JP2003106707A - Water cooling condensing unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve problems that is an extremely severe temperature control such that a temperature change falls in a range of 0.1 deg.C is required in a semiconductor manufacturing device, while the amount of heat exchange in a shell and tube condensing unit of an air conditioning device should be large when a compressor of the air conditioning device is operated by inverter control at 120 Hz and at 100% capability, so, it is necessary to increase the flow velocity of water but if the flow velocity is increased, holes are liable to be made on tubes, and accordingly, if the amount of heat exchanger is increased while the flow velocity of water is limited, the condenser needs to be enlarged. SOLUTION: The water cooling condensing unit has a laminate plate condenser, wherein a plurality of heat transfer plates are laminated on each other in a relationship where a refrigerant passage is formed on one side of each heat transfer plate and a water passage is formed on the other side, the refrigerant and the water exchange heat via the heat transfer plates, and the refrigerant passage and the water passage are respectively communicated with another refrigerant passage and another water passage that communicates with the outside of the condenser.

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a water-cooled condensing system comprising a compressor and a condenser for exchanging heat of the refrigerant compressed by the compressor with water for condensation. About the unit. 2. Description of the Related Art An air conditioner used in a semiconductor manufacturing apparatus or the like requires extremely strict temperature control so that a temperature change of the semiconductor manufacturing apparatus falls within a range of about 0.1 ° C. Conventionally, the condensing unit of the air conditioner used here is a water-cooled condensing unit including a compressor and a condenser for exchanging heat with water and condensing the refrigerant compressed by the compressor, This condenser is called a shell-and-tube type, and is composed of a tank and a copper tube spirally wound in the tank. A refrigerant is introduced into the tank, and water is introduced into the tube. Is a mechanism for heat exchange. In particular, air conditioners used in semiconductor manufacturing equipment and the like have strict temperature control as described above.
Needless to say, it is necessary to change the capacity of the air conditioner according to the capacity of the semiconductor manufacturing equipment and the like, and to satisfy both, it is necessary to control the capacity of the air conditioner by inverter control. In order to control the capacity of the air conditioner in the range of 20% to 100%, a method of controlling the rotation speed of the compressor in the range of 20 Hz to 120 Hz is adopted. [0004] However, the compressor of the air conditioner is set to 120.
In the case of 100% capacity operation at Hz, for example, it is necessary to increase the condensation capacity of the refrigerant following this, and it is necessary to increase the heat exchange amount of the above-mentioned shell and tube condenser. For this purpose, it is necessary to increase the flow rate of water in the tube of the shell-and-tube type condenser, but if it is too high, there is a possibility that a hole is formed in the tube. Therefore, in order to increase the amount of heat exchange by limiting the flow rate of water, a method of increasing the size of the shell and tube condenser and increasing the amount of heat exchange here is adopted. However, increasing the size of the air conditioner is not preferable from the viewpoint of a semiconductor manufacturing device or the like. SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a water-cooled condensing unit for a small condenser that has a sufficient condensing capacity in an air conditioner used in a semiconductor manufacturing apparatus or the like. Is provided. [0006] In order to solve the above-mentioned problems, the present invention provides a water-cooled condensing unit, which condenses a compressor and a refrigerant compressed by the compressor by exchanging heat with water. A relationship in which a refrigerant flow path is formed on one surface of the heat transfer plate and a water flow path is formed on the other surface, and the refrigerant and water exchange heat through the heat transfer plate. A plurality of the heat transfer plates are stacked on each other, and each of the refrigerant passages and the water passages is a laminated plate condenser that communicates with a refrigerant passage and a water passage that communicate with the outside of the condenser. As a result, since the heat exchange between the refrigerant and the water is performed on the surface of the heat transfer plate, the amount of heat exchange is determined by the amount of water without increasing the flow velocity of the water. In addition, even if it is small, it becomes a condenser with a large heat exchange amount, the size of the water-cooled condensing unit can be reduced, and the air conditioner can be made more compact. For this reason, temperature control is strict, as in air conditioners such as semiconductor manufacturing equipment, and the ability of air conditioners is controlled by inverter control to change the capacity of air conditioners according to the capacity of semiconductor manufacturing equipment. Even in the case of controlling, even if it is small, it can be applied to a wide range of changes in the amount of heat exchange. Next, an embodiment of the present invention will be described. Each drawing shows an embodiment of the present invention, FIG. 1 is a schematic plan view of a water-cooled condensing unit of the present invention, FIG. 2 is an exploded perspective view of a condenser according to the present invention, and FIG. FIG. 4 is a side view of the condenser according to the present invention, FIG. 5 is an explanatory diagram of a configuration of an end of the condenser on the seal plate side, and FIG. 6 is a schematic side view of a water-cooled condensing unit of the present invention. It is. The water-cooled condensing unit 1 of the present invention
Will be described based on the drawings. The condensing unit is given this name because the refrigerant compressed by the compressor is condensed by the condenser. The water-cooled condensing unit 1 of the present invention includes, on a base 20, a compressor 2 and a condenser 3 for exchanging heat of the refrigerant compressed by the compressor 2 with water for condensation. The condenser 3 has a plurality of heat transfer plates 4 stacked such that a coolant passage 5 is formed on one surface of the heat transfer plate 4 and a water passage 6 is formed on the other surface of the heat transfer plate 4. Thus, the laminated plate type condenser 3 in which the refrigerant and the water exchange heat is constituted. Each of the refrigerant passages 5 and the water passages 6 communicates with a refrigerant passage 7 and a water passage 8 that communicate with the outside of the condenser 3, respectively. The water-cooled condensing unit 1 shown in the figure
Indicates that the compressor 2 is a rotary type of a two-cylinder type,
The refrigeration system includes a receiver tank 21 and an accumulator 22. The condenser 3 will be described in more detail. As shown in FIG. 2, a plurality of heat transfer plates 4 formed in a stainless steel corrugated shape 10 are alternately overlapped, and the heat transfer plates 4 are brazed with copper, nickel, or the like. The laminated body of the heat plate 4 is formed, and the laminated body is supported by stainless steel cover plates 9 provided at left and right ends thereof. Each heat transfer plate 4 is made of copper,
One of the cover plates 9 brazed with nickel or the like is provided with an inlet pipe 12 and an outlet pipe 13 for the refrigerant.
And an inlet pipe 14 and an outlet pipe 15 for water. One cover plate 9 provided with the inlet pipe and the outlet pipe
A seal plate 11 for shutting off air is attached between the heat transfer plate 4 and the heat transfer plate 4 adjacent thereto, thereby preventing damage to the plate due to freezing of moisture in the air. In the laminated plate type condenser 3 configured as described above, the refrigerant compressed by the refrigerant compressor 2 of the air conditioner flows in from the refrigerant inlet pipe 12 and passes through each port 30 as shown by an arrow. The refrigerant flows through a coolant channel 5 formed between the heat transfer plates 4. On the other hand, water, which is a kind of brine supplied from a chiller or the like for absorbing the heat of the refrigerant, flows in from the water inlet pipe 14 and is similarly formed between the heat transfer plates 4 through the respective ports 40. Through the flowing water flow path 6. Refrigerant flowing through refrigerant flow path 5 sandwiching heat transfer plate 4 and water flow path 6
The flow directions of the water flowing in the water flow form opposite flows flowing in opposite directions, and heat exchange between the refrigerant flowing in the refrigerant flow path 5 and the water flowing in the water flow path 6 is effectively performed at the waveform 10 portion. As a result, since the heat exchange between the refrigerant and the water is performed on the surface of the heat transfer plate 4, the amount of heat exchange is determined by the amount of water without increasing the flow velocity of the water. Is also gone. For this reason, even if it is small, it becomes a condenser with a large heat exchange amount, the size of the water-cooled condensing unit can be reduced, and the compactness of the air conditioner can be achieved. In the case where temperature control by the air conditioner needs to be strictly controlled according to the production capacity as in a semiconductor manufacturing device, the refrigerant compressor of the water-cooled condensing unit 1 which is a component of the air conditioner is used. By changing the number of revolutions by inverter control according to the manufacturing capacity of the semiconductor manufacturing apparatus, air conditioning according to the manufacturing capacity of the semiconductor manufacturing apparatus can be achieved. Even in such a case, the adoption of the condenser 3 of the present invention results in a water-cooled condensing unit 1 which can be applied to a wide range of heat exchange even if it is small, so that a small air conditioner for a semiconductor manufacturing apparatus is provided. Becomes possible. The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the technical scope of the present invention, and the invention includes various embodiments. According to the first aspect of the present invention, since the heat exchange between the refrigerant and the water is performed on the surface of the heat transfer plate, the amount of heat exchange is determined by the amount of water without increasing the flow rate of the water. In addition, there is no problem of perforation as in the prior art, and even if it is small, it becomes a condenser having a large amount of heat exchange, so that the water-cooled condensing unit can be downsized and the air conditioner can be downsized.
For this reason, like an air conditioner such as a semiconductor manufacturing device,
The temperature control is strict, and even if the air conditioner performance is controlled by inverter control to change the air conditioner performance according to the performance of semiconductor manufacturing equipment, etc. Can be applied.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory view of a water-cooled condensing unit of the present invention. FIG. 2 is an exploded perspective view of the condenser according to the present invention. FIG. 3 is a front view of the condenser according to the present invention. FIG. 4 is a side view of the condenser according to the present invention. FIG. 5 is an explanatory diagram of a configuration on a seal plate side of the condenser according to the present invention. FIG. 6 is a schematic side view of a water-cooled condensing unit of the present invention. [Description of Signs] 1 ... Water-cooled condensing unit 2 ... Compressor 3 ... Laminated condenser 4 ... Heat transfer plate 5 ... Refrigerant channel 6 ... Water channel

Claims (1)

Claims: 1. A compressor comprising: a compressor; and a condenser for exchanging heat with water and condensing the refrigerant compressed by the compressor, the condenser being provided on one surface of a heat transfer plate. A plurality of the heat transfer plates are stacked in a relationship where a flow passage is formed and a water flow passage is formed on the other surface, and heat exchange between the refrigerant and the water is performed via the heat transfer plate. A water-cooled condensing unit characterized in that it is a laminated plate type condenser communicating with a refrigerant passage and a water passage connected to the outside of the condenser.