JP2003121123A - Precision shape measuring method using laser beam - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a precision shape measuring method using a laser beam in which the laser beam can be irradiated precisely and easily at a prescribed part to be measured in an extremely small region so as to enhance its measurement accuracy. SOLUTION: A reference plate 1 is installed to be adjacent to a measuring object T, a slit S which is extended between the reference plate 1 and the measuring object T is formed, the thin and flat sheetlike laser beam L in a direction in which the slit S is extended is irradiated toward the part Q to be measured at the measuring object T on the slit S, and a diffraction pattern formed by the laser beam L passed through the slit S in the part Q to be measured is measured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention uses a laser beam for precisely measuring the shape of a cutting edge portion of a rotary tool such as a ball end mill, an end mill, or a twist drill as an object to be measured. The present invention relates to a precise shape measuring method.

[0002]

2. Description of the Related Art As a method for measuring the shape of the cutting edge portion of such a rotary tool, for example, in Japanese Patent Laid-Open No. 6-109440, laser light is scanned over a measured portion of the cutting edge portion to be shielded. It has been proposed to measure the size of the cutting edge portion by measuring the brightness of the laser light with a light receiving element, and JP-A-6-137842 discloses that
Using a tool microscope having a TV camera connected to the image processing device, a rotary tool is provided so that the positions of the cutting edges match the focal positions of the tool microscope at a plurality of measurement sites on the contour of the cutting edge. It has been proposed to measure the size and shape of the cutting edge portion by rotating around a rotation axis and measuring the coordinates thereof. However, in these measuring methods and devices, the measuring accuracy is limited by the resolution of the light receiving element or the TV camera, and thus it is difficult to perform more precise measuring.

On the other hand, for example, Japanese Unexamined Patent Publication No. 5-27292.
In Japanese Patent No. 5 publication, as a means for measuring the shape of the edge (cutting edge) of a cutting tool, a reference plate having an edge having a shape substantially corresponding to the shape of the cutting edge is provided, and a reference plate is provided between these edges. A method is proposed in which a narrow slit is formed, laser light is emitted from a laser light source to a measurement site on the slit to diffract it, and the diffraction pattern is measured by an optical sensor such as a CCD to perform arithmetic processing. ing. However, in such a diffraction pattern, since the distribution of the light intensity of the light and darkness thereof is determined by the size of the slit, in the measurement method and the measurement device described in the publication,
The slit width is changed in advance by one reference plate, and the light intensity and the slit width at each position in the slit width direction of the diffraction pattern are measured and input, and the edge of the bite to be measured using the same reference plate. Is measured to calculate the position of the bite edge with respect to the reference plate based on the input data.

[0004]

However, in the measuring method described in this publication (Japanese Patent Laid-Open No. 5-272925), when the laser light emitted from the laser light source is passed through the slit and diffracted, this slit is used. The laser light is applied so that a circular region is formed on the top. However, in the case of irradiating a laser beam so that a circular region is formed as described above, if the circular region irradiated with the laser beam is limited to be small so as to obtain a clear diffraction pattern, such an irradiation region is In order to accurately irradiate the narrow slit with a small laser beam, delicate adjustment that requires a high degree of skill is inevitable, and this adjustment work requires a lot of time and labor, and in some cases laser There is a possibility that the light may deviate from the measurement site in a predetermined manner and a diffraction pattern may not be obtained. On the other hand,
On the contrary, if the laser light is irradiated to a wide circular area that sufficiently covers the slit, the range of the laser light passing through the slit in the extending direction of the slit is also widened, and a predetermined target area is irradiated. It becomes difficult to accurately obtain the diffraction pattern at the measurement site.

The present invention has been made under such a background, and in a precision shape measuring method using such a laser beam, the laser beam can be reliably applied to a predetermined measurement site in an extremely small range, and further, The purpose is to make it possible to easily irradiate and to further improve the measurement accuracy.

[0006]

In order to solve the above problems and to achieve such an object, the present invention provides a reference plate adjacent to an object to be measured, and the reference plate and the object to be measured. By forming a slit extending between the object and the measurement site of the measurement object on the slit, by irradiating a thin flat sheet laser light in the direction in which the slit extends, the measurement target It is characterized in that a diffraction pattern formed by the laser light that has passed through the slit at the site is measured. That is, in the present invention,
Since the slit formed between the object to be measured and the reference plate is irradiated with thin flat sheet-like laser light so as to be crushed in the direction in which the slit extends, its diffraction pattern is measured, so this sheet By irradiating the slit-shaped laser light so that it crosses the slit, it is possible to reliably irradiate the narrow-width slit with the laser light and measure the diffraction pattern with certainty. It does not spread in the extending direction, and a clear diffraction pattern can be obtained at a predetermined measurement site.

Further, the object to be measured is disclosed in Japanese Patent Laid-Open No. 5-2.
It is not a simple shape in which the cutting edge to be measured is located on a plane like the bite of Japanese Patent No. 72925, but the above-mentioned Japanese Patent Laid-Open Nos. 6-109440 and 6-13784.
Even when the cutting edge is a rotary tool such as a ball end mill, an end mill, or a twist drill having a three-dimensionally complicated shape as in Japanese Patent Publication No. 2), in the present invention, the above-mentioned reference is provided adjacent to the cutting edge portion of this rotary tool. A plate is provided to form the slit so as to extend in the direction of the rotation axis of the rotary tool,
At the plurality of measurement sites on the slit, the laser beam is irradiated toward the measurement site while rotating the rotary tool around the rotation axis, and the diffraction according to the rotational position of the rotary tool is performed. By measuring the pattern,
It is possible to perform precise shape measurement even on a measurement object having such a complicated three-dimensional shape. That is, by measuring the diffraction pattern at the rotational position at the plurality of measurement sites on the slit while rotating the rotary tool in this way, the cross-sectional shape of the measurement object orthogonal to the rotation axis for each measurement site. Since it is possible to grasp the above, it is possible to accurately measure the overall shape of the cutting edge portion of the rotary tool, which is the measurement object, by making these measurement results continuous in the rotation axis direction.

Here, in order to measure the diffraction pattern, it is desirable to use a line sensor extending in the width direction of the sheet-shaped laser light. That is, for example, in JP-A-5-272925, a planar CCD area sensor is used as an optical sensor for measuring the diffraction pattern, but such an area sensor is expensive but its measurable range is small. For example, even if an attempt is made to fit a diffraction pattern into this small measurement range via a lens, measurement cannot be performed because the lens and the sensor are not accurately arranged, but the CCD cannot be measured. A line sensor having a large measuring range can be obtained at a relatively low cost, and thus a highly accurate measurement can be easily and inexpensively performed. Also,
The edge forming the slit facing the measured portion side of the reference plate is preferably formed in the shape of a knife edge having a tapered cross section toward the measured portion side,
This makes it possible to obtain a clearer diffraction pattern.

Further, if the width bx of the slit is too large, a clear diffraction pattern cannot be obtained, so it is desirable to set it to a small value, but if it is too small, the S / N ratio deteriorates, and the reference plate It becomes difficult to adjust the gap so as not to contact the measurement object.
Therefore, the width bx of the slit is 0.01 to 0.1 mm.
It is desirable to set to the range of. Then, as will be described later with reference to FIG. 6, the change rate of the distance R1 to the first bright ring of the diffraction pattern with respect to the change of the slit width bx is large, that is, the measurement resolution is high, and the gap adjustment of the slit width is easy. The width W of the sheet-shaped laser light may be larger than the slit width bx so that both ends in the width direction are shielded by the reference plate and the measurement object, that is, the width of the laser light. If is too small, one end in the width direction may not hit the reference plate or the object to be measured, and the diffraction pattern may become unclear, but on the other hand, if the width of this laser beam is too large, it is not suitable for measurement. It is not preferable because unnecessary laser light has to be emitted. Therefore, the laser beam width W is 2 times the slit width bx.
It is desirable to set the width within a range equal to or more than the width and less than or equal to the width dimension of the measured portion of the measurement object. This facilitates the work of determining the irradiation position of the laser light. Further, the smaller the thickness by of the sheet-shaped laser beam is, the more accurately the shape of the object to be measured can be measured, and in practice it is desirable to be set within the range of 0.005 to 0.1 mm.

[0010]

1 to 7 show an outline of a precision shape measuring apparatus using a laser beam according to an embodiment of the present invention. Hereinafter, the present invention will be described with reference to these drawings. An embodiment will be described. In the present embodiment, as the measuring object, a rotary tool T having a spiral groove for discharging chips formed on the outer periphery of the cutting edge portion such as a ball end mill, an end mill, or a twist drill is used, and the shape of this cutting edge portion is used. Is being measured. That is, as shown in FIGS. 1 to 3, the rotary tool T is rotatably supported around the rotation axis O while the rotation axis O is fixed, and the rotation position of the rotary tool T is the rotation of a rotary encoder or the like. The rotary tool T can be detected by the position detecting means.
Adjacent to the outer circumference of the reference plate 1 which is a thin rectangular flat plate
Is located on a plane P including the rotation axis O,
Further, the end edge 1a facing the rotary tool T side is fixedly provided so as to be parallel to the rotation axis O, and the rotation axis O is provided between the end edge 1a and the outer peripheral surface of the rotary tool T.
A slit S extending parallel to is formed. However,
2 and 3, the rotary tool T is shown in a simplified columnar shape. Further, the edge 1a of the reference plate 1 is gradually thinned as it goes toward the tip, that is, the rotary tool T side, and one side surface 1b thereof is inclined toward the other side surface 1c as shown in FIG. The cross section perpendicular to the rotation axis O is formed into a knife edge shape.

Further, the rotary tool T and the reference plate 1 are interposed between the CCD and the Fourier transform lens 2 on both sides of the reference plate 1 on the side surface 1b side.
The line sensor 3 also includes the other side surface 1 of the reference plate 1.
A shield plate 5 for limiting the measurement area is arranged on the c side through an imaging lens 4 for limiting the measurement area so as to be parallel to the plane P, and further outside the shield plate 5. Is provided with a laser light source (not shown) that emits laser light L perpendicular to the plane P. Then, in the shielding plate 5, an extremely elongated rectangular or substantially linear opening 5a which is thinly flattened so as to be collapsed in the direction in which the slit S extends.
Are formed so as to extend along a plane orthogonal to the rotation axis O, and by passing through the opening 5a, the laser light L is also flat and extremely flat in the direction in which the slit S extends. In the form of a sheet, as shown in FIG. 3, the measured position Q of the rotary tool T on the slit S is orthogonal to the slit S, and the both ends of the slit S are crossed over the reference plate 1. And a width W is irradiated through the imaging lens 4 so as to be blocked by the rotary tool T.

On the other hand, the line sensor 3 provided on the opposite side of the shielding plate 5 is on the optical axis C of the laser light L and is in the sheet width direction of the laser light L (see FIG. 1).
4 is arranged so as to extend in the vertical direction, in FIG. 2, the direction orthogonal to the drawing, and in FIG. 3, the horizontal direction), and the Fourier transform lens 2 is arranged in the optical axis C direction. The diffraction pattern of the laser beam L, which is arranged in the center between the line sensor 3 and the reference plate 1 and is diffracted after passing through the slit S, is obtained by the Fourier transform as shown in FIGS. It is formed so as to extend along the line sensor 3 via the lens 2.
The line sensor 3 and the Fourier transform lens 2, the laser light source, the shield plate 5, and the imaging lens 4 maintain the above-described positional relationship linear along the optical axis C and the slit S. Can be integrally moved along the extending direction, and the moving position can also be detected by a detecting means such as a linear encoder.

As shown in FIG. 4, the intensity distribution I (x) of the diffraction pattern in the x direction when the direction in which the line sensor 3 extends is defined as the x direction is determined by the slit S in the measured portion Q. Is defined as bx (the distance between the tip of the edge 1a of the reference plate 1 and the rotary tool T on the plane P), and the thickness of the sheet-shaped laser light L at the measured portion Q (the rotation axis of the laser light L). Thickness in O direction)
Let y be the distance between the Fourier transform lens 2 and the line sensor 3 and the reference plate 1, and let the wavelength of the laser light L be λ. Further, for example, the thickness by of the laser beam L at the measurement site Q is 80 μm.
m, the wavelength λ of the laser light L is 0.6328 μm, and the distance f between the Fourier transform lens 2 and the line sensor 3 and the reference plate 1 is 100.0 mm, the optical axis C, that is, the 0th order bright ring of the diffraction pattern. The relationship between the distance R1 from the peak to the peak of the first-order bright ring of the diffraction pattern and the width bx of the slit S is as shown in FIG.
The relationship between the change rate and the width bx with respect to the width bx is as shown in FIG.

[0014]

[Equation 1]

Therefore, in the measuring method of the present embodiment using the diffraction pattern of the laser beam L as described above, as the slit width bx becomes smaller as shown in FIGS. 5 and 6, the slit width bx becomes smaller. Both the change and the change rate of the distance R1 to the first bright ring with respect to the change become large. For example, when the slit width bx is 30 μm,
The change rate of the distance R1 is about 100 times the change of the slit width bx. Therefore, even if a CCD line sensor having a general 7 μm pixel is used as the line sensor 3, if the peak position of the primary bright ring can be accurately detected, measurement on the order of submicron (0.07 μm) is possible. It is possible to obtain the resolution, and it is possible to measure with higher accuracy. If the slit width bx becomes smaller, the amount of laser light becomes smaller, which is not preferable. Slit width b
When x is 0.1 mm, R1 has a rate of change of about 10 times, and with a slit width larger than this, the measurement resolution deteriorates, and a slit width of 0.01 to 0.1 mm is practically desirable.

In the measuring method of the present invention, the laser light L radiated to the measurement site Q of the slit S to obtain this diffraction pattern is a sheet-like laser light flat in the direction in which the slit S extends. L, the laser light L is wide in the direction in which the slit S extends in the vicinity of the measurement site Q.
With respect to the direction in which the slit S extends, the laser light L can be irradiated only within a very small range based on the thickness by of the sheet-shaped laser light L. On the other hand, in the direction orthogonal to the direction in which the slit S extends, that is, in the width direction of the sheet-shaped laser light L, both ends of the laser light L are the reference plate 1 and the measurement object as described above. A clear diffraction pattern can be obtained even if the laser beam L is radiated with a slight shift in the width direction as long as it is blocked by the rotary tool T. Therefore, according to the present invention, a predetermined measured object can be measured. The width bx of the slit S at the portion Q is measured extremely accurately to ensure more accurate measurement, but the skill, time, and labor required for fine adjustment during measurement are greatly reduced. Therefore, efficient measurement can be easily performed.

Further, in this embodiment, the rotary tool T, which is an object to be measured, is rotatable about its rotation axis O, and its rotational position can be detected, and the slit formed according to this rotational position. The diffraction pattern of the laser light L that has passed through S can be measured, and the laser light source, the lenses 2 and 4, the shield plate 5 and the line sensor 3 can be moved in the direction in which the slit S extends, and their moving positions can be measured. Can also be detected, and the diffraction pattern can be measured at a plurality of measurement sites Q ... In the direction in which the slit S extends. Therefore, even when the measuring object is the rotary tool T having a complicated three-dimensional shape as described above, first, the rotary tool T is rotated while detecting the rotational position, and the predetermined measured portion Q on the slit S is measured. By measuring the width bx of the slit S over the entire circumference, the cross-sectional shape of the rotary tool T orthogonal to the rotation axis O from the end edge 1a of the reference plate 1 through the measured portion Q is measured. The laser light source, the lenses 2, 4, the shielding plate 5, and the line sensor 3 are moved while detecting the movement position of such a cross section, and a plurality of sections are formed along the direction in which the slit S extends. By measuring at the measured portion Q, the shape and dimensions of the rotary tool T can be easily measured three-dimensionally and highly accurately as described above by using an arithmetic device such as a computer. It will be possible.

In FIG. 1 to FIG. 3, when measuring the shape of the outer peripheral side of the cutting edge of the rotary tool T such as a ball end mill or end mill, or a drill, the rectangular flat plate-shaped reference plate 1 is used. , The case where the straight edge 1a is arranged adjacent to the outer circumference of the cutting edge portion so that it is parallel to the rotation axis O of the rotary tool T,
When measuring the shape of the tip side portion of the cutting edge portion of these rotary tools T, for example, as shown in FIG. 7, a reference plate 11 having a shape corresponding to the tip side portion is used, and the reference plate 11 is used. And a cutting edge portion of the rotary tool T as a measurement object, a slit S extending from the tip side is formed, and a flat sheet shape is formed in a direction in which the slit S extends toward a measurement site Q on the slit S. The diffraction pattern may be measured by irradiating the laser light L.

Here, FIG. 7 shows a case of measuring the shape of the tip end side portion of the ball-end mill as a measurement object, which has a substantially hemispherical shape, and the end of the reference plate 11 having a flat plate shape. The edge 11a is formed in a concave semi-circular shape having a radius larger by the slit width bx than the hemisphere formed by the tip end side portion of the ball end mill, whereby the slit S also has a semi-circular shape concentric with the center of the hemisphere. Will be formed. Further, the sheet-shaped laser light L is
Irradiation is applied to the plurality of measurement sites Q on the slit S formed in this manner so as to be orthogonal to the direction in which the slit S extends, that is, to extend radially from the center of the hemisphere. Therefore, at the plurality of measurement sites Q ... Thus, by measuring the diffraction pattern of the laser light L while rotating the rotary tool T about the rotation axis O thereof, the measurement of the outer peripheral side portion of the cutting edge portion is performed. Together with the result, the shape of the entire cutting edge of the rotary tool T can be accurately measured.

For example, when the rotary tool T as an object to be measured is a general twist drill, the end edge 11a of the reference plate 11 has a concave V-shape with a narrow angle corresponding to the tip angle of the cutting edge. When the rotary tool T is a square end mill, the end edge 11a has a "U" shape. Further, in FIG. 7, the diffraction pattern is measured by irradiating the plurality of measured portions Q with the laser light L over the entire length of the slit S formed in a semi-arc shape, but the rotary tool T is rotated. When the measurement is performed by rotating around the axis O, the measurement may be performed only in the slit S on the one-quarter arc portion on one side of the rotation axis O.

On the other hand, in the present embodiment, in order to measure this diffraction pattern, the line sensor 3 extending in the width direction of the sheet-like laser light L is used.
Compared to using an area sensor as in the measuring method described in Japanese Patent No. 272925, it is inexpensive and can secure a large measuring range in the direction in which the diffraction pattern extends. Therefore, in this embodiment, the line sensor 3 is also accurately arranged so as to be located on the optical axis C of the laser light L even in the direction in which the slit S extends and extend in the width direction of the laser light L. If so, this slit S
In the direction orthogonal to the extending direction of the laser beam, that is, in the width direction of the sheet-shaped laser light L, the diffraction pattern can be reliably measured even if the position is slightly deviated in the width direction. It is possible to secure the measurement accuracy while reducing the fine adjustment work.

In this embodiment, when measuring the diffraction pattern at the plurality of measured portions Q on the slit S as described above, the line sensor 3 is first used, the laser light source, the lenses 2 and 4, and The shielding plate 5 is slit S
Although it is possible to move integrally along the line, on the contrary, these line sensor 3, laser light source, lens 2,
4 and the shielding plate 5 may be fixed, and the rotary tool T as a measurement object and the reference plates 1 and 11 may be moved integrally, that is, the rotary tool T as a measurement object and these line sensors 3 , Laser light source, lens 2,
4 and the shielding plate 5 may be relatively movable along the slit S. However, rather than moving the rotary tool T and the reference plates 1 and 11 integrally while maintaining the extremely narrow slit width bx as described above, the line sensor 3, the laser light source, the lenses 2 and 4 as in the present embodiment. It is desirable that the shield plate 5 be moved easily. In particular, in the case of performing the measurement while rotating the rotary tool T around the rotation axis O as in the present embodiment, the slit width bx is further supported together with the reference plates 1 and 11 while rotatably supporting the rotary tool T. Since it becomes extremely difficult to move the rotary tool T while maintaining the above, it is more desirable to have the above-mentioned configuration.

Further, in this embodiment, the slit S faces the measured portion Q side of the rotary tool T which is the object to be measured.
Since the edge 1a of the reference plate 1 forming the edge is formed in the shape of a knife edge having a tapered cross section toward the measurement site Q side, the diffraction pattern of the laser light L formed by the edge 1a is It can be made clearer, and the measurement accuracy can be further improved. Moreover, in the present embodiment, the object to be measured is the rotary tool T, that is, on the outer circumference of the cutting edge portion to be measured, if the rotary tool T is a ball end mill or an end mill, the cutting edge is When the rotary tool T is a drill, the ridges on the outer peripheral side of the chip discharge groove are all formed in a knife edge shape with a tapered cross section toward the reference plate 1 side as shown in FIG. The diffraction pattern of the laser light L can be made clearer even on the measured portion Q side of the measurement object, and the measurement can be performed with higher accuracy.

By the way, such reference plates 1, 1
As the width bx of the slit S formed between the edges 1a and 11a of 1 and the object to be measured is smaller as shown in FIGS. 5 and 6, the measurement resolution is higher and more accurate measurement is possible. However, if the slit width bx is too small, the amount of laser light becomes small and the reference plate 1,
It may be rather difficult to adjust so that the edges 1a and 11a of 11 do not contact the measurement object. In particular, in the case where the measurement target is the rotary tool T and is rotatably supported around the rotation axis O as in the present embodiment, if the slit width bx is too small, the rotary tool during rotation is Even a slight shake of T may cause contact with the reference plates 1 and 11. Therefore, in order to enable the above-mentioned highly accurate measurement while avoiding such a problem, the slit width bx is practically set within the range of 0.01 to 0.1 mm. Is desirable. Incidentally, the thickness by of the sheet-shaped laser light L at the measurement site Q is 0.005 to 0.1 mm in practical use.
It is desirable to be within the range.

On the other hand, the width W of the sheet-like laser light L radiated to the measured portion Q is made larger than the slit width bx, and the widthwise end portions of the laser light L are, as described above. Blocked by the reference plates 1 and 11 and the rotary tool T,
It suffices that the laser light L that has passed through the slit S between them can be diffracted, but if the width W of this laser light L is too small and is, for example, about the same as the slit width bx, the width is This is not desirable because fine adjustment is required to irradiate the laser light L so that both ends in the direction are blocked by the reference plates 1 and 11 and the rotary tool T. On the contrary, even if the width W of the sheet-shaped laser light L is too large, the laser light L has to be applied to a portion unrelated to the measurement, which is inefficient. is there. Therefore, it is desirable that the width W of the sheet-shaped laser light L is set to be twice the slit width bx or more and less than the width dimension of the measured portion of the measurement object.

[0026]

As described above, according to the present invention,
For the slit that extends between the object to be measured and the reference plate that is adjacent to it, irradiate the measurement site with a thin flat sheet of laser light in the direction in which this slit extends and measure the diffraction pattern. By doing so, since the shape of the measurement site of the measurement object is measured, the laser beam can be reliably and easily applied to a predetermined measurement site without requiring fine adjustment requiring advanced skill. Irradiate,
It is possible to perform more accurate and precise measurement.

[Brief description of drawings]

FIG. 1 is a plan view showing the outline of a precise shape measuring apparatus using laser light according to an embodiment of the present invention.

FIG. 2 is a side view of a precision shape measuring apparatus using the laser light shown in FIG.

3 is a diagram viewed from the ZZ direction in FIG.

FIG. 4 is an enlarged plan view of a portion from a slit 1 portion to a line sensor 3 in FIG.

5 is a diagram showing the relationship between the slit width bx and the distance R1 from the optical axis C of the laser light L to the peak of the first-order bright ring of the diffraction pattern. FIG.

FIG. 6 is a diagram showing a relationship between a change rate and a width bx with respect to a slit width bx of a distance R1 from an optical axis C of a laser beam L to a peak of a first-order bright ring of a diffraction pattern.

FIG. 7 is a diagram corresponding to FIG. 3 when measuring the shape of the tip side portion of the cutting edge portion when the rotary tool T is a ball end mill.

[Explanation of symbols]

1,11 Reference plate 1a, 11a Edge of reference plate 3 line sensor 5 Shield T rotary tool (measurement object) O Rotary tool T rotation axis L laser light S slit Q Measurement site W Width of the laser beam L irradiated on the measurement site Q bx slit width by Thickness of laser light L

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Satoshi Takahashi             2-1 Yamadaoka, Suita City, Osaka Prefecture Osaka University             Graduate School of Engineering (72) Inventor Soichiro Sogane             3 359, Mimasu, Aikawa-cho, Aiko-gun, Kanagawa Prefecture             Makino Milling Co., Ltd. (72) Inventor Takashi Harada             No.179 Kanegasaki Nishioike, Uozumi Town, Akashi City, Hyogo Prefecture             1 MC Kobelco Tool Co., Ltd.             Within F term (reference) 2F065 AA22 AA51 AA53 BB05 CC10                       DD06 FF04 FF48 FF65 FF67                       GG04 HH05 HH15 JJ02 JJ25                       LL10 LL28 PP12 QQ25 QQ29

Claims (6)

[Claims] 1. A reference plate is provided adjacent to an object to be measured, a slit extending between the reference plate and the object to be measured is formed, and the slit is directed toward a measurement site of the object to be measured on the slit. And irradiating a thin flat sheet-shaped laser beam in the direction in which the slit extends, thereby measuring a diffraction pattern formed by the laser beam that has passed through the slit at the measurement site. Precision shape measurement method. 2. The measuring object is a rotary tool, the reference plate is provided adjacent to a cutting edge portion of the rotary tool, and the slit is formed so as to extend in a rotation axis direction of the rotary tool. By irradiating the laser beam toward the measured portion while rotating the rotary tool around the rotation axis at the plurality of measured portions on the slit, the rotary tool according to the rotational position of the rotary tool. The precise shape measuring method using a laser beam according to claim 1, wherein a diffraction pattern is measured. 3. The precision shape measuring method using a laser beam according to claim 1, wherein the diffraction pattern is measured by a line sensor extending in the width direction of the sheet-shaped laser beam. 4. The edge of the reference plate, which faces the measured portion side and forms the slit, is formed in the shape of a knife edge having a tapered cross section toward the measured portion side. 3. A precise shape measuring method using the laser beam according to any one of 3 above. 5. The width bx of the slit is 0.01 to 0.
The precision shape measuring method using a laser beam according to any one of claims 1 to 4, wherein the precision shape measuring method is set within a range of 1 mm. 6. The sheet-shaped laser light is set such that the width W of the sheet-shaped laser light is at least twice the width bx of the slit and is not more than the width dimension of the measurement site of the measurement object. 6. The precision shape measuring method using laser light according to claim 1, wherein the thickness by of the layer is set within a range of 0.005 to 0.1 mm.