore, the resonance frequency can be measured while accurately recognizing the ambient temperature, and the reliability of the resonance frequency measurement result can be obtained. Particularly, in the present embodiment, the reference oscillator 11 is replaced by the crystal oscillator 1
Since it is adopted as the same type as 0, it is possible to measure the resonance frequency of the crystal resonator 10 with higher accuracy. In particular, by accurately measuring the characteristics of the reference oscillator 11 in advance, it is possible to obtain an accurate measurement result without requiring calibration of the measurement result.

Further, according to the circuit configuration of the present embodiment, it is possible to measure the resonance frequency with the same additional capacitance provided on the output line of the temperature characteristic measuring jig 2. That is,
It is possible to accurately measure the resonance frequency in the mounted state of the crystal unit 10.

(Second Embodiment) Next, a second embodiment will be described. In this embodiment, a pseudo electronic component 12 is provided instead of the reference oscillator 11. Therefore, only the differences from the first embodiment will be described here.

FIG. 4 is a diagram showing a schematic configuration of the temperature characteristic measuring apparatus 1 according to this embodiment. As shown in this figure, the temperature characteristic measuring apparatus 1 includes a pseudo electronic component 12 instead of the reference oscillator 11. The pseudo electronic component 12 includes a package of the same material and the same shape as the package of the crystal resonator 10 to be measured, and the temperature sensor 13 such as a thermocouple is housed in the package. The output line of the temperature sensor 13 is connected to the network analyzer 3 through a small-diameter through hole formed in the bottom plate of the package and the jig base 4.
That is, in the present embodiment, the frequency characteristic of the crystal unit 10 is measured while constantly monitoring the temperature inside the package of the pseudo electronic component 12.

As an explanation of the measuring operation by the temperature characteristic measuring apparatus 1 of the present embodiment, first, the temperature inside the chamber A is set to -20 ° C. as in the case of the first embodiment. The temperature is monitored by the temperature sensor 13 housed in the pseudo electronic component 12. That is, the measurement of the frequency-temperature characteristic of the crystal unit 10 is started from the time when the temperature detected by the temperature sensor 13 reaches -20 ° C. After starting this measurement,
Each time the temperature detected by the temperature sensor 13 rises by 2 deg, the frequency temperature characteristic of the crystal unit 10 is measured, and this measurement operation is sequentially performed until the temperature detected by the temperature sensor 13 reaches + 70 ° C.

According to this embodiment, the ambient temperature is measured by the temperature sensor 13 placed in the same environment as the crystal inside the crystal oscillator 10, so that the ambient temperature of the crystal oscillator 10 can be accurately recognized. However, the resonance frequency can be measured, and the resonance frequency measurement result can be highly reliable.

-Other Embodiments- In each of the above-described embodiments, the case where the crystal unit is applied as the electronic component whose temperature characteristic is to be measured has been described. The present invention is not limited to this, and can be applied to measurement of temperature characteristics of various electronic components such as a crystal filter and an IC.

Further, the crystal unit 1 associated with the change in environmental temperature
I tried to measure the change of the resonance frequency of 0, but C
You may make it measure I (crystal impedance).

Further, in each of the above embodiments, the temperature characteristic is measured while the chamber temperature is once lowered to the lower limit value of the measurement temperature range and then the chamber temperature is increased. The temperature characteristics may be measured while the temperature inside the chamber is lowered after the temperature inside the chamber is once raised to the upper limit value of the measurement temperature range. Further, in order to further improve the accuracy of the temperature characteristic measurement, it is preferable to measure the temperature characteristic by both of these operations. The measurement temperature range is not limited to the above range.

Further, although the Peltier element 6 is used as the means for adjusting the temperature in the chamber, the present invention is not limited to this, and it is possible to provide an individual cold heat source and a warm heat source, depending on the respective operations. You may make it adjust the temperature in a chamber. However, it is most preferable to adopt the Peltier element 6 in order to reduce the size of the entire apparatus.

Further, in the above-mentioned first embodiment, the connection state of each vibrator 10, 11 is switched by the switching unit 8 for one network analyzer 3, but each vibrator 10, 11 is connected. A separate network analyzer may be connected. According to this, it becomes possible to constantly monitor the resonance frequency of the crystal unit 10.

[0050]

As described above, according to the present invention, the reference electronic component for environmental temperature recognition is provided separately from the electronic component to be measured, so that the environmental temperature of the electronic component to be measured can be measured with high accuracy. However, the temperature characteristic of the electronic component to be measured can be measured. As a result, the reliability of the temperature characteristic measurement result of the measurement target electronic component can be improved.

Further, by providing the output switching means, it is possible to switch between a state in which the characteristic measurement result of the reference electronic component is output to the output line and a state in which the characteristic measurement result of the measurement target electronic component is output to the output line. In this case, the output lines can be shared, and the practicality of the jig can be improved with the simplification of the circuit configuration.

In the case where the measurement target electronic component is a crystal vibrating device and the reference electronic component is a crystal vibrating device of the same type as the measurement target electronic component, the frequency deviation of the reference electronic component with respect to the amount of change in environmental temperature is If the amount of change is greater than that of the zero-frequency temperature coefficient, the temperature in the measurement space can be measured with high accuracy by measuring the frequency deviation of the reference electronic components. Therefore, it is possible to obtain a highly reliable temperature characteristic measurement result.

Further, when the Peltier element is adopted as the temperature adjusting means, the temperature in the measurement space can be easily set to an arbitrary value, and the heating source and the cooling heat source can be downsized. The overall size of the jig can be reduced. Further, since the environmental temperature can be lowered without using a cooling gas as in the conventional case, the cost can be reduced.

[Brief description of drawings]

FIG. 1 is a diagram showing a schematic configuration of a temperature characteristic measuring device according to a first embodiment.

FIG. 2 is a graph showing the relationship between the environmental temperature and the frequency deviation in an AT-cut crystal unit, in which the characteristic of a general AT-cut crystal unit is indicated by a broken line, and the AT-cut crystal unit used as a reference unit. It is a figure which shows the characteristic of each child by a solid line.

FIG. 3 is a diagram showing a relationship between an environmental temperature and a frequency deviation in a tuning fork type crystal resonator, showing a characteristic of a general tuning fork type crystal resonator with a broken line, and a tuning fork type crystal vibration adopted as a reference resonator. It is a figure which shows the characteristic of each child by a solid line.

FIG. 4 is a diagram showing a schematic configuration of a temperature characteristic measuring device according to a second embodiment.

[Explanation of symbols]

1 Temperature characteristic measuring device 2 Temperature characteristic measurement jig 6 Peltier element (temperature control means) 8 Switching unit (output switching means) 10 Crystal unit (measurement target electronic component) 11 Reference oscillator (reference electronic component) 12 Pseudo electronic parts (standard electronic parts) A chamber (measurement space)

Claims (8)

[Claims] 1. A measuring jig used to measure a characteristic change of an electronic component due to a change in environmental temperature, the measuring space for accommodating an electronic component to be measured, and the temperature in the measuring space. And a reference electronic component that is placed in the same storage state as the measurement target electronic component in the measurement space and has a characteristic that changes in accordance with the ambient temperature in the measurement space. Measures the characteristics of electronic components, recognizes the ambient temperature corresponding to the measured characteristics as the ambient temperature of the measurement target electronic component, and executes the characteristic measurement operation of the measurement target electronic component in association with the recognized ambient temperature. A jig for measuring temperature characteristics of electronic parts, which is configured to 2. A measuring jig used to measure a characteristic change of an electronic component due to a change in environmental temperature, the measuring space for accommodating an electronic component to be measured, and the temperature in the measuring space. And a reference electronic component for measuring the temperature in the measurement space by being placed in the same accommodation state as the electronic component to be measured in the measurement space, A temperature characteristic measuring jig for an electronic component, which is configured to perform a characteristic measuring operation of an electronic component to be measured based on a temperature measurement result in association with an ambient temperature. 3. The temperature characteristic measuring jig for an electronic component according to claim 1, further comprising an output line, wherein the characteristic measurement result of the reference electronic component is output line until the environmental temperature of the electronic component to be measured reaches the measurement execution temperature. On the other hand, output switching means for outputting the characteristic measurement result of the measurement target electronic component to the output line when it is determined that the environmental temperature of the measurement target electronic component has reached the measurement execution temperature based on the characteristic measurement result of the reference electronic component A jig for measuring temperature characteristics of electronic parts, which is characterized by being provided. 4. The jig for measuring temperature characteristics of an electronic component according to claim 1 or 3, wherein the electronic component to be measured is a crystal vibrating device, and the reference electronic component is also a crystal vibrating device of the same kind as the electronic component to be measured. A jig for measuring temperature characteristics of electronic parts, which is characterized in that 5. The jig for measuring temperature characteristics of an electronic component according to claim 4, wherein the crystal vibration device used as the reference electronic component has a frequency deviation uniquely determined with respect to the ambient temperature, and The temperature characteristic measurement method for electronic parts is characterized in that the variation amount of the frequency deviation with respect to the variation amount of the temperature is larger than that of the crystal vibrating device having the characteristic of "zero frequency temperature coefficient". Ingredient 6. The temperature characteristic measuring jig for an electronic component according to claim 1, wherein the temperature adjusting means is a Peltier element. . 7. The temperature characteristic measuring jig for an electronic component according to claim 1, wherein an output means for outputting the measurement result is connected. A characteristic temperature measuring device for electronic parts. 8. An electronic component temperature characteristic measuring jig according to any one of claims 1 to 6 or an electronic component temperature characteristic measuring device according to claim 7. Measuring method for temperature characteristics of electronic parts.