JP2003112264A - Pulse-energization joining method and equipment for small surface, and joined body - Google Patents

Pulse-energization joining method and equipment for small surface, and joined body

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Publication number
JP2003112264A
JP2003112264A JP2001301600A JP2001301600A JP2003112264A JP 2003112264 A JP2003112264 A JP 2003112264A JP 2001301600 A JP2001301600 A JP 2001301600A JP 2001301600 A JP2001301600 A JP 2001301600A JP 2003112264 A JP2003112264 A JP 2003112264A
Authority
JP
Japan
Prior art keywords
joining
current
small
joined
heat treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001301600A
Other languages
Japanese (ja)
Other versions
JP4080716B2 (en
Inventor
Masao Tokita
正雄 鴇田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Coal Mining Co Ltd
Original Assignee
Sumitomo Coal Mining Co Ltd
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Filing date
Publication date
Application filed by Sumitomo Coal Mining Co Ltd filed Critical Sumitomo Coal Mining Co Ltd
Priority to JP2001301600A priority Critical patent/JP4080716B2/en
Publication of JP2003112264A publication Critical patent/JP2003112264A/en
Application granted granted Critical
Publication of JP4080716B2 publication Critical patent/JP4080716B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent any buckling, bending or the like by controlling the pressure on a work to be joined with high accuracy. SOLUTION: A pulse-energization joining equipment 1 for small surfaces comprises a pressure-variable pressing device 40 to relatively move at least one of energization-electrodes 33 and 34 to the other, a power source device to supply a pulse current to the energization electrodes, and a chamber which can control at least a space between the energization electrodes to a desired atmosphere, holds members having small surfaces to be jointed between the pair of energization electrodes in an abutting manner of the surfaces, and applies the pulse current of the desired voltage and current to the members to perform the temporary joining at the joining surfaces to obtain a temporarily joined body. The energization-joining equipment 1 further comprises a control device which controls the pressure of the pressing device 40 based on the value detected by a pressure sensor 61, and the control device performs the feedback control of the pressure by the pressing device by the valve determined by the material and the dimensions of the members to be joined with each other.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はパルス通電焼結法の原理
を利用したパルス通電接合方法、その接合装置並びにそ
のような接合方法によって接合した接合体に関し、更に
詳細には、薄肉パイプ、チューブ又は小片状チップ(小
面積の円形、多角形、その他の形状のチップ)或いは細
い棒又は線同士の接合、或いはそれらと大面積の部材と
の接合のような接合面積の小さな部材の接合をパルス通
電焼結の原理を利用して行う接合方法、接合装置並びに
接合体に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pulse current joining method utilizing the principle of the pulse current sintering method, a joining apparatus therefor, and a joined body joined by such a joining method. Or, small chip-shaped chips (small-area circular, polygonal, or other shaped chips) or thin rods or wires can be joined together, or small members such as large area members can be joined together. TECHNICAL FIELD The present invention relates to a joining method, a joining device, and a joined body, which are carried out by utilizing the principle of pulse current sintering.

【0002】[0002]

【従来技術】薄肉のパイプの端縁を突き合わせてその突
き合わせ端で接合する場合、或いは細い棒、線又は小片
状チップの端面を他の部材に接合する場合のように、小
接合面を有する部材を互いに接合する従来の方法として
は、(1)接合すべき端部を局部的に加熱溶解すると共
に溶接補助材も溶解し、それによって溶接補助材を介在
させて互いに接合する方法、(2)互いに接合すべき部
分の周囲にレーザービーム、電子ビーム等の高エネルギ
ービームを局部的に照射してその部分を局部的に溶解さ
せ、それによって部材を互いに接合する方法及び(3)
上記溶接補助材とは異なり接合する部材とは異なる材料
でできた蝋材(Cu、Agなどの合金或いはアモルファ
ス金属)を真空雰囲気又は不活性雰囲気で接合面間で溶
かして接合する方法等が一般的であった。
2. Description of the Related Art A thin joint has a small joint surface as in the case where the edges of thin pipes are butted and joined at the butted ends, or when the end face of a thin rod, wire or chip is joined to another member. As a conventional method of joining members to each other, (1) a method of locally heating and melting the ends to be joined and also melting a welding auxiliary material, thereby joining the welding auxiliary materials with each other, (2) ) A method of locally irradiating a high-energy beam such as a laser beam or an electron beam around the portions to be joined to locally melt the portions, thereby joining the members together (3)
Unlike the above-mentioned welding auxiliary material, a wax material (an alloy such as Cu or Ag or an amorphous metal) made of a material different from the material to be joined is melted between the joining surfaces in a vacuum atmosphere or an inert atmosphere to join the members. It was target.

【0003】しかしながら、上記(1)の接合方法で
は、(a)溶接補助材を使用しなければならない問題、
(b)接合すべき部材を局部的に溶解させるため部材の
母材に変質が起こる問題、及び(c)互いに接合できる
部材の材質に制限がある問題等がある。また、上記
(2)の接合方法では、上記(a)のように溶接補助材
を必要とする問題はなくなるが、上記(b)及び(c)
と同様に接合すべき部材を局部的に溶解させるため部材
の母材に変質が起こる問題、及び互いに接合できる部材
の材質に制限がある問題があり、更に、(d)接合が周
辺部で局部的に行われるため高い接合強度を得ることが
できない問題がある。更に、(3)の接合方法では上記
(a)ないし(c)及び蝋材を介しての接合であるため
接合できる部材の材質に制限があるのみならず、十分な
耐熱性や接合強度が得られない問題がある。
However, in the joining method of the above (1), (a) the problem that the welding auxiliary material must be used,
(B) There is a problem that the base materials of the members are deteriorated because the members to be joined are locally melted, and (c) there is a limitation on the materials of the members that can be joined to each other. Further, in the joining method of the above (2), the problem of requiring a welding auxiliary material as in the above (a) is eliminated, but the above (b) and (c)
Similarly, there is a problem that the base materials of the members are deteriorated because the members to be joined are locally melted, and the material of the members that can be joined to each other is limited. Further, (d) the joining is locally at the peripheral portion. However, there is a problem that high bonding strength cannot be obtained. Further, in the joining method of (3), since the joining is performed through the above (a) to (c) and the wax material, not only the material of the member that can be joined is limited, but also sufficient heat resistance and joining strength can be obtained. There is a problem that can not be.

【0004】[0004]

【発明が解決しようとする課題】ところで、技術の進歩
により様々な機器の開発及びかかる機器の小型化が進む
と共に素材の新しい利用分野が開発され、従来では考え
られない素材同士の接合が、或いは小接合面積同士又は
大面積母材に小片状チップ(小面積の円形、多角形、そ
の他の形状のチップ)のような小さな接合面積で強固に
接合されることが要求されるようになってきた。例え
ば、薄肉の所定長さのステンレスパイプに十分な接合強
度で完全密閉シール状に繋ぎ合わせて使用する場合、非
磁性材のパイプ、中実棒材(横断面が円形、多角形、そ
の他の形状の棒材)等に同じく薄肉の磁性材のパイプ、
中実棒材(横断面が円形、多角形、その他の形状の棒
材)等を繋ぎ合わせて使用する場合、タングステンカー
バイド、コバルト系超硬材料と鉄系材料とを繋ぎ合わせ
て使用する場合、或いは銅系の材料と鉄系の材料とを繋
ぎ合わせて使用する場合などである。
By the way, the development of various devices and the miniaturization of such devices have progressed due to the progress of technology, and new fields of use of materials have been developed. It has become necessary to firmly bond small bonding areas to each other or a large area base material with a small bonding area such as a small chip (small area circular, polygonal, or other shaped chip). It was For example, when connecting thin stainless steel pipes of a prescribed length with a sufficient joint strength in a completely hermetically sealed state, nonmagnetic pipes, solid rods (circular cross section, polygonal, other shapes) Thin bar of magnetic material, etc.
When connecting solid bar materials (bars with a circular cross section, polygonal shape, and other shapes), etc., when using tungsten carbide, cobalt-based cemented carbide materials and iron-based materials, Alternatively, it is a case where a copper-based material and an iron-based material are used by being joined together.

【0005】近年パルス電流を流して行うパルス通電加
圧焼結(放電プラズマ焼結、放電焼結或いはプラズマ活
性化焼結等を含む)の原理を利用して、粉末でなく所定
の嵩を有し比較的大きな接合面を有している部材同士を
接合させる技術が開発されつつあるが、このパルス通電
加圧焼結法を利用した接合装置では材料に比較的大きな
圧力を付加した状態で行う必要があったため、例えば、
薄肉パイプの端面同士を突き合わせて接合させる場合の
ように、互いに接合される部材の接合面が小さくて大き
な力を加えると部材が座屈する場合には使用できない。
このような問題を解決するためには座屈を防止するため
の外形、中子型或いはジグを使用しなければならない。
しかしながら、型或いはジグを使用する場合には、互い
に接合される被接合部材の形状、寸法等が異なるごとに
その被接合部材の形状、寸法に合った型或いはジグを用
意しなければならず接合作業が繁雑になる問題、型又は
ジグに通電する必要が生じるため接合時間が長くなりま
た消費電力も多くなる問題、それだけ接合コストが高く
なる問題等大量生産、実用性については大きな問題があ
る。
In recent years, by utilizing the principle of pulse current pressure sintering (including discharge plasma sintering, discharge sintering, plasma activated sintering, etc.) performed by passing a pulse current, it has a predetermined bulk instead of powder. However, a technology for joining members having relatively large joining surfaces is being developed, but with a joining device that uses this pulsed current pressure sintering method, a relatively large pressure is applied to the material. Because it was necessary, for example,
It cannot be used when the end faces of thin-walled pipes are butted against each other and the members to be joined together have a small joining surface and a large force causes the members to buckle.
In order to solve such a problem, an outer shape, a core type or a jig for preventing buckling must be used.
However, when using a mold or a jig, it is necessary to prepare a mold or jig suitable for the shape and size of the members to be bonded each time the shapes and sizes of the members to be bonded are different. There are major problems in mass production and practicality, such as a problem of complicated work, a problem of increasing the joining time and power consumption because it is necessary to energize the mold or jig, and a problem of increasing the joining cost.

【0006】本発明が解決しようとする課題は、放電プ
ラズマ焼結、放電焼結或いはプラズマ活性化焼結等を含
むパルス通電加圧焼結の原理を利用し、しかも接合面の
小さな部材同士の接合に適したパルス通電接合方法及び
その接合装置を提供することである。本発明が解決しよ
うとする他の課題は、被接合部材に対する加圧力を押圧
装置により高精度に制御して被接合部材の座屈、屈曲等
の発生を阻止できる、大量生産及び実用性の高いパルス
通電接合方法及びその接合装置を提供することである。
本発明が解決しようとする別の課題は、上記のような接
合方法により接合した接合体を提供することである。
The problem to be solved by the present invention is to utilize the principle of pulsed current pressure sintering including discharge plasma sintering, discharge sintering, plasma activated sintering, and the like, and yet, between members having small joint surfaces. It is an object of the present invention to provide a pulse current joining method and a joining device suitable for joining. Another problem to be solved by the present invention is to highly accurately control the pressure applied to the members to be joined by a pressing device to prevent buckling, bending, etc. of the members to be joined, high mass production and high practicality. A pulse current welding method and a welding apparatus therefor are provided.
Another problem to be solved by the present invention is to provide a joined body joined by the joining method as described above.

【0007】[0007]

【課題を解決するための手段】本願の一つの発明は、互
いに接合すべき小接合面を有する複数の部材を、所望の
雰囲気に保持されたチャンバ内に入れかつ接合面を当接
させた状態で対の通電電極により挟み、前記複数の部材
に前記対の通電電極を介して所望の電圧及び電流のパル
ス電流を流して前記接合面で接合する小接合面用パルス
通電接合方法において、通電開始前に所望の第1の押圧
力で前記複数の部材を押圧し、通電開始後前記チャンバ
内の温度が前記接合される複数の部材の材質及び寸法に
よって決まる温度に達した後、前記材質及び寸法によっ
て決まる第2の押圧力で前記複数の部材を押圧し、前記
複数の部材を仮接合して仮接合体にするように構成され
ている。なお、上記第2の押圧力は適宜変化する可変の
押圧力であり得る。上記小接合面用パルス通電接合方法
において、前記第2の押圧力での押圧を、前記部材に加
えられる押圧力を常時圧力センサで検出し、フィードバ
ックさせて制御するようにしても良く、また、前記接合
面を鏡面に研磨してもよい。また、小接合面用パルス通
電接合方法が、更に、前記仮接合された部材を前記部材
の材質及び寸法によって決まる温度及び時間により熱処
理を施すことを含んでいてもよい。更にまた、前記小接
合面用パルス通電接合方法において、前記熱処理を、前
記仮接合に引き続いて前記チャンバ内で前記通電電極に
より熱処理電流を流して行っても、或いは前記仮接合さ
れた複数の仮接合体をまとめて熱処理炉によって行って
もよい。
One aspect of the present invention is a state in which a plurality of members having small joint surfaces to be joined to each other are placed in a chamber kept in a desired atmosphere and the joint surfaces are brought into contact with each other. In a pulsed current joining method for a small joining surface, which is sandwiched by a pair of current-carrying electrodes, and a pulse current having a desired voltage and current is applied to the plurality of members through the pair of current-carrying electrodes to join at the joining surface, energization is started. After pressing the plurality of members with a desired first pressing force, after the start of energization, after the temperature in the chamber reaches a temperature determined by the materials and dimensions of the plurality of members to be joined, the material and dimensions The plurality of members are pressed by a second pressing force determined by the above, and the plurality of members are temporarily joined to form a temporary joined body. The second pressing force may be a variable pressing force that changes appropriately. In the above-described pulsed current joining method for a small joining surface, the pressing force applied by the second pressing force may be controlled by constantly detecting the pressing force applied to the member by a pressure sensor and feeding it back. The joint surface may be polished to a mirror surface. Moreover, the pulse current joining method for a small joining surface may further include heat-treating the temporarily joined member at a temperature and a time determined by the material and size of the member. Furthermore, in the pulse current joining method for the small joining surface, the heat treatment may be performed by applying a heat treatment current by the current-carrying electrode in the chamber subsequent to the temporary joining, or by performing a plurality of the temporary joining of the temporary joining. The bonded bodies may be collectively processed in a heat treatment furnace.

【0008】本願の他の発明は、対の通電電極と、前記
対の通電電極の少なくとも一方を他方に対して相対的に
移動する圧力可変の押圧装置と、前記通電電極にパルス
電流を供給する電源装置と、少なくとも前記通電電極間
の空間を所望の雰囲気に制御可能なチャンバとを備え、
前記対の通電電極の間で互いに接合すべき小接合面を有
する部材を接合面を当接させた状態で挟み、前記部材に
所望の電圧及び電流のパルス電流を流して前記接合面で
仮接合して仮接合体にする小接合面用パルス通電接合装
置において、前記接合すべき部材に加えられる圧力を検
出可能な圧力センサと、前記圧力センサにより検出した
検出値に基づいて前記押圧装置の押圧力を制御可能な制
御装置とを備え、前記制御装置が前記押圧装置による押
圧力を、接合すべき部材の材質及び寸法により決まる値
でフィードバック制御するように構成されている。上記
小接合面用パルス通電接合装置において、前記圧力可変
押圧装置が、ボールねじ装置及び前記ボールねじ装置を
駆動する微小回転制御可能な電動モータであってもよ
い。また、前記対の通電電極に前記パルス電流を供給す
る電源装置が、前記通電電極に熱処理用電流を供給可能
であり、前記仮接合後に前記通電電極に前記熱処理用電
流を流して前記チャンバ内で熱処理を行っても、或い
は、更に、前記仮接合体の熱処理を行う熱処理炉を備え
ていてもよい。チャンバ内で熱処理を行う場合、通電電
極に供給する電流は焼結用の電流と同じ電流でも或いは
異なる電流でもよい。また、熱処理炉で行う場合、一つ
のシステムの中に組み込んでも或いは別個に配置しても
よい。なお、接合過程で被接合材料の酸化が問題になら
ない材質、形状、或いは低温接合可能な場合は、雰囲気
制御付きチャンバはなくてもよい。更にまた、小接合面
用パルス通電接合装置が、更に、前記仮接合体を前記熱
処理炉に自動的に供給する搬送装置を備えていてもよ
い。また、TPマガジンから接合装置へ、接合装置から
熱処理炉へ、更に熱処理炉から冷却済み又は処理済み接
合品用のマガジンへの自動搬送を行う装置を備えていて
も良い。本願の別の発明は、請求項1ないし6に記載の
小接合面用パルス通電接合方法により接合された接合体
である。
According to another invention of the present application, a pair of energizing electrodes, a pressure variable pressing device that moves at least one of the pair of energizing electrodes relative to the other, and a pulse current is supplied to the energizing electrodes. A power supply device, and a chamber capable of controlling at least the space between the current-carrying electrodes to a desired atmosphere,
A member having a small joint surface to be joined to each other between the pair of energized electrodes is sandwiched with the joint surfaces in contact with each other, and a pulse current having a desired voltage and current is applied to the member to temporarily join the joint surfaces. In a small joining surface pulse current joining device to form a temporary joined body, a pressure sensor capable of detecting the pressure applied to the members to be joined and a pressing device for pushing the pressing device based on a detection value detected by the pressure sensor. A control device capable of controlling pressure is provided, and the control device is configured to perform feedback control of the pressing force by the pressing device at a value determined by the material and size of the members to be joined. In the above-mentioned pulse current welding device for small joining surfaces, the pressure variable pressing device may be a ball screw device and an electric motor for driving the ball screw device which is capable of minute rotation control. Further, the power supply device for supplying the pulse current to the pair of energized electrodes is capable of supplying a heat treatment current to the energized electrodes, and the heat treatment current is passed to the energized electrodes after the temporary bonding to cause the heat treatment current to flow in the chamber. A heat treatment furnace may be provided to perform heat treatment, or to further perform heat treatment on the temporary bonded body. When the heat treatment is performed in the chamber, the current supplied to the current-carrying electrode may be the same as or different from the sintering current. Further, when the heat treatment is performed in the heat treatment furnace, the heat treatment furnace may be incorporated in one system or separately arranged. Note that the chamber with atmosphere control may be omitted if the material, shape, or low-temperature bonding that does not cause a problem of the material to be bonded during the bonding process is possible. Furthermore, the pulsed current joining apparatus for small joining surfaces may be further provided with a carrying device for automatically supplying the temporary joined body to the heat treatment furnace. In addition, an apparatus may be provided that automatically conveys from the TP magazine to the joining device, from the joining device to the heat treatment furnace, and further from the heat treatment furnace to the magazine for cooled or treated joined products. Another invention of the present application is a bonded body bonded by the pulse current bonding method for a small bonding surface according to claims 1 to 6.

【0009】[0009]

【実施例】次に図面を参照して本発明による小接合面用
パルス通電接合方法を実施する接合装置の実施形態につ
いて説明する。図1ないし図3において、本実施形態に
よる小接合面用パルス通電接合装置(以下単に通電接合
装置と呼ぶ)1が示されている。この通電接合装置1
は、放電プラズマ焼結、放電焼結或いはプラズマ活性化
焼結等を含むパルス通電焼結法の原理を利用するもので
あるが、通常焼結で使用されるグラファイト製などの焼
結型(ダイ、パンチ等)は使用しない。通電接合装置1
は、フレーム装置10と、フレーム装置10の中央部
(図1において)に関して上下方向(図1において)に
移動可能に支持された可動テーブル装置20と、可動テ
ーブル装置20に取り付けられた通電電極装置30の下
通電電極組立体31と、可動テーブル装置を上下動させ
る押圧装置40と、フレーム装置10の上部に取り付け
られた通電電極装置30の上通電電極組立体32と、被
接合部材の周囲を所望の雰囲気(例えば真空雰囲気或い
は不活性ガス雰囲気)にするチャンバを画成するハウジ
ング組立体50と、を備えている。この実施形態の通電
接合装置は制御装置60(図3)により全体的な動作の
制御が行われ、電源装置70(図3)から接合用の直流
パルス電流が供給される。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a bonding apparatus for carrying out the method for pulse-current welding for small bonding surfaces according to the present invention will be described below with reference to the drawings. 1 to 3, there is shown a pulsed current joining apparatus for small joining surfaces (hereinafter simply referred to as an electricity joining apparatus) 1 according to the present embodiment. This current welding device 1
Uses the principle of pulsed current sintering including discharge plasma sintering, discharge sintering, plasma activated sintering, etc. , Punch, etc.) are not used. Current joining device 1
Is a frame device 10, a movable table device 20 movably supported in a vertical direction (in FIG. 1) with respect to a central portion (in FIG. 1) of the frame device 10, and a current-carrying electrode device attached to the movable table device 20. The lower energizing electrode assembly 31 of 30, the pressing device 40 for moving the movable table device up and down, the upper energizing electrode assembly 32 of the energizing electrode device 30 attached to the upper part of the frame device 10, and the surroundings of the members to be joined. And a housing assembly 50 that defines a chamber that provides a desired atmosphere (eg, a vacuum atmosphere or an inert gas atmosphere). The energization joining apparatus of this embodiment is controlled in its overall operation by the control device 60 (FIG. 3), and a DC pulse current for joining is supplied from the power supply device 70 (FIG. 3).

【0010】フレーム装置10は、箱状の下フレーム1
1と、下フレーム11の上部にに固定された下支持プレ
ート12と、下支持プレート12に公知の方法で取り付
けられた複数(この実施例では下支持プレートの四隅に
近接して配置された4本)の支柱13と、支柱13の上
端に公知の方法で取り付けられた上支持プレート14と
を備えている。下支持プレート12には4個の貫通穴が
形成されて、その貫通穴内には軸受け部材121が装着
されている。各軸受け部材121内には、可動テーブル
装置20の可動テーブル21の四隅に公知の方法で取り
付けられていて下方に伸びる案内軸22が滑り可能に挿
入されている。したがって、可動テーブル21は案内軸
22及び軸受け122によって単に上下方向にのみ移動
できるように案内されている。
The frame device 10 comprises a box-shaped lower frame 1
1 and a lower support plate 12 fixed to the upper portion of the lower frame 11, and a plurality of lower support plates 12 attached to the lower support plate 12 by a known method (in this embodiment, 4 arranged near four corners of the lower support plate 4). Book support 13 and an upper support plate 14 attached to the upper end of the support 13 by a known method. Four through holes are formed in the lower support plate 12, and a bearing member 121 is mounted in the through holes. In each bearing member 121, guide shafts 22 that are attached to the four corners of the movable table 21 of the movable table device 20 by known methods and extend downward are slidably inserted. Therefore, the movable table 21 is guided by the guide shaft 22 and the bearing 122 so as to be movable only in the vertical direction.

【0011】下フレーム11内には押圧装置40が配設
固定されている。この押圧装置40は上下方向に所定の
長さ伸びる公知の構造及び機能のボールねじ装置41
と、ボールねじ装置41の入力軸(図示せず)に入力を
与える駆動源としての電動モータ42と、電動モータ4
2の回転出力をボールねじ装置41に与える伝動機構4
3とを備えている。電動モータ42は微小の回転角を高
精度に制御できるステッピングモータが好ましい。この
電動モータ42は制御装置60に接続されていてその制
御装置の制御の下で回転を制御されるようになってい
る。ボールねじ装置41の出力軸411の上端近傍(図
1において)にはガイドプレート24が取り付けられ、
そのガイドプレート24には可動テーブル21に取り付
けられかつ下方に伸びる複数のガイドロッド25が相対
移動可能に案内されている。ボールねじ装置41の軸線
及び下通電電極組立体31の軸線は装置全体の軸線0−
0に一致させてある。可動テーブル21と出力軸411
との間には本通電接合装置の動作の制御を行う制御装置
60の圧力センサ61が配置されている。この圧力セン
サ61は公知の構造及び機能を有するものでよい。した
がって、押圧装置40によって可動テーブル21に加え
られる軸方向押圧力は圧力センサ61によって検出され
る。ボールねじ装置の出力軸411はガイドプレート及
びガイドロッドの作用により回転しないようになってい
る。
A pressing device 40 is arranged and fixed in the lower frame 11. The pressing device 40 is a ball screw device 41 having a known structure and function that extends vertically by a predetermined length.
An electric motor 42 as a drive source for applying an input to an input shaft (not shown) of the ball screw device 41, and the electric motor 4
Transmission mechanism 4 for giving the rotation output of 2 to the ball screw device 41
3 and 3. The electric motor 42 is preferably a stepping motor capable of controlling a minute rotation angle with high accuracy. The electric motor 42 is connected to the control device 60, and its rotation is controlled under the control of the control device. A guide plate 24 is attached near the upper end (in FIG. 1) of the output shaft 411 of the ball screw device 41,
A plurality of guide rods 25 attached to the movable table 21 and extending downward are guided to the guide plate 24 so as to be relatively movable. The axis of the ball screw device 41 and the axis of the lower energizing electrode assembly 31 are 0-
Matched with 0. Movable table 21 and output shaft 411
A pressure sensor 61 of a control device 60 that controls the operation of the present energization welding device is arranged between the and. The pressure sensor 61 may have a known structure and function. Therefore, the axial pressing force applied to the movable table 21 by the pressing device 40 is detected by the pressure sensor 61. The output shaft 411 of the ball screw device does not rotate due to the action of the guide plate and the guide rod.

【0012】可動テーブル21の上面には絶縁性の取り
付け板35を介して下通電電極組立体31が可動テーブ
ルに関して絶縁して固定されている。取り付け板35と
下通電電極組立体31の下端との固定は複数の公知の止
めねじで行われ、取り付け板35は公知の止めねじによ
り可動テーブル21に固定される。下通電電極組立体3
1は硬質で靭性を有する材料、例えばステンレスで作ら
れた円柱状の下通電電極33を有している。下通電電極
33はケーブル及びスイッチ装置71(図3)を介して
電源装置70(図3)に接続可能になっている。スイッ
チ装置71は電源装置の一部を構成しても良く、本出願
人による特願2000−284771号「パルス通電焼
結機用通電装置」に示されるスイッチ機構と同様の構造
のものでも良い。下通電電極33内には冷却流体を流す
冷却通路(図示せず)が形成され、その冷却通路には一
対の給排パイプ(図1で1個のみ図示)331を介して
冷却流体が循環されるようになっている。取り付け板3
5は全体が絶縁材料でできていても、或いは金属板の表
面に絶縁処理を施したものでもよい。
A lower energizing electrode assembly 31 is insulated and fixed to the upper surface of the movable table 21 with an insulating mounting plate 35 with respect to the movable table. The attachment plate 35 and the lower end of the lower energization electrode assembly 31 are fixed by a plurality of known set screws, and the attachment plate 35 is fixed to the movable table 21 by the known set screws. Lower energizing electrode assembly 3
Reference numeral 1 has a cylindrical lower current-carrying electrode 33 made of a hard and tough material such as stainless steel. The lower energizing electrode 33 can be connected to the power supply device 70 (FIG. 3) via the cable and the switch device 71 (FIG. 3). The switch device 71 may form a part of the power supply device, and may have the same structure as the switch mechanism shown in Japanese Patent Application No. 2000-284771 “Pulse energization sintering machine energization device” by the present applicant. A cooling passage (not shown) through which a cooling fluid flows is formed in the lower energization electrode 33, and the cooling fluid is circulated through the pair of supply / discharge pipes (only one is shown in FIG. 1) 331 in the cooling passage. It has become so. Mounting plate 3
5 may be entirely made of an insulating material, or may be a metal plate whose surface is subjected to an insulating treatment.

【0013】下通電電極33の外側にはハウジング組立
体50の下ハウジング部分51が下通電電極33に関し
て相対的に移動可能に設けられている。下ハウジング部
分51は、下通電電極の外周に滑動可能に取り付けられ
た底壁部材511と、底壁部材に互いに隔ててかつ底壁
部材に関して密閉して固定された内周壁部材512及び
外周壁部材513と、内及び外周壁部材の上端に固定さ
れた環状の端板514とを有している。底壁部材511
の下通電電極に対する接触面には公知の構造のシール部
材(図示せず)が設けられ、それらの間の隙間を密閉し
ている。底壁部材511には、下支持プレート12の貫
通穴に装着された軸受け123に滑動可能に支持された
駆動ロッド53が取り付けられている。この駆動ロッド
は、ラック及びピニオン装置及びピニオン回転用の電動
モータ(図示せず)により駆動されるようになってい
る。これにより下ハウジング部分51を下通電電極に関
して相対的に移動できるようにしている。55は可動テ
ーブルに取り付けられていて下ハウジング部分51の下
降を制限するストッパであって、軸線0−0を中心とし
て直径方向の2カ所に設けられている。なお、57は耐
熱ガラスでできたのぞき窓である。
A lower housing portion 51 of the housing assembly 50 is provided outside the lower conducting electrode 33 so as to be movable relative to the lower conducting electrode 33. The lower housing portion 51 includes a bottom wall member 511 slidably attached to the outer periphery of the lower energization electrode, and an inner peripheral wall member 512 and an outer peripheral wall member that are fixed to the bottom wall member so as to be spaced apart from each other and hermetically fixed to the bottom wall member. 513 and an annular end plate 514 fixed to the upper ends of the inner and outer peripheral wall members. Bottom wall member 511
A seal member (not shown) having a known structure is provided on the contact surface with respect to the lower energizing electrode to seal the gap between them. A drive rod 53 slidably supported by a bearing 123 mounted in a through hole of the lower support plate 12 is attached to the bottom wall member 511. The drive rod is driven by a rack and pinion device and an electric motor (not shown) for rotating the pinion. This allows the lower housing portion 51 to move relative to the lower energizing electrode. Reference numeral 55 denotes a stopper which is attached to the movable table and which limits the lowering of the lower housing portion 51, and is provided at two diametrical positions about the axis 0-0. Reference numeral 57 is a sight glass made of heat-resistant glass.

【0014】上支持プレート14の下面には取り付け板
36及び絶縁板38を介して下通電電極組立体32が固
定されている。絶縁板38と下通電電極組立体32の上
端との固定、絶縁板38と取り付け板36との固定並び
に取り付け板36と上支持プレート14との固定は、複
数の公知の止めねじで行われる。上通電電極組立体32
はステンレスで作られた円柱状の上通電電極34を有し
ている。上通電電極34は、ケーブルを介して電源装置
70に接続可能になっている。上通電電極33内には冷
却流体を流す冷却通路(図示せず)が形成され、その冷
却通路には一対の給排パイプ(図1で1個のみ図示)3
41を介して冷却流体が循環されるようになっている。
A lower conducting electrode assembly 32 is fixed to the lower surface of the upper support plate 14 via a mounting plate 36 and an insulating plate 38. The fixing of the insulating plate 38 to the upper end of the lower energizing electrode assembly 32, the fixing of the insulating plate 38 and the mounting plate 36, and the fixing of the mounting plate 36 and the upper support plate 14 are performed by a plurality of known set screws. Upper energizing electrode assembly 32
Has a cylindrical upper current-carrying electrode 34 made of stainless steel. The upper energization electrode 34 can be connected to the power supply device 70 via a cable. A cooling passage (not shown) through which a cooling fluid flows is formed in the upper energization electrode 33, and a pair of supply / discharge pipes (only one is shown in FIG. 1) 3 are provided in the cooling passage.
A cooling fluid is circulated through 41.

【0015】上通電電極34の外側にはハウジング組立
体50の上ハウジング部分52が配設されている。上ハ
ウジング部分52は、下通電電極の外周に公知の方法で
密封して取り付けられた頂壁部材521と、頂壁部材5
21に互いに隔ててかつ底壁部材に関して密閉して固定
された内周壁部材522及び外周壁部材523と、内及
び外周壁部材の下端に固定された環状の端板524とを
有している。頂壁部材521は、上支持プレート14に
固定された複数(本実施形態では4個であるが1個のみ
図示)の連結ロッド54を介して上支持プレート14に
固定されている。56は内周壁部材522及び外周壁部
材523に取り付けたパイプであって、図示しない導管
を介して真空雰囲気又は不活性ガス雰囲気にする雰囲気
制御装置(図示せず)に接続されている。下ハウジング
部分51の端板514の上面及び上ハウジング部分52
の端板524の下面の少なくとも一方には環状の溝が形
成され、その溝内にはOリングシールが設けられ、両者
が合わされたときそれらの間からの空気の漏れを防止し
得るようになっている。上ハウジング部分52内には、
図3に示されるように、圧力センサ62及び温度センサ
63が設けられ、それらの圧力センサ及び温度センサに
より下ハウジング部分51と上ハウジング部分52とに
よって画成されたチャンバC内のガス圧及び温度をそれ
ぞれ検出できるようになっている。圧力センサ62及び
温度センサ63は制御装置70に接続され、その検出信
号を制御装置に入力できるようになっている。なお、温
度フィードバックと組み合わせた圧力制御を行ってもよ
い。
An upper housing portion 52 of the housing assembly 50 is disposed outside the upper energizing electrode 34. The upper housing portion 52 includes a top wall member 521, which is hermetically attached to the outer periphery of the lower energization electrode by a known method, and a top wall member 5.
21 has an inner peripheral wall member 522 and an outer peripheral wall member 523 which are fixed to each other in a sealed manner with respect to the bottom wall member, and an annular end plate 524 which is fixed to lower ends of the inner and outer peripheral wall members. The top wall member 521 is fixed to the upper support plate 14 via a plurality of (four in the present embodiment, but only one is shown) connecting rods 54 fixed to the upper support plate 14. Reference numeral 56 is a pipe attached to the inner peripheral wall member 522 and the outer peripheral wall member 523, and is connected to an atmosphere control device (not shown) for making a vacuum atmosphere or an inert gas atmosphere through a conduit not shown. The upper surface of the end plate 514 of the lower housing portion 51 and the upper housing portion 52
An annular groove is formed in at least one of the lower surfaces of the end plates 524 of the respective members, and an O-ring seal is provided in the groove to prevent air from leaking between them when they are fitted together. ing. In the upper housing part 52,
As shown in FIG. 3, a pressure sensor 62 and a temperature sensor 63 are provided, and the gas pressure and temperature in the chamber C defined by the lower housing portion 51 and the upper housing portion 52 are provided by the pressure sensor and the temperature sensor. Can be detected respectively. The pressure sensor 62 and the temperature sensor 63 are connected to the control device 70, and their detection signals can be input to the control device. In addition, you may perform pressure control combined with temperature feedback.

【0016】[0016]

【実施例1】次に上記の通電接合装置1を使用して図4
[A]に示されるような薄肉のパイプM1とM2とを端
面を突き合わせた状態で接合する場合について説明す
る。ここで、パイプM1は非磁性ステンレス(SUS3
04)製のパイプであり、パイプM2は磁性ステンレス
(SUS430)製のパイプであり、いずれも長さL1
=30mm、内径d1=8mm、外径d2=10mm、で
肉厚はt1=1mmであるものとする。この場合、パイ
プM1及びM2の互いに接合する端面すなわちパイプM
1の上端面M1e及びパイプM2の下端面M2eは全面
にわたって均等に接触するよう切削しておく。好ましく
は、鏡面に研磨しておく。このように用意しかつ端面を
突き合わせた二つのパイプを下通電電極33の上端面上
に、例えば、V溝構造の位置合わせ冶具などを用いてセ
ットした後、制御装置60により押圧装置40を動作さ
せて可動テーブル12を上昇させ、下通電電極組立体3
1と上通電電極組立体32との間でパイプを挟む。この
時押圧装置40の押圧力を調整して、初期押圧力を、当
接表面がなじみ易いように例えば1ないし3メガパスカ
ルの力で押さえるようにする。この状態で下ハウジング
部分51を上昇させて端板514を上ハウジング部分5
2の端板524に当接させ、ハウジングにより被接合部
材であるM1及びM2の周囲に外部から密閉されたチャ
ンバCを画成する。
[Embodiment 1] Next, referring to FIG.
A case will be described where thin pipes M1 and M2 as shown in [A] are joined together with their end faces abutted. Here, the pipe M1 is made of non-magnetic stainless steel (SUS3
04), and the pipe M2 is made of magnetic stainless steel (SUS430), and each has a length L 1
= 30 mm, inner diameter d 1 = 8 mm, outer diameter d 2 = 10 mm, and wall thickness t 1 = 1 mm. In this case, the end faces of the pipes M1 and M2 that join to each other, that is, the pipe M
The upper end surface M1e of No. 1 and the lower end surface M2e of the pipe M2 are cut so as to make uniform contact over the entire surface. Preferably, the mirror surface is polished. After the two pipes thus prepared and whose end faces are butted against each other are set on the upper end face of the lower conducting electrode 33 by using, for example, a V-groove structure positioning jig, the control device 60 operates the pressing device 40. Then, the movable table 12 is raised, and the lower energizing electrode assembly 3
A pipe is sandwiched between 1 and the upper energization electrode assembly 32. At this time, the pressing force of the pressing device 40 is adjusted so that the initial pressing force is suppressed by a force of, for example, 1 to 3 megapascals so that the abutting surface is easily adapted. In this state, the lower housing part 51 is raised to move the end plate 514 to the upper housing part 5.
The second end plate 524 is brought into contact with the second end plate 524, and the housing defines a chamber C which is sealed from the outside around the members M1 and M2 to be joined.

【0017】この状態で雰囲気制御装置を動作させてチ
ャンバC内を所望の雰囲気にする。この場合にはチャン
バ内を真空引きして真空状態、例えば、約6.7パスカ
ル(Pa)(5×10-2torr)にする。チャンバ内
の真空引きが完了した後は、制御装置60の指令により
スイッチ装置71をオンにして電源装置70から上下通
電電極組立体を通してパイプM1及びM2に6ないし1
2ボルト(V)で300ないし800アンペア(A)の
直流パルス電流を流す。電流が流れるに従ってパイプは
発熱し高温になり、上下は機械的に固定されているため
熱膨張により軸方向の歪みが発生し、加圧力は徐々に増
大し、そのまま高い押圧力でパイプを軸方向に押圧して
いるとパイプは座屈する。このためパイプを固定後、押
圧装置40によりパイプに加えられる押圧力を、例えば
0.5ないし1.0メガパスカル(MP)まで下げ、パ
ルス電流の通電を始める。その後、圧力センサ61から
の検出信号に基づき押圧力をフィードバック制御してこ
の押圧力を保持する。通電加圧軸の送り機構には、パイ
プの上端面の1〜2mm程度手前まで早送りし、その後
端面に当接するまで減速送りするプログラムが組み込ま
れていても良い。パイプへの通電開始から2〜5分程度
の短時間で両パイプは接合されるので、スイッチ装置オ
フにして通電を停止する。この接合の原理は次の通りで
ある。直流パルス電流を流すと、接触抵抗の高い当接し
ている界面部分がジュール加熱により高温に熱せされ
る。また、材料自体の抵抗値により全体がジュール加熱
される。また、上下一軸加圧力による塑性変形と熱膨張
により上下に重ねられた部材の当接界面には高い圧力が
発生する。更にon−offパルス電流の流れの方向に
沿って電場が生じ、電界拡散が生じる。この電界拡散効
果と前述の熱拡散の機械的圧力が固相拡散接合に寄与し
金属結晶構造の配向性をもたらすと考えられる。この接
合は必ずしも十分な接合強度で行われていないので、こ
こでは仮接合と呼び、仮接合されたものを仮接合体と呼
ぶ。通電を停止した後チャンバを大気圧に戻し、下ハウ
ジング部分を降下させて上下通電電極間に挟まれた仮接
合体を取り出せるようにする。その後可動テーブルを降
下させて上下通電電極間から仮接合体を取り出し仮接合
が完了する。上記の場合は仮接合体を自然冷却により冷
却させる場合であるが、強制的に冷却したい場合には、
通電停止後チャンバ内に冷却された不活性ガスを供給
し、或いは吸熱構造部材を有する冷却ステージを別途設
けて冷却してもよい。なお、実施例1は上下に重ねされ
た部材の場合であるが、内外に同軸円筒重ね合わせ状
(バウムクーヘン状或いは同心円状)に複数のパイプ及
び中実丸棒を接合してもよい。
In this state, the atmosphere control device is operated to create a desired atmosphere in the chamber C. In this case, the inside of the chamber is evacuated to a vacuum state, for example, about 6.7 pascals (Pa) (5 × 10 -2 torr). After the evacuation of the chamber is completed, the switch device 71 is turned on in response to a command from the control device 60, and the power supply device 70 passes through the vertical energizing electrode assembly to the pipes M1 and M2 for 6 to 1
A DC pulse current of 300 to 800 amperes (A) is applied at 2 volts (V). As the current flows, the pipe heats up and its temperature rises.Because the upper and lower parts are mechanically fixed, thermal expansion causes strain in the axial direction, the applied pressure gradually increases, and the pipe remains in the axial direction with a high pressing force. The pipe buckles when pressed against. Therefore, after fixing the pipe, the pressing force applied to the pipe by the pressing device 40 is reduced to, for example, 0.5 to 1.0 megapascal (MP), and the energization of the pulse current is started. After that, the pressing force is feedback-controlled based on the detection signal from the pressure sensor 61, and the pressing force is held. The feed mechanism of the energizing and pressurizing shaft may be incorporated with a program for fast-forwarding to the front end surface of the pipe by about 1 to 2 mm, and then decelerating until it comes into contact with the rear end surface. Since both pipes are joined in a short time of about 2 to 5 minutes from the start of energization to the pipes, the switch device is turned off to stop energization. The principle of this joining is as follows. When a direct current pulse current is applied, the contacting interface portion with high contact resistance is heated to a high temperature by Joule heating. Further, the entire material is Joule heated by the resistance value of the material itself. Further, a high pressure is generated at the contact interface between the members that are vertically stacked due to the plastic deformation and the thermal expansion due to the vertical uniaxial pressure. Further, an electric field is generated along the direction of the flow of the on-off pulse current, and electric field diffusion occurs. It is considered that this electric field diffusion effect and the mechanical pressure of the above-mentioned thermal diffusion contribute to the solid phase diffusion bonding and bring about the orientation of the metal crystal structure. Since this joining is not always performed with sufficient joining strength, it is called temporary joining here, and the temporarily joined one is called a temporary joined body. After the energization is stopped, the chamber is returned to atmospheric pressure and the lower housing part is lowered so that the temporary bonded body sandwiched between the upper and lower energizing electrodes can be taken out. After that, the movable table is lowered and the temporary bonded body is taken out between the upper and lower energizing electrodes to complete the temporary bonding. In the above case, the temporary bonded body is cooled by natural cooling, but if you want to forcibly cool it,
After the energization is stopped, a cooled inert gas may be supplied into the chamber, or a cooling stage having a heat absorbing structure member may be separately provided to cool the chamber. Although the first embodiment is a case of vertically stacked members, a plurality of pipes and solid round bars may be joined inside and outside in a coaxial cylindrical stacked shape (Baumkuchen shape or concentric shape).

【0018】上記のような薄肉のパイプ同士の接合、径
の小さい棒材又は線材同士の接合、或いは棒材、線材又
は薄肉パイプと板材との接合のように接合面の面積が小
さい場合には大きな力を加えると被接合部材が常温でも
座屈、屈曲等が起こり、被接合部材が発熱して高温にな
るとより小さな押圧力で座屈を起こす。このため、被接
合部材の寸法(長さ、外径、肉厚等)及び材質に応じた
制御プログラム(押圧力減少開始温度、押圧力、通電時
間等を決めた制御プログラム)を予め種々作成してお
き、その制御プログラムにしたがって押圧装置40によ
り押圧力の増減フィードバック制御を行う。そして、押
圧装置による押圧力は、可能な限りゼロに近い値でも制
御できるようにしておく。このようなフィードバック制
御のフローチャートを示せば図5に示されるようにな
る。
When the area of the joint surface is small as in the case of joining thin pipes as described above, joining rods or wires having a small diameter, or joining rods, wires or thin pipes and plates, If a large force is applied, the members to be joined will buckle or bend even at room temperature, and if the members to be joined generate heat and become hot, they will buckle with a smaller pressing force. Therefore, various control programs (control programs that determine the pressing force decrease start temperature, pressing force, energizing time, etc.) according to the dimensions (length, outer diameter, wall thickness, etc.) and material of the members to be joined are created in advance. The pressing device 40 performs the increase / decrease feedback control of the pressing force according to the control program. Then, the pressing force of the pressing device can be controlled to a value as close to zero as possible. A flow chart of such feedback control is shown in FIG.

【0019】上記通電接合装置により行われた両パイプ
の接合は仮接合である。パイプの使用目的によっては仮
接合程度の接合強度でも良い場合がある。その場合に
は、上記仮接合されたパイプM1及びM2を、図4
[B]に示される仮接合体M3として通電接合装置から
取り出して使用に供する。両パイプの接合を高い接合強
度で本接合させる場合には、下記のような条件で熱処理
を行う。 熱処理温度 900℃〜1000℃ 熱処理時間 30分〜90分 上記熱処理の条件は被接合部材として前記ステンレス鋼
製薄肉パイプを仮接合した仮接合体に対するものであ
り、被接合部材の大きさ、材質等により異なるものであ
る。
The joining of both pipes performed by the above-mentioned current joining device is temporary joining. Depending on the purpose of use of the pipe, there may be a case where the joining strength is about temporary joining. In that case, the temporarily joined pipes M1 and M2 are
The temporary bonded body M3 shown in [B] is taken out from the current welding apparatus and used. When the main joining of both pipes is performed with high joining strength, heat treatment is performed under the following conditions. Heat treatment temperature 900 ° C. to 1000 ° C. Heat treatment time 30 minutes to 90 minutes The above heat treatment conditions are for a temporarily joined body obtained by temporarily joining the stainless steel thin-walled pipe as a joined member, and the size, material, etc. of the joined member. It depends on

【0020】次に、上記のように仮接合されたパイプM
1及びM2(したがってここでは仮接合体M3)を上記
通電接合装置を使用して熱処理を行う場合について説明
する。仮接合のための通電が終了した後、チャンバC内
の真空雰囲気をそのまま保持しておき、或いはチャンバ
内に不活性ガスを流して冷却することによりチャンバC
内の温度が上記熱処理温度に適した温度まで下がった
後、電源装置70から熱処理温度に保つための熱処理用
電流すなわち5ないし20ボルトで、500ないし10
00アンペアの直流電流を約10〜30分流す。この場
合チャンバ内に設けられた温度センサによりチャンバ内
の温度が熱処理温度に保たれるように、電流値をフィー
ドバック制御する。この熱処理により両パイプの接合は
完全なもの(本接合)になる。熱処理が完了後チャンバ
C内の冷却(自然冷却でも強制冷却でもよい)を待って
下ハウジング部分を降下させかつ可動テーブルを降下さ
せて本接合されたパイプを取り出して使用に供する。通
常、熱処理時間が仮接合時間より遙かに長いので、上記
のように通電接合装置を使用して熱処理を行うのは効率
が悪い。したがって、このような熱処理を行うのは単
品、少量生産の場合などに適している。
Next, the pipe M temporarily joined as described above.
A case will be described where 1 and M2 (hence the temporary bonded body M3 here) are heat-treated using the above-described current-flow bonding apparatus. After the energization for the temporary joining is completed, the vacuum atmosphere in the chamber C is maintained as it is, or an inert gas is allowed to flow in the chamber to cool the chamber C.
After the internal temperature has dropped to a temperature suitable for the heat treatment temperature, the heat treatment current for maintaining the heat treatment temperature from the power supply device 70, that is, 5 to 20 volts, 500 to 10
A direct current of 00 amps is applied for about 10 to 30 minutes. In this case, the temperature value provided in the chamber feedback-controls the current value so that the temperature in the chamber is maintained at the heat treatment temperature. This heat treatment completes the joining of the two pipes (main joining). After the heat treatment is completed, the inside of the chamber C is waited for cooling (either natural cooling or forced cooling), the lower housing part is lowered, and the movable table is lowered to take out the main joined pipes for use. Usually, since the heat treatment time is much longer than the temporary joining time, it is inefficient to perform the heat treatment using the current joining device as described above. Therefore, such heat treatment is suitable for a single product or a small amount production.

【0021】図6において、本発明の通電接合装置の別
の実施形態が示されている。この通電接合装置は、熱処
理を行う熱処理部80を更に備えている。この熱処理部
は市場で入手可能な公知の構造の熱処理炉で良い。この
熱処理炉で熱処理する場合は、上記通電接合装置1によ
り仮接合されたパイプが複数個たまったときまとめてバ
ッチ式に熱処理炉に入れて一度に熱処理を行う。このよ
うにするのは、仮接合は数分で行えるのに対して熱処理
は数十分かかるので仮接合された仮接合体を複数まとめ
て熱処理を行うことによって、効率を良くでき、接合品
の大量生産に適している。
In FIG. 6, another embodiment of the current welding apparatus of the present invention is shown. The current welding apparatus further includes a heat treatment section 80 that performs heat treatment. This heat treatment part may be a heat treatment furnace of a known structure available on the market. In the case of heat treatment in this heat treatment furnace, when a plurality of pipes temporarily joined by the current joining device 1 are accumulated, they are put in a batch type heat treatment furnace and heat treated at once. Since the heat treatment takes several tens of minutes while the temporary joining can be performed in a few minutes, it is possible to improve the efficiency and improve the efficiency of the joined product by collectively performing the heat treatment on the temporarily joined temporary joined bodies. Suitable for mass production.

【0022】通電接合装置は、更に、仮接合された部材
すなわち仮接合体を熱処理部80に自動的に供給する搬
送装置90を備えていても良い。この搬送装置は、通電
接合装置1の上、下通電電極間から仮接合体を取り出す
公知の構造のロボット装置91と、ロボット装置91に
より取り出された仮接合体を複数個まとめて熱処理部8
0内に送るコンベヤ92とを備えている。ロボット装置
91は、角θの範囲で揺動可能なアーム911と、その
アームの先端に取り付けられたチャック912とを備え
ている。この別個に設けられた熱処理部に熱処理を行う
ことにより複数の仮接合体をバッチ式まとめて熱処理で
きるので効率良く接合できる。したがって、同一品から
成る多数の接合体を製造する場合に適している。なお、
図示しないが、アーム911の揺動範囲の途中に設けた
供給コンベアにより接合すべき部材を上下に重ねた状態
で供給し、チャックで把持して自動的に上、下通電電極
の間に自動的に供給し、チャックで把持した状態でそれ
らの通電電極で押圧して押さえるようにしてもよい。な
お、図示しないが、TPマガジンから接合装置へ、接合
装置から熱処理炉へ、更に熱処理炉から冷却済み又は処
理済み接合品用のマガジンへの自動搬送を行う装置を備
えていても良い。
The electrical joining apparatus may further include a transfer device 90 for automatically supplying the temporarily joined members, that is, the temporarily joined body, to the heat treatment section 80. This transfer device includes a robot device 91 having a known structure that takes out a temporary bonded body from between the lower conductive electrodes on the current-carrying bonding device 1, and a plurality of temporary bonded bodies taken out by the robot device 91 together.
0, and a conveyor 92 for sending the paper to the inside. The robot device 91 includes an arm 911 that can swing within an angle θ and a chuck 912 attached to the tip of the arm. By performing the heat treatment on the separately provided heat treating portions, a plurality of temporary joined bodies can be collectively heat treated in a batch manner, so that the joining can be performed efficiently. Therefore, it is suitable for manufacturing a large number of joined bodies made of the same product. In addition,
Although not shown, members to be joined are supplied in a vertically stacked state by a supply conveyor provided in the middle of the swinging range of the arm 911, gripped by a chuck and automatically placed between the upper and lower energizing electrodes. It is also possible to supply the same to the electrodes and press and hold them with the current-carrying electrodes while gripping them with the chuck. Although not shown, a device for automatically carrying the TP magazine to the joining device, the joining device to the heat treatment furnace, and the heat treatment furnace to the magazine for the cooled or treated joined article may be provided.

【0023】[0023]

【実施例2】図7[A]に示されるような細い線材N1
の端面と板材N2一方の表面とを接合する場合について
説明する。ここで、線材N1はモリブデン製で、長さL
2=25mm、外径d3=5mmであり、板材N2はタン
グステン製で、直径d4=30mmで肉厚がt2=5mm
の円板であるものとする。この場合、線材N1の端面及
び板材N2の表面の互いに当接する部分は均等に接触す
るよう加工しておく。好ましくは、鏡面に研磨してお
く。このように用意しかつ互いに突き合わせた線材及び
板材を前記実施例1と同様にして通電接合装置1により
まず仮接合した。その時、初期押圧5メガパスカルの力
で上下通電電極により押さえた。
Example 2 A thin wire N1 as shown in FIG. 7A.
A case where the end face of the plate member and one surface of the plate member N2 are joined together will be described. Here, the wire N1 is made of molybdenum and has a length L.
2 = 25 mm, an outer diameter d 3 = 5 mm, the plate material N2 is made of tungsten, the thickness in the diameter d 4 = 30 mm is t 2 = 5 mm
It is assumed that it is a disc. In this case, the end surfaces of the wire N1 and the surface of the plate N2 that are in contact with each other are processed so as to be in uniform contact with each other. Preferably, the mirror surface is polished. The wire rod and the plate member thus prepared and butted against each other were first temporarily joined by the current joining device 1 in the same manner as in the first embodiment. At that time, it was pressed by the upper and lower energizing electrodes with a force of initial pressing of 5 megapascals.

【0024】この状態で雰囲気制御装置を動作させてチ
ャンバC内を真空引きして真空状態(5×10-2tor
r)にした後、押圧装置によるプリセット設定圧力を2
メガパスカルにし上下通電電極組立体を通して線材及び
板材に3ないし12ボルト(V)で200ないし600
アンペア(A)の直流パルス電流を流した。電流が流れ
るに従ってパイプは発熱し高温になったので、非接触式
の赤外線放射型温度計で計測した。接合部分の温度が1
350℃になるまで押圧力を1〜2メガパスカルの間で
フィードバック制御してこの押圧力を保持した。通電開
始から5分後に通電を停止した。これにより図7[B]
に示されるような線材と板材の仮接合体N3ができあが
った。この仮接合体N3を熱処理部80の真空熱処理炉
内を使用して熱処理温度1180℃、熱処理時間40〜
60分に亘って熱処理を行った。この熱処理により線材
と板材の接合は完全なものになった。なお、上記実施例
ではステンレス製薄肉パイプの接合及びモリブデン製線
材とタングステン製板材との接合についてのみ説明した
が、その他、接合面積の小さな種々の部材の接合に、し
かも種々の材質の部材の接合に本発明の方法及び装置を
使用することが可能である。例えば、図8[A]に示さ
れるように、基板O1に複数の小径の円柱状又は円筒状
チップO2を接合する場合、 図8[B]に示されるよ
うに、円板P1に小歯車P2を接合する場合、図8
[C]に示されるように、基板Q1にカム部材Q2を接
合する場合、図8[D]に示されるように、複数の形状
の異なる複数の小形のカムR1ないしR3を隣接して接
合する場合、図8[E]に示されるように、ブロック材
S1に小部品S2を接合する場合等である。
In this state, the atmosphere control device is operated to evacuate the chamber C to create a vacuum state (5 × 10 -2 torr).
After setting r), set the preset pressure by the pressing device to 2
200 to 600 for 3 to 12 volts (V) on the wire and plate through the vertical energizing electrode assembly in megapascal
A direct current pulse current of ampere (A) was applied. The pipe generated heat as the current flowed and became hot, so the temperature was measured with a non-contact infrared radiation thermometer. The temperature of the joint is 1
This pressing force was maintained by feedback controlling the pressing force between 1 and 2 megapascals until it reached 350 ° C. The energization was stopped 5 minutes after the start of the energization. As a result, FIG. 7 [B]
A temporary bonded body N3 of the wire and the plate as shown in FIG. This temporary bonded body N3 is heat-treated at a temperature of 1180 ° C. for a heat treatment time of 40-
Heat treatment was performed for 60 minutes. By this heat treatment, the joining of the wire and the plate was completed. In the above example, only the joining of stainless thin pipes and joining of molybdenum wire rods and tungsten plate members were described, but in addition, joining of various members with a small joining area, and joining of members of various materials It is possible to use the method and apparatus of the present invention. For example, as shown in FIG. 8 [A], when a plurality of small-diameter columnar or cylindrical chips O2 are bonded to the substrate O1, as shown in FIG. 8 [B], a small gear P2 is attached to the disc P1. When joining
When the cam member Q2 is joined to the substrate Q1 as shown in [C], a plurality of small cams R1 to R3 having different shapes are joined adjacent to each other as shown in FIG. 8D. In this case, as shown in FIG. 8E, the small component S2 is joined to the block material S1.

【0025】[0025]

【発明の効果】本発明により次のような効果を奏するこ
とが可能である。 (イ)薄肉パイプ同士のように接合面積の小さな部材間
の接合を固相拡散接合になるパルス通電接合法で相互の
部材が全当接面に亘り完全密着シール状態で簡単にしか
も座屈、屈曲変形等を起こさせることなくかつ母材並の
強度を持った高品位の接合部品の大量生産ができる。 (ロ)従来の接合法では接合できない異種又は同種材質
の部材同士を簡単に接合させることができる。 (ハ)台座形状部品を、ブロック状の素材から切削加工
(フライス加工、放電加工等)で複雑な形状に削り出す
ことなく、基板材料に小片の部材をパルス通電接合する
ことで製作できるので、大幅な工程削減、コスト削減が
できる。 (ニ)エンドミルの刃先では切削不可能な直角や鋭角を
もつ平坦部と突起部分との一体形状やアンダーカット形
状でも容易につくることができ、一体部材から切削加工
で製造するよりも形状設計の自由度が広がる。 (ホ)固相拡散接合部品が短時間で廉価に簡便に量産が
可能となる。 (ヘ)ロー付け品、溶接品に比べて組織的にもまた機械
特性的にも信頼度の高い部品をつくることができる。
According to the present invention, the following effects can be achieved. (B) By means of the pulse current welding method, which joins members with a small joining area such as thin-walled pipes into solid-phase diffusion joining, mutual members can be easily and buckled in a completely tightly sealed state over all contact surfaces, It is possible to mass-produce high-quality bonded parts that do not cause bending deformation and have the same strength as the base material. (B) It is possible to easily join members made of different materials or the same material that cannot be joined by the conventional joining method. (C) Since the pedestal-shaped component can be manufactured by pulse-current welding a small piece of member to the substrate material without cutting the block-shaped material into a complicated shape by cutting (milling, electric discharge machining, etc.), Significant process reduction and cost reduction can be achieved. (D) It is possible to easily create an integrated shape or an undercut shape of a flat part and a protruding part having a right angle or an acute angle that cannot be cut by the end mill's cutting edge, and it is easier to make a shape design than a manufacturing process from an integrated member. Greater freedom. (E) Solid-phase diffusion bonding parts can be mass-produced easily in a short time at low cost. (F) Compared to brazed products and welded products, it is possible to make parts that are both structurally and mechanically highly reliable.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明による小接合面用パルス通電接合装置の
縦断面図である。
FIG. 1 is a vertical sectional view of a pulsed current joining apparatus for small joining surfaces according to the present invention.

【図2】図1の線A−Aに沿って見た小接合面用パルス
通電接合装置の断面図である。
FIG. 2 is a cross-sectional view of the pulsed current joining apparatus for small joining surfaces as seen along the line AA in FIG.

【図3】図1の小接合面用パルス通電接合装置の電気及
び制御系統の接続関係を示すずである。
FIG. 3 is a view showing a connection relationship between electric and control systems of the pulse current welding device for a small joint surface of FIG.

【図4】図1の小接合面用パルス通電接合装置を使用し
て接合する第1の実施例の部材及び仮接合体を示す斜視
図である。
FIG. 4 is a perspective view showing a member and a temporary bonded body of a first embodiment that are bonded by using the pulsed current bonding apparatus for a small bonding surface of FIG.

【図5】図1の小接合面用パルス通電接合装置の押圧力
のフィードバック制御を示すフローチャートである。
5 is a flowchart showing feedback control of pressing force of the pulsed current welding apparatus for small welding surfaces in FIG. 1. FIG.

【図6】本発明の小接合面用パルス通電接合装置の変形
例を示す図である。
FIG. 6 is a view showing a modified example of the pulse current joining device for small joining surfaces of the present invention.

【図7】図1の小接合面用パルス通電接合装置を使用し
て接合する第2の実施例の部材及び仮接合体を示す斜視
図である。
FIG. 7 is a perspective view showing a member and a temporary bonded body of a second embodiment that are bonded by using the pulse current welding device for a small bonding surface of FIG.

【図8】小接合面用パルス通電接合装置を使用して接合
するその他の例を示す概略斜視図である。 1 パルス通電接合装置 10 フレーム装置 20 可動テーブ
ル装置 21 可動テーブル 30 通電電極装
置 31 下通電電極組立体 32 上通電電極
組立体 33 下通電電極 34 上通電電極 40 押圧装置 50 ハウジング 51 下ハウジング部分 52 上ハウジン
グ部分 60 制御装置 61 圧力センサ 62 圧力センサ 63 温度センサ 70 電源装置 71 スイッチ装
置 80 熱処理部 90 搬送装置
FIG. 8 is a schematic perspective view showing another example of joining using the pulse current joining device for small joining surfaces. DESCRIPTION OF SYMBOLS 1 pulse energization joining device 10 frame device 20 movable table device 21 movable table 30 energizing electrode device 31 lower energizing electrode assembly 32 upper energizing electrode assembly 33 lower energizing electrode 34 upper energizing electrode 40 pressing device 50 housing 51 lower housing part 52 upper Housing part 60 Control device 61 Pressure sensor 62 Pressure sensor 63 Temperature sensor 70 Power supply device 71 Switch device 80 Heat treatment part 90 Transfer device

Claims (12)

【特許請求の範囲】[Claims] 【請求項1】 互いに接合すべき小接合面を有する複数
の部材を、所望の雰囲気に保持されたチャンバ内に入れ
かつ接合面を当接させた状態で対の通電電極により挟
み、前記複数の部材に前記対の通電電極を介して所望の
電圧及び電流のパルス電流を流して前記接合面で接合す
る小接合面用パルス通電接合方法において、 通電開始前に所望の第1の押圧力で前記複数の部材を押
圧し、 通電開始後前記チャンバ内の温度が前記接合される複数
の部材の材質及び寸法によって決まる温度に達した後、
前記材質及び寸法によって決まる第2の押圧力で前記複
数の部材を押圧し、 前記複数の部材を仮接合して仮接合体することを特徴と
する小接合面用パルス通電接合方法。
1. A plurality of members having small bonding surfaces to be bonded to each other are placed in a chamber maintained in a desired atmosphere and sandwiched by a pair of energizing electrodes in a state where the bonding surfaces are in contact with each other. In a pulsed current joining method for a small joining surface, in which a pulsed current having a desired voltage and a current is applied to a member through the pair of energizing electrodes to join at the joining surface, the method is performed with a desired first pressing force before starting energization. After pressing a plurality of members, the temperature in the chamber after the start of energization reaches a temperature determined by the materials and dimensions of the plurality of members to be joined,
A pulsed current joining method for a small joining surface, characterized in that the plurality of members are pressed with a second pressing force determined by the material and size, and the plurality of members are temporarily joined to form a temporary joined body.
【請求項2】 請求項1に記載の小接合面用パルス通電
接合方法において、 前記第2の押圧力での押圧を、前記部材に加えられる押
圧力を常時圧力センサで検出し、フィードバックさせて
制御する小接合面用パルス通電接合方法。
2. The method of pulse current welding for a small joint surface according to claim 1, wherein the pressing force applied to the member is constantly detected by a pressure sensor to feed back the pressing force with the second pressing force. Controlled pulse current welding method for small joint surfaces.
【請求項3】 請求項1又は2に記載の小接合面用パル
ス通電接合方法において、前記接合面を鏡面に研磨する
小接合面用パルス通電接合方法。
3. The pulse current welding method for a small joint surface according to claim 1, wherein the joint surface is polished into a mirror surface.
【請求項4】 請求項1、2又は3に記載の小接合面用
パルス通電接合方法において、更に、 前記仮接合された部材を前記部材の材質及び寸法によっ
て決まる温度及び時間により熱処理を施すことを特徴と
する小接合面用パルス通電接合方法。
4. The pulse current joining method for a small joining surface according to claim 1, 2 or 3, further comprising heat-treating the temporarily joined member at a temperature and a time determined by the material and size of the member. A method for pulse current welding for small joint surfaces, characterized by.
【請求項5】 請求項4に記載の小接合面用パルス通電
接合方法において、 前記熱処理を、前記仮接合に引き続いて前記チャンバ内
で前記通電電極により熱処理電流を流して行うことを特
徴とする小接合面用パルス通電接合方法。
5. The pulse current joining method for a small joining surface according to claim 4, wherein the heat treatment is performed by causing a heat treatment current to flow in the chamber in the chamber subsequent to the temporary joining. Pulse current welding method for small joint surfaces.
【請求項6】 請求項4に記載の小接合面用パルス通電
接合方法において、前記熱処理を、前記仮接合された複
数の仮接合体をまとめて熱処理炉によって行うことを特
徴とする小接合面用パルス通電接合方法。
6. The small joint surface pulse energization joining method according to claim 4, wherein the heat treatment is performed by collectively using a heat treatment furnace for the plurality of temporarily joined temporary joined bodies. Energization welding method for.
【請求項7】 対の通電電極と、前記対の通電電極の少
なくとも一方を他方に対して相対的に移動する圧力可変
の押圧装置と、前記通電電極にパルス電流を供給する電
源装置と、少なくとも前記通電電極間の空間を所望の雰
囲気に制御可能なチャンバとを備え、前記対の通電電極
の間で互いに接合すべき小接合面を有する部材を接合面
を当接させた状態で挟み、前記部材に所望の電圧及び電
流のパルス電流を流して前記接合面で仮接合して仮接合
体にする小接合面用パルス通電接合装置において、 前記接合すべき部材に加えられる圧力を検出可能な圧力
センサと、 前記圧力センサにより検出した検出値に基づいて前記押
圧装置の押圧力を制御可能な制御装置とを備え、前記制
御装置が前記押圧装置による押圧力を、接合すべき部材
の材質及び寸法により決まる値でフィードバック制御す
る小接合面用パルス通電接合装置。
7. A pair of energizing electrodes, a pressure variable pressing device that moves at least one of the pair of energizing electrodes relative to the other, and a power supply device that supplies a pulse current to the energizing electrodes. A chamber capable of controlling the space between the current-carrying electrodes to a desired atmosphere, and sandwiching a member having small bonding surfaces to be bonded to each other between the pair of current-carrying electrodes with the bonding surfaces in contact with each other, In a pulsed current joining device for a small joining surface, in which a pulse current of a desired voltage and current is applied to a member to temporarily join the joining surfaces to form a temporary joined body, a pressure capable of detecting the pressure applied to the members to be joined A sensor and a control device capable of controlling the pressing force of the pressing device based on a detection value detected by the pressure sensor, the control device pressing force by the pressing device, the material of the member to be joined and Small joint surface pulse current welding apparatus feedback control value determined by law.
【請求項8】 請求項7に記載の小接合面用パルス通電
接合装置において、前記圧力可変押圧装置がボールねじ
装置及び前記ボールねじ装置を駆動する微小回転制御可
能な電動モータである小接合面用パルス通電接合装置。
8. The small joint surface pulse current welding device according to claim 7, wherein the pressure variable pressing device is a ball screw device and an electric motor for driving the ball screw device which is capable of minute rotation control. Pulse energizing welding equipment.
【請求項9】 請求項7又は8に記載の小接合面用パル
ス通電接合装置において、前記対の通電電極に前記パル
ス電流を供給する電源装置が、前記通電電極に熱処理用
電流を供給可能であり、前記仮接合後に前記通電電極に
前記熱処理用電流を流して前記チャンバ内で熱処理を行
う小接合面用パルス通電接合装置。
9. The pulse current welding apparatus for a small welding surface according to claim 7, wherein the power supply device that supplies the pulse current to the pair of current-carrying electrodes is capable of supplying a heat treatment current to the current-carrying electrodes. A pulsed current welding apparatus for small welding surfaces, in which the heat treatment current is passed through the current-carrying electrode to perform heat treatment in the chamber after the temporary welding.
【請求項10】 請求項7又は8に記載の小接合面用パ
ルス通電接合装置において、更に、前記仮接合体の熱処
理を行う熱処理炉を備える小接合面用パルス通電接合装
置。
10. The pulse current welding apparatus for small joint surfaces according to claim 7 or 8, further comprising a heat treatment furnace for performing heat treatment on the temporary joint body.
【請求項11】 請求項10に記載の小接合面用パルス
通電接合装置において、更に、前記仮接合体を前記熱処
理炉に自動的に供給する搬送装置を備える小接合面用パ
ルス通電接合装置。
11. The pulse current welding apparatus for a small bonding surface according to claim 10, further comprising a conveying device that automatically supplies the temporary bonded body to the heat treatment furnace.
【請求項12】 請求項1ないし6に記載の小接合面用
パルス通電接合方法により接合された接合体。
12. A joined body joined by the pulse current joining method for a small joining surface according to claim 1.
JP2001301600A 2001-09-28 2001-09-28 Pulse current welding method for small joint surface Expired - Fee Related JP4080716B2 (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090289041A1 (en) * 2005-07-29 2009-11-26 Takeshi Tsukamoto Electric joining method and electric joining apparatus
WO2012117908A1 (en) * 2011-03-02 2012-09-07 株式会社タカコ Method for fabricating slidable member
JP2013086162A (en) * 2011-10-21 2013-05-13 Akim Kk Welding method and welding equipment
WO2013076759A1 (en) * 2011-11-22 2013-05-30 三菱電機株式会社 Metal bonding method
KR20190037695A (en) * 2017-09-29 2019-04-08 서울대학교산학협력단 Activated sintering apparatus having pressure control part
CN113492252A (en) * 2021-06-10 2021-10-12 河北荣泰模具科技股份有限公司 Automatic fusion welding device for production of PTA process punch

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090289041A1 (en) * 2005-07-29 2009-11-26 Takeshi Tsukamoto Electric joining method and electric joining apparatus
WO2012117908A1 (en) * 2011-03-02 2012-09-07 株式会社タカコ Method for fabricating slidable member
JP2013086162A (en) * 2011-10-21 2013-05-13 Akim Kk Welding method and welding equipment
WO2013076759A1 (en) * 2011-11-22 2013-05-30 三菱電機株式会社 Metal bonding method
KR20190037695A (en) * 2017-09-29 2019-04-08 서울대학교산학협력단 Activated sintering apparatus having pressure control part
KR102043679B1 (en) * 2017-09-29 2019-11-12 서울대학교산학협력단 Activated sintering apparatus having pressure control part
CN113492252A (en) * 2021-06-10 2021-10-12 河北荣泰模具科技股份有限公司 Automatic fusion welding device for production of PTA process punch
CN113492252B (en) * 2021-06-10 2024-04-23 河北荣泰模具科技股份有限公司 Automatic fusion welding device for PTA process punch production

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