JP2003100601A - Substrate treatment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate treatment device that performs slit scan development for the substrate and then sufficiently cleans the substrate after a developing stopper is supplied. SOLUTION: A developing solution supply nozzle 21 supplies a developing solution to a main surface of a substrate W while traveling from one end to the other end of the substrate W. After a specified time period, a developing stopper supply nozzle 31 having a slit-shape outlet travels above the main surface in the same direction and at the same rate as the nozzle 21, and supplies a rinsing liquid as the stopper. After this process, a cleaning liquid supply nozzle 41 travels above the main surface, and supplies a rinsing liquid which is the cleaning liquid to the main surface of the substrate W.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for developing a semiconductor wafer, a glass substrate for a liquid crystal display panel, a glass substrate for a plasma display panel, or the like.

[0002]

2. Description of the Related Art Conventionally, as this type of substrate processing apparatus, there is one disclosed in Japanese Patent Application Laid-Open No. 10-20508.

In the substrate processing apparatus disclosed in the above publication, the developing solution supply nozzle is moved from one end side to the other end side of the substrate to supply the developing solution to the entire upper surface of the substrate, and after a predetermined time elapses, rinse is performed. The liquid supply nozzle is moved from one end side to the other end side of the substrate at the same speed as the moving speed of the developing solution supply nozzle to supply the rinse liquid to the entire upper surface of the substrate and stop the development on the upper surface of the substrate. ing.

According to this substrate processing apparatus, since the developing time can be made substantially the same on the entire upper surface of the substrate, uneven development can be prevented and the line width uniformity of the resist pattern after development can be improved. it can.

[0005]

However, in the above-mentioned substrate processing apparatus, only the substrate portion corresponding to the moving position at any time is moved during the movement of the rinse liquid supply nozzle so that the developing time is almost the same on the entire upper surface of the substrate. The rinse is supplied at a supply amount such that the rinse liquid is supplied.

For this reason, the cleaning effect on the substrate is insufficient, and particles such as dissolved products due to the development process remain retained on the substrate, leading to a reduction in product yield.

Therefore, an object of the present invention is to provide a substrate processing apparatus capable of sufficiently cleaning the substrate after the supply of the development stop solution.

[0008]

[Means for Solving the Problems] In order to solve the above problems,
The substrate processing apparatus according to claim 1, wherein the substrate holding means holds the substrate, the developing solution supply means for supplying the developing solution from one end side to the other end side of the main surface of the substrate held by the substrate holding means, After the developing solution is supplied to the main surface of the substrate, a developing stop solution supplying means for supplying the developing stop solution from one end side to the other end side of the main surface of the substrate, and a cleaning solution supply for supplying the cleaning solution to the main surface of the substrate Means and a control means for supplying the cleaning liquid from the cleaning liquid supply means to the main surface of the substrate after the development stopping liquid is supplied to the substrate.

According to a second aspect of the present invention, the cleaning liquid supply means includes a cleaning liquid supply nozzle having a discharge port having a width dimension substantially equal to or larger than a substrate diameter dimension, and the cleaning liquid supply nozzle. Cleaning liquid supply nozzle moving means for moving the substrate from the one end side to the other end side of the position where the substrate is held by the substrate holding means, after the control means supplies the development stop solution to the substrate. The cleaning liquid supply nozzle may supply the cleaning liquid while moving the cleaning liquid supply nozzle from one end side of the position where the substrate is held to the other end side or vice versa.

Further, as described in claim 3, the developing solution supply means and the cleaning solution supply means have a rinse liquid supply having a discharge port having a width dimension substantially equal to or larger than a substrate diameter dimension. The nozzle and the rinse liquid supply nozzle moving means for moving the rinse liquid supply nozzle from one end side of the position where the substrate is held by the substrate holding means to the other end side and in the opposite direction are shared. After the developing solution is supplied to the substrate, the control means moves the rinse solution supply nozzle from one end side to the other end side of the substrate main surface held by the substrate holding means. , A rinse liquid is supplied from the rinse liquid supply nozzle as a development stop liquid, and then the rinse liquid supply nozzle is directed from one end side of the position where the substrate is held by the substrate holding means to the other end side, or While moving toward the the rinse liquid may be one which is supplied as the cleaning liquid from the rinsing liquid supply nozzle.

In this case, as described in claim 4, the developing solution supply means has a developing solution supply nozzle having a discharge port having a width dimension substantially equal to or larger than the substrate diameter dimension, The rinsing liquid supply nozzle moving means may function as a nozzle moving means for moving the developing solution supply nozzle together with the rinsing liquid supply nozzle, and the developing solution supply means may be provided as described in claim 5. The means is formed separately from the rinse solution supply nozzle, and has a developing solution supply nozzle having a discharge port having a width dimension substantially equal to or larger than the diameter dimension of the rinse solution substrate; and the developing solution supply nozzle. With a developing solution supply nozzle moving means for moving from one end side to the other end side of the main surface of the substrate held by the substrate holding means.

Further, according to a sixth aspect of the present invention, it further comprises a rotating means for rotating the substrate held by the substrate holding means, wherein the control means supplies the cleaning liquid to the substrate.
The substrate may be rotated.

Further, as described in claim 7, the supply amount of the cleaning liquid to the substrate may be made larger than the supply amount of the development stopping liquid to the substrate.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.

The schematic structure of the present invention will be described. In this substrate processing apparatus, a developing solution is supplied to the main surface of a substrate from one end side to the other end side thereof, and then a developing time is applied to the entire main surface of the substrate. The developing stop solution is supplied from one end side to the other end side of the main surface of the substrate, and then the cleaning solution is supplied to the substrate so that the same becomes as the above.

{First Embodiment} In the first embodiment, the means for supplying a developing solution, the means for supplying a development stop solution, and the means for supplying a cleaning solution are separately configured. The substrate processing apparatus will be described.

FIG. 1 is a plan view showing a schematic structure of a substrate processing apparatus according to a first embodiment of the present invention, and FIG. 2 is a sectional view taken along line II-II of FIG.

This substrate processing apparatus is an apparatus for supplying a developing solution to the exposed substrate W to perform a developing process, and includes a substrate holding section 10 for holding the substrate W and a developing solution on the main surface of the substrate W. For supplying the developing solution to the main surface of the substrate W, the cleaning solution supplying means 40 for supplying the cleaning solution to the main surface of the substrate W, and the entire apparatus. And a control unit 50 for controlling operation.

The substrate holding section 10 holds the substrate W in a substantially horizontal posture. Specifically, the substrate holding unit 10 includes the device main body 5
Is provided with a rotary shaft 11 disposed in a substantially vertical position in a substantially central portion thereof, and a rotary base 12 fixed to an upper end portion of the rotary shaft. The turntable 12 is configured to adsorb and hold the substrate W in a substantially horizontal posture. The lower end of the rotary shaft 11 is connected to a spin motor 13 that is a rotating unit, and the rotation of the spin motor 13 is transmitted to the rotary base 12 via the rotary shaft 11. As a result, the substrate W can be rotated in the horizontal plane with the vertical axis as the rotation axis. The rotary table 12 is not limited to the structure for sucking and holding the substrate W, and may have a structure for gripping the peripheral portion of the substrate W.

A circular inner cup 6 is provided around the substrate holding portion 10 so as to surround the substrate W, and a substantially square outer cup 7 is provided around the outer circumference of the inner cup 6.
Is provided. A standby pot 8 is provided on both sides of the outer cup 7.

The developing solution supply means 20 supplies the developing solution from one end side to the other end side of the main surface of the substrate W. Specifically, the developing solution supply unit 20 includes a developing solution supply nozzle 21 and
Developer supply nozzle moving mechanism 22 and developer supply system mechanism 2
6 and.

The developing solution supply system mechanism 26 is provided with a developing solution supply source and an opening / closing valve (both not shown), and the developing solution from the developing solution supply source has a predetermined value which will be described later according to the opening / closing timing of the opening / closing valve. Developer supply nozzle 2 at the timing
1 is configured to be supplied.

The developing solution supply nozzle 21 has a slit-shaped discharge port 2 having a width dimension substantially the same as the diameter dimension of the substrate W.
1a (see FIG. 2). The developing solution supplied from the developing solution supply system mechanism 26 is discharged from the entire width of the discharge port 21a. The width dimension of the ejection port may be larger than the width dimension of the substrate W.

The developing solution supply nozzle moving mechanism 22 includes a guide rail 23, a horizontal drive section 24, and a support arm section 25. The guide rail 23 is laid on the upper surface side of the apparatus main body 5 and laterally of the substrate holding unit 10 along the horizontal direction. The horizontal drive unit 24 is provided with the guide rail 23.
It is configured to be horizontally movable along a predetermined scanning direction A and the opposite direction. The support arm portion 25 is cantilevered by the horizontal drive portion 24 so as to extend toward the substrate holding portion 10, and the developer supply nozzle 21 is orthogonal to the scanning direction A on the free end side thereof. It is supported in a substantially horizontal posture along the direction.

By driving the horizontal drive unit 24, the developer supply nozzle 21 can be moved above the main surface of the substrate W from one end side to the other end side. When the developing solution supply nozzle 21 moves above the substrate W, by ejecting the developing solution from the developing solution supply nozzle 21, the developing solution is supplied to the entire main surface of the substrate W.

The development stop solution supply means 30 supplies the development stop solution from one end side to the other end side of the main surface of the substrate W.

Specifically, the development stop solution supply means 30 is
The development stop solution supply nozzle 31, the development stop solution supply nozzle moving mechanism 32, and the development stop solution supply system mechanism 36 are provided, and the development stop solution is supplied by the same configuration and operation as the developer supply means 20. .

The development stop solution supply system mechanism 36 has the same structure as the development solution supply system mechanism 26 and supplies the development stop solution at a predetermined timing described later. From the development stop liquid supply system mechanism 36, a liquid that stops the development of the developer on the substrate W is supplied. Normally, the developing solution is stopped by diluting the developing solution on the substrate W and supplying an amount of rinsing solution (pure water) in such an amount that the developing reaction can be stopped.

The development stop solution supply nozzle 31 has a slit-shaped discharge port 31a having a width dimension substantially the same as the diameter dimension of the substrate W. The width dimension of the ejection port 31a may be larger than the diameter dimension of the substrate W.

The development stop solution supply nozzle moving mechanism 32 has the same structure as the developer supply nozzle moving mechanism 22, that is, the horizontal drive section 3 corresponding to the horizontal drive section 24.
4 and a supporting arm portion 3 corresponding to the supporting arm portion 25.
5 and.

When the developing stop solution supply nozzle 31 moves above the substrate W by the driving of the horizontal drive section 34,
By discharging the development stop solution from the development stop solution supply nozzle 31, the development solution is supplied to the entire main surface of the substrate W.

The cleaning liquid supply means 40 supplies the cleaning liquid to the main surface of the substrate W.

Specifically, the cleaning liquid supply means 40 includes a cleaning liquid supply nozzle 41 and a cleaning liquid supply nozzle moving mechanism 42.
And the cleaning liquid supply system mechanism 46, and supplies the cleaning liquid with the same configuration and operation as the developing liquid supply means 20.

The cleaning liquid supply system mechanism 46 has the same structure as the developing solution supply system mechanism 26 and supplies the cleaning liquid at a predetermined timing described later. From the cleaning liquid supply system mechanism 46,
A liquid that can sufficiently wash away particles and the like on the substrate W is supplied. Normally, cleaning is performed by supplying a rinse liquid (pure water). In order to enhance the cleaning effect, this supply amount is preferably larger than the supply amount for stopping the development.

The cleaning liquid supply nozzle 41 has a slit-shaped discharge port 4 having a width dimension substantially the same as the diameter dimension of the substrate W.
1a. The width dimension of the ejection port 41a may be larger than the diameter dimension of the substrate W.

The cleaning liquid supply nozzle moving mechanism 42 has the same structure as the developing liquid supply nozzle moving mechanism 22.
That is, the horizontal drive unit 44 corresponding to the horizontal drive unit 24.
And a supporting arm portion 45 corresponding to the supporting arm portion 25.
It has and.

When the cleaning liquid supply nozzle 41 moves above the substrate W by driving the horizontal drive unit 44, the cleaning liquid is ejected from the cleaning liquid supply nozzle 41 to supply the cleaning liquid to the entire main surface of the substrate W. The Rukoto.

In the initial standby state of the substrate processing apparatus, the developer supply nozzle 21, the development stop solution supply nozzle 31, and the cleaning solution supply nozzle 41 are arranged in this order in the predetermined scanning direction A. Then, the developing solution supply nozzle 2
1. Development stop solution supply nozzle 31 and cleaning solution supply nozzle 4
1 is configured to be able to pass above the substrate W in that order.

Further, in the present embodiment, the developing solution supply nozzle moving mechanism 22, the developing stop solution supply nozzle moving mechanism 32,
Guide rail 2 with common cleaning liquid supply nozzle moving mechanism 42
Although it is configured to move on the guide member 3, they may move along completely different guide members, and the moving mechanism thereof is not limited to that described above.

The control unit 50 controls the entire apparatus, is provided with a CPU, a ROM, a RAM and the like, and is constituted by a general microcomputer which performs a predetermined arithmetic operation by a software program stored in advance. There is.

The control unit 50 controls a series of operations described below. At least after the development stop solution is supplied to the substrate W, the cleaning solution supply means 40 supplies the substrate W to the substrate W.
The operation control for supplying the cleaning liquid to the main surface of is performed.

Next, regarding the operation of this substrate processing apparatus,
This will be described with reference to FIG.

In the initial standby state, as shown in FIG. 3A, the substrate W is supported by the substrate holding unit 10 in a stationary state in a horizontal posture. In addition, the developing solution supply nozzle 21, the development stop solution supply nozzle 31, and the cleaning solution supply nozzle 41 are arranged on the substrate W.
Is located at one end side (upstream side in the scanning direction A) of the.

After the processing is started, first, as shown in FIG. 3B, the developing solution supply nozzle 21 moves above the main surface of the substrate W.
It moves in the scanning direction A, that is, from one end side of the substrate W toward the other end side. When the developing solution supply nozzle 21 moves above the main surface of the substrate W, the developing solution is discharged from the developing solution supply nozzle 21 and the developing solution is supplied to the entire main surface of the substrate W. As a result, development is performed on the main surface of the substrate W.

After the developer supply nozzle 21 has passed above the main surface of the substrate W, the development is stopped as shown in FIG. 3C at the timing when a predetermined time required for the development reaction on the substrate W elapses. The liquid supply nozzle 31 moves above the main surface of the substrate W in the scanning direction A, that is, from one end side to the other end side of the substrate W. The moving speed of the development stop solution supply nozzle 31 is substantially the same as the moving speed of the developer supply nozzle 21. Then, when the development stop solution supply nozzle 31 passes above the main surface of the substrate W, the development stop solution supply nozzle 3
The development stop solution is discharged from No. 1, the development stop solution is supplied to the entire main surface of the substrate W, and the development on the substrate W is stopped.

As a result, the development stop solution is supplied to the main surface of the substrate W in the same manner as the supply of the developer (supply direction and supply speed), and the development time is substantially the same on the entire main surface of the substrate W. Can be

After the development stop solution supply nozzle 31 has passed above the main surface of the substrate W, the cleaning solution supply nozzle 41 is above the main surface of the substrate W in the scanning direction A, that is, as shown in FIG. The substrate W moves from one end side to the other end side where the substrate W is held. When the development stop solution supply nozzle 31 passes above the main surface of the substrate W, the development stop solution is ejected from the development stop solution supply nozzle 31 and the substrate W rotates. Thus, the cleaning liquid is supplied to the entire main surface of the rotating substrate W,
Sufficient cleaning is performed to remove particles.

Finally, as shown in FIG. 3E, the developing solution supply nozzle 21, the development stop solution supply nozzle 31, and the cleaning solution supply nozzle 41 are arranged on the other end side of the substrate W (downstream side in the scanning direction A). Then, the series of operations is completed.

According to the substrate processing apparatus configured as described above, after the development stop solution is supplied to stop the development on the substrate W, the cleaning solution is further supplied to the substrate W. Therefore, after the development stop solution is supplied. The substrate W can be sufficiently cleaned.

While the cleaning liquid supply nozzle 41 having the discharge port 41a having substantially the same size as the substrate diameter is moved from one end side of the position where the substrate W is held to the other end side,
Since the cleaning liquid is supplied, the cleaning liquid is not concentrated and locally supplied to the substrate W. Therefore, a large amount of the cleaning liquid can be supplied to the entire main surface of the substrate W with a low impact, and a fine pattern can be obtained. Can be prevented from collapsing.

Furthermore, since the substrate W is rotated during the supply of the cleaning liquid to the substrate W, the cleaning effect is further improved.

{Second Embodiment} In the second embodiment, the means for supplying the development stop solution and the means for supplying the cleaning liquid share the rinsing liquid supply means. A configuration in which the rinsing liquid supply means and the developing solution supply means are moved by different mechanisms will be described. In this description, the same components as those in the substrate processing apparatus according to the first embodiment described above will be denoted by the same reference numerals, and the description thereof will be omitted. Differences will be mainly described.

FIG. 4 is a plan view showing a schematic structure of the substrate processing apparatus according to the second embodiment of the present invention.

In this substrate processing apparatus, the development stop solution supplying means 3 in the substrate processing apparatus according to the first embodiment described above.
0 and the cleaning liquid supply means 40, instead of the rinse liquid supply means 1
Has 60.

The rinse liquid supply means 160 includes a rinse liquid supply nozzle 161 and a rinse liquid supply nozzle moving mechanism 162.
And a rinse liquid supply system mechanism 166.

The rinse liquid supply system mechanism 166 has the same structure as the developing solution supply system mechanism 26 described in the first embodiment, and supplies the rinse liquid at a predetermined timing described later. The supply amount of the rinse liquid is also adjusted by adjusting the opening of the valve.

When the present rinse solution supply means 160 is made to function as the development stop solution supply means, usually, a sufficient amount of rinse solution (is sufficient to stop the development reaction by diluting the developer on the substrate W). Supply pure water). Also,
The rinse liquid (pure water) is also supplied as the cleaning liquid when the rinse liquid supply device functions as the cleaning liquid supply device. In order to enhance the cleaning effect, it is preferable to supply the rinse liquid at the time of cleaning in a larger amount than the amount supplied for stopping the development.

The rinse liquid supply nozzle 161 has a slit-shaped discharge port (not shown) having a width dimension substantially the same as the diameter dimension of the substrate W. The width dimension of the ejection port may be larger than the diameter dimension of the substrate W.

The rinsing liquid supply nozzle moving mechanism 162 has the same structure as the developing liquid supply nozzle moving mechanism 22 described in the first embodiment, that is, the horizontal driving unit corresponding to the horizontal driving unit 24. 164 and a supporting arm portion 165 corresponding to the supporting arm portion 25.

Then, by driving the horizontal drive unit 164,
When the rinse liquid supply nozzle 161 moves above the substrate W, the rinse liquid supply nozzle 161 supplies the rinse liquid as a development stop liquid or a cleaning liquid to the entire main surface of the substrate W.

In this embodiment, the developing solution supply nozzle moving mechanism 22 and the rinsing solution supply nozzle moving mechanism 162 are configured to move on the common guide rail 23. However, these are completely different guide members. It may be one that moves along, and its moving mechanism is not limited to that described above.

Further, in this substrate processing apparatus, the control section 150 controls a series of operations described below, and at least after the developing solution is supplied to the substrate W,
The operation of supplying the rinse liquid as the development stop liquid from the rinse liquid supply nozzle 161 to the substrate W and the operation of supplying the rinse liquid as the cleaning liquid from the rinse liquid supply nozzle 161 to the substrate W are controlled thereafter.

The operation of the substrate processing apparatus thus configured will be described with reference to FIG.

First, in the initial standby state, as shown in FIG. 5A, the substrate W is supported by the substrate holder 10 in a horizontal state in a stationary state. Further, the developing solution supply nozzle 21 and the rinse solution supply nozzle 161 are located at one end side of the substrate W (upstream side in the scanning direction A).

After the substrate processing is started, first, as shown in FIG. 5B, the developing solution is supplied from the developing solution supply nozzle 21 to the entire main surface of the substrate W. This operation is similar to that of FIG.

After the developing solution supply nozzle 21 has passed above the main surface of the substrate W and a predetermined time required for the development reaction on the substrate W has elapsed, the rinse solution supply nozzle 161 is turned on as shown in FIG. 5C. Above the main surface of the substrate W in the scanning direction A,
That is, the substrate W moves from one end side to the other end side. At this time, the moving speed of the rinse solution supply nozzle 161 is set to be substantially the same as the moving speed of the developing solution supply nozzle 21.
Further, the supply amount of the rinse liquid is supplied in a relatively small amount enough to stop the development. As a result, the substrate W
The developing time is almost the same on the entire main surface of the substrate W.
Development can be stopped. After that, the rinse liquid supply nozzle 161 is once positioned on the downstream side in the scanning direction A (see the position indicated by the chain double-dashed line in FIG. 5C).

After that, as shown in FIG. 5D, the rinse liquid supply nozzle 161 moves above the main surface of the substrate W in the scanning direction A.
In the opposite direction, that is, from the other end side of the position where the substrate W is supported to the one end side. Rinsing liquid supply nozzle 161
When passing over the main surface of the substrate W, the rinse liquid is discharged as the cleaning liquid from the rinse liquid supply nozzle 161, and the substrate W rotates. In this way, the cleaning liquid is supplied to the entire main surface of the rotating substrate W, and sufficient cleaning is performed to remove particles.

Finally, as shown in FIG. 5E, the developing solution supply nozzle 21 is located on the other end side of the substrate W (downstream side in the scanning direction A), and the rinse solution supply nozzle 161 is located on the substrate W. At a position on one end side (upstream side in the scanning direction A), a series of operations ends.

According to the substrate processing apparatus configured as described above, in addition to the same effect as that obtained in the first embodiment, the development stop solution supply means and the cleaning solution supply means are rinse solutions. Since the supply nozzle 161 and the rinse liquid supply nozzle moving mechanism 162 are configured to be shared,
The configuration can be simplified.

{Third Embodiment} In the third embodiment, the means for supplying the development stop solution and the means for supplying the cleaning solution share the rinsing liquid supply means. A configuration in which the rinse liquid supply nozzle of the rinse liquid supply means and the developing solution supply nozzle of the developing solution supply means are moved by the same mechanism will be described. In this description, the same components as those in the substrate processing apparatus according to the first embodiment described above will be denoted by the same reference numerals, and the description thereof will be omitted. Differences will be mainly described.

FIG. 6 is a plan view showing a schematic structure of a substrate processing apparatus according to the third embodiment of the present invention.

This substrate processing apparatus has a processing solution supply means 270 instead of the developing solution supply means 20, the development stop solution supply means 30 and the cleaning solution supply means 40 in the substrate processing apparatus according to the first embodiment. is doing.

The processing liquid supply means 270 includes a developing liquid supply nozzle 221 and a developing liquid supply system mechanism 226 as a developing liquid supply mechanism, and a rinsing liquid supply nozzle 261 and a rinsing liquid supply system as a rinsing liquid supply mechanism. Mechanism 26
6 and further has a single nozzle moving mechanism 272.

The developing solution supply nozzle 221 has the same structure as the developing solution supply nozzle 21 described in the first embodiment, and the developing solution supply system mechanism 226 has the first structure.
The developing solution can be supplied to the developing solution supply nozzle 221 at a predetermined timing by the same configuration as the developing solution supply system mechanism 26 described in the above embodiment.

The rinse liquid supply nozzle 261 has the same structure as the rinse liquid supply nozzle 161 described in the second embodiment, and the rinse liquid supply system mechanism 266 includes
With the same configuration as the rinse liquid supply system mechanism 166 described in the second embodiment, the rinse liquid can be supplied at a predetermined timing as a development stop liquid in a predetermined amount or as a cleaning liquid in a predetermined amount. In order to enhance the cleaning effect, it is preferable to supply the rinse liquid at the time of cleaning in a larger amount than the amount supplied for stopping the development.

The nozzle moving mechanism 272 has a structure similar to that of the developing solution supply nozzle moving mechanism 22, and includes a horizontal driving section 274 corresponding to the horizontal driving section 24 and two corresponding to the supporting arm section 25. One support arm 27
5,276. Each support arm portion 275, 2
The developing solution supply nozzle 221 is supported by the supporting arm portion 275 on the downstream side of the scanning direction A in a substantially horizontal posture along the direction orthogonal to the scanning direction A, and the supporting arm on the upstream side of the scanning direction A is supported. A rinse liquid supply nozzle 261 is supported on the arm portion 276 in a substantially horizontal posture along a direction orthogonal to the scanning direction A.

Then, by driving the horizontal drive unit 274,
When the developing solution supply nozzle 221 moves above the substrate W,
The developing solution is supplied from the developing solution supply nozzle 221 to the substrate W, or when the rinse solution supply nozzle 261 moves above the substrate W, the rinse solution is supplied from the rinse solution supply nozzle 261 as a development stop solution or The cleaning liquid is supplied to the entire main surface of the substrate W.

In this substrate processing apparatus, the controller 250 controls a series of operations described below, and at least the developer supply nozzle 221 is connected to the substrate W.
After the developer is supplied to the substrate W by moving it from one end side above the main surface of the substrate W to the other end side, the rinse liquid supply nozzle 261 is moved from one end side above the main surface of the substrate W to the other end side. Then, the rinse liquid is supplied to the substrate W as a development stopping liquid, and then the rinse liquid supply nozzle 261 is moved to the substrate W again.
The operation control is performed so that the rinse liquid is supplied as the cleaning liquid by moving the cleaning liquid above the main surface.

The operation of the substrate processing apparatus thus configured will be described with reference to FIG.

First, in the initial standby state, as shown in FIG. 7A, the substrate W is supported by the substrate holding portion 10 in a horizontal state in a stationary state. In addition, the developer supply nozzle 221,
The rinse liquid supply nozzle 261 is located at one end side of the substrate W (upstream side in the scanning direction A).

After the substrate processing is started, first, as shown in FIG. 7B, the developing solution supply nozzle 221 and the rinse solution supply nozzle 261 are located above the main surface of the substrate W in the scanning direction A.
That is, the substrate W moves from one end side to the other end side. When the developing solution supply nozzle 221 moves above the main surface of the substrate W, the developing solution supply nozzle 221 discharges the developing solution, the developing solution is supplied to the entire main surface of the substrate W, and the developing process is performed on the main surface of the substrate W. Is done.

After that, the developing solution supply nozzle 221 and the rinse solution supply nozzle 261 are, as shown in FIG. 7C, in the direction opposite to the scanning direction A, that is, the other end side of the substrate W (in the scanning direction A). From the downstream side), it moves to one end side of the substrate W (upstream side in the scanning direction A).

Then, in accordance with the timing when a predetermined time required for the development reaction on the substrate W has elapsed, FIG.
As shown in FIG.
That is, the substrate W moves from one end side to the other end side. At this time, the moving speed of the rinse liquid supply nozzle 261 is
It is set to be substantially the same as the moving speed of the developing solution supply nozzle 221 in FIG. Further, the supply amount of the rinse liquid is an amount sufficient to stop the development, and is supplied in a relatively small amount. This makes it possible to stop the development on the substrate W by making the development time substantially the same on the entire main surface of the substrate W. After that, the developing solution supply nozzle 221 and the rinse solution supply nozzle 261 are once positioned on the downstream side in the scanning direction A (see the position indicated by the chain double-dashed line in FIG. 7E).

After that, as shown in FIG. 7E, the rinse liquid supply nozzle 261 and the developing solution supply nozzle 221 are
It moves above the main surface of the substrate W in the direction opposite to the scanning direction A, that is, from the other end side of the position where the substrate W is supported to the one end side. When the rinse liquid supply nozzle 261 passes above the main surface of the substrate W, the rinse liquid is discharged as the cleaning liquid from the rinse liquid supply nozzle 261 and the substrate W rotates.
In this way, the cleaning liquid is supplied to the entire main surface of the rotating substrate W, and sufficient cleaning is performed to remove particles.

Finally, as shown in FIG. 7F, the developing solution supply nozzle 221 and the rinse solution supply nozzle 261 are located at one end side of the substrate W (upstream side in the scanning direction A), and a series of operations are performed. finish.

According to the substrate processing apparatus configured as described above, in addition to the same effects as those obtained in the first and second embodiments, the nozzle moving mechanism 272 causes the developing solution supply nozzle 221 to operate. With rinse liquid supply nozzle 261
Since the nozzles 261 and 221 are moved, the configuration for moving the nozzles 261 and 221 is shared, and the overall configuration is simplified.

In this embodiment, the developing solution supply nozzle 221 and the rinse solution supply nozzle 261 are formed as a single component member, that is, the developing solution discharge port and the rinse solution discharge port are provided in a single nozzle. May be formed.

{Other Modifications} Although the respective embodiments of the present invention have been described above, the present invention is not limited to the above examples.

For example, when cleaning the substrate W, the cleaning liquid supply nozzle 41 or the rinse liquid supply nozzles 161, 261
The moving direction of may be the forward direction of the scanning direction A,
Alternatively, it may be the opposite direction.

Depending on the cleaning condition, the cleaning liquid supply nozzle 41 and the rinse liquid supply nozzles 161, 261 are
The cleaning liquid may be ejected and passed over the main surface of the substrate W a plurality of times to perform more sufficient cleaning.

[0091]

According to the substrate processing apparatus of the present invention configured as described above, since the cleaning solution is supplied to the substrate after the development stop solution is supplied, the substrate after the development stop solution is supplied. The substrate can be thoroughly cleaned.

Further, according to the substrate processing apparatus of the second aspect, the cleaning liquid supply nozzle having the discharge port having the width dimension substantially equal to or larger than the substrate diameter dimension is provided at one end side of the position where the substrate is held. Since the cleaning liquid is supplied while moving from the other side to the other side or vice versa, a large amount of the cleaning liquid can be supplied to the entire main surface of the substrate with a low impact and the collapse of the pattern can be prevented.

Further, according to the substrate processing apparatus of the third aspect, since the rinse liquid supply nozzle and the rinse liquid supply nozzle moving means are shared, the structure can be simplified.

Further, a rinse liquid supply nozzle having a discharge port having a width substantially equal to or larger than the diameter of the substrate is provided from one end side of the position where the substrate is held to the other end side or vice versa. Since the cleaning liquid is supplied while moving to, it is possible to supply a large amount of the cleaning liquid to the entire main surface of the substrate with low impact and prevent the pattern from collapsing.

According to the substrate processing apparatus of the fourth aspect, the rinse liquid supply nozzle moving means functions as a nozzle moving means for moving the developing solution supply nozzle together with the rinse liquid supply nozzle, so that each nozzle is moved. The configuration will be shared, and the overall configuration will be simplified.

Further, according to the substrate processing apparatus of the sixth aspect, since the substrate is rotated during the supply of the cleaning liquid to the substrate, the cleaning effect is improved.

Further, according to the substrate processing apparatus of the seventh aspect, since the supply amount of the cleaning liquid to the substrate is larger than the supply amount of the development stopping liquid to the substrate, more sufficient cleaning can be performed.

[Brief description of drawings]

FIG. 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a schematic process diagram showing an operation of the substrate processing apparatus according to the first embodiment.

FIG. 4 is a plan view showing a schematic configuration of a substrate processing apparatus according to a second embodiment of the present invention.

FIG. 5 is a schematic process diagram showing the operation of the above substrate processing apparatus.

FIG. 6 is a plan view showing a schematic configuration of a substrate processing apparatus according to a third embodiment of the present invention.

FIG. 7 is a schematic process diagram showing the operation of the above substrate processing apparatus.

[Explanation of symbols]

10 Substrate holder 20 developer supply means 21 developer supply nozzle 21a outlet 22 Developer supply nozzle moving mechanism 30 Development Stop Solution Supply Means 31 Development Stop Solution Supply Nozzle 31a outlet 32 Development Stop Solution Supply Nozzle Moving Mechanism 40 Cleaning liquid supply means 41 Cleaning liquid supply nozzle 41a outlet 42 Cleaning liquid supply nozzle moving mechanism 50 control unit 150 control unit 160 Rinsing liquid supply means 161 Rinsing liquid supply nozzle 162 Rinsing liquid supply nozzle moving mechanism 221 developer supply nozzle 250 control unit 270 Treatment liquid supply means 272 Nozzle moving mechanism

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masahiko Harumoto             4-chome Tenjin, which runs up to Teranouchi, Horikawa-dori, Kamigyo-ku, Kyoto             1 Kitamachi No. 1 Dai Nippon Screen Manufacturing Co., Ltd.             Inside the company (72) Inventor Osamu Tamada             4-chome Tenjin, which runs up to Teranouchi, Horikawa-dori, Kamigyo-ku, Kyoto             1 Kitamachi No. 1 Dai Nippon Screen Manufacturing Co., Ltd.             Inside the company F-term (reference) 2H096 AA25 GA30                 3B201 AA02 AA03 AB34 BB22 BB32                       BB44 BB92 BB93 CC01                 5F046 LA03 LA04 LA06

Claims (7)

[Claims] 1. A substrate holding means for holding a substrate, a developing solution supply means for supplying a developing solution from one end side to the other end side of a substrate main surface held by the substrate holding means, and a main surface of the substrate. A developing solution supplying means for supplying a developing solution from one end side to the other end side of the main surface of the substrate after the developing solution is supplied; a cleaning solution supplying means for supplying a cleaning solution to the main surface of the substrate; And a control unit for supplying the cleaning liquid from the cleaning liquid supply unit to the main surface of the substrate after the development stop liquid is supplied to the substrate processing apparatus. 2. The substrate processing apparatus according to claim 1, wherein the cleaning liquid supply unit has a cleaning liquid supply nozzle having a discharge port having a width dimension substantially equal to or larger than a substrate diameter dimension, and the cleaning fluid. A cleaning liquid supply nozzle moving unit that moves the supply nozzle from one end side of the position where the substrate is held by the substrate holding unit toward the other end side, and After being supplied, the cleaning liquid supply nozzle moves the cleaning liquid supply nozzle from one end side to the other end side of the position where the substrate is held, or vice versa, and supplies the cleaning liquid from the cleaning liquid supply nozzle. . 3. The substrate processing apparatus according to claim 1, wherein the development stop solution supply means and the cleaning solution supply means have a discharge port having a width dimension substantially equal to or larger than a substrate diameter dimension. A rinse liquid supply nozzle having and a rinse liquid supply nozzle moving unit for moving the rinse liquid supply nozzle from one end side of the position where the substrate is held by the substrate holding unit to the other end side and in the opposite direction. And the control unit directs the rinse liquid supply nozzle from one end side to the other end side of the substrate main surface held by the substrate holding unit after the developing solution is supplied to the substrate. The rinse liquid supply nozzle supplies the rinse liquid as a development stop liquid while moving the rinse liquid supply nozzle, and thereafter the rinse liquid supply nozzle is directed from one end side of the position where the substrate is held by the substrate holding means to the other end side Or while moving toward the opposite Te, to supply the rinse liquid as the cleaning liquid from the rinsing liquid supply nozzle, the substrate processing apparatus. 4. The substrate processing apparatus according to claim 3, wherein the developing solution supply means has a developing solution supply nozzle having a discharge port having a width dimension substantially equal to or larger than a substrate diameter dimension. The rinsing liquid supply nozzle moving means functions as a nozzle moving means that moves the developing solution supply nozzle together with the rinsing liquid supply nozzle. 5. The substrate processing apparatus according to claim 3, wherein the developing solution supply unit is formed separately from the rinse solution supply nozzle and has substantially the same size as the rinse solution substrate diameter dimension. A developing solution supply nozzle having a discharge port having a width dimension larger than that, and a developing solution supply nozzle for moving the developing solution supply nozzle from one end side to the other end side of the substrate main surface held by the substrate holding means. A substrate processing apparatus having a moving means. 6. The substrate processing apparatus according to claim 1, further comprising a rotating unit that rotates the substrate held by the substrate holding unit, wherein the control unit includes the substrate. A substrate processing apparatus for rotating the substrate while supplying a cleaning liquid to the substrate. 7. The substrate processing apparatus according to claim 1, wherein the supply amount of the cleaning liquid to the substrate is larger than the supply amount of the development stop liquid to the substrate. Substrate processing equipment.